CN103415142B - A kind of FPC localization method and pcb board structure - Google Patents
A kind of FPC localization method and pcb board structure Download PDFInfo
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- CN103415142B CN103415142B CN201310281346.9A CN201310281346A CN103415142B CN 103415142 B CN103415142 B CN 103415142B CN 201310281346 A CN201310281346 A CN 201310281346A CN 103415142 B CN103415142 B CN 103415142B
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Abstract
The open a kind of FPC localization method of the present invention and pcb board structure, the hole, location for positioning it is provided with at pcb board on described FPC, wherein, described FPC localization method comprises the following steps: on pcb board, attachment is for the SMT device of FPC location, and the mounting position of described SMT device is corresponding with the hole, location on described FPC；Hole, location on described FPC is directed at described SMT device, and is socketed on described SMT device, it is achieved FPC location on pcb board.The present invention realizes the positioning welding to FPC by the described SMT device of attachment, can replace on traditional PCB plate for positioning the hole, location of FPC, it is achieved atresia positions.The inventive method is easy and simple to handle, and efficiency is high.Being additionally, since on pcb board without punching, so, pcb board mounts SMT device back portion and can also be designed circuit and components and parts, add pcb board can design area.
Description
Technical field
The present invention relates to chemical cell field, particularly relate to a kind of FPC localization method and pcb board structure.
Background technology
Traditional F PC(Flexible Printed Circuit, flexible PCB) location is by increasing hole, location on pcb board, then uses locating dowel on fixture to realize positioning FPC welding through the hole, location of PCB.But, current smart mobile phone major part uses the design of half pcb board, and area is little, it requires that the spacing of circuit and device is more and more less, and therefore on pcb board, space reduces, and pcb board cannot increase hole, location.But, if cannot provide hole, location for FPC on pcb board, FPC then cannot position, and will be substantially reduced working performance when welding FPC, and increase the generation of the bad phenomenon such as operation process short circuit, missing solder.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of FPC localization method and pcb board structure, it is intended to solve space on existing pcb board and reduce the problem that cannot increase hole, location.
Technical scheme is as follows:
A kind of FPC localization method, described FPC is provided with the hole, location for positioning at pcb board, and wherein, described FPC localization method comprises the following steps:
On pcb board, attachment is for the SMT device of FPC location, and the mounting position of described SMT device is corresponding with the hole, location on described FPC；
Hole, location on described FPC is directed at described SMT device, and is socketed on described SMT device, it is achieved FPC location on pcb board.
Described FPC localization method, wherein, the aperture in hole, described location more than the size of SMT device, and hole, described location monolateral than SMT device size greatly less than 0.15mm.
Described FPC localization method, wherein, at least design two of the hole, location on described FPC, the quantity of described SMT device is identical with hole, described location.
Described FPC localization method, wherein, when described location borehole jack is connected on described SMT device, described SMT device passes hole, described location, its upper surface upper surface higher than described FPC.
A kind of pcb board structure, including pcb board and FPC, described FPC is welded on described pcb board, and wherein, on described pcb board, attachment is for the SMT device of FPC location, and described FPC is provided with the hole, location for location, and described location borehole jack is connected on described SMT device.
Described pcb board structure, wherein, the aperture in hole, described location more than the size of SMT device, and hole, described location monolateral than SMT device size greatly less than 0.15mm.
Described pcb board structure, wherein, at least design two of the hole, location on described FPC, the quantity of described SMT device is identical with hole, described location.
Described pcb board structure, wherein, described SMT device passes hole, described location, its upper surface upper surface higher than described FPC.
Beneficial effect: a kind of FPC localization method provided by the present invention, the position attachment corresponding on the pcb board SMT device for FPC location, realize the positioning welding to FPC by mounting described SMT device, can replace on traditional PCB plate for positioning the hole, location of FPC, it is achieved atresia positions.Owing to there being the location of SMT device, the location borehole jack on FPC is directly connected on described SMT device and can complete location by workmen, and easy and simple to handle, efficiency is high.Be additionally, since on pcb board without punching, so, on pcb board mount SMT device back portion can also be designed circuit and components and parts, add pcb board can design area, be particularly suited for the PCB design of current smart mobile phone.
Accompanying drawing explanation
Fig. 1 is the structural representation after mounting SMT device in the present invention on pcb board.
Fig. 2 is the structural representation of the FPC being provided with hole, location in the present invention.
