CN208819871U - The fixation device of lead frame - Google Patents

Abstract

This application discloses a kind of fixation devices of lead frame, the lead frame includes sequentially connected cooling fin, the first Ji Dao and the second Ji Dao, and the pin around second Ji Dao, the fixed device includes: heating sole piece, including the first carrying platform for carrying the cooling fin and first Ji Dao, the second carrying platform for carrying second Ji Dao and the third carrying platform for carrying the pin；Pin pressing plate, positioned at the top of the heating sole piece, for pressing the pin of the lead frame；And cooling fin pressing plate, it is located above the heating sole piece, and be detachably connected with the pin pressing plate, for pressing the cooling fin.The second carrying platform and boss is respectively set on heating sole piece and pin pressing plate in the fixation device of the lead frame of the application, can complete the wire bonding of two or more base island lead frame framves, and increase the stability of bonding process.

Description

The fixation device of lead frame

Technical field

The utility model relates to the encapsulation fields of semiconductor devices, particularly, are related to a kind of fixation device of lead frame.

Background technique

In recent years, it with the raising of field of power electronics demand, is able to achieve conversion and controls the semiconductor function of flow of electrical power Rate device is just extensively studied and develops, and especially needs to realize the device of power switch, for example, can control it is high-power and Realize high performance power metal-oxide semiconductor field effect transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), Power bipolar transistor (Bipolar Junction Transistor, BJT), insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) etc..Semiconductor power Device will carry out the various Power Processing tasks such as frequency conversion, transformation, unsteady flow, power management, and it is necessary to have processing high voltages, high current Ability.

In the manufacturing process of semiconductor integrated circuit, multiple encapsulation is important one of process, including integrated circuit Chip and pin and subsequent encapsulation.Existing integrated antenna package mostly uses greatly lower-cost lead key closing process, i.e., Wire bonding is carried out using lead frame bonding apparatus.Packaging structure for semiconductor power device in the prior art, because inside is drawn Only one Ji Dao of wire frame, the fixed device of bonding is relatively simple, is bonded a plane of the heating sole piece of fixed device It is padded on the lower surface Ji Dao of lead frame, another plane is padded on the pin lower surface of lead frame；It is bonded the pressing plate of fixed device Push down the Ji Dao of lead frame and the upper surface of pin.Such is bonded fixed device can not drawing suitable for two or more Ji Dao Wire frame.And in bonding process, lead frame is easy to appear shaking, and bonding is caused to fail, and reduces yield rate.

Utility model content

In view of this, in order to solve problems in the prior art, the utility model provides a kind of fixation device of lead frame, The lead frame of two or more Ji Dao can be enable reliablely and stablely to carry out wire bonding in encapsulation bond sequence.

A kind of fixation device of lead frame is provided according to the utility model, the lead frame includes sequentially connected dissipates Backing, the first Ji Dao and the second Ji Dao, and the pin around second Ji Dao, the fixed device include: heating Sole piece, including for carrying the cooling fin and first Ji Dao the first carrying platform, for carrying second Ji Dao The second carrying platform and third carrying platform for carrying the pin；Pin pressing plate, positioned at the upper of the heating sole piece Side, for pressing the pin of the lead frame；And cooling fin pressing plate, it is located above the heating sole piece, and with The pin pressing plate is detachably connected, for pressing the cooling fin.

Preferably, second carrying platform is between first carrying platform and the third carrying platform.

Preferably, the heating sole piece is structure as a whole.

Preferably, the height of first carrying platform, second carrying platform and the third carrying platform is different.

Preferably, second carrying platform includes extending on the third carrying platform from first carrying platform Multiple extensions.

Preferably, the pin pressing plate includes: first connecting portion, and the first connecting portion is stripped, for it is described Cooling fin pressing plate is connected；Multiple press keeping sections, each press keeping section include the multiple claws stretched out from the first connecting portion, are used to Press the pin of the lead frame；And mounting portion, it is connected with the first connecting portion, positioned at the opposite of the press keeping section Side, for being releasably attached to other devices.

