CN114046463A - Roll-to-roll manufacturing method and process flow of LED lamp strip - Google Patents
Roll-to-roll manufacturing method and process flow of LED lamp strip Download PDFInfo
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- CN114046463A CN114046463A CN202111332799.0A CN202111332799A CN114046463A CN 114046463 A CN114046463 A CN 114046463A CN 202111332799 A CN202111332799 A CN 202111332799A CN 114046463 A CN114046463 A CN 114046463A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000012360 testing method Methods 0.000 claims abstract description 29
- 230000002950 deficient Effects 0.000 claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 238000005476 soldering Methods 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000001514 detection method Methods 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000013461 design Methods 0.000 claims abstract description 4
- 239000013072 incoming material Substances 0.000 claims abstract description 4
- 238000005259 measurement Methods 0.000 claims abstract description 4
- 239000000741 silica gel Substances 0.000 claims abstract description 4
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 4
- 230000008439 repair process Effects 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 239000000047 product Substances 0.000 abstract description 35
- 239000011265 semifinished product Substances 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 244000144992 flock Species 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a roll-to-roll manufacturing method of an LED lamp strip and a process flow thereof, wherein the method comprises incoming material detection, wherein whether the surfaces of a chip and a plate bonding pad are clean or not and have no damage is detected by manually observing the surfaces of the chip; comparing the sizes of the chip and the circuit board with the size of the design drawing by manual measurement to detect whether the sizes meet the error standard or not; die bonding, namely, dotting solder paste to a pad position on the plate through a die bonding machine; then, placing the chip and the resistor on the corresponding bonding pad position; fixing the chip and the resistor at the position of a bonding pad of the plate by using the solder paste on the spot, and heating the solder paste by reflow soldering to fully melt and uniformly weld the solder paste; detecting, namely detecting the circuit blank plate by lighting a power supply; packaging, namely packaging the chip on the plate through silica gel to form a semi-finished product; testing, wherein the packaged semi-finished product is subjected to a lighting test, and a defective product is marked; cutting, namely cutting the semi-finished product into a plurality of strips; wiring, namely connecting the cut semi-product with a power line; testing, namely performing lighting test on the connected semi-finished product of the power line; a reel, which is used for coiling the tested product by a reel machine and carrying out lighting test; and packaging, namely packaging the lamp strip.
Description
Technical Field
The invention relates to a roll-to-roll manufacturing method and a process flow of an LED lamp strip.
Background
The LED lamp strip produced by enterprises adopts the way that the patch lamp beads are welded on the circuit board, and the common LED lamp strip has low production efficiency and is easy to be welded badly, so the applicant develops a new production process aiming at the situation to avoid the defects.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a roll-to-roll manufacturing method of an LED lamp strip and a process flow thereof.
The technical scheme adopted by the invention for solving the technical problems is as follows:
firstly, designing a FPC material circuit board
Secondly, incoming material detection, which is to detect whether the surfaces of the chip and the plate bonding pad are clean and have no damage through manual observation of the surface of the chip; detecting whether the dimension of the plate meets the error standard or not by comparing the dimension of the manual measurement chip and the dimension of the plate with the dimension of the design drawing;
thirdly, die bonding, namely, dotting the solder paste to the position of a bonding pad on the plate through a die bonding machine; and then the chip and the resistor are placed on the corresponding bonding pad position. Fixing the chip and the resistor at the position of a bonding pad of the plate by using the solder paste on the spot, and heating the solder paste by reflow soldering to fully melt and uniformly weld the solder paste;
fourthly, detecting, namely placing the plate after die bonding on a power supply test frame; the LED lamps on the circuit bonding pads are subjected to lighting detection through a power supply;
fifthly, repairing, and passing the test; repairing the defective product on a platform, and baking the defective product by an oven to remove moisture;
sixthly, packaging, namely adjusting the proportion of the silica gel to the fluorescent powder and adjusting any color;
uniformly stirring, then carrying out vacuum stirring, and placing the mixed glue and the plate after crystal solidification on a dispensing machine; dispensing, and heating by reflow soldering to solidify the surface of the colloid; then baking by an oven; curing the colloid completely;
seventhly, testing, namely cooling the baked product at normal temperature, then placing the baked product on a power supply testing frame for lighting test, marking the defective product, marking the measured size, and then dividing the board;
eighthly, cutting, namely placing the product with the measured size on a board separator for cutting, and cutting the product into a plurality of products;
ninth, wiring, connecting the cut product with a power line by using a soldering iron and tin, wherein the connected position is on a bonding pad of the product;
testing, namely performing lighting test on the product connected with the power line through a power supply; marking the defective products for repair;
coiling the tested product by using a coiling machine, then carrying out lighting test, and marking and then carrying out item repair if defective products exist;
and step twelve, packaging, namely packaging the rolled product by using an aluminum foil bag and sticking a label.
And the reflow soldering in the second step is divided into 4-8 temperature zones, and each temperature zone is provided with a temperature value.
And the second step also comprises resistance welding.
The invention has the beneficial effects that: the circuit board is infinitely long and is a new improved process of a roll-to-roll whole board, and the board can be made into any length. The whole plate is cut, and a plurality of plates can be cut at one time. The die bonding is to fix the chip on the bonding pad of the FPC board by adopting a mode of reflow soldering and baking the LED chip and the solder paste, so that the bad soldering effect is avoided at one time. The FPC board is characterized by being made into any length; any color.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a block diagram of a die bonding process,
figure 2 is a block diagram of a dispensing process,
FIG. 3 is a block flow diagram of wrapping.
Detailed Description
Advantages and features of the present disclosure and methods of practicing the same will be clarified by the following embodiments described with reference to the accompanying drawings. This disclosure may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Furthermore, the present disclosure is to be limited only by the scope of the claims.
The shapes, sizes, proportions, angles and numbers disclosed in the accompanying drawings for describing embodiments of the present disclosure are by way of example only, and are not intended to be limited to the details shown. Like reference numerals refer to like elements throughout the specification. In the following description, when a detailed description of a related known function or configuration is determined to unnecessarily obscure the focus of the present disclosure, the detailed description will be omitted. In the case of using "including", "having", and "including" described in this specification, other components may be added unless "only" is used. Unless indicated to the contrary, singular terms may include the plural.
In explaining the elements, although not explicitly described, the elements are understood to include error ranges.
In describing the positional relationship, for example, when the positional relationship is described as "on … …", "above … …", "below … …", and "adjacent to … …", one or more portions may be arranged between two other portions unless "immediately" or "directly" is used.
In describing the temporal relationship, for example, when the temporal order is described as "after … …", "subsequently", "next", and "before … …", the case of discontinuity may be included unless "just" or "directly" is used.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure.
As will be well understood by those skilled in the art, the features of the different embodiments of the present disclosure may be partially or fully coupled or combined with each other and may cooperate with each other and be technically driven in various ways. Embodiments of the present disclosure may be performed independently of each other, or may be performed together in an interdependent relationship.
Referring to the figures: fig. 1 to 3 show that the invention discloses a method for manufacturing a coiled LED strip and a process flow thereof, comprising the following steps:
designing a FPC material circuit board, wherein the circuit board can be divided into high voltage and low voltage, such as (3V, 12V, 24V, 36V, 120V, 220V) and the like, and the circuit board can be designed optionally according to requirements;
secondly, incoming material detection, which is to detect whether the surfaces of the chip and the plate bonding pad are clean and have no damage through manual observation of the surface of the chip, and comprises surface pressure damage, oil stain, color change, yellowing, scratch, flock and high temperature resistance tests; comparing the sizes of the chip and the circuit board with the size of the design drawing by manual measurement to detect whether the sizes meet the error standard or not;
thirdly, die bonding, wherein material checking is required before the machine is started: the type, number, dehumidification and order number of the plates; the type and number of chips; die bond solder paste type; the type and number of resistors;
after the checking is finished, the solder paste is dotted to the bonding pad position on the plate bonding pad through a die bonder; placing the chip and the resistor at the corresponding bonding pad position, fixing the chip and the resistor at the bonding pad position of the plate through the solder paste on the points, welding the resistor and the chip in the same manner and in an adjustable sequence, and heating through reflow soldering to ensure that the solder paste is fully melted and uniformly welded; the box is divided into a plurality of temperature zones, each temperature zone is provided with a temperature value, the box is divided into 4-8 temperature zones, and each temperature corresponds to one temperature.
Detecting, namely detecting the LED chip on the plate by lighting a power supply; if after the defective products are detected, the defective products are transferred to maintenance personnel to carry out rework maintenance and repair processes, and the maintenance personnel need to feed the bad conditions back to operators or technicians.
Fifthly, repairing, and passing the test; performing LOI repair on the defective product, and then baking the defective product by an oven to remove moisture;
packaging, namely packaging the chip on the plate by using silica gel through a dispenser to form a semi-finished product, and heating through reflow soldering to solidify the surface of the colloid; then baking by an oven; curing the colloid completely;
seventhly, testing, namely cooling the baked product at normal temperature, then placing the baked product on a power supply testing frame for lighting test, marking the defective product, and marking the measured size;
eighthly, cutting, namely placing the product with the measured size on a board separator for cutting, and cutting the product into a plurality of products;
ninth, wiring, connecting the cut product with a power line by using a soldering iron and tin, wherein the connected position is on a bonding pad of the product;
testing, namely performing lighting test on the product connected with the power line through a power supply; marking the defective products for repair;
coiling the tested product by using a coiling machine, then carrying out lighting test, and marking and then carrying out item repair if defective products exist;
and step twelve, packaging, namely packaging the rolled product by using an aluminum foil bag and sticking a label.
The roll-to-roll LED strip manufacturing method and the process flow thereof provided by the embodiment of the present invention are described in detail above, and a specific example is applied in the text to explain the principle and the implementation of the present invention, and the description of the above embodiment is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (4)
1. The utility model provides a roll-to-roll LED lamp area manufacturing scheme and process flow thereof which characterized in that: the method comprises the following steps:
designing, namely designing a FPC material circuit board;
secondly, incoming material detection, which is to detect whether the surfaces of the chip and the plate bonding pad are clean and have no damage through manual observation of the surface of the chip; detecting whether the dimension of the plate meets the error standard or not by comparing the dimension of the manual measurement chip and the dimension of the plate with the dimension of the design drawing;
thirdly, die bonding, namely, dotting the solder paste to the position of a bonding pad on the plate through a die bonding machine; and then the chip and the resistor are placed on the corresponding bonding pad position. Fixing the chip and the resistor at the position of a bonding pad of the plate by using the solder paste on the spot, and heating the solder paste by reflow soldering to fully melt and uniformly weld the solder paste;
fourthly, detecting, namely placing the plate after die bonding on a power supply test frame; the LED lamps on the circuit bonding pads are subjected to lighting detection through a power supply;
fifthly, repairing, and passing the test; repairing the defective product on a platform, and baking the defective product by an oven to remove moisture;
sixthly, packaging, namely adjusting the proportion of the silica gel to the fluorescent powder and adjusting any color; uniformly stirring, then carrying out vacuum stirring, and placing the mixed glue and the plate after crystal solidification on a dispensing machine; dispensing, and heating by reflow soldering to solidify the surface of the colloid; then baking by an oven; curing the colloid completely;
seventhly, testing, namely cooling the baked product at normal temperature, then placing the baked product on a power supply testing frame for lighting test, marking the defective product, marking the measured size, and then dividing the board;
eighthly, cutting, namely placing the product with the measured size on a board separator for cutting, and cutting the product into a plurality of products;
ninth, wiring, connecting the cut product with a power line by using a soldering iron and tin, wherein the connected position is on a bonding pad of the product;
testing, namely performing lighting test on the product connected with the power line through a power supply; marking the defective products for repair;
coiling the tested product by using a coiling machine, then performing point test, marking if defective products exist, and then performing item repair;
and step twelve, packaging, namely packaging the rolled product by using an aluminum foil bag and sticking a label.
