JP4142233B2 - Component adsorption head, component mounting apparatus and component mounting method using the same - Google Patents

Component adsorption head, component mounting apparatus and component mounting method using the same Download PDF

Info

Publication number
JP4142233B2
JP4142233B2 JP2000199877A JP2000199877A JP4142233B2 JP 4142233 B2 JP4142233 B2 JP 4142233B2 JP 2000199877 A JP2000199877 A JP 2000199877A JP 2000199877 A JP2000199877 A JP 2000199877A JP 4142233 B2 JP4142233 B2 JP 4142233B2
Authority
JP
Japan
Prior art keywords
component
electronic component
substrate
suction
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000199877A
Other languages
Japanese (ja)
Other versions
JP2002018756A (en
Inventor
眞一 荻本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2000199877A priority Critical patent/JP4142233B2/en
Publication of JP2002018756A publication Critical patent/JP2002018756A/en
Application granted granted Critical
Publication of JP4142233B2 publication Critical patent/JP4142233B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Description

【0001】
【発明の属する技術分野】
この発明は、電子部品を吸着搬送し、液晶基板に代表されるフラットパネルディスプレイ等に実装するのに好適な部品吸着ヘッド、及びその部品吸着ヘッドを用いた部品実装装置及び部品実装方法の改良に関する。
【0002】
【従来の技術】
近年の電子機器の研究開発は目覚ましく、ネットワークを介した情報技術(IT)の進歩発展と相俟って、多種多様な機種製品が提供されるようになってきた。
【0003】
とりわけ、半導体技術の研究開発に伴う電子機器等の軽薄短小化により、コンピュータを搭載した通信機器のモバイル化の普及が図られている。
【0004】
また、テレビジョン受像機等では、液晶基板製造技術等の進歩により、高精細で薄型大画面のディスプレイ装置が、カラーブラウン管に代わって採用されるようになってきた。
【0005】
図6は、液晶表示器製造工程の一部を概略示したもので、まず収納棚(マガジン)1内には、TFT(薄膜トランジスタ)をマトリクス状に配置したガラス製の液晶基板2が多数格納されていて、その基板2はX−Y座標系で作動するスカラ型の取り出しロボット3により1個ずつ順次取り出され、中継テーブル4上に載置される。中継テーブル4上の基板2は、リニア搬送型の第1の基板搬送装置5を介して接続部材貼付装置6に搬送される。
【0006】
基板2は、図7(a)に示すように、周縁部に電極部2aが形成されていて、接続部材貼付装置6により、電極部2aへの異方性導電テープ等の接続部材の貼付が行われる。
【0007】
接続部材貼付装置6において電極部2aへの接続部材の貼付が行われた基板2は、同じくリニア搬送型の第2の基板搬送装置7によって、図8に示す構成からなる部品実装装置8に搬送され、そこで図7(a)及び(b)に示したTCP(Tape Carrier Package)やFPC(Flexible Printed Circuit)等の電子部品9が、接続部材が貼付された基板2の電極部2a上に位置決め実装される。
【0008】
電子部品9は、図7(a)及び(b)に示したように、透光性フィルムからなるフィルム状部品91にIC等のチップ部品92が搭載されて構成され、フィルム状部品91にはチップ部品92に接続されたリード91a、及び位置決めマーク91bの各パターンが形成されている。
【0009】
また、基板2周縁部には、電極部2a及び位置決めマーク2bがパターン形成されている。
【0010】
そこで部品実装装置8は、フィルム状部品91のリード91aと基板2の電極部2aとが対応一致して重なるように、各位置決めマーク91b,2bの撮像データに基づき位置決め補正を行いつつ、電子部品9を接着材を介して基板2の電極部2aに実装を行うものである。
【0011】
電子部品9における透光性のフィルム状部品91は、ポリイミド樹脂で形成され、緑や茶系色等の色彩を帯びており、他方、パターン形成されたリード91aや位置決めマーク91bは導電体からなり白や茶系色等の色彩を帯びており、フィルム状部品91のベースの色とリード91の色との組合せによっては両者の階調差が小さくなることがある。
【0012】
このように、ベースの色とリード91の色との間の階調差が小さい状況のもとでは、撮像機器が撮像機器側から照射させた光の反射光を利用した撮像では、十分なコントラストが得られないので、部品実装装置では、反対側に配置された光源からの透過光を利用して、電子部品9の位置決めマーク91bを撮像するように構成されている。
【0013】
すなわち、図8は光の透過型を利用して電子部品9の位置決め実装を行うように構成された従来の部品実装装置8を示した正面図で、まず電子部品9を吸着搬送する部品吸着ヘッド81が、シリンダ82のロッド82aを介して、X−Y座標系ロボットからなる搬送アーム83に取り付けられている。
【0014】
また、その下方の基板搭載ステージ84上には、液晶(ガラス)基板2が搭載され、基板搭載ステージ84自体は軸84aを中心として回動可能とされるとともにX−Yテーブル(不図示)によりX,Y方向に移動可能に構成されている。
【0015】
搬送されてきて一旦テーブル85上に載置された電子部品9は、部品吸着ヘッド81の吸着により、基板2の電極部2a上に搬送移動されて、制御装置86による制御を受け、基板2との間で相対的位置が位置決めが行われる。
【0016】
位置決め操作のために電子部品9及び基板2の各位置決めマーク2b,91bを撮影する撮像機器87は、基板2及び部品吸着ヘッド81の上に固定配置されていて、図9にも要部を拡大して示したように、基板2の下に設置された光源88からの透過光により、基板2及び電子部品9の位置決めマーク2b,91bの映像を同時に捕らえるように構成されている。もっとも、撮像機器87内にも別途光源が内蔵されていて、基板2が非透光性部材で形成されている場合には、基板2の端子部の映像を撮像機器87内光源から光の反射光で捕らえることができる。
【0017】
撮像機器87で得られた各位置決めマーク2b,91bの撮像信号は、制御装置86に供給され、パターン認識等により相対的な位置ずれが算出され、制御装置86はその位置ずれが零となるように搬送アーム83及び基板搬送ステージ84等を修正制御し、電子部品9のリード91aと基板2の電極部2aとの位置が対応一致するように位置決め制御される。
【0018】
位置決めされた後、制御装置86は、図8及び図9に示すように、受け台89を矢印X及びZで示す方向へ移動制御し、基板2を受け台89により支持させた状態で、シリンダ82を制御して電子部品9を降下させ、電子部品9を接続部材を介して基板2上に実装させる。
【0019】
図10は部品吸着ヘッド81が電子部品9を吸着した状態を示した断面図で、図11は図10のA−A線から矢印方向を見た図10の断面図である。図10及び図11に示すように、部品吸着ヘッド81の吸着部81aは吸着孔が吸着面に向け開口して設けられており、吸着部81aはパイプ81bを介して、電磁バルブを有する不図示の吸気ポンプに接続されている。吸着部81aにおける電子部品9の吸着動作も制御装置86のバルブ制御を受けて行われる。
【0020】
このように、従来の部品実装装置では、上方の撮像機器87は電子部品9の反対側(下方)に位置した光源88からの透過光を利用してその電子部品9の端子部を撮影し、制御装置86はその撮影データに基づき位置ずれ補正制御を行うように構成されている。
【0021】
【発明が解決しようとする課題】
上述のように従来の部品実装装置では、上方に配置された撮像機器87が、電子部品9の位置決めマーク91bを、電子部品9の反対側(下方)に設置された光源88からの透過光によりその画像を得るように光学系は構成されている。
【0022】
従って、図10及び図11に示したように、電子部品9を吸着した部品吸着ヘッド81は、フィルム状部品91のパターン(リード91aおよび位置決めマーク91b)を避けた位置で電子部品9を吸着保持している。つまり、電子部品の保持位置が制限されていた。
【0023】
ところで、電子部品9を構成するポリイミド樹脂製のフィルム状部品91は、部品の小形化及び軽量化により、ますます薄型化され、部品吸着ヘッド81で吸着されたとき、図12(a)及び図12(b)に示したように、吸着保持されない部分のフィルム状部品91、すなわち位置決めのため撮像されるリード91aや位置決めマーク91bの部分に反りや垂れ等の変形が生じた。
【0024】
このような電子部品9端子部の反りや垂れ等による変形は、本来の位置決めマーク91b等の位置と、撮像された位置決めマーク91bの位置との間に位置ずれを生じさせるので、実装時のアライメント不良や基板2への圧着不良をもたらす原因となった。特に最近では、リード91aの間隔(ピッチ)の極小化傾向がますます進み、高精細化が液晶パネル製造上の歩留まり向上を阻む要因の一つでもあり改善が要望された。
【0025】
そこで、本発明は、電子部品の保持位置に制限を受けることなく、また電子部品が特にフィルム状である場合においては、その電子部品端子部の反りや垂れ等による変形を回避し、高精度で実装可能な、部品吸着ヘッド及びそれを用いた部品実装装置並びに部品実装方法を提供することを目的とする。
【0026】
第1の発明は、部品吸着ヘッドにおいて、相対向するとともに一端で連結されて平面視状態でコ字状に形成され、かつ吸着面に向け吸着孔を開口して設けた透光部材からなる吸着部と、この吸着部の前記吸着孔につらねて接続された吸気装置と、前記吸着部を介して前記吸着面に向け光を照射する光源と、前記コ字状に形成された中央凹部に上下動可能に装着された加熱ツールと、を具備し、前記吸着部によって吸着対象となる電子部品の端子部が少なくとも両側端部位置で吸着され、前記中央凹部に装着された加熱ツールによって当該電子部品が、実装対象となる基板に熱圧着されることを特徴とする。
【0027】
このように、吸着部に透光部材を採用し、吸着面に光を照射する光源を吸着部側に搭載したので、電子部品の保持位置に制限を受けることなく、そして撮像手段は、吸着部に吸着され、正常に位置した電子部品の端子部を透過光により撮像することができる。
【0028】
また、吸着部は電子部品の端子部を吸着して実装できるので、電子部品の反りや垂れ等の変形が回避され、電子部品は正確な撮像パターンのもとで高精度な実装が行われる。
【0029】
