CN219393364U

CN219393364U - MiniLED reprocesses equipment

Info

Publication number: CN219393364U
Application number: CN202320572369.4U
Authority: CN
Inventors: 王文; 林佛迎; 谢楷鸿
Original assignee: Shenzhen Micro Group Semiconductor Technology Co ltd
Current assignee: Shenzhen Micro Group Semiconductor Technology Co ltd
Priority date: 2023-03-13
Filing date: 2023-03-13
Publication date: 2023-07-21
Anticipated expiration: 2033-03-13

Abstract

The utility model discloses MiniLED repairing equipment, and relates to the technical field of repairing of MiniLED lamp bead chips. The chip position angle adjusting assembly comprises a chip loading table used for transferring chips and a chip triaxial adjusting assembly used for adjusting the R, X, Y axis position of the chip loading table.

Description

MiniLED reprocesses equipment

Technical Field

The utility model relates to the technical field of repair of MiniLED lamp bead chips and MiniC, in particular to MiniLED repair equipment.

Background

In the MiniLED lamp bead production industry, the yield of products in the production process is influenced by various factors such as complex process, the low yield is difficult to repair due to complex process procedures, the yield of each link is controlled in the manufacturing process of a plurality of links, the final yield is improved, the yield is improved at the front end, the repair difficulty of the rear end process is reduced greatly, so that the yield is detected after tin brushing and die bonding, defective points are repaired again, the products at the moment are not melted by a reflow oven, the solder paste is not combined with the chips, and the defective points in the process are repaired simply and quickly.

However, automatic equipment for repairing the MiniLED lamp bead products before passing through a reflow oven is lacking in the market, manual repair or repair after die bonding is generally adopted, a manual repair mode is adopted, manpower expenditure is large, the efficiency is low, repair is performed after passing through the reflow oven, and due to solder paste solidification, repair difficulty is large, product scrapping is easy, the reject ratio is high, and the two repair modes can not meet the requirements of manufacturing industry.

Disclosure of Invention

In order to achieve the above purpose, the present utility model provides the following technical solutions: the MiniLED repairing equipment comprises a chip tray, a chip position angle adjusting assembly, a repairing platform and a repairing assembly, wherein at least one chip placing groove is formed in the chip tray;

the chip position angle adjusting component is positioned at one side of the chip tray and comprises a chip carrier used for transferring chips and a chip triaxial adjusting component used for adjusting the R, X, Y axis position of the chip carrier;

the repairing platform is used for bearing products to be repaired and comprises a platform conveying line positioned at one side of the chip carrier and a platform double-shaft adjusting assembly used for driving the platform conveying line to carry out X, Y shaft position adjustment;

the repair assembly comprises a linear module, a tin-plating support and a product alignment linear module, a tin-plating head used for tin plating of the product is arranged on the tin-plating support, a product bad point alignment camera used for identifying the position of a bad point on the product is arranged on the product alignment linear module, and a chip alignment camera, a chip position angle alignment camera, a chip transfer suction nozzle used for adsorbing chip transfer and a product cleaning suction nozzle used for cleaning the bad point of the product are arranged on the linear module, wherein the chip alignment camera and the chip position angle alignment camera correspond to the chip tray and the chip carrier respectively.

As a preferable technical scheme of the utility model, the chip tray is rotatably arranged on the bottom plate, a tray rotating motor in transmission connection with the chip tray through a belt is arranged on one side of the bottom plate, a tray X-axis adjusting table is arranged at the bottom of the bottom plate, and a tray Y-axis adjusting table is arranged at the bottom of the tray X-axis adjusting table.

As a preferable technical scheme of the utility model, the chip triaxial adjusting assembly comprises a chip R-axis direct-drive rotary table for mounting a chip carrier, a chip X-axis linear module arranged at the bottom of the chip R-axis direct-drive rotary table and a chip Y-axis linear module arranged at the bottom of the chip X-axis linear module.

As a preferable technical scheme of the utility model, the platform double-shaft adjusting assembly comprises a platform X-axis linear module arranged at the bottom of the platform conveying line and a platform Y-axis linear module arranged at the bottom of the platform X-axis linear module.

