CN114093802A - Automatic laser repair equipment and method for mini LED flip chip - Google Patents
Automatic laser repair equipment and method for mini LED flip chip Download PDFInfo
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- CN114093802A CN114093802A CN202210059548.8A CN202210059548A CN114093802A CN 114093802 A CN114093802 A CN 114093802A CN 202210059548 A CN202210059548 A CN 202210059548A CN 114093802 A CN114093802 A CN 114093802A
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- 238000012545 processing Methods 0.000 claims description 38
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- 238000006073 displacement reaction Methods 0.000 claims description 22
- 230000007246 mechanism Effects 0.000 claims description 22
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- 230000000007 visual effect Effects 0.000 claims description 7
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- 238000005476 soldering Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 129
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- 238000012958 reprocessing Methods 0.000 description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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Abstract
The invention discloses an automatic laser repair device for a mini LED flip chip, which comprises a base, wherein the base is provided with: the conveying device is used for conveying the display module to be repaired to the repair station and conveying the repaired display module away from the repair station; the system comprises a material loading platform, a light emitting diode (mini LED) chip and a Light Emitting Diode (LED) chip, wherein a plurality of mini LED chips are stored on the material loading platform; the laser repairing device is used for replacing the damaged mini LED wafer on the display module to be repaired; the laser repairing device firstly peels off the damaged mini LED wafer on the display module, and then transfers the mini LED wafer on the material loading platform to the position on the display module corresponding to the originally damaged mini LED wafer for welding. The invention provides a high-precision high-efficiency high-yield mini LED automatic flip chip repairing device and a laser repairing method, which completely realize the automation of a repairing process and solve the current situation of low efficiency and low yield depending on manpower at present.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging equipment, and particularly relates to automatic laser repair equipment and method for a mini LED flip chip.
Background
An LED is called a light-emitting diode (light-emitting diode), and converts electrical energy into light energy, a voltage is applied to 2 positive and negative terminals in a semiconductor, after a current passes through the semiconductor, electrons and holes are combined, the remaining energy is released in the form of visible light, and photon energy generates light with different wavelengths according to different materials. Direct display type LEDs are commonly used for outdoor tv walls or traffic lights, and LED chips are the mainstream products of tv, screen backlight and illumination. Is an improved version based on the traditional LED backlight and is used as the backlight source of the LCD panel.
With the development of LED wafers and the progress of packaging technology, mini LED display screens with higher resolution and better picture display effect appear on the market. The LED backlight is miniaturized and matrixed, and is dedicated to independently drive inorganic self-luminescence (self-luminescence), so that the product has longer life and even better performance than the OLED, and is regarded as the next generation display technology in the industry. Direct display and backlight modes exist for the display technology, and one display panel module has thousands or even hundreds of thousands of LED chips regardless of the mode.
Because the mini LED product of small interval needs the LED wafer's of encapsulation quantity increase by a wide margin on the same display area, and all need the LED wafer of fixed R, G, B three kinds of colours in every LED unit of display screen, lead to the mini LED product encapsulation in-process the wafer to appear and damage, the skew, the probability of neglected loading or coming off also doubles and increase, and the mini LED product on the existing market all adopts one shot forming, there is not effectual remedy measure to the defective products that appear in the production process, consequently, the defective products can only be scrapped, cause the waste and the economic loss of raw and other materials.
Chinese patent with publication number CN113471338A discloses a mini LED repair platform, which comprises a platen, a work box is arranged on the platen, a material loading component, a glue tray component, a first XY moving component and a second XY moving component, a laser component is arranged on the first XY moving component, a suction component and a glue dispensing component, the laser component comprises a laser emitter, the suction component comprises a first suction nozzle for sucking waste wafers and a second suction nozzle for sucking molten state solder paste, the glue dispensing component comprises a glue dispensing needle matched with the glue tray component, a mounting component is arranged on the second XY moving component, and the mounting component comprises a third suction nozzle for picking up new wafers from the material loading component and mounting the new wafers onto repair products in the work box. The mini LED repairing platform can repair defective products in the LED product production process, so that the products after repairing can meet the use requirements, waste caused by scrapping is prevented, raw materials are saved, and economic loss caused by producing products with poor quality is avoided.
Although the patent can repair the defective mini LED product, certain defects exist, firstly, two sets of moving assemblies are needed for a laser assembly and a mounting assembly, the requirement for space occupation is larger, the structure is not compact enough, and the whole equipment is larger in size; secondly, the position of the product to be repaired, which needs to be repaired, is identified by scanning the code, so that the position information of the damaged product needs to be packaged and stored in the code before the product is repaired, and the procedure is complicated; in addition, the size of the accommodating cavity of the working box is fixed, the size of the accommodating cavity is adjusted according to the size of the product, and when the products with different sizes need to be repaired, the equipment cannot be used.
Disclosure of Invention
The invention aims to provide automatic laser repair equipment and method for a mini LED flip chip, aiming at the problems in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides an automatic laser repair equipment of mini LED flip chip, includes the base, install on the base:
the conveying device is used for conveying the display module to be repaired to the repair station and conveying the repaired display module away from the repair station;
the system comprises a material loading platform, a light emitting diode (mini LED) chip and a Light Emitting Diode (LED) chip, wherein a plurality of mini LED chips are stored on the material loading platform;
the laser repairing device is used for replacing the damaged mini LED wafer on the display module to be repaired;
the laser repairing device firstly peels off the damaged mini LED wafer on the display module, and then transfers the mini LED wafer on the material loading platform to the position on the display module corresponding to the originally damaged mini LED wafer for welding.
