JP5062204B2 - Component mounting board inspection method and apparatus, and component mounting apparatus - Google Patents

Component mounting board inspection method and apparatus, and component mounting apparatus Download PDF

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JP5062204B2
JP5062204B2 JP2009055985A JP2009055985A JP5062204B2 JP 5062204 B2 JP5062204 B2 JP 5062204B2 JP 2009055985 A JP2009055985 A JP 2009055985A JP 2009055985 A JP2009055985 A JP 2009055985A JP 5062204 B2 JP5062204 B2 JP 5062204B2
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mounting
component
substrate
inspection
side edge
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JP2010212394A (en
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安登 鬼塚
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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本発明は、基板の側縁部に実装された部品の実装状態、特に実装位置ずれの検査を行う部品実装基板の検査方法と装置及びそれを適用した部品実装装置に関するものである。   The present invention relates to a component mounting board inspection method and apparatus for inspecting a mounting state of a component mounted on a side edge portion of a board, particularly a mounting position shift, and a component mounting apparatus to which the inspection method is applied.

液晶ディスプレイパネル(LCD)やプラズマディスプレイパネル(PDP)の製造においては、そのガラス基板の側縁部に設けられた実装部位に、TCP(Tape Carrier Package)部品、COF(Chip On Film)部品、COG(Chip On Glass )部品、TAB(Tape Automated Bonding)部品、フレキシブルプリント基板(FPC基板)、その他の電子部品、機械部品、光学部品などの部品が実装される。   In the manufacture of liquid crystal display panels (LCDs) and plasma display panels (PDPs), TCP (Tape Carrier Package) parts, COF (Chip On Film) parts, COGs are mounted on the mounting portion provided on the side edge of the glass substrate. Components such as (Chip On Glass) components, TAB (Tape Automated Bonding) components, flexible printed circuit boards (FPC substrates), other electronic components, mechanical components, and optical components are mounted.

この種の部品実装基板100は、例えば図11に示すように、基板10の長辺側(ソース側)と短辺側(ゲート側)の2つの側縁部(若しくは3つの側縁部)にそれぞれ複数配設された実装部位のそれぞれに部品11を実装して構成されている。このような部品実装基板100を製造する部品実装装置101は、図12に示すように、実装ラインとして構成しており、その実装ラインにローダ102にて基板10が供給され、洗浄機103にて供給された基板10の実装部位が配設された側縁部が洗浄され、ACF貼付装置104にて各実装部位にACF(異方性導電材)が貼付けられ、仮圧着装置105にて部品供給ユニット106から部品11を順次取り出し、各実装部位に部品11を移載して仮圧着し、基板10の長辺側用と短辺側用の本圧着装置107a、107bにて基板10のそれぞれの側縁部に仮圧着された部品11を本圧着し、製造された部品実装基板100をアンローダ108にて次工程に向けて搬出される。以上のライン全体の制御と各装置の稼動状況に関する各種データの管理がラインコントローラ109にて行われる。   For example, as shown in FIG. 11, this type of component mounting board 100 has two side edges (or three side edges) on the long side (source side) and short side (gate side) of the board 10. Components 11 are mounted on each of a plurality of mounting portions. A component mounting apparatus 101 that manufactures such a component mounting substrate 100 is configured as a mounting line as shown in FIG. 12, and the substrate 10 is supplied to the mounting line by a loader 102, and a cleaning machine 103. The side edge portion where the mounting portion of the supplied substrate 10 is disposed is cleaned, ACF (an anisotropic conductive material) is attached to each mounting portion by the ACF attaching device 104, and the component is supplied by the temporary pressure bonding device 105. The components 11 are sequentially taken out from the unit 106, and the components 11 are transferred to the respective mounting parts and temporarily crimped. The main crimping apparatuses 107a and 107b for the long side and the short side of the substrate 10 The component 11 temporarily bonded to the side edge portion is finally bonded, and the manufactured component mounting board 100 is unloaded by the unloader 108 for the next process. The line controller 109 controls the entire line and manages various data relating to the operating status of each apparatus.

