KR102038521B1 - Apparatus and method of reworking led element in led display substrate - Google Patents

Abstract

The present invention relates to an apparatus and method for reproducing an LED substrate, and provides an apparatus and method for automatically replacing a new normal element even if some elements of the LED substrate are defective and the width and length of the element are microscopically 225 μm or less. .

Description

Regeneration device and method of LED substrate {APPARATUS AND METHOD OF REWORKING LED ELEMENT IN LED DISPLAY SUBSTRATE}

The present invention relates to an apparatus and method for reproducing an LED substrate, and more particularly, to an LED panel reproducing apparatus for regenerating an LED substrate by replacing a defective LED element having a width and length of 225 µm or less with a new LED element. It is about a method.

The display device is widely used as a device for reproducing a clear image or a moving picture. The display device displays an image in various ways such as LCD, LED, OLED, etc. The LED display device displays an image in which LED elements emitting light by themselves are densely and vertically arranged.

That is, in the LED display device, a plurality of LED elements emitting and displaying red (R), green (G), and blue (B) are arranged vertically and horizontally, and each color of the LED element is selected by a current applied to the LED element. The image is displayed while emitting light.

Recently, the size of the display device is changing in a large area. In the large-area LED display device, if any of the LED elements distributed vertically and wider in a larger area occurs, the display device must be disposed of as a defective device. Therefore, it is important to reduce the defects. This is the same not only in the case of one display device displaying one image, but also in the case of an electronic display or the like in which dozens or thousands of display devices are closely and vertically aligned to display one image.

However, as the unit size of the display device is gradually changed to a large area, the probability of a failure occurring in any one or more of a number of LED elements becomes high, resulting in a problem that the yield of mass production is gradually lowered. Moreover, in recent years, since the size of the pixels is getting smaller in order to express a clearer and more detailed image, the size of the LED element becomes smaller and the size of the element has begun to be applied to the ultra-small size of 125 μm * 225 μm.

Therefore, conventionally, since the size of the LED element is relatively large, when some LED elements of a large area LED substrate are poorly connected to the substrate or are bonded in the wrong posture, the operator wears a microscope and manually replaces the LED element. Could. However, as the width and length of the LED elements are applied in a very small size of 225 μm or less, a problem arises in that it is impossible to replace the LED elements manually by hand.

Accordingly, there is an urgent need for a regeneration process in which an LED element is formed in an ultra-small size so that only a defective element is replaced with a new normal element to operate as a normal display device.

In order to solve the above problems, the present invention, even if the LED element of the LED substrate of the LED display device is a very small size of 225㎛ or less, successfully replace the defective device with a new normal device, to reproduce the LED substrate ( to rework).

In addition, an object of the present invention is to minimize the damage of the LED element in the process of separating the LED element from the mother substrate to which the ultra-small LED element is attached, and to prevent a process error from occurring.

In addition, the present invention, in the process of joining a new device to the region where the defective device was located, it is an object to ensure that the ultra-small devices are not bonded in the wrong posture by the flow due to the melting of the solder, thereby ensuring the reliability of regeneration. .

Through this, an object of the present invention is to enable a reproducing process by replacing an LED element which is impossible by hand, without error.

In order to achieve the above object of the present invention, the present invention, the solder supply unit for supplying a solder (solder) to the first region where the defective element of the LED substrate is located; A picker for placing a new first element in the first region when solder is supplied to the first region; A laser beam irradiator which irradiates a laser beam while the first element is located in the first region, and integrally connects and fixes the first element to the LED substrate via the solder; It provides an apparatus for reproducing an LED substrate comprising a.

On the other hand, according to another field of the invention, the present invention, the substrate supply step of supplying an LED substrate containing a defective element to a predetermined position; A defective device removing step of separating and removing the defective device from the LED substrate; A solder supply step of supplying solder to a first region in which the defective element is located; A first element positioning step of placing a new first element of the same kind as the defective element in the first region with a picker; A first device coupling step of coupling the first device to the LED substrate by irradiating the solder with a laser beam; It provides a method for regenerating an LED substrate comprising a.

The term 'solder' described in the present specification and claims is defined as referring to a material of any component that can be bonded while being melted and then cured while maintaining electrical connectivity.

The term 'melt' and similar terms described in the specification and claims are not limited to referring to a state in which the solder is completely melted, and refers to a state in which at least part of the solder is in a solid state to a gel state or a liquid state. define.