第2の発明は、部品実装装置において、上記第1の発明にかかる部品吸着ヘッドの吸着部に吸着された電子部品、並びにこの電子部品が実装される基板を吸着部とは反対側から撮影する撮像手段と、この撮像手段による撮像データに基づき、電子部品と基板との間の位置ずれを検出する検出手段と、この検出手段で検出された位置ずれに基づき、電子部品と基板との間の相対位置を補正する補正手段と、この補正手段により位置補正された電子部品を基板に実装する実装手段とを具備することを特徴とする。
【0030】
また、第3の発明は、部品実装方法において、上記第1の発明にかかる部品吸着ヘッドの吸着部に電子部品を吸着し、吸着部に吸着された電子部品及びその電子部品が実装される基板を、吸着部とは反対側から撮像手段により撮影し、撮像手段により得られた撮像データに基づき、電子部品と基板との間の相対的な位置ずれを検出し、この検出された位置ずれに基づき、電子部品と基板との間の相対位置を補正し、この位置補正により位置補正された電子部品を基板に実装することを特徴とする。
【0031】
上記第2及び第3の発明によれば、電子部品が第1の発明による部品吸着ヘッドにより吸着されて基板に実装されるので、高精度に位置決め実装され、アライメント不良や圧着及び接続不良等が回避され、製造上の歩留まり向上を図ることができる。
【0032】
【発明の実施の形態】
以下この発明による部品吸着ヘッド、及びそれを用いた部品実装装置並びに部品実装方法の一実施の形態を図1ないし図5を参照して詳細に説明する。なお、図6ないし図12に示した従来の部品吸着ヘッド、及びそれを用いた部品実装装置と同一構成には同一符号を付して詳細な説明は省略する。
【0033】
すなわち、図1は本発明による部品吸着ヘッドを搭載した部品実装装置の第1の実施の形態を示す正面図である。
【0034】
図1に示す装置において、電子部品9を吸着搬送した部品吸着ヘッド81は、シリンダ82のロッド82aを介して、搬送アーム83に取り付けられている。
【0035】
下方の基板搭載ステージ84上には、液晶基板2が搭載されている。テーブル85上に載置された電子部品9を部品吸着ヘッド81が吸着して搬送し、基板2との相対的位置の位置決めが行われた後、基板2上に実装される。
【0036】
一方、位置決めのためのCCDカメラからなる撮像機器(撮像手段)87は、図2にも示したように下方に設置されている。
【0037】
また、部品吸着ヘッド81は、図3及び図3のA−A線から矢印方向を見た図4の拡大断面図に示すように構成されている。
【0038】
すなわち、部品吸着ヘッド81は、吸着面に向け吸着孔811aを開口して設けた石英ガラスや合成樹脂等の透光部材からなる吸着部811と、ランプ等の光源812a及びその光源812aからの照射光を導入して面発光体を形成して吸着部811を照射する光導体部812bとからなる光源812と、吸着孔811aにパイプ81bを介して接続され電磁バルブを有する不図示の吸気ポンプ(吸気装置)とから構成されている。
【0039】
従って、撮像機器87は、電子部品9のリード91a並びに位置決めマーク91b等の端子部画像を、部品吸着ヘッド81の吸着部が、電子部品9の撮影しようとする端子部を吸着した状態でも、光源812から照射された光の透過光をもとに捕らえることができる。
【0040】
従って、吸着部811に吸着された電子部品9は、従来のように、リード91aや位置決めマーク91bが形成されたフィルム状部品91に反りや垂れを生じることなく、しかも良好なコントラストからなる撮像画像のもとで、位置決め制御及び部品吸着ヘッド81による装着実装が行われるので、高精度・高品質な実装が行われる。
【0041】
また電子部品に対する吸着位置に制限がなくなることから、たとえ品種交換で電子部品に形成された位置決めマーク91bの位置が変わっても、同一の部品吸着ヘッドを用いることも可能となる。
【0042】
上記のような構成により、位置決めされた後は、図2にも示したように、制御装置86は、受け台89を矢印X及びZで示す方向へ移動制御し、受け台89にて支持された基板2に対し、シリンダ82を制御して電子部品9を下降させ接続部材を介して実装する。
【0043】
なお、上記実施の形態において、基板2が透光性ガラスにより形成されている場合は、撮像機器87は部品吸着ヘッド81の光源812からの光の透過光を受けて撮像することもできる。また、基板2が非透光性部材で形成された場合には、図2に示すように、撮像機器87に光源871が内蔵され、光ファイバ872を介して撮像機器87の鏡筒内に供給された光源871からの光が、光学系により基板2面を照射し、撮像機器87がその反射光により撮像するように構成することもできる。
【0044】
次に、図5は部品吸着ヘッド81の第2の実施の形態を示す斜視図で、吸着部811をコ字状に形成して、電子部品9の端子部を少なくとも両側端部位置で確実に吸着して、電子部品9の反りや垂れ等の変形を防ぐものである。
【0045】
このとき、コ字状の吸着部811の中央凹部に位置する電子部品9の端子部には、別途加熱ツール813を矢印Z方向へ上下動可能に装着し、接着材を介した電子部品9の基板2への実装時の接着を熱圧着により行うように構成することができる。
【0046】
いずれにしても、本発明による部品吸着ヘッド及びそれを用いた部品実装装置並びに方法によれば、フィルム状部品91等の透光性フィルムを有するTCP等の電子部品9は、基板2等への実装に際し、透光性フィルムの変形を回避して、しかも良好なコントラストの撮像画像データが得られるものであり、液晶パネル製造等に採用して優れた効果を得ることができる。
【0047】
なお、上記実施の形態において、電子部品をフィルム状部品にIC等のチップを搭載して構成されたものとして説明したが、電子部品には、フィルム状部品にリードが形成されたのみの接続用フィルム部品等も含むものとする。
【0048】
また、光源を、ランプ等の光源812aからの照射光を光導体部812bに導入して光導体部812bを面発光させる例で説明したが、これに限られるものではなく、光源812aの代わりにLED等の発光体を用い、この発光体を複数、吸着ヘッド81の電子部品9の吸着面に沿って配列するように光導体部812b内に埋設してもよい。
【0049】
また、基板は、液晶基板2に限らず、プラズマディスプレイパネル等であってもよく、液晶基板2の材質はガラスに限らず樹脂等で形成されるものであってもよい。
【0050】
【発明の効果】
本発明のよる部品吸着ヘッド及びそれを用いた部品実装装置並びに方法によれば、部品装着ヘッドによる電子部品の保持位置に制限を受けることなく、また電子部品が特にフィルム状である場合においては、基板への実装時に際し、電子部品に垂れや反り等の変形が生じるのを回避し、高精度でかつ接続特性の良好な部品実装が可能となるものであり、実用上の効果大である。
【図面の簡単な説明】
【図1】この発明による部品実装装置の第1の実施の形態を示す正面図である。
【図2】図1に示す装置の主要部の構成を示す拡大斜視図である。
【図3】図1に示す部品吸着ヘッドの一部切り欠け正面図である。
【図4】図3に示した部品吸着ヘッドのA−A線から矢印方向を見た断面図である。
【図5】この発明による部品吸着ヘッドの第2の実施の形態を示す斜視図である。
【図6】液晶基板製造工程の一部を示す構成図である。
【図7】図7(a)は、図6に示す工程で供給される基板2及び電子部品9を示す構成図で、図7(b)は図7(a)に示した電子部品の拡大斜視図である。
【図8】従来の部品実装装置を示す正面図である。
【図9】図8に示す装置の主要部の構成を示す拡大斜視図である。
【図10】図7に示した部品吸着ヘッドの断面図である。
【図11】図10に示した部品吸着ヘッドのA−A線から矢印方向を見た断面図である。
【図12】図8に示した部品吸着ヘッドが電子部品9を吸着した状態を示す斜視図である。
【符号の説明】
2 基板(液晶基板)
8 部品吸着ヘッド
81 吸着ヘッド
811 吸着部
811a 吸着孔
812 光源
86 制御装置(検出手段,補正手段)
87 撮像機器(撮像手段)
9 電子部品
91 フィルム状部品(透光性フィルム)
91a リード
91b 位置決めマーク
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component suction head suitable for sucking and transporting electronic components and mounting them on a flat panel display or the like typified by a liquid crystal substrate, and a component mounting apparatus and a component mounting method using the component suction head. .
[0002]
[Prior art]
In recent years, research and development of electronic devices has been remarkable, and in combination with the advancement and development of information technology (IT) via networks, a wide variety of model products have been provided.
[0003]
In particular, the spread of mobile communication devices equipped with computers has become widespread due to the reduction in size and size of electronic devices associated with research and development of semiconductor technology.
[0004]
In television receivers and the like, high-definition, thin, and large-screen display devices have come to be used in place of color CRTs due to advances in liquid crystal substrate manufacturing technology and the like.
[0005]
FIG. 6 schematically shows a part of the manufacturing process of the liquid crystal display. First, in the storage shelf (magazine) 1, a large number of glass liquid crystal substrates 2 having TFTs (thin film transistors) arranged in a matrix are stored. The substrates 2 are sequentially taken out one by one by a scalar type take-out robot 3 operating in the XY coordinate system and placed on the relay table 4. The substrate 2 on the relay table 4 is transported to the connecting member pasting device 6 via the linear transport type first substrate transport device 5.
