TWI364247B - Apparatus and method for bonding printed circuit - Google Patents
Apparatus and method for bonding printed circuit Download PDFInfo
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- TWI364247B TWI364247B TW97117370A TW97117370A TWI364247B TW I364247 B TWI364247 B TW I364247B TW 97117370 A TW97117370 A TW 97117370A TW 97117370 A TW97117370 A TW 97117370A TW I364247 B TWI364247 B TW I364247B
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Description
九、發明說明： 【發明所屬之技術領域】 以將印刷電路壓銲在平板影像資訊裝置以及用 別是指一種可以-簡單面板上的設備及方法，特 流程的加工時間，以實^的方法’同時地縮短一壓銲 【先前技術】 ,plpx °例如電漿顯不面板（plasma display P—，，）、液晶顯示器（Uquidcrystai 以及有機發光二極體（nro>Qn. .. L ； m ^ ^ game light emitting diode » D) 4 相平板顯示器（加 panel display，FPD)’ 係逐漸地製造的更薄、更輕。於是，不同的印刷電路係直 接連接到平板㈣H且製造成—種整合性產品。在下列的 敛述中平板顯不器係表示液晶顯示H基板C IXD substrate)。 .印刷電路包括可撓性印刷電路（flexible printed cnxint ’ FPC)、捲帶式晶片載體封裝c町^ package，TCP)與-般成批的軟性電路板，以及驅動積體 電路（driVer、IC)。這些印刷電路係直接連接到-基板， j不而要複雜的佈線’也因此使得組裝、保養與維修 父合易而既然不需要分隔的佈線空間，印刷電路 可以適σ於使產σσ小型化與輕薄化，以便獲得有品質的產 1364247 路可相容不同的佈線’因此印刷電 而不會受到基板的使用與規格所影 印刷電路壓銲流程的研究係:續不斷地;=7=之 =提出一種在都是自動化流程中‘Nine, the invention: [Technical field of the invention] In order to press-fit the printed circuit on the flat-panel image information device and to refer to a device and method that can be used on a simple panel, the processing time of the special process is determined by the method ' Simultaneously shorten a pressure welding [previous technique], plpx ° such as plasma display P-,, liquid crystal display (Uquidcrystai and organic light-emitting diode (nro> Qn. .. L; m ^ ^ game light emitting diode » D) 4-phase flat panel display (with panel display, FPD)' is gradually made thinner and lighter. Therefore, different printed circuits are directly connected to the flat panel (4) H and manufactured into an integrated In the following description, the flat panel display means a liquid crystal display H substrate C IXD substrate. The printed circuit includes a flexible printed circuit (FPC), a tape carrier package, and a general-purpose flexible circuit board, and a driver integrated circuit (driVer, IC). . These printed circuits are directly connected to the -substrate, and j is not complicated wiring. Therefore, the assembly, maintenance, and maintenance of the father are easy, and since there is no need for separate wiring spaces, the printed circuit can be adapted to miniaturize the production σσ. Light and thin, in order to obtain a quality of 1364247 compatible with different wiring 'so the printing is not subject to the use of the substrate and the specifications of the printed circuit welding process research department: continued; = 7 = = Propose a way in both automated processes'
=介=現❹完全自繼輪程的壓鋒方 P請參考圖1’係表示一般習知的完全自動模組壓鮮流 私。在圖1中’所述的完全自動模組壓銲流程區分成一玻 璃覆晶（Ghip-Gn-glass，GGG)壓銲流程以及—玻璃上膜 (film-on-glass，FOG)壓銲流程。 在玻璃覆晶（COG )壓銲流程的敘述中，印刷電路係 以驅動積體電路表示。在玻璃覆晶（c〇G)壓銲流程中，一 為流程目標的基板係置放在一平台上，而且一異方性導電=介=Present the full-scale round of the pressure front side P Please refer to Figure 1' for the general known fully automatic module pressure fresh flow. The fully automatic module pressure welding process described in Figure 1 is divided into a Ghip-Gn-glass (GGG) pressure welding process and a film-on-glass (FOG) pressure welding process. In the description of the glass flip chip (COG) pressure welding process, the printed circuit is represented by a drive integrated circuit. In the glass flip chip (c〇G) pressure welding process, a substrate for the process target is placed on a platform, and an anisotropic conduction
品。再者，既然印刷電 路可以被廣泛地使用， 於更，在用以將 膠臈（anisotropic conductive film，ACF)係圖案化並 連接到在基板上供驅動積體電路連接的位置。 驅動積體電路係使用如同一搬運機的一運送設備，而 從一用以容納驅動積體電路的供給托盤抓取，並在異方性 導電膠膜圖案化的位置將驅動積體電路作預壓銲（在此之 後’係代表預先按壓或者是預先壓銲）。之後，驅動積體電 路係藉由加熱以及加壓在基板及驅動積體電路而進行完全 地壓銲.（在此之後，係代表主要地按壓）。為了確認驅動積 體電路是否正確地壓銲到基板，則利用一用以確認驅動積 6 1364247 體電路是否正確地連接的壓痕檢查，以及一用以確認是否 產生裂缝的裂縫檢查來實現。 在玻璃覆晶壓銲流程之後所進行的玻璃上膜壓銲流 程，除了連接的印刷電路形式之外，係大致與玻璃覆晶壓 銲流程相同。也就是說，玻璃覆晶壓銲流程為將驅動機體 電路連接並壓銲到基板的流程者，則玻璃上膜壓銲流程為 壓銲例如一由薄膜形成的可撓性印刷電路或是導電壓膜 (conductive bonding film)的流程，而且此可撓性印刷 電路或是導電壓膜係連接在玻璃覆晶壓銲流程中的驅動積 體電路以及一印刷電路板（printed circuit board ’ PCB)。 在玻璃上膜壓銲流程中，印刷電路係以可撓性印刷電路為 代表。 請再參考圖1，在異方性導電膠膜黏貼到基板之後， 已校準在基板上的可撓性印刷電路係預先按壓在異方性導 電膠膜上。因此可撓性印刷電路與基板則已經相互校準完 成。在預先按壓完成之後，基板與可撓性印刷電路係藉由 加熱與加壓而相互進行完全地壓銲（主要地按壓）。之後， 即進行用以確認基板與可撓性印刷電路是否適當地結合在 一起的壓痕檢查，以及用以確認裂縫是否產生在基板的裂 缝檢查。當玻璃覆晶壓銲流程以及玻璃上膜壓銲流程完成 時，會進行如一電性測試的輔助流程，再進行一最終封裝 流程，因此而完成了所述的完全自動模組壓銲流程。 以如上所述的壓銲流程索完成的液晶顯示器基板 中，已進行的玻璃覆晶壓録流程的液晶顯示器基板包括一 上玻璃或一彩色濾、光玻璃，以及一下玻璃或是一薄膜電晶 7 1364247 體面板，其部分的表面配置為液晶係灌注在上玻璃與下玻 璃之間，且上偏光片與下偏光片係分別黏貼到上玻璃及下 玻璃的外表面。 在上玻璃中用以形成一彩色影像的區域，係小於在下 玻璃中用以形成一彩色影像的區域。而未與上玻璃重疊的 非重疊區段係設置在下玻璃上表面的一側，即對應於上述 的驅動機體電路。 根據習知驅動機體電路壓銲到基板的壓銲流程，為了 進行壓銲流程，驅動機體電路必須置放在基板上的一精確 位置。在這種狀況下，當一壓頭降下來按壓驅動機體電路 時，才能獲得所欲的品質。因此，在壓銲流程之前，驅動 機體電路與基板之間需要有一相對應的校準流程。 在驅動機體電路與基板之間所進行的校準流程，一習 知的壓銲設備係包括二攝影機。此二攝影機用來拍攝並獲 取形成在驅動機體電路上的二晶片標記，與形成在基板上 的二玻璃標記的影像。之後，支撐基板的平台係在X、Y軸 及Θ角度，以相對應二晶片標記進行校準。最後，使用壓 頭將驅動機體電路壓銲到基板。 請參考圖2,係表示用以解釋一習知壓銲印刷電路之 方法的一流程圖。如圖2所示，當用以提供一驅動機體電 路的一供給手臂，運送到位在一壓銲位置的壓頭之下部區 域時，壓頭係下降到一拿取位置（步驟Sill)。在壓頭即 形成真空以便壓頭可以拿取驅動機體電路（步驟S112)。 當拿起驅動機體電路時，壓頭即上升到一離開位置（步驟 S113)。 8 Z4/ 的供上相軸位置時，移動供給手臂，意即所述 # = 頭的下部區域離開（步驟S114)。此時， 二手#係早獨運达。在供給手臂運送之後，壓頭即下降 空吸二攝影機即拍_頭以真 及，的範動機體電路之二晶片標記（步驟。在完 標記的拍攝之後，下_賴位置㈣頭即上升 回到#開位置（步驟Si 17 )。 smC的平台運送到—壓銲流程位置（步驟 代2。 機版—部分的伽1具（在此之後，係 程位置時’將平台降下且基板則由平 σ與輔助工具所支撐（步驟S119)。 基板的平成魏記的拍攝之後，支樓 (牛台的校準時，M頭即下降到壓銲流程位置 壓並^爾銲流程(步驟S123)。在完成預 平二往l·孩1 /壓頭升起到離開位置（步驟S124)。在 sm的操作。（/驟S127) ’則重覆步驟siii到步驟 _ ’根據習知的技術’由於二 進仃而疋獨自進行，因此在將驅動 1364247 機體電路壓銲到基板的加工時間之降低，會有一定的限 制。因此，需要一改進的方法。 而且，在習知的壓銲設備中，由於平台的支撐表面係 支撐黏貼到下玻璃之下表面的一下偏光片區域，以及辅助 工具的支撐表面係直接地支撐下玻璃未黏貼到下偏光片的 區域，如所述的非重疊區段，因此平台的支撐表面以及辅 助工具的支撐表面並未在同一表面，以便產生與下偏光片 厚度相同的高度差。換句話說，基板大致上並未支撐在一 完全平坦的狀態。 當壓銲設備按壓基板上的驅動機體電路區域，而且基 板並未支撐在一完全平坦狀態時，在基板上即產生一彎曲 的動力。在重要的案例中，由於過度的彎曲動力而可能使 基板損傷或是使基板產生裂痕。 為了避免在基板上產生損傷或是裂痕，平台的支撐表 面以及輔助工具的支撐表面需要盡可能地設置在同一平面 上。然而，由於下偏光片的厚度而不容易達成平台的支撐 表面以及輔助工具的支撐表面在同一平面上。即使平台的 支撐表面以及輔助工具的支撐表面並未位在同一平面上， 當基板的厚度不是太薄時，在基板上就會產生損傷或是裂 痕。 實際上，由於目前在移動終端的液晶顯示器基板的每 一上玻璃及下玻璃，係使用0. 5mm的厚度，因此當驅動機 體電路壓銲在具有上述厚度的基板上時，即使平台的支撐 表面以及輔助工具的支撐表面並未位在同一平面上，在基 板上可能會產生損傷或是裂痕。 1364247 不過，根據正在發展或是未來希望去發展的使用者規 格，每一上玻璃及下玻璃的已知厚度會是0. 25mm。當基板 的厚度縮減到此一程度時，若是平台的支撐表面及從機版 的底部以支撐基板的輔助工具大致上並未位在同一平面的 話，在驅動機體電路的壓銲流程期間，於基板上極有可能 會產生損傷或是裂痕，而因此無法獲得在壓銲流程中的品 質。 因此，當基板的厚度漸漸地縮減而變薄時，則需要有 用以校準平台及輔助工具之支樓表面的一測量設備。然 而，不僅由於產品製造商不想購買昂貴而技術複雜的結構 之測量設備，也因為校準平台的支樓表面與輔助工具的支 撐表面之時間增加，而造成加工時間無法避免地增加的難 題。 【發明内容】 為了解決上述的問題，本發明係提供一種用以獲取校 準影像資訊的裝置以及用以將一印刷電路壓銲在一平板顯 示器上的設備與方法，係藉以一簡單且方便的方法將一印 刷電路壓銲到一基板，且同時降低壓銲流程的加工時間， 以實現高速度的壓銲流程。 本發明提供一種用以獲取校準影像資訊的裝置以及 用以將一印刷電路壓銲在一平板顯示器上的設備與方法， 係可藉由使用簡單的結構與方法有效地支撐基板，以避免 印刷電路壓銲流程期間，在基板上產生損傷或是裂痕，甚 1364247 至是當基板的厚度比以習知技術所使用的基板厚度更薄 時，亦可避免在基板上產生損傷或是裂痕。 根據本發明之一目的，在用以印刷電路與基板之間的 校準所獲得印刷電路與基板上的校準影像資訊的裝置中， ' 所述用以獲取影像資訊的裝置係一體成型，且將形成在印 ' 刷電路上的至少一晶片標記與形成在基板上至少一玻璃標 記拍攝在一起，以獲取這些標記的校準影像資訊。 根據本發明的另一目的，一種用以壓銲一印刷電路的 ® 設備，係包括一平台，具有支樓一基板的一上表面，且將 基板運送並取出到一壓銲流程位置，而該印刷電路係壓銲 到該基板；一壓頭，係設置在該壓銲流程位置，而可以將 該印刷電路向上吸起，且按壓該被吸起的印刷電路到該基 板，以將該印刷電路壓銲到該基板；以及一獲取校準影像 資訊的裝置，係將形成在該被吸起的印刷電路之至少一晶 片標記與形成在該基板上之至少一玻璃標記拍攝在一起， 以獲取該等標記的校準影像資訊。 • 根據本發明的再一目的，一種用以壓銲一印刷電路的 方法，包括將一用以支撑一基板的平台運送到一壓銲流成 位置；將一拿起一印刷電路的壓頭下降到一拍攝位置；同 時地拍攝形成在該印刷電路上的至少一晶片標記與形成在 該基板的至少一玻璃標記，以獲取該等標記的校準影像資 . 訊；依據在該等標記上所獲取的校準影像資訊，將支撐有 該基板的平台相對於該晶片標記進行校準；以及藉由壓頭 的下降，將該印刷電路壓銲到該基板。 12 1364247 依據本發明的再一目的，一種用以壓銲一印刷電路的 設備，包括一平台，係用以運送一基板，且將該基板取出 到一印刷電路的壓銲流成位置及將該基板從該印刷電路的 壓銲流程位置取出，該基板具有一上玻璃及一下玻璃，而 右*干上偏光片及下偏光片係分別黏貼到該上玻璃及該下玻 璃的外表面；一壓銲工具，係設置在該壓銲流程位置，而 可以升起，並可藉由將该印刷電路按壓到該基板之下玻璃 的非重璺區段之一上表面’而將印刷電路壓銲到該基板， 該下玻璃的非重疊區段係在該壓銲流程位置並未與該上玻 璃重疊；以及一辅助工具，係分離地設置在遠離該平台處， 該輔助工具係在該壓銲流程位置從其較低側支撐該非重疊 區段，並具有至少一真空孔，以使在該壓銲工具的壓銲期 間吸取該基板。 根據本發明的再一目的，一種壓鲜一印刷電路的方 法，包括將一基板吸取到一平台上，該平台係可產生真空 並將該被吸取的基板運送到該印刷電路的壓銲流程位置， 該基板具有上玻璃及下玻璃，而上偏光片及下偏光片係分 別黏貼到該上玻璃及該下玻璃的外表面；提供該下玻璃並 未與該上玻璃重疊的一非重疊區段，而使其在設置在該壓 銲流程位置的一輔助工具之一支撐表面上；在輔助工具上 產生真空’並從該非重疊區段的下側吸取該非重疊區段； 移.除產生在該平台的真空，以及糟由將該壓鲜工具下降到 該基板之上，而將該印刷電路壓銲到該非重疊區段的上表 面0 以下在貫施方式中詳細敛述本發明之詳細特徵以及優 13 1364247 =^3二使任何熟習相關技藝者了解本發明之技術 二：=:揭露之内"請專 相關之目的及優點。 可輕易地理解本發明 【實施方式】 本發明用以圖解較佳實施例所附 查委員更加了解本發明、i中的優點叫係為了月匕審 膏頦的目μ n 〃中的優…从及達到本發明所 實見的目#轉日核下列的敘述巾，絲考 詳加說明本發明的較佳實·。其中， 納 表示相同的元件。 」的兀件、，扁號係 根據本發明的一實施例中，一 的設備及方法，可使用在將印刷電路“厂 == 平板顯示器(FPD)的基板上，此印到 =叫捲帶式晶_卿電= f電路板(CBF)以及驅動積體電路(dri二 顯不器係例如《顯示器p )」= 以及有機發光二極體（0LED)。為“2曰曰顯不盗（LCD) ::及方法係適用於將驅動積體電路壓=== 移動t端上之液晶顯示器基板。j使用在如手機的 液曰ιΓ-參考3 ’係表林㈣—驅動㈣電路壓銲到一 1係包括—μ沾成r、0如圖3所不，液晶顯示器基板 ^ 或一彩色濾光玻璃）2及一下玻璃 -相電晶體面板)3,液晶(圖未示)係灌注:=2 1364247 及下玻璃3的部分表面之間，而且一上偏光片4及一下偏 光片5係分別地黏貼到上玻璃3及下玻璃3的外表面。