As described above, according to the present invention, even when the LED element of the LED substrate of the LED display device has a micro size of 225 μm or less, there is an effect of regenerating the LED substrate by replacing the defective element with a new normal element.

In addition, the present invention, in the process of separating the LED element from the mother substrate to which the small LED element is attached, there is an effect of minimizing the damage of the LED element and reliably separated without the error of separation to minimize the occurrence of process errors.

In addition, the present invention, in the process of bonding a new device to the region where the defective device was located, by holding the LED device in the suction gripping state with a picker while the laser beam is irradiated, by the flow due to the melting of the solder microelement The effect of improving the reliability of the reproduction can be obtained by preventing the combination of the positions in the wrong posture.

In addition, the present invention, in the process of irradiating a laser beam and the new device is bonded to the LED substrate via the solder, by monitoring the temperature so that the temperature of the device is kept below the allowable temperature, the normal operation after replacing the device A guaranteed effect can be obtained.

As a result, the present invention enables the LED substrate regeneration process to be performed without error by replacing the LED element, which is impossible by hand, thereby increasing the yield even in a large-area display device and improving the economic efficiency.

1 is a perspective view showing the configuration of an LED substrate reproducing apparatus according to an embodiment of the present invention;
2 is a block diagram schematically showing the configuration of FIG. 1;
3 is a perspective view showing a module in which a laser beam irradiator and a picker are coupled;
4 is a schematic diagram showing the configuration of a laser beam irradiator and a camera;
5 is a view showing the configuration of the substrate supply unit and the substrate discharge unit of FIG.
6 is a flowchart sequentially showing a method of regenerating an LED substrate according to an embodiment of the present invention;
7A to 7H are schematic views showing the configuration according to the regeneration process of the LED substrate;
8 is a diagram showing the configuration of a mother plate on which an LED element is mounted;
9A and 9B are enlarged views of part 'A' of FIG. 7F to explain the principle of suction-holding the LED element from the mother plate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numerals refer to substantially the same elements, and may be described by quoting contents described in other drawings under such a rule, and any contents repeated or deemed apparent to those skilled in the art may be omitted.

As shown in the drawing, the apparatus 100 for reproducing an LED substrate according to the present invention includes a substrate supply unit 110 for supplying an LED substrate G including a defective element S ', and a supplied LED substrate ( The defective element S 'is removed from G and removed, and a picker 120 for picking up and supplying a new LED element (hereinafter, simply referred to as a' first element ') and a solder (on the LED substrate G) is soldered ( The new solder B 'is applied to the laser beam irradiator 130 for irradiating the laser beam L for melting B) and the first region A1 of the LED substrate G from which the defective element S' is separated. The solder supply unit 140 for supplying the temperature, the temperature sensing unit 150 for detecting the temperature overheating in the process of coupling the first device (S1) to the first region (A1), and the first device (S1) The camera 170 for inspecting the coupling state of the first device S1 and the LED substrate G after the reproducing process are discharged are discharged. It is configured to include a controller 190 for controlling the discharge units and the substrate 180, each of the components (110-180).

In the LED substrate G, a plurality of LED elements S are densely arranged laterally and horizontally. As shown in FIG. 7A, the LED elements S are arranged one by one in the sink PS formed in the substrate. .

Each LED element S is coupled to the LED substrate G by a transfer process or the like. As the two electrodes are connected to the LED element S, the LED elements S are formed by two solders B. (G) and energized.

Here, the LED element S may be formed in a microminiature having any one of a width and a length of 225 μm or less, and preferably, may have a rectangular cross section of 125 μm * 225 μm in width and length. However, the present invention is not limited to the technology of individually installing and reproducing elements having the width and length of the LED element S of 225 μm or less, and the width and length of the LED element S within the scope of the claims. Applicable for devices larger than 225 μm.

The substrate supply unit 110 collects in the magazine 111 that at least one defective element (S1 ') is found in the manufacturing process of the LED substrate (G), the LED to the working position with the transfer conveyor belt 90 The substrate G is transferred.

To this end, the magazine 111 is movable up and down 110d along the transport rails arranged up and down, and the magazine 111 to replace the defective element S 'reaches the predetermined height. After moving up and down, the LED substrate G is pushed toward the conveyor belt 90 by a pusher (not shown). As the conveyor belt 90 moves, the LED substrate G is transferred to the working position.

