KR101542865B1 - Pre-Bonding Apparatus for Flat Display Panel - Google Patents

Abstract

The present invention relates to a flexible electronic circuit (FPC) which is divided into upper and lower parts so as to completely automate the pre-bonding process and correct the position of the flexible electronic circuit, A panel having an anisotropic conductive film (ACF) is loaded and loaded in a previous process, and the panel is transported in the X-axis direction A panel loading unit configured to receive the panel loading unit; A stage unit configured to support the panel loaded from the panel loading unit and to be capable of being supplied in the Y axis direction after sucking and supporting the panel on the upper side; An alignment inspection unit which photographably mounts the flexible electronic circuit of the panel located on the stage unit and which can compensate the bonding position of the flexible electronic circuit by the individually photographed image information; A clamp unit positioned corresponding to an upper side of the stage unit and capable of fixing a flexible electronic circuit located on an upper side of a panel before and after a correction operation by a signal of the alignment inspection unit; A bonding unit installed on one side of the clamp unit and movable upward and downward toward the stage unit and thermally compressing and bonding the flexible electronic circuit of the fixed panel from the clamp unit; And a panel unloading unit for picking up the panel bonded in the bonding unit from the stage unit and unloading the panel from the stage unit to the next process, wherein the panel unloading unit is capable of transporting the panel in the X axis direction do.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a flat panel display panel,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bonding apparatus for a flat panel display panel, and more particularly, to a substrate bonding apparatus for a flat panel display panel, and more particularly, to a method for fully automating a prebonding process between flexible electronic circuits (TFPC / MFPC) And more particularly, to a method and apparatus for a flat panel display panel capable of effectively correcting a position of a flat display panel by aligning and correcting the position of the flat panel display panel.

In general, various types of high-density semiconductor packages are mounted on parts of a panel so as to realize a low-voltage driving, a low power consumption, and a full-color implementation in a portable electronic device such as a mobile phone, a notebook computer, a PDA, do. Furthermore, in order to mount a high-density semiconductor package on a panel, a bonding apparatus of a variety of structures is used so that a semiconductor package, which is a driving circuit, can be electrically connected to the display panel.

As a technique for manufacturing a high-density semiconductor package, a TCP (tape carrier package) called a tape carrier system is a typical method in which a semiconductor chip, which is a plurality of integrated circuit elements, is mounted on a single panel in a high density manner In recent years, technologies such as COB (chip on board) and COG (chip on glass) have been developed and used to mount semiconductor chips. However, there are limitations in driving a high-performance semiconductor chip requiring a fine pitch. There was a problem that was difficult to follow the trend.

From this background, development of thinner, lighter, and more flexible components is required. As with TCP, which is a conventional semiconductor package technology, a film on film (FOF) method, which is a new method of bonding semiconductor chips on a film, Was developed.

The FOF bonding method according to the bonding apparatus proceeds in three steps. First, a step of attaching an anisotropic conductive film (ACF) to a thin glass-shaped panel having a thin thickness, and a step of bonding an FPC Bonding process is performed by arranging a plurality of flexible electronic circuits on a substrate and then pressurizing the substrate with a suitable pressure to carry out a main bonding process again to complete the bonding operation, In addition, a flexible electronic circuit of the panel is provided with a donging device installed therein.

However, in the case of a conventional carbon bonding apparatus, since a plurality of sides are bonded to a component of a flexible electronic circuit, the working time of the carbon bonding process becomes long, and the process efficiency is lowered.

In order to solve the above problems, Korean Patent Registration No. 997919 (Nov. 26, 2010) discloses a method of pre-bonding tabs to a part of one short side and one long side of a display panel A first pre-bonding unit; And a second prebonding unit spaced apart from one side of the first prebonding unit and prebonding the tabs to the remaining short sides and the remainder of the long sides, A first linear motor provided above the short side of the panel and extending along the short side; A first mounter connected to the first linear motor and moving along the extending direction of the first linear motor and attaching the tabs to the short side; A second linear motor provided on the longer side of the display panel and extending along the longer side; And a second mounter connected to the second linear motor and moving along the extending direction of the second linear motor and attaching the tabs to a part of the long side, A tap pre-bonding device is known.

Korean Patent Laid-Open Publication No. 739 (Apr. 1, 2014) discloses a pre-bonding module for thermally pressing a display panel and a target part; A Z-axis position control unit connected to the free bonding module to control the up-down movement of the pre-bonding module; A Y-axis position control unit connected to the Z-axis position control unit and including a Y-axis linear motor for controlling forward and backward movement of the pre-bonding module; And an X-axis position control unit connected to the Y-axis position control unit and controlling an X-axis linear motor to control the left and right movement of the pre-bonding module. Accordingly, there is no occurrence of bonding distortion and productivity is improved A pre-bonding device for a flexible display panel is known.

