CN206789537U - Surface mount rectification chip - Google Patents
Surface mount rectification chip Download PDFInfo
- Publication number
- CN206789537U CN206789537U CN201720479429.2U CN201720479429U CN206789537U CN 206789537 U CN206789537 U CN 206789537U CN 201720479429 U CN201720479429 U CN 201720479429U CN 206789537 U CN206789537 U CN 206789537U
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- Prior art keywords
- side pin
- chip
- pin
- raised item
- several
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of surface mount rectification chip, its chip is fixed on the middle section of metal pad upper surface by the glue-line that insulate, the left side of chip is arranged at several left side pin spacing side by side, is arranged at the right side of chip several right side pin spacing side by side；The lower surface of the metal pad has several continuous arc-shaped recess areas, the left side pin, the lower surface of right side pin are provided with gap slot, each lower end has the extension for extending epoxy resin cladding lower surface for the left side pin and right side pin, one left insulation raised item and right insulation raised item are located at epoxy resin cladding lower surface respectively, the left insulation raised item is between left side pin and metal pad, and the right insulation raised item is between right side pin and metal pad.The utility model surface mount rectification chip is effectively increased pin creep age distance, adds product ontology area of dissipation, reduces device and PCB conductive contact resistance, the raising for the weld strength being also beneficial between PCB.
Description
Technical field
A kind of chip-packaging structure is the utility model is related to, is related to technical field of semiconductors.
Background technology
SOP encapsulation is a kind of component encapsulation form, and common encapsulating material has:Plastics, ceramics, glass, metal etc., now
Substantially Plastic Package is used, is of wide application, is used primarily in various integrated circuits.As shown in figure 1, existing SOP encapsulation
Pad in structure is generally the single independent small pad being independently arranged corresponding to the signal pins of electronic component.But
As product power consumption stream is increasing, some SOP encapsulation chips are also used in high-current circuit, the electrification effect changed of circulation to
Certain module is powered, but corresponding pad design is more and more undesirable in the pcb for these traditional SOP encapsulation, because
Pad size area is too small, and when carrying high current, immediate current is very big, and pulse caused by electric current can incite somebody to action in very short time
Chip punctures, it is more likely that burns whole circuit, loss is very big.Traditional SOP encapsulation welding trays can not carry more high current, lead
The impact of not all right, circuit function unstable, the extremely short time high current of radiating of chip is caused to be easily damaged chip, so as to influence
The quality of product.
The content of the invention
The utility model purpose is to provide a kind of surface mount rectification chip, and the surface mount rectification chip effectively increases
Pin creep age distance, adds product ontology area of dissipation, reduces device and PCB conductive contact resistance, be also beneficial to
The raising of weld strength between PCB.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of surface mount rectification chip, including core
Piece, metal pad, several left side pins, several right side pins and epoxy resin cladding, the chip pass through insulating cement
Layer is fixed on the middle section of metal pad upper surface, is arranged at a left side for chip several left side pin spacing side by side
Side, is arranged at the right side of chip several right side pin spacing side by side, some first gold threads be located at left side pin and
Between chip, for some second gold threads between right side pin and chip, the epoxy resin cladding is coated on chip, gold
Belong to pad, several left side pins, several right side pins on；
The lower surface of the metal pad has several continuous arc-shaped recess areas, the left side pin, right side pin
Lower surface be provided with gap slot, each lower end has and extends epoxy resin cladding following table for the left side pin and right side pin
The extension in face, a left insulation raised item and right insulation raised item are located at epoxy resin cladding lower surface respectively, described left exhausted
Edge raised item between left side pin and metal pad, the right insulation raised item be located at right side pin and metal pad it
Between.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the left side pin, the metal-coated coating in the lower surface of right side pin, the metal-plated
Layer is tin layers or NiPdAu layer.
2. in such scheme, the height of the extension is 2 ~ 5mm.
3. in such scheme, the height of the left insulation raised item and right insulation raised item is 1 ~ 3mm.
4. in such scheme, the height ratio of the extension and left insulation raised item and right insulation raised item is 10：（6~
8）.
Because above-mentioned technical proposal is used, the utility model has following advantages compared with prior art：
1. the utility model surface mount rectification chip, each lower end has and prolonged for its described left side pin and right side pin
The extension of epoxy resin cladding lower surface is stretched out, a left insulation raised item and right insulation raised item are located at epoxy resin respectively
Cladding lower surface, between left side pin and metal pad, the right insulation raised item is located at the left insulation raised item
Between right side pin and metal pad, pin creep age distance is effectively increased, product ontology area of dissipation is added, improves
The reliability and security of device.
