CN201283377Y - Mold for punching warpage of aluminum substrate - Google Patents

Mold for punching warpage of aluminum substrate Download PDF

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Publication number
CN201283377Y
CN201283377Y CNU2009201513803U CN200920151380U CN201283377Y CN 201283377 Y CN201283377 Y CN 201283377Y CN U2009201513803 U CNU2009201513803 U CN U2009201513803U CN 200920151380 U CN200920151380 U CN 200920151380U CN 201283377 Y CN201283377 Y CN 201283377Y
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China
Prior art keywords
jade
warpage
arc
aluminum
aluminium base
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Expired - Lifetime
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CNU2009201513803U
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Chinese (zh)
Inventor
杨成君
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Shenzhen Kinwong Electronic Co Ltd
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Shenzhen Kinwong Electronic Co Ltd
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Priority to CNU2009201513803U priority Critical patent/CN201283377Y/en
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Publication of CN201283377Y publication Critical patent/CN201283377Y/en
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Abstract

The utility model discloses an aluminum-based plate punching warping die, which comprises an upper die jade and a lower die jade, wherein an arc-shaped convex area is arranged on the lower portion of the upper die jade, an arc-shaped groove is arranged on the upper portion of the lower die jade corresponding to the arc-shaped convex area, and the arc-shaped convex area and the arc-shaped groove are correspondingly clamped without seams. When the aluminum-based plate punching warping die carries out reverse warping compensation to an aluminum-based plate, the warped aluminum-based plate can be clamped between the upper die jade and the lower die jade for pressing, the reverse warping quantity of the pressed aluminum-based plate is evener, the rebound amount after SMT is consistent, the straight-through rate of the aluminum-based plate is improved, and the subsequent return fluid welding reliability is guaranteed.