However, in the above-mentioned conventional method, some processes such as loading or unloading panels in a previous process for semi-automatic bonding are semi-automatic by a worker, resulting in a decrease in work efficiency and a long work time There was a problem.

Further, in the case of a conventional electronic device, in the process of bonding a flexible electronic circuit of a panel, there is no separate correction function for a flexible electronic circuit, so that a large number of flexible electronic circuits are mutually intertwined to each other during bonding, Further, there is a problem that not only the quality of the product deteriorates but also the defect rate increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to automate the overall operation of the docking process from loading and unloading the panel to press bonding and bonding the flexible electronic circuit on the panel, And it is an object of the present invention to provide a gobbing device for a flat panel display panel which can shorten the time required for a flat panel display panel.

In addition, the present invention provides means for correcting a point mark to be bonded between a plurality of flexible electronic circuits, thereby preventing the bonding position from being changed between the flexible electronic circuits, And to provide a substrate bonding apparatus for a flat panel display panel.

The present invention provides a substrate bonding apparatus for a flat panel display panel in which a flexible electronic circuit is thermally press-bonded onto a panel to perform bonding, wherein a panel having an anisotropic conductive film (ACF) A panel loading unit configured to be movable in the X-axis direction; A stage unit configured to support the panel loaded from the panel loading unit and to be capable of being supplied in the Y axis direction after sucking and supporting the panel on the upper side; An alignment inspection unit which photographably mounts the flexible electronic circuit of the panel located on the stage unit and which can compensate the bonding position of the flexible electronic circuit by the individually photographed image information; A clamp unit positioned corresponding to an upper side of the stage unit and capable of fixing a flexible electronic circuit located on an upper side of a panel before and after a correction operation by a signal of the alignment inspection unit; A bonding unit installed on one side of the clamp unit and movable upward and downward toward the stage unit and thermally compressing and bonding the flexible electronic circuit of the fixed panel from the clamp unit; And a panel unloading unit configured to pick up the panel bonded in the bonding unit from the stage unit and unload the panel to the next process, and to transfer the panel in the X axis direction.

The stage unit includes a stage main body configured to be movable forward, backward, and up and down after supporting the panel, and a stage main body mounted on one side of the stage main body and capable of reciprocating right and left toward the flexible electronic circuit of the panel located on the stage main body And configured to interfere with each other so as to be able to take a picture of the flexible electronic circuit divided up and down from the alignment inspection unit, respectively.

The stage main body includes a panel supporting means for sucking and supporting the panel on an upper portion thereof, an elevating means connected to the lower portion of the panel supporting means and formed so as to reciprocate the panel supporting means in the inside, And a panel conveying means connected to the lower end of the main frame for reciprocating back and forth and for conveying the position of the panel in the Y axis direction.

And a support block for supporting a correction operation by the alignment inspection unit and a bonding operation by the bonding unit, wherein the stage main body is fixedly installed at a predetermined interval from the panel support means and the flexible electronic circuit of the panel is positioned .

The inspection assistant unit includes a test pin body mounted on the stage main body and reciprocally movable from the stage main body to the left and right, and a flexible electronic circuit fixedly mounted on the upper end of the test pin main body, And a pin member extending in the transverse direction so as to be able to make contact therewith.

The alignment inspection unit includes an alignment camera for photographing the positions of the upper and lower flexible electronic circuits, a test monitor for outputting a screen photographed by the alignment camera, and an upper and a lower flexible electronic circuit And an alignment control unit for inputting each of the image signals and performing mutual calculation, and then applying a control signal to the stage unit or the clamp unit.

The clamp unit includes a pin clamp member for supporting the lower surface of the flexible electronic circuit located on the upper side, a pin clamp member for supporting the lower surface of the flexible electronic circuit located above the pin clamp member, As shown in Fig.

The clamp unit includes a bracket member that supports the pin clamp member and the compression clamp member and supports the flexible electronic circuit of the panel located on the stage unit so as to be horizontally reciprocally movable left and right.

Wherein the clamping clamp member comprises a cylindrical clamp body, a clamp tip provided at a lower portion of the clamp body and movable up and down vertically so as to be contactable with a flexible electronic circuit located on the stage unit, And a lifting cylinder mounted on the upper portion of the clamp body.

The clamp main body is capable of correcting the position of the flexible electronic circuit located on the upper side by rotating the clamp tip from the signal for the correction operation of the alignment inspection unit after the clamp tip contacts the pin clamp member to fix the flexible electronic circuit .

