CN110324986A - The preparation method of charactron - Google Patents
The preparation method of charactron Download PDFInfo
- Publication number
- CN110324986A CN110324986A CN201910543173.0A CN201910543173A CN110324986A CN 110324986 A CN110324986 A CN 110324986A CN 201910543173 A CN201910543173 A CN 201910543173A CN 110324986 A CN110324986 A CN 110324986A
- Authority
- CN
- China
- Prior art keywords
- flip chip
- led flip
- circuit board
- preparation
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Abstract
The invention discloses a kind of preparation methods of charactron, comprising: arranges pad on circuit boards；The point note tin cream on the pad；LED flip chip is placed on the tin cream by way of die bond, is electrically connected two electrodes of the LED flip chip bottom and the pad；The LED flip chip is fixed on the circuit board by Reflow Soldering.Preparation method provided by the invention does not need bonding wire craft, the occurrence of capable of preventing broken string, to improving production efficiency and product yield, in addition, tin cream is in Reflow Soldering by heat of solution, become liquid tin liquor, temperature declines after coming out of the stove, and tin liquor becomes solid again, and flip-chip and pad are fixed together so as to firm, it realizes stable electric connection, promotes product stability.
Description
Technical field
The present invention relates to charactron technical fields, more particularly to a kind of preparation method of charactron.
Background technique
Charactron, also referred to as aeolight are a kind of electronic equipments that can show number and other information.It is commonly used in electronics
, it can be achieved that system is shown as man-machine interface in display circuit.LED charactrons are made of light emitting diode, are also known as partly led
Body charactron.Strip-like LED is connected according to the method for common cathode (cathode) or common-anode (anode), forms " 8 " word,
Another electrode of light emitting diode is made a segment electrode again, just constitutes LED charactrons.
Currently, LED charactrons packaging technology is that chip is fixed on pcb board with elargol, then used with automatic bonding equipment
Ultrasonic bonding mode carries out chip interconnection, is made using high molecular material encapsulation, and especially blue white light a, chips will weld
Connect two Si-Al wires.It is this by Si-Al wire welding come realize conducting in the way of, in process of production, be easy to appear the feelings of broken string
Condition influences production efficiency and product yield, and product reliability is poor.
Summary of the invention
It is an object of the invention to propose a kind of preparation method of charactron, with improving production efficiency, product yield and production
Product reliability.
A kind of preparation method of charactron, comprising:
Pad is arranged on circuit boards；
The point note tin cream on the pad；
LED flip chip is placed on the tin cream by way of die bond, makes two of the LED flip chip bottom
Electrode and the pad are electrically connected；
The LED flip chip is fixed on the circuit board by Reflow Soldering.
The preparation method of the charactron proposed according to the present invention, the point note tin cream on pad, then by way of die bond
LED flip chip is placed on tin cream, two electrodes and pad of LED flip chip bottom are electrically connected, finally by reflux
Weldering is fixed on circuit boards by LED flip chip, realizes and makes charactron, system provided by the invention using LED flip chip
Not the occurrence of Preparation Method does not need bonding wire craft, can prevent broken string, thus improving production efficiency and product yield, in addition,
Tin cream, by heat of solution, becomes liquid tin liquor in Reflow Soldering, and temperature declines after coming out of the stove, and tin liquor becomes solid again, so as to
Enough firm is fixed together flip-chip and pad, realizes stable electric connection, promotes product stability.
In addition, the preparation method of the charactron provided according to the present invention, can also have the following additional technical features:
Further, after the step that the LED flip chip is fixed on the circuit board by Reflow Soldering,
The method also includes:
By the circuit board package into the filling shell of epoxy resin, reflection cavity is equipped in the shell, it is described anti-
Penetrate the light that chamber is issued for assembling the LED flip chip.
Further, it is described by way of die bond on the tin cream place LED flip chip the step of in, according to institute
It states spacing between two electrodes of LED flip chip bottom and selects double end Glue dripping head, make two rubber heads of the double end Glue dripping head
Center match away from spacing between two electrodes of the LED flip chip bottom.
