KR100913579B1 - Apparatus and method for Bonding Printed Circuit on FPD Panel - Google Patents

Abstract

Disclosed are a bonding apparatus for a driving circuit board and a method thereof. A bonding apparatus for a driving circuit board according to the present invention includes: a stage for supporting a substrate on which a driving circuit board is to be bonded to an upper surface thereof, and transferring and taking out the substrate to a bonding work position; A pressure head provided to be capable of lifting and lowering at a bonding work position, for absorbing the driving circuit board to press the driving circuit board to the substrate and to bond the bonding circuit board; And at least one chip mark of the driving circuit board absorbed by the pressure head and at least one glass mark of the substrate supported by the stage to align the image information of the marks. Characterized in that it comprises an alignment image information acquisition unit for obtaining. According to the present invention, the driving circuit board can be bonded to the substrate by a simple and simple method, and the tact time according to the bonding work can be shortened and the work can be speeded up.

Description

Bonding device for driving circuit board and its method {Apparatus and method for Bonding Printed Circuit on FPD Panel}

FIG. 1 is a view schematically illustrating a full auto module bonding process in a bonding apparatus for a general driving circuit board.

2 is a flowchart illustrating a bonding method of a driving circuit board according to the prior art.

3 is a perspective view of an LCD substrate to which a driver chip is bonded.

4 is a schematic diagram of a bonding apparatus for a driving circuit board according to an exemplary embodiment of the present invention.

5 is a perspective view of the alignment image information acquisition unit illustrated in FIG. 4.

6 is a plan view of FIG. 5.

7 to 9 are diagrams showing the operation of the bonding apparatus of the driving circuit board according to the exemplary embodiment of the present invention in stages.

10 is a flowchart illustrating a bonding method of a driving circuit board according to an exemplary embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

1: substrate 2,3: upper and lower glass

4,5: upper and lower polarizer plate 6: driving chip

10: stage 11: support surface

20 backup tool 21 support surface

30: pressurized head 40: alignment image information acquisition unit

50: supply hand

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for a driving circuit board and a method thereof, and more particularly, a tact time according to a bonding operation while bonding a driving circuit board to a substrate in a simple and convenient manner. The present invention relates to a bonding apparatus for a driving circuit board and a method thereof, which can realize shortening and speeding up of work.

In general, flat panel displays (FPDs), such as plasma displays (PDPs), liquid crystal displays (LCDs), and organic light emitting diodes (OLEs), are gradually thin and short. The trend is going. Accordingly, various driving circuit boards are directly attached to the flat panel display device to manufacture a single article. Hereinafter, the flat panel display element will be described as an LCD substrate.

The driving circuit board includes FPC (Flexible Printed Circuit), TCP (Tape Carrier Package), CBF (Common Block Flexible Printed Circuit), Driver IC (Driver Integrated Circuit).

Since these driving circuit boards are directly attached to the board, there is no need for complicated wiring, so assembly and maintenance are easy, and there is no need to secure a separate wiring space. have. In addition, the driving circuit board is widely used without being limited by the use and specifications of the board because the compatibility of various wiring is maintained.

Accordingly, research on a driving circuit board bonding process of directly bonding a driving circuit board on a substrate has been steadily made.

In particular, recently, a full auto module bonding process in which all processes are fully automated has been used. Hereinafter, a bonding method performed by the bonding process will be described.

FIG. 1 is a view schematically illustrating a general full auto module bonding process. As shown in FIG. 1, a full auto module bonding process includes a chip on glass (COG) bonding process and a film on glass (FOG) bonding process. Divided.

In the COG bonding process, the driving circuit board will be described as a driver chip. In the COG bonding process, first, a substrate, which is a workpiece, is placed on a stage, and then an anisotropic conductive film (ACF) is patterned and attached to the substrate at the position where the driving chip is to be attached.

Subsequently, the driving chip is gripped from the supply tray in which the driving chip is accommodated by using a conveying device such as a handler, and pre-bonding the driving chip to a position where the conductive conductive film (ACF) is patterned. Bonding or pressure bonding), and then completely adheres the substrate and the chip by applying heat and pressure. Subsequently, an indentation test for confirming proper attachment and a crack test for checking whether cracks have occurred on the substrate are performed.