The bonding unit includes: a bonding frame; forward and backward transport means provided to be capable of linearly reciprocating in the Y-axis direction toward the clamp unit by supporting the bonding frame; and forward and backward transport means provided on one end of the bonding frame, And a cylinder member connected to the upper end of the bonding tip and extending and moving up and down to apply the upward and downward movement power to the bonding tip.

According to the method for fabricating a flat panel display panel according to the present invention, it is possible to improve productivity of a product by shortening a tact time of the process while improving work efficiency.

In addition, since the joining device for a flat panel display panel according to the present invention is configured to align marks after confirming marks for two flexible electronic circuits (TFPC / MFPC), the bonding positions are prevented from being mutually interchanged, It is possible to minimize the defective rate by reducing the work error in the carbonization process as well as to improve the quality of the product.

In addition, since the gobo dipping apparatus for a flat panel display panel according to the present invention constitutes an inspection sub-unit which can be controlled so as to confirm marks for a flexible electronic circuit in the process of transferring a panel for a bonding operation, The efficiency of the alignment inspection can be further improved.

Further, since the gobbing device for a flat panel display panel according to the present invention selectively adjusts the position of the flexible electronic circuit (TFPC / MFPC) divided into upper and lower parts, it is possible to flexibly select the operation type according to various panel shapes So that an efficient operation can be achieved.

1 is a plan view schematically showing an embodiment according to the present invention.
2 is a side view schematically showing an embodiment according to the present invention.
3 is a front view schematically showing a stage unit according to an embodiment of the present invention;
4 is a side view schematically showing a stage unit according to an embodiment of the present invention.
5 is a plan view showing the use state of the stage main body in the embodiment according to the present invention.
6 is a front view showing the use state of the examination assistant unit according to the embodiment of the present invention;
7 is a partially enlarged view showing a use state of the stage unit according to the embodiment of the present invention;
Figure 8 is a block diagram schematically illustrating an alignment inspection unit in an embodiment according to the present invention;
9 is a front view schematically showing a clamp unit in an embodiment according to the present invention.
10 is a side cross-sectional view schematically showing a clamp unit and a bonding unit according to an embodiment of the present invention.
11 is a side view showing the use state of the bonding unit according to the embodiment of the present invention.

The present invention relates to a joining apparatus for joining a flexible electronic circuit on a panel by thermocompression bonding, the joining apparatus comprising: a panel having an anisotropic conductive film (ACF) A panel loading portion; A stage unit configured to support the panel loaded from the panel loading unit and to be capable of being supplied in the Y axis direction after sucking and supporting the panel on the upper side; An alignment inspection unit which photographably mounts the flexible electronic circuit of the panel located on the stage unit and which can compensate the bonding position of the flexible electronic circuit by the individually photographed image information; A clamp unit positioned corresponding to an upper side of the stage unit and capable of fixing a flexible electronic circuit located on an upper side of a panel before and after a correction operation by a signal of the alignment inspection unit; A bonding unit installed on one side of the clamp unit and movable upward and downward toward the stage unit and thermally compressing and bonding the flexible electronic circuit of the fixed panel from the clamp unit; And a panel unloading unit for picking up the panel bonded in the bonding unit from the stage unit and unloading the panel from the stage unit to the next process so that the panel can be transferred in the X axis direction. It is characterized by the constitution.

The stage unit is mounted on one side of the stage main body and is capable of reciprocating leftward and rightward toward a flexible electronic circuit of the panel located on the stage main body. And an inspection auxiliary unit interposed between the upper and lower flexible electronic circuits so as to be able to photograph each of the flexible electronic circuits from the alignment inspection unit.

The stage main body includes a panel supporting means for sucking and supporting the panel on an upper portion thereof, an elevating means connected to a lower portion of the panel supporting means and formed so as to reciprocate the panel supporting means in the inside, And a panel transporting means connected to the lower end of the main frame for reciprocating back and forth and for transporting the position of the panel in the Y axis direction, The device is characterized by its technical composition.

And a support block for supporting a correction operation by the alignment inspection unit and a bonding operation by the bonding unit, the flexible electronic circuit being fixed to the stage main body at a predetermined interval from the panel support means, Which is a feature of the technical construction.

The inspection assistant unit may include a test pin body mounted on the stage main body and reciprocally movable from the stage main body to the left and right, And a pin member extending in a transverse direction so as to be able to make contact with the flat panel display panel.

The alignment inspection unit may further include an alignment camera for photographing the positions of the upper and lower flexible electronic circuits, a test monitor for outputting a screen photographed by the alignment camera, and an upper and a lower flexible electronic And an alignment control unit for receiving a video signal of each circuit and performing a mutual calculation process and applying a control signal to the stage unit or the clamp unit.

