CN208157452U

CN208157452U - A kind of flip LED luminescent device

Info

Publication number: CN208157452U
Application number: CN201721410712.6U
Authority: CN
Inventors: 侯宇; 全美君; 姜志荣; 万垂铭; 曾照明
Original assignee: Guangdong APT Electronics Ltd
Current assignee: Guangdong APT Electronics Ltd
Priority date: 2017-10-27
Filing date: 2017-10-27
Publication date: 2018-11-27
Anticipated expiration: 2027-10-27

Abstract

The utility model relates to the LED chip fields of light emitting diode, more particularly to a kind of flip LED chips luminescent device.The flip LED luminescent device includes bracket, flip LED chips, and the flip LED chips are fixed on the bracket by tin cream, and the positive crystal bonding area of the bracket and the outside of cathode crystal bonding area are each provided with an insulation box dam isolation strip.On the one hand, by respectively increasing by a box dam insulating tape outside bracket positive and negative electrode die bond section, the connection of positive and negative anodes caused by preventing tin cream from flowing causes leaky；On the other hand, one layer of thermal plastic insulation is coated in positive and negative electrode die bond section, can also effectively prevent leaking electricity while heat dissipation can be increased, increase yields.

Description

A kind of flip LED luminescent device

Technical field

The utility model relates to the LED chip fields of light emitting diode, more particularly to a kind of flip LED luminescent device.

Background technique

With the fast development of LED Related product technology, flip LED chips are by feat of its advantage：First is that not over indigo plant Jewel heat dissipation can lead to high current use；Second is that size can accomplish smaller, optics more easily matching；Third is that heat sinking function mentions It rises, the service life of chip is made to be improved；Fourth is that the promotion of antistatic effect；The focus on research direction of LED industry is had become, so And there are still leakage current (IR) problems for the encapsulation of LED chip.

In existing flip LED chips encapsulation technology, have through eutectic welding technology, so that LED chip and rest body Good welding is carried out, and avoids IR problem, but the Technical investment is at high cost, and temperature is up to 320 DEG C in eutectic welding technology, this It is the conventional unaffordable application conditions of SMD plastic rubber bracket and white oil class rest body institute, which has been more than plastic cement melting Temperature, easily leads to its melting deformation, white oil xanthochromia, and reflectivity sharply declines.

LED chip is although practical using tin cream die bond technology, and cost performance is high.But since tin cream is flowing back after encapsulating Melting direction when weldering is uncontrollable, and the positive and negative anodes of tin cream flowing conducting LED chip bottom occurs, to IR problem occur.

Some is fluted in the setting of the negative regions of flip LED bracket, and tin cream can be uniformly filled in groove, when Reflow Soldering Melting tin cream will not move offset, to avoid IR problem caused by the melting offset of encapsulation process tin cream.But positive and negative anodes are conductive Material thickness is limited, and the depth of groove is very restricted, and is shallowly difficult to achieve the effect that tin cream is isolated excessively, deepens the depth of groove Degree, which may require that, increases positive and negative anodes conductive material thickness, considerably increases flip LED bracket cost.

Utility model content

The technical purpose of the utility model is the encapsulation for above-mentioned LED chip there are still leakage current (IR) problem, is mentioned For a kind of flip LED luminescent device.

The technical purpose of the utility model is achieved through the following technical solutions：

Flip LED luminescent device described in the utility model, including bracket, flip LED chips, the flip LED chips Fixed on the bracket by tin cream, the positive crystal bonding area of the bracket and the outside of cathode crystal bonding area are each provided with an insulation Box dam isolation strip.

Specifically, the bracket includes copper sheet and the rest body that copper sheet both ends are arranged in, the insulation to the utility model The rest body that interband is isolated in box dam is equipped with thermal plastic insulation.

Specifically, the insulation box dam isolation strip is in vertical bar shaped and is parallel to each other for the utility model, or forms circular arc type.

Preferably, the height of the insulation box dam isolation strip is 0.1~0.2mm to the utility model.

One kind as the utility model is preferably coated with packing colloid and fluorescence on the surface of the flip LED chips The mixed layer of powder, or it is coated with packing colloid layer.