Product. Further, since the printed circuit can be widely used, it is used to pattern an anisotropic conductive film (ACF) and connect it to a position on the substrate for driving the integrated circuit. The driving integrated circuit is grasped from a supply tray for accommodating the driving integrated circuit by using a conveying device such as the same carrier, and the driving integrated circuit is pre-positioned at a position where the anisotropic conductive film is patterned. Pressure welding (after this means 'pre-pressed or pre-welded). Thereafter, the integrated integrated circuit is completely pressure-bonded by heating and pressurizing the substrate and driving the integrated circuit (hereinafter, it is mainly pressed). In order to confirm whether or not the driving integrated circuit is properly soldered to the substrate, it is realized by an indentation inspection for confirming whether or not the driving circuit 6 1364247 body circuit is properly connected, and a crack inspection for confirming whether or not cracks are generated. The glass film bonding process performed after the glass flip chip bonding process is substantially the same as the glass flip chip bonding process except for the connected printed circuit form. That is to say, the glass flip chip bonding process is a process for connecting and soldering the body circuit to the substrate, and the glass film bonding process is pressure welding, for example, a flexible printed circuit formed by a film or a conductive voltage. The process of a conductive bonding film, and the flexible printed circuit or the voltage-conducting film is connected to a driving integrated circuit in a glass flip-chip bonding process and a printed circuit board 'PCB. In the glass film bonding process, the printed circuit is represented by a flexible printed circuit. Referring again to FIG. 1, after the anisotropic conductive film is adhered to the substrate, the flexible printed circuit that has been calibrated on the substrate is preliminarily pressed against the anisotropic conductive film. Therefore, the flexible printed circuit and the substrate are already calibrated to each other. After the pre-pressing is completed, the substrate and the flexible printed circuit are completely pressure-bonded (mainly pressed) by heating and pressurization. Thereafter, an indentation inspection for confirming whether or not the substrate and the flexible printed circuit are properly combined is performed, and a crack inspection for confirming whether or not the crack is generated on the substrate is performed. When the glass flip chip bonding process and the glass film bonding process are completed, an auxiliary process such as an electrical test is performed, and then a final packaging process is performed, thereby completing the fully automatic module pressure welding process. In the liquid crystal display substrate completed by the pressure welding process as described above, the liquid crystal display substrate of the glass flip-chip recording process includes an upper glass or a color filter, a light glass, and a glass or a thin film. 7 1364247 The body panel is partially surface-mounted with a liquid crystal system interposed between the upper glass and the lower glass, and the upper polarizer and the lower polarizer are respectively adhered to the outer surfaces of the upper glass and the lower glass. The area used to form a color image in the upper glass is smaller than the area used to form a color image in the lower glass. The non-overlapping section which is not overlapped with the upper glass is disposed on one side of the upper surface of the lower glass, i.e., corresponds to the above-described driving body circuit. According to the conventional pressure welding process for driving the body circuit to the substrate, in order to perform the pressure welding process, the driving body circuit must be placed at a precise position on the substrate. In this case, when a head is lowered and pressed to drive the body circuit, the desired quality can be obtained. Therefore, a corresponding calibration process is required between the drive body circuit and the substrate before the pressure welding process. In the calibration process performed between the drive body circuit and the substrate, a conventional pressure welding apparatus includes two cameras. The two cameras are used to capture and acquire two wafer marks formed on the drive body circuit, and two glass mark images formed on the substrate. Thereafter, the platform supporting the substrate is aligned at the X, Y axis and the Θ angle to correspond to the two wafer marks. Finally, the drive body circuit is pressure bonded to the substrate using a press head. Referring to Figure 2, there is shown a flow chart for explaining a conventional method of soldering a printed circuit. As shown in Fig. 2, when a supply arm for providing a drive body circuit is transported to a lower portion of the ram in a press-welding position, the ram is lowered to a take-up position (step Sill). A vacuum is formed at the indenter so that the indenter can take the driving body circuit (step S112). When the drive body circuit is picked up, the ram is raised to an exit position (step S113). When the upper phase position of the Z Z/ is supplied, the supply arm is moved, that is, the lower portion of the # = head is left (step S114). At this time, the second-hand # is a long-term transport. After the supply arm is transported, the indenter is lowered and the second camera is taken. The first chip is marked with the second chip of the motor circuit (step. After the shooting of the mark, the head of the lower position (4) rises back. Go to the #open position (step Si 17). The smC platform is transported to the position of the pressure welding process (step generation 2. machine version - part of the gamma 1 (after this, the position of the system is lowered) and the substrate is The flat σ is supported by the auxiliary tool (step S119). After the photographing of the substrate is completed, the branch (the M head is lowered to the position of the welding process and the welding process is performed (step S123). After completing the pre-leveling, the child/head is raised to the leaving position (step S124). The operation at sm. (/step S127) 'then repeat step siii to step _ 'according to the conventional technique' due to two It is carried out by itself, so there is a certain limit in reducing the processing time for driving the 1364247 body circuit to the substrate. Therefore, an improved method is required. Moreover, in the conventional pressure welding equipment, The support surface of the platform is supported and pasted. The area of the lower polarizer to the lower surface of the lower glass, and the support surface of the auxiliary tool directly support the area where the lower glass is not adhered to the lower polarizer, such as the non-overlapping section, so the support surface of the platform and the auxiliary tool The support surfaces are not on the same surface to produce the same height difference as the thickness of the lower polarizer. In other words, the substrate is not substantially supported in a completely flat state. When the bonding apparatus presses the drive body circuit area on the substrate And when the substrate is not supported in a completely flat state, a bending power is generated on the substrate. In an important case, the substrate may be damaged or cracked due to excessive bending power. Damage or cracks are generated, and the support surface of the platform and the support surface of the auxiliary tool need to be disposed on the same plane as much as possible. However, the support surface of the platform and the support surface of the auxiliary tool are not easily achieved due to the thickness of the lower polarizer. On the same plane, even the support surface of the platform and the support table of the auxiliary tool It is not located on the same plane. When the thickness of the substrate is not too thin, damage or cracks will occur on the substrate. In fact, due to the current glass and the lower glass of the liquid crystal display substrate of the mobile terminal, Using a thickness of 0.5 mm, so when the driving body circuit is pressure-welded on the substrate having the above thickness, even if the supporting surface of the platform and the supporting surface of the auxiliary tool are not located on the same plane, damage may occur on the substrate or It is a crack. 