CN103974557A - Method and jig for attaching bare chip to IC (Integrated Circuit) substrate - Google Patents
Method and jig for attaching bare chip to IC (Integrated Circuit) substrate Download PDFInfo
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- CN103974557A CN103974557A CN201410226835.9A CN201410226835A CN103974557A CN 103974557 A CN103974557 A CN 103974557A CN 201410226835 A CN201410226835 A CN 201410226835A CN 103974557 A CN103974557 A CN 103974557A
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- support plate
- pallet
- reference column
- cover plate
- location hole
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Abstract
The invention discloses a method and jig for attaching a bare chip to an IC (Integrated Circuit) substrate. The jig comprises a base, a tray, a sticking material and a cover plate. By adopting the method and the jig disclosed by the invention, the defects in the process of attaching of the bare chip to the IC substrate can be overcome.
Description
Technical field
The present invention relates to IC support plate to carry out method and the tool that naked wafer mounts.
Background technology
IC support plate (IC Substrate) is mainly in order to carry naked wafer; inside is furnished with circuit in order to signal between conducting chip and circuit board; except the function of carrying, IC support plate still has protective circuit, special line, design heat radiation approach, sets up the additional functions such as spare part modularization standard.
At present generally IC support plate is carried out to method and step that naked wafer mounts be mainly: mount → IC of fix → naked wafer of tool preparations → IC support plate carrier is dismantled.
(1) tool (pallet) is prepared: make tool, tool material is chosen as aluminium alloy, because this material is subject to thermal deformation coefficient less, and hardness is large, prevents the distortion after repeatedly using.Normally used localization method is the outline that directly processes IC support plate on pallet, positions by IC support plate edge;
(2) IC support plate is fixed: by the profile on pallet, IC support plate is positioned on pallet, uses high temperature gummed tape that IC support plate is fixed on pallet;
(3) naked wafer mounts: IC support plate first carries out silk screen printing and puts glue, then adopts surface mount process that naked wafer is mounted to IC support plate;
(4) IC carrier dismounting: use plastics electrostatic-resisting tweezers that high temperature gummed tape is removed, take off IC support plate from pallet.
Above-mentioned general operational method has following defect:
(1) use high temperature gummed tape to be fixed IC support plate, after having welded, high temperature gummed tape can not reuse, and causes a large amount of losses of this material;
(2) cannot use reference column to position, because IC support plate is thinner, conventionally below 0.4mm, so in the time of Design Orientation post, if reference column is too high, can directly have influence on screen printing process below, this just requires the reference column can not be higher than IC support plate thickness, and low reference column like this, in the time that IC support plate has warpage, cannot insert the location hole of IC support plate, not have the effect of location;
(3) when the profile of use IC support plate positions, the precision of location depends on the shape deviation of IC support plate to a great extent, and therefore the inaccurate problem in location easily occurs;
(4) after using high temperature gummed tape to be fixed IC support plate, just the edge of IC support plate is fixed, and can there is projection or up-and-down situation in the middle part of IC support plate these phenomenons quality that directly the naked wafer of impact mounts and the quality of Reflow Soldering.
Summary of the invention
The object of the present invention is to provide and a kind of IC support plate is carried out to method and the tool that naked wafer mounts, solve and at present IC support plate is carried out to naked wafer and mount the defect in process.
For achieving the above object, the invention provides and a kind of IC support plate is carried out to the tool that naked wafer mounts, comprise base, pallet, adhesive material and cover plate;
Described base is for horizontal positioned pallet; Described base top surface is provided with: pallet reference column, and with the location hole IC support plate reference column of corresponding matching one by one of IC support plate;
Described pallet is for horizontal positioned IC support plate; Described pallet is provided with: for allowing the hole of dodging that IC support plate reference column runs through, and with the pallet reference column pallet location hole of corresponding matching one by one, and cover plate location hole; Described pallet end face is also provided with the annular groove of laminating IC support plate edge shape, and described adhesive material is placed in annular groove, and described adhesive material is for being fixed on pallet end face by IC support plate edge;
Described cover plate is for being pressed on pallet by IC support plate; Described cover plate is provided with the hole of dodging of dodging naked wafer and mount position; Described cover plate bottom surface is provided with and the cover plate location hole cover plate reference column of corresponding matching one by one.