2. the utility model surface mount rectification chip, its left side pin, the metal-coated plating in the lower surface of right side pin
Layer, had both reduced device and PCB conductive contact resistance, the raising for the weld strength being also beneficial between PCB；Next, its
Left side pin, the lower surface of right side pin are provided with gap slot, are advantageous to pin and metal pad being more firmly fixed, and improve
The reliability welded between PCB；Secondly, its first metal substrate, the lower surface of the second metal substrate connect with several
Continuous arc-shaped recess area not only improves raising heat dispersion, is also beneficial to quickly discharge heat.
Brief description of the drawings
Accompanying drawing 1 is the utility model surface mount rectification chip structural representation.
In the figures above：1st, chip；2nd, metal pad；3rd, left side pin；4th, right side pin；5th, epoxy resin cladding；
6th, insulate glue-line；7th, gap slot；8th, the first gold thread；9th, the second gold thread；10th, left insulation raised item；11st, right insulation raised item；12、
Extension；13rd, the coat of metal；14th, arc-shaped recess area.
Embodiment
Below in conjunction with the accompanying drawings and embodiment is further described to the utility model：
Embodiment 1：A kind of surface mount rectification chip, including chip 1, metal pad 2, several left side pins 3, some
Individual right side pin 4 and epoxy resin cladding 5, the chip 1 are fixed in the upper surface of metal pad 2 by the glue-line 6 that insulate
Region is entreated, is arranged at the left side of chip 1, several described right side pins 4 are side by side several spacing side by side of left side pin 3
It is positioned apart from the right side of chip 1, some first gold threads 8 are between left side pin 3 and chip 1, some second gold medals
For line 9 between right side pin 4 and chip 1, the epoxy resin cladding 5 is coated on chip 1, metal pad 2, several left sides
On side pin 3, several right side pins 4；
The lower surface of the metal pad 2 has several continuous arc-shaped recess areas 14, the left side pin 3, right side
The lower surface of pin 4 is provided with gap slot 7, and the 4 respective lower end of left side pin 3 and right side pin, which has, extends epoxy resin bag
The extension 12 of the lower surface of body 5 is covered, a left insulation raised item 10 and right insulation raised item 11 are located at epoxy resin cladding 5 respectively
Lower surface, for the left insulation raised item between left side pin 3 and metal pad 2, the right insulation raised item is located at right side
Between pin 4 and metal pad 2.
Above-mentioned left side pin 3, the metal-coated coating 13 in the lower surface of right side pin 4, the coat of metal 13 are tin layers
Or NiPdAu layer.
The height of above-mentioned extension 12 is 3mm.
The height of above-mentioned left insulation raised item 10 and right insulation raised item 11 is 2mm.
Embodiment 2：A kind of surface mount rectification chip, including chip 1, metal pad 2, several left side pins 3, some
Individual right side pin 4 and epoxy resin cladding 5, the chip 1 are fixed in the upper surface of metal pad 2 by the glue-line 6 that insulate
Region is entreated, is arranged at the left side of chip 1, several described right side pins 4 are side by side several spacing side by side of left side pin 3
It is positioned apart from the right side of chip 1, some first gold threads 8 are between left side pin 3 and chip 1, some second gold medals
For line 9 between right side pin 4 and chip 1, the epoxy resin cladding 5 is coated on chip 1, metal pad 2, several left sides
On side pin 3, several right side pins 4；
The lower surface of the metal pad 2 has several continuous arc-shaped recess areas 14, the left side pin 3, right side
The lower surface of pin 4 is provided with gap slot 7, and the 4 respective lower end of left side pin 3 and right side pin, which has, extends epoxy resin bag
The extension 12 of the lower surface of body 5 is covered, a left insulation raised item 10 and right insulation raised item 11 are located at epoxy resin cladding 5 respectively
Lower surface, for the left insulation raised item between left side pin 3 and metal pad 2, the right insulation raised item is located at right side
Between pin 4 and metal pad 2.
Above-mentioned left side pin 3, the metal-coated coating 13 in the lower surface of right side pin 4, the coat of metal 13 are tin layers
Or NiPdAu layer.
The height of above-mentioned extension 12 is 4mm.