The clamp unit includes a pin clamp member for supporting the lower surface of the flexible electronic circuit located on the upper side and a pin clamp member for supporting the lower surface of the flexible electronic circuit located above the pin clamp member, And a clamping member for fixing the clamping clamp member.

And a bracket member for supporting the pin clamp member and the clamping clamp member so as to horizontally reciprocate toward the flexible electronic circuit of the panel located on the stage unit, The device is characterized by its technical composition.

The clamping member includes a cylindrical clamp body, a clamp tip provided at a lower portion of the clamp body and vertically moving vertically so as to be contactable with a flexible electronic circuit located on the stage unit, And a lifting cylinder mounted on the upper portion of the clamp body so as to apply the clamping force to the clamping body.

The clamping body may further include a clamping member for clamping the flexible electronic circuit by contacting the clamping tip toward the pin clamping member and rotating the clamping tip from a signal for a correction operation of the aligning inspection unit to position the flexible electronic circuit located on the upper side The present invention provides a method for compensating for deflection of a flat panel display panel.

The bonding unit may include a bonding frame, forward and backward transport means provided to support the bonding frame and linearly reciprocally movable in the Y axis direction toward the clamp unit, A bonding apparatus for a flat panel display panel, comprising: a bonding tip provided in contact with a flexible electronic circuit so as to be thermo-compression-bonded; and a cylinder member connected to an upper end of the bonding tip and extending and moving up and down, As a feature of the technical construction.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a preferred embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIGS. 1 and 2, a substrate bonding apparatus for a flat panel display panel according to an embodiment of the present invention includes a panel loading unit and a flexible electronic circuit, A stage unit 200, an alignment inspection unit 300, a clamp unit 400, and a bonding unit 500. The clamp unit 400 includes a clamp unit 400,

The term " panel " in the present invention is not limited to a general panel, and is collectively referred to as a meaning including various types of panels such as a flexible panel.

In addition, the flexible electronic circuit (FPC) performs the function of transmitting a driving signal to the panel, and has two flexible electronic circuit components, TFPC and MFPC, which are provided on the panel. For example, the flexible electronic circuit located on the upper side in the panel supplied on the stage unit 200 is the TFPC, and the flexible electronic circuit located on the lower side of the panel is the MFPC.

The panel loading unit 100 performs the function of continuously loading and loading the panel from the previous process, that is, the process of attaching the anisotropic conductive film (ACF) to the panel.

As shown in FIG. 1, the panel loading unit 100 is configured to be capable of moving the panel in the X-axis direction. That is, the panel loading unit 100 transports the panel in the X-axis direction toward the bundling process in the film attaching process in the state where the film bonding process, the bonding process, and the main bonding process are sequentially arranged in the X- do.

The panel unloading unit 600 performs a function of unloading the panel to the next process, that is, the main bonding process.

1, the panel unloading unit 600 picks up a panel dubbed from the bonding unit 500 from the stage unit 200, and is capable of being transported in the X-axis direction in the same manner as the panel loading unit 100 .

The panel loading unit 100 is disposed between the film attaching process and the joining process, and is installed so as to be driven to move in the X-axis direction by repeating the film attaching process and the joining process on the conveying path. The panel unloading unit 600 are disposed between the bonding process and the bonding process so that the bonding process and the bonding process are repeatedly performed on the transfer path to be driven in the X axis direction.

The panel loading unit 100 and the panel unloading unit 600 are provided with a plurality of suction nozzles N so as to suck various points of the panel and then move safely toward the X- do.

In this case, the suction nozzle N may be constructed in such a manner that a simple suction force for sucking air from the outside is generated so that the suction nozzle N sucks the suction nozzle N so that the panel contacts the suction nozzle N, So that the panel can be picked up by applying a method of adsorbing the panel in a noncontact manner.

The stage unit 200 supports the panel loaded from the panel loading unit 100 and supplies the panel to the bonding unit 500. That is, the stage unit 200 is configured to be able to supply the panel in the Y-axis direction after sucking and supporting the panel supplied from the panel loading unit 100 in the upper direction.

The stage unit 200 includes a stage main body 210 for transferring a panel and an inspection auxiliary unit 220 for assisting a correction operation of the alignment inspection unit 300 with respect to the flexible electronic circuit of the panel.

The stage main body 210 is configured to be movable back and forth and up and down after supporting the panel. That is, the stage main body 210 is positioned between the panel loading unit 100 and the bonding unit 500 and is vertically movable at a height of a position where the panel is sucked on the panel loading unit 100 , And linearly moves forward and backward toward the bonding unit (500) to transfer the panel.