At this time, an alignment mechanism that taps the edge of the LED substrate G is provided so that the LED substrate G may be positioned at a predetermined position of the conveyor belt 90. As the conveyor belt 90 moves 15, the LED substrate G reaches a predetermined working position.

On the other hand, as shown in Figure 7a, the LED substrate (G) supplied to the working position is provided with an identifier 55 such as a bar code, and before the LED substrate (G) reaches the working position to start the regeneration process The identifier reader 192 calls and receives the information of the LED substrate G from the server. That is, in the inspection process performed after the manufacture of the LED substrate G, some of the LED elements S of the LED substrate G are coupled to the defective element S 'such that they are not energized smoothly or are coupled upright. If it is found out, the type of the defective element S 'of the LED substrate G (for example, whether it emits red light, emits green light, or emits blue light) and location information Is stored on the server. Therefore, when the LED substrate G supplied to the work position is read to the identifier reader 192, the board information read by the identifier reader 192 is transmitted to the controller 190, and the controller 190 is sent from the server. Receives by calling the type and position information of the defective element (S ') of the LED substrate (G), according to the position information and the type of the defective element received from the server, the laser beam irradiator 130 and the picker 120 The rework process is performed while controlling the respective components 110-170 including a).

When the LED substrate G reaches the working position, two or more reference points formed on the LED substrate G are recognized, and the picker 120 and the laser beam irradiator 130 are positioned according to the attitude and position of the LED substrate G. By resetting the coordinates, the reproduction process can be performed with respect to the exact position of the LED substrate G.

The picker 120 picks up and removes the defective element S 'from the LED substrate G, and places the new first element S1 in the first region A1 where the defective element S' is located. .

Here, when the length (x) of the LED element (S) is a very small size of 225㎛ or less, it is not smooth to pick up the LED element (S) and if the excessive force is introduced may cause damage to the LED element (S) have. Accordingly, the picker 120 according to the present invention has a receiving groove 121 for accommodating a part or more of the LED element S having a non-circular cross section, and the fluid passage through which gas can flow in the receiving groove 121. 125 is in communication.

Here, the lower part of the picker 120 is formed in a sharply inclined shape, the receiving groove 121 is formed at the bottom, the size of the LED element (S) is very small, the LED substrate (G) and the mother plate (M) Even if it is densely distributed, it is possible to pick up and position smoothly.

Then, the flow passage 125 is connected to the fluid control unit (P) that can flow in and out the gas, such as air, nitrogen. Accordingly, when the elements S1 and S 'to be picked up are accommodated in the receiving groove 121 or more, the fluid adjusting unit P sucks gas through the fluid passage 125 to receive the receiving groove ( 121) the suction pressure can be applied.

As shown in Fig. 7C, in the case where the defective element S ', which is built up in the shape of Manhattan and wants to be separated from the LED substrate G, the defective element S' is discarded without being used again, a large suction pressure is achieved. May be applied.

However, as shown in FIGS. 7F and 7G, when picking up a new first element S1 to be mounted on the LED substrate G, the first element S1 may be damaged by excessive suction pressure. In the process of picking up the first element S1 from the mother plate M and in the process of placing the suction-holded first element S1 in the first region A1, the gas control unit P is adapted to apply an appropriate suction pressure. Flow rate control is performed rather than pressure control to apply suction pressure through the fluid passage 125.

That is, when the first element S1 is accommodated in the accommodation groove 121 of the picker 120, when a small amount of flow rate determined from the gas control unit P is discharged through the fluid passage 125, FIG. As shown in the enlarged view of 7f, since the first element S1 is very small and light, the first element S1 is lifted up to the inlet of the fluid passage 125 while underpressure is applied in the receiving groove 121. It is in a close state. And, even if no additional negative pressure is applied, the inside of the gas passage 125 is maintained in a negative pressure state slightly lower than the atmospheric pressure, so that the state in which the first element S1 is in close contact with the inlet of the gas passage 125 is maintained. The first device S1 is gripped by the picker 120. As such, the picker 120 suction-holds the first element S1 by flow rate control without adopting pressure control, so that the picker 120 can reliably suction-hold while preventing damage to the ultra-compact and ultra-lightweight first element S1. Can be.