Preferably, the quantity of described IC support plate reference column is three, is angular distribution, can accurately locate, again can fool proof.
Preferably, the quantity of described pallet reference column is four, and rectangular distribution can accurately be located pallet.
Preferably, the quantity of described cover plate reference column is two, is positioned at cover plate length direction both sides, can accurately locate cover plate.
Preferably, the location hole of described IC support plate and IC support plate reference column tight fit, ensure positioning precision.
Preferably, described pallet location hole and pallet reference column tight fit, ensure positioning precision.
Preferably, described cover plate location hole and cover plate reference column tight fit, ensure positioning precision.
Preferably, described adhesive material is FPC double faced adhesive tape or high temperature resistant glutinous agent.
The present invention also provides by above-mentioned tool IC support plate is carried out to the method that naked wafer mounts, and comprises the steps:
(1) by the pallet reference column contraposition of pallet location hole and base, and by pallet horizontal positioned to base top surface; Now, IC support plate reference column vertically runs through pallet dodges hole, and protrudes from pallet end face;
(2) by the IC support plate reference column contraposition of the location hole of IC support plate and base, and IC support plate is placed to pallet end face, presses the edge of IC support plate, make IC support plate edge be fixed on pallet end face by adhesive material;
(3) pallet is taken out from base, print and put glue being accurately fixed on IC support plate on pallet;
(4) after printing and some glue complete, by the cover plate location hole contraposition of the cover plate reference column of cover plate and pallet, and cover plate is placed to pallet end face; Cover plate relies on himself weight, and IC support plate is pressed on to pallet end face;
(5) to being clamped in the IC support plate between cover plate and pallet, carry out mounting and Reflow Soldering of naked wafer;
(6) after Reflow Soldering completes, cover plate is taken out from pallet, then IC support plate is taken out from pallet.
Method of the present invention and tool are located IC support plate for reference column used and are arranged on base, reference column can have enough length, guarantee the in the situation that of IC support plate warpage, the location hole of IC support plate still can be inserted and run through to reference column, IC support plate is located effectively, and reference column does not affect the follow-up presswork of IC support plate.
Method of the present invention and tool can carry out effective location to IC support plate by reference column, and accurate positioning solves the low problem of positioning precision while only positioning by IC support plate edge, effectively improves the precision that the silk screen printing of IC support plate and naked wafer mount.
Method of the present invention and tool use cover plate in the process that mounts naked wafer and Reflow Soldering, can be fixed the middle part of IC support plate, solve when only IC support plate edge being fixed, can there is projection or up-and-down problem in IC support plate middle part, make IC support plate naked wafer mount with the process of Reflow Soldering in keep sufficiently evenness, effectively improve naked wafer placement accuracy and Reflow Soldering quality, ensure that IC support plate keeps formation state after coming out of the stove simultaneously.
Method of the present invention and tool use FPC double faced adhesive tape or high temperature resistant glutinous agent to stick on pallet, can reuse, and do not re-use high temperature gummed tape, reduce the operation action of manually taping, and meanwhile, reduce the waste of this precious materials.
Brief description of the drawings
Fig. 1 is the schematic diagram of base;
Fig. 2 is the schematic diagram of pallet;
Fig. 3 is the schematic diagram of cover plate.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is further described.Following examples are only for technical scheme of the present invention is more clearly described, and can not limit the scope of the invention with this.
The concrete technical scheme of implementing of the present invention is:
As shown in Figure 1-Figure 3, a kind of IC support plate is carried out to the tool that naked wafer mounts, comprise base 1, pallet 2, adhesive material and cover plate 3;
Described base 1 is for horizontal positioned pallet 2; Described base 1 end face is provided with: pallet reference column 11, and with the location hole IC support plate reference column 12 of corresponding matching one by one of IC support plate; The quantity of described IC support plate reference column 12 is three, is angular distribution, can accurately locate, again can fool proof; The quantity of described pallet reference column 11 is four, and rectangular distribution can accurately be located pallet 2;
Described pallet 2 is for horizontal positioned IC support plate; Described pallet 2 is provided with: dodge hole 21 for what allow IC support plate reference column 12 runs through, and with the pallet reference column 11 pallet location hole 22 of corresponding matching one by one, and cover plate location hole 23; Described pallet 2 end faces are also provided with the annular groove 24 of laminating IC support plate edge shape, and described adhesive material is placed in annular groove 24, and described adhesive material is for being fixed on pallet 2 end faces by IC support plate edge;
Described cover plate 3 is for being pressed on pallet 2 by IC support plate; Described cover plate 3 be provided with dodge that naked wafer mounts position dodge hole 31; Described cover plate 3 bottom surfaces are provided with and the cover plate location hole 23 cover plate reference column 32 of corresponding matching one by one; The quantity of described cover plate reference column 32 is two, is positioned at cover plate 3 length direction both sides, can accurately locate cover plate 3;
The location hole of described IC support plate and IC support plate reference column 12 tight fits, ensure positioning precision.