Specifically, the insulation box dam isolation strip is plastic cement insulation box dam isolation strip to the utility model；The rest body For plastic rubber bracket matrix；The preferably described insulation box dam, rest body use PA6T, PA9T, PA10, PCT or LCP；More preferably Ground uses PA6T, PA9T or PCT plastic cement.

Specifically, the thermal plastic insulation is organic insulation silicon heat-conducting glue to the utility model；Preferably epoxide resin AB Glue, titanium pentoxide, polyurethane adhesive or heat-conducting silicone grease.

The utility model is it is highly preferred that the bracket is patch type bracket or flat bracket.

The flip LED luminescent device of the utility model has the following advantages that relative to existing LED light emitting device:

1. positive and negative anodes connection caused by insulation box dam isolation strip can effectively prevent tin cream to flow causes leaky；

2. coating one layer of thermal plastic insulation between positive crystal bonding area, cathode crystal bonding area, can accelerate can also while heat dissipation It effectively prevent leaking electricity, increases yields.

Detailed description of the invention

Fig. 1 is that the LED support of the utility model is applied to the integrally-built side diagrammatic cross-section after white-light LED encapsulation.

Fig. 2 is that the LED support of the utility model is applied to the integrally-built side section signal after RGB glory LED encapsulation Figure.

Fig. 3 is the integrally-built top view after the LED support application LED encapsulation of the utility model.

The top view of (insulation box dam isolation strip) another embodiment that Fig. 4 is Fig. 3.

Description of symbols：

1, tin cream；2, insulation box dam isolation strip；3, thermal plastic insulation；4, flip LED chips；5, fluorescent powder and packaging plastic Body mixed layer；6, rest body；7, packing colloid layer；8, copper sheet.

Specific embodiment

Specific embodiment of the utility model is described in detail below in conjunction with attached drawing.

Embodiment 1

Fig. 1, Fig. 3 are please referred to, the flip LED luminescent device in the utility model embodiment 1 includes bracket, flip LED core Piece (4).The bracket includes copper sheet (8) and the rest body (6) that the copper sheet both ends are arranged in.The flip LED chips (4) Fixed on the bracket by tin cream (1), the positive crystal bonding area of the bracket and the outside of cathode crystal bonding area (could also say that The outside of tin cream (1)), it is located on the rest body (6) and is each provided with an insulation box dam isolation strip (2).The insulation described in this way Isolation strip (2) can separate the anode and cathode of flip LED chips, and the tin cream (1) can be prevented to flow caused positive and negative anodes Connection causes leaky.The flip LED chips (4) are fixed on the insulation box dam isolation strip (2) by tin cream (1) Side.

It is filled full thermal plastic insulation (3) on rest body (6) between insulation box dam isolation strip (2), it is described glimmering The mixed layer (5) of light powder and packaging plastic is coated on the surface of the LED chip (4).The insulation box dam isolation strip (2) and institute Stating rest body (6) can be used plastic rubber material, and identical plastic rubber material can be used, and the insulation box dam isolation strip (2) It can be with integrated injection molding with the rest body (6).

Preferably, the material of insulation box dam isolation strip (2) and the rest body (6) is thermoplastic resin PPA (Polyphthalamide), all kinds of specifically, PPA plastic cement can be subdivided into 5 class such as PA6T, PA9T, PA10, PCT, LCP again Plastic material molecular structure, additive and content of glass fiber are different, and function emphasizes particularly on different fields, it is most widely used for PA6T, PA9T and PCT plastic cement.

Preferably, the material of the thermal plastic insulation (3) is organosilicon heat-conducting glue, specifically, organosilicon heat-conducting glue It is subdivided into epoxy resin AB glue, titanium pentoxide, polyurethane adhesive, heat-conducting silicone grease etc..

The preparation method of LED light emitting device described in embodiment 1, includes the following steps：

S1：Flip LED chips (4) are fixed on bracket by tin cream (1), then in the positive crystal bonding area of the bracket An insulation box dam isolation strip (2) is respectively set with the outside of cathode crystal bonding area；

S2：Thermal plastic insulation (3) are coated between the insulation box dam isolation strip (2)；

S3：Then coating/filling packaging plastic and fluorescent powder mixed layer on the surface of flip LED chips.

Embodiment 2

Please refer to Fig. 2, Fig. 3, the utility model case study on implementation 2 please refers to Fig. 1, Fig. 3, in the utility model embodiment 1 Flip LED luminescent device include bracket, flip LED chips (4) (blue chip or red light chips).The bracket includes copper sheet (8) and the rest body (6) at the copper sheet both ends is set.The flip LED chips (4) are fixed on described by tin cream (1) On bracket, the positive crystal bonding area of the bracket and the outside (outside that could also say that tin cream (1)) of cathode crystal bonding area are located at institute It states and is each provided with an insulation box dam isolation strip (2) on rest body (6).The insulating isolation belt (2) described in this way can be by flip LED core The anode and cathode of piece separate, and the tin cream (1) can be prevented to flow caused positive and negative anodes connection and cause leaky.

Full thermal plastic insulation (3), the envelope are filled on rest body (6) between insulation box dam isolation strip (2) Dress colloid layer (7) is coated on the surface of the LED chip (4).The insulation box dam isolation strip (2) and the rest body (6) plastic rubber material can be used, and identical plastic rubber material can be used, and the insulation box dam isolation strip (2) and the bracket Matrix (6) can be with integrated injection molding.

Preferably, the material of the thermal plastic insulation (3) is organosilicon heat-conducting glue, specifically, organosilicon heat-conducting glue is again It is subdivided into epoxy resin AB glue, titanium pentoxide, polyurethane adhesive, heat-conducting silicone grease etc..

The preparation method of LED light emitting device described in embodiment 2, includes the following steps：

S3：Then coating/filling packing colloid layer (7) on the surface of flip LED chips.

Embodiment 3

Fig. 1, Fig. 4 are please referred to, is approached with the scheme of embodiment 1 and embodiment 2, only the shape of insulation box dam isolation strip (2) Shape is different, and insulation box dam isolation strip (2) described in Examples 1 to 2 is in vertical bar shaped and to be parallel to each other, in case study on implementation 3, Insulation box dam isolation strip is the insulation box dam isolation strip of two circular arc types.Insulation box dam isolation strip in the utility model can basis Actual demand is adjusted, and equally can achieve the electrical leakage problems of isolation tin cream flowing conducting.

Claims

1. a kind of flip LED luminescent device, which is characterized in that including bracket, flip LED chips, the flip LED chips pass through Tin cream is fixed on the bracket, and the positive crystal bonding area of the bracket and the outside of cathode crystal bonding area are each provided with an insulation box dam Isolation strip；The bracket includes copper sheet and the rest body that copper sheet both ends are arranged in, the bracket of the insulation box dam isolation interband Matrix is equipped with thermal plastic insulation.

2. flip LED luminescent device according to claim 1, which is characterized in that the insulation box dam isolation strip is in vertical bar shaped And it is parallel to each other, or form circular arc type.

3. flip LED luminescent device according to claim 1, which is characterized in that it is described insulation box dam isolation strip height be 0.1~0.2mm.

4. flip LED luminescent device according to claim 1, which is characterized in that coated on the surface of the flip LED chips There is the mixed layer of packing colloid and fluorescent powder, or is coated with packing colloid layer.

5. flip LED luminescent device according to claim 1, which is characterized in that the insulation box dam isolation strip is that plastic cement is exhausted Edge box dam isolation strip；The rest body is plastic rubber bracket matrix.

6. flip LED luminescent device according to claim 5, which is characterized in that the insulation box dam, rest body use PA6T, PA9T, PA10, PCT or LCP.

7. flip LED luminescent device according to claim 6, which is characterized in that the insulation box dam, rest body are adopted With PA6T, PA9T or PCT plastic cement.

8. flip LED luminescent device according to claim 1, which is characterized in that the thermal plastic insulation is organic insulation silicon Heat-conducting glue.

9. flip LED luminescent device according to claim 8, which is characterized in that the thermal plastic insulation is epoxide resin AB Glue, titanium pentoxide, polyurethane adhesive or heat-conducting silicone grease.

10. flip LED luminescent device described according to claim 1~any one of 9, which is characterized in that the bracket is Patch type bracket or flat bracket.