CN108878309A - It is bonded pressing plate and bonding jig - Google Patents
It is bonded pressing plate and bonding jig Download PDFInfo
- Publication number
- CN108878309A CN108878309A CN201710331161.2A CN201710331161A CN108878309A CN 108878309 A CN108878309 A CN 108878309A CN 201710331161 A CN201710331161 A CN 201710331161A CN 108878309 A CN108878309 A CN 108878309A
- Authority
- CN
- China
- Prior art keywords
- bonding
- feeler
- pressing plate
- dao
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Abstract
The application provides a kind of bonding pressing plate and bonding jig.In the application, the bonding pressing plate, including：Pressing plate ontology, pressing plate ontology include the pressing surface for pressing on lead frame；Feeler is located on pressing plate ontology, extends outward to form from pressing surface, and for pressing on lead frame the Ji Dao for carrying chip, length and the Ji Dao depth sinking of feeler match.The application also provides a kind of bonding jig.The application may be implemented steadily to press Ji Dao in bonding, improve bonding success rate, reduce the loss of bonding pressing plate, while can also avoid the transformation to lead frame by forming the feeler for compressing Ji Dao on the pressing surface of bonding pressing plate.
Description
Technical field
This application involves Wire Bonding Technology field, in particular to a kind of bonding pressing plate and bonding jig.
Background technique
For some products using lead frame, in the production of product normal bonding, often since lead frame presses
It is bad that bonding is caused to fail.
In the related technology, it solves lead frame and presses bad main method, be to increase spring leaf on bonding pressing plate, utilize
The retractility of spring leaf can greatly improve and press bad problem.
However, firstly, spring leaf easily deforms in use for some time, secondly, spring leaf pole during the installation process
Easy to damage, finally, spring leaf is that screw is fixed, screw easily loosens, it may appear that the position change that spring leaf pushes, and lose work
With.
Furthermore if the island of lead frame sink, depth is larger, and in bonding, bonding head is easy to encounter in bonding pressing plate
The upper surface of installation spring leaf, lead to not be bonded.
Summary of the invention
The embodiment of the present application provides a kind of bonding pressing plate and bonding jig, and bonding success rate can be improved, and reduces bonding pressure
The loss of plate.
The application section Example provides a kind of bonding pressing plate, including：
Pressing plate ontology, the pressing plate ontology include the pressing surface for pressing on lead frame；
Feeler is located on the pressing plate ontology, extends outward to form from the pressing surface, for pressing on the lead
The Ji Dao of chip is carried on frame, the length of the feeler matches with the Ji Dao depth sinking.
In one embodiment, the feeler includes antennule and antenna secunda, the antennule, second touching
Angle is respectively used to compress on the lead frame the first Ji Dao on the outermost side in all base islands, on the second Ji Dao.In this way, can
To be effectively fixed in the island Liang Geji for being located at both ends in bonding platen region, when guaranteeing bonding, pressing is stablized, and raising is bonded successfully
Rate.
In one embodiment, the length of the antennule can be 0.66mm, and width can be 0.64mm, and depth can be
1.3mm。
In one embodiment, the length of the antenna secunda can be 0.6mm, and width can be 0.35mm, and depth can be
1.3mm。
In one embodiment, the feeler includes at least one third feeler, and the third feeler is described for compressing
It is located at the third Ji Dao of inside on lead frame in all base islands.In this way, can be in the case where not influencing bonding, to greatest extent
Ground contacts feeler with lead frame, and when guaranteeing bonding, pressing is stablized, and is not shaken, and improves bonding success rate.
In one embodiment, the length of the third feeler can be 1.35mm, and width can be 0.39mm.
In one embodiment, the feeler can be L-shaped.
In one embodiment, it may also include the 4th feeler for compressing company's muscle on the lead frame.
In one embodiment, the length of the 4th feeler can be 1.98mm, and width can be 0.53mm.
The application section Example additionally provides a kind of bonding jig, is bonded including above-mentioned bonding pressing plate and with described
Pressing plate matches the substrate for clamping the lead frame.
The embodiment of the present application major technique effect achieved is：By being formed on the pressing surface of bonding pressing plate for supporting
The feeler on the island Ya Ji may be implemented steadily to press Ji Dao in bonding, improve bonding success rate, reduce the damage of bonding pressing plate
Consumption, while the transformation to lead frame can also be avoided.Specifically, it is integrally formed due to feeler with pressing plate is bonded, it not only can be with
It avoids feeler after repeatedly pressing from deforming, can also avoid the problem that damaging feeler during the installation process, moreover, it is also possible to avoid more
After secondary pressing due to feeler loosens ineffective problem, and the problem of can be damaged to avoid feeler after multiple pressing.And by
Match in the length of feeler with the Ji Dao depth sinking, in this way, can steadily press Ji Dao in bonding.And by
The problem of being located at the pressing surface of bonding pressing plate in feeler, bonding being led to not to avoid the touching bonding head in bonding.
