CN110729218B - Rapid assembly process for semiconductor diode frame and auxiliary tool thereof - Google Patents
Rapid assembly process for semiconductor diode frame and auxiliary tool thereof Download PDFInfo
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- CN110729218B CN110729218B CN201911016545.0A CN201911016545A CN110729218B CN 110729218 B CN110729218 B CN 110729218B CN 201911016545 A CN201911016545 A CN 201911016545A CN 110729218 B CN110729218 B CN 110729218B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a semiconductor diode frame rapid assembly process and an auxiliary tool thereof, which comprise a tool frame, wherein a carrier plate placing groove is formed in the surface of the tool frame, the inner wall of the carrier plate placing groove is matched with the surface of a glue dispenser carrier plate, a positioning and fixing device is arranged on the inner wall of the carrier plate placing groove, the positioning and fixing device comprises a positioning and fixing pipe, and the inner wall of the carrier plate placing groove is in sliding insertion connection with the surface of the glue dispenser carrier plate; the inside of tool frame is provided with quick fixed glue dispenser device of location. This semiconductor diode frame rapid Assembly technology and appurtenance thereof is provided with the fixed glue dispenser device of quick location through the inside that sets up the tool frame, and the fixed point gum machine device of quick location is including adjusting the pole to reached simple structure, convenient operation, great reduction complicated installation dismantlement, avoided semiconductor diode frame to get on the gum machine support plate and put the number of times, reduced operation workman's intensity of labour, improved production efficiency's characteristics.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a rapid assembly process of a semiconductor diode frame and an auxiliary tool thereof.
Background
The solder paste is a novel welding material produced along with SMT, and is a paste mixture formed by mixing solder powder, soldering flux, other surfactants, thixotropic agents and the like. The method is mainly used for welding electronic components such as PCB surface resistance, capacitance, I C and the like in the SMT industry.
At present, in the traditional assembly process, the times of taking and placing the semiconductor diode frame on the glue dispenser carrier plate are too many, and the labor intensity of operators is greatly enhanced and the production efficiency is reduced due to the complex assembly and disassembly, so that a semiconductor diode frame rapid assembly process and an auxiliary tool thereof are needed.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a semiconductor diode frame rapid assembly process and an auxiliary tool thereof, which have the characteristics of simple structure, convenience in operation, great reduction of complex mounting and dismounting, avoidance of the taking and placing times of the semiconductor diode frame on a dispensing machine carrier plate, reduction of the labor intensity of operators and improvement of the production efficiency.
In order to achieve the purpose, the invention provides the following technical scheme:
a semiconductor diode frame rapid assembly process and an auxiliary tool thereof comprise a tool frame, wherein a carrier plate placing groove is formed in the surface of the tool frame, the inner wall of the carrier plate placing groove is matched with the surface of a glue dispenser carrier plate, a positioning and fixing device is arranged on the inner wall of the carrier plate placing groove, the positioning and fixing device comprises a positioning and fixing pipe, and the inner wall of the carrier plate placing groove is in sliding splicing with the surface of the glue dispenser carrier plate;
the inside of the tool frame is provided with a quick positioning and fixing glue dispenser device, and the quick positioning and fixing glue dispenser device comprises an adjusting rod.
Furthermore, mounting holes are formed in the inner wall of the support plate placing groove, the inner walls of the two mounting holes are in threaded connection with the surface of the positioning fixing pipe, and one end of the positioning fixing pipe is fixedly connected with a protection ring;
through above-mentioned technical scheme, set up the effect that the guard ring reaches many location pearl protection, avoid the location pearl to extrude the inside of the fixed pipe of location under the effect of first spring.
Furthermore, the inner wall of the other end of the positioning fixing tube is fixedly connected with a plugging block, the surface of the plugging block is fixedly connected with a first spring, one end of the first spring is fixedly connected with a positioning ball, the surface of the positioning ball is respectively in sliding insertion connection with the inner wall of the positioning fixing tube and the inner wall of the protection ring, the inner diameter of the protection ring is smaller than the diameter of the positioning ball, the surface of the dispensing machine support plate is provided with a positioning hole, and the inner wall of the positioning hole is in sliding insertion connection with the surface of the positioning ball;
through the technical scheme, the effects of convenience in mounting and dismounting of the glue dispenser carrier plate, simple structure and convenience in operation are achieved.
