CN218311438U - Automatic laser repair equipment for mini LED flip chip - Google Patents
Automatic laser repair equipment for mini LED flip chip Download PDFInfo
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- CN218311438U CN218311438U CN202221442651.2U CN202221442651U CN218311438U CN 218311438 U CN218311438 U CN 218311438U CN 202221442651 U CN202221442651 U CN 202221442651U CN 218311438 U CN218311438 U CN 218311438U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Optics & Photonics (AREA)
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Abstract
The utility model discloses an automatic laser repair equipment of miniLED flip chip, the on-line screen storage device comprises a base, install on the base: the conveying device is used for conveying the display module to be repaired to the repair station and conveying the repaired display module away from the repair station; the device comprises a material loading platform, a plurality of miniLED chips and a plurality of control modules, wherein the material loading platform is used for storing a plurality of miniLED chips; the laser repairing device is used for replacing the damaged miniLED wafer on the display module to be repaired; the laser repairing device firstly peels off the damaged miniLED wafer on the display module, and then transfers the miniLED wafer on the loading platform to the position on the display module corresponding to the originally damaged miniLED wafer for welding. The utility model provides an automatic flip chip of miniLED of high accuracy high yield reprocesses equipment has realized the automation of repair process completely, has solved the current situation that relies on artifical low efficiency low yield at present.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package equipment, concretely relates to automatic laser repair equipment of mini LED flip chip.
Background
An LED is called a light-emitting diode (light-emitting diode), and converts electrical energy into light energy, a voltage is applied to 2 positive and negative terminals in a semiconductor, after a current passes through the semiconductor, electrons and holes are combined, the remaining energy is released in the form of visible light, and photon energy generates light with different wavelengths according to different materials. Direct display type LEDs are commonly used for outdoor tv walls or traffic lights, and LED chips are the mainstream products of tv, screen backlight and illumination. Is an improved version based on the traditional LED backlight and is used as the backlight source of the LCD panel.
With the development of LED wafers and the progress of packaging technology, mini LED display screens with higher resolution and better picture display effect appear on the market. The LED backlight source is miniaturized and matrixed, and dedicated to independently driving inorganic self-luminescence (self-luminescence), so that the product life is longer, and even the performance is better than that of OLED, and it is considered as the next generation display technology in the industry. Direct display and backlight modes exist for the display technology, and one display panel module has thousands or even hundreds of thousands of LED chips regardless of the mode.
Because the mini LED product of small interval needs the LED wafer's of encapsulation quantity to increase by a wide margin on the same display area, and all need fixed R in every LED unit of display screen, G, the LED wafer of the three kinds of colours of B, lead to the mini LED product encapsulation in-process to appear the wafer damage, the skew, the probability of neglected loading or coming off also doubles, and the mini LED product on the existing market all adopts one shot forming, there is not effectual remedy measure to the defective products that appear in the production process, consequently, the defective products can only be scrapped, cause the waste and the economic loss of raw and other materials.
Disclosure of Invention
The utility model aims at the problem that prior art exists, a mini LED flip chip automatic laser reprocesses equipment is provided.
In order to achieve the above object, the utility model adopts the following technical scheme:
the utility model provides an automatic laser repair equipment of mini LED flip chip, includes the base, install on the base:
the conveying device is used for conveying the display module to be repaired to the repair station and conveying the repaired display module away from the repair station;
the system comprises a material loading platform, a light emitting diode (mini LED) chip and a Light Emitting Diode (LED) chip, wherein a plurality of mini LED chips are stored on the material loading platform;
the laser repairing device is used for stripping the damaged mini LED wafer on the display module and transferring the mini LED wafer on the material loading platform to the position, corresponding to the originally damaged mini LED wafer, on the display module for welding;
a first focusing lens and a second focusing lens with adjustable positions are arranged in a laser processing head of the laser repairing device, the first focusing lens is used for focusing laser beams in the horizontal direction, and the second focusing lens is used for focusing the laser beams in the vertical direction; laser beams emitted by the laser processing head form a rectangular light spot with adjustable length and width after being focused by the first focusing lens and the second focusing lens, so that the shape and the size of the rectangular light spot are adaptive to the shape and the size of a mini LED wafer, and the laser processing head is suitable for repairing the mini LED wafers with different sizes; the rectangular light spot can cover the mini LED wafer to heat the mini LED wafer, so that the utilization rate of a light source is improved, and meanwhile, nearby modules are prevented from being damaged in the process of heating the mini LED wafer.
The laser repairing device comprises a laser processing assembly, a wafer auxiliary removing assembly and a wafer auxiliary welding assembly, wherein the laser processing assembly is used for heating a mini LED wafer to melt soldering tin welded between the mini LED wafer and a display module; the wafer auxiliary removing assembly is used for removing the mini LED wafer which is desoldered on the display module; the wafer auxiliary welding assembly is used for transferring the mini LED wafer on the material loading platform to the display module for welding.