Detailed description of the invention
Fig. 1 is a kind of top view of bonding pressing plate shown in one exemplary embodiment of the application；
Fig. 2 is sectional view of the Fig. 1 along the direction A-A；
Fig. 3 is a kind of structural schematic diagram of lead frame shown in one exemplary embodiment of the application.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they are only and such as appended right
The example of the consistent device and method of some aspects be described in detail in claim, the application.
It is only to be not intended to be limiting the application merely for for the purpose of describing particular embodiments in term used in this application.
It is also intended in the application and the "an" of singular used in the attached claims, " described " and "the" including majority
Form, unless the context clearly indicates other meaning.It is also understood that term "and/or" used herein refers to and wraps
It may be combined containing one or more associated any or all of project listed.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the application
A little information should not necessarily be limited by these terms.These terms are only used to for same type of information being distinguished from each other out.For example, not departing from
In the case where the application range, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as
One information.Depending on context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determination ".
In the related technology, the lead frame that a intelligent power module is used in bonding (with a thickness of 0.5mm, and has 9
On Ji Dao), there is part Ji Dao there was only company's muscle, stability is poor, is easy to appear deformation, is easy to appear so as to cause in bonding
It presses ineffective and bonding is caused to fail.However, pressing bad skill by increasing spring leaf on bonding pressing plate to improve
There is also problems for art scheme.In view of the above-mentioned problems, present inventor proposes the technical solution of the application.
With reference to the accompanying drawing, it elaborates to some embodiments of the present application.In the absence of conflict, following reality
The feature applied in example and embodiment can be combined with each other.
The exemplary embodiment of the application provides a kind of bonding pressing plate, including：Pressing plate ontology and feeler；Wherein, pressing plate
Ontology includes for compressing the pressing surface on lead frame, and feeler is located on the pressing plate ontology, from the pressing surface to
It extends to form outside, for compressing the Ji Dao for carrying chip on the lead frame, the length of the feeler and the Ji Dao sink
Depth match.
In the present embodiment, by forming the feeler for compressing Ji Dao on the pressing surface of bonding pressing plate, it may be implemented
When bonding, Ji Dao is steadily pressed, bonding success rate is improved, reduces the loss of bonding pressing plate, while can also avoid to lead
The transformation of frame.Specifically, it is integrally formed due to feeler with pressing plate is bonded, can not only be deformed to avoid feeler after multiple pressing,
It can also avoid the problem that damaging feeler during the installation process, moreover, it is also possible to avoid losing after repeatedly pressing because feeler loosens
The problem of going the problem of acting on, and being damaged to avoid feeler after multiple pressing.Again due to the length of feeler and the Ji Dao
Sagging depth matches, in this way, can steadily press Ji Dao in bonding.Again since feeler is located at the pressure of bonding pressing plate
The problem of closing surface, bonding being led to not to avoid the touching bonding head in bonding.
Fig. 1 and Fig. 3 are please referred to, the feeler includes antennule 121 and antenna secunda 122, and the antennule 121 is used
In all base islands the first base on the outermost side island 33 in compressing on lead frame 3, and the antenna secunda 122 is for compressing lead
On frame 3 in all base islands on the second base on the outermost side island 34.In this way, position in bonding platen region can be effectively fixed in
In the island Liang Geji at both ends, when guaranteeing bonding, pressing is stablized, and improves bonding success rate.
Wherein, antennule 121 can be identical with 122 shape of antenna secunda, referring to Fig. 2, antennule 121 is from pressing plate
The pressing surface of ontology 11 extends outward to form.The length of antennule 121 and antenna secunda 122 can be according to the Ji Dao compressed
Sagging depth determines.Wherein, the sagging depth in the first base island 33 can be the sagging depth in 1.3mm, the second base island 34 can be with
It is 1.3mm.Correspondingly, in one embodiment, the length of the antennule is 0.66mm, width 0.64mm, and depth is
1.3mm.The length of the antenna secunda is 0.6mm, width 0.35mm, depth 1.3mm.Due to feeler length with it is described
Ji Dao sagging depth matches, in this way, can steadily press Ji Dao in bonding.
