CN206059346U - The fixing device of lead frame - Google Patents
The fixing device of lead frame Download PDFInfo
- Publication number
- CN206059346U CN206059346U CN201621011755.2U CN201621011755U CN206059346U CN 206059346 U CN206059346 U CN 206059346U CN 201621011755 U CN201621011755 U CN 201621011755U CN 206059346 U CN206059346 U CN 206059346U
- Authority
- CN
- China
- Prior art keywords
- pressure
- fixed block
- fixing device
- connecting plate
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
This utility model is related to a kind of fixing device, more particularly to a kind of fixing device of lead frame, including pressing plate, connecting plate and pressure refer to, the centre of the pressing plate is provided with through hole, it is fixedly connected during the connecting plate is arranged on the through hole and with the pressing plate, the pressure refers to and is arranged on the connecting plate, the pressure refers to including the fixed block being fixed on the connecting plate and with the fixed block finger tip being connected by screw, the relatively described fixed block of the finger tip it is Height Adjustable, the device is designed as dismountable structure by pressure is referred to, the finger tip for being divided into fixed block and being connected by screw with fixed block, in the height for needing regulation pressure to refer to, screw can be unscrewed, adjust pressure and refer to the height relative to fixed block, it is very convenient, make the leadframe-type that the fixing device is suitable for more, substantially increase work efficiency.
Description
Technical field
This utility model is related to a kind of fixing device, more particularly to a kind of fixing device of lead frame.
Background technology
The encapsulation of semiconductor device is in order that chip is from mechanical stress, thermal stress, dampness, harmful gass and radiation
The impact of the external environment conditions such as line.As encapsulation is used as the pass for ensureing semiconductor device final electrically, optics, calorifics and mechanical performance
Key link, in semiconductor manufacturing cost, shared ratio gradually increases, and has become the bottleneck of restriction semi-conductor industry development
One of.Connection between semiconductor packaged inner chip and external pin and chip plays establishment chip and outside and electrically connects
Connect, guarantee the input in chip and the external world, export unobstructed important function, be the key in whole rear end encapsulation process.Lead key
Close with technique realize it is simple, with low cost, occupied an leading position in connected mode using multiple packing forms.
In wire bonding, need to fix lead frame, it is ensured that the stability of wire bonding, mainly adopt pressing plate at present
Carry out anchor leg framework, traditional pressing plate is provided with pressure and refers to, lead frame is lived using pressure finger pressure.Pressure refers to and is integrally formed, fixing
During the lead frame of different-thickness, press the height for referring to be difficult to adjust, need to adjust the height that pressure refers between pressing plate, it is very numerous
It is trivial, affect work efficiency.
In view of above-mentioned defect, the design people, positive research and innovation in addition, to founding a kind of fixation of lead frame
Device so as to more the value in industry.
Utility model content
To solve above-mentioned technical problem, the purpose of this utility model is to provide a kind of fixing device of lead frame, can
According to the thickness of lead frame, the height that pressure refers to is adjusted, regulative mode is easier, improves work efficiency.
The utility model proposes a kind of lead frame fixing device, including pressing plate, connecting plate and pressure refer to, the pressing plate
Centre be provided with through hole, be fixedly connected during the connecting plate is arranged on the through hole and with the pressing plate, the pressure refers to and is arranged on
On the connecting plate, the pressure is referred to including the fixed block being fixed on the connecting plate and is connected by screw with the fixed block
Finger tip, the relatively described fixed block of the finger tip it is Height Adjustable.
Further, the finger tip is bent downwardly in hook-shaped.
Further, described to press the quantity that refers to be eight, eight described to press the finger tip for referring to relative.
Further, the material that the pressing plate, connecting plate and pressure refer to is rustless steel.
By such scheme, this utility model at least has advantages below：This utility model is by pressure being referred to, be designed as can
The structure of dismounting, that is, the finger tip for being divided into fixed block and being connected by screw with fixed block, in the height for needing regulation pressure to refer to, can
To unscrew screw, adjust and press the height referred to relative to fixed block, very convenient, the leadframe-type for being suitable for the fixing device
It is more, substantially increase work efficiency.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand skill of the present utility model
Art means, and being practiced according to the content of description, with preferred embodiment of the present utility model and coordinate accompanying drawing detailed below
Describe in detail bright as after.
Description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is to press the structural representation for referring in this utility model.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is used to illustrate this utility model, but is not limited to scope of the present utility model.
Referring to Fig. 1 and Fig. 2, a kind of fixing device of the lead frame described in one preferred embodiment of this utility model, including
Pressing plate 1, connecting plate 2 and pressure refer to 3, and the centre of pressing plate 1 is provided with through hole 4, fix during connecting plate 2 is arranged on through hole 4 and with pressing plate 1 and connect
Connect, the centre of connecting plate 2 also is provided with the hole 5 being open, pressure refers to that 3 are arranged on connecting plate 2, is arranged in around hole 5.Pressure refers to
3 finger tips 32 for including the fixed block 31 being fixed on connecting plate 2 and being connected by screw with fixed block 31, finger tip 32 are bent downwardly
In hook-shaped, finger tip 32 is relatively fixed the Height Adjustable of block 31.Pressure refers to that 3 quantity is eight, and eight are pressed 32 phase of finger tip for referring to 3
It is right.Pressing plate 1, connecting plate 2 and pressure refer to that 3 material is rustless steel.