Fig. 3 is the structural representation that in the present invention, FPC is positioned on pcb board.
Detailed description of the invention
The present invention provides a kind of FPC localization method and pcb board structure, and for making the purpose of the present invention, technical scheme and effect clearer, clear and definite, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
A kind of FPC localization method provided by the present invention, is tradition to be cancelled for positioning the hole of FPC on pcb board, SMT(surface mounting technology in the attachment of the position of its correspondence) device, realize the positioning welding to FPC by SMT device.
Specifically, as it is shown in figure 1, be pasted with described SMT device 110 on described pcb board 100；As in figure 2 it is shown, be provided with hole 210, location on described FPC 200.Described FPC localization method comprises the following steps:
On pcb board 100, attachment is for the SMT device 110 of FPC 200 location, and the position of described SMT device 110 is corresponding with the hole, location 210 on described FPC 200；
Hole, location 210 on described FPC 200 is directed at described SMT device 110, hole, described location 210 is socketed on described SMT device 110, as it is shown on figure 3, the FPC 200 location on pcb board 100 can be realized.
Wherein, the aperture size of the SMT device 110 on described pcb board 100 and flexible PCB positioning hole matches.The aperture in the hole 210, location on described FPC 200 requires more slightly larger than SMT device 110, but the monolateral 0.15mm that can not be more than SMT device 110 size, so it is to ensure that the positioning precision of FPC 200, if the aperture in hole 210, location is excessive, easily makes FPC 200 offset.
The shape in hole, described location 210 could be arranged to circle, square or triangle etc., and described SMT device 110 is correspondingly arranged the column for cross section is circular, square or triangle etc..In order to make described FPC 200 to be accurately positioned, the hole, location 210 on described FPC 200 should be designed at least as hole, two location, and the hole 210, quantity corresponding and described location of described SMT device 110 is identical.The pore size in hole, described location 210 can be according to the design needs of FPC.
Owing to SMT device 110 and FPC 200 is all comparatively fine device, when hole, described location 210 is socketed on described SMT device 110, if the upper surface that the upper surface of described SMT device 110 is less than described FPC 200, the most described FPC 200 easily displacement abjection from SMT device 110.Therefore, when described FPC 200 is positioned on described pcb board 100, the upper surface of described SMT device 110 upper surface greater than or equal to described FPC 200, the most a little higher than described FPC 200 0.1-0.2mm, make SMT device 110 be exposed by the hole, location 210 on FPC 200.So, the hole, location 210 that can preferably prevent described FPC 200 shifts abjection from described SMT device 110.And the thickness of described FPC 200 is generally 0.3-0.4mm, the most described SMT device 110 is 0.4-0.5mm at the height of described pcb board 100.
Also providing for a kind of pcb board structure in the present invention, including pcb board and FPC, described FPC is welded on described pcb board, and described FPC is to use above-mentioned FPC localization method to be positioned on described pcb board；On described pcb board, attachment is for the SMT device of FPC location, and described FPC is provided with the hole, location for location, and described location borehole jack is connected on described SMT device.
FPC localization method provided by the present invention can be applied on the electronic product of there is a need to manual welding FPC.Owing to there being the location of SMT device, the location borehole jack on FPC is directly connected on described SMT device and can complete location by workmen, and easy and simple to handle, efficiency is high.And traditional F PC location, be to punch on pcb board, then by hole hole be accurately positioned and could realize FPC location, bothersome arduously.And, due on pcb board without punching, only need to mount SMT device on pcb board can realize the location of FPC, so, mount SMT device back portion on pcb board and can also be designed circuit and components and parts, add pcb board can design area, be particularly suited for the PCB design of current smart mobile phone.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, all these modifications and variations all should belong to the protection domain of claims of the present invention.
Claims (6)
1. a FPC localization method, described FPC is provided with the hole, location for positioning at pcb board, it is characterised in that described
FPC localization method comprises the following steps:
On pcb board, attachment is for the SMT device of FPC location, the mounting position of described SMT device and the location on described FPC
Hole is corresponding；
Hole, location on described FPC is directed at described SMT device, and is socketed on described SMT device, it is achieved FPC is on pcb board
Location；
When described location borehole jack is connected on described SMT device, described SMT device passes hole, described location, and its upper surface is higher than
The upper surface 0.1-0.2mm of described FPC.
FPC localization method the most according to claim 1, it is characterised in that the aperture in hole, described location is more than SMT device
Size, and hole, described location monolateral than SMT device size greatly less than 0.15mm.