Furthermore, the laser processing assembly comprises a laser, a transmission optical fiber, a laser processing head and a camera module, wherein a laser beam emitted by the laser is transmitted into the laser processing head through the transmission optical fiber, and the laser processing head adjusts the laser beam and irradiates the mini LED wafer; the camera module is used for identifying the specific position of the damaged mini LED wafer on the display module, and the camera module shoots and identifies the edge or the characteristics of the display module so as to determine the specific position information of the damaged wafer.
Further, the wafer auxiliary removing assembly comprises an air blowing pipe and an air suction pipe; the air blowing pipe and the air suction pipe are arranged on two opposite sides of the laser processing head, the air blowing pipe is used for peeling off the defluxing mini LED wafer from the display module, and the air suction pipe is used for sucking away the damaged mini LED wafer. The utility model discloses a set up gas blow pipe and breathing pipe and assist the getting rid of the mini LED wafer of desoldering simultaneously, efficiency is higher.
Furthermore, the wafer auxiliary welding assembly comprises a wafer suction nozzle, a suction nozzle lifting assembly, a suction nozzle rotating assembly, a tin point needle and a tin needle lifting assembly, wherein the wafer suction nozzle is used for sucking the mini LED wafer, and the tin point needle is used for adding soldering tin on the display module; the suction nozzle lifting component is used for driving the wafer suction nozzle to lift, so that the wafer suction nozzle can suck the wafer conveniently; the suction nozzle rotating assembly is used for driving the wafer suction nozzle to rotate, so that the angle of the wafer can be conveniently adjusted, and pins at the bottom of the wafer correspond to welding points at the corresponding position of the display module; the tin needle lifting assembly is used for driving the tin-dispensing needle to lift, and the tin-dispensing needle can dispense tin at a welding spot position conveniently.
Specifically, the laser repair device is installed on the base through a three-dimensional displacement mechanism, and the three-dimensional displacement mechanism includes:
the first sliding rail is transversely arranged;
two second sliding rails which are longitudinally arranged and are parallel to each other;
a third slide rail arranged vertically;
the two second slide rails are installed on the base through the upright posts, two ends of the first slide rail are installed on the second slide rails in a sliding mode, and the third slide rail is installed on the first slide rail in a sliding mode;
the third slide rail is provided with an installation plate in a sliding manner, and the laser repairing device is installed on the installation plate;
a first linear motor is arranged between the first sliding rail and the second sliding rail and used for driving the first sliding rail to longitudinally slide along the second sliding rail;
a second linear motor is arranged between the first sliding rail and the third sliding rail and is used for driving the third sliding rail to transversely slide along the first sliding rail;
and a third linear motor is arranged between the third slide rail and the mounting plate and used for driving the mounting plate to vertically slide along the third slide rail.
The utility model discloses a with the supplementary subassembly of getting rid of laser beam machining subassembly, wafer and the supplementary welding subassembly of wafer integrated to a laser reprocess the device the inside to reprocess the device through a three-dimensional displacement mechanism drive laser and remove wantonly in three-dimensional space, reduced the equipment volume, equipment occupation space is few, whole equipment is compacter.
The conveying device comprises two parallel conveying belts, the conveying belts are driven by belt pulleys at two ends, the belt pulleys are driven by a transmission motor, a cover is arranged outside the conveying belts, the conveying belts and the belt pulleys are arranged inside the cover, and a gap for placing the display module is formed between the conveying belts and the cover; the two covers are respectively arranged on the two parallel vertical plates, the two vertical plates are both arranged on a longitudinal sliding table on the base, each vertical plate comprises a fixed vertical plate and a movable vertical plate, the fixed vertical plate is fixedly arranged at one end of the sliding table, and the movable vertical plate is slidably arranged on the longitudinal sliding table; the utility model discloses a vertical conveyor belt, including fixed riser, lead screw, adjusting hand wheel, slip table longitudinal sliding, fixed riser and activity riser, it is equipped with the lead screw to run through between fixed riser and the activity riser, the one end that the lead screw is close to fixed riser is equipped with adjusting hand wheel, the one end that fixed riser was kept away from to the lead screw is equipped with the lead screw fixing base, the position that activity riser and lead screw contacted is equipped with the cover seat that matches with the lead screw, through rotatory adjusting hand wheel drives activity riser along slip table longitudinal sliding to adjust the interval between two parallel conveyor belt. The utility model discloses can freely adjust the interval between two parallel conveyor belt according to display module assembly's size to the not unidimensional display module assembly of adaptation has improved the suitability of equipment.
Furthermore, a limiting assembly and a pressing assembly are arranged on the cover, the limiting assembly is used for restraining the position of the display module on the conveying belt, and the pressing assembly is used for fixing the display module on the conveying belt;
the limiting assembly comprises a limiting block and a first driving assembly, and the first driving assembly is used for driving the limiting block to block or keep the display module away;
the pressing assembly comprises a pressing block and a second driving assembly, and the second driving assembly is used for driving the pressing block to press or loosen the display module.
The utility model discloses a set up spacing subassembly and compress tightly the subassembly on the cover, can fix it on reprocessing the station when reprocessing the display module assembly, prevent that the display module assembly from changing at the in-process position of reprocessing.