Preferably, each press keeping section further include: boss is located at multiple claw sides, from first connection Portion is stretched out, for pressing second Ji Dao of the lead frame.

Preferably, the first connecting portion includes: first through hole and the first threaded hole, for installing the cooling fin pressure Plate.

Preferably, the mounting portion includes the second through-hole, the first kidney slot and the second waist-shaped hole, is used for the pin pressure The installation of plate.

Preferably, the cooling fin pressing plate includes: main body, and the main body is arranged circlewise, so that working as the cooling fin pressure Plate, which is located above the heating sole piece when pressing the cooling fin, makes first Ji Dao and the second Ji Dao via described cricoid Center is exposed；Cooling fin is presented a theatrical performance as the last item on a programme, on a side of the main body, for pressing the cooling fin；Second connecting portion, position In on another side of the main body, present a theatrical performance as the last item on a programme relatively with the cooling fin, for detachably connected with the pin pressing plate.

Preferably, the cooling fin, which is presented a theatrical performance as the last item on a programme, has difference in height with the second connecting portion.

Preferably, the second connecting portion includes the second threaded hole, and the cooling fin pressing plate passes through with the pin pressing plate The second threaded hole formation is bolted.

The fixed device of a whole set of bonding of the utility model is completed the process by metal material manufacture, intermediate without welding, And so that hardness is reached certain requirement by heat treatment process, increase reliability.

According to the fixation device of the lead frame of the utility model embodiment, the second carrying is provided on heating sole piece and is put down Platform, while the corresponding boss for pressing the second Ji Dao is equipped on the claw of pin pressing plate, two or more base islands lead can be completed The fixation of frame is to facilitate wire bonding；

The cooperation of pin pressing plate and heating sole piece is fixed in lead frame therebetween, and the setting of cooling fin pressing plate It more ensure that lead frame, without shaking phenomenon, to reduce equipment alarm, improves lead quality in wire bonding process.

Detailed description of the invention

By referring to the drawings to the description of the utility model embodiment, above-mentioned and other mesh of the utility model , feature and advantage will be apparent from.

Fig. 1 shows the planar structure schematic diagram of the lead frame according to the utility model embodiment.

Fig. 2 shows the perspective views for heating sole piece according to the utility model embodiment.

Fig. 3 a shows the schematic perspective view of the pin pressing plate according to the utility model embodiment.

Fig. 3 b shows the stereochemical structure enlarged drawing of the press keeping section of the pin pressing plate according to Fig. 3 a.

Fig. 4 a shows the schematic perspective view of the cooling fin pressing plate according to the utility model embodiment.

Fig. 4 b shows the planar structure schematic diagram of the cooling fin pressing plate according to another embodiment of the utility model.

Fig. 5 shows the explosive view of the fixation device according to the lead frame of the utility model embodiment.

Specific embodiment

Hereinafter reference will be made to the drawings is more fully described the various embodiments of the utility model.In various figures, identical Element is indicated using same or similar appended drawing reference.For the sake of clarity, the various pieces in attached drawing are not drawn to draw System.Embodiment described in preferred embodiments below does not represent all embodiments consistent with the utility model.

It should be appreciated that being known as being located at another floor, another area when by a floor, a region when describing the structure of component When domain " above " or " top ", can refer to above another layer, another region, or its with another layer, it is another Also comprising other layers or region between a region.Also, if by part turnover, this layer, a region will be located at it is another Layer, another region " following " or " lower section ".

Fig. 1 shows the planar structure schematic diagram of the lead frame according to the utility model embodiment.The utility model draws The bonding that the fixation device of wire frame is used for the lead frame with two to more Ji Dao is fixed, and Fig. 1 shows tool, and there are two bases The structural schematic diagram of the lead frame on island illustrates that the wire frame of the utility model is bonded the structure of fixed device as example.