FPC localization method the most according to claim 1, it is characterised in that the hole, location on described FPC is designed at least as two
Individual, the quantity of described SMT device is identical with hole, described location.
4. a pcb board structure, including pcb board and FPC, described FPC is welded on described pcb board, it is characterised in that described
On pcb board, attachment is for the SMT device of FPC location, and described FPC is provided with the hole, location for location, described location borehole jack
It is connected on described SMT device；
Described SMT device passes hole, described location, and its upper surface is higher than the upper surface 0.1-0.2mm of described FPC.
Pcb board structure the most according to claim 4, it is characterised in that the aperture in hole, described location is more than the chi of SMT device
Very little, and hole, described location monolateral than SMT device size greatly less than 0.15mm.
Pcb board structure the most according to claim 4, it is characterised in that the hole, location on described FPC is designed at least as two
Individual, the quantity of described SMT device is identical with hole, described location.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310281346.9A CN103415142B (en) | 2013-07-05 | 2013-07-05 | A kind of FPC localization method and pcb board structure |
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| CN201310281346.9A CN103415142B (en) | 2013-07-05 | 2013-07-05 | A kind of FPC localization method and pcb board structure |
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| CN103415142A CN103415142A (en) | 2013-11-27 |
| CN103415142B true CN103415142B (en) | 2016-12-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104690420B (en) * | 2013-12-05 | 2016-08-17 | 大族激光科技产业集团股份有限公司 | FPC edges of boards positioning and processing method based on digital CCD |
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|---|---|---|---|---|
| TW200539781A (en) * | 2004-05-20 | 2005-12-01 | Au Optronics Corp | Display module and locating method of flexible print circuit board thereof |
| CN101336048A (en) * | 2007-06-27 | 2008-12-31 | 英华达(上海)电子有限公司 | Method and apparatus for reinforced locating of flexible circuit board |
| CN101672959A (en) * | 2008-09-09 | 2010-03-17 | 信越聚合物株式会社 | Optical transceiver |
| US8007286B1 (en) * | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
| CN103188884A (en) * | 2011-12-27 | 2013-07-03 | 星湖电子株式会社 | Soldering method of metal printed circuit board and flexible circuit and soldering apparatus thereof |
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2013
- 2013-07-05 CN CN201310281346.9A patent/CN103415142B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200539781A (en) * | 2004-05-20 | 2005-12-01 | Au Optronics Corp | Display module and locating method of flexible print circuit board thereof |
| CN101336048A (en) * | 2007-06-27 | 2008-12-31 | 英华达(上海)电子有限公司 | Method and apparatus for reinforced locating of flexible circuit board |
| US8007286B1 (en) * | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
| CN101672959A (en) * | 2008-09-09 | 2010-03-17 | 信越聚合物株式会社 | Optical transceiver |
| CN103188884A (en) * | 2011-12-27 | 2013-07-03 | 星湖电子株式会社 | Soldering method of metal printed circuit board and flexible circuit and soldering apparatus thereof |
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| CN103415142A (en) | 2013-11-27 |
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Effective date of registration: 20211201 Address after: 264200 19th floor, block a, innovation and entrepreneurship base, No. 213, Torch Road, torch high tech Industrial Development Zone, Weihai City, Shandong Province Patentee after: WEIHAI ELECTRONIC INFORMATION TECHNOLOGY COMPREHENSIVE RESEARCH CENTER, MINISTRY OF INDUSTRY AND INFORMATION TECHNOLOGY Address before: 516006 No.70, Huifeng 4th Road, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee before: HUIZHOU TCL MOBILE COMMUNICATION Co.,Ltd. |
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Effective date of registration: 20221114 Address after: 264200 18th Floor, Building A, Innovation and Entrepreneurship Base, No. 213, Torch Road, Torch Hi tech Industrial Development Zone, Weihai, Shandong Patentee after: Weihai Shenzhou Information Technology Research Institute Co.,Ltd. Address before: 264200 19th floor, block a, innovation and entrepreneurship base, No. 213, Torch Road, torch high tech Industrial Development Zone, Weihai City, Shandong Province Patentee before: WEIHAI ELECTRONIC INFORMATION TECHNOLOGY COMPREHENSIVE RESEARCH CENTER, MINISTRY OF INDUSTRY AND INFORMATION TECHNOLOGY |