The material loading platform comprises a rotary support arranged on a base, a carrier plate is arranged on the rotary support, a plurality of crystal frames are uniformly arranged on the carrier plate around the rotary center of the rotary support, the crystal frames are rotatably arranged on the carrier plate, a driven gear is arranged outside the crystal frames, a driving gear and a driving motor are arranged on the carrier plate, the driven gear is meshed with the driving gear or connected with the driving gear through a transmission belt, and the driving motor is used for driving the driving gear to rotate so as to drive the crystal frames to rotate; a blue film is arranged in the crystal frame, and a plurality of mini LED chips are paved on the blue film; an ejector pin component 309 is arranged below the crystal frame and used for ejecting the blue film in the crystal frame to separate the wafer attached to the other surface of the blue film from the blue film, so that the wafer is conveniently sucked by a wafer suction nozzle; a visual identification assembly is further arranged on one side of the material carrying platform and used for identifying whether the laser repairing device takes the mini LED wafer or not, and the wafer is prevented from not being sucked by a wafer suction nozzle; meanwhile, the visual identification component is also used for identifying the pin direction at the bottom of the wafer, and the suction nozzle rotating component on the wafer suction nozzle corresponds to the welding spot position of the corresponding position on the display module according to the pin direction. The utility model has the advantages that the crystal frames are uniformly arranged on the support plate around the rotation center of the rotating bracket, so that when the wafers in one crystal frame are completely taken, the next crystal frame is switched, and the repair efficiency is improved; the crystal frame is rotatably arranged on the carrier plate, so that the overall angle of the wafer in the crystal frame can be roughly adjusted, and the subsequent angle adjustment of a single wafer is reduced.
Specifically, the first focusing lens and the second focusing lens are both plano-convex cylindrical lenses, the first focusing lens is vertically mounted, the second focusing lens is horizontally mounted, the first focusing lens and the second focusing lens are both movably mounted on the laser processing head through adjustable lens barrels, and when the upper position and the lower position of the first focusing lens or the second focusing lens need to be adjusted, the adjustment can be achieved by rotating the corresponding lens barrels.
Compared with the prior art, the beneficial effects of the utility model are that: (1) The utility model discloses a with the supplementary subassembly of getting rid of laser beam machining subassembly, wafer and the supplementary welding subassembly of wafer integrated to a laser reprocess the device the inside to reprocess the device through three-dimensional displacement mechanism drive laser and remove wantonly in three-dimensional space, reduced the equipment volume, equipment occupation space is few, whole equipment is compacter. (2) The utility model discloses a rotatory adjusting handle drives movable riser along slip table longitudinal sliding to adjust the interval between two parallel conveyor belt, can freely adjust the interval between two parallel conveyor belt according to display module assembly's size, thereby adaptation unidimensional display module assembly has improved the suitability of equipment. (3) The utility model has the advantages that the crystal frames are uniformly arranged on the support plate around the rotation center of the rotating bracket, so that when the wafers in one crystal frame are completely taken, the next crystal frame is switched, and the repair efficiency is improved; the crystal frame is rotatably arranged on the carrier plate, so that the overall angle of the wafer in the crystal frame can be roughly adjusted, and the subsequent angle adjustment of a single wafer is reduced. (4) The utility model discloses a set up position adjustable first focusing mirror and second focusing mirror in the laser beam machining head, the laser beam of laser beam machining head outgoing forms the rectangle facula of length and width adjustable after the focus of first focusing mirror and second focusing mirror to make the shape and size adaptation mini LED wafer of rectangle facula's shape and size, be applicable to the reprocessed of the mini LED wafer of not unidimensional; the rectangular light spot can cover the mini LED wafer to heat the mini LED wafer, the utilization rate of a light source is improved, and meanwhile, nearby modules are prevented from being damaged in the process of heating the mini LED wafer.
Drawings
Fig. 1 is the overall structure schematic diagram of the automatic laser repair equipment of the utility model.
Fig. 2 is the schematic diagram of the internal structure of the laser repairing device in the embodiment of the present invention.
Fig. 3 is a schematic view of the installation structure of the laser repair device and the three-dimensional displacement mechanism in the embodiment of the present invention.
Fig. 4 is a top view of a three-dimensional displacement mechanism according to an embodiment of the present invention.
Fig. 5 is a perspective view of the conveying device in the embodiment of the present invention.
Fig. 6 is a top view of a conveying device according to an embodiment of the present invention.
Fig. 7 is a perspective view of the material loading platform in the embodiment of the present invention.
Fig. 8 is a top view of a display module according to an embodiment of the present invention.
Fig. 9 is a front view of the display module according to the embodiment of the present invention.
Fig. 10 is a schematic optical path diagram of the embodiment of the present invention, in which the laser beam is focused by the first focusing lens and the second focusing lens.
Fig. 11 is a schematic diagram of the change of the optical path corresponding to the moving position of the lens inside the laser processing head according to the embodiment of the present invention.