Described pallet location hole 22 and pallet reference column 11 tight fits, ensure positioning precision.
Described cover plate location hole 23 and cover plate reference column 32 tight fits, ensure positioning precision.
Described adhesive material is FPC double faced adhesive tape or high temperature resistant glutinous agent.
The present invention also provides by above-mentioned tool IC support plate is carried out to the method that naked wafer mounts, and comprises the steps:
(1) pallet reference column 11 contrapositions with base 1 by pallet location hole 22, and by pallet 2 horizontal positioned to base 1 end face; Now, IC support plate reference column 12 vertically runs through pallet 2 dodges hole 21, and protrudes from pallet 2 end faces;
(2) by IC support plate reference column 12 contrapositions of the location hole of IC support plate and base 1, and IC support plate is placed to pallet 2 end faces, presses the edge of IC support plate, make IC support plate edge be fixed on pallet 2 end faces by adhesive material;
(3) pallet 2 is taken out from base 1, print and put glue being accurately fixed on IC support plate on pallet 2;
(4) after printing and some glue complete, cover plate location hole 23 contrapositions by the cover plate reference column of cover plate 3 32 with pallet 2, and cover plate 3 is placed to pallet 2 end faces; Cover plate 3 relies on himself weight, and IC support plate is pressed on to pallet 2 end faces;
(5) to being clamped in the IC support plate between cover plate 3 and pallet 2, carry out mounting and Reflow Soldering of naked wafer;
(6) after Reflow Soldering completes, cover plate 3 is taken out from pallet 2, then IC support plate is taken out from pallet 2.
Method of the present invention and tool are located IC support plate for reference column used and are arranged on base 1, reference column can have enough length, guarantee the in the situation that of IC support plate warpage, the location hole of IC support plate still can be inserted and run through to reference column, IC support plate is located effectively, and reference column does not affect the follow-up presswork of IC support plate.
Method of the present invention and tool can carry out effective location to IC support plate by reference column, and accurate positioning solves the low problem of positioning precision while only positioning by IC support plate edge, effectively improves the precision that the silk screen printing of IC support plate and naked wafer mount.
Method of the present invention and tool use cover plate 3 in the process that mounts naked wafer and Reflow Soldering, can be fixed the middle part of IC support plate, solve when only IC support plate edge being fixed, can there is projection or up-and-down problem in IC support plate middle part, make IC support plate naked wafer mount with the process of Reflow Soldering in keep sufficiently evenness, effectively improve naked wafer placement accuracy and Reflow Soldering quality, ensure that IC support plate keeps formation state after coming out of the stove simultaneously.
Method of the present invention and tool use FPC double faced adhesive tape or high temperature resistant glutinous agent to stick on pallet 2, can reuse, and do not re-use high temperature gummed tape, reduce the operation action of manually taping, and meanwhile, reduce the waste of this precious materials.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (9)
1. pair IC support plate carries out the tool that naked wafer mounts, and it is characterized in that, comprises base, pallet, adhesive material and cover plate;
Described base is for horizontal positioned pallet; Described base top surface is provided with: pallet reference column, and with the location hole IC support plate reference column of corresponding matching one by one of IC support plate;
Described pallet is for horizontal positioned IC support plate; Described pallet is provided with: for allowing the hole of dodging that IC support plate reference column runs through, and with the pallet reference column pallet location hole of corresponding matching one by one, and cover plate location hole; Described pallet end face is also provided with the annular groove of laminating IC support plate edge shape, and described adhesive material is placed in annular groove, and described adhesive material is for being fixed on pallet end face by IC support plate edge;
Described cover plate is for being pressed on pallet by IC support plate; Described cover plate is provided with the hole of dodging of dodging naked wafer and mount position; Described cover plate bottom surface is provided with and the cover plate location hole cover plate reference column of corresponding matching one by one.