Furthermore, a bearing is fixedly connected to the surface of the tool frame, an inner ring of the bearing is fixedly connected with the surface of the adjusting rod, one end of the adjusting rod is fixedly connected with an operating wheel, an adjusting cavity is formed in the inner wall of the tool frame, and hydraulic oil is arranged inside the adjusting cavity;
through above-mentioned technical scheme, set up the operation wheel and reached the effect of the operation of being convenient for, only need rotate the operation wheel and can adjust the effect of installation dismantlement.
Furthermore, the inner wall of the adjusting cavity is provided with a sliding hole, the inner wall of the sliding hole is slidably inserted with an adjusting pipe, the inner wall of the adjusting pipe is in threaded connection with the surface of the adjusting rod, one end of the adjusting pipe is fixedly connected with a piston, the surface of the piston is fixedly connected with a first sealing ring, and the surface of the first sealing ring is slidably inserted with the inner wall of the adjusting cavity;
through above-mentioned technical scheme, set up the piston and reached the inside hydraulic oil of removal extrusion that utilizes the piston, the effect of its inside oil pressure increase of control or reduction sets up first sealing washer and has reached the sealed effect to its inside hydraulic oil.
Furthermore, the inner wall of the adjusting cavity is provided with a flow groove, the inner walls of one ends of the two flow grooves are both provided with a positioning fixing cavity, the inner walls of the positioning fixing cavities are provided with inserting grooves, and the inner walls of the inserting grooves are inserted with positioning blocks in a sliding manner;
through above-mentioned technical scheme, set up the locating piece and reached the surface through a plurality of locating pieces and extrude the platform surface simultaneously and make it fix firm reliable effect.
Furthermore, the surface of the positioning block is fixedly connected with a second sealing ring, the surface of the second sealing ring is in sliding insertion connection with the inner wall of the positioning fixing cavity, the surface of the positioning block is fixedly connected with a second spring, and one end of the second spring is fixedly connected with the inner wall of the positioning fixing cavity;
through above-mentioned technical scheme, set up the effect that second spring control its condition control locating piece that reduces at the oil pressure resets and retracts, reach and dismantle simple.
Furthermore, the surface of the tool frame is fixedly communicated with a portable oil filling pipe, the inner wall of one end of the portable oil filling pipe is fixedly connected with a clamping ring, and the surface of the clamping ring is fixedly connected with a sealing gasket;
through above-mentioned technical scheme, set up portable oil pipe and reached hidden refueling, and avoided conventional oil pipe to extend the effect that hinders other step operations, also reached the simple portable effect of operation refueling, during the use, through oil pipe joint clamping ring, extrude inside ball sealer, make the ball sealer leave the sealed pad, add hydraulic oil to inside, pull out oil pipe after the interpolation finishes, control ball sealer extrusion sealed pad is sealed under the spring force effect of third spring.
Furthermore, a third spring is fixedly connected to the inner wall of the other end of the portable oil filling pipe, a sealing ball is fixedly connected to one end of the third spring, and the surface of the sealing ball is in sliding insertion connection with the surface of the sealing gasket;
through above-mentioned technical scheme, set up the third spring and reached the sealed effect of control ball sealer extrusion sealing pad, place inside hydraulic oil and reveal.
Further, the first step: an operator firstly arranges the frame on the surface of the glue dispenser carrier plate for tin dispensing operation, takes down the carrier plate after finishing the arrangement processing after the operation is finished, places the carrier plate in the carrier plate placing groove, controls the surface of the glue dispenser carrier plate to extrude the surface of the positioning bead by extruding the carrier plate placing groove, and controls the surface of the positioning bead to extrude the positioning hole for positioning and fixing after continuously extruding downwards until the inner wall of the positioning hole is in sliding insertion connection with the surface of the positioning bead;
step two: after the tool frame is taken out and fixed, chip processing is carried out on the tool frame, after the chip processing, tin dispensing operation needs to be carried out on the dispensing machine again, the tool frame is directly taken under the condition that the carrier plate does not need to be disassembled, and the surfaces of two sides of the bottom of the tool frame are controlled to be clamped with the surface of a platform of the dispensing machine;
step three: when the positioning block is placed on the dispenser platform, the operation wheel is rotated to drive the adjusting rod to rotate, so that the adjusting pipe is driven to move downwards, the piston is driven to extrude hydraulic oil in the piston, the oil pressure of the hydraulic oil is increased, the oil pressure is controlled to flow into the positioning fixing cavity through the flow groove, the surface of the positioning block is extruded, and the side face of the dispenser platform extruded by the positioning block is controlled to be fixed, so that the operation is simple;
step four: after the fixing operation is finished, the tin point operation is carried out on the tool frame, the operation wheel is reversed after the operation is finished, the oil pressure in the control device is reduced, the positioning block is controlled to reset and retract under the action of the second spring, and then the tool frame can be taken out for the next assembling operation.