In the figure: 100. a base; 200. a conveying device; 201. a conveyor belt; 202. a belt pulley; 203. a drive motor; 204. A cover; 205. fixing the vertical plate; 206. a movable vertical plate; 207. a longitudinal sliding table; 208. a screw rod; 209. adjusting a hand wheel; 210. a screw rod fixing seat; 211. a sleeve seat; 212. a limiting block; 213. a first drive assembly; 214. briquetting; 215. a second drive assembly; 300. a material loading platform; 301. rotating the bracket; 302. a carrier plate; 303. a crystal frame; 304. a driven gear; 305. a driving gear; 306. a drive motor; 307. a drive belt; 308. a visual recognition component; 309. a thimble assembly; 400. a laser repair device; 401. a laser 402, a laser processing head; 4021. a first focusing mirror; 4022. a second focusing mirror; 403. a camera module; 404. an air blowing pipe; 405. an air intake duct; 406. a wafer suction nozzle; 407. a suction nozzle lifting assembly; 408. a nozzle rotating assembly; 409. a tin point needle; 410. a tin pin lifting component; 500. a three-dimensional displacement mechanism; 501. A first slide rail; 502. a second slide rail; 503. a third slide rail; 504. a column; 505. mounting a plate; 506. a first linear motor; 507. a second linear motor; 508. a third linear motor; 600. a display module; 601. a mini LED wafer; 602. welding spots; 603. and (5) tin dotting.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically, electrically or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1, the present embodiment provides an automatic laser repair apparatus for a mini LED flip chip, which includes a base 100, and the base 100 is mounted with:
the conveying device 200 is used for conveying the display module 600 to be repaired to the repair station and conveying the repaired display module 600 away from the repair station;
the loading platform 300 is characterized in that a plurality of mini LED wafers 601 are stored on the loading platform 300;
the laser repairing device 400 is used for stripping the damaged mini LED wafer 601 on the display module 600 and transferring the mini LED wafer 601 on the material loading platform 300 to the position, corresponding to the originally damaged mini LED wafer, on the display module 600 for welding;
a first focusing lens 4021 and a second focusing lens 4022 with adjustable positions are arranged in a laser processing head 402 of the laser repair device 400, the first focusing lens 4021 is used for focusing laser beams in the horizontal direction, and the second focusing lens 4022 is used for focusing laser beams in the vertical direction; laser beams emitted by the laser processing head 402 are focused by the first focusing lens 4021 and the second focusing lens 4022 to form rectangular light spots with adjustable length and width, so that the shape and size of the rectangular light spots are adaptive to the shape and size of the mini LED wafer 601, and the laser processing head is applicable to repair of the mini LED wafer 601 with different sizes; the rectangular light spot can cover the mini LED wafer to heat the mini LED wafer, the utilization rate of a light source is improved, and meanwhile, nearby modules are prevented from being damaged in the process of heating the mini LED wafer.
Specifically, the laser repairing device 400 comprises a laser processing assembly, a wafer auxiliary removing assembly and a wafer auxiliary welding assembly, wherein the laser processing assembly is used for heating the mini LED wafer 601 to melt soldering tin welded between the mini LED wafer 601 and the display module 600; the wafer auxiliary removing component is used for removing the mini LED wafer 601 desoldered on the display module 600; the wafer auxiliary welding assembly is used for transferring the mini LED wafer 601 on the loading platform 300 to the display module 600 for welding.
In this embodiment, the laser repair device 400 is further provided with a housing, the laser processing assembly, the wafer auxiliary removing assembly and the wafer auxiliary welding assembly are all located inside the housing, and the housing can protect and prevent dust for parts inside the laser repair device 400.
Further, as shown in fig. 2 and 4, the laser processing assembly includes a laser 401, a transmission optical fiber, a laser processing head 402 and a camera module 403, a laser beam emitted by the laser 401 is transmitted into the laser processing head 402 through the transmission optical fiber, and the laser processing head 402 adjusts the laser beam and irradiates the mini LED wafer 601; the camera module 403 is used for identifying the specific position of the damaged mini LED chip 601 on the display module 600, and the camera module 403 is used for shooting and identifying the edge or the feature of the display module 600, so as to determine the specific position information of the damaged chip.
Further, the wafer auxiliary removing assembly comprises a gas blowing pipe 404 and a gas suction pipe 405; the air blowing pipe 404 and the air suction pipe 405 are arranged on two opposite sides of the laser processing head 402, the air blowing pipe 404 is used for peeling off the desoldering mini LED wafer 601 from the display module 600, and the air suction pipe 405 is used for sucking away the damaged mini LED wafer 601. In the embodiment, the air blowing pipe 404 and the air suction pipe 405 are arranged to simultaneously remove the desoldered mini LED wafer 601 in an auxiliary manner, so that the efficiency is higher.
