CN201792105U - Wire welding device of light emitting diode (LED) - Google Patents
Wire welding device of light emitting diode (LED) Download PDFInfo
- Publication number
- CN201792105U CN201792105U CN2010205297223U CN201020529722U CN201792105U CN 201792105 U CN201792105 U CN 201792105U CN 2010205297223 U CN2010205297223 U CN 2010205297223U CN 201020529722 U CN201020529722 U CN 201020529722U CN 201792105 U CN201792105 U CN 201792105U
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- CN
- China
- Prior art keywords
- welding
- led
- conduit
- wire
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a wire welding device of a light emitting diode (LED), which comprises a welding head, a wire-welding swinging arm and a suction nozzle, wherein a conduit is fixedly connected with the wire-welding swinging arm by a fixed arm, and the lower end of the conduit is connected with a needle head. The upper end of the conduit is connected with a joint of an air duct, and one end of the joint of the air duct is connected with a flowmeter. In the wire welding process of the device, the needle head and the suction nozzle move together. Meanwhile, gas is ejected from the needle head for protecting an LED wafer which is correspondingly welded at the position of the suction nozzle. Airflow can carry away residual heat on the LED wafer very well after wire welding, which avoids that the performance of the wafer is influenced, and enhances the reliability of the LED wafer; the airflow can also prevent oxidation and nitridation effectively, increases the welding performance and enhances the welding quality effectively; and the entire device has simple structure, high safety and strong operability.
Description
Technical field
The utility model relates to a kind of LED packaging system, is specifically related to a kind of LED bonding wire device.
Background technology
Advocate in the whole world under the theme of low-carbon (LC), energy-saving and environmental protection, account under the very big situation of energy consumption ratio in illumination, LED as novel backlight and lighting source constantly ripe and perfect.The LED encapsulation is the important step that LED produces, and is directly determining LED performance quality.Traditional LED bonding wire temperature height, damage wafers is understood in accumulating in that high temperature is permanent on the LED wafer, thereby reduces the brightness of wafer and reliability and the service life of LED.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of LED bonding wire device, and is simple to operate, and high temperature deposition has been created advantageous environment for bonding wire simultaneously to the damage of LED wafer when having effectively reduced bonding wire, improves the quality of bonding wire.And brightness and the reliability and the service life of lifting product.
For solving the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of LED bonding wire device, comprise soldering tip, and the bonding wire swing arm, suction nozzle, conduit is fixedlyed connected with the bonding wire swing arm by fixed arm, and the conduit lower end is connected with syringe needle.
The conduit upper end is connected with air duct fitting, and air duct fitting one end is connected with flowmeter.
The utility model adopts technical scheme, therefore has following beneficial effect:
1, the conduit upper end is connected with air duct fitting, and the conduit that is fit to unlike material docks with air inlet.
2, wireway one end is connected with flowmeter, and gas flow in the time of can accurately controlling welding increases welding stability.
Soldering tip thawing gold thread combined back high temperature residual on wafer when 3, air-flow can well be taken away bonding wire with wafer
, avoid wafer property to be affected, strengthen the reliability of LED wafer.
4, air-flow can also effectively preventing oxidation and nitrogenize, increases welding performance, effectively improves welding quality.
5, the utility model apparatus structure is simple, safely, have an operability.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples:
Fig. 1 is the utility model structural representation.
Fig. 2 is the utility model gas operated device structural representation.
Fig. 3 is the utility model flowmeter structure schematic diagram.
The specific embodiment
A kind of LED bonding wire device comprises soldering tip 5, bonding wire swing arm 6, and suction nozzle 7, conduit 3 is fixedlyed connected with bonding wire swing arm 6 by fixed arm 1, and conduit 3 lower ends are connected with syringe needle 4.
Described conduit 3 upper ends are connected with air duct fitting 2, and described air duct fitting 2 one ends are connected with flowmeter 8.
Syringe needle 4 moves with suction nozzle 7 in the bonding wire process, and syringe needle 4 ejection gases are protected the LED wafer 10 of the corresponding welding in suction nozzle 7 places simultaneously.
In the process, gold thread 9 passes suction nozzle 7 during bonding wire, and soldering tip 5 is welded in gold thread 9 on the LED wafer 10.Syringe needle 4 moves with suction nozzle 7, and syringe needle 4 ejection inert gases are protected the LED wafer 10 of suction nozzle 7 places welding simultaneously.
As shown in Figure 1, the gas operated device that connects is fixed in the bonding wire swing arm 6, discharges inert gas from syringe needle 4 in the time of bonding wire.
As shown in Figure 2, during bonding wire, syringe needle 4 is placed on the metal catheter 3, metal catheter 3 other ends are communicated with air duct fitting 2.
As shown in Figure 3, air duct fitting 2 and flowmeter 8 be communicated with, flowmeter 8 is provided with air inlet pipe and escape pipe, flowmeter 8 accurately control feeds the amount of inert gas of conduits 3.
Claims (3)
1. a LED bonding wire device comprises soldering tip (5), bonding wire swing arm (6), and suction nozzle (7) is characterized in that: conduit (3) is fixedlyed connected with bonding wire swing arm (6) by fixed arm (1), and conduit (3) lower end is connected with syringe needle (4).
2. a kind of LED bonding wire device according to claim 1 is characterized in that: conduit (3) upper end is connected with air duct fitting (2).
3. a kind of LED bonding wire device according to claim 2 is characterized in that: air duct fitting (2) one ends are connected with flowmeter (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205297223U CN201792105U (en) | 2010-09-15 | 2010-09-15 | Wire welding device of light emitting diode (LED) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205297223U CN201792105U (en) | 2010-09-15 | 2010-09-15 | Wire welding device of light emitting diode (LED) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201792105U true CN201792105U (en) | 2011-04-13 |
Family
ID=43847028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205297223U Expired - Fee Related CN201792105U (en) | 2010-09-15 | 2010-09-15 | Wire welding device of light emitting diode (LED) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201792105U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107350229A (en) * | 2017-07-20 | 2017-11-17 | 攀钢集团研究院有限公司 | The minimizing technology of gas preheating inside pipe wall carbon distribution |
| CN113579121A (en) * | 2021-06-23 | 2021-11-02 | 苏州斯尔特微电子有限公司 | High-power LED chip wire bonding machine |
-
2010
- 2010-09-15 CN CN2010205297223U patent/CN201792105U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107350229A (en) * | 2017-07-20 | 2017-11-17 | 攀钢集团研究院有限公司 | The minimizing technology of gas preheating inside pipe wall carbon distribution |
| CN113579121A (en) * | 2021-06-23 | 2021-11-02 | 苏州斯尔特微电子有限公司 | High-power LED chip wire bonding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20150915 |
|
| EXPY | Termination of patent right or utility model |