以上のような実装ラインで製造された部品実装基板100の不良発生率を低減するため、実装ラインから搬出された部品実装基板100に対する検査は従来から行われており、その検査として、通電検査とは別に、より品質の安定性を確保するために部品実装基板100を適宜に抜き取って部品実装状態の検査が行われている。   In order to reduce the defect occurrence rate of the component mounting board 100 manufactured by the mounting line as described above, the inspection of the component mounting board 100 carried out from the mounting line has been conventionally performed. In addition, in order to ensure the stability of quality, the component mounting board 100 is appropriately extracted and the component mounting state is inspected.

また、実装ラインに検査装置が配設されている例もあるが、その検査装置としては、基板の側縁部及び部品の実装部が光透過性を有している場合に、基板を基板保持部で保持した状態で実装部位を順次検査位置に位置決めし、検査位置で基板側の実装部位の電極パターン若しくは位置マークと部品側の電極パターン若しくは位置マークを画像認識し、実装部品の位置ずれを検査するようにしたものが知られている。   In addition, there is an example in which an inspection device is provided on the mounting line, but as the inspection device, the substrate is held by the substrate when the side edge portion of the substrate and the mounting portion of the component are light transmissive. The mounting part is sequentially positioned at the inspection position while being held by the part, and the electrode pattern or position mark of the mounting part on the board side and the electrode pattern or position mark on the part side are image-recognized at the inspection position, and the positional deviation of the mounting part is detected What is inspected is known.

また、部品がCOG部品のように、部品の実装部が可視光を透過せずかつ基板及び部品の電極パッドが微小でファインピッチで配設されている場合の検査方法として、基板の電極パッドに対して異方導電材中の導電粒子が圧着されることによって電極パッドに生じる隆起状態を、光透過性を有する基板を通して微分干渉顕微鏡にて観察することで検査する方法が知られている(例えば、特許文献1参照)。   In addition, as an inspection method when the component mounting part does not transmit visible light and the substrate and the electrode pads of the component are arranged in a fine and fine pitch, such as a COG component, On the other hand, there is known a method of inspecting a raised state generated in an electrode pad by pressurizing conductive particles in an anisotropic conductive material by observing with a differential interference microscope through a substrate having optical transparency (for example, , See Patent Document 1).

なお、基板の側縁部の複数の実装部位に仮圧着された部品を本圧着する本圧着装置において、複数の部品を同時に一括して本圧着する時に基板の側縁部を平面状態に保持するために、本圧着時に基板の側縁部を下方から支持するバックアップステージの側部に平行に、基板の側縁部近傍を略その全長にわたって吸着保持して平面状態を保持する反り矯正部を配設し、かつその吸着部にジャバラパッドを配設して基板に反りがあっても確実に吸着保持して平面状態を確保できるようにしたものが知られている(例えば、特許文献2参照)。   In the final crimping apparatus for final pressure-bonding components temporarily bonded to a plurality of mounting sites on the side edge of the substrate, the side edge of the substrate is held in a flat state when the plurality of components are simultaneously finally crimped together. For this reason, a warp correction unit is provided in parallel to the side of the backup stage that supports the side edge of the substrate from below during the main pressure bonding, and holds the vicinity of the side edge of the substrate substantially over its entire length to maintain the flat state. And a bellows pad disposed on the suction portion so that even if the substrate is warped, it can be surely sucked and held to ensure a flat state (see, for example, Patent Document 2). .

また、基板の側縁部の複数の実装部位に部品をボンディングする装置において、移動手段にて水平なX方向と、X方向と直交するY方向と、垂直なZ方向と、垂直軸心回りのθ方向に移動及び位置決め可能な基板保持部にて基板の略中央部を吸着保持し、基板保持部とは別に基板の側縁部を下方から吸着して支持する支持部を配設して、X方向には基板保持部と連動して移動し、Y方向には移動自在に、かつZ方向に昇降可能に構成し、部品のボンディング動作に際して、支持部を退避位置に下降させた状態で、基板保持部で保持した基板をY方向に移動させてその側縁部を支持部の上方に位置させた後、支持部を上昇させて基板の側縁部を吸着して支持し、その状態で基板保持部をY方向及びX方向に移動させて基板の側縁部の最初の実装部位をボンディング位置に位置決めし、その実装部位の位置を認識し、次に部品をボンディング位置に移載し実装部位に当接させた状態で部品の位置を認識し、その認識結果に応じて、部品を退避上昇させてθ位置を補正するとともに基板の側縁部を支持部で吸着保持したまま基板保持部にてX−Y位置を補正した後、部品をボンディングし、その後、基板の側縁部を支持部にて吸着保持した状態を維持したままの状態で基板保持部にて基板をX方向に移動させることで、次の実装部位をボンディング位置に位置させ、上記と同様に部品をボンディングするという動作を繰り返すことで、複数の実装部位に部品を順次ボンディングするようにしたものが知られている(例えば、特許文献3参照)。
特開2003−269934号公報 特開2006−24797号公報 特許第3633493号明細書
Further, in the apparatus for bonding components to a plurality of mounting portions on the side edge of the board, the horizontal X direction, the Y direction orthogonal to the X direction, the vertical Z direction, and the vertical axis around the moving means are used. A substrate holding part that can be moved and positioned in the θ direction sucks and holds the substantially central part of the substrate, and separately from the substrate holding part, a support part that sucks and supports the side edge of the substrate from below is arranged, It moves in conjunction with the substrate holding part in the X direction, is movable in the Y direction and can be moved up and down in the Z direction, and in the state where the support part is lowered to the retracted position during the bonding operation of the components, After the substrate held by the substrate holding part is moved in the Y direction and its side edge is positioned above the support part, the support part is raised and the side edge part of the substrate is sucked and supported. First mounting of the side edge of the board by moving the board holding part in the Y and X directions Positioning the position at the bonding position, recognizing the position of the mounting part, then recognizing the position of the part in a state where the part is transferred to the bonding position and in contact with the mounting part, and according to the recognition result, The component is retracted and lifted to correct the θ position, and after correcting the XY position at the substrate holding portion while the side edge portion of the substrate is sucked and held by the support portion, the component is bonded, and then the side edge of the substrate By moving the board in the X direction with the board holding part while maintaining the state where the part is sucked and held by the support part, the next mounting site is positioned at the bonding position, and the parts are bonded in the same manner as above. It is known that components are sequentially bonded to a plurality of mounting parts by repeating the operation of performing (see, for example, Patent Document 3).
JP 2003-269934 A JP 2006-24797 A Japanese Patent No. 3633493

ところで、従来のように実装ラインから搬出された部品実装基板を適宜に抜き取って実装状態の検査を行っていたのでは、実装エラーを検出するまでに時間がかかって応答性良く対策を取ることができず、エラー対策の遅れによって高品質の基板を効率的にかつ安定して生産することができないという問題がある。   By the way, if the component mounting board carried out from the mounting line is appropriately removed and the mounting state is inspected as before, it takes time to detect a mounting error and measures can be taken with good responsiveness. However, there is a problem that high-quality substrates cannot be produced efficiently and stably due to delays in error countermeasures.

また、従来の実装ラインに配設されている検査装置では、分解能が比較的低く焦点深度の深い認識カメラが用いられ、実装部位における電極及びその配列ピッチが大きい基板に対して適用されているが、近年は基板及び部品が高精細化して実装部位及び部品における電極及びその配列ピッチが精細になっているため、それにともない高い分解能の認識カメラで画像認識する必要があり、その場合焦点深度が浅くなる。
また、その一方で近年は基板の薄型化・大型化が進行しているために基板を基板保持部で保持した状態では基板の側縁部に反りが発生し、そのため分解能が高く焦点深度の浅い認識カメラでは安定して画像認識できず、信頼性の高い検査が困難であるという問題がある。
In addition, in a conventional inspection apparatus arranged on a mounting line, a recognition camera having a relatively low resolution and a deep depth of focus is used, which is applied to an electrode in a mounting region and a substrate having a large arrangement pitch. In recent years, the substrate and components have become more precise, and the electrodes and arrangement pitches of the mounting parts and components have become finer. Accordingly, it is necessary to recognize images with a high resolution recognition camera, in which case the depth of focus is shallow. Become.
On the other hand, in recent years, since the substrate has become thinner and larger, when the substrate is held by the substrate holding part, the side edge of the substrate is warped, so that the resolution is high and the depth of focus is shallow. There is a problem in that a recognition camera cannot stably recognize an image and it is difficult to perform a highly reliable inspection.