In conclusion, the invention has the following beneficial effects:
1. the inner wall through setting up the support plate standing groove is provided with location fixing device, and location fixing device is including the fixed pipe in location, and the inner wall of support plate standing groove is pegged graft with the surperficial slip of point gum machine support plate to having reached the effect that the installation of point gum machine support plate is convenient for was dismantled, avoided complicated operation to reduce operation workman's intensity of labour, provided production efficiency's characteristics.
2. The quick positioning and fixing glue dispenser device is arranged in the tool frame and comprises the adjusting rod, so that the purposes of simple structure and convenience in operation are achieved, complex mounting and dismounting are greatly reduced, the number of taking and placing times of a semiconductor diode frame on a glue dispenser carrier plate is avoided, the labor intensity of operators is reduced, and the production efficiency is improved.
Drawings
FIG. 1 is a perspective view of a tool frame structure according to the present invention;
FIG. 2 is a perspective view of a positioning block structure of the present invention;
FIG. 3 is a front view of a positioning block structure of the present invention;
FIG. 4 is a front view of the tool frame construction of the present invention;
FIG. 5 is an enlarged view of the structure of FIG. 4 at A in accordance with the present invention;
FIG. 6 is an enlarged view of the structure of FIG. 4 at B in accordance with the present invention;
FIG. 7 is an enlarged view of the structure of FIG. 4 at C in accordance with the present invention;
FIG. 8 is an enlarged view of the structure of FIG. 4 according to the present invention at D.
In the figure: 1. a tool frame; 2. a support plate placing groove; 3. positioning the fixed tube; 31. mounting holes; 32. a guard ring; 33. blocking; 34. a first spring; 35. a positioning bead; 36. positioning holes; 4. adjusting a rod; 41. a bearing; 42. an operating wheel; 43. an adjustment chamber; 44. a slide hole; 45. an adjusting tube; 46. a piston; 47. a first seal ring; 48. a flow channel; 49. positioning the fixed cavity; 410. inserting grooves; 411. positioning blocks; 412. a second seal ring; 413. a second spring; 5. a portable filler tube; 6. a clamping ring; 7. a gasket; 8. a third spring; 9. and (4) sealing the ball.
Detailed Description
Example (b):
the present invention is described in further detail below with reference to figures 1-8.
A semiconductor diode frame rapid assembly process and an auxiliary tool thereof are disclosed, as shown in figures 1 and 4, the semiconductor diode frame rapid assembly process comprises a tool frame 1, a carrier plate placing groove 2 is formed in the surface of the tool frame 1, the inner wall of the carrier plate placing groove 2 is matched with the surface of a glue dispenser carrier plate, a positioning and fixing device is arranged on the inner wall of the carrier plate placing groove 2, the positioning and fixing device comprises a positioning and fixing pipe 3, and the inner wall of the carrier plate placing groove 2 is in sliding splicing with the surface of the glue dispenser carrier plate;
as shown in fig. 7, mounting holes 31 are formed in the inner wall of the carrier plate placing groove 2, the inner walls of the two mounting holes 31 are in threaded connection with the surface of the positioning fixing tube 3, one end of the positioning fixing tube 3 is fixedly connected with a protection ring 32, the protection ring is arranged to achieve the protection effect of multiple positioning beads, and the positioning beads are prevented from being extruded out of the positioning fixing tube under the action of the first spring; the inner wall of the other end of the positioning fixing tube 3 is fixedly connected with a blocking block 33, the surface of the blocking block 33 is fixedly connected with a first spring 34, one end of the first spring 34 is fixedly connected with a positioning ball 35, the surface of the positioning ball 35 is respectively in sliding insertion connection with the inner wall of the positioning fixing tube 3 and the inner wall of the protection ring 32, the inner diameter of the protection ring 32 is smaller than the diameter of the positioning ball 35, the surface of the dispensing machine support plate is provided with a positioning hole 36, and the inner wall of the positioning hole 36 is in sliding insertion connection with the surface of the positioning ball 35, so that the effects of convenience in mounting and dismounting of the dispensing machine support plate, simple structure and convenience in operation are achieved; the positioning and fixing device is arranged on the inner wall of the support plate placing groove 2 and comprises the positioning and fixing pipe 3, and the inner wall of the support plate placing groove 2 is in sliding insertion connection with the surface of the glue dispenser support plate, so that the effect of convenient mounting and dismounting of the glue dispenser support plate is achieved, the phenomenon that complicated operation is reduced, the labor intensity of operators is reduced, and the production efficiency is improved;
