KR102335737B1 - An Apparatus for Supplying a Small Size Element and a Method for Reworking - Google Patents

Abstract

The present invention relates to a device for supplying small parts and a method for reworking therewith. The small component supply device includes a component pack (EM) in which a plurality of small components are disposed; and separation means for separating each component from the component pack EM, wherein the plurality of components becomes an independently separable electronic device.

Description

An Apparatus for Supplying a Small Size Element and a Method for Reworking

The present invention relates to an apparatus for supplying small parts and a method for reworking by the same, and to a device for supplying small parts for supplying a plurality of small parts for a reworking process and a method for reworking thereby.

LED devices are used in various optical industries, for example, the LED devices can be applied to the display industry. The display of the LED element structure has advantages of low power consumption and high efficiency and reliability. In addition, if a unit panel made of a micro LED element of 100 μm or less having a pixel function of a pixel is arranged in a tile structure, it is possible to increase the area of the display. For this reason, various developments are being made to apply the micro LED to a display. Patent Publication No. 10-2019-0006430 discloses a micro-display in which the RGB sub-pixels are several tens of μm in size and a method of manufacturing the same. In addition, Patent Publication No. 20-2018-0031126 discloses a method for mounting an LED chip for a display panel and a display panel using the same. When an operation error of some LED elements occurs in the manufacturing process of a display by the arrangement of micro LED elements, or an error occurs in some LED elements in a manufactured display unit, it is necessary to reworking the LED elements. As described above, it is advantageous that the reworking of the LED elements densely on the substrate is performed automatically, and in particular, it is impossible unless the reworking of the micro LED elements having a size of 100 μm is performed in a substantially automatic process. For such a reworking operation, it is necessary to supply LED parts having a size of a micro unit by an appropriate method. After the parts are supplied, a reworking operation may be performed by the supplied parts. However, the prior art or the known art does not disclose, for example, a method for supplying a component having a micro unit or a method for reworking by the method.

The present invention is to solve the problems of the prior art and has the following objects.

Patent Document 1: Patent Publication No. 10-2019-0006430 (Samsung Electronics Co., Ltd., published on 2019.01.18.) Micro LED display and manufacturing method thereof Patent Document 2: Patent Publication No. 10-2018-0031126 (Samsung Electronics Co., Ltd., published on August 28, 2018) Method of mounting LED chip for display panel and display panel using the same

SUMMARY OF THE INVENTION It is an object of the present invention to provide a small component supply apparatus for transporting and supplying a plurality of small components having a micro unit to a predetermined position, and a reworking method by the same.

According to a suitable embodiment of the present invention, the small component supply apparatus includes a component pack in which a plurality of small components are disposed; and separation means for separating each component from the component pack, wherein the plurality of components becomes an independently separable electronic device.

According to another suitable embodiment of the present invention, the small component is an LED device, and the component pack is a wafer or a gel pack.

According to another suitable embodiment of the present invention, the reworking method of the small component comprises the steps of fixing a substrate for the reworking process; supplying a plurality of parts in the form of a parts pack by the parts supply module; removing the faulty part from the board: detaching one part from the part pack; Soldering to the separated parts; and adhering the component to the substrate.

According to another suitable embodiment of the present invention, the small component is a micro-unit LED device.

According to another suitable embodiment of the present invention, the process of separating the faulty part or bonding the part includes the step of irradiating laser light.

The small parts supply apparatus according to the present invention enables, for example, a plurality of micro-unit parts to be efficiently supplied for reworking. The supply device according to the present invention allows the small parts for the reworking operation to be transferred to and fixed to a predetermined position. The reworking method according to the present invention enables, for example, a reworking process for an LED device disposed on a substrate for an LED display to automatically proceed. In particular, the reworking method according to the present invention enables a reworking process of a micro LED device having a size of 100 μm or less.

1A and 1B show an embodiment of a small component supply device.
2a and 2b show another embodiment of the small component supply device.
Figure 3 shows an embodiment of the reworking method of small parts according to the supply of small parts according to the present invention.
4 illustrates an embodiment of a reworking apparatus for a reworking method according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings, but the embodiments are for a clear understanding of the present invention, and the present invention is not limited thereto. In the following description, components having the same reference numerals in different drawings have similar functions, so unless necessary for the understanding of the invention, the description will not be repeated and well-known components will be briefly described or omitted, but the present invention It should not be construed as being excluded from the embodiment of

A small component supply device according to the present invention includes a component pack (EM) in which a plurality of small components are disposed; and a separation means for separating each component from the component pack EM, wherein the plurality of components may be independently separable electronic devices, preferably LED devices having a micro-scale size.