また、特許文献1に記載された検査装置は、基板を透過して各部品の電極に対して異方性導電材中の導電粒子による接合状態を検査するものであり、各部品の電極ごとに画像認識して検査するため、1つの部品の検査にも時間がかかり、実装ラインにおける動作タクトに合わせ、検査する検査装置に、効率的に適用することは困難であるという問題がある。   Moreover, the inspection apparatus described in Patent Document 1 is for inspecting the bonding state of the conductive particles in the anisotropic conductive material with respect to the electrodes of each component through the substrate, and for each electrode of each component. Since an image is recognized and inspected, it takes time to inspect one component, and there is a problem that it is difficult to efficiently apply it to an inspection apparatus that inspects in accordance with an operation tact on a mounting line.

なお、特許文献2には、基板の側縁部の近傍を吸着保持して基板の反りを解消した状態で、側縁部に配設された複数の実装部位に対する本圧着を一度に一括して行うようにした部品実装装置が開示されているが、固定設置された反り矯正部にて基板の側縁部を吸着保持したままで、複数の実装部位に対して一度に本圧着するものである。高精度に検査する
ため、固定設置した高精度の認識カメラにて、基板の側縁部に実装された複数の部品の実装状態を、基板を順次移動させて検査する検査装置に効率的に適用することは困難である。
Note that Patent Document 2 collectively applies main pressure bonding to a plurality of mounting portions disposed on the side edge at a time in a state where the vicinity of the side edge of the substrate is sucked and held to eliminate the warpage of the board. Although the component mounting apparatus is disclosed, it is intended to perform a main pressure bonding to a plurality of mounting parts at a time while the side edge portion of the substrate is sucked and held by a warp correction unit fixedly installed. . In order to inspect with high precision, it can be efficiently applied to inspection equipment that inspects the mounting state of multiple components mounted on the side edge of the board by sequentially moving the board with a high-precision recognition camera fixedly installed It is difficult to do.

また、特許文献3には、基板の側縁部の複数の実装部位に部品をボンディングするため、基板の側縁部を支持部で吸着保持して支持しているため、基板に実装した部品の実装状態を、基板を通して画像認識することはできず、またその支持部が基板保持部とX方向に連動して移動・位置決めされるように構成されているが、部品をボンディングする際にX−Y方向の位置補正を行うために、Y方向にも移動可能に構成されているので、支持部自体の位置精度を高くすることが困難であり、実装状態の部品の位置ずれを高精度に画像認識して検査するのが困難であるという問題がある。   Further, in Patent Document 3, since components are bonded to a plurality of mounting portions on the side edge of the substrate, the side edge of the substrate is supported by being sucked and held by the support portion. The mounting state cannot be recognized through the board, and the support part is configured to move and position in conjunction with the board holding part in the X direction. Since it is configured to be movable in the Y direction in order to correct the position in the Y direction, it is difficult to increase the positional accuracy of the support itself, and the positional deviation of the mounted components can be imaged with high accuracy. There is a problem that it is difficult to recognize and inspect.

また、本出願人は先に、可視光を透過する基板の側縁部に可視光を透過しないシリコンチップなどの部品を実装した部品実装基板における部品の位置ずれを検査する検査装置として、基板の実装部位に設けられた位置マークを、可視光を照射して画像認識し、実装された部品の実装面に設けられた認識マークを、部品を透過する赤外光を照射して画像認識するようにしたものを提案している(特願2007−255363号参照)。   In addition, the applicant of the present invention, as an inspection apparatus for inspecting the positional deviation of a component on a component mounting substrate in which a component such as a silicon chip that does not transmit visible light is mounted on the side edge of the substrate that transmits visible light. Image recognition is performed by irradiating visible light on the position mark provided on the mounting site, and image recognition is performed on the recognition mark provided on the mounting surface of the mounted component by irradiating infrared light that passes through the component. (See Japanese Patent Application No. 2007-255363).

