CN107813079A - A kind of LED wire-soldering devices - Google Patents
A kind of LED wire-soldering devices Download PDFInfo
- Publication number
- CN107813079A CN107813079A CN201711154738.3A CN201711154738A CN107813079A CN 107813079 A CN107813079 A CN 107813079A CN 201711154738 A CN201711154738 A CN 201711154738A CN 107813079 A CN107813079 A CN 107813079A
- Authority
- CN
- China
- Prior art keywords
- lamp bead
- bead plate
- led
- upper fixture
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The invention discloses a kind of LED wire-soldering devices, including the LED of upper fixture, the wire-soldering device being arranged on above upper fixture, the multiple proper alignments of carrying lamp bead plate, connecting rod, lower clamp, two baffle plates spacing the progress of lamp bead plate both sides, the first drive mechanism for driving lamp bead plate to be moved two baffle plates and control device；The upper fixture is arranged on above lamp bead plate, the upper fixture is provided with the through hole of multiple proper alignments, the arrangement mode of the through hole is corresponding with the LED arrangement modes on lamp bead plate, and upper fixture is connected with connecting rod, and connecting rod is connected with the 3rd drive mechanism of its lifting of driving；The lower clamp is arranged on below lamp bead plate, is coordinated with upper fixture and is compressed lamp bead plate.For the present apparatus by the positioning of fixture and the effect of through hole, wire-soldering device can accurately carry out bonding wire, improve the quality of production, and the device can rapidly process the LED of a whole plate, improve production efficiency, and without manual operation, realize automation, reduce production cost.
Description
Technical field
The present invention relates to LED manufacture fields, particularly a kind of LED wire-soldering devices.
Background technology
LED is widely applied in daily life due to good performance and relatively low energy consumption, as new backlight with
And lighting source.LED encapsulation is one of important step of LED productions, and wherein bonding wire craft has very big to LED package quality quality
Influence, it directly determines the performance quality of LED product.Traditional bonding wire operation, it is inefficient, and because precision is poor, production
Quality is not also high.
The content of the invention
It is contemplated that at least solves above-mentioned technical problem to a certain extent.Therefore, the present invention proposes a kind of LED bonding wires
Device.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of LED wire-soldering devices, including upper fixture, the wire-soldering device being arranged on above upper fixture, the multiple neat rows of carrying
The LED of row lamp bead plate, connecting rod, lower clamp, lamp bead plate both sides are carried out with two spacing baffle plates, driving lamp bead plate at two
The first drive mechanism and control device moved between baffle plate；The upper fixture is arranged on above lamp bead plate, and the upper fixture is set
Be equipped with the through hole of multiple proper alignments, the arrangement mode of the through hole is corresponding with the LED arrangement modes on lamp bead plate, upper fixture with
Connecting rod connects, and connecting rod is connected with the 3rd drive mechanism of its lifting of driving；The lower clamp is arranged on below lamp bead plate, with
Upper fixture, which coordinates, compresses lamp bead plate；The wire-soldering device includes carrying out the bonding wire pin of bonding wire to LED through through hole and driving is welded
Second drive mechanism of line pin work；The control device drives with the first drive mechanism, the second drive mechanism and the 3rd respectively
Motivation structure is connected to control its work.
Further, the through hole is bellmouth.
Further, the connecting rod is provided with two, is separately fixed at the both ends of upper fixture.
Further, first drive mechanism includes screw mandrel and stepper motor, and stepper motor is connected with control device.
Further, the 3rd drive mechanism is cylinder.
The beneficial effects of the invention are as follows：By the positioning of fixture and the effect of through hole, wire-soldering device can be carried out accurately
Bonding wire, the quality of production being improved, the device can rapidly process the LED of a whole plate, improve production efficiency, and without manually grasping
Make, realize automation, reduce production cost.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is mounting structure schematic diagram of the present invention.
Embodiment
The present invention is described in detail with reference to the accompanying drawings and examples.
Reference picture 1, a kind of LED wire-soldering devices of the invention, including upper fixture 1, the bonding wire dress for being arranged on the top of upper fixture 1
Lamp bead plate 6, the connecting rod 2 for connecting upper fixture 1 and the cooperation of upper fixture 1 for putting the LED of 4, the multiple proper alignments of carrying compress lamp bead
The lower clamp of plate 6, the both sides of lamp bead plate 6 are carried out with spacing two baffle plates 3, driving lamp bead plate 6 moves two baffle plates 3 the
One drive mechanism and control device；Lower clamp is located at the lower section of lamp bead plate 6, and upper fixture 1 is located above lamp bead plate, the work of two fixtures
With can be clamped to lamp bead plate 6, the wire-soldering device 4 includes bonding wire pin 41 and drives the second driving of the work of bonding wire pin 41
Mechanism 42, the upper fixture 1 are provided with the through hole 11 of multiple proper alignments, the arrangement mode of the through hole 11 with lamp bead plate 6
LED arrangement modes it is corresponding, the connecting rod 2 is connected with the 3rd drive mechanism of its lifting of driving, first drive mechanism,
Second drive mechanism 42 and the 3rd drive mechanism are connected with control device.