2. according to claim 1 IC support plate is carried out to the tool that naked wafer mounts, it is characterized in that, the quantity of described IC support plate reference column is three, is angular distribution.
3. according to claim 2 IC support plate is carried out to the tool that naked wafer mounts, it is characterized in that, the quantity of described pallet reference column is four, rectangular distribution.
4. according to claim 3 IC support plate is carried out to the tool that naked wafer mounts, it is characterized in that, the quantity of described cover plate reference column is two, is positioned at cover plate length direction both sides.
5. according to claim 4 IC support plate is carried out to the tool that naked wafer mounts, it is characterized in that the location hole of described IC support plate and IC support plate reference column tight fit.
6. according to claim 5 IC support plate is carried out to the tool that naked wafer mounts, it is characterized in that described pallet location hole and pallet reference column tight fit.
7. according to claim 6 IC support plate is carried out to the tool that naked wafer mounts, it is characterized in that described cover plate location hole and cover plate reference column tight fit.
8. according to claim 7 IC support plate is carried out to the tool that naked wafer mounts, it is characterized in that, described adhesive material is FPC double faced adhesive tape or high temperature resistant glutinous agent.
9. by tool described in any one in claim 1-8, IC support plate is carried out to the method that naked wafer mounts, it is characterized in that, comprise the steps:
(1) by the pallet reference column contraposition of pallet location hole and base, and by pallet horizontal positioned to base top surface; Now, IC support plate reference column vertically runs through pallet dodges hole, and protrudes from pallet end face;
(2) by the IC support plate reference column contraposition of the location hole of IC support plate and base, and IC support plate is placed to pallet end face, presses the edge of IC support plate, make IC support plate edge be fixed on pallet end face by adhesive material;
(3) pallet is taken out from base, print and put glue being accurately fixed on IC support plate on pallet;
(4) after printing and some glue complete, by the cover plate location hole contraposition of the cover plate reference column of cover plate and pallet, and cover plate is placed to pallet end face; Cover plate relies on himself weight, and IC support plate is pressed on to pallet end face;
(5) to being clamped in the IC support plate between cover plate and pallet, carry out mounting and Reflow Soldering of naked wafer;
(6) after Reflow Soldering completes, cover plate is taken out from pallet, then IC support plate is taken out from pallet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410226835.9A CN103974557B (en) | 2014-05-27 | 2014-05-27 | The method and tool of bare crystalline piece attachment are carried out to IC support plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410226835.9A CN103974557B (en) | 2014-05-27 | 2014-05-27 | The method and tool of bare crystalline piece attachment are carried out to IC support plates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103974557A true CN103974557A (en) | 2014-08-06 |
| CN103974557B CN103974557B (en) | 2017-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410226835.9A Active CN103974557B (en) | 2014-05-27 | 2014-05-27 | The method and tool of bare crystalline piece attachment are carried out to IC support plates |
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Cited By (6)
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| CN104684272A (en) * | 2014-11-19 | 2015-06-03 | 深圳市海能达通信有限公司 | Multi-splicing PCB (printed circuit board) patch clamp and production process thereof |
| CN105828534A (en) * | 2016-04-26 | 2016-08-03 | 安徽安美半导体有限公司 | Tool for rapidly assembling semiconductor diode frame |
| CN106624249A (en) * | 2016-11-30 | 2017-05-10 | 江西洪都航空工业集团有限责任公司 | Fixing method for soldering paste scraping |
| CN109402594A (en) * | 2018-12-13 | 2019-03-01 | 浙江舜宇光学有限公司 | A kind of film coating jig and carrying tooling |
| CN110729218A (en) * | 2019-10-24 | 2020-01-24 | 江苏顺烨电子有限公司 | Rapid assembly process for semiconductor diode frame and auxiliary tool thereof |
| CN112895696A (en) * | 2021-01-18 | 2021-06-04 | 王秋萍 | Stamp clamping device is used in non-woven fabrics production |
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