CN102398095A - Light-emitting diode (LED) wire welding device and wire welding method - Google Patents
Light-emitting diode (LED) wire welding device and wire welding method Download PDFInfo
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- CN102398095A CN102398095A CN2010102820647A CN201010282064A CN102398095A CN 102398095 A CN102398095 A CN 102398095A CN 2010102820647 A CN2010102820647 A CN 2010102820647A CN 201010282064 A CN201010282064 A CN 201010282064A CN 102398095 A CN102398095 A CN 102398095A
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- led
- wire welding
- bonding wire
- conduit
- suction nozzle
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Abstract
The invention relates to a light-emitting diode (LED) wire welding device, which comprises a welding head, a wire welding swing arm and a suction nozzle, wherein a conduit is fixedly connected with the wire welding swing arm by a fixed arm; a needle head is connected to the lower end of the conduit; and a gas guiding tube joint is connected to the upper end of the conduit, and a flowmeter is connected to one end of the gas guiding tube joint. An LED wire welding method comprises the following steps that: the needle head and the suction nozzle are moved in the wire welding process, and gas sprayed from the needle head protects LED chips welded at the suction nozzle correspondingly. By the method, waste heat on the LED chips after wire welding can be better carried away by airflow to prevent the performance of the chips from being influenced and enhance the reliability of the LED chips; and the airflow also can prevent oxidation and nitridation effectively, enhance the welding performance and improve the welding quality effectively. The device has a simple structure and operability and is safe.
Description
Technical field
The present invention relates to a kind of LED packaging system and process, be specifically related to a kind of LED bonding wire device and bonding wire method.
Background technology
Advocate in the whole world under the theme of low-carbon (LC), energy-saving and environmental protection, account under the very big situation of energy consumption ratio in illumination, LED is as be that novel backlight and lighting source is ripe and perfect constantly.The LED encapsulation is the important step that LED produces, and is directly determining LED performance quality.Traditional LED bonding wire temperature is high, and damage wafers is understood in accumulating in that high temperature is permanent on the LED wafer, thereby reduces the brightness of wafer and reliability and the service life of LED.
Summary of the invention
Technical problem to be solved by this invention provides a kind of LED bonding wire device and bonding wire method, and is simple to operate, and high temperature deposition has been created advantageous environment for bonding wire simultaneously to the damage of LED wafer when having effectively reduced bonding wire, improves the quality of bonding wire.And brightness and the reliability and the service life of lifting product.
For solving the problems of the technologies described above, the technical scheme that the present invention adopted is: a kind of LED bonding wire device, comprise soldering tip, and the bonding wire swing arm, suction nozzle, conduit is fixedly connected with the bonding wire swing arm through fixed arm, and the conduit lower end is connected with syringe needle.
The conduit upper end is connected with air duct fitting,
Air duct fitting one end is connected with flowmeter.
A kind of LED bonding wire method may further comprise the steps: syringe needle moves with suction nozzle in the bonding wire process, and the gas of syringe needle ejection is simultaneously protected the LED wafer of the corresponding welding in suction nozzle place.
The present invention adopts technical scheme, therefore has following beneficial effect:
1, the conduit upper end is connected with air duct fitting, and the conduit that is fit to unlike material docks with air inlet.
2, wireway one end is connected with flowmeter, and gas flow in the time of can accurately controlling welding increases welding stability.
Soldering tip thawing gold thread combined back high temperature residual on wafer when 3, air-flow can well be taken away bonding wire with wafer
, avoid wafer property to be affected, strengthen the reliability of LED wafer.
4, air-flow can also effectively preventing oxidation and nitrogenize, increases welding performance, effectively improves welding quality.
5, apparatus of the present invention are simple in structure, safely, have an operability.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is described further:
Fig. 1 is a structural representation of the present invention.
Fig. 2 is a gas operated device structural representation of the present invention.
Fig. 3 is a flowmeter structure sketch map of the present invention.
The specific embodiment
A kind of LED bonding wire device comprises soldering tip 5, bonding wire swing arm 6, and suction nozzle 7, conduit 3 is fixedly connected with bonding wire swing arm 6 through fixed arm 1, and conduit 3 lower ends are connected with syringe needle 4.
Said conduit 3 upper ends are connected with air duct fitting 2,
Said air duct fitting 2 one ends are connected with flowmeter 8.
A kind of LED bonding wire method may further comprise the steps: syringe needle 4 moves with suction nozzle 7 in the bonding wire process, and syringe needle 4 ejection gases are protected the LED wafer 10 of the corresponding welding in suction nozzle 7 places simultaneously.
In the process, gold thread 9 passes suction nozzle 7 during bonding wire, and soldering tip 5 is welded in gold thread 9 on the LED wafer 10.Syringe needle 4 moves with suction nozzle 7, and syringe needle 4 ejection inert gases are protected the LED wafer 10 of suction nozzle 7 places welding simultaneously.
As shown in Figure 1, the gas operated device that connects is fixed in the bonding wire swing arm 6, discharge inert gas from syringe needle 4 in the time of bonding wire.
As shown in Figure 2, during bonding wire, syringe needle 4 is placed on the metal catheter 3, metal catheter 3 other ends are communicated with air duct fitting 2.
As shown in Figure 3, air duct fitting 2 and flowmeter 8 be communicated with, flowmeter 8 is provided with air inlet pipe and escape pipe, flowmeter 8 accurately control feeds the amount of inert gas of conduits 3.
Claims (4)
1. a LED bonding wire device comprises soldering tip (5), bonding wire swing arm (6), and suction nozzle (7) is characterized in that: conduit (3) is fixedly connected with bonding wire swing arm (6) through fixed arm (1), and conduit (3) lower end is connected with syringe needle (4).
2. a kind of LED bonding wire device according to claim 1 is characterized in that: conduit (3) upper end is connected with air duct fitting (2).
3. a kind of LED bonding wire device according to claim 2 is characterized in that: air duct fitting (2) one ends are connected with flowmeter (8).
4. LED bonding wire method is characterized in that may further comprise the steps: syringe needle in the bonding wire process (4) moves with suction nozzle (7), and the LED wafer (10) that the gas of syringe needle (4) ejection is simultaneously located corresponding welding to suction nozzle (7) is protected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102820647A CN102398095A (en) | 2010-09-15 | 2010-09-15 | Light-emitting diode (LED) wire welding device and wire welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102820647A CN102398095A (en) | 2010-09-15 | 2010-09-15 | Light-emitting diode (LED) wire welding device and wire welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102398095A true CN102398095A (en) | 2012-04-04 |
Family
ID=45880970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102820647A Pending CN102398095A (en) | 2010-09-15 | 2010-09-15 | Light-emitting diode (LED) wire welding device and wire welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102398095A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107813079A (en) * | 2017-11-20 | 2018-03-20 | 江门市江海区康欣电子科技有限公司 | A kind of LED wire-soldering devices |
Citations (6)
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|---|---|---|---|---|
| CN2683305Y (en) * | 2004-03-22 | 2005-03-09 | 中国航空工业第一集团公司北京航空制造工程研究所 | Laser wire filling welding gas protection integrated device |
| CN201231368Y (en) * | 2008-05-25 | 2009-05-06 | 宣方忠 | Automatic tin-charging soldering iron |
| CN101502918A (en) * | 2009-01-16 | 2009-08-12 | 北京工业大学 | Method for reducing laser welding pores of cast magnesium alloy |
| CN201333580Y (en) * | 2009-01-09 | 2009-10-28 | 四机赛瓦石油钻采设备有限公司 | Rotating-disc type automatic brazing machine |
| CN201543975U (en) * | 2009-10-13 | 2010-08-11 | 圣崴科技股份有限公司 | Gas supply device for welding wire equipment |
| CN201559006U (en) * | 2009-11-23 | 2010-08-25 | 常州铭赛机器人科技有限公司 | Solder wire precision positioning mechanism of automatic soldering robot |
-
2010
- 2010-09-15 CN CN2010102820647A patent/CN102398095A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2683305Y (en) * | 2004-03-22 | 2005-03-09 | 中国航空工业第一集团公司北京航空制造工程研究所 | Laser wire filling welding gas protection integrated device |
| CN201231368Y (en) * | 2008-05-25 | 2009-05-06 | 宣方忠 | Automatic tin-charging soldering iron |
| CN201333580Y (en) * | 2009-01-09 | 2009-10-28 | 四机赛瓦石油钻采设备有限公司 | Rotating-disc type automatic brazing machine |
| CN101502918A (en) * | 2009-01-16 | 2009-08-12 | 北京工业大学 | Method for reducing laser welding pores of cast magnesium alloy |
| CN201543975U (en) * | 2009-10-13 | 2010-08-11 | 圣崴科技股份有限公司 | Gas supply device for welding wire equipment |
| CN201559006U (en) * | 2009-11-23 | 2010-08-25 | 常州铭赛机器人科技有限公司 | Solder wire precision positioning mechanism of automatic soldering robot |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107813079A (en) * | 2017-11-20 | 2018-03-20 | 江门市江海区康欣电子科技有限公司 | A kind of LED wire-soldering devices |
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Application publication date: 20120404 |