The laser repairing device comprises a laser processing assembly, a wafer auxiliary removing assembly and a wafer auxiliary welding assembly, wherein the laser processing assembly is used for heating a mini LED wafer to melt soldering tin welded between the mini LED wafer and a display module; the wafer auxiliary removing assembly is used for removing the detached mini LED wafer on the display module; the wafer auxiliary welding assembly is used for transferring the mini LED wafer on the material loading platform to the display module for welding.
Furthermore, the laser processing assembly comprises a laser, a transmission optical fiber, a laser processing head and a camera module, wherein a laser beam emitted by the laser is transmitted into the laser processing head through the transmission optical fiber, and the laser processing head adjusts the laser beam and irradiates the mini LED wafer; the camera module is used for identifying the specific position of the damaged mini LED wafer on the display module, and the camera module shoots and identifies the edge or the characteristics of the display module so as to determine the specific position information of the damaged wafer.
Further, the wafer auxiliary removing assembly comprises a gas blowing pipe and a gas suction pipe; the air blowing pipe and the air suction pipe are arranged on two opposite sides of the laser processing head, the air blowing pipe is used for peeling off the desoldered mini LED wafer from the display module, and the air suction pipe is used for sucking away the damaged mini LED wafer. The invention has the advantages that the air blowing pipe and the air suction pipe are arranged to simultaneously remove the desoldered mini LED wafer in an auxiliary way, so that the efficiency is higher.
Furthermore, the wafer auxiliary welding assembly comprises a wafer suction nozzle, a suction nozzle lifting assembly, a suction nozzle rotating assembly, a tin point needle and a tin needle lifting assembly, wherein the wafer suction nozzle is used for sucking the mini LED wafer, and the tin point needle is used for adding soldering tin on the display module; the suction nozzle lifting component is used for driving the wafer suction nozzle to lift, so that the wafer suction nozzle can suck the wafer conveniently; the suction nozzle rotating assembly is used for driving the wafer suction nozzle to rotate, so that the angle of the wafer can be conveniently adjusted, and pins at the bottom of the wafer correspond to welding points at the corresponding position of the display module; the tin needle lifting assembly is used for driving the tin-dispensing needle to lift, and the tin-dispensing needle can dispense tin at a welding spot position conveniently.
Specifically, the laser repair device is installed on the base through a three-dimensional displacement mechanism, and the three-dimensional displacement mechanism includes:
the first sliding rail is transversely arranged;
two second sliding rails which are longitudinally arranged and are parallel to each other;
a third slide rail arranged vertically;
the two second slide rails are installed on the base through the upright posts, two ends of the first slide rail are installed on the second slide rails in a sliding mode, and the third slide rail is installed on the first slide rail in a sliding mode;
the third slide rail is provided with an installation plate in a sliding manner, and the laser repairing device is installed on the installation plate;
a first linear motor is arranged between the first sliding rail and the second sliding rail and used for driving the first sliding rail to longitudinally slide along the second sliding rail;
a second linear motor is arranged between the first sliding rail and the third sliding rail and is used for driving the third sliding rail to transversely slide along the first sliding rail;
and a third linear motor is arranged between the third slide rail and the mounting plate and used for driving the mounting plate to vertically slide along the third slide rail.
According to the invention, the laser processing assembly, the wafer auxiliary removing assembly and the wafer auxiliary welding assembly are integrated into the laser repairing device, and the laser repairing device is driven to move randomly in a three-dimensional space through the three-dimensional displacement mechanism, so that the volume of the equipment is reduced, the occupied space of the equipment is small, and the whole equipment is more compact.
The conveying device comprises two parallel conveying belts, the conveying belts are driven by belt pulleys at two ends, the belt pulleys are driven by a transmission motor, a cover is arranged outside the conveying belts, the conveying belts and the belt pulleys are arranged inside the cover, and a gap for placing the display module is formed between the conveying belts and the cover; the two covers are respectively arranged on the two parallel vertical plates, the two vertical plates are both arranged on a longitudinal sliding table on the base, each vertical plate comprises a fixed vertical plate and a movable vertical plate, the fixed vertical plate is fixedly arranged at one end of the sliding table, and the movable vertical plate is slidably arranged on the longitudinal sliding table; the adjustable vertical plate conveying device is characterized in that a lead screw penetrates through the fixed vertical plate and the movable vertical plate, an adjusting hand wheel is arranged at one end, close to the fixed vertical plate, of the lead screw, a lead screw fixing seat is arranged at one end, far away from the fixed vertical plate, of the lead screw, a sleeve seat matched with the lead screw is arranged at the position, in contact with the lead screw, of the movable vertical plate, and the adjusting hand wheel drives the movable vertical plate to longitudinally slide along the sliding table through rotation, so that the distance between the two parallel conveying belts is adjusted. The invention can freely adjust the distance between the two parallel conveying belts according to the size of the display module, thereby adapting to display modules with different sizes and improving the applicability of equipment.
Furthermore, a limiting assembly and a pressing assembly are arranged on the cover, the limiting assembly is used for restraining the position of the display module on the conveying belt, and the pressing assembly is used for fixing the display module on the conveying belt;
the limiting assembly comprises a limiting block and a first driving assembly, and the first driving assembly is used for driving the limiting block to block or keep the display module away;
the pressing assembly comprises a pressing block and a second driving assembly, and the second driving assembly is used for driving the pressing block to press or loosen the display module.