1A and 1B show an embodiment of a small component supply device.

1A and 1B , the component pack EM may be a gel-pack in which a plurality of small components E_1 to E_N are arranged in a matrix form. The parts pack (EM) includes a base (B) having an accommodating space therein while forming a rectangular peripheral wall; a flexible separator (SP) in the form of a thin film disposed on the upper surface of the base (B); a plurality of separation protrusions S_1 to S_L formed on the bottom of the flexible separation membrane SP or on the bottom surface of the base B; It may be connected to the bottom surface of the base B to form a pressure control path VP that creates a reduced pressure or vacuum between the flexible separation membrane SP and the bottom surface. The component pack EM may be transferred to an apparatus in which a reworking process is performed by the guide module 10 . The guide module 10 is formed by a pair of substrates facing each other, for example, a guide body 11 having a structure that is detachably mounted in a slot formed in the reworking device; a guide path 12 formed in the upper portion of the guide body 11; a transport tray 13 movable along the guide path 12; and a fixing unit 14 formed at one end of the guide path 12 to fix the tray 13 . The transport tray 13 includes a movable body 131 movable along the guide unit formed in the guide path 12; a cover 132 for fixing the component pack EM to be loaded on the moving body 131; and a locking tab 133 for removably fixing the cover 132 to the movable body 131 . When the component pack EM is loaded onto the moving body 131 , the cover 132 is closed and fixed to the tray 13 to move along the induction path 12 . When the tray 13 is moved and fixed to the fixing unit 14 formed at one end of the induction path 12 , each small component E_K may be separated from the component module EM and put into a reworking process. For example, suction means AM operating in a vacuum suction manner can be moved above each small part EM. And when the lower part of the flexible separation membrane SP is made under reduced pressure or vacuum through the pressure control path VP, each small component E_K arranged in a matrix form can be separated from the flexible separation membrane SP. can be in a state of being. In this state, the small component E_K may be moved and attached to a substrate such as a printed circuit board for a reworking process by the adsorption means AM. The small part E_K may be moved to a predetermined position for the reworking process in various ways.

2a and 2b show another embodiment of the small component supply device.

Referring to FIGS. 2A and 2B , the small component may be stored on a wafer having, for example, 4 inches or another size, and the small component may be, for example, an LED device having a size of a micro unit. . The wafer may be fixed to the fixing module 20 , and the fixing module 20 includes a base body 21 ; a positioning block (22) movable along the XY-plane with respect to the base body (21); It may be formed of at least one fixing hole (23a, 23b, 23c) formed in the positioning block (22). Each of the fixing holes (23a, 23b, 23c) is rotatable on the circumferential surface of the overall hollow cylinder shape, the loading cylinder 231 is formed with an expansion ring on which the wafer is fixed; A stable block 232 formed in a circular shape along the circumferential surface of the loading cylinder (231); At least one fixing block 233_1 to 233_K that is installed in the stability block 232 to fix the wafer and a stopper block 234 to limit the movement of the wafer may be installed. In addition, a control module 25 that controls the process of fixing the wafer and separating the small component from the wafer may be coupled to the fixing module 20 . When the wafer is fixed to the fixing block 20 , each small component needs to be separated from the wafer for a reworking process. Separation module 24 may be activated to separate each small component from the wafer.

