CN201329478Y - Slice type LED bonding wire tool - Google Patents

Slice type LED bonding wire tool Download PDF

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Publication number
CN201329478Y
CN201329478Y CNU2008202062483U CN200820206248U CN201329478Y CN 201329478 Y CN201329478 Y CN 201329478Y CN U2008202062483 U CNU2008202062483 U CN U2008202062483U CN 200820206248 U CN200820206248 U CN 200820206248U CN 201329478 Y CN201329478 Y CN 201329478Y
Authority
CN
China
Prior art keywords
base plate
bonding wire
edges
substrate
guide edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008202062483U
Other languages
Chinese (zh)
Inventor
熊书明
肖斌
李燕
李国平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongli Zhihui Group Co Ltd
Original Assignee
Guangzhou Hongli Tronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Hongli Tronic Co Ltd filed Critical Guangzhou Hongli Tronic Co Ltd
Priority to CNU2008202062483U priority Critical patent/CN201329478Y/en
Application granted granted Critical
Publication of CN201329478Y publication Critical patent/CN201329478Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a slice type LED bonding wire tool comprising a frame and a base plate, wherein the frame comprises two connecting edges, two base plate bearing edges which are mutually parallel, and two guiding edges, wherein the thickness of the guiding edges is 0.5-2 mm, the base plate bearing edges are lower than the guiding edges, locating columns are arranged on the base plate bearing edges, and locating holes which are corresponding to the locating columns are arranged on the base plates. Adopting the structure, the complete automation of LED bonding wires can be realized, the producing efficiency is improved, the locating columns and the locating holes are arranged, which enables the location of the base plate to be more accurate, thereby the precision of the bonding wires is high and the quality of products is good.

Description

A kind of bonding wire tool of sheet-shaped LED
Technical field
The utility model relates to tool, particularly the bonding wire tool of sheet-shaped LED.
Background technology
Along with developing rapidly that LED uses, LED has obtained in other fields such as backlight, Landscape Lighting, domestic lighting and automotive lightings using widely.The packing forms of power-type LED mainly contains Piranha formula, aluminium base board-like, large power triode formula, with the heat sink integrated formula of SMD formula, aluminium base and the encapsulation of ceramic-type, the lighting field of the LED of these packing forms in our daily life is seen everywhere.The integrated PCB encapsulated LED of existing potsherd cribbing and aluminium base, because ceramics bracket is cracked easily, but can not be too thick, as too thick, then when full-automatic bonding wire, it is too narrow that bonding equipment is crossed the track of sheet mechanism, can not be direct cross sheet and carry out full-automatic bonding wire, therefore, can only be with the manual mistake of semi-automatic bonding wire sheet, production efficiency is low like this, is difficult for producing in enormous quantities.
Summary of the invention
The purpose of this utility model is for a kind of bonding wire tool of sheet-shaped LED being provided, utilizing structure of the present utility model, when carrying out the LED bonding wire, can realize full-automation, enhances productivity.
For achieving the above object, the bonding wire tool of sheet-shaped LED of the present utility model comprises framework and substrate, described framework comprises two fillets, two base plate carrying limits and two guide edges, and described base plate carrying limit and guide edge are parallel to each other, and described guide edge thickness is 0.5-2mm; Described base plate carrying limit is lower than described guide edge, and after substrate was put into the base plate carrying limit, the upper surface of substrate was no more than guide edge; Described base plate carrying limit is provided with reference column, and substrate is provided with and the reference column corresponding positioning hole.
Before the bonding wire, allow substrate locating hole align substrates carrying limit reference column and put in the framework, during bonding wire, described guide edge orbital motion, thereby realize bonding wire work.This structure, because the thickness of guide edge is little, between 0.5-2mm, and the base plate carrying limit is lower than described guide edge, therefore, this tool can pass through narrower track, thereby realizes full-automatic bonding wire, has improved production efficiency; Owing on the base plate carrying limit, be provided with reference column, on substrate, be provided with corresponding positioning hole, therefore, the accurate positioning of substrate on framework.
As improvement, guide edge on the described framework and fillet intersection are provided with the hole; Adopt this structure, be convenient to the processing of framework.
Compared with prior art, the utility model has been realized the full-automation of LED lamp bonding wire, has improved production efficiency, and has been provided with reference column and locating hole, makes substrate orientation accurate, therefore, bonding wire precision height, the quality of product is good.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the structural representation of framework.
The specific embodiment
The bonding wire tool of sheet-shaped LED as depicted in figs. 1 and 2 is by framework 1 and substrate 2; Described framework 1 comprises two base plate carrying limits 101, two guide edges 102 and fillets 103, wherein base plate carrying limit 101 and guide edge 102 are parallel to each other, the thickness of described guide edge 102 is 0.5-2mm, base plate carrying limit 101 is lower than guide edge 102, when substrate 2 was put on the base plate carrying limit 101, the height of substrate 2 was not higher than guide edge 102; Be provided with reference column 3 on base plate carrying plate 101, be provided with on substrate and reference column corresponding positioning hole 4, guide edge on framework 1 and fillet intersection are provided with hole 5.
Before the bonding wire, allow substrate locating hole align substrates carrying limit reference column and put in the framework, during bonding wire, the guide edge orbital motion, thereby realize bonding wire work.This structure, because the thickness of guide edge is little, between 0.5-2mm, and the base plate carrying limit is lower than described guide edge, and when it guaranteed that highly substrate is put on the base plate carrying limit, substrate was not higher than guide edge, therefore, this tool can pass through narrower track, thereby realizes full-automatic bonding wire, has improved production efficiency; Owing on the base plate carrying limit, be provided with reference column, on substrate, be provided with corresponding positioning hole, therefore, and the accurate positioning of substrate on framework, bonding wire precision height, the quality of product is good; Machining hole on framework is convenient to the processing of framework.