The picker 120 is installed to be movable in the up-down direction 120u and the front-rear left-right direction 120d by the picker transfer part Mp. For example, the picker transfer part Mp may include the gantry 160 and may be moved in some or all directions by the movement 160d of the gantry.

On the other hand, to bring the first element S1, which is a new LED element, into the receiving groove 121 of the picker 120, the normal first element S1 is picked up from the mother substrate M shown in FIG. To the first area A1.

In general, the new LED element S used in the rework process includes an LED element R emitting red on the mother substrate M and a green color as shown in FIG. 8. LED elements G for emitting light and LED elements BL for emitting blue light are alternately arranged, and these elements S are arranged vertically and horizontally. In addition, since the size of the device S is very fine, the new LED devices S are positioned in a state of being bonded to the adhesive layer Z of the mother plate M.

Accordingly, the controller 190 determines the type of the defective element S 'through the identifier 55 of the supplied LED substrate G, and allows the picker 120 to supply the LED substrate G to the working position. The element of the same kind as the defective element S '(that is, the LED element emitting the same color) is picked up from the mother board M and controlled to be brought into the first region A1 of the LED substrate G.

However, since the LED element S is bonded to the adhesive layer Z of the mother plate M, the first element on the mother plate M is installed in the receiving groove 121 of the picker 120. When the suction pressure pn is applied in a state where the element S1 is accommodated, the first device S1 is not detached from the mother plate M. When the suction pressure pn is applied, the first device S1 is applied. S1) may be damaged by the suction pressure pn.

Accordingly, the present invention, as described above, in the state of receiving the first groove (S1) bonded to the mother plate (M) in the receiving groove 121, the flow rate predetermined by the fluid control unit (P) By sucking the bay, a small negative pressure is applied to the fluid passage 125, and at the same time, the picker 120 is rotated 120 r in the horizontal direction, thereby accommodating the first element S1 together with the receiving groove 121 of the picker 120. Rotation), the adhesive force between the first element (S1) and the mother plate (M) is weakened by the torsional displacement, so even with a small negative pressure, the first element (S1) is separated from the mother plate (M) and the fluid passage ( 125 may be adjusted to be in close contact with the inlet (py). To this end, the cross section of the inner wall of the receiving groove 121 of the picker 120 is formed in a non-circular shape, the cross section of the first element (S1) includes at least a portion of the non-circular cross section.

Through this, although the conventional LED element had to be detached from the mother plate by hand, the first element S1 accommodated in the receiving groove 121 was first rotated by rotating the picker 120. By causing the torsional displacement with respect to the mother plate (M) to slowly release the adhesive state with the mother plate (M), and secondly the first element (S1) with a low negative pressure applied to the receiving groove 121, the picker receiving groove ( Advantageous effect of implementing mechanical suction gripping in close contact with the inlet of the fluid passage 125 revealed in 121.

Furthermore, since the process of separating the first element S1 from the mother plate M is made possible by applying a suction pressure pn of a small negative pressure, the bending deformation applied to the first element becomes very small, and thus, the first element. An advantageous effect of performing a reliable regeneration process without damaging (S1) can be obtained.

When the bad element S ′ is removed by the picker 120, the solder supply unit 140 may have the solder B1 in the first region A1 where the bad element S ′ was present, as shown in FIG. 7E. To supply. Since the LED element S maintains an energized state through the substrate G and two electrodes, the solder B1 supplied to the first region A1 by the solder supply unit 140 is supplied to two positions.

For this purpose, a solder supply unit 140 supplies the molten solder from the solder is in communication with the storage section (S _B) for storing a molten solder, the solder storing section (S _B) in the first area (A1). The number of solders B1 supplied to the first region A1 may be one or three or more, depending on the state in which the LED substrate G is energized.

In some cases, the solder remaining in the first region A1 from which the defective element S 'has been removed may be reused, and after the cleaning to remove the remaining solder and foreign matter, the new solder B1 may be replaced with the first solder. It may supply to area | region A1.

The laser beam irradiator 130 irradiates the laser beam L to melt the solders B and B1. As shown in the figure, in the case where solder B is disposed at two positions in one LED element S, the laser beam reaching the LED element S is minimized as much as possible and the solder B is reached directly. In order to increase the laser beam L, as shown in FIGS. 7C and 7G, the two laser beam irradiators at different positions are respectively provided on the solders B and B1 at two positions of the first region A1. 130 irradiates the laser beam (L) in an inclined posture.

