CN106624249B - method for fixing double-sided scraping soldering paste - Google Patents
method for fixing double-sided scraping soldering paste Download PDFInfo
- Publication number
- CN106624249B CN106624249B CN201611080012.5A CN201611080012A CN106624249B CN 106624249 B CN106624249 B CN 106624249B CN 201611080012 A CN201611080012 A CN 201611080012A CN 106624249 B CN106624249 B CN 106624249B
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- China
- Prior art keywords
- printed circuit
- circuit board
- fixing
- mould
- steel plate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Abstract
The invention discloses a fixing method of double-sided scraping soldering paste, which comprises the steps of manufacturing a mould matched with the size of a printed circuit board according to the size of the printed circuit board, using a through hole on the printed circuit board as a positioning hole, manufacturing a positioning pin of the mould according to the size of the positioning hole, fixing the printed circuit board on the mould, matching the positioning hole with the positioning pin, pushing the mould fixed with the printed circuit board into a clamping groove of a silk screen steel plate, arranging fixing plates for fixing the position of the printed circuit board on three positions of the silk screen steel plate, and forming the clamping groove between the fixing plates at the three positions.
Description
Technical Field
The invention relates to a fixing method of double-sided scraping solder pastes.
Background
The printed circuit board can shift when the solder paste is scraped, so that the solder paste can not be accurately scraped and printed on a solder pad of the printed circuit board, and because the thickness of the material used for the die is relatively thin, components welded on the front surface of the printed circuit board on the th surface contact with a screen printing table board when the solder paste is scraped on the second surface, the components are easily extruded and damaged.
Therefore, new technical solutions are needed to solve the above problems.
Disclosure of Invention
The invention aims to provide fixing methods for double-sided scraping of solder paste, which can improve the success rate and reduce the damage rate of components in the process of scraping the solder paste on the back surface of a printed circuit board.
In order to solve the technical problem, the invention adopts the technical scheme that:
A method for fixing double-sided scraping solder paste, comprising the following steps:
(1) manufacturing a mould matched with the printed circuit board in size according to the printed circuit board, using a via hole on the printed circuit board as a positioning hole, and manufacturing a positioning pin of the mould according to the size of the positioning hole;
(2) the printed circuit board is fixed on the die, the positioning holes are matched with the positioning pins, the die fixed with the printed circuit board is pushed into the clamping grooves of the silk screen steel plate, the fixing plates used for fixing the position of the printed circuit board are arranged at three positions of the silk screen steel plate, and the clamping grooves are spaces formed among the fixing plates at the three positions, so that soldering paste can be accurately scraped and printed on soldering tin plates on the reverse side of the printed circuit board.
The three positions of the wire mesh steel plate are respectively provided with an th fixing plate, a second fixing plate and a third fixing plate, the th fixing plate and the second fixing plate are positioned at the upper side and the lower side of the wire mesh steel plate, and the third fixing plate is positioned at the side edges of the left side and the right side of the wire mesh steel plate.
The printed circuit board is provided with two through holes, and the two through holes are distributed on two sides of the printed circuit board.
The invention has the beneficial effects that: the method mainly adopts two through holes on the printed circuit board to fix the printed circuit board on a self-made mould, so that the printed circuit board can not shift, and then the fixed printed circuit board and the mould are pushed into a clamping groove of a silk screen steel plate with a fixed plate, so that the soldering paste can be accurately printed on a soldering tin plate on the back side of the printed circuit board.
Drawings
Fig. 1 is a schematic structural view of a wire mesh steel sheet according to the present invention.
FIG. 2 is a diagram of a solder pad on a circuit board by silk-screen printing.
Fig. 3 is a schematic view of a mold for fabrication according to the present invention.
Fig. 4 is a side sectional view of fig. 1.
The positioning device comprises a die 1, a die 2, a positioning pin 3, an opening 4, a printed circuit board 5, a silk screen steel plate 61, an th fixing plate 62, a second fixing plate 63, a third fixing plate 7, a through hole 8, a soldering tin plate 9, a through hole 10 and a clamping groove.
Detailed Description
The present invention is further illustrated at with reference to the following specific examples, which are intended to be illustrative only and are not intended to limit the scope of the invention.
Referring to fig. 1 to 4, the method for fixing double-sided-scraping solder paste of the present invention comprises the following steps:
(1) manufacturing a mould 1 matched with the printed circuit board in size according to the printed circuit board, manufacturing a positioning pin 2 of the mould 1 according to the positioning hole by using two through holes 9 on the printed circuit board 4 as the positioning hole, and enabling the size of an opening 3 in the mould 1 to be based on the maximum size of the periphery of the component so that the component does not collide with any object;
(2) fix printed circuit board 4 on mould 1, the locating hole cooperates with locating pin 2, and the mould 1 that will fix printed circuit board 4 again pushes into the draw-in groove 10 that has the silk screen steel sheet 5 of fixed plate, and the fixed plate is the board that is used for fixed printed circuit board position, is dotted line frame in silk screen steel sheet 5 in figure 1, and the dotted line frame is the fixed plate of three position in fact, forms draw-in groove 10 between the fixed plate of three position, makes the accurate scraping of solder paste to be printed on the soldering tin dish of printed circuit board 4 reverse side.