as shown in fig. 5, a fast positioning and fixing glue dispenser device is arranged inside the tool frame 1, and the fast positioning and fixing glue dispenser device comprises an adjusting rod 4; the surface of the tool frame 1 is fixedly connected with a bearing 41, the inner ring of the bearing 41 is fixedly connected with the surface of the adjusting rod 4, one end of the adjusting rod 4 is fixedly connected with an operating wheel 42, the inner wall of the tool frame 1 is provided with an adjusting cavity 43, hydraulic oil is arranged in the adjusting cavity 43, the operating wheel is arranged to achieve the effect of convenient operation, and the effect of installation and disassembly can be adjusted only by rotating the operating wheel; the inner wall of the adjusting cavity 43 is provided with a sliding hole 44, the inner wall of the sliding hole 44 is slidably inserted with an adjusting pipe 45, the inner wall of the adjusting pipe 45 is in threaded connection with the surface of the adjusting rod 4, one end of the adjusting pipe 45 is fixedly connected with a piston 46, the surface of the piston 46 is fixedly connected with a first sealing ring 47, the surface of the first sealing ring 47 is slidably inserted with the inner wall of the adjusting cavity 43, the piston is arranged to achieve the effect of extruding the internal hydraulic oil by the movement of the piston, the effect of controlling the increase or decrease of the internal oil pressure is achieved, and the effect of sealing the internal hydraulic oil by the first sealing ring is achieved;
as shown in fig. 2, 3 and 8, the inner wall of the adjusting cavity 43 is provided with flow grooves 48, the inner walls of one ends of the two flow grooves 48 are both provided with positioning fixing cavities 49, the inner wall of the positioning fixing cavity 49 is provided with an inserting groove 410, the inner wall of the inserting groove 410 is inserted with a positioning block 411 in a sliding manner, and the positioning block is arranged to achieve the effect of pressing the surface of the platform through the surfaces of a plurality of positioning blocks to fix the platform firmly and reliably; the surface of the positioning block 411 is fixedly connected with a second sealing ring 412, the surface of the second sealing ring 412 is in sliding insertion connection with the inner wall of the positioning fixing cavity 49, the surface of the positioning block 411 is fixedly connected with a second spring 413, one end of the second spring 413 is fixedly connected with the inner wall of the positioning fixing cavity 49, the second spring is arranged to control the effect of controlling the positioning block to reset and retract under the condition that the oil pressure is reduced, and the purpose of simple disassembly is achieved;
as shown in fig. 6, the surface of the tool frame 1 is fixedly communicated with a portable oil filling pipe 5, the inner wall of one end of the portable oil filling pipe 5 is fixedly connected with a clamping ring 6, and the surface of the clamping ring 6 is fixedly connected with a sealing gasket 7; the inner wall of the other end of the portable oil filling pipe 5 is fixedly connected with a third spring 8, one end of the third spring 8 is fixedly connected with a sealing ball 9, and the surface of the sealing ball 9 is in sliding insertion connection with the surface of the sealing gasket 7; when the portable oil filling pipe is used, the clamping ring is clamped through the oil pipe to extrude the sealing ball inside, the sealing ball is separated from the sealing gasket, hydraulic oil is added into the sealing gasket, and the sealing ball is controlled to extrude the sealing gasket to seal under the elastic force of the third spring; the third spring is arranged to achieve the effect of controlling the sealing ball to extrude the sealing gasket to seal, and the hydraulic oil inside the sealing ball is prevented from leaking; the quick positioning and fixing glue dispenser device is arranged in the tool frame 1 and comprises the adjusting rod 4, so that the structure is simple, the operation is convenient, the complex installation and disassembly are greatly reduced, the number of taking and placing times of a semiconductor diode frame on a glue dispenser carrier plate is avoided, the labor intensity of operators is reduced, and the production efficiency is improved.