3 and 4, the stage main body 210 includes a panel supporting means 211, a main body frame 213, and a panel conveying means 217. As shown in FIG.

The panel supporting means 211 has a planar shape having a flat top surface so as to support the panel at an upper portion thereof and to be parallel to the panel.

The panel supporting means 211 has a structure in which the panel can be vacuum-adsorbed on the upper surface in a non-contact state. That is, although not shown in the drawing, a plurality of vacuum holes are formed on the upper surface of the panel supporting means 211 to generate a vacuum toward the panel, thereby absorbing the panel, and a separate vacuum line is connected to one side.

The main body frame 213 is connected to the lower portion of the panel supporting means 211 and includes an elevating means 214 and a turning means 215 inside.

In the main body frame 213, the elevating means 214 is formed to be capable of reciprocating the panel supporting means 211 up and down.

The lifting means 214 lifts the panel supporting means 211 up and down to move the panel loading unit 100 to receive the panel from the panel loading unit 100 securely, So that it can be moved in the Z-axis direction.

The pivoting means 215 is configured to pivot the panel supporting means 211. That is, the turning unit 215 is configured to correct the position of the panel from the control signal transmitted from the alignment checking unit 300.

Since the elevating means 214 and the turning means 215 can be implemented by applying the same general motor and shaft configurations as those described above, the detailed description will be omitted.

The panel conveying means 217 is connected to the lower end of the main body frame 213 and is reciprocally movable back and forth.

As shown in FIG. 5, the panel transportation means 217 is configured to be capable of transporting the position of the panel in the Y-axis direction, which is the direction in which the clamp unit 400 and the bonding unit 500 are located.

The panel conveying means 217 is provided with a rail extending in a range in which it is movable in the forward and backward directions, and is installed so as to travel in the Y-axis direction along the rails and reciprocate linearly.

The stage main body 210 is provided with a support block 219 fixedly installed at a predetermined interval from the panel support means 211.

The inspection assisting unit 220 may be located in a space between the panel supporting means 211 and the supporting block 219.

The support block 219 is formed to be a horizontal flat upper surface that is the same as the upper surface of the panel supporting means 211 and extends as long as the width of the panel supporting means 211.

The supporting block 219 is positioned at a position where the flexible electronic circuit extending from the panel located on the panel supporting means 211 is located and the correction operation by the alignment inspection unit 300 and the correction operation by the bonding unit 500 So as to support the bonding operation.

3 and 4, the inspection auxiliary unit 220 in the stage unit 200 is mounted on one side of the stage main body 210. [

The inspection assisting unit 220 performs a function of interfering with each of the upper and lower flexible electronic circuits in one panel so that each of them can be photographed from the alignment inspection unit 300. That is, the inspection assistant unit 220 is configured to separate the two flexible electronic circuits, that is, the TFPC and the MFPC, which overlap each other, so as to first photograph the MFPC from the alignment inspection unit 300, and then assist in photographing the TFPC.

The inspection assistant unit 220 includes an inspection pin main body 221 mounted on the stage main body 210 and capable of independently driving from the stage main body 210, And a pin member 223 formed to be extended.

The inspection pin main body 221 is mounted on the stage main body 210 and is moved back and forth by the panel conveying means 217 so as to be reciprocally movable left and right independently of the stage main body 210 as shown in FIG. .

The pin member 223 is fixed to the upper end of the inspection pin main body 221 and is formed so as to be able to contact the flexible electronic circuit of the panel located in the stage main body 210.

The pin member 223 is positioned so as to flow toward the space between the panel supporting means 211 and the support block 219 by movement of the inspection pin body 221.

The pin member 223 is formed so as to form a pair of two fins extended in the left and right direction and a pair of fins are formed so as to be parallel to each other with a predetermined gap therebetween.

7, the stage unit 200 moves the pin member 223 of the inspection auxiliary unit 220 in a forward direction toward the clamp unit 400 and the bonding unit 500 The flexible electronic circuit is brought into contact with the pin member 223 and the flexible electronic circuit TFPC located on the upper side is lifted and the flexible electronic circuit MFPC located on the lower side from the alignment inspection unit 300 is photographed .

As described above, when the inspection assistant unit 220 is configured to be able to confirm marks for the flexible electronic circuit in the process of transferring the panel for the bonding operation, it is possible to simplify the structure and significantly reduce the tact time of the process, It is possible to further improve the inspection efficiency.

The alignment inspection unit 300 performs a function to check the mutual bonding positions between the flexible electronic circuits of the panels located up and down.