The th fixing plate 61, the second fixing plate 62 and the third fixing plate 63 are respectively installed at three positions of the screen steel plate 5, the th fixing plate 61 and the second fixing plate 62 are located at the upper and lower sides of the screen steel plate 5, and the third fixing plate 63 is located at the side of the left and right sides of the screen steel plate 5.
The printed circuit board 4 is provided with two through holes 9, and the two through holes 9 are distributed on two sides of the printed circuit board 4. And matching the two via holes 9 of the printed circuit board 4 with the two positioning pins 2 of the mold 1 to complete the process of fixing the printed circuit board 4 on the mold 1.
Because the thickness of the die material is thicker than that of the th surface, when the second surface scrapes the solder paste, the distance between the components welded on the front surface of the th surface of the printed circuit board and the screen printing table surface is enough, so that the components are not damaged by extrusion, thereby improving the quality of scraping the solder paste and reducing the damage of the components.
The silk screen steel plate 5 is suitable for the process of scraping the solder paste on the two sides of a plurality of printed circuit boards, plays a role in fixing the printed circuit boards, prevents components welded on the front side of the printed circuit boards from contacting with a screen printing table surface in the process of scraping the solder paste on the back side, keeps the printed circuit boards 4 in a balanced state when scraping the solder paste, ensures that the through holes 7 on the silk screen steel plate 5 and the solder pads 8 on the printed circuit boards 4 are in good correspondence, and can ensure that the solder paste can be accurately scraped and printed on the solder pads on the back side of the printed circuit boards.
Through the test, in the process of scraping the solder paste on the back surface of the printed circuit board, the quality of the solder paste is obviously improved, and the front components cannot collide with any object, so that the damage rate of the components is reduced.
Claims (2)
1, fixing method of double-sided scraping solder paste, which is characterized by comprising the following steps:
(1) manufacturing a mould matched with the printed circuit board in size according to the printed circuit board, using a via hole on the printed circuit board as a positioning hole, and manufacturing a positioning pin of the mould according to the size of the positioning hole;
(2) fixing the printed circuit board on a mould, matching the positioning hole with the positioning pin, pushing the mould fixed with the printed circuit board into a clamping groove of a silk screen steel plate, arranging fixing plates for fixing the position of the printed circuit board on three positions of the silk screen steel plate, wherein the clamping groove is a space formed between the fixing plates at the three positions, so that soldering paste can be accurately scraped and printed on a soldering tin plate on the back side of the printed circuit board;
the three positions of the wire mesh steel plate are respectively provided with an th fixing plate, a second fixing plate and a third fixing plate, the th fixing plate and the second fixing plate are positioned at the upper side and the lower side of the wire mesh steel plate, and the third fixing plate is positioned at the side edges of the left side and the right side of the wire mesh steel plate.
2. The method for fixing kinds of double-sided-scraping solder paste as claimed in claim 1, wherein the PCB has two through holes, and the two through holes are distributed on two sides of the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611080012.5A CN106624249B (en) | 2016-11-30 | 2016-11-30 | method for fixing double-sided scraping soldering paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611080012.5A CN106624249B (en) | 2016-11-30 | 2016-11-30 | method for fixing double-sided scraping soldering paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106624249A CN106624249A (en) | 2017-05-10 |
| CN106624249B true CN106624249B (en) | 2020-01-31 |
Family
ID=58813328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611080012.5A Active CN106624249B (en) | 2016-11-30 | 2016-11-30 | method for fixing double-sided scraping soldering paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106624249B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN103974557A (en) * | 2014-05-27 | 2014-08-06 | 苏州市易德龙电器有限公司 | Method and jig for attaching bare chip to IC (Integrated Circuit) substrate |
| CN104144577A (en) * | 2014-07-25 | 2014-11-12 | 江苏联康电子有限公司 | PCB soldering paste silk screen steel mesh |
| CN205271090U (en) * | 2016-01-12 | 2016-06-01 | 北京京东方显示技术有限公司 | Weld steel net system spare |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02143860A (en) * | 1988-11-26 | 1990-06-01 | Mitsubishi Electric Corp | Screen printing method onto substrates having different thicknesses |
| JP2004148644A (en) * | 2002-10-30 | 2004-05-27 | Shinko Electric Ind Co Ltd | Apparatus and method for printing |
-
2016
- 2016-11-30 CN CN201611080012.5A patent/CN106624249B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN103974557A (en) * | 2014-05-27 | 2014-08-06 | 苏州市易德龙电器有限公司 | Method and jig for attaching bare chip to IC (Integrated Circuit) substrate |
| CN104144577A (en) * | 2014-07-25 | 2014-11-12 | 江苏联康电子有限公司 | PCB soldering paste silk screen steel mesh |
| CN205271090U (en) * | 2016-01-12 | 2016-06-01 | 北京京东方显示技术有限公司 | Weld steel net system spare |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106624249A (en) | 2017-05-10 |
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| CP02 | Change in the address of a patent holder |
Address after: Nanchang high tech Industrial Development Zone, Jiangxi Province Patentee after: JIANGXI HONGDU AVIATION INDUSTRY GROUP Co.,Ltd. Address before: 330000 Jiangxi city in Nanchang Province, the new bridge box 460 box 5001 Patentee before: JIANGXI HONGDU AVIATION INDUSTRY GROUP Co.,Ltd. |
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