When device brings into operation, the first drive mechanism driving lamp bead plate 6 is moved to the lower section of upper fixture 1, the 3rd drive mechanism
Drive connection bar 2, which declines, drives upper fixture 1 to push down lamp bead plate, and lower clamp then abuts lamp bead plate, coordinates upper fixture 1 to clamp lamp bead
Plate, and through hole 11 and LED arrangement mode are corresponding, LED spills upper surface just by through hole 11.At this moment LED completes positioning
Clamping, wire-soldering device 4 start to start, and gold thread is welded on LED by the second drive mechanism 42 driving bonding wire pin 41 through through hole 11.
Disturbed when being processed in order to avoid bonding wire pin 41 by through hole 11, in the present embodiment, through hole 11 designs tapered.
In the present embodiment, in order to which the stress of upper fixture 1 is more balanced, the connecting rod 2 is provided with two, is separately fixed at
The both ends of fixture 1.
In the present embodiment, first drive mechanism includes screw mandrel and stepper motor, and stepper motor passes through shaft coupling with screw mandrel
Moment of torsion is transmitted in device connection, and stepper motor is connected with control device, and the cooperation of stepper motor and screw mandrel can accurately control lamp bead plate 6
It is mobile.
In the present embodiment, the 3rd drive mechanism is cylinder, clamping of the driving upper fixture 1 to lamp bead plate.
The above embodiments are merely illustrative of the technical solutions of the present invention and is not limited, all without departing from the present invention
Any modification of spirit and scope or equivalent substitution, it all should cover in the range of technical solution of the present invention.
Claims (5)
- A kind of 1. LED wire-soldering devices, it is characterised in that：Including upper fixture (1), the wire-soldering device being arranged on above upper fixture (1) (4), carry the LED of multiple proper alignments lamp bead plate (6), connecting rod (2), lower clamp, lamp bead plate (6) both sides are carried out it is spacing Two baffle plates (3), driving lamp bead plate (6) the first drive mechanism for being moved between two baffle plates (3) and control device；The upper fixture (1) is arranged on above lamp bead plate (6), and the upper fixture (1) is provided with the through hole of multiple proper alignments (11), the arrangement mode of the through hole (11) is corresponding with the LED arrangement modes on lamp bead plate (6), upper fixture (1) and connecting rod (2) connect, connecting rod (2) is connected with the 3rd drive mechanism of its lifting of driving；The lower clamp is arranged on below lamp bead plate (6), is coordinated with upper fixture (1) and is compressed lamp bead plate (6)；The wire-soldering device (4) includes carrying out LED through through hole (11) on the bonding wire pin (41) and driving bonding wire pin of bonding wire (41) the second drive mechanism (42) of work；The control device is connected to control with the first drive mechanism, the second drive mechanism (42) and the 3rd drive mechanism respectively Its work.
- A kind of 2. LED wire-soldering devices according to claim 1, it is characterised in that：The through hole (11) is bellmouth.
- A kind of 3. LED wire-soldering devices according to claim 1, it is characterised in that：The connecting rod (2) is provided with two, It is separately fixed at the both ends of upper fixture (1).
- A kind of 4. LED wire-soldering devices according to claim 1, it is characterised in that：First drive mechanism includes screw mandrel And stepper motor, stepper motor are connected with control device.