As a preferable technical scheme of the utility model, product lifting cylinders are arranged on two sides of the inner wall of the platform conveying line, product positioning pressing plates are arranged on two sides of the top of the platform conveying line, products to be repaired are borne by the platform conveying line, and a product coarse positioning cylinder is arranged on one side of the platform conveying line.

As a preferable technical scheme of the utility model, the number of the linear modules is at least two, the tin-plating support is positioned between the two linear modules, and the tin-plating linear module used for driving the tin-plating head to adjust the Y-axis position and the tin-plating lifting module used for driving the tin-plating linear module to adjust the Z-axis position are arranged in the tin-plating support.

As an optimal technical scheme of the utility model, the product alignment linear modules are arranged on the two linear modules together, and the product alignment linear modules are provided with product alignment lifting modules for installing the product defective point alignment cameras.

As a preferable technical scheme of the utility model, the product cleaning suction nozzle is arranged on a suction nozzle lifting linear motor, the suction nozzle lifting linear motor is arranged on one linear module, and the chip alignment camera, the chip position angle alignment camera and the chip transferring suction nozzle are all arranged on the other linear module.

As a preferable technical scheme of the utility model, the utility model also comprises a product loading and unloading conveying line positioned at two sides of the repairing platform.

As a preferable technical scheme of the utility model, the utility model also comprises a marble base used for installing a product loading and unloading conveying line, a chip tray, a chip position angle adjusting component, a repairing platform and a repairing component.

Compared with the prior art, the utility model provides MiniLED repair equipment, which comprises the following components

The beneficial effects are that:

this MiniLED reprocesses equipment, through setting up chip charging tray, chip position angle adjustment subassembly, reprocessing platform, reprocessing subassembly and product unloading transfer chain, this product can carry out bad point reprocessing before the solid brilliant of product, need not staff's manual operation, reprocess efficiency promotes greatly, because go on before solid brilliant process, the product is not gone on when the reflow oven, reprocess technology can be simpler than the reprocessing technology after having passed through the reflow oven, reprocess the yield can be higher, promote the total yield and the single Duan Liang rate of product production by a wide margin, it is all suitable for to MiniLED's direct display and backlight, can the wide application in MiniLED industry.

Drawings

FIG. 1 is a schematic structural diagram of a MiniLED repair device according to the present utility model;

FIG. 2 is an enlarged view of the structure at A in FIG. 1;

FIG. 3 is an enlarged view of the structure at B in FIG. 1;

FIG. 4 is a side view of a MiniLED repair device according to the present utility model;

FIG. 5 is an enlarged view of the structure at A in FIG. 4;

FIG. 6 is a rear view of a MiniLED repair device according to the present utility model;

FIG. 7 is an enlarged view of the structure at A in FIG. 6;

fig. 8 is an enlarged view of the structure at B in fig. 6.

In the figure: 1. a chip tray; 11. a chip placement groove; 12. a bottom plate; 13. a material disc rotating motor; 14. the X-axis adjusting table of the material tray; 15. a Y-axis adjusting table of the material tray; 2. a chip position angle adjusting assembly; 21. a chip carrier; 22. the chip R shaft directly drives the turntable; 23. a chip X-axis linear module; 24. a chip Y-axis linear module; 3. a repair platform; 31. a platform conveyor line; 32. a platform X-axis linear module; 33. a platform Y-axis linear module; 34. a product positioning pressing plate; 4. a rework assembly; 41. a linear module; 42. a tin-plating bracket; 421. a tin spot; 422. a straight line module for spot tin; 423. a tin-plating lifting module; 43. a product alignment straight line module; 431. a product alignment lifting module; 432. a product bad point alignment camera; 44. a chip alignment camera; 45. a chip position angle alignment camera; 46. a chip transferring suction nozzle; 47. cleaning a suction nozzle by a product; 471. a suction nozzle lifting linear motor; 5. product loading and unloading conveying lines; 6. and a marble base.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-8, a MiniLED repair device includes a chip tray 1, a chip position angle adjusting assembly 2, a repair platform 3, and a repair assembly 4, where at least one chip placement groove 11 is provided in the chip tray 1.