[0006]
As shown in FIG. 7 (a), the substrate 2 has an electrode portion 2a formed on the peripheral edge thereof, and the connecting member applying device 6 applies the connecting member such as an anisotropic conductive tape to the electrode portion 2a. Done.
[0007]
The substrate 2 on which the connection member is pasted to the electrode portion 2a in the connection member pasting device 6 is transported to the component mounting device 8 having the configuration shown in FIG. 8 by the second linear transport type substrate transport device 7. Therefore, an electronic component 9 such as TCP (Tape Carrier Package) or FPC (Flexible Printed Circuit) shown in FIGS. 7A and 7B is positioned on the electrode portion 2a of the substrate 2 to which the connecting member is attached. Implemented.
[0008]
As shown in FIGS. 7A and 7B, the electronic component 9 is configured by mounting a chip component 92 such as an IC on a film-like component 91 made of a translucent film. Each pattern of the lead 91a connected to the chip component 92 and the positioning mark 91b is formed.
[0009]
In addition, an electrode portion 2a and a positioning mark 2b are formed on the periphery of the substrate 2 in a pattern.
[0010]
Accordingly, the component mounting apparatus 8 performs electronic component correction while performing positioning correction based on the imaging data of the positioning marks 91b and 2b so that the lead 91a of the film-like component 91 and the electrode portion 2a of the substrate 2 overlap in correspondence with each other. 9 is mounted on the electrode portion 2a of the substrate 2 via an adhesive.
[0011]
The translucent film-like component 91 in the electronic component 9 is formed of polyimide resin and has a color such as green or brown, and the patterned lead 91a and positioning mark 91b are made of a conductor. Depending on the combination of the base color of the film-like component 91 and the color of the lead 91, the gradation difference between them may be small.
[0012]
As described above, under a situation where the gradation difference between the base color and the lead 91 color is small, sufficient contrast is obtained in imaging using reflected light of light emitted from the imaging device side by the imaging device. Therefore, the component mounting apparatus is configured to image the positioning mark 91b of the electronic component 9 using the transmitted light from the light source disposed on the opposite side.
[0013]
That is, FIG. 8 is a front view showing a conventional component mounting apparatus 8 configured to position and mount the electronic component 9 using a light transmission type, and first, a component suction head that sucks and conveys the electronic component 9. 81 is attached to a transfer arm 83 formed of an XY coordinate system robot via a rod 82a of a cylinder 82.
[0014]
The liquid crystal (glass) substrate 2 is mounted on the substrate mounting stage 84 below the substrate mounting stage 84, and the substrate mounting stage 84 itself can be rotated about the shaft 84a and is rotated by an XY table (not shown). It is configured to be movable in the X and Y directions.
[0015]
The electronic component 9 that has been transported and once placed on the table 85 is transported and moved onto the electrode portion 2a of the substrate 2 by the suction of the component suction head 81, and is controlled by the control device 86, The relative positions are positioned between the two.
[0016]
The imaging device 87 for photographing the positioning marks 2b and 91b of the electronic component 9 and the substrate 2 for positioning operation is fixedly arranged on the substrate 2 and the component suction head 81, and the main part is also enlarged in FIG. As shown, the images of the positioning marks 2b and 91b of the substrate 2 and the electronic component 9 are simultaneously captured by the transmitted light from the light source 88 installed under the substrate 2. Of course, if the imaging device 87 also includes a separate light source and the substrate 2 is formed of a non-translucent member, the image of the terminal portion of the substrate 2 is reflected from the light source in the imaging device 87. It can be captured with light.
[0017]
The imaging signals of the positioning marks 2b and 91b obtained by the imaging device 87 are supplied to the control device 86, and the relative positional deviation is calculated by pattern recognition or the like, so that the positional deviation is zero. Then, the transfer arm 83 and the substrate transfer stage 84 are corrected and controlled so that the positions of the lead 91a of the electronic component 9 and the electrode portion 2a of the substrate 2 correspond to each other.
[0018]
After being positioned, the control device 86 controls the movement of the cradle 89 in the directions indicated by arrows X and Z as shown in FIGS. 8 and 9, and the cylinder 2 is supported by the cradle 89. The electronic component 9 is lowered by controlling 82 and the electronic component 9 is mounted on the substrate 2 via the connection member.
[0019]