Further, the wafer auxiliary welding assembly comprises a wafer suction nozzle 406, a suction nozzle lifting assembly 407, a suction nozzle rotating assembly 408, a tin dispensing needle 409 and a tin needle lifting assembly 410, wherein the wafer suction nozzle 406 is used for sucking the mini LED wafer 601, and the tin dispensing needle 409 is used for adding soldering tin on the display module 600; the nozzle lifting component 407 is used for driving the wafer suction nozzle 406 to lift, so that the wafer suction nozzle 406 can suck a wafer conveniently; the nozzle rotating assembly 408 is used for driving the wafer nozzle 406 to rotate, so as to adjust the angle of the wafer, and the pins at the bottom of the wafer correspond to the welding points 602 at the corresponding positions of the display module 600; the tin needle lifting component 410 is used for driving the tin point needle 409 to lift, so that the tin point needle 409 can carry out tin point at the position of the welding spot 602.
In this embodiment, the suction nozzle lifting assembly 407, the suction nozzle rotating assembly 408, and the tin pin lifting assembly 410 are all implemented by motors; the air blowing pipe 404, the air suction pipe 405 and the wafer suction nozzle 406 are all provided with air pumps in a matching way.
Specifically, as shown in fig. 1, 3 and 4, the laser repair device 400 is mounted on the base 100 by a three-dimensional displacement mechanism 500, and the three-dimensional displacement mechanism 500 includes:
a first slide rail 501 arranged transversely;
two second slide rails 502 which are longitudinally arranged and are parallel to each other;
a third slide rail 503 arranged vertically;
the two second slide rails 502 are mounted on the base 100 through the upright posts 504, two ends of the first slide rail 501 are both slidably mounted on the second slide rails 502, and the third slide rail 503 is slidably mounted on the first slide rail 501;
a mounting plate 505 is slidably mounted on the third slide rail 503, and the laser repairing device 400 is mounted on the mounting plate 505;
a first linear motor 506 is arranged between the first slide rail 501 and the second slide rail 502 and is used for driving the first slide rail 501 to slide longitudinally along the second slide rail 502;
a second linear motor 507 is installed between the first slide rail 501 and the third slide rail 503 and is used for driving the third slide rail 503 to slide transversely along the first slide rail 501;
a third linear motor 508 is installed between the third slide rail 503 and the mounting plate 505, and is configured to drive the mounting plate 505 to slide vertically along the third slide rail 503.
In the embodiment, the laser processing assembly, the wafer auxiliary removing assembly and the wafer auxiliary welding assembly are integrated into the laser repairing device 400, and the laser repairing device 400 is driven to move randomly in a three-dimensional space through the three-dimensional displacement mechanism 500, so that the size of the equipment is reduced, the occupied space of the equipment is small, and the whole equipment is more compact.
Specifically, as shown in fig. 5 and 6, the conveying device 200 includes two parallel conveying belts 201, the conveying belts 201 are driven by pulleys 202 at two ends, the pulleys 202 are driven by a driving motor 203, a cover 204 is disposed outside the conveying belts 201, both the conveying belts 201 and the pulleys 202 are disposed inside the cover 204, and the driving motor 203 is mounted outside the cover 204 at a position corresponding to the pulleys 202; a gap for placing the display module 600 is formed between the conveying belt 201 and the cover 204, and the cover 204 can vertically restrain the display module 600; the two covers 204 are respectively installed on two parallel vertical plates, the two vertical plates are both installed on a longitudinal sliding table 207 on the base 100, the vertical plates include a fixed vertical plate 205 and a movable vertical plate 206, the fixed vertical plate 205 is fixedly installed at one end of the sliding table, and the movable vertical plate 206 is slidably installed on the longitudinal sliding table 207 (a sliding rail and a sliding block are arranged on the longitudinal sliding table 207); a screw rod 208 penetrates between the fixed vertical plate 205 and the movable vertical plate 206, an adjusting hand wheel 209 is arranged at one end, close to the fixed vertical plate 205, of the screw rod 208, a screw rod 208 fixing seat is arranged at one end, far away from the fixed vertical plate 205, of the screw rod 208, a sleeve seat 211 matched with the screw rod 208 is arranged at the position, in contact with the screw rod 208, of the movable vertical plate 206, and the adjusting hand wheel 209 is rotated to drive the movable vertical plate 206 to longitudinally slide along the sliding table, so that the distance between the two parallel conveying belts 201 is adjusted. This embodiment can freely adjust the interval between two parallel conveyor belt 201 according to display module assembly 600's size to the not unidimensional display module assembly 600 of adaptation has improved the suitability of equipment.
Furthermore, a limiting assembly and a pressing assembly are arranged on the cover 204, the limiting assembly is used for limiting the position of the display module 600 on the conveying belt 201, and the pressing assembly is used for fixing the display module 600 on the conveying belt 201;
the limiting component comprises a limiting block 212 and a first driving component 213, and the first driving component 213 is used for driving the limiting block 212 to block or keep away the display module 600;
the pressing assembly comprises a pressing block 214 and a second driving assembly 215, and the second driving assembly 215 is used for driving the pressing block 214 to press or loosen the display module 600.
In this embodiment, the first driving assembly 213 and the second driving assembly 215 are both implemented by using air cylinders (in a specific implementation process, oil cylinders or motors may be used instead of the air cylinders or the motors according to actual situations).