The FOG bonding step that follows the COG bonding step is similar to the above-described COG bonding step except that only the type of the driving circuit board to be attached differs.

In other words, the COG bonding process is a process of attaching a driver chip to a substrate and bonding, while the FOG is a flexible printed circuit that connects a printed circuit board (PCB) and a driving chip attached by a COG bonding process. ) Is a process of bonding a circuit board for driving a flexible film material such as CBF. In the FOG bonding process, the driving circuit board is described as an FPC.

Referring again to FIG. 1, first, a conductive conductive film (ACF) is attached to a substrate, and then aligned FPC is placed thereon to press-fit the FPC. Of course, at this time, the FPC and the substrate are in alignment with each other.

When pressing is completed, heat and pressure is applied to the substrate and the FPC to completely attach (main compression), followed by an indentation test to confirm proper attachment, and a crack test to check whether cracks have occurred on the substrate. .

When the COG and FOG bonding processes are completed, the full auto module bonding process is completed by final packing after the secondary process such as an electrical test.

Meanwhile, referring to an LCD substrate in which such a bonding process is performed, in particular, a COG bonding process, an upper glass in which LCD substrates are partially disposed in a state where liquid crystals are injected therein. ) And a lower glass (TFT panel), and upper and lower polarizer films attached to outer surfaces of the upper glass and the lower glass, respectively.

The upper glass forming the image of the color is formed smaller in area than the lower glass. Therefore, there is a non-overlapping section in which the upper glass is not overlapped on one side of the upper surface of the lower glass, and the driving chip described above is bonded to this portion.

A conventional bonding operation in which a driving chip is bonded to a substrate will be described. According to the prior art, in order to perform the bonding operation, the driving chip must be in a state of being seated at the correct position of the substrate, and in this state, the pressing head is lowered to press the driving chip to obtain the desired quality. Therefore, before the bonding operation, a relative alignment between the driving chip and the substrate is required.

For the alignment work between the driving chip and the substrate, the bonding device of the prior art is equipped with two cameras. Accordingly, two chip marks formed on the driving chip are captured by two cameras, and an image thereof is obtained. Then, two glass marks formed on the substrate are captured by two cameras. Acquire. Then, after the stage on which the substrate is supported based on the two chip marks is aligned with the X-axis, Y-axis, and θ-axis, the driving chip is bonded to the substrate using the pressurizing head.

2 is a flowchart illustrating a bonding method of a driving circuit board according to the prior art. Referring to this drawing, a conventional bonding method will be described in more detail as follows.

First, when the supply hand for providing the driving chip to the lower region of the pressing head located at the bonding work position is transferred, the pressing head is lowered to the pick up position (S111). Then, a vacuum is provided to the pressure head so that the pressure head picks up the driving chip (S112). When the driving chip is picked up, the pressure head is raised again to the escape position (S113).

When the pressure head is raised to the escape position, the supply hand is transferred (S114). That is, exit. At this time, only the supply hand is transferred alone. After the supply hand is transferred, the pressure head is lowered to the imaging position again (S115). Then, the two cameras capture the two chip marks of the driving chip sucked in the vacuum by the pressure head (S116). When the imaging of the two chip marks is completed, the pressure head lowered to the imaging position is raised again to the above-described escape position (S117).

Next, the stage on which the substrate is supported is advanced to the bonding work position and transferred (S118). The bonding work position is provided with a back_up tool for supporting an area of the substrate (hereinafter, referred to as a non-overlapping section). When the stage is transferred to the bonding work position, the stage is down and the substrate is moved to the stage. And is supported together with the backup tool (S119).

In this state, the two cameras capture two glass marks formed on the substrate (S120). After image capturing up to two glass marks as described above, the stage on which the substrate is supported is aligned on the X-axis, Y-axis, and θ-axis based on the two chip marks photographed above (S121).