1364247 However, according to the user specifications that are being developed or are expected to develop in the future, the known thickness of each of the upper and lower glass will be 0.25 mm. When the thickness of the substrate is reduced to this extent, if it is a platform If the support surface and the auxiliary tool supporting the substrate from the bottom of the machine plate are not substantially in the same plane, there is a possibility that damage or cracks may occur on the substrate during the pressure welding process of driving the body circuit, and thus The quality in the pressure welding process cannot be obtained. Therefore, when the thickness of the substrate is gradually reduced and thinned, a measuring device for calibrating the surface of the platform of the platform and the auxiliary tool is required. However, not only does the product manufacturer not want to purchase expensive and technically complicated structural measuring equipment, but also because the time of the surface of the calibrating platform and the supporting surface of the auxiliary tool increases, resulting in an inevitable increase in processing time. SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides an apparatus for acquiring calibration image information and an apparatus and method for pressure welding a printed circuit on a flat panel display, by a simple and convenient method. A printed circuit is pressure bonded to a substrate while reducing the processing time of the bonding process to achieve a high speed press welding process. The present invention provides an apparatus for acquiring calibration image information and an apparatus and method for pressure welding a printed circuit on a flat panel display, which can effectively support the substrate by using a simple structure and method to avoid the printed circuit During the soldering process, damage or cracks are generated on the substrate, even 1364247. When the thickness of the substrate is thinner than the thickness of the substrate used in the prior art, damage or cracks on the substrate can be avoided. According to one aspect of the present invention, in a device for obtaining calibration image information on a printed circuit and a substrate by calibration between a printed circuit and a substrate, the device for acquiring image information is integrally formed and formed. At least one wafer mark on the printed circuit is photographed together with at least one glass mark formed on the substrate to obtain calibration image information of the marks. According to another object of the present invention, a device for pressure welding a printed circuit includes a platform having an upper surface of a substrate and transporting the substrate to a pressure welding process position, and The printed circuit is pressure-bonded to the substrate; a pressing head is disposed at the position of the bonding process, and the printed circuit can be sucked up, and the sucked printed circuit is pressed to the substrate to the printed circuit Press-bonding to the substrate; and a device for acquiring calibration image information, wherein at least one wafer mark formed on the sucked printed circuit is photographed together with at least one glass mark formed on the substrate to obtain the same Marked calibration image information. • According to still another object of the present invention, a method for pressure welding a printed circuit includes transporting a platform for supporting a substrate to a pressure welding flow position; and lowering a pressure head for picking up a printed circuit Going to a shooting position; simultaneously capturing at least one wafer mark formed on the printed circuit and at least one glass mark formed on the substrate to obtain a calibration image of the mark; according to the mark Calibrating the image information, aligning the platform supporting the substrate with respect to the wafer mark; and pressing the printed circuit to the substrate by lowering the indenter. 12 1364247 According to still another object of the present invention, an apparatus for pressure welding a printed circuit includes a platform for transporting a substrate and taking the substrate out to a bonding circuit of a printed circuit and The substrate is taken out from the position of the welding process of the printed circuit, the substrate has an upper glass and a lower glass, and the right*dry upper polarizer and the lower polarizer are respectively adhered to the upper surface of the upper glass and the lower glass; A soldering tool is disposed at the position of the bonding process and can be raised and can be press-bonded to the printed circuit by pressing the printed circuit to the upper surface of one of the non-heavy sections of the glass under the substrate The substrate, the non-overlapping section of the lower glass is not overlapped with the upper glass at the position of the pressure welding process; and an auxiliary tool is separately disposed away from the platform, and the auxiliary tool is in the pressure welding process The position supports the non-overlapping section from its lower side and has at least one vacuum aperture to draw the substrate during the bonding of the bonding tool. According to still another object of the present invention, a method of embossing a printed circuit includes drawing a substrate onto a platform that generates a vacuum and transports the drawn substrate to a pressure welding process location of the printed circuit The substrate has an upper glass and a lower glass, and the upper polarizer and the lower polarizer are respectively adhered to the outer surfaces of the upper glass and the lower glass; and a non-overlapping section in which the lower glass is not overlapped with the upper glass is provided And causing it to be on a support surface of an auxiliary tool disposed at the position of the pressure welding process; generating a vacuum on the auxiliary tool and drawing the non-overlapping section from the lower side of the non-overlapping section; The vacuum of the platform, and the lowering of the pressing tool onto the substrate, and the bonding of the printed circuit to the upper surface 0 of the non-overlapping section, the detailed features of the present invention are detailed in the manner of Excellent 13 1364247 = ^ 3 2 to let any skilled person know the technology of the present invention: =: within the disclosure " Please specifically related purposes and advantages. The present invention can be easily understood. The present invention is used to illustrate the preferred embodiment of the present invention. The advantage of the present invention is that it is advantageous for the purpose of the monthly review. And the following description of the invention is achieved by the purpose of the present invention. Wherein, the nano is the same component. In accordance with an embodiment of the present invention, an apparatus and method can be used on a substrate of a printed circuit "factory== flat panel display (FPD), which is printed on the tape Form crystal = f circuit board (CBF) and drive integrated circuit (dri display system such as "display p)" = and organic light-emitting diode (0LED). For the "2" display and non-stolen (LCD) :: and method is suitable for driving the integrated circuit voltage === moving the liquid crystal display substrate on the t end. j is used in liquid 曰 Γ 参考 - reference 3 ' Table forest (4) - drive (four) circuit pressure welding to a 1 series including - μ dip into r, 0 as shown in Figure 3, liquid crystal display substrate ^ or a color filter glass 2 and a lower glass-phase transistor panel) 3, The liquid crystal (not shown) is filled between: = 2 1364247 and a part of the surface of the lower glass 3, and an upper polarizer 4 and a lower polarizer 5 are adhered to the outer surfaces of the upper glass 3 and the lower glass 3, respectively.
在上玻璃2形成一彩色影像的區域，係小於在下玻璃 3。的區域。因此，在上玻璃2未重疊在下玻璃3的一非重 且區Η係存在下玻璃3之上表面的一側。一驅動積體電 路6係壓銲到非重疊區段H的上表面。在本實施例中雖 然係將一單一驅動積體電路壓銲到非重疊區段η，但並不 以此為限，意即亦可壓銲二個或更多個驅動積體電路。 如圖3所示，上偏光片4係大致地黏貼到上玻璃2大 部分的上表面。然而，下偏光片5係黏貼到下玻璃3的下 表面除了非重疊區段Η的部分。 . 驅動積體電路6係需要正確地置放在基板丨上，也厨 是說，置放在非重疊區段Η之上表面上的—正當位置。名 此狀況下’將在後面詳述的—壓頭3G係降下細按壓驅鸯 ^體電路6而獲得-所欲的品質。因此，在—壓鲜流程戈 前’需要有在驅動積體電路6與基板i之間的—比較的杉 準流程。雖然比較的校準流程將於麟述，而為了要進巧 此，程，係如圖3所示，二玻璃標記卜&係形成在基相 二f 一晶片標記6a、6b係行程在驅動積體電路6上。 凊參考圖4，係表示本發明用以壓鲜 實施例示意圖。請參考圖5，係表== :用=取校準影像資訊之裝置的立體圖。請參考圖6, 圖二,中用以獲取校準影像資訊之裝置的平面 圖5月參考圖7到圖9,係表示本發 印刷電路之設備的操作步驟分解圖。认 15 1364247 如圖4到圖9所示，依據本發明一實施例的一屢銲設 備，係包括一平台10、一備用工具20、一壓頭30、一校 準影像資訊獲取裝置40、一供給手臂50、以及一控制上述 元件的控制單元（圖未示）。 基板1係包括上玻璃2及下玻璃3，以及如上所述的 分別黏貼到上玻璃2及下玻璃3的上偏光片4及下偏光片 5。平台10將基板1運送到驅動積體電路6的一壓銲流程 位置W，或者是將已經完成一壓銲流程的基板1取出。亦 即，平台10大致上與一運送裝置的功能相同，係用以運送 基板1。在某些狀況下，當已經進行壓銲流程時，平台10 係支撐基板1之下部位的部分。 平台10係包括一支撐表面11，具有一至少大於基板 1的區域，而易於將基板1支撐在一平坦的狀態。然而， 如上所述，雖然平台ίο i撐著基板1，但平台ίο支撐著 除了非重疊區段Η以外的基板1之其他區域。因此，可以 說平台10的支撐表面11係支撐基板1的下偏光片5的區 域。 雖然並未詳細地圖解，複數個用以吸取基板1的真空 孔（圖未示）係設置在平台10的支撐表面11。在平台10 可更進一步設置一用以控制產生在平台10之真空的開/關 與強度的真空控制裝置（圖未示）。 備用工具20係在壓銲流程期間，與平台10 —起支撐 基板1。當平台10的支撐表面11支撐著基板1的大部分 區域時，備用工具20的支撐表面21係部份地僅支撐著非 16 1364247 重疊區段Η。一真空孔（圖未示）可以形成在備用工具20 的支撐表面21，以吸取在空狀態下的非重疊區段Η。 當形成在備用工具20的支撐表面21之真空孔吸取在 空狀態下的非重疊區段Η時，移除形成在平台10的真空是 有利的，這原因係敘述如下。 當基板1的表面被平台10的支撐表面11大部分地真 空吸取，且基板1的非重疊區段Η從備用工具20的支撐表 面21上升時，若是壓頭30降下來按壓驅動積體電路6的 區域者，會因為在平台10的支撐表面11與備用工具20的 支撐表面21之間有一相對的高度差，而會在基板1上產生 損傷或是裂痕。 然而，如上所述，當僅是基板1的非重疊區段Η以備 用工具20的支撐表面21的真空吸取而支撐，且基板1係 保持在從平台10的支撐表面11上升的狀態下時，若是降 下壓頭30且進行將驅動積體電路6壓銲到基板1的壓銲流 程者，實際上按壓的壓頭30、備用工具20及備用工具20 的支撐表面21係形成在一平面，以便可以避免產生在基板 1的損傷及裂痕。然而，本發明並不以此為限。 備用工具20係分離地設置在遠離平台10處。在本實 施例中，備用工具20係提供來可以升高到驅動積體電路6 之壓銲流程位置W的區域。然而，由於本發明並不以此為 限，因此備用工具20可以固定地設置在壓銲流程位置W的 任何區域。 17 1364247 壓頭30係大致地將驅動積體電路6壓銲到基板1的 非重疊區段Η之上表面。於是，壓頭20係設置在壓銲流程 位置W，而可以在此一位置升高。 由於壓頭30的升高，壓頭30需要一用以上升的滾筒 以及一用以熱壓的電熱線。然而，在此省略對壓頭30的詳 細敘述，而若是需要者係可使用隸屬申請人之已申請的專 利申請案所揭露的技術。 所述的校準.影像資訊獲取裝置40係藉由拍攝如圖3 所示形成在驅動積體電路6上的二晶片標記6a、6b，以及 如圖3所示形成在蓦板1上的二玻璃標記la、lb，以獲取 在標記la、lb、6a以及6b之間相對應的校準影像資訊。 因此，依據傳統的壓銲設備，由於二晶片標記la、lb 的拍攝以及二玻璃標記6a、6b的拍攝，係使用二攝影機（圖 未示）分開進行的，除了分開拍攝標記la、lb、6a、6b的 時間之外，更進一步需要壓頭30上升以及移動平台10以 拍攝標記1 a、1 b、6a、6b的時間，也因此在縮減加工時間 上會有所限制。 然而，在與傳統技術像比較之下，在本實施例中，藉 由採用校準影像資訊裝置40，而可以縮減加工時間，此校 準影像資訊裝置40係可以同時地拍攝如圖3所示形成在驅 動積體電路6上的^一晶片標§己6 a、6 b ’以及如圖3所不形 成在基板1上的二玻璃標記la、lb。 所以，當同時地拍攝標記la、lb、6a、6b時，可減 少壓頭30升高操作的部分以及用以拍攝標記la、lb、6a、 6b之平台10的移動操作，以便可以縮減加工時間。 