CN206322729U

CN206322729U - CSP LED encapsulation structures

Info

Publication number: CN206322729U
Application number: CN201621451608.7U
Authority: CN
Inventors: 林书弘
Original assignee: Shenzhen City Branch Yixing Optoelectronic Technology Co Ltd
Current assignee: Shenzhen City Branch Yixing Optoelectronic Technology Co Ltd
Priority date: 2016-12-27
Filing date: 2016-12-27
Publication date: 2017-07-11
Anticipated expiration: 2026-12-27

Abstract

The utility model discloses a kind of CSP LED encapsulation structures, wherein, CSP LED encapsulation structures include chip body, pad, packaging plastic and sheet metal；Pad is located at the one side of the chip body, and the pad is the electrode of the chip body；Packaging plastic wraps up the chip body, and the packaging plastic has the opening of the exposure pad；Sheet metal located at the pad back to one side be connected with the chip body, and area of the area more than the pad of the sheet metal.Technical solutions of the utility model reduction CSP LED attachment process difficulty simultaneously meets demand of the market for different CSP LED monomer input voltages.

Description

CSP LED encapsulation structures

Technical field

The utility model is related to technical field of semiconductors, more particularly to a kind of CSP LED encapsulation structures.

Background technology

Because in LED markets, client is just continued to increase using the ratio of the power source design of linear integrated circuit, and this kind of Power source design needs the CSP (Chip Scale Package wafer-level packages) of 9V, 18V, 36V, 48V or more voltage envelope Monomer is filled to coordinate circuit to design.But commercially available CSP chips are provided without a variety of high operation voltage styles and the both positive and negative polarity of bottom is welded Disc area is smaller, and combination attachment difficulty is high between causing multiple CSP chips.

Utility model content

Main purpose of the present utility model is to provide a kind of CSP LED encapsulation structures, it is intended to reduce CSP LED attachment work Skill difficulty and provide market diversification high pressure CSP LED selection.

To achieve the above object, the utility model proposes CSP LED encapsulation structures include：

Chip body；

Pad, located at the one side of the chip body, and the pad is the electrode of the chip body；

Packaging plastic, wraps up the chip body, and the packaging plastic has the opening of the exposure pad；

Sheet metal, the one side connected located at the pad away from the chip body, and the area of the sheet metal are more than The area of the minimum electrode on chip.

Preferably, the pad includes positive electrode and electrode；The area of the sheet metal be more than a positive electrode or The area of one negative electrode；Pass through the serial or parallel conducting of the sheet metal between multiple chip bodies.

Preferably, the sheet metal is welded in the positive electrode or the negative electricity in two adjacent chip bodies Pole.

Preferably, the chip of the CSP LED encapsulation structures is flip-chip.

Preferably, the packaging plastic is layer of silica gel.

Preferably, the packaging plastic contains fluorescent material.

Preferably, the bond pad surface has metal level.

Technical solutions of the utility model by pad back to setting up a sheet metal in the one side being connected with chip body, profit Increase the bonding area of pad with sheet metal, so that allow the electrode of chip body to be easier to be attached with remaining chip body, And pass through the arrangement design of different metal piece to reach the series design of a plurality of chips.

Brief description of the drawings

, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only It is some embodiments of the present utility model, for those of ordinary skill in the art, is not paying the premise of creative work Under, other accompanying drawings can also be obtained according to the structure shown in these accompanying drawings.

Fig. 1 is the utility model CSP LED structural representation；

Fig. 2 is the structural representation of the embodiment of the utility model CSP LED encapsulation structures one；

Fig. 3 is the sectional view that multiple CSP LED encapsulation structures are connected；

Fig. 4 is the top view that multiple CSP LED encapsulation structures are connected.

Drawing reference numeral explanation：

Label	Title	Label	Title
				100	Chip body	200	Pad
210	Positive electrode	220	Negative electrode
				300	Packaging plastic	400	Sheet metal

Realization, functional characteristics and the advantage of the utility model purpose will be described further referring to the drawings in conjunction with the embodiments.

Embodiment

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present utility model, rather than all Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise Lower obtained every other embodiment, belongs to the scope of the utility model protection.

It is to be appreciated that institute is directional in the utility model embodiment indicates (such as up, down, left, right, before and after ...) Relative position relation, motion conditions for being only used for explaining under a certain particular pose (as shown in drawings) between each part etc., such as When really the particular pose changes, then directionality indicates also correspondingly therewith to change.

In addition, the description for being related to " first ", " second " etc. in the utility model is only used for describing purpose, without being understood that To indicate or implying its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", At least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the technical side between each embodiment Case can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical scheme It will be understood that the combination of this technical scheme is not present when appearance is conflicting or can not realize, also not in the utility model requirement Protection domain within.

The utility model proposes a kind of CSP LED encapsulation structures.

In the utility model embodiment, reference picture 1, Fig. 2 and Fig. 4, the CSP LED encapsulation structures include chip body 100；

Pad 200, located at the one side of the chip body 100, and the pad 200 is the electricity of the chip body 100 Pole；

Packaging plastic 300, wraps up the chip body 100, and the packaging plastic 300 has the opening of the exposure pad 200；

Sheet metal 400, located at the pad 200 back to the one side being connected with the chip body 100, and the sheet metal Area be more than the pad 200 area.