As shown in Figure 1, the lead frame 100 includes cooling fin 110 and multiple pins 120, cooling fin 110 is for improving envelope The heat dissipation performance of assembling structure further includes mounting hole 112 on cooling fin 110, the installation for entire lead frame 100.Cooling fin 110 can be connected with the first base island 111, the first chip 114 can be equipped on the first base island 111, below the first base island 111 Second base island 113 can also be set, the second chip 115 is provided on the second base island 113.Wherein, the first base island 111 can be core Chip base island, the second base island 113 can be that Ji Dao is isolated, and the positional relationship on the first base island 111 and the second base island 113 is not limited in figure Shown, the second base island 113 may be located on the first base island 111, be only citing here.And connect with the first base island 111 The quantity on diyl island 113 can be one, be also possible to the multiple of other quantity more than two, the second core on the second base island 113 The quantity of piece 115 is also possible to corresponding multiple.The present embodiment is to include second chip 115 on a second base island 113 For illustrate.

Multiple pins 120 are located at around the second base island 113, may include the first pin, the second pin and third pipe For foot to N pin, N is the integer greater than 3.Wherein, can directly connect with the first base island 111 positioned at certain pins of marginal position It connects, is used as power pin, it can also be separately positioned by whole pins 120 and the first base island 111 and the second base island 113.Multiple pipes Part pin in foot 120 can be bonded with the first chip 114, and another part pin can be with second on the second base island 113 Chip 115 is bonded.

May each comprise bonding region 121 in multiple pins 120 with each pin of chip bonding, bonding region 121 be used for First chip 114 or the bonding of the second chip 115.For example, the bonding region 121 of pin shown in Fig. 1 can pass through key in parallel It closes conducting wire 140 to be connected with the first chip 114, bonding lead 140 can be copper wire, aluminum steel, alloy wire etc..Other pins and chip Bonding it is similar, do not shown one by one in figure.

The lead frame 100 of the present embodiment is only a basic unit, the lead frame of actual use include it is multiple successively The unit shown in FIG. 1 connected side by side, and the lead frame of the present embodiment is only a preferred embodiment, but of the invention draw The structure of the corresponding fixed lead frame of the fixation device of wire frame is without being limited thereto.

The Each part of the fixation device of the lead frame of the utility model is shown respectively in Fig. 2-Fig. 4 b, and Fig. 5 shows root According to the explosive view of the fixation device of the lead frame of the utility model embodiment.The lead frame of the utility model embodiment is consolidated Determining device 600 includes: heating sole piece 200, pin pressing plate 300 and cooling fin pressing plate 400.Wherein, heating sole piece 200 is for holding Lead frame 100 is carried, pin pressing plate 300 is used to press the pin 120 of lead frame, and cooling fin pressing plate 400 is located at pin pressing plate 300 tops, for pressing the cooling fin 110 of lead frame.Illustrate each section respectively structurally and functionally with reference to the accompanying drawing.

Fig. 2 shows the perspective views for heating sole piece according to the utility model embodiment.As shown in Fig. 2, the utility model is real The heating sole piece 200 of example is applied for carrying lead frame 100 shown in FIG. 1, and can once carry multiple lead frames 100. Heating sole piece 200 includes the first carrying platform 210, the second carrying platform 220 and third carrying platform 230, and heating sole piece 200 is Integral structure, the first carrying platform 210 is suitable with the length of third carrying platform 230, and is in contact with each other, the second carrying platform 220 between the first carrying platform 210 and third carrying platform 230, and is located at least in the first carrying platform 210 and third is held A part of the junction of carrying platform 230, for example, the second carrying platform 220 is located at the first carrying platform 210 and third carrying is flat The middle position of the junction of platform 230.

First carrying platform 210 is used to carry the first base island 111 and the cooling fin 110 of lead frame 100；Second carrying is flat Platform 220 is connected with the first carrying platform 210, for carrying the second base island 113 of lead frame 100；Third carrying platform 230 It is connected with the second carrying platform 220, for carrying multiple pins 120 of lead frame 100, i.e. pin carrying platform.