According to the invention, the limiting assembly and the pressing assembly are arranged on the cover, so that the display module can be fixed on a repair station when being repaired, and the position of the display module is prevented from being changed in the repair process.
The material carrying platform comprises a rotary support arranged on a base, a support plate is arranged on the rotary support, a plurality of crystal frames are uniformly arranged on the support plate around the rotary center of the rotary support, the crystal frames are rotatably arranged on the support plate, driven gears are arranged outside the crystal frames, driving gears and driving motors are arranged on the support plate, the driven gears are meshed with the driving gears or connected through a transmission belt, and the driving motors are used for driving the driving gears to rotate so as to drive the crystal frames to rotate; a blue film is arranged in the crystal frame, and a plurality of mini LED chips are paved on the blue film; an ejector pin component 309 is arranged below the crystal frame and used for ejecting the blue film in the crystal frame to separate the wafer attached to the other surface of the blue film from the blue film, so that the wafer is conveniently sucked by a wafer suction nozzle; a visual identification assembly is further arranged on one side of the material carrying platform and used for identifying whether the laser repairing device takes the mini LED wafer or not, and the wafer is prevented from not being sucked by a wafer suction nozzle; meanwhile, the visual identification component is also used for identifying the pin direction at the bottom of the wafer, and the suction nozzle rotating component on the wafer suction nozzle corresponds to the welding spot position of the corresponding position on the display module according to the pin direction. According to the invention, the plurality of crystal frames are uniformly arranged on the carrier plate around the rotating center of the rotating support, so that when all the wafers in one crystal frame are taken out, the next crystal frame is switched conveniently, and the repair efficiency is improved; the crystal frame is rotatably arranged on the carrier plate, so that the overall angle of the wafer in the crystal frame can be roughly adjusted, and the subsequent angle adjustment of a single wafer is reduced.
Corresponding to the repair equipment, the automatic laser repair method for the mini LED flip chip comprises the following steps:
s1, placing the display module to be repaired into a conveying belt of a conveying device, driving the display module to be transported along the conveying direction through the conveying belt, and blocking and fixing the display module through a limiting component and a pressing component on the conveying device when the display module reaches a repair station;
s2, driving the laser repairing device to move to a repairing station through the three-dimensional displacement mechanism, and identifying the specific position of the damaged mini LED wafer on the display module through a camera module in the laser repairing device;
s3, heating the damaged mini LED wafer through a laser processing head in the laser repairing device, and desoldering the damaged mini LED wafer; removing the detached mini LED wafer through a wafer auxiliary removing assembly in the laser repairing device;
s4, driving the laser repairing device to move above the crystal frame of the material loading platform through the three-dimensional displacement mechanism, and sucking the mini LED chip in the crystal frame through the chip auxiliary welding assembly in the laser repairing device;
s5, driving the laser repairing device to move to a repairing station through the three-dimensional displacement mechanism, performing tin dotting on the position where the mini LED wafer is taken away through the wafer auxiliary welding assembly in the laser repairing device, and placing the mini LED wafer sucked from the crystal frame on the tin dotting; heating the mini LED wafer through a laser processing head in the laser repairing device, and finishing the replacement of the damaged mini LED wafer after the point tin is heated and solidified;
s6, the display module is separated and loosened through the limiting component and the pressing component on the conveying device, the display module is driven to transmit along the conveying direction through the conveying belt, and the repaired display module is transmitted out of the conveying device.
Compared with the prior art, the invention has the beneficial effects that: (1) according to the invention, the laser processing assembly, the wafer auxiliary removing assembly and the wafer auxiliary welding assembly are integrated into the laser repairing device, and the laser repairing device is driven to move randomly in a three-dimensional space through the three-dimensional displacement mechanism, so that the volume of the equipment is reduced, the occupied space of the equipment is small, and the whole equipment is more compact. (2) According to the invention, the movable vertical plate is driven to longitudinally slide along the sliding table by rotating the adjusting hand wheel, so that the distance between the two parallel conveying belts is adjusted, and the distance between the two parallel conveying belts can be freely adjusted according to the size of the display module, so that the display module is adaptive to display modules with different sizes, and the applicability of the equipment is improved. (3) According to the invention, the plurality of crystal frames are uniformly arranged on the carrier plate around the rotating center of the rotating support, so that when all the wafers in one crystal frame are taken out, the next crystal frame is switched conveniently, and the repair efficiency is improved; the crystal frame is rotatably arranged on the carrier plate, so that the overall angle of the wafer in the crystal frame can be roughly adjusted, and the subsequent angle adjustment of a single wafer is reduced.
Drawings
Fig. 1 is a schematic view of the overall structure of the automatic laser repair apparatus of the present invention.
Fig. 2 is a schematic diagram of an internal structure of a laser repair apparatus according to an embodiment of the present invention.
Fig. 3 is a schematic view of an installation structure of the laser repairing device and the three-dimensional displacement mechanism according to the embodiment of the present invention.
FIG. 4 is a top view of a three-dimensional displacement mechanism in an embodiment of the present invention.
Fig. 5 is a perspective view of a delivery device in an embodiment of the present invention.
Fig. 6 is a top view of a delivery device in an embodiment of the invention.
Fig. 7 is a perspective view of a loading platform in an embodiment of the invention.
FIG. 8 is a top view of a display module according to an embodiment of the invention.
FIG. 9 is a front view of a display module according to an embodiment of the invention.
Fig. 10 is a schematic diagram illustrating a change in an optical path according to a movement position of a lens inside a laser processing head according to an embodiment of the present invention.