As shown in FIG. 2A , the separation module 24 may be disposed inside each of the fixing holes 23a, 23b, and 23c. Separation module 24 includes a fixed base 241; a separation induction unit 243 coupled to the fixed base 241 so as to be movable up and down; and a driving unit 242 such as a motor for moving the separation induction unit 243 up and down. An adsorption surface 243a in which a plurality of flow holes for gas flow are formed may be formed on the upper surface of the separation induction unit 243 , and the adsorption surface 243a may have a disk shape, for example. In addition, a vertically movable separation tab 243b may be disposed in the center of the adsorption surface, and a separation hole H_K having the same or similar shape and function as the flow hole may be formed on the circumferential surface of the separation tab 243b. When the wafer is fixed to the fixing module 20 , a pickup means such as a vacuum suction means for adsorbing each small component and moving it to a reworking process may be moved above the separated small component. When the pickup means is moved to a predetermined position, the separation module 24 may be positioned below the small part to be separated in the fixing holes 23a, 23b, and 23c. The lower side of the wafer may be fixed by the suction surface 243a of the separation induction unit 243 , and the peripheral surface of the small part to be separated by the separation hole H_K may be stably fixed. Thereafter, when the separation tab 243b is moved upward and the small component is pushed up, the small component is picked up by the pickup means and moved to the substrate on which the reworking process is performed. A small component may be separated and picked up by various methods from the wafer fixed to the fixing module 20 , and the present invention is not limited thereto. In this way, when the small component is picked up and moved to the substrate, the reworking process may be performed.

Figure 3 shows an embodiment of the reworking method of small parts according to the supply of small parts according to the present invention.

Referring to FIG. 3 , the method of reworking small parts includes fixing a substrate for the reworking process (P31); Step (P32) of supplying a plurality of parts in the form of a parts pack by the parts supply module; The step of removing the faulty part from the board (P33): a step of separating one part from the part pack (P34); Soldering to the separated parts (P35); and adhering the component to the substrate.

The reworking process refers to a process of replacing a portion of a plurality of devices disposed on one substrate with a new device while having the same function. For example, a plurality of LED elements may be disposed on a substrate for a display, and when some of the LED elements are determined to be defective, a reworking process may be performed to replace the defective LED elements. The reworking process needs to be performed automatically, and in particular, when the size of the device is very small, the replacement of the device should be performed by the automatic process. For example, when the size of the process area for the reworking process has a size of 1 to 100 μm or a size similar thereto, the reworking process needs to be performed by a precisely controlled automatic process. In the automatic reworking device, the substrate may be fixed at a predetermined position for the reworking process (P31). A plurality of LED devices may be disposed on the substrate, and the substrate may be a substrate for an LED display, for example, a substrate such as a flexible PCB. When the substrate on which the reworking process is to be performed is fixed (P31), the component pack on which a plurality of small components are disposed is transferred to a predetermined position by the component supply module to supply the components for the reworking process (P32). The small component may be stored in the above-described gel-pack, wafer or component tape, and may be transported and supplied by a component supply device (P32). When the component pack is fixed at a predetermined position and the component can be supplied, the faulty component may be removed from the board (P33). The position of the device to be replaced on the substrate can be predetermined, the device can have a size of, for example, 50 to 500 × 50 to 500 μm, and the spacing between the devices can be in micro units or millimeters. have. In addition, the thickness of the substrate may be 0.1 to 10 mm, and may be electrically connected to other elements or components by a circuit pattern. In such a condition, a laser device may be used to separate a device such as an LED device from a substrate. A laser is irradiated around or above the device to be replaced, thereby making the device detachable from the substrate. When the device becomes detachable from the substrate, a gas pressure may be applied to the device by a means capable of gas flow such as a nozzle (blow off). Accordingly, the device may be separated from the substrate, and the device separated from the substrate may be sucked through a suction means operating in a vacuum suction manner to remove the device from the substrate. Alternatively, the device may be removed from the substrate by a suction method without separately applying pressure (P33). When a component is removed from the board, the component may be separated from the component pack to place a new component in the position of the removed component (P34). In the same or similar manner as described in FIGS. 1A to 2B , the parts may be separated from the parts pack and picked up by the pickup means (P34). And soldering cream may be applied to the attachment surface of the picked-up part (P35). Thereafter, heat may be applied by the laser unit to the periphery or upper portion of the element at the position to which the component to which the soldering cream is applied should be attached, whereby the component may be adhered to the predetermined position (P36). In this way, when all faulty parts on the board are replaced, the reworking process is completed. Such a reworking process may be performed by various devices, and an embodiment of the reworking device will be described below.

4 illustrates an embodiment of a reworking apparatus for a reworking method according to the present invention.