18 1364247 如圖5及圖6所示的校準影像資訊獲取裝置40,係包 括一稜鏡區塊41，具有四個用以同時拍攝二晶片標記6a、 6b及二玻璃標記la、lb的拍攝視窗41a;四個空搞合區塊 42，其中每兩個空耦合區塊42係分別連接到稜鏡區塊41 的相對側；複數個棱鏡（圖未示）係設置在稜鏡區塊41與 ' 四個空耦合區塊42中，以將光線的方向折射到朝四拍攝視 窗41a ;四筒體43，係分別地耦合到四空耦合區塊42 ;以 及四攝影鏡片單元44,係分別地耦合到四筒體43的端部。 • 稜鏡區塊41係由二相互分隔的子區塊所形成。每二 拍攝視窗41a係以相同的間隔而緊鄰地設置在每一分隔的 子區塊上。一用以支撐每一拍攝鏡片單元44的鏡片支撐座 45，係設置在四拍攝鏡片單元44與四筒體43之間，換句 話說，係在二拍攝鏡片單元44及二筒體43之間。鏡片支 撐座45係為每一拍攝鏡片單元44與每一筒體43所組合的 結構。四個分別耦合到四筒體43而將光線發射到四筒體 43的照明單元46，係設置在四筒體43之下。 Φ 參考上，在本實施例中，由於四拍攝視窗41a係以相 同的間隔而相鄰地相互設置在其間，因此可以同時地拍攝 如圖3所示形成在驅動積體電路6上的二晶片標記6a、6b， 以及如圖3所示形成在基板1上的二玻璃標記6a、6b。也 就是說，由於棱鏡區塊41、四空耦合區塊42、四筒體43、 四拍攝鏡片單元44、二鏡片支撐座45以及四照明單元46 的結構特性，甚至是當四拍攝視窗41a係相互地緊靠設 置，因此非常地相互緊靠設置的標記la、lb、6a、6b可以 充分地同時被拍攝。然而，若是簡易地設置四個攝影機的 19 1364247 話，四個非常地相互緊靠上置的標記1 a、1 b、6a、6b則由 於攝影機本身的體積，而無法同時拍攝。 詳細地說，四個標記la、lb、6a、6b可以使用獨立 設置的攝影機進行拍攝。在此一狀態下，為了避免攝影機 之間的相互的干擾，晶片標記6a、6b及玻璃標記1 a、1 b 必須相互分隔一相當的距離。因此，由於平台10需要移動 一相當的距離以同時地拍攝四個標記1 a、1 b、6a、6b，會 因為平台10的移動而耗費大量時間，也因此無法實實地縮 減加工時間，或是因為沿著平台10移動的路徑很複雜，而 不可能進行校準。然而，如在本實施例中，當採用了可以 同時地拍攝晶片標記6a、6b及玻璃標記1 a、1 b，以及四 拍攝視窗41a緊鄰地設置在一單一本體中的校準影像資訊 裝置40時，則可以縮減平台10的移動時間，而且移動的 路徑不會複雜，也因此校準的進行不會顯得困難。 供給手臂50係將驅動積體電路6供給到壓頭30的下 部區域，以便壓頭30可以拿起或是吸起驅動積體電路6。 因此，供給手臂50可以看作是一供給驅動積體電路6的機 械裝置。 控制單元係控制壓頭30、平台10、備用工具20，以 及校準影像資訊獲取裝置40。特別的是，在本實施例中， 控制單元係依據藉由校準影像資訊裝置40，所獲取在標記 la、lb、6a、6b之間的相對應的校準影像資訊，以控制基 板1相對於驅動積體電路6之相對應的校準。也就是說， 控制單元在X、Y軸及Θ角校準用以支撐基板1的平台10， 以便控制基板1相對於驅動積體電路6之相對應的校準。 20 1364247 然而’在使用控制單元以校準平台10的流程中，在 平台10被運送到壓銲流程位置W並下降之前，則平台1〇 即被控制在X、Y軸及0角而進行校準，以便基板1的一部 • 分可以由備用工具20的支撐表面所支撐。 根據本實施例的壓銲驅動積體電路6之方法，係如圖 7到圖1〇所示，以控制單元的控制流程作敘述。首先，如 圖7所示’當用以運送驅動積體電路6的供給手臂50，移 φ 動到位在壓銲流程位置W之壓頭30的下部區域時，則壓頭 30係下降到一拿取位置L1 (步驟S11)。 ^ 當在壓頭30提供真空時，壓頭3〇係從供給手臂50 拿1驅動積體電路6 (步驟S12)。當驅動積體電路6被拿 起^ ’屋頭30係升起到一離開位置L2 (步驟S13)。值到 現在所述的操作’係大致地與如圖2所示的習知技術相同。 當壓頭30上升到離開位置L2時，供給手臂5〇則移 動到f始位置。在習知技術中，雖然供給手臂50在此操作 • 中係單獨移動，而在本實施例中，支樓基板1的平台10係 一供給手臂50 一起移動到壓銲流程位置W (步驟S14)。 再者，如圖8所示，壓頭30係下降到一拍攝位置[3。 根據習知技術，在此操作中，僅壓頭3〇下降到拍攝位置 …而/、他操作則並未一起進行。然而，在本實施例中， . 當壓頭3〇下降到拍攝位置L3時，平台1〇係下降一預定距 離（步驟S15)。 . ^當平台w下降-預定距離時，基板i之非重叠區段η 、邛分可以被支撐在位在壓銲流程位置w之備用工呈2η 的支撐表面21上。在此狀態下，在步驟S15的操作中，基 1364247 板1並未元全地校準在一正當位置，且承△ +台10仍是需要朝 備用工具20而向左、向右、向上及向下移動。 當壓頭30下降到拍攝位置L3，且伞么 ^ α 且+台10下降以便將 基板1之非重豐區段Η的一部分，支轉在傷用工具2〇的支 撐表面21時，校準影像資訊獲取裝置4〇係同時地拍攝如 圖3所示形成在驅動積體電路6上的二晶片標記6a、叻， 以及如圖3所示形成在基板丨上的二破螭標記la、比（步 驟 S16)。 然後，平台10更進一步朝向備用工具移動一預定 距離，以完全地位在壓銲流程位置W。同時地，支撐基板i 的平台10係藉由拍攝而獲取標記la、lb、6a、6b的影像 資訊，以在X、Y軸及0角進行相對於影像資訊的校準（步 驟 S17)。The area where the upper glass 2 forms a color image is smaller than the lower glass 3. Area. Therefore, the upper glass 2 is not overlapped on the side of the upper surface of the lower glass 3 in a non-heavy area of the lower glass 3. A drive integrated circuit 6 is pressure welded to the upper surface of the non-overlapping section H. In the present embodiment, although a single driving integrated circuit is pressure-bonded to the non-overlapping section η, it is not limited thereto, that is, two or more driving integrated circuits may be pressure-welded. As shown in Fig. 3, the upper polarizer 4 is substantially adhered to the upper surface of most of the upper glass 2. However, the lower polarizer 5 is adhered to the lower surface of the lower glass 3 except for the portion of the non-overlapping section Η. The drive integrated circuit 6 needs to be properly placed on the substrate stack, that is, the proper position placed on the upper surface of the non-overlapping section. In this case, the indenter 3G is lowered in detail and the body circuit 6 is lowered to obtain the desired quality. Therefore, there is a need for a comparison process between the drive integrated circuit 6 and the substrate i in the "pre-pressing process". Although the comparison calibration process will be described, in order to make this happen, the process is as shown in Fig. 3. The two glass marks are formed on the base phase two f-wafer marks 6a, 6b. On the body circuit 6. Referring to Figure 4, there is shown a schematic view of an embodiment of the present invention for freshening. Please refer to Figure 5, which is a perspective view of the device for calibrating image information with =. Referring to Fig. 6, Fig. 2, a plan view of an apparatus for obtaining calibration image information. Fig. 7 to Fig. 9 are exploded views showing the operation steps of the apparatus of the present printing circuit. As shown in FIG. 4 to FIG. 9, an automatic welding apparatus according to an embodiment of the present invention includes a platform 10, a spare tool 20, a ram 30, a calibration image information acquiring device 40, and a supply. The arm 50, and a control unit (not shown) that controls the above components. The substrate 1 includes an upper glass 2 and a lower glass 3, and an upper polarizer 4 and a lower polarizer 5 adhered to the upper glass 2 and the lower glass 3, respectively, as described above. The stage 10 transports the substrate 1 to a pressure welding process position W of the drive integrated circuit 6, or takes out the substrate 1 which has completed a pressure welding process. That is, the platform 10 is substantially identical in function to a transport device for transporting the substrate 1. In some cases, the platform 10 supports a portion of the lower portion of the substrate 1 when the pressure welding process has been performed. The platform 10 includes a support surface 11 having a region at least larger than the substrate 1, and it is easy to support the substrate 1 in a flat state. However, as described above, although the platform ίο i supports the substrate 1, the platform ίο supports other regions of the substrate 1 except for the non-overlapping segments 。. Therefore, it can be said that the support surface 11 of the stage 10 supports the area of the lower polarizer 5 of the substrate 1. Although not illustrated in detail, a plurality of vacuum holes (not shown) for sucking the substrate 1 are provided on the support surface 11 of the stage 10. A vacuum control device (not shown) for controlling the on/off and intensity of the vacuum generated in the platform 10 can be further disposed on the platform 10. The spare tool 20 supports the substrate 1 together with the platform 10 during the pressure welding process. When the support surface 11 of the platform 10 supports most of the area of the substrate 1, the support surface 21 of the spare tool 20 partially supports only the non-16 1364247 overlapping section Η. A vacuum hole (not shown) may be formed on the support surface 21 of the spare tool 20 to suck the non-overlapping section 在 in the empty state. When the vacuum hole formed in the support surface 21 of the spare tool 20 sucks the non-overlapping section 在 in the empty state, it is advantageous to remove the vacuum formed on the stage 10 for the following reason. When the surface of the substrate 1 is largely vacuum-absorbed by the support surface 11 of the stage 10, and the non-overlapping section 基板 of the substrate 1 rises from the support surface 21 of the spare tool 20, if the ram 30 is lowered, the drive integrated circuit 6 is pressed. The area may cause damage or cracks on the substrate 1 because of a relative height difference between the support surface 11 of the platform 10 and the support surface 21 of the spare tool 20. However, as described above, when only the non-overlapping section 基板 of the substrate 1 is supported by the vacuum suction of the support surface 21 of the spare tool 20, and the substrate 1 is held in a state of being raised from the support surface 11 of the stage 10, If the embossing head 30 is lowered and the pressure welding process for pressing the driving integrated circuit 6 to the substrate 1 is performed, the pressing urging head 30, the spare tool 20, and the support surface 21 of the spare tool 20 are actually formed in a plane so that Damage and cracks in the substrate 1 can be avoided. However, the invention is not limited thereto. The spare tool 20 is separately disposed away from the platform 10. In the present embodiment, the spare tool 20 is provided in an area which can be raised to the position W of the welding process of the drive integrated circuit 6. However, since the invention is not limited thereto, the spare tool 20 can be fixedly disposed at any area of the pressure welding process position W. 17 1364247 The indenter 30 is substantially pressure welded to the drive integrated circuit 6 to the upper surface of the non-overlapping section 基板 of the substrate 1. Thus, the ram 20 is placed at the pressure welding process position W and can be raised at this position. Due to the elevation of the ram 30, the ram 30 requires a roller for raising and a heating wire for hot pressing. However, a detailed description of the indenter 30 is omitted herein, and the technique disclosed in the patent application filed by the applicant is hereby incorporated by reference. The image information acquiring device 40 is formed by photographing the two wafer marks 6a, 6b formed on the driving integrated circuit 6 as shown in FIG. 3, and the