Due to the first base island 111 on lead frame 100, the second base island 113 and multiple pins 120 may not be in same water In flat height, it is preferable that the first carrying platform 210, the second carrying platform 220 are different with the height of third carrying platform 230, i.e., The difference of the structure for the lead frame 100 that the height of three platforms carries as needed and adjust.For example, three platforms can be set It sets in same level height, is also possible on three horizontal planes of different drops, also or different two of height fall On horizontal plane.

In the present embodiment, the first carrying platform 210, the height of the second carrying platform 220 and third carrying platform 230 is successively It increases, and the first carrying platform 210 and the second carrying platform 220 are mutually chimeric with third carrying platform 230 respectively, i.e. junction Shape be irregular figure, for example, a part of third carrying platform 230 extends on the first carrying platform 210, formed Multiple protruding portion, and each section of the second carrying platform 220 is located in the interval that multiple adjacent protruding portions are formed, and the A part of two carrying platforms 220 extends in third carrying platform 230, i.e. the second carrying platform 220 includes being located at first to hold A part on carrying platform 210 and multiple extensions 221 on third carrying platform 230 are extended to from the first carrying platform 210. The extension 221 of the protruding portion of third carrying platform 230 and the second carrying platform 220 is adjacent and quantity is identical.

Further, the second carrying platform 220 includes multiple discontinuous irregular platforms, and each platform includes being located at the Rule section on one carrying platform 210 and an extension 221 being connected with this Rule section.The heating sole piece of the present embodiment 200 can once carry multiple lead frames shown in FIG. 1 100, i.e. the second carrying platform 220 can once carry multiple second Base island 113, so the irregular platform of each of second carrying platform 220 can carry a second base island 113, the second carrying The quantity for the irregular platform that platform 220 includes and the quantity of leadframes unit can be mutually matched, for example, the present embodiment Lead frame includes 4 leadframes units shown in FIG. 1, and the second carrying platform 220 includes 4 irregular platforms.

Preferably, heating sole piece 200 selects metal block to be made, and in bonding, can be rapidly heated.

Fig. 3 a shows the schematic perspective view of the pin pressing plate according to the utility model embodiment.Fig. 3 b is shown according to figure The stereochemical structure enlarged drawing of the press keeping section of the pin pressing plate of 3a.As shown in Figure 3a and Figure 3b shows, the pin of the utility model embodiment Pressing plate 300 includes: press keeping section 310, interconnecting piece 320 and mounting portion 330.

Interconnecting piece 320 is stripped, for being connected with cooling fin pressing plate 400, the intermediate as pin pressing plate 300； Press keeping section 310 is located at an end of pin pressing plate 300, pin pressing plate 300 include multiple intervals uniformly and respectively with interconnecting piece The press keeping section 310 of 320 connections, each press keeping section 310 include the multiple claws 311 stretched out from interconnecting piece 320, are placed for pressing The pin 120 of lead frame on third carrying platform 320；Mounting portion 330 is located at another end of pin pressing plate 300, It is connect with interconnecting piece 320, for pin pressing plate 300 to be releasably attached to other devices.Interconnecting piece 320 includes and installation The square plate that portion 330 connects and the arc panel connecting with multiple press keeping sections 310, interconnecting piece 320 and press keeping section 310 form arc Connection, so mounting portion 330 and press keeping section 310 be not in same level height.

Specifically, multiple pins 120 of one lead frame 100 of corresponding pressure holding of press keeping section 310, because of heating sole piece Multiple sequentially connected lead frames 100 can be carried on 200, so pin pressing plate 300 includes multiple sequentially connected side by side Press keeping section 310.The quantity of press keeping section 310 can be with the quantity of the irregular platform of the second carrying platform 220 on heating sole piece 200 Match, for example, pin pressing plate 300 includes 4 press keeping sections 310, an interconnecting piece 320 and a mounting portion 330, pin pressing plate 300 are also structure as a whole.