しかし、この検査装置を実装ラインに配設する場合、図13に示すように、固定して設定された検査位置110の下部に基板10の実装部位に設けられた位置マークを認識する認識カメラ111を配設し、検査位置110の上部に実装された部品に設けられた認識マークを認識する認識カメラ112を配設し、検査位置110の側部に基板の検査対象の実装部位の側部を吸着保持して基板の反りを矯正する反り矯正部113を配設して、高精度で焦点深度の浅い認識カメラ111、112で安定して画像認識できる構成とすることが考えられる。そして、このような構成では、検査に当たっては検査対象部位の側部を反り矯正部113で吸着保持した状態で画像認識して検査し、次に吸着を解除した後、基板10の実質的な中央を保持している基板保持部(図示せず)を上昇させ、次の検査対象の部品が検査位置110に位置するように基板保持部(図示せず)を移動させた後下降させ、検査対象部位の側部を反り矯正部113で吸着保持した後画像認識して検査するという動作を繰り返すことになる。しかし、これでは動作に時間がかかるため、実装ラインのタクトに合わせて各部品の実装状態を検査するのは困難であるという問題があり、基板の側縁部に実装された部品を順次検査位置に移動させながら、基板の側縁部の反りを矯正して高精度で焦点深度の浅い認識カメラで高い信頼性をもって安定して画像認識できる検査装置を得ることが課題として残っている。   However, when this inspection apparatus is disposed on the mounting line, as shown in FIG. 13, a recognition camera 111 that recognizes a position mark provided on the mounting portion of the substrate 10 below the fixedly set inspection position 110. And a recognition camera 112 for recognizing a recognition mark provided on a component mounted on the upper portion of the inspection position 110, and a side portion of the mounting portion to be inspected on the substrate on the side portion of the inspection position 110. It is conceivable that a warp correction unit 113 that corrects the warp of the substrate by sucking and holding is provided so that the recognition cameras 111 and 112 with high accuracy and shallow depth of focus can stably recognize an image. In such a configuration, in the inspection, the side portion of the inspection target part is image-recognized and inspected in a state where the side portion of the inspection target is adsorbed and held by the warp correction unit 113, and then the adsorbing is released. The substrate holding portion (not shown) holding the substrate is raised, the substrate holding portion (not shown) is moved so that the next component to be inspected is located at the inspection position 110, and then lowered. The operation of recognizing and inspecting the image after the side portion of the part is sucked and held by the warp correction unit 113 is repeated. However, since this takes time to operate, there is a problem that it is difficult to inspect the mounting state of each component according to the tact of the mounting line, and the components mounted on the side edges of the board are sequentially inspected. However, it remains a problem to obtain an inspection apparatus that can correct the warp of the side edge of the substrate while moving it to a high degree of accuracy and stably recognize an image with a recognition camera with a shallow depth of focus.

本発明は、上記従来の問題に鑑み、基板の側縁部に実装された複数の部品の実装位置ずれを高精度にかつ短いタクトで効率良く検査することができる部品実装基板の検査方法と装置及び部品実装装置を提供することを目的とする。   In view of the above-described conventional problems, the present invention provides a component mounting board inspection method and apparatus capable of efficiently inspecting a mounting position shift of a plurality of components mounted on a side edge of a substrate with high accuracy and with a short tact. And it aims at providing a component mounting apparatus.

本発明の部品実装基板の検査方法は、基板の側縁部に設けられた複数の実装部位に実装された各部品の実装位置ずれを検査する検査方法であって、部品が実装された基板の側縁部の近傍位置を側縁部の長手方向に移動可能な反り矯正部にて側縁部の実質的な全長にわたって吸着保持する反り矯正工程と、反り矯正部にて基板の側縁部の近傍位置を吸着保持したまま、反り矯正部とともに基板を側縁部の長手方向に移動させて、各部品の実装位置を順次所定の検査位置に位置決めする移動・位置決め工程と、所定の検査位置にて検査可能に固定して設置された画像認識手段で、その検査位置に位置決めされた部品の実装位置を画像認識し、基板に実装された各部品の実装位置ずれを検査する検査工程と、を有するものである。   The component mounting board inspection method of the present invention is an inspection method for inspecting a mounting position shift of each component mounted on a plurality of mounting portions provided on a side edge portion of the board, and the inspection method of the board on which the component is mounted. A warp correction step of adsorbing and holding the position near the side edge in the longitudinal direction of the side edge in the longitudinal direction of the side edge over the substantially entire length of the side edge, and the side edge of the substrate at the warp correction part While moving the substrate in the longitudinal direction of the side edge part with the warp correction part while holding the vicinity position by suction, a moving / positioning process for sequentially positioning the mounting position of each component at the predetermined inspection position, and the predetermined inspection position An image recognition means fixedly installed so as to be inspected, image-recognizing the mounting position of the component positioned at the inspection position, and inspecting the mounting position deviation of each component mounted on the board, It is what you have.