10 is a cross-sectional view showing a state in which the electronic component 9 is adsorbed by the component adsorption head 81, and FIG. 11 is a cross-sectional view of FIG. 10 viewed from the AA line in FIG. As shown in FIGS. 10 and 11, the suction portion 81a of the component suction head 81 is provided with a suction hole opening toward the suction surface, and the suction portion 81a has an electromagnetic valve via a pipe 81b. Connected to the intake pump. The suction operation of the electronic component 9 in the suction portion 81a is also performed under the valve control of the control device 86.
[0020]
Thus, in the conventional component mounting apparatus, the upper imaging device 87 photographs the terminal portion of the electronic component 9 using the transmitted light from the light source 88 located on the opposite side (lower side) of the electronic component 9. The control device 86 is configured to perform positional deviation correction control based on the photographing data.
[0021]
[Problems to be solved by the invention]
As described above, in the conventional component mounting apparatus, the imaging device 87 arranged above the positioning mark 91b of the electronic component 9 by the transmitted light from the light source 88 installed on the opposite side (downward) of the electronic component 9. The optical system is configured to obtain the image.
[0022]
Therefore, as shown in FIGS. 10 and 11, the component suction head 81 that sucks the electronic component 9 sucks and holds the electronic component 9 at a position avoiding the pattern (lead 91 a and positioning mark 91 b) of the film-like component 91. is doing. That is, the holding position of the electronic component is limited.
[0023]
By the way, when the polyimide resin film-shaped component 91 constituting the electronic component 9 is made thinner and thinner by the miniaturization and weight reduction of the component and is sucked by the component suction head 81, FIG. As shown in FIG. 12B, deformations such as warping and sagging occurred in the film-like component 91 in the portion that is not attracted and held, that is, the portion of the lead 91a and the positioning mark 91b that are imaged for positioning.
[0024]
Such deformation due to warping or sagging of the terminal portion of the electronic component 9 causes a displacement between the original position of the positioning mark 91b and the position of the imaged positioning mark 91b. It became the cause of bringing about a defect and the crimping | compression-bonding defect to the board | substrate 2. In particular, recently, the trend of minimizing the interval (pitch) between the leads 91a has been further advanced, and high definition has been one of the factors hindering the yield in liquid crystal panel manufacturing, and improvement has been demanded.
[0025]
Therefore, the present invention is not limited by the holding position of the electronic component, and particularly when the electronic component is in the form of a film, it avoids deformation due to warping or sagging of the electronic component terminal portion, and is highly accurate. An object is to provide a component suction head, a component mounting apparatus using the same, and a component mounting method.
[0026]
1st invention is the adsorption head which consists of a translucent member in the component adsorption | suction head which mutually opposed and was connected by one end, was formed in U shape in planar view, and opened the adsorption hole toward the adsorption surface. A suction device connected to the suction hole of the suction portion, a light source that emits light toward the suction surface through the suction portion, and a central recess formed in the U-shape. A heating tool that is movably mounted, and a terminal portion of the electronic component to be sucked by the suction portion is sucked at at least both end positions, and the electronic component is mounted by the heating tool mounted in the central recess. However, it is characterized in that it is thermocompression bonded to a substrate to be mounted .
[0027]
As described above, since the light-transmitting member is used for the suction portion and the light source for irradiating the suction surface is mounted on the suction portion side, there is no restriction on the holding position of the electronic component, and the imaging means The terminal part of the electronic component that is attracted to and normally positioned can be imaged by transmitted light.
[0028]
In addition, since the suction part can be mounted by sucking the terminal part of the electronic component, deformation such as warping or drooping of the electronic component is avoided, and the electronic component is mounted with high accuracy under an accurate imaging pattern .
[0029]