Preferably, the interconnecting piece 320 of pin pressing plate 300 includes a through-hole 321 and two threaded holes 322, is located at pin The intermediate region of pressing plate 300, for installing cooling fin pressing plate 400.Mounting portion 330 includes two through-holes, 331, two biggish waists Shape hole 332 and two lesser waist-shaped holes 333, for pin pressing plate 300 to be releasably attached to external devices.Example Such as, two biggish kidney slots 332 are located at the edge of the end of pin pressing plate 300, the extending direction of long axis and claw 311 Unanimously, two lesser waist-shaped holes 333 are located between two biggish kidney slots 332, divide in arrangement, two through-holes 331 up and down Not Wei Yu two biggish kidney slots 332 adjacent one end, only a kind of embodiment of mounting portion as needed can here To change the quantity and arrangement mode in each hole.

Preferably, each press keeping section 310 includes multiple different in size and mutually independent claw 311, is respectively intended to press The pin 120 for the lead frame being placed on third carrying platform 230 is held, a claw 311 can correspond to pressure holding one at most The quantity of a pin 120, claw 311 is determined that the length of claw 311 can be with pin by the quantity of the pin 120 of lead frame 120 length matches or matches with the shape of each platform junction of heating sole piece 200.Each press keeping section 310 also wraps Include: boss 312 is located at multiple 311 sides of claw, the pressure holding for the second base island 113 to lead frame.Boss 312 can be with It is considered as another the curved claw of end stretched out together from interconnecting piece 320 with multiple claws 311, the end of the claw is first to more The direction of a claw 311 is laterally extended, then is longitudinally extended to the direction of the second carrying platform 220, is formed to the second base island 113 Pressure holding；Boss 312 can also be considered as in multiple claws 311, the part to extend out on outermost claw 311, boss 312 It is first laterally extended from the end of outermost claw 311 to the orientation of multiple claws 311, surrounds part press jaws, then to second An apiculus is longitudinally extended in the direction of carrying platform 220, forms the pressure holding to the second base island 113.Wherein, boss 312 Quantity can be set according to the size on the second base island 113.

Fig. 4 a shows the schematic perspective view of the cooling fin pressing plate according to the utility model embodiment, and Fig. 4 b shows basis The planar structure schematic diagram of the cooling fin pressing plate of another embodiment of the utility model.As shown in fig. 4 a, the utility model embodiment Cooling fin pressing plate 400 include: main body 410, cooling fin is presented a theatrical performance as the last item on a programme 420 and interconnecting piece 430.

Main body 410 is arranged circlewise, so that pressing cooling fin 110 when cooling fin pressing plate 400 is located above heating sole piece 200 When keep the first base island 111 and the second base island 113 exposed via cricoid center, the top view of main body 410 is in a rectangle frame；It dissipates Backing, which is presented a theatrical performance as the last item on a programme, 420 to be located on a side of main body 410, and main body 410 includes one and presents a theatrical performance as the last item on a programme 420 to multiple cooling fins, cooling fin 420 are presented a theatrical performance as the last item on a programme for pressing the cooling fin 110 of lead frame；Interconnecting piece 430 is located on another side of main body 410, for Pin pressing plate 300 is connected, and the top view of interconnecting piece 430 is a rectangle.

Further, main body 410 include openings at one side three side rectangle frames and two sections of sides with opening two sides respectively Three side rectangle frames of the inclined strip 440 of side connection, interconnecting piece 430 and main body 310 form inclination by inclined strip 440 and connect Connect, be integrally formed structure, and cooling fin is presented a theatrical performance as the last item on a programme and 420 is located on the side opposite with opening side, thus cooling fin present a theatrical performance as the last item on a programme 420 with There is difference in height between interconnecting piece 430.When cooling fin pressing plate 400 is for when pressing, cooling fin presents a theatrical performance as the last item on a programme 420, and to be located at the first carrying flat The top of platform 210.Cooling fin present a theatrical performance as the last item on a programme 420 be, for example, a cuboids, the cooling fin 110 of multiple lead frames 100 is pressed simultaneously.