This embodiment can fix it on the station of reprocessing when reprocessing display module assembly 600 through set up spacing subassembly and compress tightly the subassembly on cover 204, prevents that display module assembly 600 from changing at the in-process position of reprocessing.
Specifically, as shown in fig. 7, the loading platform 300 includes a rotating bracket 301 installed on the base 100, a carrier plate 302 is installed on the rotating bracket 301, a plurality of crystal frames 303 are uniformly arranged on the carrier plate 302 around a rotation center of the rotating bracket 301, the crystal frames 303 are rotatably installed on the carrier plate 302, a driven gear 304 is arranged outside the crystal frames 303, a driving gear 305 and a driving motor 306 are installed on the carrier plate 302, the driven gear 304 is connected with the driving gear 305 through a transmission belt 307, and the driving motor 306 is used for driving the driving gear 305 to rotate, so as to drive the crystal frames 303 to rotate; a blue film is arranged in the crystal frame 303, and a plurality of mini LED chips 601 are paved on the blue film; a thimble assembly 309 is arranged below the crystal frame 303 and is used for jacking the blue film in the crystal frame 303 to separate the wafer attached to the other surface of the blue film from the blue film, so that the wafer is conveniently sucked by the wafer suction nozzle 406; as shown in fig. 1, a visual recognition component 308 is further disposed on one side of the material loading platform 300, and is used for recognizing whether the laser repairing device 400 takes the mini LED wafer 601, so as to prevent the wafer from being sucked by the wafer suction nozzle 406; meanwhile, the vision recognition component 308 is also used to recognize the lead direction of the bottom of the wafer, and the nozzle rotation component 408 on the wafer nozzle 406 corresponds to the solder joint 602 orientation at the corresponding position on the display module 600 according to the lead direction. In the embodiment, the carrier plate 302 is uniformly provided with the plurality of crystal frames 303 around the rotation center of the rotating bracket 301, so that when all the wafers in one crystal frame 303 are taken out, the next crystal frame 303 is switched, and the repair efficiency is improved; by rotatably mounting the frame 303 on the carrier plate 302, the overall angle of the wafers in the frame 303 can be coarsely adjusted, reducing the subsequent angle adjustment for individual wafers.
Specifically, as shown in fig. 10, the first focusing lens 4021 and the second focusing lens 4022 are both plano-convex cylindrical lenses, the first focusing lens 4021 is vertically installed, the second focusing lens 4022 is horizontally installed, the first focusing lens 4021 and the second focusing lens 4022 are both movably installed on the laser processing head through adjustable lens barrels, and when the up-down position of the first focusing lens 4021 or the second focusing lens 4022 needs to be adjusted, the adjustment can be achieved by rotating the corresponding lens barrels.
As shown in fig. 11 (a) and 11 (b), fig. 11 (a) is a left-view optical path schematic diagram of the inner lens of the laser processing head in the present embodiment; fig. 11 (b) is a schematic top view of the optical path of the inner lens of the laser processing head in the present embodiment; as shown in fig. 11 (c), when the second focusing mirror 4022 of the laser processing head 402 is adjusted up and down, the length of the focused spot is changed from a to a1; as shown in fig. 11 (d), when the first focusing mirror 4021 of the laser processing head 402 is adjusted up and down, the width of the focused spot is changed from b to b1, and the laser processing head 402 is adjusted by this method, so that the apparatus can be adapted to repair work for mini LED wafers 601 of various sizes.
In this embodiment, the working process of the laser repair device includes the following steps:
firstly, putting the display module 600 to be repaired into the conveying belt 201 of the conveying device 200, driving the display module 600 to be transmitted along the conveying direction through the conveying belt 201, and blocking and fixing the display module 600 through the limiting component and the pressing component on the conveying device 200 when the display module 600 reaches the repair station;
secondly, driving the laser repairing device 400 to move to a repairing station through the three-dimensional displacement mechanism 500, and identifying the specific position of the damaged mini LED wafer 601 on the display module 600 through the camera module 403 in the laser repairing device 400;
thirdly, heating the damaged mini LED wafer 601 through the laser processing head 402 in the laser repairing device 400, and desoldering the damaged mini LED wafer 601; stripping and sucking off the stripped mini LED wafer 601 through an air blowing pipe 404 and an air suction pipe 405 in the laser repairing device 400;
fourthly, the laser repairing device 400 is driven by the three-dimensional displacement mechanism 500 to move to the position above the crystal frame 303 of the material loading platform 300, a blue film in the crystal frame 303 is jacked up by the thimble assembly 309 below the crystal frame 303, so that a wafer in the crystal frame 303 is separated from the blue film, a mini LED wafer 601 in the crystal frame 303 is sucked by the wafer suction nozzle 406 in the laser repairing device 400, the laser repairing device 400 is driven by the three-dimensional displacement mechanism 500 to move to the position above the visual identification assembly 308, whether the wafer is adsorbed on the wafer suction nozzle 406 is identified by the visual identification assembly 308, and the pin direction of the bottom of the wafer is detected; then, the angle of the wafer is adjusted by the nozzle rotating assembly 408 according to the direction of the pins at the bottom of the wafer and the direction of the welding points 602 on the display module 600, so that the direction of the pins at the bottom of the wafer is matched with the direction of the welding points 602 on the display module 600;