Description

Aluminium base is towards the warpage mould
Technical field:
The utility model relates to a kind of aluminium base towards the warpage mould, particularly a kind of mould that is used for the aluminium base warpage is compensated processing.
Background technology:
Aluminium base is made up of copper, high thermal conductivity insulating layer and aluminium sheet three parts, because the thermal conductivity factor of these three kinds of materials is widely different, as: the high heat conductive insulating layer is: 3.0W/m ℃, aluminium is 190.0W/m ℃, and copper is 390.0W/m ℃.Therefore carry out SMT (surface mount) when mounting after crossing Reflow Soldering, owing to be subjected to temperatures involved, material can produce different stress and be out of shape, and then causes the aluminium sheet warpage.
The warpage of aluminium base mainly shows on the not reciprocity rectangle aluminium base of length and width, this type of aluminium base is in the amount of warpage that 0.25~0.35mm height is arranged behind SMT, and because the back operation also needs multi pack that the PCB of FR-4 material is arranged again, so the warpage of aluminium sheet brings influence on efficient and the quality can for the back process operations.Mount for satisfying SMT high temperature, need in advance aluminium base to be carried out the bent processing of reflex action, with the warpages that produce because of the material stress difference in the compensation SMT process, but industry does not also have concrete method and measure effectively to solve the problem of aluminium base warpage at present.
The utility model content:
For solving the problem of aluminium base warpage in the prior art, the purpose of this utility model is to provide a kind of aluminium base towards the warpage mould.
For achieving the above object, the utility model adopts following technical scheme:
A kind of aluminium base includes the beautiful and counterdie jade of patrix towards the warpage mould, and the beautiful bottom of described patrix is provided with an arc convex, and the beautiful top of described counterdie is provided with an arc groove corresponding to above-mentioned arc convex place, the corresponding seamless engaging with arc groove of described arc convex.
Be used for holding warpage aluminium base between described patrix jade and the counterdie jade.
Described counterdie jade bottom is provided with a plurality of fixing holes.
Described patrix jade is by having elasticity and indeformable colloid is made.
The beautiful bottom of the utility model patrix is an arc convex, and the beautiful top of counterdie is arc groove, and the corresponding seamless engaging with arc groove of described arc convex.When aluminium base being carried out the bent compensation of reflex action, can be between patrix jade and counterdie jade with the aluminium base holding of warpage, carry out pressing, aluminium base reflex action amount control after pressing then relatively evenly, cross rebound amount unanimity behind the SMT, improved the first-pass yield of aluminium base and guaranteed the follow-up reliability of crossing Reflow Soldering.
Description of drawings:
Fig. 1 is a structural representation of the present utility model.
Identifier declaration among the figure: patrix jade 1, arc convex 101, counterdie jade 2, arc groove 201, warpage aluminium base 3.
The specific embodiment:
Core concept of the present utility model is: by in the beautiful bottom of patrix an arc convex being set, and the arc groove of a correspondence is set on the beautiful top of counterdie, make the corresponding seamless engaging of arc convex with arc groove, when aluminium base being carried out the bent compensation of reflex action, the aluminium base of warpage is placed between patrix jade and the counterdie jade, carry out pressing, to improve the aluminium base first-pass yield of warpage.
For setting forth thought of the present utility model and purpose, the utility model is described further below in conjunction with the drawings and specific embodiments.
See also shown in Figure 1ly, the utility model provides a kind of aluminium base towards the warpage mould, and it is mainly used in the aluminium base warpage is compensated processing.Include patrix beautiful 1 and counterdie jade 2, patrix jade 1 is by having elasticity and indeformable colloid is made.Wherein the bottom of patrix jade 1 is provided with an arc convex 101, and patrix beautiful 1 adopts the colloid design of not hindering sheet material here, and its characteristic is to have certain elasticity and indeformable in the process of punching press repeatedly; Counterdie beautiful 2 is the normal steel body structure, and its top is provided with an arc groove 201 corresponding to above-mentioned arc convex 101 places, described arc convex 101 and arc groove 201 corresponding seamless engagings.
And between patrix beautiful 1 and counterdie jade 2, be used for fixing holding warpage aluminium base 3, wherein the amount of warpage of warpage aluminium base 3 is 0.25~0.35mm, this moment, the warpage with warpage aluminium base 3 partly made progress, its arc convex 101 with beautiful 1 bottom of patrix is contacted, the non-warpage part of warpage aluminium base 3 is then downward at this moment, corresponding with the arc groove 201 of counterdie jade 2, be pressed together on patrix jade 1 on the counterdie jade 2 this moment, make arc convex 101 and arc groove 201 corresponding seamless engagings, the warpage of warpage aluminium base 3 part has then been carried out the bent compensation of reflex action at this moment.
In addition, the counterdie here beautiful 2 is the normal steel body structure, and its bottom is provided with a plurality of fixing holes, can be the counterdie beautiful 2 of this steel body structure is fixing by screw, and to prevent that counterdie beautiful 2 takes place in the course of the work to slide.
Specific operation process wherein of the present utility model is: at first check and the suit mould, whether the colloid compression face colloid (being the capable projection 101 of arc) of checking patrix jade 1 in the mould has foreign matter, it is loosening to check whether each screw has, and cleaning table top dirt after inspection finishes is installed mould.After start is adjusted then, carry out the bent operation of reflex action, be specially: tear the aluminium surface protective film; with circuit surface up, aluminium faces down, and before the punching press plate is placed in the mold slots; and during with the plate punching press towards the placement that keeps left or keep right of same direction, behind the constant bearing, punching press 1PCS; measure depth of camber, when depth of camber is lower than customer requirement, will move on the limited screw; when depth of camber is higher than requirement; limited screw is moved down, do first plate again, up to finishing.
More than a kind of aluminium base provided by the utility model is described in detail towards the warpage mould, used specific case herein principle of the present utility model and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present utility model and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.

Claims (3)

1, a kind of aluminium base is towards the warpage mould, it is characterized in that including patrix jade (1) and counterdie jade (2), described patrix jade (1) bottom is provided with an arc convex (101), an arc groove (201) is located to be provided with corresponding to above-mentioned arc convex (101) in described counterdie jade (2) top, described arc convex (101) and the corresponding seamless engaging of arc groove (201).
2, aluminium base according to claim 1 is characterized in that towards the warpage mould described counterdie jade (2) bottom is provided with a plurality of fixing holes.
3, aluminium base according to claim 1 is towards the warpage mould, it is characterized in that described patrix jade (1) is by having elasticity and indeformable colloid is made.
CNU2009201513803U 2009-04-20 2009-04-20 Mold for punching warpage of aluminum substrate Expired - Lifetime CN201283377Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2009201513803U CN201283377Y (en) 2009-04-20 2009-04-20 Mold for punching warpage of aluminum substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2009201513803U CN201283377Y (en) 2009-04-20 2009-04-20 Mold for punching warpage of aluminum substrate

Publications (1)

Publication Number Publication Date
CN201283377Y true CN201283377Y (en) 2009-08-05

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Family Applications (1)

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CNU2009201513803U Expired - Lifetime CN201283377Y (en) 2009-04-20 2009-04-20 Mold for punching warpage of aluminum substrate