For interconnecting piece 430 for being connected with pin pressing plate 300, interconnecting piece is including two threaded holes 431 and is located at threaded hole 3 through-holes 432 (or being also possible to threaded hole) near 431, two screw threads of two threaded holes 431 and pin pressing plate 300 Hole 322 matches.When cooling fin pressing plate 400 is connect with pin pressing plate 300, threaded hole 431 matches with threaded hole 322, dissipates Backing pressing plate 400 is bolted with the formation of pin pressing plate 300.

It as shown in Figure 4 b, is the planar structure schematic diagram of the cooling fin pressing plate 500 of another embodiment of the utility model.At this In embodiment, present a theatrical performance as the last item on a programme 520 quantity of cooling fin can match with the quantity of lead frame 100 carried on heating sole piece 200, Or can match with the quantity of the press keeping section 310 of pin pressing plate 300, for example, cooling fin pressing plate 500 includes 4 cooling fins 520,4 cooling fins of presenting a theatrical performance as the last item on a programme are presented a theatrical performance as the last item on a programme 520 spaced sets, and are connected with each other, and are located in main body 410.The top view of interconnecting piece 530 Shape can be set according to actual needs.

Fig. 5 shows the explosive view of the fixation device according to the lead frame of the utility model embodiment.

In the present embodiment, the heating sole piece 200 of the fixation device 600 of lead frame, pin pressing plate 300 and cooling fin pressing plate Though 400 is separately positioned, needing to cooperate just can be carried out bonding process.When being bonded, first by lead frame On corresponding three platforms of correspondence for being placed in heating sole piece 200 of 100 each section, for example, by cooling fin 110 and the first Ji Dao 111 are placed on the first carrying platform 210, and the second base island 113 is placed on the second carrying platform 220, and multiple pins 120 are placed On third carrying platform 230.Then cooling fin pressing plate 400 and pin pressing plate 300 are connected, such as by threaded hole 431 It coincides with threaded hole 322, blending bolt connection, inclined strip 440 and the arc panel of pin pressing plate 300 match, make multiple Press keeping section 310 is located in the ring-type of main body 400.Then the pin of lead frame is pressed with the press keeping section 310 of pin pressing plate 300 120, boss 312 presses the second base island 113, and the cooling fin of cooling fin pressing plate 400 is presented a theatrical performance as the last item on a programme 420 heat dissipations for pressing lead frame Piece 110.Through-hole 331, kidney slot 332 and kidney slot 333 are connected respectively in other equipment.I.e. press keeping section 310 and third carry Platform 230 is vertically corresponding, and cooling fin is presented a theatrical performance as the last item on a programme 420 vertical corresponding with the first carrying platform 210, and the claw 311 of press keeping section 310 is from the Three carrying platforms 230 extend to the direction of the second carrying platform 220.

Above-described embodiment is only to illustrate the present embodiment for pressing semiconductor package of multiple tools there are two Ji Dao Lead frame be bonded the structure of fixed device, embodiment is only a typical case of the fixation device of the lead frame of the utility model Application, but the embodiment of the fixation device of the lead frame of the utility model is without being limited thereto.For example, working as semiconductor packages knot When structure has multiple base islands, heating sole piece can be provided with the base island carrying platform of corresponding number, and pin pressing plate can also correspond to Multiple boss are set, press multiple Ji Dao respectively.

In the preferred embodiment in the utility model, the whole series, which are bonded fixed device, to be completed the process by metal manufacture, intermediate Reach certain degree of hardness requirement without welding, and by heat treatment process.

The fixation device of the lead frame of the utility model embodiment is provided with the second carrying platform on heating sole piece, The boss of the second Ji Dao of corresponding pressure holding is equipped on the claw of pin pressing plate simultaneously, two or more base island lead frame framves can be completed Fixation to facilitating wire bonding；

The cooperation of pin pressing plate and heating sole piece is fixed in lead frame therebetween, and the setting of cooling fin pressing plate It more ensure that stability of the lead frame in wire bonding process, avoid shaking phenomenon, to reduce equipment alarm, raising is drawn Line mass.