fifthly, as shown in fig. 8 and 9, the laser repairing device 400 is driven to move to a repairing station through the three-dimensional displacement mechanism 500, the position where the mini LED wafer 601 is taken away is subjected to tin dotting through a tin dotting needle 409 in the laser repairing device 400, and the mini LED wafer 601 sucked from the wafer frame 303 is placed on a tin dotting 603 through a wafer suction nozzle 406; the mini LED wafer 601 is heated through the laser processing head 402 in the laser repairing device 400, and the damaged mini LED wafer 601 is replaced after the tin spot 603 is heated and solidified;
sixthly, the display module assembly 600 is opened and loosened through the limiting assembly and the pressing assembly on the conveying device 200, the display module assembly 600 is driven to be transmitted along the conveying direction through the conveying belt 201, and the repaired display module assembly 600 is transmitted out of the conveying device 200.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; these modifications and substitutions do not depart from the essence of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides an automatic laser repair equipment of mini LED flip chip which characterized in that, includes the base, install on the base:
the conveying device is used for conveying the display module to be repaired to the repair station and conveying the repaired display module away from the repair station;
the system comprises a material loading platform, a light emitting diode (mini LED) chip and a control system, wherein a plurality of mini LED chips are stored on the material loading platform;
the laser repairing device is used for stripping the damaged mini LED wafer on the display module and transferring the mini LED wafer on the material loading platform to the position, corresponding to the original damaged mini LED wafer, on the display module for welding;
a first focusing lens and a second focusing lens with adjustable positions are arranged in a laser processing head of the laser repairing device, the first focusing lens is used for focusing laser beams in the horizontal direction, and the second focusing lens is used for focusing the laser beams in the vertical direction; laser beams emitted by the laser processing head are focused by the first focusing lens and the second focusing lens to form rectangular light spots with adjustable length and width.
2. The automatic laser repair equipment for mini LED flip chips as claimed in claim 1, wherein the first focusing lens and the second focusing lens are both plano-convex cylindrical lenses, the first focusing lens is vertically mounted, and the second focusing lens is horizontally mounted.
3. The automatic laser repair equipment for the mini LED flip chip as claimed in claim 1, wherein the laser repair device comprises a laser processing assembly, a chip auxiliary removing assembly and a chip auxiliary welding assembly, wherein the laser processing assembly is used for heating the mini LED chip to melt soldering tin for welding the mini LED chip and the display module; the wafer auxiliary removing assembly is used for removing the mini LED wafer which is desoldered on the display module; the wafer auxiliary welding assembly is used for transferring the mini LED wafer on the material loading platform to the display module for welding.
4. The automatic laser repair equipment for the mini LED flip chip as claimed in claim 3, wherein the laser processing assembly comprises a laser, a transmission optical fiber, a laser processing head and a camera module, a laser beam emitted by the laser is transmitted into the laser processing head through the transmission optical fiber, and the laser processing head adjusts the laser beam and irradiates the mini LED chip; the camera module is used for identifying the specific position of the damaged mini LED wafer on the display module.
5. The automatic laser repair equipment for mini LED flip chips as claimed in claim 3, wherein the chip auxiliary removal assembly comprises a gas blowing pipe and a gas suction pipe; the air blowing pipe and the air suction pipe are arranged on two opposite sides of the laser processing head, the air blowing pipe is used for peeling off the defluxing mini LED wafer from the display module, and the air suction pipe is used for sucking away the damaged mini LED wafer.
6. The automatic laser repair equipment for the mini LED flip chip as claimed in claim 3, wherein the wafer auxiliary welding assembly comprises a wafer suction nozzle, a suction nozzle lifting assembly, a suction nozzle rotating assembly, a tin dispensing needle and a tin needle lifting assembly, the wafer suction nozzle is used for sucking the mini LED wafer, and the tin dispensing needle is used for adding soldering tin on the display module; the suction nozzle lifting assembly is used for driving the wafer suction nozzle to lift, and the suction nozzle rotating assembly is used for driving the wafer suction nozzle to rotate; the tin needle lifting assembly is used for driving the tin-burning needle to lift.
7. The automatic laser repair equipment for mini LED flip chips as claimed in claim 3, wherein the laser repair device is mounted on the base through a three-dimensional displacement mechanism, and the three-dimensional displacement mechanism comprises:
the first sliding rail is transversely arranged;
two second sliding rails which are longitudinally arranged and are parallel to each other;
a third slide rail arranged vertically;
the two second slide rails are arranged on the base through the upright posts, two ends of the first slide rail are arranged on the second slide rails in a sliding manner, and the third slide rail is arranged on the first slide rail in a sliding manner;
the third slide rail is provided with an installation plate in a sliding manner, and the laser repairing device is installed on the installation plate;
a first linear motor is arranged between the first sliding rail and the second sliding rail and used for driving the first sliding rail to longitudinally slide along the second sliding rail;
a second linear motor is arranged between the first sliding rail and the third sliding rail and used for driving the third sliding rail to transversely slide along the first sliding rail;
and a third linear motor is arranged between the third slide rail and the mounting plate and used for driving the mounting plate to vertically slide along the third slide rail.