Specifically, pad 200 is used to connect chip body 100 and printed substrate, realizes the electricity of CSP LED encapsulation structures Property conduction.Chip body 100 uses welding manner with printed substrate, improves the connection of chip body 100 and printed substrate Intensity.Opening on packaging plastic 300 can allow pad 200 to expose outside, will pass through the connection He of chip body 100 of pad 200 Printed substrate.CSP LED are the encapsulation of the chip, i.e. chip circumference cladding of (Chip Scale Package) wafer-level package Colloid is close to chip size, therefore this kind of CSP LED size is smaller, so the area of pad 200 is smaller.Thus, in CSP In LED actual production process, the production equipment that the less chip of the area of pad 200 needs accuracy higher is welded and grabbed Take, directly increase CSP LED attachment process difficulty.It is small in order to solve the area of pad 200, the problem of hardly possible is mounted, thus in CSP On the basis of LED, in pad 200 back to setting a sheet metal 400 in the one side being connected with the chip body 100.Sheet metal 400 area is more than the area of pad 200, and such pad 200 (electrode of chip body 100) mounts process with printed substrate In, sheet metal 400 adds bonding area so that printed substrate more holds as the extension pad of the electrode of chip body 100 Easily welded by greater area of sheet metal 400 and chip body 100, and bigger bonding strength can be formed.For example:1. metal The length of piece 400 is more than the length of pad 200；2. the width of sheet metal 400 is more than the width of pad 200.Preferably, the envelope Dress glue 300 is layer of silica gel, because silica gel is a kind of high stability material, is not occurred instead with any material in addition to highly basic, hydrofluoric acid Should, water insoluble and any solvent is nonpoisonous and tasteless, and heat endurance is good, stable chemical nature, have higher mechanical strength etc. excellent Point.

Technical solutions of the utility model by pad 200 back to setting up a gold medal in the one side being connected with chip body 100 Belong to piece 400, increase the bonding area of pad 200 using sheet metal 400, so as to allow the electrode of chip body 100 to be easier and it Remaining chip body 100 is attached, and passes through the arrangement design of different metal piece 400 to reach a plurality of CSP LED series connection Design.

Further, reference picture 3 and Fig. 4, the pad 200 include a positive electrode 210 and a negative electrode 220；Institute The area for stating sheet metal 400 is more than the area of a positive electrode 210 or a negative electrode 220；Multiple chips Pass through the serial or parallel conducting of the sheet metal 400 between body 100.Thus, sheet metal 400 can cover two adjacent chips Positive electrode 210 and negative electrode 220 between body, realize the serial or parallel of multiple chip bodies, to form bigger voltage CSP LED groups, adapt to the use of the power source design of linear integrated circuit.

Further, reference picture 3, the sheet metal 400 is welded in described in the chip body 100 of adjacent two Positive electrode 210 or the negative electrode 220 are using welding.Thus, improving sheet metal 400 and positive electrode 210 or negative electrode 220 Bonding strength, while improving the package reliability of CSP LED encapsulation structures.

Preferably, reference picture 1, the chip of the CSP LED encapsulation structures is flip-chip.In the present embodiment, CSP LED The chip preferred flip chip chip of encapsulating structure, because the thermal property of the encapsulation technology of flip-chip is substantially superior to conventional use Lead key closing process.And it is all very outstanding in terms of the packaging density and processing speed of flip-chip.

Preferably, reference picture 1, the surface of pad 200 has transition metal layer (not shown).It is arranged such, it is described Transition metal layer plays a part of non-proliferation, increase adhesion and protection pad 200.The technique for forming the transition metal layer can Think physical vapour deposition (PVD), chemical vapor deposition, electrochemical deposition and electroplating technology.The transition metal layer can be NiPdAu Layer, Ag layers, one or more of laminations in Ti layers, Ta layers, TiN layer, TaN layers, Cu layers or Cu alloy-layers.The transition gold The thickness for belonging to layer is 0.1 μm to 3 μm.

Preferred embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, It is every under inventive concept of the present utility model, the equivalent structure made using the utility model specification and accompanying drawing content is become Change, or directly/be used in other related technical fields indirectly and be included in scope of patent protection of the present utility model.

Claims

1. a kind of CSP LED encapsulation structures, it is characterised in that including：

Chip body；

Sheet metal, the area located at one side of the pad away from the chip body, and the sheet metal is more than the pad Area.

2. CSP LED encapsulation structures as claimed in claim 1, it is characterised in that the pad includes a positive electrode and one Individual negative electrode；The area of the sheet metal is more than the area of a positive electrode or a negative electrode；Multiple cores Pass through the serial or parallel conducting of the sheet metal between piece main body.

3. CSP LED encapsulation structures as claimed in claim 2, it is characterised in that the sheet metal is welded in adjacent two The positive electrode or the negative electrode in the chip body.

4. the CSP LED encapsulation structures as described in any one in claims 1 to 3, it is characterised in that the CSP LED envelopes The chip of assembling structure is flip-chip.

5. CSP LED encapsulation structures as claimed in claim 4, it is characterised in that the packaging plastic is layer of silica gel.

6. CSP LED encapsulation structures as claimed in claim 5, it is characterised in that the packaging plastic contains fluorescent material.

7. CSP LED encapsulation structures as claimed in claim 6, it is characterised in that the bond pad surface has transition metal layer.