2. The manufacturing process of the roll-to-roll LED strip according to claim 1, wherein: and the reflow soldering in the second step is divided into 4-8 temperature zones, and each temperature zone is provided with a temperature value.
3. The manufacturing process of the roll-to-roll LED strip according to claim 1, wherein: and the second step also comprises resistance welding.
4. The manufacturing process of the roll-to-roll LED strip according to claim 1, wherein: in the third step, if the defective products are detected, the defective products are transferred to a maintenance worker for reworking, maintaining and repairing, and the maintenance worker needs to feed the bad conditions back to an operator or a technician.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111332799.0A CN114046463A (en) | 2021-11-11 | 2021-11-11 | Roll-to-roll manufacturing method and process flow of LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111332799.0A CN114046463A (en) | 2021-11-11 | 2021-11-11 | Roll-to-roll manufacturing method and process flow of LED lamp strip |
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| Publication Number | Publication Date |
|---|---|
| CN114046463A true CN114046463A (en) | 2022-02-15 |
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| CN202111332799.0A Pending CN114046463A (en) | 2021-11-11 | 2021-11-11 | Roll-to-roll manufacturing method and process flow of LED lamp strip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116677934A (en) * | 2023-05-31 | 2023-09-01 | 深圳市华笙光电子有限公司 | Production method of soft package lamp strip |
| CN116677934B (en) * | 2023-05-31 | 2024-05-28 | 深圳市华笙光电子有限公司 | Production method of soft package lamp strip |
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| CN106287341A (en) * | 2016-08-18 | 2017-01-04 | 四川蓝景光电技术有限责任公司 | A kind of processing technique of silica gel extrusion molding soft light bar |
| CN109244216A (en) * | 2018-09-14 | 2019-01-18 | 深圳市同方光电技术有限公司 | A kind of double-colored upside-down mounting COB that monochromatic full cladding is luminous |
| CN110324986A (en) * | 2019-06-21 | 2019-10-11 | 江西恒明科技发展有限公司 | The preparation method of charactron |
| CN112289780A (en) * | 2020-10-14 | 2021-01-29 | 深圳市同一方光电技术有限公司 | LED packaging structure, processing method, lamp strip and lamp |
| CN113446526A (en) * | 2021-07-01 | 2021-09-28 | 深圳市卷对卷光电科技有限公司 | LED light bar production method and production system applying same |
-
2021
- 2021-11-11 CN CN202111332799.0A patent/CN114046463A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106287341A (en) * | 2016-08-18 | 2017-01-04 | 四川蓝景光电技术有限责任公司 | A kind of processing technique of silica gel extrusion molding soft light bar |
| CN109244216A (en) * | 2018-09-14 | 2019-01-18 | 深圳市同方光电技术有限公司 | A kind of double-colored upside-down mounting COB that monochromatic full cladding is luminous |
| CN110324986A (en) * | 2019-06-21 | 2019-10-11 | 江西恒明科技发展有限公司 | The preparation method of charactron |
| CN112289780A (en) * | 2020-10-14 | 2021-01-29 | 深圳市同一方光电技术有限公司 | LED packaging structure, processing method, lamp strip and lamp |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116677934A (en) * | 2023-05-31 | 2023-09-01 | 深圳市华笙光电子有限公司 | Production method of soft package lamp strip |
| CN116677934B (en) * | 2023-05-31 | 2024-05-28 | 深圳市华笙光电子有限公司 | Production method of soft package lamp strip |
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