Claims (2)

1. the bonding wire tool of a sheet-shaped LED comprises framework and substrate, it is characterized in that: described framework comprises two fillets and two parallel base plate carrying limit and two guide edges, and described guide edge thickness is 0.5-2mm; Described base plate carrying limit is lower than described guide edge; Described base plate carrying limit is provided with reference column, and substrate is provided with and the reference column corresponding positioning hole.
2. the bonding wire tool of sheet-shaped LED according to claim 1, it is characterized in that: guide edge on the described framework and fillet intersection are provided with the hole.
CNU2008202062483U 2008-12-26 2008-12-26 Slice type LED bonding wire tool Expired - Fee Related CN201329478Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008202062483U CN201329478Y (en) 2008-12-26 2008-12-26 Slice type LED bonding wire tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008202062483U CN201329478Y (en) 2008-12-26 2008-12-26 Slice type LED bonding wire tool

Publications (1)

Publication Number Publication Date
CN201329478Y true CN201329478Y (en) 2009-10-21

Family

ID=41222852

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008202062483U Expired - Fee Related CN201329478Y (en) 2008-12-26 2008-12-26 Slice type LED bonding wire tool

Country Status (1)

Country Link
CN (1) CN201329478Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107042192A (en) * 2017-03-27 2017-08-15 深圳市欧美亚科技有限公司 LED flexibility filament support fixed jigs
CN107813079A (en) * 2017-11-20 2018-03-20 江门市江海区康欣电子科技有限公司 A kind of LED wire-soldering devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107042192A (en) * 2017-03-27 2017-08-15 深圳市欧美亚科技有限公司 LED flexibility filament support fixed jigs
CN107813079A (en) * 2017-11-20 2018-03-20 江门市江海区康欣电子科技有限公司 A kind of LED wire-soldering devices

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou

Patentee after: Guangzhou Hongli Tronic Co., Ltd.

Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou

Patentee before: Guangzhou Hongli Photoelectron Co., Ltd.

C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1

Patentee after: Hongli Newell group Limited by Share Ltd

Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou

Patentee before: Guangzhou Hongli Tronic Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091021

Termination date: 20171226

CF01 Termination of patent right due to non-payment of annual fee