The alignment inspection unit 300 is mounted on the flexible electronic circuit of the panel located on the stage unit 200 so as to be photographable and is positioned above the clamp unit 400 so that the stage unit 200 can be photographed So as to transmit the correction signal.

8, the alignment inspection unit 300 is configured to be capable of correcting the bonding position of the flexible electronic circuit by the individually photographed image information on the upper and lower flexible electronic circuits, An inspection monitor 320 and an alignment control unit 330.

The alignment camera 310 is disposed on the upper side of the clamp unit 400 and installed so as to be vertically downward on a predetermined height so as to be able to shoot toward the stage unit 200.

The alignment camera 310 scans the flexible electronic circuit and photographs the positions of the upper and lower flexible electronic circuits, respectively.

It is preferable that the alignment inspection unit 300 is provided with an illumination source 315 for illuminating the flexible electronic circuit so as to improve the sharpness of the image at the time of shooting due to the alignment camera 310. [

The inspection monitor 320 is configured to be capable of outputting a screen photographed from the alignment camera 310.

Preferably, the inspection monitor 320 is capable of outputting a numerical operation signal for each flexible electronic circuit as well as an image signal from the alignment camera 310. [

The alignment control unit 330 receives a video signal of the alignment camera 310 and applies a control signal to the stage unit 200 or the clamp unit 400.

For example, after the image signals for the upper and lower flexible electronic circuits photographed from the alignment camera 310 are input, the alignment control unit 330 performs arithmetic processing on the image signals, and the stage unit 200 or the And the alignment control unit controls the clamp unit 400 by applying a control signal.

The clamp unit 400 is positioned corresponding to the upper side of the stage unit 200.

The clamp unit 400 is formed so as to fix a flexible electronic circuit located on the upper side of the flexible electronic circuit of the panel before and after the correction operation by the signal of the alignment inspection unit 300.

9, the clamp unit 400 includes a pin clamp member 410 for supporting a lower surface of a flexible electronic circuit located above, a pressing clamp member 410 for pressing and fixing the upper surface of the flexible electronic circuit located on the upper side, (420).

The pin clamp member 410 has a flat pin shape having a thin thickness and has a structure in which the pin clamp member 410 is slightly extended toward one side (the side where the flexible electronic circuit is located).

The clamping clamp member 420 is disposed to correspond to the upper side of the pin clamp member 410 and is vertically reciprocable toward the pin clamp member 410.

The clamping clamp member 420 includes a cylindrical clamp main body 421, a clamp tip 423 provided below the clamp main body 421 and a lifting cylinder 425 mounted on the clamp main body 421 ).

The clamp tip 423 moves up and down vertically so as to be able to contact a flexible electronic circuit located on the stage unit 200. The up and down movement power of the clamp tip 423 is controlled by the extension movement of the lifting cylinder 425 .

In the clamp unit 400, the clamp body 421 may be configured to rotate the clamp tip 423 so as to be capable of correcting the flexible electron beam located on the upper side. That is, after the clamp tip 423 contacts the pin clamp member 410 to fix the flexible electronic circuit, the clamp tip 423 is rotated from the signal for the correction operation of the alignment inspection unit 300, So that the position of the flexible electronic circuit can be corrected.

As described above, when the position correction of the MFPC of the flexible electronic circuit (TFPC / MFPC) is performed and the position correction of the TFPC can be performed, a selective correction pattern can be installed to flexibly select the operation type according to various panel shapes Thereby enabling efficient operation.

The clamp unit 400 includes a bracket member 430 for supporting the pin clamp member 410 and the compression clamp member 420, respectively.

The bracket member 430 supports the flexible electronic circuit of the panel located on the stage unit 200 so as to horizontally reciprocate from side to side. That is, the clamp unit 400 photographs the flexible electronic circuit of the panel located on the stage unit 200 from the alignment camera 310 of the alignment inspection unit 300, The bracket member 430 is movably formed at a position where the compression clamp member 420 can clamp the flexible electronic circuit.

For example, if the clamping unit 400 is moved to the outside during photographing with the alignment camera 310, the clamping unit 400 is moved inward during the correction operation after photographing, so that the clamping of the flexible electronic circuit by the clamping unit 400 It is located as possible.

The left and right movement of the bracket member 430 may be applied in the same manner as the structure of the driving structure of a cylinder, a motor, or the like applied to general mechanical equipment.

The bonding unit 500 is provided on one side of the clamp unit 400 and thermally presses the flexible electronic circuit of the panel fixed on the stage unit 200 from the clamp unit 400 to perform bonding .

10 and 11, the bonding unit 500 is vertically reciprocally movable toward the support block 219 of the stage unit 200 and includes a bonding frame 510 and a back-and- 520, a bonding tip 530, and a cylinder member 540.