Since the laser beam L irradiated from the laser beam irradiator 130 has sufficient light intensity to melt the solders B and B1, the laser beams L are sufficient to match the type of the solders B and B1 and the size of the LED element S. Accordingly, the laser beam L of various frequency bands may be applied. For example, a UV laser beam can be applied.

The laser beam irradiator 130, as illustrated in FIG. 7B, in order to remove the defective element S ′ coupled to the LED substrate G, a solder that couples the defective element S ′ and the substrate G to each other. (B) is irradiated with a laser beam (L) to melt the solder (B). Then, the picker 120 is moved to the defective element S '(120d, 120u), as shown in Figure 7c, by applying the suction pressure (pn) through the fluid passage 125, the defective element (S') ), The picker 120 is moved upward to separate the defective element S 'from the substrate G.

Here, the defective element S 'may have an incorrect posture of the element coupled to the substrate G, a poor electrical connection with the substrate G via the solder B, or a defective element itself. In the case of constituting an LED panel, all the elements causing the bad pixels are collectively referred to.

In addition, as shown in FIG. 7G, the laser beam irradiator 130 is positioned in the first region A1 while the picker 120 sucks and grips the first element S1. It is also used to bond the first element S1 to the substrate G by irradiating L) obliquely to each solder B1 to melt the solder B. FIG. In particular, while the laser beam L is irradiated to the solder B1 and the solder B1 is melted and cured again, the picker 120 is gripped with the suction pressure pn applied to the first element S. FIG. By maintaining the state, at least a part of the solder B1 becomes a liquid state, and in the process of flowing, the posture of the first element S is not distorted, and it is advantageous to securely connect and fix the substrate G in a normal position. You can get it.

On the other hand, in the process of fixing the first element S1 to the substrate G by irradiating the laser beam L, it is necessary to monitor whether or not the first element S1 is maintained in a normal posture. At this time, since the picker 120, the laser beam irradiator 130, and the like are disposed around the small size of the first element S1, it is very difficult to photograph the first element S1.

Therefore, as shown in FIG. 4, when the laser beam L is irradiated from the laser beam oscillator 130a, the laser beam irradiator 130 transflects the light passing through the reflection mirror 132 to the half mirror 135. The solder B is melted by the laser beam L reflected from the half mirror 135, and the light L ′ reflected from the first element S1 penetrates the half mirror 135. It may be configured to shoot with the camera 170.

That is, the camera 170 photographs the first area A1 where the process is performed while the laser beam L is irradiated to the solders B 'and B1. For this purpose, the camera 170 is irradiated from the laser beam irradiator 130. The reproducing process is monitored and recorded while photographing the image of the first area A1 in real time with the light L 'passed by the half mirror 135 in the reflected light reflected by the laser beam L.

Here, the laser beam L irradiated from the laser beam oscillator 130a may be short wavelength light, but may be multi-wavelength light or white light. That is, light of a wavelength for melting the solder B1 and light for camera photographing may be irradiated together.

Through this, even if the optical path required for the imaging is not secured in the narrow space, the process of accurately separating the defective device (S ') from the LED substrate (G') by photographing using the optical path irradiated from the laser beam irradiator 130 And the regeneration process can be performed while visually monitoring in real time the process of accurately coupling the new first element S1 to the first region A1 where the defective element S 'is located, thereby increasing the reliability of the regeneration process. Can be.

On the other hand, in the process of melting the solder (B1) using the laser beam (L), if excessive heat is generated, the LED element already mounted around the newly supplied first element (S1) or the first region (A1) (S) may be damaged by heat. Accordingly, a process of accurately separating the defective element S 'from the LED substrate G, and a process of accurately coupling the new first element S1 to the first region A1 in which the defective element S' is located. The temperature sensing unit 150 measuring the temperature of the first element S1 and the LED element S in the vicinity thereof is provided.

For example, the temperature sensor 150 may be applied as a pyrometer or micropyrometer using infrared light or light. The configuration of irradiating light for temperature measurement to the first region A1 in a narrow space may be configured by using a half mirror or a total reflection mirror, similar to that shown in FIG. 4.

