CN204706546U - A kind of pressing plate used in lead frame and electronic devices and components wire bonding process - Google Patents
A kind of pressing plate used in lead frame and electronic devices and components wire bonding process Download PDFInfo
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- CN204706546U CN204706546U CN201520322743.0U CN201520322743U CN204706546U CN 204706546 U CN204706546 U CN 204706546U CN 201520322743 U CN201520322743 U CN 201520322743U CN 204706546 U CN204706546 U CN 204706546U
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- lead frame
- pressing plate
- frame
- bonding wire
- electronic devices
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Abstract
A kind of pressing plate used in lead frame and electronic devices and components wire bonding process, relate to welding aid technical field, its lead frame comprises treats bonding wire region, describedly treat that bonding wire region is provided with pad, described pressing plate comprises the plate frame for compressing lead frame, described plate frame is provided with the window treating bonding wire region for exposing described lead frame, described plate frame is provided with some several paws treating the non-pad locations in bonding wire region for compressing described lead frame, the utility model is by arranging some paws to compress the non-pad locations treating bonding wire region, paw is distributed near pad, make lead frame by pressing plate press against tighter and press against district also stressed evenly, substantially increase quality and the operation yield of bonding wire.
Description
Technical field
The utility model relates to welding aid technical field, particularly relates to a kind of pressing plate used in lead frame and electronic devices and components wire bonding process.
Background technology
Power model is the module of power power electronic device by embedding after the combination of certain function.
Intelligent Power Module take IGBT as the advanced hybrid integrated power component of kernel, and by high-speed low-power-consumption tube core (IGBT) and the gate drive circuit optimized, and fast protection circuit is formed.
Intelligent Power Module generally comprises pcb board and lead frame, is a kind of microelectronic device or parts.Pcb board adopts certain technique, together with the elements such as transistor required in a circuit, diode, resistance, electric capacity and inductance and wire interconnects.
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material (spun gold, aluminium wire and copper wire etc.), form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.
Prior art is when welding the wire be electrically connected between pcb board and lead frame, lead frame is fixed by pressing plate by usual needs, avoid it to move and affect bonding results, but the platen design of prior art is unreasonable, as shown in Figure 3 and Figure 4, only has a plate frame 11, expose a window 12, inadequate to the dynamics that press against of pcb board during bonding wire, cause often causing the quality problem such as rosin joint or fish tail fracture because of press against not tight in bonding wire operation process.
Utility model content
The purpose of this utility model is avoid weak point of the prior art and provide a kind of pressing plate used in lead frame and electronic devices and components wire bonding process, should the pressing plate that use in lead frame and electronic devices and components wire bonding process can make press against tighter and press against district also stressed evenly, substantially increase quality and the yields of bonding wire.
The purpose of this utility model is achieved through the following technical solutions:
A kind of pressing plate used in lead frame and electronic devices and components wire bonding process is provided, described lead frame comprises treats bonding wire region, describedly treat that bonding wire region is provided with pad, it is characterized in that: described pressing plate comprises the plate frame for compressing lead frame, described plate frame is provided with the window treating bonding wire region for exposing described lead frame, and described plate frame is provided with some several paws treating the non-pad locations in bonding wire region for compressing described lead frame.
One end of each described paw is connected with the end face of described plate frame, and the other end of each described paw extends to the center of described window.
The height of the other end of each described paw is identical with the height of the bottom surface of described plate frame.
The height of the other end of each described paw is lower than the height of the bottom surface of described plate frame.
Several paws described are divided into row pressure pawl and lower row pressure pawl, and described upper row pressure pawl and lower row pressure pawl are oppositely arranged.
The beneficial effects of the utility model: lead frame of the present utility model comprises treats bonding wire region, describedly treat that bonding wire region is provided with pad, described pressing plate comprises the plate frame for compressing lead frame, described plate frame is provided with for exposing the window treating bonding wire region, and described plate frame is provided with some several paws for compressing the non-pad locations treating bonding wire region.
The utility model is by arranging some paws to compress the non-pad locations treating bonding wire region, and paw is distributed near pad, make lead frame by pressing plate press against tighter and press against district also stressed evenly, substantially increase quality and the yields of bonding wire.
Accompanying drawing explanation
Accompanying drawing is utilized to be described further utility model, but the embodiment in accompanying drawing does not form any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the following drawings.
Fig. 1 is the overall structure schematic diagram of a kind of pressing plate used in lead frame and electronic devices and components wire bonding process of the present utility model.
Fig. 2 is the using state schematic diagram of a kind of pressing plate used in lead frame and electronic devices and components wire bonding process of the present utility model.
Fig. 3 is the overall structure schematic diagram of a kind of pressing plate used in lead frame and electronic devices and components wire bonding process of prior art.