The chip position angle adjusting component 2 is located at one side of the chip tray 1, and the chip position angle adjusting component 2 comprises a chip carrier 21 for transferring chips and a chip triaxial adjusting component for adjusting the R, X, Y axis position of the chip carrier 21.

The repairing platform 3 is used for bearing products to be repaired, and the repairing platform 3 comprises a platform conveying line 31 positioned on one side of the chip carrier 21 and a platform double-shaft adjusting assembly used for driving the platform conveying line 31 to conduct X, Y shaft position adjustment.

The repairing assembly 4 comprises a linear module 41, a tin-plating bracket 42 and a product alignment linear module 43, the tin-plating bracket 42 is provided with a tin-plating head 421 for tin-plating the product, the product alignment linear module 43 is provided with a product defective spot alignment camera 432 for identifying the defective spot position on the product, the linear module 41 is provided with a chip alignment camera 44, a chip position angle alignment camera 45, a chip transferring suction nozzle 46 for transferring the adsorbed chip and a product cleaning suction nozzle 47 for cleaning the defective spot of the product, which can repair the same spot for many times without affecting the repairing effect and the repairing yield of the position, and the repairing yield is about forty percent higher than the yield of the repairing finished product after welding under a simple procedure, the product after repair has no influence, no brightness or appearance difference, has obvious improvement effect on direct display and backlight in the MiniLED industry, can be repaired at bad points before the product is subjected to crystal fixing without manual operation by staff through arranging the chip tray 1, the chip position angle adjusting assembly 2, the repair platform 3, the repair assembly 4 and the product feeding and discharging conveying line 5, and has greatly improved repair efficiency.

As a specific technical scheme of this embodiment, the chip tray 1 rotates and sets up on the bottom plate 12, bottom plate 12 one side is provided with the tray rotating electrical machines 13 that is connected with chip tray 1 transmission through the belt, the bottom of bottom plate 12 is provided with tray X-axis adjustment platform 14, the bottom of tray X-axis adjustment platform 14 is provided with tray Y-axis adjustment platform 15, chip standing groove 11 is used for placing the MiniLED lamp pearl chip of different grade, start tray rotating electrical machines 13 and drive chip tray 1 rotation to drive different chip standing grooves 11 towards chip counterpoint camera 44, tray X-axis adjustment platform 14 and tray Y-axis adjustment platform 15 can adopt manual regulation, lock to die or adopt sharp module to drive, because chip standing groove 11 size is fixed, generally only need through tray rotating electrical machines 13 switch can, only need adjust tray X-axis adjustment and tray Y-axis adjustment platform 15 when initial debugging, according to the user demand, both kinds of adjustment modes can be selected.

As a specific technical solution of this embodiment, the chip triaxial adjustment assembly includes a chip R axis direct-driving turntable 22 for mounting a chip carrier 21, a chip X axis linear module 23 disposed at the bottom of the chip R axis direct-driving turntable 22, and a chip Y axis linear module 24 disposed at the bottom of the chip X axis linear module 23, the chip transfer nozzle 46 removes a chip from the chip placement groove 11 and then places the chip on the chip carrier 21, and cooperates with the chip position angle alignment camera 45 to start the chip R axis direct-driving turntable 22, the chip X axis linear module 23 and the chip Y axis linear module 24, so that the chip angle is adjusted to an angle suitable for mounting on a product, the linear module is mounted in the linear module 41, and the chip transfer nozzle 46 is driven by the linear module 41 to adsorb and mount the chip with the adjusted position angle on the product coated with solder paste.

As a specific technical solution of this embodiment, the dual-axis adjustment assembly for a platform includes a platform X-axis linear module 32 disposed at the bottom of the platform conveying line 31 and a platform Y-axis linear module 33 disposed at the bottom of the platform X-axis linear module 32, and the platform X-axis linear module 32 and the platform Y-axis linear module 33 are started to adjust the platform conveying line 31, so that the platform conveying line 31 receives a product to be repaired from the product loading and unloading conveying line 5, or conveys the repaired product to the product loading and unloading conveying line 5.

As a concrete technical scheme of this embodiment, the inner wall both sides of platform conveying line 31 all are provided with the product lift cylinder, the top both sides of platform conveying line 31 all are provided with product location clamp plate 34, through platform conveying line 31 bears the product of waiting to repair, starts the product lift cylinder and drives the product and contradicts product location clamp plate 34, realizes the location to the product, one side of platform conveying line 31 is provided with the product coarse positioning cylinder 35, and after the product moved to platform conveying line 3, reaches the product coarse positioning cylinder 35 earlier, later carries out the product jack-up again, realizes coarse positioning, and the accurate positioning relies on the Mark of vision location product.

As a specific technical solution of this embodiment, the number of the linear modules 41 is at least two, the tin-plating support 42 is located between the two linear modules 41, the tin-plating linear module 422 for driving the tin-plating head 421 to adjust the Y-axis position and the tin-plating lifting module 423 for driving the tin-plating linear module 422 to adjust the Z-axis position are disposed inside the tin-plating support 42, and the tin-plating support 42 is located between the two linear modules 41, so that the repairing position of the repairing platform 3 is located between the two linear modules 41, the structural layout is more reasonable, the loading and unloading are more convenient and faster, when the product defective point is cleaned by the product cleaning nozzle 47, the tin-plating linear module 422 is started to drive the tin-plating head 421 to move above the product defective point position, the tin-plating lifting module 423 is started to descend to apply solder paste on the product defective point, and the subsequent pasting work can be performed.

As a specific technical scheme of this embodiment, the product alignment linear modules 43 are disposed on the two linear modules 41 together, the product alignment linear modules 43 are provided with product alignment lifting modules 431 for mounting the product defective spot alignment cameras 432, the product alignment linear modules 43 are started to drive the product alignment lifting modules 431 to move in the X-axis direction, the alignment lifting modules drive the product defective spot alignment cameras 432 to search defective spot MARK on the product, and after MARK alignment is completed, defective spot cleaning work can be performed.

As a specific technical scheme of this embodiment, the product cleaning nozzle 47 is mounted on the nozzle lifting linear motor 471, the nozzle lifting linear motor 471 is mounted on one of the linear modules 41, the chip alignment camera 44, the chip position angle alignment camera 45 and the chip transfer nozzle 46 are all mounted on the other linear module 41, the linear module 41 is started to drive the nozzle lifting linear motor 471 to move in the X-axis direction, meanwhile, the nozzle lifting linear motor 471 is started to drive the product cleaning nozzle 47 to move above the defective point of the product, a high-pressure air source is connected to the product cleaning nozzle 47 in advance, and the defective point can be cleaned by controlling the opening of the air source valve.

As a specific technical scheme of the embodiment, the device further comprises product loading and unloading conveying lines 5 positioned on two sides of the repairing platform 3, wherein the two product loading and unloading conveying lines 5 can be interchanged, and when one of the two product loading and unloading conveying lines is used for product loading, the other product loading and unloading conveying line is used for product unloading.

As a concrete technical scheme of this embodiment, still including be used for installing the product unloading transfer chain 5, chip charging tray 1, chip position angle adjustment subassembly 2, repair the platform 3, repair the marble base 6 of subassembly 4, repair the subassembly 4 and repair the platform 3 combination and be T font setting, repair the subassembly 4 and repair platform 3 and the product unloading transfer chain 5 combination and be the I-shaped setting, product clearance structure and chip material loading alignment structure are installed respectively on I-shaped both sides, the structure is simple, succinct, rationally distributed, the operation method is simple swift, accord with economic benefits, application prospect is wide, marble base 6 does not have the characteristics of expend with heat and contract with cold, stability in use is high, satisfy manufacturing industry user demand.

In summary, according to the MiniLED repairing device, by arranging the chip tray 1, the chip position angle adjusting assembly 2, the repairing platform 3, the repairing assembly 4 and the product feeding and discharging conveying line 5, the product can be repaired at a defective point before the product is subjected to die bonding, manual operation of a worker is not needed, the repairing efficiency is greatly improved, the repairing process is simpler when the product does not pass through a reflow oven because the product is subjected to the die bonding process, the repairing process is simpler than that after the reflow oven is finished, the repairing yield is higher, the total yield and single Duan Liang rate of the product production are greatly improved, and the device is applicable to direct display and backlight of MiniLEDs and can be widely applied to the MiniLED industry.

It should be noted that in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a MiniLED reprocesses equipment, includes chip charging tray (1), chip position angle adjustment subassembly (2), reprocesses platform (3) and reprocesses subassembly (4), its characterized in that: at least one chip placing groove (11) is arranged in the chip tray (1);

the chip position angle adjusting assembly (2) is positioned on one side of the chip tray (1), and the chip position angle adjusting assembly (2) comprises a chip carrying platform (21) for transferring chips and a chip triaxial adjusting assembly for adjusting the R, X, Y axial position of the chip carrying platform (21);

the repairing platform (3) is used for bearing products to be repaired, and the repairing platform (3) comprises a platform conveying line (31) positioned at one side of the chip carrying platform (21) and a platform double-shaft adjusting assembly used for driving the platform conveying line (31) to carry out X, Y shaft position adjustment;

the repair assembly (4) comprises a linear module (41), a tin-pointing support (42) and a product alignment linear module (43), a tin-pointing head (421) for tin-pointing the product is arranged on the tin-pointing support (42), a product defective point alignment camera (432) for identifying the defective point position on the product is arranged on the product alignment linear module (43), and a chip alignment camera (44), a chip position angle alignment camera (45), a chip transfer suction nozzle (46) for adsorbing chips and a product cleaning suction nozzle (47) for cleaning the defective point of the product, which are respectively corresponding to the chip tray (1) and the chip carrier (21), are arranged on the linear module (41).

2. The MiniLED repair device of claim 1, wherein: the chip tray (1) rotates and sets up on bottom plate (12), bottom plate (12) one side is provided with tray rotating electrical machines (13) that are connected through belt and chip tray (1) transmission, the bottom of bottom plate (12) is provided with tray X axle adjustment platform (14), the bottom of tray X axle adjustment platform (14) is provided with tray Y axle adjustment platform (15).

3. The MiniLED repair device of claim 1, wherein: the chip triaxial adjusting assembly comprises a chip R axis direct-drive rotary table (22) for mounting a chip carrying table (21), a chip X axis linear module (23) arranged at the bottom of the chip R axis direct-drive rotary table (22) and a chip Y axis linear module (24) arranged at the bottom of the chip X axis linear module (23).

4. The MiniLED repair device of claim 1, wherein: the double-shaft platform adjusting assembly comprises a platform X-axis linear module (32) arranged at the bottom of the platform conveying line (31) and a platform Y-axis linear module (33) arranged at the bottom of the platform X-axis linear module (32).

5. The MiniLED repair device of claim 4, wherein: the middle of platform conveying line (31) is provided with product lift cylinder, the top both sides of platform conveying line (31) all are provided with product location clamp plate (34), through platform conveying line (31) bear the product of waiting to repair, one side of platform conveying line (31) is provided with product coarse positioning cylinder (35).

6. The MiniLED repair device of claim 1, wherein: the number of the linear modules (41) is at least two, the tin-plating support (42) is positioned between the two linear modules (41), and a tin-plating linear module (422) for driving the tin-plating head (421) to adjust the Y-axis position and a tin-plating lifting module (423) for driving the tin-plating linear module (422) to adjust the Z-axis position are arranged in the tin-plating support (42).

7. The MiniLED repair device of claim 1, wherein: the product alignment linear modules (43) are arranged on the two linear modules (41) together, and product alignment lifting modules (431) for installing the product defective point alignment cameras (432) are arranged on the product alignment linear modules (43).

8. The MiniLED repair device of claim 1, wherein: the product cleaning suction nozzle (47) is arranged on a suction nozzle lifting linear motor (471), the suction nozzle lifting linear motor (471) is arranged on one of the linear modules (41), and the chip alignment camera (44), the chip position angle alignment camera (45) and the chip transferring suction nozzle (46) are arranged on the other linear module (41).

9. The MiniLED repair device of claim 1, wherein: the device also comprises a product loading and unloading conveying line (5) positioned at two sides of the repairing platform (3).

10. The MiniLED repair device of claim 9, wherein: the chip position and angle adjusting device is characterized by further comprising a marble base (6) for installing a product loading and unloading conveying line (5), a chip tray (1), a chip position and angle adjusting assembly (2), a repairing platform (3) and a repairing assembly (4).