The working principle is as follows: the method comprises the following steps: an operator firstly arranges the frame on the surface of the glue dispenser carrier plate to perform tin dispensing operation, takes down the carrier plate after finishing the discharge processing after the operation is finished, places the carrier plate in the carrier plate placing groove 2, controls the surface of the glue dispenser carrier plate to extrude the surface of the positioning bead 35 by extruding the carrier plate placing groove 2, and controls the surface of the positioning bead 35 to extrude the positioning bead 36 to position and fix the positioning bead 35 after continuously extruding the carrier plate downwards until the inner wall of the positioning hole 36 is inserted with the surface of the positioning bead 35 in a sliding manner;
step two: after the tool frame 1 is taken out and fixed, the chip is processed, the tin dispensing operation is carried out on the dispensing machine again after the chip is processed, the tool frame 1 is directly taken under the condition that the carrier plate does not need to be disassembled, and the surfaces of two sides of the bottom of the tool frame 1 are controlled to be clamped with the surface of a platform of the dispensing machine;
step three: when the positioning block 411 is placed on a dispenser platform, the operation wheel 42 is rotated to drive the adjusting rod 4 to rotate, so that the adjusting pipe 45 is driven to move downwards, the piston 46 is driven to extrude the hydraulic oil in the dispensing block platform, the oil pressure of the hydraulic oil is increased, the hydraulic oil is controlled to flow into the positioning fixing cavity 49 through the flowing groove 48 to extrude the surface of the positioning block 411, the side face of the dispensing block platform is controlled to be extruded by the positioning block 411 to be fixed, and the operation is simple;
step four: after the fixing is finished, the tin-coating operation is carried out on the tool frame, after the operation is finished, the operation wheel 42 is reversed, the oil pressure in the tool frame is controlled to be reduced, the positioning block 411 is controlled to reset and retract under the action of the second spring 413, and then the tool frame 1 can be taken out for the next assembling operation.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (9)
1. A semiconductor diode frame rapid Assembly appurtenance, includes tool frame (1), its characterized in that: a carrier plate placing groove (2) is formed in the surface of the tool frame (1), the inner wall of the carrier plate placing groove (2) is matched with the surface of the glue dispenser carrier plate, a positioning and fixing device is arranged on the inner wall of the carrier plate placing groove (2), the positioning and fixing device comprises a positioning and fixing pipe (3), and the inner wall of the carrier plate placing groove (2) is in sliding insertion connection with the surface of the glue dispenser carrier plate;
a quick positioning and fixing glue dispenser device is arranged in the tool frame (1), and comprises an adjusting rod (4);
the fixed surface of toolbox (1) is connected with bearing (41), the inner circle of bearing (41) is connected with the fixed surface who adjusts pole (4), the one end fixedly connected with operating wheel (42) of adjusting pole (4), regulation chamber (43) have been seted up to the inner wall of toolbox (1), the inside of adjusting chamber (43) is provided with hydraulic oil.
2. The tool of claim 1, wherein the tool comprises: mounting holes (31) are formed in the inner wall of the support plate placing groove (2), the inner wall of each mounting hole (31) is in threaded connection with the surface of the corresponding positioning fixing pipe (3), and one end of each positioning fixing pipe (3) is fixedly connected with a protection ring (32).
3. The tool of claim 2, wherein the tool comprises: the other end inner wall fixedly connected with sprue (33) of location fixed tube (3), the fixed surface of sprue (33) is connected with first spring (34), the one end fixedly connected with location pearl (35) of first spring (34), the surface of location pearl (35) is pegged graft with the inner wall of location fixed tube (3) and the inner wall slip of guard ring (32) respectively, the internal diameter of guard ring (32) is less than the diameter of location pearl (35), locating hole (36) have been seted up on the surface of point gum machine support plate, the inner wall of locating hole (36) is pegged graft with the surface slip of location pearl (35).
4. The tool of claim 1, wherein the tool comprises: the inner wall of adjusting chamber (43) has seted up sliding hole (44), the inner wall of sliding hole (44) slides and pegs graft and have adjusting pipe (45), the inner wall of adjusting pipe (45) and the surperficial threaded connection who adjusts pole (4), the one end fixedly connected with piston (46) of adjusting pipe (45), the fixed surface of piston (46) is connected with first sealing washer (47), the surface of first sealing washer (47) and the inner wall of adjusting chamber (43) slide and peg graft.