When the reference temperature determined by the temperature sensing unit 150 is reached, a warning alarm may be output and the regeneration process may be stopped to prevent thermal damage of the elements S and S1.

On the other hand, the upper side of the work position where the regeneration process is performed is provided with an air suction unit for sucking the ambient air.

Accordingly, in the process of separating the defective element S 'from the LED substrate G or connecting the new first element S1 to the LED substrate G, the laser beams are formed on the solders B' and B1. In the process of irradiating L), it is possible to keep the working environment more comfortable by discharging fumes that can be generated directly from the process site through the suction exhaust.

The picker 120, the pair of inclined laser beam irradiators 130, the temperature sensing unit 150, and the camera 170 are configured to move together in a module Mx. As a result, position control of each component 120-170 by the controller 190 may be performed more easily.

The module Mx, as shown in FIG. 1, moves forward and backward with the gantry 160, and moves laterally along the gantry, and moves upward and downward with respect to the gantry 160. Controlled. In addition, the picker 120 has a degree of freedom in which individual positions can be moved even within the module Mx, thereby facilitating a regeneration process of replacing the LED elements S. FIG.

As described above, by removing and removing the defective element S 'in the first region A1 and coupling the first element S1, which is a new LED element, to the substrate G to be electrically connected in a predetermined posture. The pixel error in the first area A1 can be solved accurately.

There may be only one defective element S ′ in the supplied LED substrate G, but two or more defective elements S ′ may be present. In this case, by repeating the above-described method with respect to another defective element S ', the two or more defective elements S' are also replaced with a new normal first element S1, and the LED substrate G LED panel (not shown) using the () can display a clear image quality without the bad pixels.

The LED substrate G fixed as described above is transferred 16 to the substrate discharge unit 180 by the conveyor belt 90. As shown in FIG. 5, the substrate discharge unit 180 includes a magazine 111 capable of vertically moving 111d as shown in FIG. 5.

Then, when the LED substrate G, the error of which has been corrected by the conveyor belt 90, is transferred, the empty space of the magazine of the substrate discharge unit 180 is matched with the height of the conveyor belt 90, and the modified LED substrate G is fixed. ) Are collected one by one in a stacked form, and when the modified LED substrate G is filled in the magazine 111, it is transferred to the next process.

Hereinafter, with reference to the drawings shown in Figs. 6 to 7G, the regeneration step (S100) of the LED substrate (G) according to the present invention will be described in detail. For reference, in order to facilitate understanding of the present invention, the sizes of the respective LED elements S and S1 in the LED substrate G shown in the drawings are shown to be exaggerated in size.

Step 1 : First, as illustrated in FIG. 7A, a substrate for supplying and transferring the LED substrate S including the defective element S ′ from the substrate supply 110 to the working position by the conveyor 90. Supply step S110 is performed.

In this process, the substrate information is transmitted to the controller 190 by the identifier 55 of the LED substrate S, and the controller 190 is the type of the defective element S ′ of the substrate based on the received substrate information. And location data from the server.

Step 2 : Then, as shown in Fig. 7B, the solder B 'fixing the defective element S' to the defective element S 'already mounted on the supplied LED substrate G. The laser beam L is irradiated and melted, and as shown in FIG. 7C, the picker 120 is disposed so that at least a part of the defective device S 'is accommodated in the receiving groove 121 of the picker 120. After approaching 120u1 to (S '), the defective element S' is sucked and held by the picker 120 in the state where the solder B 'is molten. At this time, even if the defective element S 'is inclined with respect to the substrate G, the defective element S' is gripped by the receiving groove 121 by the suction pressure applied to the picker receiving groove 121, The defective element S ′ is in close contact with the inlet of the fluid passage 125 communicating with the receiving groove 121 or in close contact with the ceiling surface of the receiving groove 121.

As shown in FIG. 7D, the picker 120 is moved 120u2 away from the substrate G to put the collected defective element S 'into a waste container (not shown). The defective element removing step (S120) of separating and removing the defective element S 'from G) is performed.

At this time, since the defective element S 'separated and removed by the picker 120 is discarded, the suction pressure p n introduced into the receiving groove 121 of the picker 120 may be large.

A cleaning process may be additionally performed to remove the foreign matter from the sink portion of the first region A1 from which the defective element S 'is removed from the LED substrate G.