According to a second invention, in the component mounting apparatus, the electronic component sucked by the suction portion of the component suction head according to the first invention and the board on which the electronic component is mounted are photographed from the side opposite to the suction portion. An image pickup means, a detection means for detecting a positional deviation between the electronic component and the substrate based on image data obtained by the imaging means, and a position between the electronic component and the board based on the positional deviation detected by the detection means. It is characterized by comprising correcting means for correcting the relative position and mounting means for mounting the electronic component whose position has been corrected by the correcting means on the substrate.
[0030]
According to a third aspect of the present invention, in the component mounting method, the electronic component is sucked into the suction portion of the component suction head according to the first invention, and the electronic component sucked in the suction portion and the board on which the electronic component is mounted. Is taken from the opposite side of the suction portion by the imaging means, and based on the imaging data obtained by the imaging means, a relative positional deviation between the electronic component and the substrate is detected, and the detected positional deviation is detected. Based on this, the relative position between the electronic component and the substrate is corrected, and the electronic component whose position is corrected by this position correction is mounted on the substrate.
[0031]
According to the second and third aspects of the invention, the electronic component is attracted by the component suction head according to the first aspect and mounted on the substrate. It is avoided and the production yield can be improved.
[0032]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a component suction head according to the present invention, a component mounting apparatus using the same, and a component mounting method will be described in detail with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same structure as the conventional component adsorption | suction head shown in FIG. 6 thru | or FIG. 12, and the component mounting apparatus using the same, and detailed description is abbreviate | omitted.
[0033]
That is, FIG. 1 is a front view showing a first embodiment of a component mounting apparatus equipped with a component suction head according to the present invention.
[0034]
In the apparatus shown in FIG. 1, the component suction head 81 that sucks and transports the electronic component 9 is attached to the transport arm 83 via the rod 82 a of the cylinder 82.
[0035]
The liquid crystal substrate 2 is mounted on the lower substrate mounting stage 84. The electronic component 9 placed on the table 85 is sucked and conveyed by the component suction head 81 and positioned relative to the substrate 2 and then mounted on the substrate 2.
[0036]
On the other hand, an imaging device (imaging means) 87 including a CCD camera for positioning is installed below as shown in FIG.
[0037]
Further, the component suction head 81 is configured as shown in the enlarged sectional view of FIG. 4 as viewed in the direction of the arrow from the AA line of FIGS. 3 and 3.
[0038]
That is, the component suction head 81 includes a suction portion 811 made of a transparent member such as quartz glass or synthetic resin provided with a suction hole 811a facing the suction surface, a light source 812a such as a lamp, and irradiation from the light source 812a. A light source 812 composed of a light guide portion 812b that introduces light to form a surface light emitter and irradiates the adsorption portion 811; an intake pump (not shown) having an electromagnetic valve connected to the adsorption hole 811a via a pipe 81b. Intake device).
[0039]
Therefore, the imaging device 87 can display the terminal portion images such as the lead 91a and the positioning mark 91b of the electronic component 9 even when the suction portion of the component suction head 81 sucks the terminal portion of the electronic component 9 to be photographed. 812 can be captured based on the transmitted light of the light emitted from 812.
[0040]
Therefore, the electronic component 9 adsorbed by the adsorbing portion 811 does not warp or sag in the film-like component 91 on which the lead 91a and the positioning mark 91b are formed as in the prior art, and has a good contrast. Since the mounting control is performed by the positioning control and the component suction head 81, high-precision and high-quality mounting is performed.
[0041]
Further, since there is no restriction on the suction position with respect to the electronic component, the same component suction head can be used even if the position of the positioning mark 91b formed on the electronic component is changed by changing the product type.
[0042]
After positioning by the above configuration, as shown in FIG. 2, the control device 86 controls the movement of the cradle 89 in the directions indicated by the arrows X and Z, and is supported by the cradle 89. The electronic component 9 is lowered and mounted on the substrate 2 via the connecting member by controlling the cylinder 82.
[0043]