Referring to FIG. 4 , the reworking device 40 may include first and second laser units 46 and 47 and a temperature detection unit 45 . A position in the XY-plane of the reworking module 40 may be set by movement of the position base PB. The movement in the Z-axis direction of the first and second laser devices 46 and 47 or other components coupled to the coupling base PB may be controlled by each moving means. The vision camera 41 for confirming the replacement position may include a cylinder-shaped light guide block with adjustable length, and a ring-shaped ring lighting unit 411 is disposed in the lower part to obtain an image with appropriate brightness make it possible The barcode of the substrate may be identified by the barcode unit 422 , and the barcode unit 422 may be moved up and down by the adjustment cylinder 423 . The suction nozzle unit 43 for suction of the separated element may be coupled to the coupling base PB, for example, the Z-axis by a length adjusting means such as a ball screw and a position adjusting means 431 such as an operating cylinder. The position of the direction can be adjusted. The Z-axis distance between the coupling base PB and the replacement area of the substrate may be measured by a distance measuring sensor 48 such as a laser sensor, based on which the Z-axis of each component coupled to the coupling base PB A location may be set. A cream applying unit 44 that applies soldering cream to the parts may be coupled to the coupling base PB so as to be movable up and down, and an application control unit such as a servo motor is positioned above the cream applying unit 44 ( 441) can be arranged. The level of operation of the application control unit 441 may be determined based on the pressure information detected by the pressure sensor 442 . Also, the soldering cream may be discharged from the cream application unit 44 by the operation of the application control unit 441 and applied to the bottom surface of the device. The first and second laser devices 46 and 47 may be coupled to the coupled laser block 492 so as to be vertically movable with respect to the coupling base PB. The laser block 492 may be moved up and down along a movement axis coupled to the fixing bracket 491 fixed to the coupling base PB by the operation of the laser setting unit 49 . The first laser device 46 may be disposed to be inclined with respect to the XY-plane, and the second laser device 47 may be disposed to be perpendicular to the XY-plane. Heat may be generated on the peripheral surface of the device by the first laser device 46 , and the upper portion of the device may be heated by the second laser device 47 . The temperature may be detected during the removal or attachment of the device by a temperature detection unit 45 such as an infrared camera. When the element is separated by the heat applied by the first and second laser devices 46 and 47 , the element is sucked by the suction nozzle unit 43 having a nozzle structure to be removed from the substrate. Thereafter, soldering cream may be applied to the bottom surface of the new LED unit by the cream applying unit 44 and disposed. Then, heat may be applied to the peripheral surface of the device and the device by the first and second laser units 46 and 47, and the LED device to which the soldering cream has been applied may be attached to the replacement position in an adhesive manner. Various sensors, separation means or adhesive means may be added to the reworking device 40 and are not limited to the embodiments presented.

Although the present invention has been described in detail above with reference to the presented embodiment, those skilled in the art will be able to make various modifications and modified inventions without departing from the technical spirit of the present invention with reference to the presented embodiment. . The present invention is not limited by such variations and modifications, but only by the claims appended hereto.

10: guide module 11: guide body
12: guide path 13: transport tray
14; fixed unit 20; fixed module
21: base body 22: positioning block
23a, 23b, 23c: fixing hole 24: separation module
25: control module 40: reworking device
131: moving body 132: cover
133: locking tab 231: loading cylinder
232: stability block 234: stopper block
241: fixed base 242: driving means
243: separation induction unit

Claims (5)

parts pack (EM) in which a large number of small parts are placed; and
separating means for separating each part from the parts pack (EM);
A number of components become independently separable electronic devices.
Further comprising a guide module 10 for transferring the parts pack (EM) to the reworking device,
The guide module 10 includes a guide body 11 formed by a pair of substrates facing each other and detachably mounted in a slot formed in the reworking device; a guide path 12 formed in the upper portion of the guide body 11; a transport tray 13 movable along the guide path 12; and a fixing unit 14 formed at one end of the guide path 12 to fix the tray 13,
The transport tray 13 includes a movable body 131 movable along the guide unit formed in the guide path 12; a cover 132 for fixing the component pack EM to be loaded on the moving body 131; and a locking tab 133 for removably fixing the cover 132 to the moving body 131 . The small component supply device according to claim 1, wherein the small component is an LED element, and the component pack is a gel pack.
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