In the figure: 100. a base; 200. a conveying device; 201. a conveyor belt; 202. a belt pulley; 203. a drive motor; 204. a cover; 205. fixing the vertical plate; 206. a movable vertical plate; 207. a longitudinal sliding table; 208. a screw rod; 209. adjusting a hand wheel; 210. a screw rod fixing seat; 211. a sleeve seat; 212. a limiting block; 213. a first drive assembly; 214. briquetting; 215. a second drive assembly; 300. a material loading platform; 301. rotating the bracket; 302. a carrier plate; 303. a crystal frame; 304. a driven gear; 305. a driving gear; 306. a drive motor; 307. a drive belt; 308. a visual recognition component; 309. a thimble assembly; 400. a laser repair device; 401. a laser 402, a laser processing head; 4021. a front lens; 4022. a rear lens; 403. a camera module; 404. an air blowing pipe; 405. an air intake duct; 406. a wafer suction nozzle; 407. a suction nozzle lifting assembly; 408. a nozzle rotating assembly; 409. a tin point needle; 410. a tin pin lifting component; 500. a three-dimensional displacement mechanism; 501. a first slide rail; 502. a second slide rail; 503. a third slide rail; 504. a column; 505. mounting a plate; 506. a first linear motor; 507. a second linear motor; 508. a third linear motor; 600. a display module; 601. a mini LED wafer; 602. welding spots; 603. and (5) tin dotting.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1, the present embodiment provides an automatic laser repair apparatus for a mini LED flip chip, which includes a base 100, and the base 100 is mounted with:
the conveying device 200 is used for conveying the display module 600 to be repaired to the repair station and conveying the repaired display module 600 away from the repair station;
the loading platform 300 is characterized in that a plurality of mini LED wafers 601 are stored on the loading platform 300;
the laser repairing device 400 is used for replacing the damaged mini LED wafer 601 on the display module 600 to be repaired;
the laser repairing device 400 firstly peels off the damaged mini LED chip 601 on the display module 600, and then transfers the mini LED chip 601 on the material loading platform 300 to the position on the display module 600 corresponding to the originally damaged mini LED chip 601 for welding.
Specifically, the laser repairing device 400 comprises a laser processing assembly, a wafer auxiliary removing assembly and a wafer auxiliary welding assembly, wherein the laser processing assembly is used for heating the mini LED wafer 601 to melt soldering tin welded between the mini LED wafer 601 and the display module 600; the wafer auxiliary removing component is used for removing the mini LED wafer 601 desoldered on the display module 600; the wafer auxiliary welding assembly is used for transferring the mini LED wafer 601 on the loading platform 300 to the display module 600 for welding.
In this embodiment, the laser repair device 400 is further provided with a casing, the laser processing assembly, the wafer auxiliary removing assembly and the wafer auxiliary welding assembly are all located inside the casing, and the casing can protect and prevent dust for the parts inside the laser repair device 400.
Further, as shown in fig. 2 and 4, the laser processing assembly includes a laser 401, a transmission optical fiber, a laser processing head 402 and a camera module 403, a laser beam emitted by the laser 401 is transmitted into the laser processing head 402 through the transmission optical fiber, and the laser processing head 402 adjusts the laser beam and irradiates the adjusted laser beam on a mini LED wafer 601; the camera module 403 is used for identifying the specific position of the damaged mini LED chip 601 on the display module 600, and the camera module 403 determines the specific position information of the damaged chip by shooting and identifying the edge or the feature of the display module 600.
Further, the wafer auxiliary removing assembly comprises a gas blowing pipe 404 and a gas suction pipe 405; the air blowing pipe 404 and the air suction pipe 405 are arranged on two opposite sides of the laser processing head 402, the air blowing pipe 404 is used for peeling off the detached mini LED wafer 601 from the display module 600, and the air suction pipe 405 is used for sucking away the damaged mini LED wafer 601. In the embodiment, the air blowing pipe 404 and the air suction pipe 405 are arranged to simultaneously remove the desoldered mini LED wafer 601 in an auxiliary manner, so that the efficiency is higher.
Further, the wafer auxiliary welding assembly comprises a wafer suction nozzle 406, a suction nozzle lifting assembly 407, a suction nozzle rotating assembly 408, a tin dispensing needle 409 and a tin needle lifting assembly 410, wherein the wafer suction nozzle 406 is used for sucking the mini LED wafer 601, and the tin dispensing needle 409 is used for adding soldering tin on the display module 600; the nozzle lifting component 407 is used for driving the wafer nozzle 406 to lift, so that the wafer nozzle 406 can conveniently suck the wafer; the nozzle rotating assembly 408 is used for driving the wafer nozzle 406 to rotate, so as to adjust the angle of the wafer, and the pins at the bottom of the wafer correspond to the welding points 602 at the corresponding positions of the display module 600; the tin needle lifting component 410 is used for driving the tin point needle 409 to lift, so that the tin point needle 409 can carry out tin point at the position of the welding spot 602.
In this embodiment, the nozzle lifting assembly 407, the nozzle rotating assembly 408, and the tin pin lifting assembly 410 are all implemented by motors; the air blowing pipe 404, the air suction pipe 405 and the wafer suction nozzle 406 are all provided with air pumps in a matching way.