When the alignment work for the stage is completed, the pressure head is lowered to the bonding position (S122), and the pre-bonding operation is performed (S123). When the pre-bonding operation is completed, the pressure head is raised to the escape position (S124), and after the stage is up (S125), the stage is taken out (S126). Then, the supply hand is transferred again (S127), and the above-described steps S111 to S127 are repeated one cycle.

However, according to the related art, not only the operation of imaging the two chip marks or the imaging of the two glass marks is performed in separate steps, but also the steps S111 to S127 described above do not partially proceed simultaneously, and all of them are independent. Due to the operation, there is a limit to substantially reduce the tact time associated with bonding the driving chip to the substrate, and thus, a new concept needs to be introduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding apparatus for a driving circuit board that can bond the driving circuit board to the substrate in a simple and simple manner, and can shorten the tact time according to the bonding operation and speed up the work. And a method thereof.

On the other hand, the object is, according to the present invention, the substrate to be bonded to the driving circuit board to the upper surface is supported, the stage for transporting and taking out the substrate to the bonding work position; A pressing head provided to be capable of lifting and lowering at the bonding work position, and configured to press the driving circuit board to bond the driving circuit board to the substrate by absorbing the driving circuit board; And aligning the marks by capturing at least one chip mark of the driving circuit board absorbed by the pressing head and at least one glass mark of the substrate supported by the stage. (align) is also achieved by a bonding device for a driving circuit board comprising an alignment image information acquisition unit for acquiring image information.

Here, the alignment image information acquisition unit may be provided integrally.

At least one chip mark of the driving circuit board and at least one glass mark of the substrate may be two, respectively, and the aligned image information acquisition unit may be configured to use the two chip marks and the glass mark at once. It can image together.

The alignment image information acquisition unit may include: a prism block including a plurality of imaging windows for imaging the at least one chip mark and the at least one glass mark together at one time; A plurality of dummy coupling blocks each connected to opposite sides of the prism block; A plurality of prisms provided in the prism block and the plurality of dummy coupling blocks to refract the direction of light to the plurality of image pickup areas; A plurality of barrels coupled to the plurality of dummy coupling blocks, respectively; And a plurality of camera lens units respectively coupled to end regions of the plurality of barrels.

The alignment image information acquisition unit may include a plurality of lens holders provided between the plurality of camera lens units and the plurality of barrels; And a plurality of lighting units respectively coupled to the plurality of barrels to irradiate light to the plurality of barrels.

The prism blocks may be formed in a pair divided with each other, and each of the two imaging windows may be arranged adjacent to each other at equal intervals in the pair of prism blocks.

The control apparatus may further include a controller configured to control the stage for aligning the substrate with respect to the driving circuit board based on the alignment image information of the marks acquired by the alignment image information obtaining unit.

It may further include a backup tool (back_up Tool) provided separately from the stage to support a region of the substrate from the bonding work position from below, the control unit, the stage is transferred to the bonding work position Before one region of the substrate is supported on the support surface of the backup tool, the stage may be controlled to be aligned with the X, Y, and θ axes based on the image information of the alignment image information acquisition unit.

The substrate may be a liquid crystal display (LCD) substrate for a mobile terminal, and the driving circuit substrate may be a driver integrated circuit.

On the other hand, the object is, according to the present invention, the stage supporting the substrate is transferred to the bonding working position; The pressure head picking up the driving circuit board is lowered to an imaging position; Simultaneously acquiring at least one chip mark formed on the driving circuit board and at least one glass mark formed on the substrate to obtain align image information on the marks; Aligning the stage on which the substrate is supported based on the plurality of chip marks based on the acquired image information on the marks; And the pressing head is lowered to bond the driving circuit board to the substrate.

Here, the step of lowering the pressing head to the imaging position may be performed with an operation in which the stage is down by a predetermined distance or a backup tool for supporting the non-overlapping section of the substrate is up.

The aligning of the stage may proceed with an operation in which the stage is further moved by the distance toward the backup tool such that the stage can be positioned substantially completely at the bonding work position.