The bonding frame 510 is movably connected to the front and rear conveying means 520 and supports the bonding tip 530 and the cylinder member 540 so that the bonding tip 530 and the cylinder member 540 can be driven at respective positions.

The back-and-forth feeding means 520 supports the bonding frame 510 so that the bonding frame 510 is linearly reciprocally movable in the Y-axis direction toward the clamp unit 400.

The forward / rearward conveying means 520 is configured to transmit the rotational force of the driving motor M provided at the lower side to the shaft and to drive the rearward / rearward linear motion along the rail.

The bonding tip 530 is installed on one end of the bonding frame 510 so as to reciprocate up and down.

The bonding tip 530 contacts the flexible electronic circuit and presses the flexible electronic circuit so that the flexible electronic circuit can be thermally compressed.

The cylinder member 540 is coupled to the upper end of the bonding tip 530 and is configured to be able to apply upward and downward movement power to the bonding tip 530 by stretching.

Next, a description will be given of the operation of the joining apparatus for a flat panel display panel according to a preferred embodiment of the present invention.

First, a panel having an anisotropic conductive film attached thereto is picked up by the panel loading unit 100 and then transferred in the X axis direction. Then, the panel is loaded onto the stage unit 200 from the panel loading unit 100, 200 lifts up the panel support means 211 by the elevating means 214 to load the panel so that the panel can be securely supplied.

Then, the stage unit 200 is driven by the panel conveying means 217 to move the panel supporting means 211 forward, thereby conveying the panel in the Y-axis direction.

At this time, the inspection pin body 221 of the inspection assisting unit 220 moves toward the stage main body 210 of the stage unit 200 and the flexible electronic circuit of the stage supporting unit 211 of the stage unit 200 The pin member 223 of the inspection assisting unit 220 can be contacted and the panel supporting means 211 of the stage unit 200 moves in the Y axis direction toward the clamp unit 400, The flexible electronic circuit TFPC located on the upper side of the flexible electronic circuit of the upper side maintains the raised state in contact with the pin member 223 so that the lower flexible electronic circuit MFPC is held by the upper side of the flexible electronic circuit TFPC As shown in Fig.

The flexible electronic circuit (MFPC) positioned below the flexible electronic circuit located on the support block 219 in the stage unit 200 is exposed by the alignment camera 310 of the alignment inspection unit 300 And transmits an input signal to the inspection monitor 320 and the alignment control unit 330 after the mark is taken. The inspection pin main body 221 of the inspection assisting unit 220 moves out of the stage main body 210 and the pin member 223 is removed from the flexible electronic circuit so that the flexible electronic circuit TFPC located at the upper side returns to the original position The alignment camera 310 of the alignment inspection unit 300 takes an appropriate mark of the flexible electronic circuit TFPC located on the upper side and then inputs an input signal to the inspection monitor 320 and the alignment control unit 330 To check whether it is correct.

The bracket member 430 of the clamp unit 400 is moved in the lateral direction toward the stage unit 200 so that the pin clamp member 410 supports the lower surface of the flexible electronic circuit TFPC located on the upper side, 420 are driven in the vertical direction so that the clamp tip 423 presses the upper surface of the flexible electronic circuit TFPC located on the upper side to clamp the upper surface.

At this time, the panel support means 211 of the stage unit 200 is driven in the X-axis, Y-axis, and θ-axis (rotation angle) directions according to the values calculated by the alignment inspection unit 300, Since the position of the flexible electronic circuit located on the lower side is corrected, the flexible electronic circuit of the panel is aligned.

The bonding frame 510 of the bonding unit 500 moves toward the clamp unit 400 and the bonding tip 530 of the bonding unit 500 moves in the vertical direction toward the flexible electronic circuit, Are thermocompression bonded to each other.

After completion of the bonding process from the bonding unit 500, the panel unloading unit 600 picks up the panel after the stage unit 200 is returned to the original position and transfers the panel to the next process for bonding.

That is, according to the present invention, it is possible to improve the productivity by shortening the tact time of the process while improving the work efficiency. Do.

In addition, since the present invention is configured to align marks after confirming each of two flexible electronic circuits (TFPC / MFPC), it is possible to prevent the bonding positions from being mutually interchanged, thereby improving the precision of the operation, It is possible to minimize the defect rate and significantly improve the quality of the product.

While the preferred embodiments of the present invention have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. And this also falls within the scope of the present invention.