two glass formed on the seesaw 1 as shown in FIG. The labels la, lb are marked to obtain calibration image information corresponding between the markers la, lb, 6a, and 6b. Therefore, according to the conventional pressure welding apparatus, since the photographing of the two wafer marks la, lb and the photographing of the two glass marks 6a, 6b are performed separately using two cameras (not shown), except for the separate shooting marks la, lb, 6a. In addition to the time of 6b, it is further required that the indenter 30 rises and the time when the platform 10 is moved to take the marks 1 a, 1 b, 6a, 6b, and thus there is a limit in reducing the processing time. However, in comparison with the conventional technology, in the present embodiment, the processing time can be reduced by using the calibration image information device 40, and the calibration image information device 40 can be simultaneously imaged as shown in FIG. The wafers on the integrated circuit 6 are labeled 6a, 6b' and the two glass marks la, lb which are not formed on the substrate 1 as shown in FIG. Therefore, when the marks la, lb, 6a, 6b are simultaneously photographed, the portion of the raising operation of the ram 30 and the movement operation of the stage 10 for taking the marks la, lb, 6a, 6b can be reduced, so that the processing time can be reduced. . 18 1364247 The calibration image information acquiring device 40 shown in FIG. 5 and FIG. 6 includes a block 41 having four shooting windows for simultaneously capturing the two wafer marks 6a, 6b and the two glass marks la, lb. 41a; four empty engaging blocks 42, wherein each of the two empty coupling blocks 42 are respectively connected to opposite sides of the block 41; a plurality of prisms (not shown) are disposed in the block 41 and 'in the four empty coupling blocks 42 to refract the direction of the light to the four shot windows 41a; the four cylinders 43 are respectively coupled to the four-coupling block 42; and the four photographic lens units 44, respectively It is coupled to the end of the four cylinder 43. • The block 41 is formed by two sub-blocks that are separated from each other. Each of the shooting windows 41a is disposed immediately adjacent to each of the divided sub-blocks at the same interval. A lens support 45 for supporting each of the photographing lens units 44 is disposed between the four photographing lens units 44 and the four cylinders 43 , in other words, between the two photographing lens units 44 and the two cylinders 43 . . The lens holder 45 is a structure in which each lens unit 44 is combined with each barrel 43. Four illumination units 46, respectively coupled to the four cylinders 43 to emit light to the four cylinders 43, are disposed below the four cylinders 43. Φ In the present embodiment, since the four photographing windows 41a are adjacently disposed adjacent to each other at the same interval, the two wafers formed on the driving integrated circuit 6 as shown in FIG. 3 can be simultaneously photographed. Marks 6a, 6b, and two glass marks 6a, 6b formed on the substrate 1 as shown in FIG. That is, due to the structural characteristics of the prism block 41, the quadruple coupling block 42, the four cylinders 43, the four lens unit 44, the two lens holders 45, and the four illumination units 46, even when the four shot windows 41a are The labels are placed in close proximity to each other, so that the marks la, lb, 6a, 6b which are placed very close to each other can be sufficiently photographed at the same time. However, if 19 1364247 of four cameras are simply set, the four markers 1 a, 1 b, 6a, 6b which are very close to each other are not able to be photographed at the same time due to the volume of the camera itself. In detail, the four markers la, lb, 6a, 6b can be photographed using a separately provided camera. In this state, in order to avoid mutual interference between the cameras, the wafer marks 6a, 6b and the glass marks 1 a, 1 b must be separated from each other by a considerable distance. Therefore, since the platform 10 needs to move a considerable distance to simultaneously capture the four marks 1 a, 1 b, 6a, 6b, it takes a lot of time due to the movement of the platform 10, and thus the processing time cannot be substantially reduced, or Because the path along the platform 10 is complex, it is not possible to calibrate. However, as in the present embodiment, when the wafer image marks 6a, 6b and the glass marks 1a, 1b can be simultaneously captured, and the four image capturing windows 41a are disposed in close proximity to the calibration image information device 40 disposed in a single body, , the movement time of the platform 10 can be reduced, and the path of the movement is not complicated, and therefore the calibration is not difficult. The supply arm 50 supplies the drive integrated circuit 6 to the lower region of the ram 30 so that the ram 30 can pick up or suck up the drive integrated circuit 6. Therefore, the supply arm 50 can be regarded as a mechanical device that supplies the integrated circuit 6. The control unit controls the ram 30, the platform 10, the spare tool 20, and the calibration image information acquiring device 40. In particular, in the present embodiment, the control unit controls the substrate 1 relative to the drive according to the corresponding calibration image information acquired between the marks la, lb, 6a, and 6b by the calibration image information device 40. The corresponding calibration of the integrated circuit 6. That is, the control unit calibrates the platform 10 for supporting the substrate 1 at the X, Y axis and the corner to control the corresponding calibration of the substrate 1 with respect to the drive integrated circuit 6. 20 1364247 However, in the process of using the control unit to calibrate the platform 10, the platform 1 is controlled to be calibrated at the X, Y and 0 angles before the platform 10 is transported to the pressure welding process position W and lowered. Thus, a portion of the substrate 1 can be supported by the support surface of the spare tool 20. The method of the pressure welding driving integrated circuit 6 according to the present embodiment is as shown in Figs. 7 to 1B, and is described by the control flow of the control unit. First, as shown in Fig. 7, when the supply arm 50 for transporting the integrated circuit 6 is moved to the lower portion of the indenter 30 at the position W of the press-welding process, the indenter 30 is lowered to one. The position L1 is taken (step S11). When the vacuum is supplied from the ram 30, the ram 3 is pulled from the supply arm 50 to drive the integrated circuit 6 (step S12). When the drive integrated circuit 6 is picked up, the roof 30 is lifted up to an exit position L2 (step S13). The value of the operation described so far is substantially the same as the conventional technique shown in Fig. 2. When the ram 30 is raised to the exit position L2, the supply arm 5 移 is moved to the f start position. In the prior art, although the supply arm 50 is separately moved in this operation, in the present embodiment, the platform 10 of the branch substrate 1 is moved by the supply arm 50 to the pressure welding flow position W (step S14). . Furthermore, as shown in FIG. 8, the indenter 30 is lowered to a shooting position [3. According to the prior art, in this operation, only the ram 3 〇 is lowered to the shooting position ... and /, his operation is not performed together. However, in the present embodiment, when the indenter 3〇 is lowered to the photographing position L3, the stage 1 is lowered by a predetermined distance (step S15). ^ When the platform w is lowered by a predetermined distance, the non-overlapping sections η and 邛 of the substrate i may be supported on the support surface 21 of the standby work position 2n at the position of the press-welding process w. In this state, in the operation of step S15, the board 1364247 is not fully calibrated in a proper position, and the y+ stage 10 still needs to be left, right, up, and toward the spare tool 20. Move down. When the indenter 30 is lowered to the photographing position L3, and the umbrella is lowered and the + table 10 is lowered to support a portion of the non-heavy section 基板 of the substrate 1 to the support surface 21 of the wound tool 2〇, the image is calibrated. The information acquiring device 4 simultaneously photographs the two wafer marks 6a, 叻 formed on the driving integrated circuit 6 as shown in FIG. 3, and the two broken marks la, ratio (formed on the substrate 如图 shown in FIG. 3). Step S16). The platform 10 is then moved further toward the standby tool a predetermined distance to be fully in the press welding process position W. Simultaneously, the stage 10 supporting the substrate i acquires image information of the marks la, lb, 6a, 6b by photographing to perform calibration with respect to the image information at the X, Y and 0 angles (step S17).