Please continue to refer to Fig. 1 and Fig. 3, feeler may also include at least one third feeler 123, and the third feeler 123 is used
In compressing on the lead frame 3 the third base island 35 for being located inside in all base islands.The number of third feeler 123 is according to being located at
35 number of third base island of inside determines.It in one exemplary embodiment, altogether include 3 islands Ge Ji on lead frame 3, that is,
35 number of third base island positioned inside is 1, then being bonded on pressing plate 1 may include 1 third feeler 123.In another example
Property embodiment in, on lead frame 3 altogether include 5 islands Ge Ji, that is, positioned inside 35 number of third base island be 3, then be bonded
It on pressing plate 1 may include that 2 third feelers, 123,2 third feelers 123 are respectively used to compress wherein 2 third base islands 35, alternatively,
It may also comprise 3 third feelers, 123,3 third feelers 123 to be respectively used to compress 3 third base islands 35.
The characteristics of size of third feeler 123 can be according to the chip carried on lead frame 3 and third base island 35 is true
It is fixed, to increase the pressing area of third feeler 123.In one embodiment, the length of third feeler can be 1.35mm, and width can
For 0.39mm.In this way, feeler can be made to contact with lead frame to the maximum extent in the case where not influencing bonding, guarantee key
When conjunction, pressing is stablized, and is not shaken, and bonding success rate is improved.
Please continue to refer to Fig. 2, antennule 121, antenna secunda 122, third feeler 123 are L-shaped, it is, first
Feeler 121, antenna secunda 122, third feeler 123 section be L-type, in other words, antennule 121, antenna secunda 122,
Third feeler 123 is a step-like protrusion.This way it is possible to avoid feeler is pressed onto the chip carried on Ji Dao, and can protect
In bonding, feeler can be contacted integrally with lead frame 3 card.
Due to further including at least two the 4th base islands 31 on lead frame 3, this at least two the 4th base island 31 shares one
Even muscle 32.When to guarantee bonding, the company's of avoiding muscle 32 is deformed, therefore the bonding pressing plate 1 in the application further includes for compressing described draw
4th feeler 13 of company's muscle 32 on wire frame 3, the 4th feeler 13 is also L-shaped, this way it is possible to avoid the 4th feeler 13 is pressed onto
The chip carried on 4th base island 31, and can guarantee that the 4th feeler 13 can be contacted integrally with lead frame 3 in bonding.
In one embodiment, the length of the 4th feeler 13 can be 1.98mm, and width can be 0.53mm.
The main beneficial effect of the present embodiment is：By forming the touching for compressing Ji Dao on the pressing surface of bonding pressing plate
Angle may be implemented steadily to press Ji Dao in bonding, improve bonding success rate, reduce the loss of bonding pressing plate, while may be used also
To avoid the transformation to lead frame.Specifically, it is integrally formed due to feeler with pressing plate is bonded, it not only can be to avoid multiple pressing
Feeler deforms afterwards, can also avoid the problem that damaging feeler during the installation process, moreover, it is also possible to avoid after repeatedly pressing because of touching
Angle loosens and ineffective problem, and the problem of can damage to avoid feeler after multiple pressing.Again due to the length of feeler
Match with the Ji Dao depth sinking, in this way, can steadily press Ji Dao in bonding.Again since feeler is located at key
The pressing surface of combined pressure plate can lead to not the problem of being bonded to avoid the touching bonding head in bonding.
Embodiments herein additionally provides a kind of bonding jig, is bonded including above-mentioned bonding pressing plate 1 and with described
Pressing plate 1 matches the substrate for clamping the lead frame 3.
The main beneficial effect of the present embodiment is：By forming the touching for compressing Ji Dao on the pressing surface of bonding pressing plate
Angle may be implemented steadily to press Ji Dao in bonding, improve bonding success rate, reduce the loss of bonding pressing plate, while may be used also
To avoid the transformation to lead frame.Specifically, it is integrally formed due to feeler with pressing plate is bonded, it not only can be to avoid multiple pressing
Feeler deforms afterwards, can also avoid the problem that damaging feeler during the installation process, moreover, it is also possible to avoid after repeatedly pressing because of touching
Angle loosens and ineffective problem, and the problem of can damage to avoid feeler after multiple pressing.Again due to the length of feeler
Match with the Ji Dao depth sinking, in this way, can steadily press Ji Dao in bonding.Again since feeler is located at key
The pressing surface of combined pressure plate can lead to not the problem of being bonded to avoid the touching bonding head in bonding.
The apparatus embodiments described above are merely exemplary, wherein described, unit can as illustrated by the separation member
It is physically separated with being or may not be, component shown as a unit may or may not be physics list
Member, it can it is in one place, or may be distributed over multiple network units.It can be selected according to the actual needs
In some or all of the modules realize the purpose of application scheme.Those of ordinary skill in the art are not paying creative labor
In the case where dynamic, it can understand and implement.
The foregoing is merely the preferred embodiments of the application, not to limit the application, all essences in the application
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of the application protection.