Specifically, as shown in fig. 1, 3 and 4, the laser repair apparatus 400 is mounted on the base 100 by a three-dimensional displacement mechanism 500, and the three-dimensional displacement mechanism 500 includes:
a first slide rail 501 arranged transversely;
two second slide rails 502 which are longitudinally arranged and are parallel to each other;
a third slide rail 503 arranged vertically;
the two second slide rails 502 are mounted on the base 100 through the upright posts 504, two ends of the first slide rail 501 are both slidably mounted on the second slide rails 502, and the third slide rail 503 is slidably mounted on the first slide rail 501;
a mounting plate 505 is slidably mounted on the third slide rail 503, and the laser repairing device 400 is mounted on the mounting plate 505;
a first linear motor 506 is installed between the first slide rail 501 and the second slide rail 502 and used for driving the first slide rail 501 to longitudinally slide along the second slide rail 502;
a second linear motor 507 is installed between the first slide rail 501 and the third slide rail 503 and is used for driving the third slide rail 503 to slide transversely along the first slide rail 501;
a third linear motor 508 is installed between the third slide rail 503 and the mounting plate 505, and is used for driving the mounting plate 505 to slide vertically along the third slide rail 503.
In the embodiment, the laser processing assembly, the wafer auxiliary removing assembly and the wafer auxiliary welding assembly are integrated into the laser repairing device 400, and the laser repairing device 400 is driven to move randomly in a three-dimensional space through the three-dimensional displacement mechanism 500, so that the size of the equipment is reduced, the occupied space of the equipment is small, and the whole equipment is more compact.
Specifically, as shown in fig. 5 and 6, the conveying device 200 includes two parallel conveying belts 201, the conveying belts 201 are driven by pulleys 202 at two ends, the pulleys 202 are driven by a driving motor 203, a cover 204 is disposed outside the conveying belts 201, both the conveying belts 201 and the pulleys 202 are disposed inside the cover 204, and the driving motor 203 is mounted outside the cover 204 at a position corresponding to the pulleys 202; a gap for placing the display module 600 is formed between the conveying belt 201 and the cover 204, and the cover 204 can vertically restrain the display module 600; the two covers 204 are respectively installed on two parallel vertical plates, the two vertical plates are both installed on a longitudinal sliding table 207 on the base 100, the vertical plates include a fixed vertical plate 205 and a movable vertical plate 206, the fixed vertical plate 205 is fixedly installed at one end of the sliding table, and the movable vertical plate 206 is slidably installed on the longitudinal sliding table 207 (a sliding rail and a sliding block are arranged on the longitudinal sliding table 207); a screw rod 208 penetrates between the fixed vertical plate 205 and the movable vertical plate 206, an adjusting hand wheel 209 is arranged at one end, close to the fixed vertical plate 205, of the screw rod 208, a screw rod 208 fixing seat is arranged at one end, far away from the fixed vertical plate 205, of the screw rod 208, a sleeve seat 211 matched with the screw rod 208 is arranged at the position, in contact with the screw rod 208, of the movable vertical plate 206, and the adjusting hand wheel 209 is rotated to drive the movable vertical plate 206 to longitudinally slide along the sliding table, so that the distance between the two parallel conveying belts 201 is adjusted. This embodiment can freely adjust the interval between two parallel conveyor belt 201 according to display module assembly 600's size to the not unidimensional display module assembly 600 of adaptation has improved the suitability of equipment.
Furthermore, a limiting assembly and a pressing assembly are arranged on the cover 204, the limiting assembly is used for limiting the position of the display module 600 on the conveying belt 201, and the pressing assembly is used for fixing the display module 600 on the conveying belt 201;
the limiting assembly comprises a limiting block 212 and a first driving assembly 213, and the first driving assembly 213 is used for driving the limiting block 212 to block or leave the display module 600;
the pressing assembly comprises a pressing block 214 and a second driving assembly 215, and the second driving assembly 215 is used for driving the pressing block 214 to press or loosen the display module 600.
In this embodiment, the first driving assembly 213 and the second driving assembly 215 are both implemented by using air cylinders (in a specific implementation process, oil cylinders or motors may be used instead of the air cylinders or the motors according to actual situations).
This embodiment can fix it on the station of reprocessing when reprocessing display module assembly 600 through set up spacing subassembly and compress tightly the subassembly on cover 204, prevents that display module assembly 600 from changing at the in-process position of reprocessing.
Specifically, as shown in fig. 7, the loading platform 300 includes a rotating bracket 301 installed on the base 100, a carrier plate 302 is installed on the rotating bracket 301, a plurality of crystal frames 303 are uniformly arranged on the carrier plate 302 around a rotation center of the rotating bracket 301, the crystal frames 303 are rotatably installed on the carrier plate 302, a driven gear 304 is arranged outside the crystal frames 303, a driving gear 305 and a driving motor 306 are installed on the carrier plate 302, the driven gear 304 is connected with the driving gear 305 through a transmission belt 307, and the driving motor 306 is used for driving the driving gear 305 to rotate, so as to drive the crystal frames 303 to rotate; a blue film is arranged in the crystal frame 303, and a plurality of mini LED chips 601 are paved on the blue film; a thimble assembly 309 is arranged below the crystal frame 303 and is used for jacking the blue film in the crystal frame 303 to separate the wafer attached to the other surface of the blue film from the blue film, so that the wafer is conveniently sucked by the wafer suction nozzle 406; as shown in fig. 1, a visual recognition component 308 is further disposed on one side of the material loading platform 300, and is used for recognizing whether the laser repairing device 400 takes the mini LED wafer 601, so as to prevent the wafer from being sucked by the wafer suction nozzle 406; meanwhile, the vision recognition component 308 is also used to recognize the lead direction of the bottom of the wafer, and the nozzle rotation component 408 on the wafer nozzle 406 corresponds to the solder joint 602 orientation at the corresponding position on the display module 600 according to the lead direction. In the embodiment, the carrier plate 302 is uniformly provided with the plurality of crystal frames 303 around the rotation center of the rotating bracket 301, so that when all the wafers in one crystal frame 303 are taken out, the next crystal frame 303 is switched, and the repair efficiency is improved; by rotatably mounting the frame 303 on the carrier plate 302, the overall angle of the wafers in the frame 303 can be coarsely adjusted, reducing the subsequent angle adjustment for individual wafers.
In this embodiment, the use method of the laser repair device includes the following steps:
firstly, putting the display module 600 to be repaired into a conveying belt 201 of a conveying device 200, driving the display module 600 to be transmitted along the conveying direction through the conveying belt 201, and blocking and fixing the display module 600 through a limiting component and a pressing component on the conveying device 200 when the display module 600 reaches a repair station;
secondly, driving the laser repairing device 400 to move to a repairing station through the three-dimensional displacement mechanism 500, and identifying the specific position of the damaged mini LED wafer 601 on the display module 600 through the camera module 403 in the laser repairing device 400;
thirdly, heating the damaged mini LED wafer 601 through the laser processing head 402 in the laser repairing device 400, and desoldering the damaged mini LED wafer 601; stripping and sucking off the stripped mini LED wafer 601 through an air blowing pipe 404 and an air suction pipe 405 in the laser repairing device 400;
fourthly, the laser repairing device 400 is driven by the three-dimensional displacement mechanism 500 to move to the position above the crystal frame 303 of the material loading platform 300, a blue film in the crystal frame 303 is jacked up by the thimble assembly 309 below the crystal frame 303, so that a wafer in the crystal frame 303 is separated from the blue film, a mini LED wafer 601 in the crystal frame 303 is sucked by the wafer suction nozzle 406 in the laser repairing device 400, the laser repairing device 400 is driven by the three-dimensional displacement mechanism 500 to move to the position above the visual identification assembly 308, whether the wafer is adsorbed on the wafer suction nozzle 406 is identified by the visual identification assembly 308, and the pin direction of the bottom of the wafer is detected; then, the angle of the wafer is adjusted by the nozzle rotating assembly 408 according to the direction of the pins at the bottom of the wafer and the direction of the welding points 602 on the display module 600, so that the direction of the pins at the bottom of the wafer is matched with the direction of the welding points 602 on the display module 600;
fifthly, as shown in fig. 8 and 9, the laser repairing device 400 is driven to move to a repairing station through the three-dimensional displacement mechanism 500, the position where the mini LED wafer 601 is taken away is subjected to tin dotting through a tin dotting needle 409 in the laser repairing device 400, and the mini LED wafer 601 sucked from the wafer frame 303 is placed on a tin dotting 603 through a wafer suction nozzle 406; the mini LED wafer 601 is heated through the laser processing head 402 in the laser repairing device 400, and the damaged mini LED wafer 601 is replaced after the tin spot 603 is heated and solidified;
sixthly, the display module assembly 600 is opened and loosened through the limiting assembly and the pressing assembly on the conveying device 200, the display module assembly 600 is driven to be transmitted along the conveying direction through the conveying belt 201, and the repaired display module assembly 600 is transmitted out of the conveying device 200.
As shown in fig. 10(a) and 10(b), fig. 10(a) is a left-view optical path schematic diagram of the inner lens of the laser processing head in the present embodiment; fig. 10(b) is a schematic top view of the optical path of the lens inside the laser processing head in the present embodiment; the size of facula can be adjusted according to the size of wafer to the laser beam machining head 402 of this embodiment, be equipped with preceding lens 4021 and back lens 4022 in the laser beam machining head 402, the position of preceding lens 4021 and back lens 4022 can be adjusted, is convenient for adjust the facula size to the wafer of adaptation different sizes. As shown in fig. 10(c), when the rear mirror 4022 of the laser processing head 402 is adjusted up and down, the long side a of the focus spot is changed to a 1; as shown in fig. 10(d), when the front mirror 4021 of the laser processing head 402 is adjusted up and down, the broadside b of the focused spot is changed to b1, and the laser processing head 402 is adjusted by this method, so that the apparatus can be adapted to repair work for mini LED wafers 601 of various sizes.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides an automatic laser repair equipment of mini LED flip chip which characterized in that, includes the base, install on the base:
the conveying device is used for conveying the display module to be repaired to the repair station and conveying the repaired display module away from the repair station;
the system comprises a material loading platform, a light emitting diode (mini LED) chip and a Light Emitting Diode (LED) chip, wherein a plurality of mini LED chips are stored on the material loading platform;
the laser repairing device is used for replacing the damaged mini LED wafer on the display module to be repaired;
the laser repairing device firstly peels off the damaged mini LED wafer on the display module, and then transfers the mini LED wafer on the material loading platform to the position on the display module corresponding to the originally damaged mini LED wafer for welding.
2. The automatic laser repair equipment for the mini LED flip chip as claimed in claim 1, wherein the laser repair device comprises a laser processing assembly, a chip auxiliary removing assembly and a chip auxiliary welding assembly, wherein the laser processing assembly is used for heating the mini LED chip to melt soldering tin for welding the mini LED chip and the display module; the wafer auxiliary removing assembly is used for removing the detached mini LED wafer on the display module; the wafer auxiliary welding assembly is used for transferring the mini LED wafer on the material loading platform to the display module for welding.