將平台10降下來以便基板1可以完全地被支撐在平 台10的支撐表面11以及備用工具20的支撐表面21 (步 驟S18)。在步驟S18的操作中，備用工具2〇可以向上移 動以取代平台10的下降。如上所述，當基板1係由形成在 備用工具20之支撐表面21的真空孔而將非重疊區段η吸 取到一空狀fe時，移除形成在平台1〇的空狀態是有利的。 凊參考圖9，當完成平台ι〇的校準流程時，壓頭祁 係下降到一壓銲位置L4 (步驟S19)，並進行一預壓銲流程 (步驟S20)。當完成預壓銲流程時，壓頭3〇係上升回到 離開位置L2。在習知技術的操作中，僅壓頭3〇上升到離 開位置L2，且其他操作則並未一同進行。然而，在本實施 22 1364247 例中，當壓頭30上升到離開位置L2時，係一同進行升起 平台10的操作或是降下備用工具20的操作（步驟S21)。 平台10係被取出。在此操作中，並不像習知技術， 由於平台10已被取出，供給手臂50係同時地將一新的驅 動積體電路（圖未示）運送到壓頭30的下部區域（步驟 S22)。之後即重覆上述步驟S11到步驟S22的操作。 依據上述的壓銲方法，再與習知技術比較，由於在前 一步驟操作完成以及個別的步驟操作同時地進行之後，許 多步驟的操作並不需要進行，因此可以縮短加工時間，而 可以使壓銲流程進行得更快。 依據本實施例，驅動積體電路6係可以一簡單及方便 的方法壓銲到基板1，且可以縮短用以壓銲流程的加工時 間，而可以實現高速度的壓銲流程。 在上述的實施例中，雖然壓頭係用於預壓銲流程，壓 頭亦可以使用在主要的壓銲流程。而且，雖然校準影像資 訊獲取裝置適用於用以壓銲一印刷電路的設備，校準影像 資訊獲取裝置亦可以適用在不同的設備，例如一檢查設備。 請參考圖11，係表示本發明一實施例在進行一壓銲流 程之前*用以壓得一印刷電路之設備結構的示意圖。請參 考圖12，係表示本發明另一實施例在壓銲流程期間，用以 壓鲜一印刷電路之設備結構的不意圖。請參考圖13 ’係表 示本發明圖11及圖12所示的輔助工具之結構的示意圖。 請參考圖14，係表示本發明另一實施例，用以壓銲一印刷 電路之方法的流程圖。 23 丄 J0^fZ4/ 係包一圖υ到圖14所示，依據本實施例的一壓銲設備， 乃平台l〇a、一備用工具20a、一壓銲工具30,以 璃ϋ述元件的控制單元（圖未示）。基板1包含上破 .'朗之外3 ’以及如上所述，分別㈣到上破璃及下 其起1々面的上偏光片4及下偏光片5。平台10a係將 移動到驅動積體電路6的―壓銲流程位置w，或者 疋將已元成〜壓銲流程的基板丨取出。也就是說， •係大致地a運作得如_以移動基板1的-移動單元e a 平σ l〇a係包括一支撐表面Ha，支撐表面係夏 有一至少大於基板1的區域，以容易地將基板i支浐在二 平坦的狀態。然而，如上所述，雖然平台1〇a係支 1，平台l〇a亦支撐基板i上除了非重疊區段η之外^ 域。因此可以說是平台10a的支樓表*以係支撐^ 1之下偏光片5的區域。土板 雖然並未詳細地圖解’用以吸起基板！的複 孔（圖未示）係設置在平台1()a的支樓表面⑴。一直= .控制單元12係可更.進-步設置在平台此，而用 生在平台10a之真空的開/關與強度。而直空控Ί 係由控制單元所控制。僅有在當平台他將基板H 驅動積體電路6的壓銲流程位置w，或者β將已纟移動到 鲜流程的基板1取出的時候，在控制單元二制S3 經由真空孔產生真空。也就是說，當藉由壓 地進行壓銲流程時，係將真空移除。 、卯貫際 支撐基板1的大部分區域時，備 H 〇 2〇a 24 1364247 地設置。在本實施例中，備用工具20a係固定地設置在驅 動積體電路6之壓銲流程位置W的區域。由於本發明並不 以此為限，因此備用工具20a係可以形成能如平台10a之 移動。 備用工具20a包括一主體25、一形成在主體25表面 上與從主體25下侧支撐非重疊區段Η的支撐表面21a、複 數個形成在支撐表面21a並分類成三個群組G1、G2、G3的 真空孔22、三條分別相對應地設置在三群組Gl、G2、G3 的真空線23，以及三個分別地設置在三真空線23且可選 擇地將每一真空線23的一開口開啟/關閉的檢測閥24。 在本實施例中，用以將形成在支撐表面21a的真空孔 22分類成三個群組Gl、G2、G3的原因，係為了符合可以 將基板1支撐在支撐表面21a上的尺寸。舉例來說如圖13 所示，當基板1的尺寸小於支撐表面21a，而使基板1的 非重疊區段Η僅足夠藉由第二群組G2所支撐時，若是第一 群組G1與第三群組G3其他部位的所有真空孔22產生真空 的話，就會發生流程損耗。 在本實施例中，三真空線23係設置在每一群組G1、 G2、G3，使得三真空線23的開口係選擇性地藉由三檢測閥 24而開啟或關閉。由於本發明並不以此為限，因此真空孔 22之群組的數量可以是數量” 2”或是數量” 4”或者是更 多，亦或者是如果需要的話可以不需將真空孔22分類成不 同群組。 在習知技術中，如圖11所示，由於基板1大部分的 表面係大致地藉由平台10a的支撐表面11a所真空吸起並 25 1364247 支撐著’且基板1的非重疊區域H係從備用工具 ，表面21a升起’若是在此狀態下料工具f ' : 壓驅動積體電路6的區域，會因為在平台1〇 11a與備用工具2Ga的支撐表面仏之間的一切表面 而可能在基板1上產生損傷與裂痕。 于向度差， 然而’在本實施例甲，如圖12所示基 台心的支撐表面…所升起(因為已經移除係從： 有基板1的非重疊區域H藉由備用工具2〇a ^，且僅 而真空吸起並支撐著。在此狀態下，當壓銲工具 且驅動積體電路6的壓銲流程㈣於基板丨 ^降， 於提供壓力的壓私具30、基板i，以及備用 支撐表面21a係大致上形成在相同平面，所以 基板1上產生損傷及裂痕。 乂避免在 壓銲工具3〇係大致地將驅動積體電路6壓銲到基板1 之非重疊區段Η的上表面。壓銲工具3〇係設 土 位置W，而能夠上升到一預定位置。 因為壓銲工具30的上升操作，一用以上升的滾筒咬 備以^用以熱壓的電熱線，係設置在壓銲工具3〇上。由 於壓銲工具30的技術以揭露在某些專利申請案上，因此省 略對壓銲工具30的詳細敘述。 此4 控制單元係控制平台1()a及備用工具服，進而可以 控制堅銲工具3〇。特別的是，在本實施例令，控制單元可 空的Γ，舉例來說，即真空的開啟/關閉 :產rr 係依據壓銲卫具％的上升操作， 而產生在母一平台10a及備用工具20a。 26 1364247 特別的是，控制單元係控制於基板丨移動與取 間，在平台10a的真空孔13產生的真空以吸起基板i，瑚The platform 10 is lowered so that the substrate 1 can be completely supported on the support surface 11 of the platform 10 and the support surface 21 of the spare tool 20 (step S18). In the operation of step S18, the spare tool 2〇 can be moved up to replace the lowering of the platform 10. As described above, when the substrate 1 is sucked by a vacuum hole formed in the support surface 21 of the spare tool 20 to the empty fe, it is advantageous to remove the empty state formed on the stage 1〇. Referring to Fig. 9, when the calibration process of the stage ι is completed, the ram is lowered to a pressure welding position L4 (step S19), and a pre-welding process is performed (step S20). When the pre-welding process is completed, the indenter 3 is raised back to the exit position L2. In the operation of the prior art, only the indenter 3〇 is raised to the off position L2, and other operations are not performed together. However, in the example of the embodiment 22 1364247, when the ram 30 is raised to the exit position L2, the operation of raising the platform 10 or the operation of lowering the spare tool 20 is performed together (step S21). The platform 10 is taken out. In this operation, unlike the prior art, since the platform 10 has been taken out, the supply arm 50 simultaneously transports a new drive integrated circuit (not shown) to the lower region of the indenter 30 (step S22). . Thereafter, the operations of the above steps S11 to S22 are repeated. According to the above-mentioned pressure welding method, compared with the prior art, since the operation of the plurality of steps does not need to be performed after the completion of the previous step operation and the individual step operations, the processing time can be shortened, and the pressure can be made. The welding process proceeds faster. According to the present embodiment, the driving integrated circuit 6 can be pressure-welded to the substrate 1 in a simple and convenient manner, and the processing time for the pressure welding process can be shortened, and a high-speed welding process can be realized. In the above embodiment, although the indenter is used in the pre-welding process, the indenter can also be used in the main pressure welding process. Moreover, although the calibration image information acquisition device is suitable for use in a device for pressure welding a printed circuit, the calibration image information acquisition device can also be applied to different devices, such as an inspection device. Referring to Figure 11, there is shown a schematic view of an apparatus structure for pressing a printed circuit prior to performing a pressure welding process in accordance with an embodiment of the present invention. Referring to Fig. 12, there is shown a schematic view of another embodiment of the present invention for embossing a device structure of a printed circuit during a pressure welding process. Referring to Fig. 13', there is shown a schematic view showing the structure of the auxiliary tool shown in Figs. 11 and 12 of the present invention. Referring to Figure 14, there is shown a flow chart of a method of pressure welding a printed circuit in accordance with another embodiment of the present invention. 23丄J0^fZ4/A package is shown in Fig. 14. According to the embodiment, a pressure welding device is a platform l〇a, a spare tool 20a, a pressure bonding tool 30, and a component of the glass. Control unit (not shown). The substrate 1 includes an upper polarizer 4 and a lower polarizer 5 which are broken up and '3' and as described above, respectively (4) to the upper glass and the lower surface. The platform 10a is moved to the "welding process position w" of the drive integrated circuit 6, or the substrate of the assembly process is taken out. That is, the system is substantially operated as _ to move the substrate 1 - the moving unit ea σ 〇 l〇a includes a support surface Ha, and the support surface is a region at least larger than the substrate 1 to easily The substrate i is supported in a two flat state. However, as described above, although the platform 1a is a support 1, the platform 10a also supports the substrate i except for the non-overlapping section η. Therefore, it can be said that it is the branch table of the platform 10a* to support the area of the polarizer 5 under the ^1. The earth plate is not detailed in detail to 'suck up the substrate! The duplicate holes (not shown) are placed on the surface (1) of the platform of the platform 1 () a. Always =. The control unit 12 can be further stepped on the platform to use the on/off and intensity of the vacuum generated on the platform 10a. The direct air control system is controlled by the control unit. Only when the platform H drives the substrate H to the pressure welding flow position w of the integrated circuit 6, or β removes the substrate 1 which has been moved to the fresh flow, the vacuum is generated by the control unit S3 via the vacuum hole. That is, when the pressure welding process is performed by pressing, the vacuum is removed. When the majority of the substrate 1 is supported, the H 〇 2〇a 24 1364247 is provided. In the present embodiment, the spare tool 20a is fixedly disposed in the region where the welding process position W of the integrated circuit 6 is driven. Since the present invention is not limited thereto, the spare tool 20a can be formed to be movable as the platform 10a. The spare tool 20a includes a main body 25, a support surface 21a formed on the surface of the main body 25 and supporting the non-overlapping section 从 from the lower side of the main body 25, a plurality of formed on the support surface 21a and classified into three groups G1, G2. The vacuum hole 22 of G3 and the three vacuum lines 23 respectively corresponding to the three groups G1, G2, and G3, and three openings respectively disposed on the