Country Status (1)

Country Link
CN (1) CN201283377Y (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101898216A (en) * 2010-07-13 2010-12-01 世纪机械(安徽)有限公司 Steel back leveling die
CN102284560A (en) * 2011-07-26 2011-12-21 中国北车集团大连机车研究所有限公司 Process for leveling aluminum alloy brazing plate
CN102632108A (en) * 2012-04-28 2012-08-15 昆山长运电子工业有限公司 Leveling jig for LED (Light-Emitting Diode) display back plate
CN105562468A (en) * 2014-10-30 2016-05-11 日本发条株式会社 Warp correction apparatus for plate-like workpiece and warp correction method
CN105728501A (en) * 2016-04-29 2016-07-06 国网山东省电力公司汶上县供电公司 Plate flattening device
CN105728500A (en) * 2016-04-29 2016-07-06 国网山东省电力公司汶上县供电公司 Plate flattening device
CN108526246A (en) * 2018-05-21 2018-09-14 靖江市佳佳工程机械制造有限公司 A kind of thin plate circular pieces hot sizing method
CN109392247A (en) * 2018-10-16 2019-02-26 江苏迪飞达电子有限公司 A kind of manufacture craft of curved surface aluminum substrate
CN109982513A (en) * 2019-04-27 2019-07-05 宏俐(汕头)电子科技有限公司 A kind of circuit board sticks up correcting tool
CN111804754A (en) * 2020-06-05 2020-10-23 东莞市新美洋技术有限公司 Flatness adjusting device and flatness adjusting method

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101898216A (en) * 2010-07-13 2010-12-01 世纪机械(安徽)有限公司 Steel back leveling die
CN101898216B (en) * 2010-07-13 2012-05-23 世纪机械(安徽)有限公司 Steel back leveling die
CN102284560A (en) * 2011-07-26 2011-12-21 中国北车集团大连机车研究所有限公司 Process for leveling aluminum alloy brazing plate
CN102284560B (en) * 2011-07-26 2013-06-05 中国北车集团大连机车研究所有限公司 Process for leveling aluminum alloy brazing plate
CN102632108A (en) * 2012-04-28 2012-08-15 昆山长运电子工业有限公司 Leveling jig for LED (Light-Emitting Diode) display back plate
CN105562468B (en) * 2014-10-30 2017-10-24 日本发条株式会社 Warp correction equipment and warpage correcting method for plate workpiece
CN105562468A (en) * 2014-10-30 2016-05-11 日本发条株式会社 Warp correction apparatus for plate-like workpiece and warp correction method
US10332551B2 (en) 2014-10-30 2019-06-25 Nhk Spring Co., Ltd. Warp correction apparatus for plate-like workpiece and warp correction method
US11152022B2 (en) 2014-10-30 2021-10-19 Nhk Spring Co., Ltd. Warp correction apparatus for plate-like workpiece and warp correction method
CN105728501A (en) * 2016-04-29 2016-07-06 国网山东省电力公司汶上县供电公司 Plate flattening device
CN105728500A (en) * 2016-04-29 2016-07-06 国网山东省电力公司汶上县供电公司 Plate flattening device
CN105728501B (en) * 2016-04-29 2018-06-19 国网山东省电力公司汶上县供电公司 A kind of plank apparatus for leveling
CN108526246A (en) * 2018-05-21 2018-09-14 靖江市佳佳工程机械制造有限公司 A kind of thin plate circular pieces hot sizing method
CN109392247A (en) * 2018-10-16 2019-02-26 江苏迪飞达电子有限公司 A kind of manufacture craft of curved surface aluminum substrate
CN109982513A (en) * 2019-04-27 2019-07-05 宏俐(汕头)电子科技有限公司 A kind of circuit board sticks up correcting tool
CN111804754A (en) * 2020-06-05 2020-10-23 东莞市新美洋技术有限公司 Flatness adjusting device and flatness adjusting method

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C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SHENZHEN KINWONG ELECTRONIC CO., LTD.

Free format text: FORMER NAME: KINGWONG ELECTRONICS (SHENZHEN) CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: 518126, No. 166, Reservoir Road, iron Gang village, West Village, Shenzhen, Guangdong, Baoan District

Patentee after: Shenzhen Kinwong Electronic Co., Ltd.

Address before: 518126, No. 166, Reservoir Road, iron Gang village, West Village, Shenzhen, Guangdong, Baoan District

Patentee before: Kinwong Electronic (Shenzhen) Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20090805