この構成によれば、複数の部品が実装された基板の側縁部近傍位置を反り矯正部で実質的な全長にわたって吸着保持した状態で、基板を側縁部の長手方向に移動させて各部品の実装位置を順次所定の検査位置に位置決めし、画像認識によって各部品の実装位置ずれを検査するので、基板の側縁部の平面度を保持して画像認識することができて焦点深度の浅い高精度の認識カメラにて高精細度で検査することができ、しかも基板の側縁部を吸着保持したまま基板を側縁部の長手方向に移動させ、各部品の実装位置を検査位置に順次位置決めして複数の部品の検査を行うので、短いタクトで検査することができ、実装ラインに配設してもその実装タクトに合わせることができる。   According to this configuration, each component is moved by moving the substrate in the longitudinal direction of the side edge in a state where the vicinity of the side edge of the substrate on which a plurality of components are mounted is sucked and held by the warp correction unit over the substantially entire length. Since the mounting position of each part is sequentially positioned at a predetermined inspection position and the mounting position deviation of each component is inspected by image recognition, the image can be recognized while maintaining the flatness of the side edge of the board, and the depth of focus is shallow. The high-precision recognition camera can inspect with high definition, and the board is moved in the longitudinal direction of the side edge while holding the side edge of the board by suction, and the mounting position of each component is sequentially set to the inspection position. Since a plurality of components are inspected by positioning, the inspection can be performed with a short tact, and even if arranged on the mounting line, it can be adjusted to the mounting tact.

また、検査工程が、基板の実装部位に設けられた位置マークを、基板を透過する第1の検査光を照射して画像認識する基板マーク認識工程と、実装された部品の実装面に設けられた認識マークを、部品を透過する第2の検査光を照射して画像認識する部品マーク認識工程とを有すると、基板の実装部位と部品の実装面の間に異方性導電材の無数の微細な導電粒子が存在し、かつ部品がシリコンチップなどの可視光を透過しない部品である場合でも、異方性導電材の導電粒子の影響を受けることなく、基板の実装部位に設けられた位置マークを、基板を通して認識するとともに部品の実装面に設けられた位置マークを、部品を通して認識することができるので、部品の実装位置の位置ずれを確実に検査することができる。   In addition, an inspection process is provided on a board mark recognition process for recognizing an image by irradiating a first inspection light transmitted through the board with a position mark provided on a mounting part of the board, and on a mounting surface of a mounted component. And a component mark recognition step for recognizing an image by irradiating the second inspection light that passes through the component, and innumerable anisotropic conductive materials between the mounting portion of the substrate and the mounting surface of the component. Even when fine conductive particles are present and the component is a component that does not transmit visible light, such as a silicon chip, the position provided on the mounting part of the substrate without being affected by the conductive particles of the anisotropic conductive material Since the mark can be recognized through the board and the position mark provided on the mounting surface of the component can be recognized through the component, it is possible to surely inspect the displacement of the mounting position of the component.

また、本発明の部品実装基板の検査装置は、基板の側縁部に設けられた複数の実装部位に実装された各部品の実装位置ずれを検査する検査装置であって、固定した位置の所定認識位置にて基板に実装された部品の実装位置を画像認識する画像認識手段と、基板を保持して各実装部位を順次所定の検査位置に移動させ位置決めする移動手段と、基板の実装部位が設けられた側縁部の近傍を吸着保持し、側縁部の長手方向に沿った一方向にのみ移動自在な反り矯正部と、基板の側縁部の長手方向に沿う方向の移動に連動するように、移動手段と反り矯正部とを連結する連結手段とを備えたものである。   The component mounting board inspection apparatus of the present invention is an inspection apparatus for inspecting mounting position deviations of components mounted on a plurality of mounting portions provided on a side edge portion of a board, and is a predetermined fixed position. Image recognition means for recognizing the mounting position of the component mounted on the board at the recognition position, moving means for holding the board and sequentially moving each mounting part to a predetermined inspection position, and a mounting part for the board The vicinity of the provided side edge portion is sucked and held, and the warp correction portion that is movable only in one direction along the longitudinal direction of the side edge portion is interlocked with the movement in the direction along the longitudinal direction of the side edge portion of the substrate. As described above, a connecting means for connecting the moving means and the warp correction portion is provided.