three vacuum lines 23 and optionally each vacuum line 23 The detection valve 24 is opened/closed. In the present embodiment, the reason for classifying the vacuum holes 22 formed in the support surface 21a into three groups G1, G2, G3 is to conform to the size at which the substrate 1 can be supported on the support surface 21a. For example, as shown in FIG. 13, when the size of the substrate 1 is smaller than the support surface 21a, and the non-overlapping sections 基板 of the substrate 1 are only enough to be supported by the second group G2, if the first group G1 and the first group Flow loss occurs when all vacuum holes 22 in other parts of the three groups G3 generate a vacuum. In the present embodiment, three vacuum lines 23 are provided in each of the groups G1, G2, G3 such that the openings of the three vacuum lines 23 are selectively opened or closed by the three detection valves 24. Since the present invention is not limited thereto, the number of groups of the vacuum holes 22 may be the number "2" or the number "4" or more, or the vacuum holes 22 may not be classified if necessary. Into different groups. In the prior art, as shown in FIG. 11, since most of the surface of the substrate 1 is substantially vacuumed by the support surface 11a of the stage 10a and supported by 25 1364247, and the non-overlapping region H of the substrate 1 is The spare tool, the surface 21a is raised, 'If the tool f' is loaded in this state: the area of the pressure driving integrated circuit 6 may be due to all surfaces between the platform 1〇11a and the supporting surface 备用 of the spare tool 2Ga. Damage and cracks are generated on the substrate 1. The difference in the degree of orientation, however, 'in this embodiment A, as shown in Fig. 12, the support surface of the abutment is raised... (because the system has been removed: the non-overlapping region H of the substrate 1 is replaced by the spare tool 2 a ^, and only the vacuum is sucked up and supported. In this state, when the pressure welding tool drives the integrated circuit 6 the pressure welding process (4) is lowered on the substrate, the pressure is provided to the pressure device 30, the substrate i And the backup support surface 21a is formed substantially in the same plane, so that damage and cracks are generated on the substrate 1. 乂 Avoiding the pressure welding tool 3 to substantially weld the drive integrated circuit 6 to the non-overlapping section of the substrate 1. The upper surface of the crucible. The pressure welding tool 3 is set to the soil position W and can be raised to a predetermined position. Because of the ascending operation of the pressure welding tool 30, a heating drum for the hot cylinder is used for the rising of the pressure welding tool 30. The system is disposed on the pressure welding tool 3. Since the technique of the pressure bonding tool 30 is disclosed in some patent applications, the detailed description of the pressure bonding tool 30 is omitted. This 4 control unit is the control platform 1 () a And the spare tool suit, which in turn can control the welding tool. In addition, in this embodiment, the control unit can be empty, for example, vacuum on/off: the production rr is generated according to the rising operation of the pressure welding aid, and is generated on the mother platform 10a and the standby Tool 20a. 26 1364247 In particular, the control unit controls the substrate to move and take off, the vacuum generated in the vacuum hole 13 of the platform 10a to suck up the substrate i,
及於壓銲工具30的按壓期間，從平台1〇a的真空孔 M 除真空。當產生在每一平台1〇a及備用工具2〇a的真外移 態係適當地由控制單元所控制時，於驅動積體電路6狀 銲流程期間，可以避免在基板1上產生損傷及裂痕。、壤 在控制單元的操作之下，當基板i係第一次移動During the pressing of the bonding tool 30, the vacuum is removed from the vacuum hole M of the stage 1A. When the true external transition state generated at each of the platform 1a and the spare tool 2A is appropriately controlled by the control unit, damage to the substrate 1 can be avoided during the driving process of the integrated circuit 6 crack. , under the operation of the control unit, when the substrate i is moved for the first time
銲流程位置W時’控制單元在平台l〇a上產生真空。於1日壓 位在平台l〇a之支撐表面lla上的基板丨，尤其是下^ > 片5，係藉由平台1〇a之支撐表面Ua將其真空吸起。光 此，甚至是當平台1〇a移動時，係可避免基板1從平A因 分離。 τ 0 l〇a 當平台10a到達壓銲流程位置w時，平台1〇a係〜 在緊鄰固定在壓銲流程位置W的備用卫具2Ga。而移^ 基板1之非重疊區域H係被搭載在備用工具2〇 ¥ 面21a上。 X镡痛 當基板1之非重疊區域Η係被搭載在備用工具 支撐表面21a上時，控制單元係降低產生在平台^ 空強度，以形成—微弱的空狀態。相反地，控制單元在^ 用工具20a產生真空，以便將基板！的非重疊區段η從美 板1的下表面吸起。然後，控制單元移除產二土 的真空。 丁口 I〇a 結果是，基板1係大致地僅藉由備用工具2如 表面21a而吸起。在此狀態下，當在壓銲工具30下降而: 行相對應於基板1的驅動積體電路6的壓銲流程時，由於 27 1364247 提供壓力的壓銲工具30、基板1，以及備用工具20a的支 撐表面21a係大致地形成相同平面’因此可以避免在基板 1上產生損傷及裂痕。 當完成壓銲流程且升起壓銲工具30時，控制單元係 移除產生在備用工具20a的真空，且在平台i〇a產生真空， 如同初始狀態，以便吸起基板1及取出基板i。 請參考圖14，用以壓銲如上述結構之驅動積體電路6 的方法，係詳述如下。當在壓銲流程中的基板丨裝载在平 台10a上時，在平台l〇a上產生真空（步驟S3i )。而基板 1係穩固地且固定地被吸起在平台1 〇a上。 當基板1係穩固地且固定地被吸起在平台1 〇a上時， 係藉由用以移動平台l〇a的分離式移動單元，將平台i〇a 移動到壓銲流程位置W (步驟S32)。如圖u所示，^平二 l〇a到達壓銲流程位置W時，平台10a係定位在緊：固； 地位在壓銲絲位置E的制王具2Qa。卿動之基板！ 的非重疊區段Η係被搭载在備用工具的支面21&上 驟 S33)。 當基板1的非重疊區段Η係被搭載在備用工具 表面…上時，控制單元係降低產生在平台1〇a的直空強 度’以形成-微弱.的空狀態（步驟咖）。相反地，在備用 工具20a產生真空以從非重疊區段H的下側吸起非重 段f步：娜)。而移除產生在平台1 的真空(步驟S3; = = Ϊ二3° (步驟S37)且進行將驅動積體電 ^ 立品'^又H之上表面的壓銲流程（步驟S38)〇 28 1364247 藉由供應熱度及壓力到驅動積體電路，而將驅動積 6壓銲到基板1。 'At the time of the welding process position W, the control unit generates a vacuum on the platform l〇a. The substrate 压, which is pressed on the support surface 11a of the platform l〇a on the 1st, is vacuumed by the support surface Ua of the platform 1〇a. Light, even when the platform 1〇a is moved, the substrate 1 can be prevented from being separated from the flat A. τ 0 l〇a When the platform 10a reaches the pressure welding process position w, the platform 1〇a is in the immediate vicinity of the backup fixture 2Ga fixed at the pressure welding process position W. On the other hand, the non-overlapping region H of the substrate 1 is mounted on the spare surface 2a. X 镡 Pain When the non-overlapping region of the substrate 1 is mounted on the spare tool support surface 21a, the control unit reduces the intensity generated at the platform to form a weak empty state. Conversely, the control unit generates a vacuum at the tool 20a to place the substrate! The non-overlapping section η is sucked from the lower surface of the sheet 1. The control unit then removes the vacuum from the two soils. As a result, the substrate 1 is substantially sucked up only by the spare tool 2 such as the surface 21a. In this state, when the bonding tool 30 is lowered: the row corresponds to the pressure welding process of the driving integrated circuit 6 of the substrate 1, the pressure bonding tool 30, the substrate 1, and the spare tool 20a are provided by the pressure of 27 1364247. The support surfaces 21a are formed substantially in the same plane' so that damage and cracks on the substrate 1 can be avoided. When the pressure welding process is completed and the pressure bonding tool 30 is raised, the control unit removes the vacuum generated in the spare tool 20a, and generates a vacuum on the stage i〇a, as in the initial state, in order to suck up the substrate 1 and take out the substrate i. Referring to Fig. 14, a method for pressure welding the integrated circuit 6 of the above structure will be described in detail below. When the substrate 丨 in the pressure welding process is loaded on the stage 10a, a vacuum is generated on the stage 10a (step S3i). The substrate 1 is firmly and fixedly sucked up on the stage 1 〇a. When the substrate 1 is firmly and fixedly sucked up on the platform 1 〇a, the platform i〇a is moved to the pressure welding process position W by the separate moving unit for moving the platform 10a (step S32). As shown in Fig. u, when the flat 2 l〇a reaches the position W of the welding process, the platform 10a is positioned tightly: solid; the position is at the position E of the welding wire 2Qa. The substrate of the movement! The non-overlapping sections are mounted on the support surface 21& of the spare tool (S33). When the non-overlapping sections of the substrate 1 are mounted on the surface of the spare tool, the control unit lowers the straight-air intensity ′ generated at the stage 1 〇a to form a weak state (step coffee). Conversely, a vacuum is generated at the standby tool 20a to suck the non-heavy segment f step from the lower side of the non-overlapping section H: Na). And the vacuum generated in the stage 1 is removed (step S3; == 32° (step S37) and the pressure welding process for driving the upper surface of the integrated body '^又H' is performed (step S38) 〇28 1364247 Pressure-bonding the drive product 6 to the substrate 1 by supplying heat and pressure to drive the integrated circuit.
在習知技術中，如圖Π所示，由於基板丨的大部分 表面係大致地藉由平台l〇a的支撐表面Ua索真空吸起1 支樓著，且基板1的非重營區域Η係從備用工具2〇a的支 撐表面21a升起，在此狀態下，若是壓銲工具3〇下降並按 壓驅動積體電路6的區域者，會因為在平台丨〇3的支撐表 面11a與備用工具20a的支撐表面21a之間的一相對的高. 度差，使得在基板1上很有可能地產生損傷及裂痕。门 然而，在本實施例中’如圖12所示，基板丨係從平 台j〇a的支撐表面ila升起，且僅有基板i的非重疊區段 Η藉由備用工具20a的表支撐表面21a所真空吸起並支撐 著。在此狀態下，當壓銲工具3〇下降且相對於基板丨而進 行驅動積體電路6的壓銲流程時’由於提供壓力的壓録工 具30、基板1 ’以及備用工具2〇a的支撐表面係形成 相同^面’因此可以避免在基才反！上產生損傷及裂痕。 當完成壓銲流程時，壓銲工具3〇係上升到原^位置 (步驟S39)。當升起壓銲工纟3〇時，係可相對應^移除 產生在備用工具2〇a的真空（步驟S4G)。當控制單元關閉 三個檢測㈤24其中之—時，即可以移除產 20a的真空。 1有用/ 當移除產生在備用工具2〇a的真空時，在平台再 次產生真空，以便藉好台1Ga吸起基板丨（ 當移動平台10a時’即取出已完成壓銲流程的基板1 (步 29 1364247 驟S42)。在上述的方法中，另一基板（圖未示）的壓銲流 程係可以速續地進行。 如上戶斤述，依據本發明，由於係以一簡單且方便的結 構及方法而有效地支撐基板1，也因為基板具有一比習知 技術更薄的厚.度’因此在驅動積體電路6的壓銲流程期 間，可以避免在基板上產生損傷與裂痕。特別的是，在本 實施例中，甚至是當上偏光片2及下偏光片3的厚度並不 大於0. 25ram時，更是可以避免在基板1上產生損傷與裂 痕，且可以容易地進行驅動積體電路6的壓銲流程。 如上所述，依據本發明，印刷電路係以一簡單且方便 的方法而廢銲到基板’同時地縮減用在壓薛流程的加 間’也因而實現了高速度的壓銲流程。 而且，甚至是當與習知技術比較起In the prior art, as shown in FIG. ,, since most of the surface of the substrate raft is vacuumed up by a support floor Ua of the platform 10a, a non-re-energy area of the substrate 1 is Η Lifting from the support surface 21a of the spare tool 2A, in this state, if the pressure welding tool 3 is lowered and pressed to drive the area of the integrated circuit 6, it will be due to the support surface 11a of the platform 丨〇3 and the standby A relatively high degree of difference between the support surfaces 21a of the tool 20a makes it possible to cause damage and cracks on the substrate 1. However, in the present embodiment, 'as shown in FIG. 12, the substrate tether is lifted from the support surface ila of the stage j〇a, and only the non-overlapping section of the substrate i is supported by the surface of the spare tool 20a. The vacuum is sucked up and supported by 21a. In this state, when the pressure welding tool 3 is lowered and the pressure welding process for driving the integrated circuit 6 is performed with respect to the substrate ', the support of the urging tool 30, the substrate 1 ' and the spare tool 2 〇a which are supplied with pressure The surface system forms the same surface, so it can be avoided in the base! Damage and cracks occur on it. When the pressure welding process is completed, the pressure bonding tool 3 is raised to the original position (step S39). When the press welder is raised, the vacuum generated in the spare tool 2〇a can be removed correspondingly (step S4G). When the control unit turns off three of the three tests (five) 24, the vacuum of the 20a can be removed. 1 useful / When the vacuum generated in the spare tool 2〇a is removed, a vacuum is again generated on the platform, so that the substrate 1 is sucked up by the stage 1Ga (when the stage 10a is moved), the substrate 1 that has completed the pressure welding process is taken out ( Step 29 1364247 Step S42). In the above method, the pressure welding process of another substrate (not shown) can be performed continuously. As described above, according to the present invention, due to a simple and convenient structure And the method effectively supports the substrate 1, also because the substrate has a thinner thickness than the prior art. Therefore, damage and cracks on the substrate can be avoided during the pressure welding process of driving the integrated circuit 6. In this embodiment, even when the thickness of the upper polarizer 2 and the lower polarizer 3 is not more than 0.25 ram, damage and cracks on the substrate 1 can be avoided, and the drive product can be easily performed. The pressure welding process of the body circuit 6. As described above, according to the present invention, the printed circuit is scrap-welded to the substrate in a simple and convenient manner while simultaneously reducing the application between the press and the process, thereby achieving high speed. Pressure welding Process, and even when compared with conventional techniques
付，或依本發明專利範圍所做的均等 發明專利範圍所涵蓋。 發明專利實施之範圍 付’或依太旅HB由<.，It is covered by the scope of the equivalent invention patents made by the invention or the scope of the invention. Scope of implementation of invention patents Pay or relying on the brigade HB by <.,
【圖式簡單說明】 ® 1係、表示在—锸 二小隹一種用以壓銲一印刷電路 70全自動模組壓銲流程圖； 的設備中，習知的 30 1364247 圖2係表示一種習知用以壓銲一印刷電路的方法； 圖3係表示本發明一驅動積體電路磨鏵到一液晶顯示器基 板的立體圖； 圖4係表示本發明用以壓銲一印刷電路的設備結構之一實 施例示意圖； 圖5係表示本發明圖4中用以獲取校準影像資訊 立體圖； ^且v f 6係表示本發明圖5中用以獲取校準影像資訊之裝置的 平面圖； 圖7至圖9係表示本發明圖4中用以歷銲—印刷電路之設 備的操作步驟分解圖； & 圖1〇係表示依據本發明用以壓銲一印刷電路版的方法之 一實施例的流程圖； 圖11係h本發明-實_在進行—壓料程之前，用以 壓銲一印刷電路之設備結構的示意圖； 圖12係表示本發明另一實施例在壓銲流程期間，用以 一印刷電路之設備結構的示意圖； 圖13係土示本發日 n及圖12所示的輔助工具之結 示意圖；以及 圖14係表不本發明另一實施例，用以壓銲一印刷電路 法的流程圖。 【主要元件符號說明】 S111 壓頭下降到一拿取位置 驅動機 S112在壓頭即形成真空以便壓頭可以拿取 31 1364247 體電路 SI 13 壓頭即上升到一離開位置 5114 移動供給手臂 5115 壓頭下降到一拍攝位置 5116 二攝影機即拍攝由壓頭以真空吸取的驅動機 體電路之二晶片標記 5117 壓頭上升回到離開位置 5118 將一支撐基板的平台運送到一壓銲流程位置[Simple diagram of the diagram] ® 1 series, which is a kind of equipment used in pressure welding of a printed circuit 70 automatic module pressure welding flow chart; the conventional 30 1364247 Figure 2 shows a A method for soldering a printed circuit is shown in FIG. 3; FIG. 3 is a perspective view showing a driving integrated circuit of the present invention honed to a liquid crystal display substrate; FIG. 4 is a view showing one of the device structures for pressure welding a printed circuit of the present invention. FIG. 5 is a plan view showing the calibration image information in FIG. 4; and vf 6 is a plan view showing the apparatus for acquiring calibration image information in FIG. 5 of the present invention; FIG. 7 to FIG. FIG. 4 is a flow chart showing an operation of an apparatus for soldering a printed circuit in FIG. 4; FIG. 1 is a flow chart showing an embodiment of a method for pressure welding a printed circuit board according to the present invention; The present invention is a schematic view of an apparatus structure for pressure welding a printed circuit prior to performing a press process; and FIG. 12 is a view showing another embodiment of the present invention for use in a printed circuit during a pressure welding process. Equipment structure Figure 13 is a schematic view showing the relationship between the present invention and the auxiliary tool shown in Figure 12; and Figure 14 is a flow chart showing a method of pressure welding a printed circuit according to another embodiment of the present invention. [Main component symbol description] S111 The pressure head is lowered to a take-up position. The drive unit S112 forms a vacuum at the pressure head so that the pressure head can take 31 1364247. The body circuit SI 13 is raised to a leaving position 5114. The moving supply arm 5115 is pressed. The head is lowered to a shooting position 5116. The second camera is photographed by the indenter to vacuum the drive body circuit. The second wafer mark 5117 is raised back to the exit position 5118. A platform supporting the substrate is transported to a pressure welding process position.
5119 將平台降下 5120 二攝影機即拍攝形成在基板上的二玻璃標記 5121 平台在X、Y軸及β角進行校準 5122 壓頭下降到壓銲流程位置 5123 進行預壓銲流程 5124 將壓頭升起到離開位置 5125 將平台升起 5126 取出平台5119 Lower the platform by 5120. The camera will shoot the two glass marks on the substrate. The 5121 platform is calibrated at the X, Y and β angles. 5122 The head is lowered to the pressure welding process position 5123. The pre-welding process 5124 raises the indenter. Go to the exit position 5125 and raise the platform 5126 to remove the platform
5127 移動供給手臂 1 液晶顯示器基板 la 玻璃標記 lb 玻璃標記 2 上玻璃 3 下玻璃 4 上偏光片 5 下偏光片 6 驅動積體電路 32 13642475127 Mobile supply arm 1 LCD substrate la glass mark lb glass mark 2 upper glass 3 lower glass 4 upper polarizer 5 lower polarizer 6 drive integrated circuit 32 1364247
6a 晶片標記 6b 晶片標記 10 平台 11 支撐表面 20 備用工具 21 支樓表面 30 壓頭/壓銲工具 40 校準影像資訊獲取裝置 41 稜鏡區塊 41a 拍攝視窗 42 空耦合區塊 43 筒體 44 攝影鏡片單元 45 鏡片支撐座 46 照明單元 50 供給手臂 H 非重疊區段 LI 拿取位置 L2 離開位置 L3 拍攝位置 L4 壓銲位置 W 壓銲流程位置 Sll 壓頭下降到一拿取位置 S12 壓頭提供真空，以拿起驅動積體電路 S13 將壓頭升起到一離開位置 33 1364247 514 將支撐基板的平台與供給手臂移動到壓銲流 程位置 515 將壓頭下降到拍攝位置，並降下平台 516 同時地拍攝二晶片標記及二玻璃標記 517 當平台進行校準流程時，移動平台到壓銲流 程位置 518 降下平台或是升起備用工具 519 將壓頭下降到一壓銲位置 520 進行一預壓銲流程 521 壓頭上升到離開位置/降下平台或是升起備 用工具 522 取出平台且移動供給手臂 10a 平台 11a 支撐表面 12 真空控制單元 13 真空孔6a wafer mark 6b wafer mark 10 platform 11 support surface 20 spare tool 21 branch surface 30 indenter/welding tool 40 calibration image information acquisition device 41 block 41a shooting window 42 empty coupling block 43 cylinder 44 photographic lens Unit 45 Lens support 46 Lighting unit 50 Supply arm H Non-overlapping section LI Pickup position L2 Release position L3 Shooting position L4 Pressure welding position W Pressure welding flow position S11 The head is lowered to a take-up position S12 The head provides vacuum, To pick up the drive integrated circuit S13 and raise the ram to an exit position 33 1364247 514 Move the platform of the support substrate and the supply arm to the pressure welding flow position 515. Lower the ram to the shooting position and lower the platform 516 while shooting Two wafer marks and two glass marks 517 When the platform performs the calibration process, move the platform to the pressure welding process position 518 to lower the platform or raise the spare tool 519 to lower the pressure head to a pressure welding position 520 for a pre-welding process 521 Head up to the exit position / lower the platform or raise the spare tool 522 to remove the platform and move A platform support arm 13 to the vacuum holes 10a surface 12 vacuum control unit 11a
20a 備用工具 21a 支撐表面 22 真空孔 23 真空線 24 檢測閥 25 主體 G1 群組 G2 群組 G3 群組 34 1364247 S31 在平台上產生真空 S32 將平台移動到壓銲流程位置 S33 將被移動之基板的非重疊區段搭載在備用工 具的支撐表面上 S34 降低產生在平台的真空強度 S35 在備用工具產生真空 S36 移除產生在平台的真空 S37 降下壓銲工具 S38 進行壓銲流程 S39 升起壓銲工具 S40 移除產生在備用工具的真空 S41 在平台產生真空 S42 取出已完成壓銲流程的基板 3520a Spare tool 21a Support surface 22 Vacuum hole 23 Vacuum line 24 Detection valve 25 Body G1 Group G2 Group G3 Group 34 1364247 S31 Vacuum is generated on the platform S32 Move the platform to the pressure welding flow position S33 The substrate to be moved The non-overlapping section is mounted on the support surface of the spare tool. S34 is reduced. The vacuum strength generated on the platform is S35. The vacuum is generated in the spare tool. S36 is removed. The vacuum is generated on the platform. S37 is lowered. The pressure welding tool S38 is pressed. The welding process S39 is raised. S40 removes the vacuum S41 generated in the spare tool. The vacuum is generated on the platform S42. The substrate 35 that has completed the pressure welding process is taken out.
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| KR1020070046458A KR20080100582A (en) | 2007-05-14 | 2007-05-14 | Apparatus and method for bonding printed circuit on fpd panel |
| KR1020070046459A KR100913579B1 (en) | 2007-05-14 | 2007-05-14 | Apparatus and method for Bonding Printed Circuit on FPD Panel |
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| TWI364247B true TWI364247B (en) | 2012-05-11 |
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