Fig. 4 is the using state schematic diagram of a kind of pressing plate used in lead frame and electronic devices and components wire bonding process of prior art.
Include in figure:
1---pressing plate, 11---plate frame, 12---window, 13---paw;
2---lead frame.
Embodiment
With the following Examples the utility model is further described.
A kind of pressing plate used in lead frame and electronic devices and components wire bonding process of the present embodiment, as depicted in figs. 1 and 2, described lead frame comprises treats bonding wire region, describedly treat that bonding wire region is provided with pad, described pressing plate 1 comprises the plate frame 11 for compressing lead frame, described plate frame 11 is provided with the window 12 treating bonding wire region for exposing described lead frame 2, and described plate frame 11 is provided with some several paws 13 treating the non-pad locations in bonding wire region for compressing described lead frame 2.
The present embodiment compresses by arranging some paws 13 the non-pad locations treating bonding wire region, and paw 13 is distributed near pad, make lead frame by pressing plate 1 press against tighter and press against district also stressed evenly, substantially increase quality and the yields of bonding wire.
One end of each described paw 13 is connected with the end face of described plate frame 11, can guarantee the smooth of the bottom surface of plate frame 11, and the other end of each described paw 13 extends to the center of described window 12, is convenient to compress the centre position for the treatment of bonding wire region.
The height of the other end of each described paw 13 is identical with the height of the bottom surface of described plate frame 11, can guarantee to press against the centre position for the treatment of bonding wire region, certainly, more excellent execution mode is the height of height lower than the bottom surface of described plate frame 11 of the other end of each described paw 13, is conducive to like this treating that the centre position in bonding wire region is pressed tighter.
Several paws 13 described are divided into row pressure pawl and lower row pressure pawl, and described upper row pressure pawl and lower row pressure pawl are oppositely arranged, and paw can be uniformly distributed, play and better press against effect, improve the quality of bonding wire.
Finally should be noted that; above embodiment is only in order to illustrate the technical solution of the utility model; but not the restriction to the utility model protection range; although done to explain to the utility model with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical solution of the utility model or equivalent replacement, and not depart from essence and the scope of technical solutions of the utility model.
Claims (5)
1. the pressing plate used in lead frame and electronic devices and components wire bonding process, it is characterized in that: described pressing plate comprises the plate frame for compressing lead frame, described plate frame is provided with the window treating bonding wire region for exposing described lead frame, and described plate frame is provided with some several paws treating the non-pad locations in bonding wire region for compressing described lead frame.
2. a kind of pressing plate used in lead frame and electronic devices and components wire bonding process as claimed in claim 1, it is characterized in that: one end of each described paw is connected with the end face of described plate frame, the other end of each described paw extends to the center of described window.
3. a kind of pressing plate used in lead frame and electronic devices and components wire bonding process as claimed in claim 2, is characterized in that: the height of the other end of each described paw is identical with the height of the bottom surface of described plate frame.
4. a kind of pressing plate used in lead frame and electronic devices and components wire bonding process as claimed in claim 2, is characterized in that: the height of the other end of each described paw is lower than the height of the bottom surface of described plate frame.
5. a kind of pressing plate used in lead frame and electronic devices and components wire bonding process as claimed in claim 1, it is characterized in that: several paws described are divided into row pressure pawl and lower row pressure pawl, described upper row pressure pawl and lower row pressure pawl are oppositely arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520322743.0U CN204706546U (en) | 2015-05-19 | 2015-05-19 | A kind of pressing plate used in lead frame and electronic devices and components wire bonding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520322743.0U CN204706546U (en) | 2015-05-19 | 2015-05-19 | A kind of pressing plate used in lead frame and electronic devices and components wire bonding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204706546U true CN204706546U (en) | 2015-10-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520322743.0U Active CN204706546U (en) | 2015-05-19 | 2015-05-19 | A kind of pressing plate used in lead frame and electronic devices and components wire bonding process |
Country Status (1)
| Country | Link |
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| CN (1) | CN204706546U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878309A (en) * | 2017-05-11 | 2018-11-23 | 无锡华润安盛科技有限公司 | It is bonded pressing plate and bonding jig |
| CN112108827A (en) * | 2020-09-23 | 2020-12-22 | 珠海格力新元电子有限公司 | Plate pressing device |
-
2015
- 2015-05-19 CN CN201520322743.0U patent/CN204706546U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878309A (en) * | 2017-05-11 | 2018-11-23 | 无锡华润安盛科技有限公司 | It is bonded pressing plate and bonding jig |
| CN112108827A (en) * | 2020-09-23 | 2020-12-22 | 珠海格力新元电子有限公司 | Plate pressing device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |