CN206992085U - High heat conduction power device - Google Patents
High heat conduction power device Download PDFInfo
- Publication number
- CN206992085U CN206992085U CN201720167735.2U CN201720167735U CN206992085U CN 206992085 U CN206992085 U CN 206992085U CN 201720167735 U CN201720167735 U CN 201720167735U CN 206992085 U CN206992085 U CN 206992085U
- Authority
- CN
- China
- Prior art keywords
- chip
- metal pad
- shaped metal
- side pin
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 106
- 239000002184 metal Substances 0.000 claims abstract description 106
- 239000011521 glass Substances 0.000 claims abstract description 29
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 238000005253 cladding Methods 0.000 claims abstract description 15
- 241000218202 Coptis Species 0.000 claims description 10
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 10
- 238000007373 indentation Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 2
- 239000010426 asphalt Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 11
- 230000009977 dual effect Effects 0.000 abstract description 4
- 238000004021 metal welding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of high heat conduction power device, including the first chip, the second chip, the first L-shaped metal pad, the second L-shaped metal pad, several left side pins, several right side pins and epoxy resin cladding；First chip, the second chip respectively by the glue-line that insulate be fixed on the first L-shaped metal pad, the second L-shaped metal pad respective slide glass area upper surface middle section, it is arranged at the first chip, the left side of the second chip several left side pin spacing side by side, is arranged at the first chip, the right side of the second chip several right side pin spacing side by side；Left side pin and the respective inner side end of right side pin have the left trapezoidal groove and right trapezoidal groove for filling epoxy resin.The utility model is advantageous to pin and metal pad being more firmly fixed, improve the reliability welded between PCB, also so that chip quickly conducts heat at work, two chips that need to isolate is encapsulated in an encapsulating structure, realize dual chip encapsulation function.
Description
Technical field
A kind of chip-packaging structure is the utility model is related to, is related to technical field of semiconductors.
Background technology
SOP encapsulation is a kind of component encapsulation form, and common encapsulating material has:Plastics, ceramics, glass, metal etc., now
Substantially Plastic Package is used, is of wide application, is used primarily in various integrated circuits.As shown in figure 1, existing SOP encapsulation
Pad in structure is generally the single independent small pad being independently arranged corresponding to the signal pins of electronic component.But
As product power consumption stream is increasing, some SOP encapsulation chips are also used in high-current circuit, the electrification effect changed of circulation to
Certain module is powered, but corresponding pad design is more and more undesirable in the pcb for these traditional SOP encapsulation, because
Pad size area is too small, and when carrying high current, immediate current is very big, and pulse caused by electric current can incite somebody to action in very short time
Chip punctures, it is more likely that burns whole circuit, loss is very big.Traditional SOP encapsulation welding trays can not carry more high current, lead
The impact of not all right, circuit function unstable, the extremely short time high current of radiating of chip is caused to be easily damaged chip, so as to influence
The quality of product.
The content of the invention
The utility model purpose is to provide a kind of high heat conduction power device, and the high heat conduction power device is in an encapsulating structure
Two chips that middle encapsulation need to be isolated, realize dual chip encapsulation function, and are advantageous to pin and metal pad is more firm
Fixation, improve the reliability welded between PCB.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of high heat conduction power device, including first
Chip, the second chip, the first L-shaped metal pad, the second L-shaped metal pad, several left side pins, several right side pins and
Epoxy resin cladding；
The first L-shaped metal pad, the second L-shaped metal pad by slide glass area and are connected at the top of slide glass area one end
Rod-type extension forms, and the slide glass area of the first L-shaped metal pad is embedded in the indentation, there of the second L-shaped metal pad, and described the
The slide glass area of two L-shaped metal pads is embedded in the indentation, there of the first L-shaped metal pad；
First chip, the second chip are fixed on the first L-shaped metal pad, the second L-shaped gold by the glue-line that insulate respectively
Belong to the middle section of pad respective slide glass area upper surface, be arranged at the first core several left side pin spacing side by side
The left side of piece, the second chip, it is arranged at the first chip, the right side of the second chip several right side pin spacing side by side,
The first L-shaped metal pad, the second L-shaped metal pad its lower edge are provided with the first gap slot, the left side pin with
The opposite medial extremity bottom of first L-shaped metal pad, the second L-shaped metal pad is provided with left trapezoidal groove, the right side pin with
The opposite medial extremity bottom of first L-shaped metal pad, the second L-shaped metal pad is provided with right trapezoidal groove, the epoxy resin bag
Cover body and be coated on chip, the first L-shaped metal pad, the second L-shaped metal pad, several left side pins, several right side pins
On, the first L-shaped metal pad, the second L-shaped metal pad, left side pin and the respective lower surface of right side pin expose ring
The bottom of oxygen tree fat cladding；
Some first gold thread both ends electrically connect with the first chip, the second chip and left side pin respectively, some second
Gold thread both ends electrically connect with the first chip, the second chip and right side pin respectively, and the left side pin and right side pin are respective
Inner side end has the left trapezoidal groove and right trapezoidal groove for filling epoxy resin.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the number of the left side pin and right side pin is 3 ~ 10.
2. in such scheme, the coat of metal is tin layers or NiPdAu layer.
3. in such scheme, the coat of metal is 1 with the thickness ratio of left side pin or right side pin：6~12.
Because above-mentioned technical proposal is used, the utility model has following advantages compared with prior art：
1. the utility model high heat conduction power device, its first chip, the second chip, the first L-shaped metal pad, the 2nd L
Shape metal pad, several left side pins, several right side pins and epoxy resin cladding, the first L-shaped metal pad, second
L-shaped metal pad forms by slide glass area and the rod-type extension being connected at the top of slide glass area one end, the first L-shaped metal welding
The slide glass area of disk is embedded in the indentation, there of the second L-shaped metal pad, and the slide glass area of the second L-shaped metal pad is embedded in the first L-shaped
The indentation, there of metal pad；Because being provided with Liang Ge slide glasses area, two chips that need to isolate are encapsulated in an encapsulating structure, it is real
Dual chip encapsulation function is showed.
2. the utility model high heat conduction power device, its metal pad its lower edge is provided with the first gap slot, and left side is drawn
Pin and the respective inner side end of right side pin have left trapezoidal groove and right trapezoidal groove, in pin inner side end
Between area filling have epoxy resin, not only improve and pin and metal pad be more firmly fixed, also accordingly increase pin
The area of bottom, so as to improve the reliability welded between PCB and reduce contact resistance；Secondly, its chip passes through insulation
Glue-line is fixed on the middle section of metal pad upper surface, and metal pad, left side pin and the respective lower surface of right side pin are naked
Expose the bottom of epoxy resin cladding, exposed metal pad, so that chip quickly conducts heat, radiating effect at work
It is good.
3. the utility model high heat conduction power device, its left side pin, the metal-coated plating in the lower surface of right side pin
Layer, had both reduced device and PCB conductive contact resistance, the raising for the weld strength being also beneficial between PCB.
Brief description of the drawings
Accompanying drawing 1 is the utility model high heat conduction power unit structure schematic diagram；
Accompanying drawing 2 is the A-A cross-sectional views of accompanying drawing 1.
In the figures above：101st, the first chip；102nd, the second chip；201st, the first L-shaped metal pad；202nd, the second L-shaped
Metal pad；3rd, left side pin；4th, right side pin；5th, epoxy resin cladding；6th, insulate glue-line；7th, the first gap slot；8th, it is left
Trapezoidal groove；9th, right trapezoidal groove；15th, the first gold thread；16th, the second gold thread；17th, the coat of metal；21st, slide glass area；22nd, it is shaft-like to prolong
Extending portion.
Embodiment
Below in conjunction with the accompanying drawings and embodiment is further described to the utility model：
Embodiment 1：A kind of high heat conduction power device, including the first chip 101, the second chip 102, the first L-shaped metal welding
Disk 201, the second L-shaped metal pad 202, several left side pins 3, several right side pins 4 and epoxy resin cladding 5；
The first L-shaped metal pad 201, the second L-shaped metal pad 202 by slide glass area 21 and are connected to slide glass area 21
Rod-type extension 22 at the top of one end forms, and the slide glass area 21 of the first L-shaped metal pad 201 is embedded in the second L-shaped metal welding
The indentation, there of disk 202, the slide glass area 21 of the second L-shaped metal pad 202 are embedded in the indentation, there of the first L-shaped metal pad 201；
First chip 101, the second chip 102 respectively by the glue-line 6 that insulate be fixed on the first L-shaped metal pad 201,
The middle section of second L-shaped metal pad, the 202 respective upper surface of slide glass area 21, several described spacing side by side of left side pin 3
Ground is arranged at the first chip 101, the left side of the second chip 102, is arranged at first several spacing side by side of right side pin 4
The right side of chip 101, the second chip 102, the first L-shaped metal pad 201, its lower edge of the second L-shaped metal pad 202
It is provided with the first gap slot 7, the L-shaped metal pad 201 of left side pin 3 and first, the second L-shaped metal pad 202 are opposite
Medial extremity bottom is provided with left trapezoidal groove 8, the L-shaped metal pad 201 of right side pin 4 and first, the second L-shaped metal pad
202 opposite medial extremity bottoms are provided with right trapezoidal groove 9, and the epoxy resin cladding 5 is coated on chip 1, the first L-shaped metal
Pad 201, the second L-shaped metal pad 202, several left side pins 3, several right side pins 4 on, the first L-shaped metal
Pad 201, the second L-shaped metal pad 202, left side pin 3 and 4 respective lower surface of right side pin expose epoxy resin cladding
The bottom of body 5；
Some both ends of first gold thread 15 electrically connect with the first chip 101, the second chip 102 and left side pin 3 respectively, if
The dry both ends of the second gold thread of root 16 electrically connect with the first chip 101, the second chip 102 and right side pin 4 respectively, the left side pin
3 and 4 respective inner side end of right side pin have for filling epoxy resin left trapezoidal groove 8 and right trapezoidal groove 9.
Above-mentioned left side pin 3, the metal-coated coating 17 in the lower surface of right side pin 4；The above-mentioned coat of metal 17 is tin layers.
The above-mentioned coat of metal 17 is 1 with the thickness ratio of left side pin 3 or right side pin 4：7；Above-mentioned left side pin 3 and the right side
The number of side pin 4 is 8.
Embodiment 2：A kind of high heat conduction power device, including the first chip 101, the second chip 102, the first L-shaped metal welding
Disk 201, the second L-shaped metal pad 202, several left side pins 3, several right side pins 4 and epoxy resin cladding 5；
The first L-shaped metal pad 201, the second L-shaped metal pad 202 by slide glass area 21 and are connected to slide glass area 21
Rod-type extension 22 at the top of one end forms, and the slide glass area 21 of the first L-shaped metal pad 201 is embedded in the second L-shaped metal welding
The indentation, there of disk 202, the slide glass area 21 of the second L-shaped metal pad 202 are embedded in the indentation, there of the first L-shaped metal pad 201；
First chip 101, the second chip 102 respectively by the glue-line 6 that insulate be fixed on the first L-shaped metal pad 201,
The middle section of second L-shaped metal pad, the 202 respective upper surface of slide glass area 21, several described spacing side by side of left side pin 3
Ground is arranged at the first chip 101, the left side of the second chip 102, is arranged at first several spacing side by side of right side pin 4
The right side of chip 101, the second chip 102, the first L-shaped metal pad 201, its lower edge of the second L-shaped metal pad 202
It is provided with the first gap slot 7, the L-shaped metal pad 201 of left side pin 3 and first, the second L-shaped metal pad 202 are opposite
Medial extremity bottom is provided with left trapezoidal groove 8, the L-shaped metal pad 201 of right side pin 4 and first, the second L-shaped metal pad
202 opposite medial extremity bottoms are provided with right trapezoidal groove 9, and the epoxy resin cladding 5 is coated on chip 1, the first L-shaped metal
Pad 201, the second L-shaped metal pad 202, several left side pins 3, several right side pins 4 on, the first L-shaped metal
Pad 201, the second L-shaped metal pad 202, left side pin 3 and 4 respective lower surface of right side pin expose epoxy resin cladding
The bottom of body 5；
Some both ends of first gold thread 15 electrically connect with the first chip 101, the second chip 102 and left side pin 3 respectively, if
The dry both ends of the second gold thread of root 16 electrically connect with the first chip 101, the second chip 102 and right side pin 4 respectively, the left side pin
3 and 4 respective inner side end of right side pin have for filling epoxy resin left trapezoidal groove 8 and right trapezoidal groove 9.
Above-mentioned left side pin 3, the metal-coated coating 17 in the lower surface of right side pin 4；The coat of metal 17 is nickel palladium
Layer gold.
The above-mentioned coat of metal 17 is 1 with the thickness ratio of left side pin 3 or right side pin 4：11；The above-mentioned He of left side pin 3
The number of right side pin 4 is 4.
During using above-mentioned high heat conduction power device, it is encapsulated because being provided with Liang Ge slide glasses area in an encapsulating structure
Two chips that need to isolate, realize dual chip encapsulation function；Secondly, be advantageous to pin and metal pad is more solid
It is fixed, improve the reliability welded between PCB；Again, its exposed metal pad, so that chip quickly conducts at work
Heat, good heat dissipation effect；Again, it effectively prevent, missing solder and the problem of rosin joint, both improved the carrying electric current of device, and also improved
The stability and reliability of integrated chip.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (4)
- A kind of 1. high heat conduction power device, it is characterised in that：Including the first chip（101）, the second chip（102）, the first L-shaped gold Belong to pad（201）, the second L-shaped metal pad（202）, several left side pins（3）, several right side pins（4）And asphalt mixtures modified by epoxy resin Fat cladding（5）；The first L-shaped metal pad（201）, the second L-shaped metal pad（202）By slide glass area（21）Be connected to slide glass area （21）Rod-type extension at the top of one end（22）Composition, the first L-shaped metal pad（201）Slide glass area（21）Embedded second L-shaped metal pad（202）Indentation, there, the second L-shaped metal pad（202）Slide glass area（21）Embedded first L-shaped metal Pad（201）Indentation, there；First chip（101）, the second chip（102）Pass through the glue-line that insulate respectively（6）It is fixed on the first L-shaped metal pad （201）, the second L-shaped metal pad（202）Respective slide glass area（21）The middle section of upper surface, several described left side pins （3）It is arranged at the first chip spacing side by side（101）, the second chip（102）Left side, several described right side pins（4）And Row is positioned apart from the first chip（101）, the second chip（102）Right side, the first L-shaped metal pad（201）, second L-shaped metal pad（202）Its lower edge is provided with the first gap slot（7）, the epoxy resin cladding（5）It is coated on chip （1）, the first L-shaped metal pad（201）, the second L-shaped metal pad（202）, several left side pins（3）, several right side draw Pin（4）On, the first L-shaped metal pad（201）, the second L-shaped metal pad（202）, left side pin（3）With right side pin （4）Respective lower surface exposes epoxy resin cladding（5）Bottom；Some first gold threads（15）Both ends respectively with the first chip（101）, the second chip（102）With left side pin（3）It is electrically connected Connect, some second gold threads（16）Both ends respectively with the first chip（101）, the second chip（102）With right side pin（4）It is electrically connected Connect, the left side pin（3）With right side pin（4）Respective inner side end is had for the left trapezoidal recessed of filling epoxy resin Groove（8）With right trapezoidal groove（9）；The left side pin（3）, right side pin（4）The metal-coated coating in lower surface（17）.
- 2. high heat conduction power device according to claim 1, it is characterised in that：The left side pin（3）With right side pin （4）Number be 3 ~ 10.
- 3. high heat conduction power device according to claim 1 or 2, it is characterised in that：The coat of metal（17）For tin layers Or NiPdAu layer.
- 4. high heat conduction power device according to claim 3, it is characterised in that：The coat of metal（17）With left side pin （3）Or right side pin（4）Thickness ratio be 1：6~12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720167735.2U CN206992085U (en) | 2017-02-23 | 2017-02-23 | High heat conduction power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720167735.2U CN206992085U (en) | 2017-02-23 | 2017-02-23 | High heat conduction power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206992085U true CN206992085U (en) | 2018-02-09 |
Family
ID=61422125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720167735.2U Expired - Fee Related CN206992085U (en) | 2017-02-23 | 2017-02-23 | High heat conduction power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206992085U (en) |
-
2017
- 2017-02-23 CN CN201720167735.2U patent/CN206992085U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180209 |