In the above-described embodiment, when the substrate 2 is formed of translucent glass, the imaging device 87 can receive and capture the transmitted light from the light source 812 of the component suction head 81. When the substrate 2 is formed of a non-translucent member, as shown in FIG. 2, a light source 871 is built in the imaging device 87 and supplied into the lens barrel of the imaging device 87 via the optical fiber 872. The light from the light source 871 irradiated onto the surface of the substrate 2 by the optical system, and the imaging device 87 can also be configured to take an image with the reflected light.
[0044]
Next, FIG. 5 is a perspective view showing a second embodiment of the component suction head 81. The suction portion 811 is formed in a U shape so that the terminal portion of the electronic component 9 is surely at least at both end positions. It adsorbs and prevents deformation of the electronic component 9 such as warping or dripping.
[0045]
At this time, a heating tool 813 is separately attached to the terminal portion of the electronic component 9 located in the central concave portion of the U-shaped suction portion 811 so as to be movable up and down in the direction of arrow Z, and the electronic component 9 is attached via an adhesive. Bonding at the time of mounting on the substrate 2 can be performed by thermocompression bonding.
[0046]
In any case, according to the component suction head and the component mounting apparatus and method using the same according to the present invention, the electronic component 9 such as TCP having a light-transmitting film such as the film-like component 91 is attached to the substrate 2 or the like. At the time of mounting, deformation of the translucent film can be avoided and captured image data with good contrast can be obtained, and it can be used for manufacturing a liquid crystal panel or the like to obtain excellent effects.
[0047]
In the above embodiment, the electronic component is described as being configured by mounting a chip such as an IC on a film-like component. However, the electronic component is used for connection only in which a lead is formed on the film-like component. Including film parts.
[0048]
In addition, the light source has been described as an example in which irradiation light from the light source 812a such as a lamp is introduced into the light guide portion 812b to cause the light guide portion 812b to emit light, but the present invention is not limited to this, and instead of the light source 812a. A plurality of light emitters such as LEDs may be embedded in the light guide portion 812b so as to be arranged along the suction surface of the electronic component 9 of the suction head 81.
[0049]
The substrate is not limited to the liquid crystal substrate 2 and may be a plasma display panel or the like. The material of the liquid crystal substrate 2 is not limited to glass but may be formed of a resin or the like.
[0050]
【The invention's effect】
According to the component suction head and the component mounting apparatus and method using the same according to the present invention, the electronic component is not limited to the holding position of the electronic component by the component mounting head, and particularly when the electronic component is in the form of a film, When mounting on a substrate, it is possible to avoid deformation such as sagging or warping in an electronic component, and it is possible to mount a component with high accuracy and good connection characteristics, which has a great practical effect.
[Brief description of the drawings]
FIG. 1 is a front view showing a first embodiment of a component mounting apparatus according to the present invention.
2 is an enlarged perspective view showing a configuration of a main part of the apparatus shown in FIG. 1. FIG.
3 is a partially cutaway front view of the component suction head shown in FIG. 1. FIG.
4 is a cross-sectional view of the component suction head shown in FIG.
FIG. 5 is a perspective view showing a second embodiment of a component suction head according to the present invention.
FIG. 6 is a configuration diagram showing a part of a liquid crystal substrate manufacturing process.
7A is a configuration diagram showing the substrate 2 and the electronic component 9 supplied in the step shown in FIG. 6, and FIG. 7B is an enlarged view of the electronic component shown in FIG. 7A. It is a perspective view.
FIG. 8 is a front view showing a conventional component mounting apparatus.
9 is an enlarged perspective view showing a configuration of a main part of the apparatus shown in FIG.
10 is a cross-sectional view of the component suction head shown in FIG.
11 is a cross-sectional view of the component suction head shown in FIG.
12 is a perspective view showing a state in which the electronic component 9 is adsorbed by the component adsorbing head shown in FIG.
[Explanation of symbols]
2 Substrate (liquid crystal substrate)
8 component suction head 81 suction head 811 suction part 811a suction hole 812 light source 86 control device (detection means, correction means)
87 Imaging equipment (imaging means)
9 Electronic parts 91 Film-like parts (Translucent film)
91a Lead 91b Positioning mark

Claims (4)

相対向するとともに一端で連結されて平面視状態でコ字状に形成され、かつ吸着面に向け吸着孔を開口して設けた透光部材からなる吸着部と、
この吸着部の前記吸着孔につらねて接続された吸気装置と、
前記吸着部を介して前記吸着面に向け光を照射する光源と、
前記コ字状に形成された中央凹部に上下動可能に装着された加熱ツールと、を具備し、
前記吸着部によって吸着対象となる電子部品の端子部が少なくとも両側端部位置で吸着され、前記中央凹部に装着された加熱ツールによって当該電子部品が、実装対象となる基板に熱圧着されることを特徴とする部品吸着ヘッド。
An adsorbing portion made of a translucent member facing each other and connected at one end, formed in a U shape in a plan view, and having an adsorbing hole opened toward the adsorbing surface;
An intake device connected to the suction hole of the suction portion;
A light source that emits light toward the suction surface through the suction portion;
A heating tool attached to the central recess formed in the U-shape so as to be movable up and down ,
The terminal part of the electronic component to be picked up by the sucking part is picked up at least at both end positions, and the electronic component is thermocompression bonded to the substrate to be mounted by the heating tool attached to the central recess. Features component suction head.
請求項1記載の部品吸着ヘッドの前記吸着部に吸着された電子部品、並びにこの電子部品が実装される基板を前記吸着部とは反対側から撮影する撮像手段と、
この撮像手段による撮像データに基づき、前記電子部品と前記基板との間の位置ずれを検出する検出手段と、
この検出手段で検出された位置ずれに基づき、前記電子部品と前記基板との間の相対位置を補正する補正手段と、
この補正手段により位置補正された前記電子部品を前記基板に実装する実装手段とを具備することを特徴とする部品実装装置。
An electronic part sucked by the suction part of the component suction head according to claim 1, and an imaging means for photographing a substrate on which the electronic component is mounted from a side opposite to the suction part;
Detection means for detecting a positional deviation between the electronic component and the substrate based on image data obtained by the imaging means;
Correction means for correcting the relative position between the electronic component and the substrate based on the positional deviation detected by the detection means;
A component mounting apparatus comprising: mounting means for mounting the electronic component whose position has been corrected by the correcting means on the substrate.
請求項1記載の部品吸着ヘッドの吸着部に電子部品を吸着し、
前記吸着部に吸着された前記電子部品及びその電子部品が実装される基板を、前記吸着部とは反対側から撮像手段により撮影し、
前記撮像手段により得られた撮像データに基づき、前記電子部品と前記基板との間の相対的な位置ずれを検出し、
この検出された位置ずれに基づき、前記電子部品と前記基板との間の相対位置を補正し、
この位置補正により位置補正された前記電子部品を前記基板に実装することを特徴とする部品実装方法。
The electronic component is adsorbed to the adsorbing portion of the component adsorbing head according to claim 1,
Photographing the electronic component sucked by the suction part and the substrate on which the electronic component is mounted from the opposite side of the suction part by the imaging means,
Based on the imaging data obtained by the imaging means, a relative positional deviation between the electronic component and the substrate is detected,
Based on this detected displacement, correct the relative position between the electronic component and the substrate,
A component mounting method comprising mounting the electronic component whose position is corrected by the position correction on the substrate.
前記電子部品は、電極部を形成した透光性のフィルムを基材としたことを特徴とする請求項2記載の部品実装装置。  The component mounting apparatus according to claim 2, wherein the electronic component uses a translucent film having an electrode portion as a base material.
JP2000199877A 2000-06-30 2000-06-30 Component adsorption head, component mounting apparatus and component mounting method using the same Expired - Fee Related JP4142233B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000199877A JP4142233B2 (en) 2000-06-30 2000-06-30 Component adsorption head, component mounting apparatus and component mounting method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000199877A JP4142233B2 (en) 2000-06-30 2000-06-30 Component adsorption head, component mounting apparatus and component mounting method using the same

Publications (2)

Publication Number Publication Date
JP2002018756A JP2002018756A (en) 2002-01-22
JP4142233B2 true JP4142233B2 (en) 2008-09-03

Family

ID=18697823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000199877A Expired - Fee Related JP4142233B2 (en) 2000-06-30 2000-06-30 Component adsorption head, component mounting apparatus and component mounting method using the same

Country Status (1)

Country Link
JP (1) JP4142233B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180534A (en) * 1984-09-28 1986-04-24 Toshiba Corp Sticking method of optical disk substrate
JP3848299B2 (en) * 2003-05-28 2006-11-22 Tdk株式会社 Work holding device
JP6136829B2 (en) * 2013-10-01 2017-05-31 富士通株式会社 Assembly apparatus and control method thereof
JP6110931B1 (en) * 2015-12-24 2017-04-05 アルファーデザイン株式会社 Component mounting equipment

Also Published As

Publication number Publication date
JP2002018756A (en) 2002-01-22

Similar Documents

Publication Publication Date Title
JP4119098B2 (en) Component holding head, component mounting apparatus using the same, and component mounting method
US20100243153A1 (en) Component mounting apparatus and method
KR100303960B1 (en) Die-bonding machine
JP2006040978A (en) Electronic component packaging method and equipment
JP3943481B2 (en) Electronic component transport head and electronic component mounting apparatus
JP4142233B2 (en) Component adsorption head, component mounting apparatus and component mounting method using the same
KR100828309B1 (en) Apparatus and Method for Bonding Printed Circuit on FPD Panel
KR100478556B1 (en) Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel
JP3295523B2 (en) Electronic component mounting method and device
JP5017041B2 (en) Component mounting method and apparatus
JP6663940B2 (en) Electronic component mounting apparatus and display member manufacturing method
JP2001308149A (en) Apparatus and method of mounting semiconductor for fpc
JP4149752B2 (en) Component mounting apparatus and component mounting method
JP5062204B2 (en) Component mounting board inspection method and apparatus, and component mounting apparatus
JPH09186193A (en) Method and apparatus for mounting electronic component
JP2018170497A (en) Electronic component mounting device and method for manufacturing member for display
JP2005209895A (en) Apparatus for mounting flat type circuit having flexibility
KR102132094B1 (en) Electronic component mounting device and electronic component mounting method
JP2001220057A (en) Peeling mechanism for carrier tape and sticking device for supply material using the same
KR100983337B1 (en) Apparatus for Bonding Driving Printed Circuit on FPD Panel
KR100900710B1 (en) Machine for bonding pcb onto the tcp of display panel
KR20190113604A (en) Apparatus for mounting electric component
JPH0715186A (en) Mounting device for pga package and recognizing device for pin terminal of pga package
JP2002026593A (en) Part mounting device and part mounting method
KR101542865B1 (en) Pre-Bonding Apparatus for Flat Display Panel

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051222

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070717

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070724

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070906

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071002

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071129

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080520

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080612

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110620

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110620

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120620

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120620

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130620

Year of fee payment: 5

LAPS Cancellation because of no payment of annual fees