It should be noted that herein, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, article or the equipment that include a series of elements not only include those elements, but also Further include other elements that are not explicitly listed, or further includes for this process, article or the intrinsic element of equipment. In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including the element Process, there is also other identical elements in article or equipment.

The embodiments of the present invention are as described above, these embodiments details all there is no detailed descriptionthe, also not Limiting the utility model is only the specific embodiment.Obviously, as described above, can make many modifications and variations.This These embodiments are chosen and specifically described to specification, be in order to preferably explain the principles of the present invention and practical application, from And skilled artisan is enable to make well using the utility model and modification on the basis of the utility model With.The protection scope of the utility model should be subject to the range that the utility model claims are defined.

Claims (12)

1. a kind of fixation device of lead frame, the lead frame includes sequentially connected cooling fin, the first Ji Dao and second Ji Dao, and the pin around second Ji Dao,

It is characterized in that, the fixed device includes:

Sole piece is heated, including the first carrying platform, described for carrying for carrying the cooling fin and first Ji Dao The second carrying platform of second Ji Dao and third carrying platform for carrying the pin；

Pin pressing plate, positioned at the top of the heating sole piece, for pressing the pin of the lead frame；And

Cooling fin pressing plate is located above the heating sole piece, and is detachably connected with the pin pressing plate, described for pressing Cooling fin.

2. the fixation device of lead frame according to claim 1, which is characterized in that second carrying platform is located at institute It states between the first carrying platform and the third carrying platform.

3. the fixation device of lead frame according to claim 1, which is characterized in that the heating sole piece is integrated knot Structure.

4. the fixation device of lead frame according to claim 1, which is characterized in that first carrying platform, described Second carrying platform is different with the height of the third carrying platform.

5. the fixation device of lead frame according to claim 2, which is characterized in that second carrying platform include from First carrying platform extends to multiple extensions on the third carrying platform.

6. the fixation device of lead frame according to claim 1, which is characterized in that the pin pressing plate includes:

First connecting portion, the first connecting portion is stripped, for being connected with the cooling fin pressing plate；

Multiple press keeping sections, each press keeping section includes the multiple claws stretched out from the first connecting portion, for pressing the lead The pin of frame；And

Mounting portion is connected with the first connecting portion, positioned at the opposite side of the press keeping section, for being releasably attached to other On device.

7. the fixation device of lead frame according to claim 6, which is characterized in that each press keeping section further include: Boss is located at multiple claw sides, stretches out from the first connecting portion, for pressing described the second of the lead frame Ji Dao.

8. the fixation device of lead frame according to claim 6, which is characterized in that the first connecting portion includes: One through-hole and the first threaded hole, for installing the cooling fin pressing plate.

9. the fixation device of lead frame according to claim 6, which is characterized in that the mounting portion includes second logical Hole, the first kidney slot and the second waist-shaped hole, the installation for the pin pressing plate.

10. the fixation device of lead frame according to claim 1, which is characterized in that the cooling fin pressing plate includes:

Main body, the main body setting circlewise, are located above the heating sole piece described in pressure holding so that working as the cooling fin pressing plate Make first Ji Dao and the second Ji Dao exposed via the cricoid center when cooling fin；

Cooling fin is presented a theatrical performance as the last item on a programme, on a side of the main body, for pressing the cooling fin；

Second connecting portion is presented a theatrical performance as the last item on a programme relatively with the cooling fin, is used for and the pin on another side of the main body Pressing plate is detachably connected.

11. the fixation device of lead frame according to claim 10, which is characterized in that the cooling fin present a theatrical performance as the last item on a programme with it is described Second connecting portion has difference in height.

12. the fixation device of lead frame according to claim 10, which is characterized in that the second connecting portion includes the Two threaded holes, the cooling fin pressing plate are bolted with the pin pressing plate by second threaded hole formation.