This utility model is divided into fixed block 31 and is led to fixed block 31 by pressure being referred to, 3 are designed as dismountable structure
The finger tip 32 of mode connects for screw is crossed, when needing regulation pressure to refer to 3 height, screw can be unscrewed, adjusted pressure and refer to 3 relative to fixed block
31 height, it is very convenient, make the leadframe-type that the fixing device is suitable for more, substantially increase work efficiency.
The above is only preferred implementation of the present utility model, is not limited to this utility model, it is noted that
For those skilled in the art, on the premise of without departing from this utility model know-why, can also do
Go out some improvement and modification, these improve and modification also should be regarded as protection domain of the present utility model.
Claims (4)
1. a kind of fixing device of lead frame, it is characterised in that：Refer to including pressing plate, connecting plate and pressure, the centre of the pressing plate
Through hole is provided with, is fixedly connected during the connecting plate is arranged on the through hole and with the pressing plate, the pressure refers to and is arranged on the company
On fishplate bar, the pressure refers to including the fixed block being fixed on the connecting plate and with the fixed block finger being connected by screw
Point, the relatively described fixed block of the finger tip it is Height Adjustable.
2. the fixing device of lead frame according to claim 1, it is characterised in that：The finger tip is bent downwardly in hook
Shape.
3. the fixing device of lead frame according to claim 1, it is characterised in that：It is described to press the quantity for referring to be eight,
Eight described to press the finger tip that refers to relative.
4. the fixing device of lead frame according to claim 1, it is characterised in that：The pressing plate, connecting plate and pressure refer to
Material be rustless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621011755.2U CN206059346U (en) | 2016-08-30 | 2016-08-30 | The fixing device of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621011755.2U CN206059346U (en) | 2016-08-30 | 2016-08-30 | The fixing device of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206059346U true CN206059346U (en) | 2017-03-29 |
Family
ID=58373552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621011755.2U Active CN206059346U (en) | 2016-08-30 | 2016-08-30 | The fixing device of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206059346U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878309A (en) * | 2017-05-11 | 2018-11-23 | 无锡华润安盛科技有限公司 | It is bonded pressing plate and bonding jig |
-
2016
- 2016-08-30 CN CN201621011755.2U patent/CN206059346U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878309A (en) * | 2017-05-11 | 2018-11-23 | 无锡华润安盛科技有限公司 | It is bonded pressing plate and bonding jig |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208190209U (en) | A kind of route uses cable anchor ear with entering | |
| CN206059346U (en) | The fixing device of lead frame | |
| CN204204914U (en) | LED encapsulation structure | |
| CN206900594U (en) | Container securing extension bar | |
| CN202585395U (en) | DIP (Dual inline-pin Package) lead frame structure | |
| CN205863220U (en) | A kind of LED bonding wire bank | |
| CN205564715U (en) | A compression fittings for CSP eutectic solder connects | |
| CN206236705U (en) | The good light emitting diode of heat-resisting quantity | |
| CN205717065U (en) | Lamp tube connection structure | |
| CN206059384U (en) | The 220 type lead frames of TO of extension bonding nip | |
| CN208478305U (en) | Fixation device for anchor leg frame | |
| CN203623309U (en) | Buffer block structure | |
| CN207580878U (en) | The high intensity gripping tool of photovoltaic glass | |
| CN203659846U (en) | Lead frame and packaging body | |
| CN207514690U (en) | A kind of LED light easy to repair | |
| CN206878033U (en) | A kind of positive and negative eutectic welding structure of vertical LED chip | |
| CN206341491U (en) | A kind of clip suction nozzle | |
| CN205470163U (en) | Supplementary package assembly of inflection type shell fragment | |
| CN205912353U (en) | Multi -level circuit board paster smelting tool for reinforcement | |
| CN205953505U (en) | Bring gas buffer's molecular sieve adsorption tower into | |
| CN206610801U (en) | A kind of integrated circuit package body | |
| CN207752993U (en) | A kind of semiconductor wafer level packaging structure | |
| CN208521922U (en) | A kind of porpezite IC package convex block of high reliability | |
| CN208608193U (en) | A kind of lead frame of semiconductor packaging structure | |
| CN204424249U (en) | A kind of large power triode pin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Fixing device of lead frame Effective date of registration: 20180131 Granted publication date: 20170329 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: Wuxi Roum Semiconductor Technology Co., Ltd. Registration number: 2018990000073 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CP03 | Change of name, title or address |
Address after: 222300 No. 88 Shuofang Zhongtong East Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu Donghai Semiconductor Technology Co., Ltd. Address before: 214000 No. 88 Shuofang Zhongtong East Road, Wuxi New District, Jiangsu Province Patentee before: Wuxi Roum Semiconductor Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 222300 No. 88 Shuofang Zhongtong East Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu Donghai Semiconductor Co.,Ltd. Address before: 222300 No. 88 Shuofang Zhongtong East Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: WUXI ROUM SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220322 Granted publication date: 20170329 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: WUXI ROUM SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: 2018990000073 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |