CN206236705U - The good light emitting diode of heat-resisting quantity - Google Patents
The good light emitting diode of heat-resisting quantity Download PDFInfo
- Publication number
- CN206236705U CN206236705U CN201621381971.6U CN201621381971U CN206236705U CN 206236705 U CN206236705 U CN 206236705U CN 201621381971 U CN201621381971 U CN 201621381971U CN 206236705 U CN206236705 U CN 206236705U
- Authority
- CN
- China
- Prior art keywords
- substrate
- bending section
- electrode
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model provides a kind of heat-resisting quantity good light emitting diode, including packing colloid, the substrate being packaged in packing colloid and the luminescent wafer on substrate, the substrate is provided with electrode, the luminescent wafer is provided with chip electrode, the chip electrode is connected by bonding wire with the electrode on substrate, the bonding wire includes the first bending section and the second bending section, first bending section is from the chip electrode evagination segmental arc that first rear downward bending is formed upwards, second bending section is the indent segmental arc that the upward bending of tangential direction from the first bending section end is formed, the end of second bending section is connected with the electrode welding on substrate；The utility model is by setting the first bending section and the second bending section, change the angle angle of the second bending section end and substrate, so when being welded existing glue by high temperature reflux and splitting or expand, the active force that stress between bonding wire and substrate pulls bonding line reduces, and improves the stroboscopic phenomenon occurred when light emitting diode is used.
Description
Technical field
The utility model is related to the technical field that LED is encapsulated, more particularly to a kind of good light emitting diode of heat-resisting quantity.
Background technology
Light emitting diode is a kind of energy-saving and environmental protection, long-life solid light source, therefore in recent ten years to light emitting diode
The research of technology is very active always, and light emitting diode also has the trend of the conventional light source such as substitution fluorescent lamp, incandescent lamp gradually.It is existing
During some LED packages, the chip electrode of usual LED wafer is directly connected with the electrode of substrate by bonding wire
Connect, and bonding wire is bigger than normal with the angle of the junction of electrode of substrate, when being welded existing glue by high temperature reflux and splitting or expand, bonding wire with
Stress between substrate pulls the active force increase of bonding line, makes to be easily peeled off between bonding wire and substrate, makes light emitting diode
The stroboscopic phenomenon that used time occurs, reduces high temperature resistant reliability, and making the yield of light emitting diode reduces.
Utility model content
The utility model is in view of the existing deficiencies of the prior art, there is provided a kind of good light emitting diode of heat-resisting quantity, its energy
It is effective to improve stroboscopic phenomenon, reduce LED failure rate.
To achieve the above object, the utility model is adopted the following technical scheme that：
A kind of good light emitting diode of heat-resisting quantity, including packing colloid, the substrate that is packaged in packing colloid and set
In the luminescent wafer on substrate, the substrate is provided with electrode, and the luminescent wafer is provided with chip electrode, the chip electrode
It is connected with the electrode on substrate by bonding wire, the bonding wire includes the first bending section and the second bending section, first bending section
It is that second bending section is from the first bending section end from the chip electrode evagination segmental arc that first rear downward bending is formed upwards
The indent segmental arc that is formed of the upward bending of tangential direction, end and the electrode welding on substrate of second bending section connect
Connect, the angle angle of tangent line and substrate that second bending section extends along direction is gradually reduced.
Used as a kind of preferred scheme, the end of second bending section is 1~30 ° with the angle angle of substrate.
Used as a kind of preferred scheme, the top surface of the chip electrode is provided with antioxidation coating.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by setting the
One bending section and the second bending section, change the angle angle of the second bending section end and substrate, and the second bending section is extended along
The tangent line in direction is gradually reduced with the angle angle of substrate, so when being welded existing glue by high temperature reflux and splitting or expand, bonding wire with
The active force that stress between substrate pulls bonding line reduces, and makes effectively to be buffered between bonding wire and substrate, is not in
The phenomenon peeled off between bonding wire and substrate, improves the stroboscopic phenomenon occurred when light emitting diode is used, and improves high temperature resistant reliability,
LED failure rate is reduced, the row of reduction surveys difficulty, it is ensured that quality.
It is the specific purposes and work(that more clearly illustrate architectural feature of the present utility model, technological means and its reached
Can, the utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings：
Brief description of the drawings
Fig. 1 is the assembling assumption diagram of the embodiment of the utility model.
Accompanying drawing identifier declaration：
10th, packing colloid 20, substrate 21, electrode
30th, luminescent wafer 31, chip electrode 40, bonding wire
41st, the first bending section 42, the second bending section
Specific embodiment
As shown in figure 1, a kind of good light emitting diode of heat-resisting quantity, including packing colloid 10, it is packaged in packing colloid 10
Interior substrate 20 and the luminescent wafer 30 on substrate 20, the substrate 20 are provided with electrode 21, the luminescent wafer 30
Chip electrode 31 is provided with, the chip electrode 31 is connected by bonding wire 40 with the electrode 21 on substrate 20, the chip electrode
31 top surface is provided with antioxidation coating, and the bonding wire 40 includes the first bending section 41 and the second bending section 42, first bending section
41 is that second bending section 42 is from the first bending from the evagination segmental arc that first rear downward bending is formed upwards of chip electrode 31
The indent segmental arc that the upward bending of tangential direction of 41 ends of section is formed, on the end of second bending section 42 and substrate 20
Electrode 21 is welded to connect, and the angle angle of tangent line and substrate 20 that second bending section 42 extends along direction is gradually reduced,
The end of second bending section 42 is 1~30 ° with the angle angle of substrate 20.
The above, is only preferred embodiment of the present utility model, is not used to limit the utility model, therefore every
Any modification, equivalent substitution and improvements actually made to above example according to technology of the present utility model etc., still fall within this
In the range of utility model technical scheme.
Claims (3)
1. a kind of good light emitting diode of heat-resisting quantity, including packing colloid, the substrate being packaged in packing colloid and it is located at
Luminescent wafer on substrate, the substrate is provided with electrode, and the luminescent wafer is provided with chip electrode, and the chip electrode leads to
Bonding wire is crossed to be connected with the electrode on substrate, it is characterised in that：The bonding wire includes the first bending section and the second bending section, described the
One bending section is that second bending section is from the first folding from the chip electrode evagination segmental arc that first rear downward bending is formed upwards
The indent segmental arc that the upward bending of tangential direction of curved segment end is formed, the electrode on the end of second bending section and substrate
It is welded to connect, the angle angle of tangent line and substrate that second bending section extends along direction is gradually reduced.
2. the good light emitting diode of heat-resisting quantity as claimed in claim 1, it is characterised in that：The end of second bending section
It it is 1~30 ° with the angle angle of substrate.
3. the good light emitting diode of heat-resisting quantity as claimed in claim 1, it is characterised in that：The top surface of the chip electrode sets
There is antioxidation coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621381971.6U CN206236705U (en) | 2016-12-15 | 2016-12-15 | The good light emitting diode of heat-resisting quantity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621381971.6U CN206236705U (en) | 2016-12-15 | 2016-12-15 | The good light emitting diode of heat-resisting quantity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206236705U true CN206236705U (en) | 2017-06-09 |
Family
ID=58992186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621381971.6U Expired - Fee Related CN206236705U (en) | 2016-12-15 | 2016-12-15 | The good light emitting diode of heat-resisting quantity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206236705U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224055A (en) * | 2019-06-28 | 2019-09-10 | 深圳光台实业有限公司 | A kind of encapsulating structure and packaging technology of paster type light emitting type |
-
2016
- 2016-12-15 CN CN201621381971.6U patent/CN206236705U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224055A (en) * | 2019-06-28 | 2019-09-10 | 深圳光台实业有限公司 | A kind of encapsulating structure and packaging technology of paster type light emitting type |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170609 Termination date: 20171215 |