100: panel loading unit 200: stage unit 210: stage body
211: panel supporting means 213: main body frame 214: elevating means
215: rotating means 217: panel conveying means 219: supporting block
220: inspection auxiliary unit 221: inspection pin body 223: pin member
300: an alignment inspection unit 310: an alignment camera 315: a light source
320: inspection monitor 330: alignment control unit 400: clamp unit
410: pin clamp member 420: compression bonding member 421: clamp body
423: clamp tip 425: lifting cylinder 430: bracket member
500: bonding unit 510: bonding frame 520:
530: Bonding tip 540: Cylinder member 600: Panel unloading part

Claims (11)

A method for bonding a flexible electronic circuit to a panel by thermocompression bonding,
A panel loading unit configured to load and load a panel to which an anisotropic conductive film (ACF) is attached so that the panel can be transferred in the X axis direction;
A stage unit configured to support the panel loaded from the panel loading unit and to be capable of being supplied in the Y axis direction after sucking and supporting the panel on the upper side;
An alignment inspection unit which photographably mounts the flexible electronic circuit of the panel located on the stage unit and which can compensate the bonding position of the flexible electronic circuit by the individually photographed image information;
A clamp unit positioned corresponding to an upper side of the stage unit and capable of fixing a flexible electronic circuit located on an upper side of a panel before and after a correction operation by a signal of the alignment inspection unit;
A bonding unit installed on one side of the clamp unit and movable upward and downward toward the stage unit and thermally compressing and bonding the flexible electronic circuit of the fixed panel from the clamp unit;
And a panel unloading unit configured to pick up the panel bonded in the bonding unit from the stage unit and to unload the panel to the next process, and to transfer the panel in the X axis direction.
The method according to claim 1,
The stage unit includes a stage main body configured to be movable forward, backward, and up and down after supporting the panel, and a stage unit mounted on one side of the stage main body and capable of reciprocating leftward and rightward toward the flexible electronic circuit of the panel positioned on the stage main body And an inspection auxiliary unit interposed between the upper and lower flexible electronic circuits so as to be able to photograph the flexible electronic circuit from the alignment inspection unit, respectively.
The method of claim 2,
The stage main body includes a panel supporting means for sucking and supporting a panel on an upper portion thereof, an elevating means connected to a lower portion of the panel supporting means and capable of reciprocating the panel supporting means in an inner side, And a panel transporting means connected to the lower end of the main frame for reciprocating back and forth and for transporting the position of the panel in the Y axis direction, .
The method of claim 3,
And a support block for supporting a correction operation by the alignment inspection unit and a bonding operation by the bonding unit, wherein the stage main body is fixedly installed at a predetermined interval from the panel holding means and the flexible electronic circuit of the panel is located, Wherein the substrate is a flat panel display panel.
The method of claim 2,
The inspection assistant unit includes a test pin body mounted on the stage main body and reciprocally movable from the stage main body to the left and right, and a flexible electronic circuit And a pin member extending laterally so as to be contactable with the guide member.
The method according to claim 1,
The alignment inspection unit includes an alignment camera for photographing the positions of the upper and lower flexible electronic circuits, a test monitor for outputting a picture taken from the alignment camera, and an upper and a lower flexible electronic And an alignment control unit for receiving a video signal of each circuit and performing a mutual calculation process, and applying a control signal to the stage unit or the clamp unit.
The method according to claim 1,
The clamp unit includes a pin clamp member which is in contact with the upper surface of the flexible electronic circuit so as to be capable of supporting the lower surface of the flexible electronic circuit so as to support the upper surface of the flexible electronic circuit, And a clamping member for fixing the clamping member.
The method of claim 7,
And a bracket member for supporting the pin clamp member and the clamping clamp member and supporting the pin clamp member and the flexible electronic circuit of the panel located on the stage unit so as to be horizontally reciprocatable in the horizontal direction, Device.
The method of claim 7,
Wherein the clamping clamp member comprises a cylindrical clamp body, a clamp tip provided at a lower portion of the clamp body and movable up and down vertically so as to be contactable with a flexible electronic circuit located on the stage unit, And a lifting cylinder mounted on the upper portion of the clamp body to apply the clamping force to the clamping body.
The method of claim 9,
The clamp body fixes the flexible electronic circuit by contacting the clamp tip toward the pin clamp member and then rotates the clamp tip from a signal for the correction operation of the alignment inspection unit to correct the position of the flexible electronic circuit located on the upper side Wherein the substrate is a substrate.
The method according to claim 1,
The bonding unit may include a bonding frame, forward and backward transport means provided to support the bonding frame and linearly reciprocally movable in the Y-axis direction toward the clamping unit, and vertically movable on one end of the bonding frame And a cylinder member connected to the upper end of the bonding tip and adapted to extend and move to apply the up and down movement power to the bonding tip, Device.

Images