3. The automatic laser repair equipment for the mini LED flip chip as claimed in claim 2, wherein the laser processing assembly comprises a laser, a transmission optical fiber, a laser processing head and a camera module, a laser beam emitted by the laser is transmitted into the laser processing head through the transmission optical fiber, and the laser processing head adjusts the laser beam and irradiates the mini LED chip; the camera module is used for identifying the specific position of the damaged mini LED wafer on the display module.
4. The automatic laser repair equipment for mini LED flip chips as claimed in claim 2, wherein the chip auxiliary removal assembly comprises a gas blowing pipe and a gas suction pipe; the air blowing pipe and the air suction pipe are arranged on two opposite sides of the laser processing head, the air blowing pipe is used for peeling off the desoldered mini LED wafer from the display module, and the air suction pipe is used for sucking away the damaged mini LED wafer.
5. The automatic laser repair equipment for the mini LED flip chip as claimed in claim 2, wherein the wafer auxiliary welding assembly comprises a wafer suction nozzle, a suction nozzle lifting assembly, a suction nozzle rotating assembly, a tin dispensing needle and a tin needle lifting assembly, the wafer suction nozzle is used for sucking the mini LED wafer, and the tin dispensing needle is used for adding soldering tin on the display module; the suction nozzle lifting assembly is used for driving the wafer suction nozzle to lift, and the suction nozzle rotating assembly is used for driving the wafer suction nozzle to rotate; the tin needle lifting assembly is used for driving the tin-burning needle to lift.
6. The automatic laser repair equipment for mini LED flip chips as claimed in claim 1, wherein the laser repair device is mounted on the base through a three-dimensional displacement mechanism, and the three-dimensional displacement mechanism comprises:
the first sliding rail is transversely arranged;
two second sliding rails which are longitudinally arranged and are parallel to each other;
a third slide rail arranged vertically;
the two second slide rails are installed on the base through the upright posts, two ends of the first slide rail are installed on the second slide rails in a sliding mode, and the third slide rail is installed on the first slide rail in a sliding mode;
the third slide rail is provided with an installation plate in a sliding manner, and the laser repairing device is installed on the installation plate;
a first linear motor is arranged between the first sliding rail and the second sliding rail and used for driving the first sliding rail to longitudinally slide along the second sliding rail;
a second linear motor is arranged between the first sliding rail and the third sliding rail and is used for driving the third sliding rail to transversely slide along the first sliding rail;
and a third linear motor is arranged between the third slide rail and the mounting plate and used for driving the mounting plate to vertically slide along the third slide rail.
7. The automatic laser repair equipment for the mini LED flip chips as claimed in claim 1, wherein the conveying device comprises two parallel conveying belts, the conveying belts are driven by belt pulleys at two ends, the belt pulleys are driven by a driving motor, a cover is arranged outside the conveying belts, the conveying belts and the belt pulleys are arranged inside the cover, and a gap for placing the display module is arranged between the conveying belts and the cover; the two covers are respectively arranged on the two parallel vertical plates, the two vertical plates are both arranged on a longitudinal sliding table on the base, each vertical plate comprises a fixed vertical plate and a movable vertical plate, the fixed vertical plate is fixedly arranged at one end of the sliding table, and the movable vertical plate is slidably arranged on the longitudinal sliding table; the adjustable vertical plate conveying device is characterized in that a lead screw penetrates through the fixed vertical plate and the movable vertical plate, an adjusting hand wheel is arranged at one end, close to the fixed vertical plate, of the lead screw, a lead screw fixing seat is arranged at one end, far away from the fixed vertical plate, of the lead screw, a sleeve seat matched with the lead screw is arranged at the position, in contact with the lead screw, of the movable vertical plate, and the adjusting hand wheel drives the movable vertical plate to longitudinally slide along the sliding table through rotation, so that the distance between the two parallel conveying belts is adjusted.
8. The automatic laser repair equipment for the mini LED flip chips as claimed in claim 7, wherein a limiting assembly and a pressing assembly are arranged on the cover, the limiting assembly is used for limiting the position of the display module on the conveying belt, and the pressing assembly is used for fixing the display module on the conveying belt;
the limiting assembly comprises a limiting block and a first driving assembly, and the first driving assembly is used for driving the limiting block to block or keep the display module away;
the pressing assembly comprises a pressing block and a second driving assembly, and the second driving assembly is used for driving the pressing block to press or loosen the display module.
9. The automatic laser repair equipment for mini LED flip chips as claimed in claim 1, wherein the material loading platform comprises a rotating support arranged on a base, a support plate is arranged on the rotating support, a plurality of crystal frames are uniformly arranged on the support plate around the rotating center of the rotating support, the crystal frames are rotatably arranged on the support plate, a driven gear is arranged outside the crystal frames, a driving gear and a driving motor are arranged on the support plate, the driven gear is meshed with the driving gear or connected through a transmission belt, and the driving motor is used for driving the driving gear to rotate so as to drive the crystal frames to rotate; a blue film is arranged in the crystal frame, and a plurality of mini LED chips are paved on the blue film; and a visual identification assembly is further arranged on one side of the material loading platform and used for identifying whether the mini LED wafer is taken out by the laser repair device.