After the bonding of the driving circuit board, the pressing head may further include a step of raising to the escape position, wherein the step of raising the pressure head to the escape position, the stage is up (up) or The backup tool may proceed with the operation of down.

After the pressing head is raised to the evacuation position, the stage may be further taken out, wherein the stage is taken out, wherein the feeding hand transfers a new driving circuit board to the lower portion of the pressing head. Can be proceeded with the operation.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

Bonding apparatus and method of a driving circuit board according to an embodiment of the present invention, Flexible Printed Circuit (FPC), Tape Carrier Package (TCP), Common Block Flexible Printed Circuit (CBF) and Driver Integrated Circuit (CIC), For driving circuit boards such as driving chips), flat panel display devices such as plasma display panels (PDPs), liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), and the like It can be used when bonding to a substrate for panel display (bonding), but for convenience of description, the following describes the bonding of a driving chip to an LCD substrate used in a small mobile terminal such as a mobile phone. Shall be.

3 is a perspective view of an LCD substrate to which a driver chip is bonded.

As shown in this figure, the LCD substrate 1 includes an upper glass 2 and a lower glass 3 which are partially faced to each other in a state where a liquid crystal (not shown) is injected therein. And a TFT panel, and upper and lower polarizers 4 and 5, which are attached to outer surfaces of the upper and lower glasses 2 and 3, respectively.

The upper glass 2 forming the image of the color is formed smaller in area than the lower glass 3. Therefore, the non-overlapping section H, which does not overlap the upper glass 2, is present on one side of the upper surface of the lower glass 3, and the driving chip 6 is bonded to the upper surface of the non-overlapping section H. In the present embodiment, one driving chip 6 is bonded to the non-overlapping section H, but two or more driving chips 6 may be bonded because the scope of the present invention is not limited thereto.

As shown, the upper polarizing plate 4 is substantially attached to the uppermost surface of the upper glass 2. However, the lower polarizing plate 5 is attached only to a part of the lower surface of the lower glass 3 except for the non-overlapping section H.

On the other hand, the driving chip 6 should be in a state where it is seated at the top position of the substrate 1, that is, the non-overlapping section H, and in this state, the driving head 6 is lowered by the pressing head 30 to be described later. ) To obtain the desired quality. Therefore, before the bonding operation, a relative alignment (alignment) operation between the driving chip 6 and the substrate 1 is required. Relative alignment operations between the driving chip 6 and the substrate 1 will be described later. However, as shown in FIG. 3 in order to proceed with the operation, two glass marks 1a are placed on the substrate 1. 1b, glass marks are formed, and two chip marks 6a, 6b, chip marks are also formed on the driving chip 6 as well.

4 is a schematic configuration diagram of a bonding apparatus for a driving circuit board according to an exemplary embodiment of the present invention, FIG. 5 is a perspective view of an alignment image information acquisition unit shown in FIG. 4, and FIG. 6 is of FIG. 5. 7 to 9 are diagrams showing step by step operations of the bonding apparatus of the driving circuit board according to the exemplary embodiment of the present invention, respectively.

As shown in these drawings, the bonding apparatus according to an embodiment of the present invention, the stage (10), the backup tool (20, back_up Tool), the pressing head 30, the alignment image information acquisition unit ( 40 and a supply hand 50, and a control unit (not shown) for controlling them.

As described above, the stage 10 includes a substrate 1 having upper and lower glasses 2 and 3 having upper and lower polarizing plates 4 and 5 attached to respective outer surfaces thereof, and a driving chip 6. It transfers to the bonding working position (W) of the or serves to take out the substrate (1) the bonding operation is completed. In other words, the stage 10 substantially serves as a transfer means for transferring the substrate 1. Of course, in some cases, when the bonding operation is carried out also serves as a part of supporting the lower region of the substrate (1).

The stage 10 includes a support surface 11 having a larger area than the substrate 1 so that the substrate 1 can be easily supported in a planar state. However, as described above, the stage 10 supports the substrate 1, but supports the remaining region of the substrate 1 except for the non-overlapping section H of the substrate 1. Therefore, the support surface 11 of the stage 10 may be regarded as supporting the lower polarizer region 5 of the substrate 1.

Although not shown in detail, the support surface 11 of the stage 10 is provided with a plurality of vacuum holes (not shown) for adsorbing the substrate 1. In addition, the stage 10 may further include a vacuum controller (not shown) for adjusting the strength of the vacuum on / off and the vacuum formed in the stage 10. The vacuum may be formed only when the stage 10 transfers the substrate 1 to the bonding work position W of the driving chip 6 or takes out the substrate 1 on which the bonding work is completed, or even during the bonding work. It may be formed.

The backup tool 20 is a structure which supports the board | substrate 1 with the stage 10 at the time of a bonding operation. While the support surface 11 of the stage 10 supports most of the surface of the substrate 1, the support surface 21 of the backup tool 20 locally supports only the non-overlapping section H described above. At this time, a vacuum hole (not shown) may also be formed in the support surface 21 of the backup tool 20 to adsorb the non-overlapping section H in a vacuum state.

If the vacuum hole formed in the support surface 21 of the backup tool 20 thus adsorbs the non-overlapping section H in a vacuum state, it may be advantageous to release the vacuum formed on the stage 10 side. . This is briefly explained.

If, most of the surface of the substrate 1 is supported while being sucked in a vacuum to the support surface 11 of the stage 10 and the non-overlapping section H of the substrate 1 is the support surface of the backup tool 20 When the pressure head 30 is lowered in this state and the driving chip 6 is pressed in this state, the support surface 11 of the stage 10 and the backup tool 20 are supported. Relative height differences between the surfaces 21 may cause breakage and cracking of the substrate 1.

However, as described above, only the non-overlapping section H of the substrate 1 is supported while being sucked in a vacuum on the support surface 21 of the backup tool 20, and the substrate 1 is supported by the stage 10. When it is kept in the excited state from the surface 11, the pressurizing head 30 pressurized substantially when the bonding operation of the drive chip 6 with respect to the board | substrate 1 advances by the lowering of the pressurizing head 30 in this state. ), The substrate 1, and the support surface 21 of the backup tool 20 form substantially parallel coplanar surfaces, thereby preventing breakage and cracking of the substrate 1. However, the scope of the present invention is not necessarily limited thereto.

The backup tool 20 is provided separately from the stage 10. In the present embodiment, the backup tool 20 is provided to be capable of raising and lowering at any one region of the bonding work position W of the driving chip 6. However, since the scope of the present invention is not limited thereto, the backup tool 20 may be provided to be fixed in one region of the bonding work position W. FIG.

The pressurizing head 30 serves to bond the driving chip 6 to the upper surface of the non-overlapping section H of the substrate 1 substantially. Therefore, the pressing head 30 is provided at the bonding working position (W), but is provided to be able to move up and down at the corresponding position.

In order to drive up and down the pressurizing head 30, the pressurizing head 30 should be provided with a cylinder device for raising and lowering as well as a heating wire for thermal compression. However, the detailed description of the pressurized head 30 will be omitted, and if necessary, reference is made to the technology filed by the present applicant.

The alignment image information acquisition unit 40 includes two chip marks 6a and 6b formed on the driving chip 6 and two glass marks 1a and 1b formed on the substrate 1. Simultaneously) to obtain relative aligned image information between the marks 1a, 1b, 6a, and 6b.

That is, in the bonding apparatus of the prior art, the operation of imaging the two chip marks 6a and 6b and the two glass marks 1a and 1b by two cameras (not shown) has been performed in separate steps, respectively. In addition to the time taken to separately photograph the marks 1a, 1b, 6a, and 6b, the operation of the pressure head 30 is lowered and the stage 10 moves for the imaging of the marks 1a, 1b, 6a, and 6b. Since more time was required for the operation, etc., there was no limit to reducing the tact time.

However, in this embodiment, two chip marks 6a, 6b (see FIG. 3) formed on the driving chip 6 and two glass marks 1a, 1b, see FIG. 3 formed on the substrate 1 together. By adopting the alignment image information acquisition unit 40 which can simultaneously image, the tact time can be shortened than before.