Step 3 : Then, as shown in FIG. 7E, the solder supply unit 140 moves to the first region A1 where the defective element S 'is located, so that the new solder B1 is transferred to the substrate G1. A solder supply step S130 for supplying the sink portion PS, that is, the first region, is performed.

Here, since one LED element S is electrically connected to the substrate G at two electrodes, the solder B1 is disposed at two positions in the first region A1.

Step 4 : Then, as shown in Fig. 7F, the picker 120 is a first element of the same kind as the defective element S 'that is separated and removed among the LED elements S arranged laterally and laterally on the base plate M. Pick up (S1).

To this end, as shown in FIG. 9A, at least a portion of the first element S1 having a rectangular cross section is accommodated in the rectangular groove shape receiving groove 121 of the picker 120. The low negative pressure state is applied by the flow rate control which contacts the surface of the base plate M, and sucks a predetermined flow volume from the fluid passage 125 of the picker 120. FIG. Then, as shown in Fig. 9B, by rotating the picker 120 horizontally 120r, the adhesive state with the mother plate M is released by the torsional displacement of the first element S1, and thus, the first Since the element S1 is very small and lightweight, the element S1 is in close contact with the ceiling of the receiving groove 121 even at a low negative pressure of the fluid passage 125. As a result, the first device S1 is in a suction gripping state only by a mechanical operation in the receiving groove 121 of the picker 120 without damage from the mother plate M.

Then, the picker 120 is moved to position the first device S1 in the first area A1 (S140).

Step 5 : Then, as shown in Fig. 7G, two laser beams L1 are inclinedly irradiated to the solder B1 of the first region A1 to melt each solder B1. At this time, the picker 120 positions the first element S1 in a predetermined posture in the first region A1 and maintains the suction grip.

As a result, even though the solder B1 is melted in the liquid state and the flow of the solder B1 is generated due to the temperature difference, the posture is not changed such that the first element S1 is erected by the flow. The posture is maintained to be electrically connected to the first region A1 of the substrate G in the intended posture by maintaining the posture (S150).

While step 5 is performed, the fumes generated by melting of the solder B1 are discharged to an intake exhaust part (not shown), and the temperature sensing unit 150 causes the first element S1 and the LED elements around it. (S) It is monitored whether it exceeds the allowable temperature.

Step 6 : Simultaneously with Step 5 or separately from Step 5, the camera 170 checks whether the replaced first element S1 is correctly coupled to the predetermined posture and position by the camera 170 in 170 to inspect (S160).

As a result of the inspection, if the position and attitude of the first element meet the acceptance criteria, as shown in FIG. 7H, the transfer process to the substrate discharge unit 180 or the regeneration process for another defective element is performed in steps 2 to 2. Do as shown in 5.

As described above, the present invention can reliably separate the small LED element S1 having a width and length of 225 μm or less from the mother substrate M in the bonded state without damage and without a separation error. An advantageous effect of coupling the separated micro LED element S1 to the region A1 in which the defective element S 'is located in an electrical connection state without error in an accurate posture can be obtained.

Through this, the present invention, even if any one or more of the width and length of the LED element (S) of the LED substrate (G) used in the LED display device is a micro size of 225㎛ or less, the defective element ( By reworking the LED substrate by replacing S ') with a new normal element S1, the process of regenerating the LED substrate by error-free replacement of the LED element can be performed without error and the processing speed per unit time is increased. It can be greatly improved, and even in a large area display device, the yield can be improved to improve the economics.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. It will be appreciated that it can be changed.

100: LED substrate reproducing apparatus 110: substrate supply unit
120: picker 130: laser beam irradiator
140: solder supply unit 150: temperature sensing unit
170: camera 190: control unit
192: identifier reader S: LED element
S1: first element S ': defective element
G: LED substrate B, B1: solder

Claims (29)