Further, the step that the LED flip chip is fixed on the circuit board by Reflow Soldering is specific
Include:
Use reflow machine, the LED flip chip to be fixed on the circuit board by Reflow Soldering, the reflux
8 temperature ranges are arranged in welding machine, and from the inlet to the outlet, temperature level is successively are as follows: 190 DEG C, 200 DEG C, 220 DEG C, 230 DEG C, 240
℃、250℃、260℃、240℃。
Further, the chain speed of the reflow machine are as follows: 75-80cm/min.
Further, described before the step of point infuses tin cream on the pad, the method also includes:
Pin is installed on the circuit board, and cleans the circuit board.
Further, the pad arranged on the circuit board is the same direction.
Further, after the step that the LED flip chip is fixed on the circuit board by Reflow Soldering,
The method also includes:
In the circumfusion adhesive glue of the LED flip chip, make to form adhesive layer around the LED flip chip,
The height of the adhesive layer is concordant with the height of the LED flip chip；
It is bonded transparent adhesive film backwards to the one side of the circuit board in the LED flip chip, makes the transparent adhesive film simultaneously
It is bonded with the LED flip chip and the adhesive layer.
Further, described the step of the LED flip chip is bonded transparent adhesive film backwards to the one side of the circuit board
Later, the method also includes:
In the transparent adhesive film backwards to the coated on one side light blocking layer of the LED flip chip, described in the light blocking layer face
LED flip chip setting, and the equivalent width of the width of the light blocking layer and the LED flip chip.
Further, the top surface of the light blocking layer is arc-shaped curved surface structure.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the flow chart of the preparation method for the charactron that first embodiment of the invention proposes；
Fig. 2 is the structural schematic diagram of charactron in first embodiment of the invention；
Fig. 3 is the flow chart of the preparation method for the charactron that second embodiment of the invention proposes；
Fig. 4 is the structural schematic diagram of charactron in second embodiment of the invention.
Specific embodiment
To keep objects, features and advantages of the present invention more obvious and easy to understand, with reference to the accompanying drawing to tool of the invention
Body embodiment is described in detail.Several embodiments of the invention are given in attached drawing.But the present invention can be with many not
With form realize, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes to this
The disclosure of invention is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixedly arranged on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side ", "upper", "lower" and similar statement for illustrative purposes only, rather than the device or member of indication or suggestion meaning
Part must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be machine
Tool connection, is also possible to be electrically connected；It can be directly connected, two members can also be can be indirectly connected through an intermediary
Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in this hair as the case may be
Concrete meaning in bright.Term " and or " used herein include the arbitrary of one or more relevant listed items and
All combinations.
Embodiment 1
Please refer to Fig. 1 and Fig. 2, the preparation method for the charactron that the first embodiment of the present invention proposes, including step S101
~S104:
S101 arranges pad on circuit boards；
Wherein, circuit board 11 is that traditional PCB circuit board preferably guarantees that each pad 12 is same when arranging pad 12
Subsequent die bond, the pad 12 at least pad for connecting anode and the pad for connecting cathode are convenient in one direction.
S102, the point note tin cream on the pad；
S103 places LED flip chip on the tin cream by way of die bond, makes the LED flip chip bottom
Two electrodes and the pad be electrically connected；
Wherein, specifically point infuses tin cream 13 on pad 12.The tin cream amount of point note can be set according to the actual situation.This
Outside, spacing selection double end Glue dripping head between two electrodes (i.e. P, N are tied) according to 14 bottom of LED flip chip is needed, is made described
The center of two rubber heads of double end Glue dripping head matches away from spacing between two electrodes of the LED flip chip bottom.
The LED flip chip is fixed on the circuit board by S104 by Reflow Soldering.
Wherein, the step that LED flip chip 14 is fixed on the circuit board 11 is specifically included by Reflow Soldering:
It is described the LED flip chip 14 to be fixed on the circuit board 11 by Reflow Soldering using reflow machine
Reflow machine be arranged 8 temperature ranges, from the inlet to the outlet, temperature level is successively are as follows: 190 DEG C, 200 DEG C, 220 DEG C, 230 DEG C,
240℃,250℃,260℃,240℃.Table specific as follows is arranged in reflow machine temperature parameter:
In addition, transport, fortune wind, heating, alarm, cooling are fully open in reflow machine, warm area 3~7 need to be all arrived at and be set
Determine temperature (in 10 DEG C of the temperature difference) can start trial product cross furnace reflux.The chain speed of reflow machine is preferred are as follows: 75-80cm/min.
In addition, as a specific embodiment, in step S102, before the step of point infuses tin cream on the pad,
The method can be with further include:
Pin 15, i.e. PIN needle are installed on the circuit board 11, and clean the circuit board, it is specific to need using jump PIN
Machine presses PIN machine, cleaning machine.
In addition, in step S104, the LED flip chip is fixed by Reflow Soldering as a specific embodiment
After the step on the circuit board, the method can also include:
By the circuit board 11 encapsulation into the filling shell 17 of epoxy resin 16, reflection cavity is equipped in the shell 17
18, the reflection cavity 18 is used to assemble the light that the LED flip chip 14 issues.
When it is implemented, reflection cavity 18 should be designed in shell 17 according to the structure of LED flip chip 14 first, it will
LED flip chip 14 is fixed on circuit board 11, obtains semi-finished product, and whether then test flip-chip in the semi-finished product good,
The semi-finished product for testing intact are encapsulated with epoxy resin, i.e., are encapsulated circuit board 11 to the filling shell 17 of epoxy resin 16
In, the electrical property and appearance of the packaged charactron of last re-test.
According to the preparation method of charactron provided in this embodiment, point note tin cream, then passes through the side of die bond on pad
Formula places LED flip chip on tin cream, and two electrodes and pad of LED flip chip bottom are electrically connected, finally by returning
Fluid welding is fixed on circuit boards by LED flip chip, realizes and makes charactron using LED flip chip, provided by the invention
Not the occurrence of preparation method does not need bonding wire craft, can prevent broken string, thus improving production efficiency and product yield, this
Outside, tin cream becomes liquid tin liquor in Reflow Soldering by heat of solution, and temperature declines after coming out of the stove, and tin liquor becomes solid again, thus
What can be consolidated is fixed together flip-chip and pad, realizes stable electric connection, promotes product stability.
Embodiment 2
Please refer to Fig. 3 and Fig. 4, the production method for the circuit board that the second embodiment of the present invention proposes, including step S201
~S209:
S201 arranges pad on circuit boards.
Wherein, circuit board 11 is that traditional PCB circuit board preferably guarantees that each pad 12 is same when arranging pad 12
Subsequent die bond, the pad 12 at least pad for connecting anode and the pad for connecting cathode are convenient in one direction.
S202 installs pin on the circuit board, and cleans the circuit board.
Wherein, pin 15, i.e. PIN needle are installed on the circuit board 11, and clean the circuit board, specifically need using
PIN machine is jumped, PIN machine, cleaning machine are pressed.
S203, the point note tin cream on the pad.
S204 places LED flip chip on the tin cream by way of die bond, makes the LED flip chip bottom
Two electrodes and the pad be electrically connected.
Wherein, specifically point infuses tin cream 13 on pad 12.The tin cream amount of point note can be set according to the actual situation.This
Outside, spacing selection double end Glue dripping head between two electrodes (i.e. P, N are tied) according to 14 bottom of LED flip chip is needed, is made described
The center of two rubber heads of double end Glue dripping head matches away from spacing between two electrodes of the LED flip chip bottom.
The LED flip chip is fixed on the circuit board by S205 by Reflow Soldering.
Wherein, the step that LED flip chip 14 is fixed on the circuit board 11 is specifically included by Reflow Soldering:
It is described the LED flip chip 14 to be fixed on the circuit board 11 by Reflow Soldering using reflow machine
Reflow machine be arranged 8 temperature ranges, from the inlet to the outlet, temperature level is successively are as follows: 190 DEG C, 200 DEG C, 220 DEG C, 230 DEG C,
240℃,250℃,260℃,240℃.Table specific as follows is arranged in reflow machine temperature parameter:
In addition, transport, fortune wind, heating, alarm, cooling are fully open in reflow machine, warm area 3~7 need to be all arrived at and be set
Determine temperature (in 10 DEG C of the temperature difference) can start trial product cross furnace reflux.The chain speed of reflow machine is preferred are as follows: 75-80cm/min.
S206 makes to be formed around the LED flip chip viscous in the circumfusion adhesive glue of the LED flip chip
Layer is closed, the height of the adhesive layer is concordant with the height of the LED flip chip.
Wherein, adhesive glue specifically can be silica gel glue, have preferable translucent effect and cementability.In LED upside-down mounting core
The circumfusion adhesive glue of piece 14 makes to form adhesive layer 20 around the LED flip chip 14.
S207 is bonded transparent adhesive film backwards to the one side of the circuit board in the LED flip chip, makes the transparent adhesive film
It is bonded simultaneously with the LED flip chip and the adhesive layer.
Wherein, it is bonded transparent adhesive film 21 backwards to the one side of the circuit board 11 in LED flip chip 14, makes the transparent adhesive tape
Film 21 is bonded with the LED flip chip 14 and the adhesive layer 20 simultaneously, and transparent adhesive film 21 is for playing LED flip chip 14
To protective effect.
S208, in the transparent adhesive film backwards to the coated on one side light blocking layer of the LED flip chip, the light blocking layer face
The LED flip chip setting, and the equivalent width of the width of the light blocking layer and the LED flip chip.
Wherein, described light-blocking in the transparent adhesive film 21 backwards to the coated on one side light blocking layer 22 of the LED flip chip 14
The top surface of layer 22 is specially arc-shaped curved surface structure, and light blocking layer 22 is made to have preferable light blocking effect.Light blocking layer 22 can block simultaneously
The light that the surface of LED flip chip 14 issues is reflected, the axial intensity of LED flip chip 14 is reduced, makes LED flip chip
The 14 most of past sides of light issued dissipate, and realization is mapped to diffuser plate in lensless situation and reaches evenly luminous effect,
For example, the material of the light blocking layer 22 is the substance of the characteristic with shading and astigmatism.
S209 is equipped with reflection cavity, institute by the circuit board package into the filling shell of epoxy resin in the shell
State the light that reflection cavity is issued for assembling the LED flip chip.
Wherein, the circuit board 11 is encapsulated into the filling shell 17 of epoxy resin 16, is equipped in the shell 17
Reflection cavity 18, the reflection cavity 18 are used to assemble the light that the LED flip chip 14 issues.
When it is implemented, reflection cavity 18 should be designed in shell 17 according to the structure of LED flip chip 14 first, it will
LED flip chip 14 is fixed on circuit board 11, obtains semi-finished product, and whether then test flip-chip in the semi-finished product good,
The semi-finished product for testing intact are encapsulated with epoxy resin, i.e., are encapsulated circuit board 11 to the filling shell 17 of epoxy resin 16
In, the electrical property and appearance of the packaged charactron of last re-test.
The present embodiment is on the basis of first embodiment, in addition to not needing bonding wire craft, can prevent the hair of broken string situation
It is raw, except improving production efficiency and product yield and product stability, by increasing adhesive layer and transparent adhesive film, Neng Goujia
By force to the protective effect of LED flip chip, and pass through the coated on one side light blocking layer in transparent adhesive film backwards to LED flip chip, energy
Enough promote the illumination effect of LED flip chip.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiment or examples in can be combined in any suitable manner.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of preparation method of charactron characterized by comprising
Pad is arranged on circuit boards；
The point note tin cream on the pad；
LED flip chip is placed on the tin cream by way of die bond, makes two electrodes of the LED flip chip bottom
It is electrically connected with the pad；
The LED flip chip is fixed on the circuit board by Reflow Soldering.
2. the preparation method of charactron according to claim 1, which is characterized in that it is described by Reflow Soldering by the LED
Flip-chip is fixed on after the step on the circuit board, the method also includes:
By the circuit board package into the filling shell of epoxy resin, reflection cavity, the reflection cavity are equipped in the shell
The light issued for assembling the LED flip chip.
3. the preparation method of charactron according to claim 1, which is characterized in that it is described by way of die bond described
In the step of placing LED flip chip on tin cream, selected according to spacing between two electrodes of the LED flip chip bottom double
Head Glue dripping head, make the center of two rubber heads of the double end Glue dripping head away from two electrodes with the LED flip chip bottom it
Between spacing match.
4. the preparation method of charactron according to claim 1, which is characterized in that it is described by Reflow Soldering by the LED
The step that flip-chip is fixed on the circuit board specifically includes:
Use reflow machine, the LED flip chip to be fixed on the circuit board by Reflow Soldering, the reflow machine
8 temperature ranges are set, and from the inlet to the outlet, temperature level is successively are as follows: 190 DEG C, 200 DEG C, 220 DEG C, 230 DEG C, 240 DEG C, 250
℃、260℃、240℃。
5. the preparation method of charactron according to claim 4, which is characterized in that the chain speed of the reflow machine are as follows: 75-
80cm/min。
6. the preparation method of charactron according to claim 1, which is characterized in that the point note tin cream on the pad
The step of before, the method also includes:
Pin is installed on the circuit board, and cleans the circuit board.
7. the preparation method of charactron according to claim 1, which is characterized in that the pad arranged on the circuit board is
The same direction.
8. the preparation method of charactron according to claim 1, which is characterized in that it is described by Reflow Soldering by the LED
Flip-chip is fixed on after the step on the circuit board, the method also includes:
In the circumfusion adhesive glue of the LED flip chip, make to form adhesive layer around the LED flip chip, it is described
The height of adhesive layer is concordant with the height of the LED flip chip；
The LED flip chip backwards to the circuit board one side be bonded transparent adhesive film, make the transparent adhesive film simultaneously with institute
State LED flip chip and adhesive layer fitting.
9. the preparation method of charactron according to claim 1, which is characterized in that described to be carried on the back in the LED flip chip
After the step of being bonded transparent adhesive film to the one side of the circuit board, the method also includes:
In the transparent adhesive film backwards to the coated on one side light blocking layer of the LED flip chip, LED described in the light blocking layer face is fallen
Cartridge chip setting, and the equivalent width of the width of the light blocking layer and the LED flip chip.
10. the preparation method of charactron according to claim 9, which is characterized in that the top surface of the light blocking layer is arc
Curved-surface structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910543173.0A CN110324986A (en) | 2019-06-21 | 2019-06-21 | The preparation method of charactron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910543173.0A CN110324986A (en) | 2019-06-21 | 2019-06-21 | The preparation method of charactron |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110324986A true CN110324986A (en) | 2019-10-11 |
Family
ID=68119968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910543173.0A Pending CN110324986A (en) | 2019-06-21 | 2019-06-21 | The preparation method of charactron |
Country Status (1)
| Country | Link |
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| CN (1) | CN110324986A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114046463A (en) * | 2021-11-11 | 2022-02-15 | 广东百珈亮光电科技有限公司 | Roll-to-roll manufacturing method and process flow of LED lamp strip |
| CN117649807A (en) * | 2023-12-18 | 2024-03-05 | 广东艾力森数码电器有限公司 | High-reliability flip-chip process LED nixie tube |
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| CN108761905A (en) * | 2018-05-04 | 2018-11-06 | 惠州市华瑞光源科技有限公司 | Liquid crystal TV set, backlight module and its manufacturing method |
| CN208157452U (en) * | 2017-10-27 | 2018-11-27 | 广东晶科电子股份有限公司 | A kind of flip LED luminescent device |
| CN109041450A (en) * | 2018-07-24 | 2018-12-18 | 广东华辉煌光电科技有限公司 | A kind of processing method of the charactron with flip-chip |
| CN208738287U (en) * | 2018-04-03 | 2019-04-12 | 赵明彦 | A kind of novel fixed device of LED charactrons digital screen production |
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- 2019-06-21 CN CN201910543173.0A patent/CN110324986A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208157452U (en) * | 2017-10-27 | 2018-11-27 | 广东晶科电子股份有限公司 | A kind of flip LED luminescent device |
| CN208738287U (en) * | 2018-04-03 | 2019-04-12 | 赵明彦 | A kind of novel fixed device of LED charactrons digital screen production |
| CN108761905A (en) * | 2018-05-04 | 2018-11-06 | 惠州市华瑞光源科技有限公司 | Liquid crystal TV set, backlight module and its manufacturing method |
| CN109041450A (en) * | 2018-07-24 | 2018-12-18 | 广东华辉煌光电科技有限公司 | A kind of processing method of the charactron with flip-chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114046463A (en) * | 2021-11-11 | 2022-02-15 | 广东百珈亮光电科技有限公司 | Roll-to-roll manufacturing method and process flow of LED lamp strip |
| CN117649807A (en) * | 2023-12-18 | 2024-03-05 | 广东艾力森数码电器有限公司 | High-reliability flip-chip process LED nixie tube |
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Application publication date: 20191011 |