In addition, by simultaneously imaging the marks 1a, 1b, 6a and 6b, the pressing head 30 is moved up and down and the stage 10 is moved for imaging the marks 1a, 1b, 6a and 6b. It can reduce a part of, which can contribute more to shortening the tact time.

As shown in FIGS. 5 and 6, the aligned image information acquisition unit 40 captures four images for photographing two chip marks 6a and 6b and glass marks 1a and 1b together at once. Prismatic block 41 provided with window 41a, four dummy coupling blocks 42 connected to two opposite sides of prism block 41, and prism block 41 and four dummy, respectively. A plurality of prisms (not shown) provided in the coupling block 42 to refract the direction of light to the four imaging windows 41a, and four barrels 43 respectively coupled to the four dummy coupling blocks 42. And four camera lens portions 44 respectively coupled to the end regions of the four barrels 43.

Prism block 41 is composed of a pair of mutually divided. In the prism block 41 divided into two pairs, two imaging windows 41a are arranged adjacent to each other at equal intervals.

Between the four camera lens portions 44 and the four barrels 43, that is, between the two camera lens portions 44 and the barrel 43, a lens holder 45 for supporting the camera lens portions 44 is provided. Each is provided. The lens holder 45 corresponds to a structure for assembling the lens unit 44 and the barrel 43.

In addition, four lighting units 46 are further provided below the four barrels 43 to be coupled to the four barrels 43 to irradiate light with the four barrels 43.

For reference, in the present embodiment, since the four imaging windows 41a are arranged adjacent to each other at equal intervals, two chip marks 6a, 6b (see FIG. 3) formed on the driving chip 6 and a substrate ( It is possible to simultaneously image two glass marks 1a and 1b formed in 1) together.

That is, the structure between the prism block 41, four dummy coupling blocks 42, four barrels 43, four camera lens units 44, two lens holders 45, and four lighting units 46. Due to its characteristic feature, even if the four imaging windows 41a are narrowly arranged, it is sufficient to capture four narrow marks 1a, 1b, 6a, and 6b at once. However, if four cameras are simply provided, four marks 1a, 1b, 6a, and 6b which are substantially narrow due to the volume between the cameras cannot be captured at once.

In more detail, the four marks 1a, 1b, 6a, and 6b may be simultaneously photographed using four independent cameras, but in this case, the interference between the cameras may not be generated. The chip marks 6a and 6b and the glass marks 1a and 1b should be placed at a considerable distance, so that the stage 10 moves a considerable distance even when imaging four marks 1a, 1b, 6a and 6b simultaneously. In this case, it takes time to move the stage 10 so that the tact time may not be substantially reduced or the path of the stage 10 may be complicated, and thus, actual alignment may be difficult. However, as in the embodiment of the present invention, four imaging windows 41a are arranged adjacent to each other so that alignment image information for simultaneously imaging the chip marks 6a and 6b and the glass marks 1a and 1b is acquired. In the case of adopting the unit 40, not only the movement time of the stage 10 is short, but also its path is not complicated, so alignment is not difficult.

The supply hand 50 serves to provide the driving chip 6 to the lower region of the pressing head 30 so that the driving chip 6 can be picked up (or attracted) to the pressing head 30. Therefore, the supply hand 50 may be regarded as a robot providing the driving chip 6.

On the other hand, the control unit controls the stage 10, the backup tool 20, and the alignment image information acquisition unit 40, including the pressing head 30. In particular, in the present embodiment, the control unit is based on the relative alignment image information between the marks (1a, 1b, 6a, 6b) obtained by the alignment image information acquisition unit 40, the substrate for the driving chip 6 Control relative alignment of (1). That is, the controller controls the relative alignment of the substrate 1 with respect to the driving chip 6 by aligning the stage 10 on which the substrate 1 is supported on the X-axis, Y-axis, and θ-axis.

However, in the process of aligning the stage 10 by the controller, the stage 10 is transferred to the bonding work position W and down, so that one area of the substrate 1 is supported by the backup tool 20. Before being supported by the ground 21, the stage 10 is controlled to align the X, Y, and θ axes.