Claims (10)
1. a kind of bonding pressing plate, which is characterized in that including：
Pressing plate ontology, the pressing plate ontology include the pressing surface for pressing on lead frame；
Feeler is located on the pressing plate ontology, extends outward to form from the pressing surface, for pressing on the lead frame
The Ji Dao of upper carrying chip, the length of the feeler match with the Ji Dao depth sinking.
2. bonding pressing plate according to claim 1, which is characterized in that the feeler includes antennule and antenna secunda,
The antennule, the antenna secunda are respectively used to compress on the lead frame on the outermost side first in all base islands
On Ji Dao, the second Ji Dao.
3. bonding pressing plate according to claim 2, which is characterized in that the length of the antennule is 0.66mm, width
For 0.64mm, depth 1.3mm.
4. bonding pressing plate according to claim 2, which is characterized in that the length of the antenna secunda is 0.6mm, and width is
0.35mm, depth 1.3mm.
5. bonding pressing plate according to claim 1, which is characterized in that the feeler includes at least one third feeler, institute
Third feeler is stated for compressing the third Ji Dao for being located inside on the lead frame in all base islands.
6. bonding pressing plate according to claim 5, which is characterized in that the length of the third feeler is 1.35mm, width
For 0.39mm.
7. bonding pressing plate according to claim 1, which is characterized in that the feeler is L-shaped.
8. bonding pressing plate according to claim 1, which is characterized in that further include for compressing the company on the lead frame
4th feeler of muscle.
9. bonding pressing plate according to claim 8, which is characterized in that the length of the 4th feeler is 1.98mm, width
For 0.53mm.
10. a kind of bonding jig, which is characterized in that including the described in any item bonding pressing plates of claim 1 to 9 and with it is described
Bonding pressing plate matches the substrate for clamping the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710331161.2A CN108878309A (en) | 2017-05-11 | 2017-05-11 | It is bonded pressing plate and bonding jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710331161.2A CN108878309A (en) | 2017-05-11 | 2017-05-11 | It is bonded pressing plate and bonding jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108878309A true CN108878309A (en) | 2018-11-23 |
Family
ID=64319775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710331161.2A Pending CN108878309A (en) | 2017-05-11 | 2017-05-11 | It is bonded pressing plate and bonding jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108878309A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62155526A (en) * | 1985-12-27 | 1987-07-10 | Toshiba Corp | Wire bonding device |
| US20020040921A1 (en) * | 1996-12-13 | 2002-04-11 | Ball Michael B. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
| JP2002252243A (en) * | 2001-02-22 | 2002-09-06 | Mitsubishi Electric Corp | Apparatus for manufacturing semiconductor device |
| CN202816883U (en) * | 2012-08-31 | 2013-03-20 | 杰群电子科技（东莞）有限公司 | Pressure plate for packaging semiconductor chips |
| CN204706546U (en) * | 2015-05-19 | 2015-10-14 | 吉林华微斯帕克电气有限公司 | A kind of pressing plate used in lead frame and electronic devices and components wire bonding process |
| CN205159288U (en) * | 2015-11-09 | 2016-04-13 | 杰群电子科技（东莞）有限公司 | Clamp plate smelting tool |
| CN206059346U (en) * | 2016-08-30 | 2017-03-29 | 无锡罗姆半导体科技有限公司 | The fixing device of lead frame |
| CN208819871U (en) * | 2018-08-29 | 2019-05-03 | 杭州友旺科技有限公司 | The fixation device of lead frame |
-
2017
- 2017-05-11 CN CN201710331161.2A patent/CN108878309A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62155526A (en) * | 1985-12-27 | 1987-07-10 | Toshiba Corp | Wire bonding device |
| US20020040921A1 (en) * | 1996-12-13 | 2002-04-11 | Ball Michael B. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
| JP2002252243A (en) * | 2001-02-22 | 2002-09-06 | Mitsubishi Electric Corp | Apparatus for manufacturing semiconductor device |
| CN202816883U (en) * | 2012-08-31 | 2013-03-20 | 杰群电子科技（东莞）有限公司 | Pressure plate for packaging semiconductor chips |
| CN204706546U (en) * | 2015-05-19 | 2015-10-14 | 吉林华微斯帕克电气有限公司 | A kind of pressing plate used in lead frame and electronic devices and components wire bonding process |
| CN205159288U (en) * | 2015-11-09 | 2016-04-13 | 杰群电子科技（东莞）有限公司 | Clamp plate smelting tool |
| CN206059346U (en) * | 2016-08-30 | 2017-03-29 | 无锡罗姆半导体科技有限公司 | The fixing device of lead frame |
| CN208819871U (en) * | 2018-08-29 | 2019-05-03 | 杭州友旺科技有限公司 | The fixation device of lead frame |
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| PB01 | Publication | ||
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Application publication date: 20181123 |
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