The height ratio of above-mentioned extension 12 and left insulation raised item 10 and right insulation raised item 11 is 10：7.
During using above-mentioned surface mount rectification chip, its described left side pin and right side pin each lower end have extend
The extension of epoxy resin cladding lower surface, a left insulation raised item and right insulation raised item coat positioned at epoxy resin respectively
Body lower surface, for the left insulation raised item between left side pin and metal pad, the right insulation raised item is located at right side
Between pin and metal pad, pin creep age distance is effectively increased, product ontology area of dissipation is added, improves device
Reliability and security；Again, its left side pin, the metal-coated coating in the lower surface of right side pin, both reduce device
With PCB conductive contact resistance, the raising for the weld strength being also beneficial between PCB；Secondly, its left side pin, right side are drawn
The lower surface of pin is provided with gap slot, is advantageous to pin and metal pad being more firmly fixed, improves and welded between PCB
Reliability；Secondly, its first metal substrate, the lower surface of the second metal substrate had had several continuous arc-shaped recess areas both
Be advantageous to improve heat dispersion, be also beneficial to quickly discharge heat.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (5)
1. a kind of surface mount rectification chip, including chip（1）, metal pad（2）, several left side pins（3）, several are right
Side pin（4）With epoxy resin cladding（5）, the chip（1）Pass through the glue-line that insulate（6）It is fixed on metal pad（2）Upper table
The middle section in face, several described left side pins（3）It is arranged at chip spacing side by side（1）Left side, several described right sides
Side pin（4）It is arranged at chip spacing side by side（1）Right side, some first gold threads（8）Positioned at left side pin（3）And chip
（1）Between, some second gold threads（9）Positioned at right side pin（4）And chip（1）Between, the epoxy resin cladding（5）Bag
It is overlying on chip（1）, metal pad（2）, several left side pins（3）, several right side pins（4）On；
It is characterized in that：The metal pad（2）Lower surface there are several continuous arc-shaped recess areas（14）, the left side
Pin（3）, right side pin（4）Lower surface be provided with gap slot（7）, the left side pin（3）With right side pin（4）Respective lower end
With extending epoxy resin cladding（5）The extension of lower surface（12）, a left insulation raised item（10）It is raised with right insulation
Bar（11）It is located at epoxy resin cladding respectively（5）Lower surface, the left insulation raised item（10）Positioned at left side pin（3）And gold
Belong to pad（2）Between, the right insulation raised item（11）Positioned at right side pin（4）And metal pad（2）Between.
2. surface mount rectification chip according to claim 1, it is characterised in that：The left side pin（3）, right side pin
（4）The metal-coated coating in lower surface（13）, the coat of metal（13）For tin layers or NiPdAu layer.
3. surface mount rectification chip according to claim 1, it is characterised in that：The extension（12）Height for 2 ~
5mm。
4. surface mount rectification chip according to claim 1, it is characterised in that：The left insulation raised item（10）And the right side
Insulate raised item（11）Height be 1 ~ 3mm.
5. surface mount rectification chip according to claim 1, it is characterised in that：The extension（12）It is convex with left insulation
Play bar（10）With right insulation raised item（11）Height ratio be 10：（6~8）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720479429.2U CN206789537U (en) | 2017-05-02 | 2017-05-02 | Surface mount rectification chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720479429.2U CN206789537U (en) | 2017-05-02 | 2017-05-02 | Surface mount rectification chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206789537U true CN206789537U (en) | 2017-12-22 |
Family
ID=60709690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720479429.2U Active CN206789537U (en) | 2017-05-02 | 2017-05-02 | Surface mount rectification chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206789537U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904125A (en) * | 2019-03-06 | 2019-06-18 | 西安航思半导体有限公司 | The preparation method of high temperature resistant QFN encapsulating structure |
| CN109904124A (en) * | 2019-03-06 | 2019-06-18 | 西安航思半导体有限公司 | QFN encapsulating structure with anti-short-circuit function |
-
2017
- 2017-05-02 CN CN201720479429.2U patent/CN206789537U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904125A (en) * | 2019-03-06 | 2019-06-18 | 西安航思半导体有限公司 | The preparation method of high temperature resistant QFN encapsulating structure |
| CN109904124A (en) * | 2019-03-06 | 2019-06-18 | 西安航思半导体有限公司 | QFN encapsulating structure with anti-short-circuit function |
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