Then, the bonding method of the driving chip 6 according to the present embodiment in parallel with the control process of the control unit will be described in series with reference to FIGS. 7 to 10.

First, as shown in FIG. 7, when the supply hand 50 providing the driving chip 6 is transferred to the lower region of the pressurizing head 30 located at the bonding work position W, the pressurizing head 30 is moved. It descends to the pick up position L1 (S11).

Then, a vacuum is provided to the pressure head 30 so that the pressure head 30 picks up the driving chip 6 from the supply hand 50 (S12). When the driving chip 6 is picked up, the pressure head 30 rises again to the escape position L2 (S13). The steps up to now may be substantially the same as the prior art of FIG. 2 described above.

When the pressure head 30 is raised to the escape position L2, the supply hand 50 is transferred. That is, it exits to its original position. In the prior art, an operation was formed in this step as long as only the supply hand 50 was transferred alone, but in this embodiment, the stage 10 on which the substrate 1 is supported together with the transfer of the supply hand 50 is bonded. The work to be advanced and transported to the position (W) is parallel together (S14).

Next, as shown in FIG. 8, the pressing head 30 is lowered to the imaging position L3. In the prior art, only the pressing head 30 was lowered to the imaging position L3 at this stage, and other operations did not proceed together. However, in the case of the present embodiment, while the pressing head 30 is lowered to the imaging position L3, the stage 10 is down by a predetermined distance (S15).

As such, when the stage is down by a predetermined distance, a portion of the non-overlapping section H of the substrate 1 may be supported by the support surface 21 of the backup tool 20 provided at the bonding work position W. FIG. . Of course, the substrate 1 is not completely aligned in the step S15, and the stage 10 still needs to be moved while moving further up and down a certain distance toward the backup tool 20.

In this way, the pressing head 30 is lowered to the imaging position L3 and the stage 10 is down so that the non-overlapping section H of the substrate 1 is supported by the support surface 21 of the backup tool 20. After being partially supported on the chip, the two chip marks 6a and 6b formed on the driving chip 6 by the alignment image information obtaining unit 40 and the two glass marks formed on the substrate 1 (1a, 1b, see FIG. 3) are simultaneously imaged at once (S16).

Then, the stage 10 is moved while moving further toward the backup tool 20 by a predetermined distance so that the stage 10 can be completely positioned at the bonding work position W. FIG. In this case, the stage 10 on which the substrate 1 is supported on the basis of the image information on the marks 1a, 1b, 6a, and 6b obtained by imaging, that is, based on the two chip marks 6a and 6b. The process of aligning the X-axis, the Y-axis and the θ-axis is performed at the same time (S17).

Then, the stage 10 is down and the substrate 1 is completely supported by the stages 10 and the support surfaces 11 and 21 of the backup tool 20 (S18). Of course, in step S18, the stage 10 may not be down, and conversely, the backup tool 20 may be up. As described above, when the substrate 1 is supported, when the vacuum hole formed in the support surface 21 of the backup tool 20 sucks the non-overlapping section H in a vacuum state, the stage 10 It would be advantageous for the vacuum formed on the side to be released.

When the alignment work on the stage 10 is completed, the pressure head 30 is lowered to the bonding position L4 as shown in FIG. 9 (S19) to perform pre-bonding work. (S20).

When the pre-bonding operation is completed, the pressure head 30 rises again to the escape position L2. In the prior art, only the pressing head 30 has risen to the evacuation position L2 at this stage, but other operations cannot be performed together. Operation (10) is up or the backup tool (20) is down (down).

Next, the stage 10 is taken out, and in this stage, unlike the conventional method, the supply hand 50 again moves a new driving chip (not shown) together with the operation in which the stage 10 is taken out. The operation of moving to the area is performed together (S22). Then, the aforementioned steps S11 to S22 are repeated one cycle.

According to this bonding method, compared to the conventional bonding method (refer to FIG. 2), it is not necessary to proceed many steps after completion of the previous step, and the tact time is shortened by that since each step can be performed at the same time. It is enough to realize the speed of work.