5. The tool of claim 1, wherein the tool comprises: the inner wall of the adjusting cavity (43) is provided with flow grooves (48), the inner wall of one end of each of the two flow grooves (48) is provided with a positioning fixing cavity (49), the inner wall of each positioning fixing cavity (49) is provided with an insertion groove (410), and the inner wall of each insertion groove (410) is inserted with a positioning block (411) in a sliding and inserting mode.
6. The tool of claim 5, wherein the tool comprises: the fixed surface of locating piece (411) is connected with second sealing washer (412), the surface of second sealing washer (412) is pegged graft with the inner wall slip of the fixed chamber in location (49), the fixed surface of locating piece (411) is connected with second spring (413), the one end of second spring (413) and the inner wall fixed connection of the fixed chamber in location (49).
7. The tool of claim 1, wherein the tool comprises: the portable oil filling device is characterized in that the surface of the tool frame (1) is fixedly communicated with a portable oil filling pipe (5), the inner wall of one end of the portable oil filling pipe (5) is fixedly connected with a clamping ring (6), and the surface of the clamping ring (6) is fixedly connected with a sealing gasket (7).
8. The tool of claim 7, wherein the tool comprises: the portable oil filling pipe is characterized in that a third spring (8) is fixedly connected to the inner wall of the other end of the portable oil filling pipe (5), a sealing ball (9) is fixedly connected to one end of the third spring (8), and the surface of the sealing ball (9) is in sliding insertion connection with the surface of the sealing gasket (7).
9. A process for implementing a tool for the rapid assembly of semiconductor diode frames as claimed in any one of claims 1 to 8, using the method of: the method comprises the following steps: an operator firstly arranges the frame on the surface of the glue dispenser carrier plate to perform tin dispensing operation, takes down the carrier plate after finishing the discharge processing after the operation is finished, places the carrier plate in the carrier plate placing groove (2), controls the surface of the glue dispenser carrier plate to extrude the surface of the positioning bead (35) by extruding the carrier plate placing groove (2), and controls the surface of the positioning bead (35) to extrude the positioning bead (36) to position and fix the positioning bead (36) after continuously extruding downwards until the inner wall of the positioning hole (36) is inserted with the surface of the positioning bead (35) in a sliding way;
step two: after the tool frame is taken out and fixed, chip processing is carried out on the tool frame, after the chip processing, tin dispensing operation needs to be carried out on the dispensing machine again, the tool frame (1) is directly taken under the condition that the carrier plate does not need to be disassembled, and the surfaces of two sides of the bottom of the tool frame (1) are controlled to be clamped with the surface of a platform of the dispensing machine;
step three: when the positioning device is placed on a dispenser platform, the adjusting rod (4) is driven to rotate by rotating the operating wheel (42), so that the adjusting pipe (45) is driven to move downwards, the piston (46) is driven to extrude the hydraulic oil in the dispensing device, the oil pressure of the hydraulic oil is increased, the oil pressure is controlled to flow into the positioning fixing cavity (49) through the flowing groove (48), the surface of the positioning block (411) is extruded, the side surface of the dispenser platform extruded by the positioning block (411) is controlled to be fixed, and the operation is simple;
step four: after the fixing is finished, the tin point operation is carried out on the tool frame, after the operation is finished, the operation wheel (42) is reversed, the internal oil pressure is controlled to be reduced, the positioning block (411) is controlled to reset and retract under the action of the second spring (413), the tool frame (1) can be taken out, and the next assembling operation is carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911016545.0A CN110729218B (en) | 2019-10-24 | 2019-10-24 | Rapid assembly process for semiconductor diode frame and auxiliary tool thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911016545.0A CN110729218B (en) | 2019-10-24 | 2019-10-24 | Rapid assembly process for semiconductor diode frame and auxiliary tool thereof |
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| CN110729218A CN110729218A (en) | 2020-01-24 |
| CN110729218B true CN110729218B (en) | 2021-11-30 |
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| CN112008637B (en) * | 2020-07-28 | 2022-02-18 | 南京灵雀智能制造有限公司 | Electronic weighing wagon balance sensor mounting device and method |
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