An apparatus for reproducing an LED substrate having a non-circular LED element having a width and length of 225 μm or less ,
A solder supply unit supplying solder to a first region in which the defective element of the LED substrate is located;
The receiving groove for accommodating the LED element is formed in a non-circular cross section on the bottom, the fluid passage through which gas can flow in the receiving groove is formed in communication, any of a plurality of new LED elements attached to the mother board in a longitudinal direction A suction pressure is applied to the fluid passage by flow control to discharge a gas having a predetermined flow rate into the fluid passage while generating a torsional displacement in the first element by rotating one first element in the accommodating groove. A picker which separates the new first element from the mother plate and suction-grips to position the first element in the first region in the first region where solder is supplied;
A laser beam irradiator which irradiates a laser beam while the first element is located in the first region, and integrally connects and fixes the first element to the LED substrate via the solder;
Recycling apparatus for an LED substrate, characterized in that it comprises a.
The method of claim 1,
And the first device is a device that emits any one color of red (R), green (G), and blue (B).
The method of claim 1,
And the laser beam irradiator irradiates a laser beam to remove a defective device that is already mounted in the first region to be replaced in the LED substrate.
The method of claim 3, wherein
When the laser beam is irradiated onto the solder holding the defective element by a laser beam irradiator, the picker grips the defective element to separate and remove the defective element from the LED substrate. .
The method of claim 1,
Solder is supplied to the first region at two positions, and the laser beam irradiator irradiates the laser beam to the solder at two positions inclinedly.
The method of claim 5,
The first substrate is sucked and held by the picker while the laser beam is irradiated to the solder with the laser beam.
The method of claim 5,
A temperature sensor configured to detect a temperature of the first device while irradiating the solder with the laser beam by the laser beam;
An apparatus for reproducing an LED substrate, further comprising.
The method of claim 7, wherein
Further, while irradiating the laser beam to the solder, further comprising a camera for photographing the process of the first region,
And the camera photographs the first region with the light passed by the half mirror in the reflected light reflected by the laser beam irradiated from the laser beam irradiator.
The method of claim 1,
The upper side of the LED substrate is a regeneration apparatus of the LED substrate, characterized in that the suction exhaust portion for sucking the fumes generated in the process of irradiating the laser beam.
The method of claim 1,
A substrate supply unit supplying the LED substrate to a predetermined working position;
An apparatus for reproducing an LED substrate, further comprising.
The method of claim 10,
A substrate reader section for reading an identifier of an LED substrate supplied by the substrate supply section;
A control unit which receives information of the LED substrate read by the substrate reader unit;
An apparatus for reproducing an LED substrate, further comprising.
The method of claim 11,
And the control unit recognizes the position and type of the element to be replaced of the LED substrate supplied by the substrate reader unit, and controls the laser beam irradiator and the picker.
A method of reproducing an LED substrate on which an LED element having a non-circular cross section having a width and a length of 225 μm or less is mounted.
A substrate supplying step of supplying an LED substrate including a defective element to a working position;
A defective device removing step of separating and removing the defective device from the LED substrate;
A solder supply step of supplying solder to a first region in which the defective element is located;
The accommodating groove for accommodating the LED element is formed in a non-circular cross section at the bottom, and a picker formed with a fluid passage through which gas flows in the accommodating groove is approached to a mother plate to which a plurality of new LED elements are attached. The torsional displacement is generated in the first element by rotating the picker while the first element of the same type as the defective element among the LED elements of the mother plate is accommodated in the accommodating groove of the picker. The flow rate control of discharging gas at a predetermined flow rate applies a suction pressure to the fluid passage to separate the new first element from the mother plate and move it in a suction grip state to the picker, so that the solder-supplied first Positioning a first device in an area in the first area;
A first device coupling step of coupling the first device to the LED substrate by irradiating the solder with a laser beam;
Recycling method of the LED substrate comprising.
The method of claim 13,
And the first device is an LED device which emits any one color of red (R), green (G), and blue (B).
The method of claim 13, wherein the removing of the defective element,
The laser beam is irradiated with a laser beam to remove the defective element already mounted in the first region to be replaced in the LED substrate, and the picker grips the defective element to remove the defective element from the LED substrate. Regeneration method of the LED substrate, characterized in that for removing.
The method of claim 13,
And the first element is sucked and held by the picker while the first element joining step is performed.
The method of claim 13,
A temperature sensing step of sensing a temperature of the first element while irradiating a laser beam to the solder by the laser beam;
The method of regenerating an LED substrate, further comprising: monitoring whether the temperature of the first device is maintained below an allowable temperature while the first device coupling step is performed.
The method of claim 13,
A substrate information reading step of reading an identifier of the LED substrate supplied by the substrate supply section from the substrate reader section while the substrate supplying step is performed;
And reproducing the position and type of the defective element to be replaced of the LED substrate read in the substrate information reading step.
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