- A kind of 5. LED wire-soldering devices according to claim 1, it is characterised in that：3rd drive mechanism is cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711154738.3A CN107813079A (en) | 2017-11-20 | 2017-11-20 | A kind of LED wire-soldering devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711154738.3A CN107813079A (en) | 2017-11-20 | 2017-11-20 | A kind of LED wire-soldering devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107813079A true CN107813079A (en) | 2018-03-20 |
Family
ID=61609586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711154738.3A Pending CN107813079A (en) | 2017-11-20 | 2017-11-20 | A kind of LED wire-soldering devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107813079A (en) |
Citations (16)
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| CN201632794U (en) * | 2009-12-22 | 2010-11-17 | 亿光电子(中国)有限公司 | Welding wire fixture of welding wire machine |
| KR20110133244A (en) * | 2010-06-04 | 2011-12-12 | 이병문 | A led array method, a board used therein and a led array package |
| CN102398095A (en) * | 2010-09-15 | 2012-04-04 | 宜昌劲森光电科技股份有限公司 | Light-emitting diode (LED) wire welding device and wire welding method |
| CN202461824U (en) * | 2011-12-15 | 2012-10-03 | 东莞华中科技大学制造工程研究院 | Material parallel calibration device for flat wire bonder |
| KR20130013390A (en) * | 2011-07-28 | 2013-02-06 | 부경대학교 산학협력단 | Led heat transfer module and manufacturing method thereof |
| CN203109465U (en) * | 2013-01-18 | 2013-08-07 | 邹志峰 | Material system for compressing materials elastically |
| CN203459842U (en) * | 2013-07-24 | 2014-03-05 | 厦门华联电子有限公司 | Multifunctional clamp for TOP light-emitting diode (LED) automatic wire bonder |
| KR101412324B1 (en) * | 2009-02-03 | 2014-06-25 | 현대중공업 주식회사 | The movable welding robot with LED lighting |
| CN203679579U (en) * | 2013-11-26 | 2014-07-02 | 佛山市蓝箭电子股份有限公司 | Size-adjustable type welding pressing clamp |
| KR20140086020A (en) * | 2012-12-28 | 2014-07-08 | 권영현 | Flexible substrate for illumination and fabricating method thereof |
| CN204209321U (en) * | 2014-09-22 | 2015-03-18 | 深圳市华高光电科技有限公司 | A kind of LED welding wire fixture |
| CN205254420U (en) * | 2015-12-24 | 2016-05-25 | 深圳市德沃先进自动化有限公司 | Clamping plate device |
| CN205571787U (en) * | 2016-01-22 | 2016-09-14 | 易美芯光（北京）科技有限公司 | Anchor clamps of LED encapsulation bonding wire |
| WO2016189728A1 (en) * | 2015-05-28 | 2016-12-01 | 日立造船株式会社 | Circumferential welding device |
| CN206543978U (en) * | 2017-03-23 | 2017-10-10 | 连云港光鼎电子有限公司 | A kind of LED LAMP racks tool |
-
2017
- 2017-11-20 CN CN201711154738.3A patent/CN107813079A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201329478Y (en) * | 2008-12-26 | 2009-10-21 | 广州市鸿利光电子有限公司 | Slice type LED bonding wire tool |
| KR101412324B1 (en) * | 2009-02-03 | 2014-06-25 | 현대중공업 주식회사 | The movable welding robot with LED lighting |
| CN201632794U (en) * | 2009-12-22 | 2010-11-17 | 亿光电子(中国)有限公司 | Welding wire fixture of welding wire machine |
| KR20110133244A (en) * | 2010-06-04 | 2011-12-12 | 이병문 | A led array method, a board used therein and a led array package |
| CN102398095A (en) * | 2010-09-15 | 2012-04-04 | 宜昌劲森光电科技股份有限公司 | Light-emitting diode (LED) wire welding device and wire welding method |
| KR20130013390A (en) * | 2011-07-28 | 2013-02-06 | 부경대학교 산학협력단 | Led heat transfer module and manufacturing method thereof |
| CN202461824U (en) * | 2011-12-15 | 2012-10-03 | 东莞华中科技大学制造工程研究院 | Material parallel calibration device for flat wire bonder |
| KR20140086020A (en) * | 2012-12-28 | 2014-07-08 | 권영현 | Flexible substrate for illumination and fabricating method thereof |
| CN203109465U (en) * | 2013-01-18 | 2013-08-07 | 邹志峰 | Material system for compressing materials elastically |
| CN203459842U (en) * | 2013-07-24 | 2014-03-05 | 厦门华联电子有限公司 | Multifunctional clamp for TOP light-emitting diode (LED) automatic wire bonder |
| CN203679579U (en) * | 2013-11-26 | 2014-07-02 | 佛山市蓝箭电子股份有限公司 | Size-adjustable type welding pressing clamp |
| CN204209321U (en) * | 2014-09-22 | 2015-03-18 | 深圳市华高光电科技有限公司 | A kind of LED welding wire fixture |
| WO2016189728A1 (en) * | 2015-05-28 | 2016-12-01 | 日立造船株式会社 | Circumferential welding device |
| CN205254420U (en) * | 2015-12-24 | 2016-05-25 | 深圳市德沃先进自动化有限公司 | Clamping plate device |
| CN205571787U (en) * | 2016-01-22 | 2016-09-14 | 易美芯光（北京）科技有限公司 | Anchor clamps of LED encapsulation bonding wire |
| CN206543978U (en) * | 2017-03-23 | 2017-10-10 | 连云港光鼎电子有限公司 | A kind of LED LAMP racks tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180320 |
|
| RJ01 | Rejection of invention patent application after publication |