As described above, according to the present embodiment, the driving chip 6 can be bonded to the substrate 1 in a simple and simple manner, and the tact time according to the bonding work can be shortened and the work can be speeded up. .

In the above-described embodiment, the pressurized head has been described as being used for pressing, but may be applied to the main pressing.

In addition, in the above-described embodiment, the alignment image information acquisition unit is applied to the bonding apparatus of the driving circuit board, but the alignment image information acquisition unit may be applied to various devices such as an inspection apparatus.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, the driving circuit board can be bonded to the substrate by a simple and simple method, and the tact time according to the bonding operation can be shortened and the work can be speeded up.

Claims (18)

delete delete delete delete delete delete delete delete delete delete delete A stage for supporting a substrate to which a driving circuit board is to be bonded to an upper surface, and transferring and taking out the substrate to a bonding work position; A pressurizing head provided to be capable of lifting and lowering at the bonding work position, for absorbing the driving circuit board to press and bond the driving circuit board to the substrate; At least one chip mark of the driving circuit board adsorbed by the pressing head and at least one glass mark of the substrate supported by the stage are taken together to align the marks. align) an image information acquisition unit for acquiring image information; A back-up tool provided separately from the stage to support a region of the substrate from below at the bonding work position; And Before the stage is transferred to the bonding operation position and one region of the substrate is supported on the support surface of the backup tool, the alignment image information is obtained based on the alignment image information of the marks acquired by the alignment image information acquisition unit. A control unit for controlling the stage to be aligned with the X axis, the Y axis, and the θ axis, The alignment image information acquisition unit, An imaging window for capturing the chip mark and an imaging window for capturing the glass mark are adjacent to each other so that the chip mark and the glass mark are captured together at once to obtain alignment image information on the chip mark and the glass mark. A prism block; A plurality of dummy coupling blocks each connected to opposite sides of the prism block; A plurality of prisms provided in the prism block and the plurality of dummy coupling blocks to refract the direction of light to the plurality of image pickup areas; A plurality of barrels coupled to the plurality of dummy coupling blocks, respectively; A plurality of camera lens portions respectively coupled to end regions of the plurality of barrels; A plurality of lens holders provided between the plurality of camera lens portions and the plurality of barrels; And A plurality of lighting units coupled to the plurality of barrels to irradiate light to the plurality of barrels, The prism block is composed of a pair of mutually divided, and each of the two imaging windows are arranged adjacent to each other at equal intervals in the pair of prism blocks, The prism block, the plurality of dummy coupling blocks, the plurality of prisms, the plurality of barrels, the plurality of camera lens units, the plurality of lens holders and the plurality of lighting units are integrally provided. Bonding device for substrate. delete Transferring the stage supporting the substrate to a bonding work position; The pressure head picking up the driving circuit board is lowered to an imaging position; Simultaneously acquiring at least one chip mark formed on the driving circuit board and at least one glass mark formed on the substrate to obtain alignment image information of the marks; Aligning the stage on which the substrate is supported based on the at least one chip mark based on the obtained image information on the marks; Bonding the driving circuit board to the substrate by lowering the pressure head; After the bonding of the driving circuit board, the pressing head is raised to an escape position; And And after the pressing head is raised to the escape position, the stage is taken out. The method of claim 14, The step of lowering the pressure head to the imaging position is characterized in that the stage is moved down with a predetermined distance down (down) or the backup tool for supporting the non-overlapping section of the substrate up (up) Bonding method of driving circuit board. The method of claim 15, And the aligning of the stage is performed with an operation in which the stage is further moved by the predetermined distance toward the backup tool so that the stage can be positioned at the bonding working position substantially completely. Bonding method of substrate. The method of claim 15, And the step of raising the pressurizing head to the escape position proceeds with an operation in which the stage is up or the backup tool is down. The method of claim 14, The step of taking out the stage, the bonding method of the driving circuit board, characterized in that the progress of the feeding hand transfers a new driving circuit board to the lower portion of the pressing head.

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