10. An automatic laser repair method for a mini LED flip chip, which is based on the automatic laser repair equipment for the mini LED flip chip of any one of claims 1 to 9, and is characterized by comprising the following steps:
s1, placing the display module to be repaired into a conveying belt of a conveying device, driving the display module to be transported along the conveying direction through the conveying belt, and blocking and fixing the display module through a limiting component and a pressing component on the conveying device when the display module reaches a repair station;
s2, driving the laser repairing device to move to a repairing station through the three-dimensional displacement mechanism, and identifying the specific position of the damaged mini LED wafer on the display module through a camera module in the laser repairing device;
s3, heating the damaged mini LED wafer through a laser processing head in the laser repairing device, and desoldering the damaged mini LED wafer; removing the detached mini LED wafer through a wafer auxiliary removing assembly in the laser repairing device;
s4, driving the laser repairing device to move above the crystal frame of the material loading platform through the three-dimensional displacement mechanism, and sucking the mini LED chip in the crystal frame through the chip auxiliary welding assembly in the laser repairing device;
s5, driving the laser repairing device to move to a repairing station through the three-dimensional displacement mechanism, performing tin dotting on the position where the mini LED wafer is taken away through the wafer auxiliary welding assembly in the laser repairing device, and placing the mini LED wafer sucked from the crystal frame on the tin dotting; heating the mini LED wafer through a laser processing head in the laser repairing device, and finishing the replacement of the damaged mini LED wafer after the point tin is heated and solidified;
s6, the display module is separated and loosened through the limiting component and the pressing component on the conveying device, the display module is driven to transmit along the conveying direction through the conveying belt, and the repaired display module is transmitted out of the conveying device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210059548.8A CN114093802A (en) | 2022-01-19 | 2022-01-19 | Automatic laser repair equipment and method for mini LED flip chip |
| CN202221442651.2U CN218311438U (en) | 2022-01-19 | 2022-06-10 | Automatic laser repair equipment for mini LED flip chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210059548.8A CN114093802A (en) | 2022-01-19 | 2022-01-19 | Automatic laser repair equipment and method for mini LED flip chip |
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| CN114093802A true CN114093802A (en) | 2022-02-25 |
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| CN202210059548.8A Pending CN114093802A (en) | 2022-01-19 | 2022-01-19 | Automatic laser repair equipment and method for mini LED flip chip |
| CN202221442651.2U Active CN218311438U (en) | 2022-01-19 | 2022-06-10 | Automatic laser repair equipment for mini LED flip chip |
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| CN202221442651.2U Active CN218311438U (en) | 2022-01-19 | 2022-06-10 | Automatic laser repair equipment for mini LED flip chip |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295691A (en) * | 2022-10-10 | 2022-11-04 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
| CN116072778A (en) * | 2023-03-27 | 2023-05-05 | 河北光兴半导体技术有限公司 | Direct display module chip replacing device and direct display module production line |
| CN116209126A (en) * | 2023-04-28 | 2023-06-02 | 河北光兴半导体技术有限公司 | Method and device for repairing module lamp surface |
| CN117147276A (en) * | 2023-08-14 | 2023-12-01 | 索罗曼(广州)新材料有限公司 | Multifunctional equipment for detecting performance of titanium alloy |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170003196A (en) * | 2015-06-30 | 2017-01-09 | 주식회사 오리온티엠 | Touch screen using laser reflection |
| CN107322473A (en) * | 2017-07-07 | 2017-11-07 | 叶巧敏 | A kind of auto parts machinery sanding apparatus |
| CN111843480A (en) * | 2020-08-06 | 2020-10-30 | 厦门强力巨彩光电科技有限公司 | LED display screen bottom shell assembly equipment and production process thereof |
| CN213242516U (en) * | 2020-11-20 | 2021-05-18 | 浙江庆鑫科技有限公司 | Carousel formula feed mechanism |
| CN113314440A (en) * | 2021-05-13 | 2021-08-27 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN113471338A (en) * | 2021-06-16 | 2021-10-01 | 先进光电器材（深圳）有限公司 | Mini LED repair platform |
-
2022
- 2022-01-19 CN CN202210059548.8A patent/CN114093802A/en active Pending
- 2022-06-10 CN CN202221442651.2U patent/CN218311438U/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170003196A (en) * | 2015-06-30 | 2017-01-09 | 주식회사 오리온티엠 | Touch screen using laser reflection |
| CN107322473A (en) * | 2017-07-07 | 2017-11-07 | 叶巧敏 | A kind of auto parts machinery sanding apparatus |
| CN111843480A (en) * | 2020-08-06 | 2020-10-30 | 厦门强力巨彩光电科技有限公司 | LED display screen bottom shell assembly equipment and production process thereof |
| CN213242516U (en) * | 2020-11-20 | 2021-05-18 | 浙江庆鑫科技有限公司 | Carousel formula feed mechanism |
| CN113314440A (en) * | 2021-05-13 | 2021-08-27 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN113471338A (en) * | 2021-06-16 | 2021-10-01 | 先进光电器材（深圳）有限公司 | Mini LED repair platform |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295691A (en) * | 2022-10-10 | 2022-11-04 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
| CN115295691B (en) * | 2022-10-10 | 2022-12-23 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
| CN116072778A (en) * | 2023-03-27 | 2023-05-05 | 河北光兴半导体技术有限公司 | Direct display module chip replacing device and direct display module production line |
| CN116209126A (en) * | 2023-04-28 | 2023-06-02 | 河北光兴半导体技术有限公司 | Method and device for repairing module lamp surface |
| CN117147276A (en) * | 2023-08-14 | 2023-12-01 | 索罗曼(广州)新材料有限公司 | Multifunctional equipment for detecting performance of titanium alloy |
| CN117147276B (en) * | 2023-08-14 | 2024-02-02 | 索罗曼(广州)新材料有限公司 | Multifunctional equipment for detecting performance of titanium alloy |
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| CN218311438U (en) | 2023-01-17 |
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Application publication date: 20220225 |