8. The automatic laser repair equipment for mini LED flip chips as claimed in claim 3, wherein the conveying device comprises two parallel conveying belts, the conveying belts are driven by pulleys at two ends, the pulleys are driven by a driving motor, a cover is arranged outside the conveying belts, the conveying belts and the pulleys are arranged inside the cover, and a gap for placing the display module is arranged between the conveying belts and the cover; the two covers are respectively arranged on the two parallel vertical plates, the two vertical plates are both arranged on a longitudinal sliding table on the base, each vertical plate comprises a fixed vertical plate and a movable vertical plate, the fixed vertical plate is fixedly arranged at one end of the sliding table, and the movable vertical plate is slidably arranged on the longitudinal sliding table; the adjustable vertical plate conveying device is characterized in that a lead screw penetrates through the fixed vertical plate and the movable vertical plate, an adjusting hand wheel is arranged at one end, close to the fixed vertical plate, of the lead screw, a lead screw fixing seat is arranged at one end, far away from the fixed vertical plate, of the lead screw, a sleeve seat matched with the lead screw is arranged at the position, in contact with the lead screw, of the movable vertical plate, and the adjusting hand wheel drives the movable vertical plate to longitudinally slide along the sliding table through rotation, so that the distance between the two parallel conveying belts is adjusted.
9. The automatic laser repairing equipment for the mini LED flip chip as claimed in claim 8, wherein a limiting component and a pressing component are arranged on the cover, the limiting component is used for restricting the position of the display module on the conveying belt, and the pressing component is used for fixing the display module on the conveying belt;
the limiting assembly comprises a limiting block and a first driving assembly, and the first driving assembly is used for driving the limiting block to block or keep the display module away;
the pressing assembly comprises a pressing block and a second driving assembly, and the second driving assembly is used for driving the pressing block to press or loosen the display module.
10. The automatic laser repairing equipment for mini LED flip chips as claimed in claim 1, wherein the material loading platform comprises a rotating bracket mounted on a base, a carrier plate is mounted on the rotating bracket, a plurality of crystal frames are uniformly arranged on the carrier plate around the rotating center of the rotating bracket, the crystal frames are rotatably mounted on the carrier plate, a driven gear is arranged outside the crystal frames, a driving gear and a driving motor are mounted on the carrier plate, the driven gear is meshed with the driving gear or connected through a transmission belt, and the driving motor is used for driving the driving gear to rotate so as to drive the crystal frames to rotate; a blue film is arranged in the crystal frame, and a plurality of mini LED chips are paved on the blue film; and a visual identification assembly is further arranged on one side of the material loading platform and used for identifying whether the mini LED wafer is taken out by the laser repair device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210059548.8A CN114093802A (en) | 2022-01-19 | 2022-01-19 | Automatic laser repair equipment and method for mini LED flip chip |
| CN2022100595488 | 2022-01-19 |
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| CN218311438U true CN218311438U (en) | 2023-01-17 |
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| CN202210059548.8A Pending CN114093802A (en) | 2022-01-19 | 2022-01-19 | Automatic laser repair equipment and method for mini LED flip chip |
| CN202221442651.2U Active CN218311438U (en) | 2022-01-19 | 2022-06-10 | Automatic laser repair equipment for mini LED flip chip |
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| CN115295691B (en) * | 2022-10-10 | 2022-12-23 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
| CN116072778A (en) * | 2023-03-27 | 2023-05-05 | 河北光兴半导体技术有限公司 | Direct display module chip replacing device and direct display module production line |
| CN116209126A (en) * | 2023-04-28 | 2023-06-02 | 河北光兴半导体技术有限公司 | Method and device for repairing module lamp surface |
| CN117147276B (en) * | 2023-08-14 | 2024-02-02 | 索罗曼(广州)新材料有限公司 | Multifunctional equipment for detecting performance of titanium alloy |
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| KR20170003196A (en) * | 2015-06-30 | 2017-01-09 | 주식회사 오리온티엠 | Touch screen using laser reflection |
| CN107322473A (en) * | 2017-07-07 | 2017-11-07 | 叶巧敏 | A kind of auto parts machinery sanding apparatus |
| CN111843480A (en) * | 2020-08-06 | 2020-10-30 | 厦门强力巨彩光电科技有限公司 | LED display screen bottom shell assembly equipment and production process thereof |
| CN213242516U (en) * | 2020-11-20 | 2021-05-18 | 浙江庆鑫科技有限公司 | Carousel formula feed mechanism |
| CN113314440B (en) * | 2021-05-13 | 2022-05-06 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN113471338A (en) * | 2021-06-16 | 2021-10-01 | 先进光电器材（深圳）有限公司 | Mini LED repair platform |
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