この構成によると、複数の部品が実装された基板の側縁部の近傍位置を、側縁部の長手方向に移動可能な反り矯正部により、側縁部の実質的な全長にわたって吸着保持した状態のままで、基板を側縁部の長手方向に沿って移動させて各部品の実装位置を順次、固定した位置の所定の検査位置に位置決めし、画像認識によって各部品の実装位置ずれを検査することができ、上記のように基板の側縁部の平面度を保持できて焦点深度の浅い高精度の認識カメラにて高精細度で検査することができ、しかも基板の側縁部を吸着保持したまま各部品の実装位置を検査位置に順次位置決めして複数の部品の検査を行うので、短いタクトで検査することができる。   According to this configuration, the vicinity of the side edge portion of the substrate on which a plurality of components are mounted is sucked and held over the substantially entire length of the side edge portion by the warp correction portion that can move in the longitudinal direction of the side edge portion. The substrate is moved along the longitudinal direction of the side edge portion so that the mounting position of each component is sequentially positioned at a predetermined inspection position of the fixed position, and the mounting position deviation of each component is inspected by image recognition. As described above, the flatness of the side edge of the substrate can be maintained, and it can be inspected with high precision by a high-precision recognition camera with a shallow depth of focus, and the side edge of the substrate is held by suction. In this state, the mounting position of each component is sequentially positioned at the inspection position to inspect a plurality of components, so that the inspection can be performed with a short tact.

また、画像認識手段が、基板の実装部位に設けられた位置マークを、基板を透過する第1の検査光を照射して画像認識する第1の認識手段と、実装された部品の実装面に設けられた認識マークを、部品を透過する第2の検査光を照射して画像認識する第2の認識手段から成ると、基板の実装部位と部品の実装面の間に異方性導電材の無数の微細な導電粒子が存在し、かつ部品がシリコンチップなどの可視光を透過しない部品である場合でも、異方性導電材の導電粒子の影響を受けることなく、基板の実装部位に設けられた位置マークを、基板を通して認識するとともに部品の実装面に設けられた位置マークを、部品を通して認識して部品の実装位置の位置ずれを確実に検査することができる。   In addition, the image recognition means irradiates the first inspection light that passes through the board with the position mark provided on the mounting portion of the board and recognizes the image on the mounting surface of the mounted component. When the provided recognition mark comprises the second recognition means for recognizing the image by irradiating the second inspection light passing through the component, an anisotropic conductive material is formed between the mounting portion of the substrate and the mounting surface of the component. Even if there are countless fine conductive particles and the component is a component that does not transmit visible light such as a silicon chip, it is not affected by the conductive particles of the anisotropic conductive material and is provided at the mounting part of the substrate. The position mark can be recognized through the board and the position mark provided on the mounting surface of the component can be recognized through the component to accurately inspect the displacement of the mounting position of the component.

また、移動手段を、基板搬送方向及び反り矯正部の長手方向と平行なX方向に移動するXテーブルと、Xテーブルの可動部上に配設されX方向と直交するY方向に移動するYテーブルと、Yテーブルの可動部上にX−Y平面に対して垂直なZ方向に昇降及び垂直軸心回りのθ方向に回転可能に配設され基板の実質的な中央部を保持可能な基板保持部とを備え、Y方向の移動が固定された反り矯正部とYテーブルの可動部との間を連結したままで、Y軸テーブルの可動部をY方向にスライド自在に連結する連結手段を設け、反り矯正部の長手方向と平行なX方向に、X軸テーブルを移動させることにより、X軸テーブルの移動とともに反り矯正部を移動させた構成とすると、連結手段にて反り矯正部を基板保持部のX方向のみの移動に連動して移動させることができ、基板のX方向の移動に完全に同期して基板の側縁部近傍を反り矯正部で吸着保持した状態で基板の側縁部をX方向に移動・位置決めすることができ、簡単な構成にて効率的にかつ精度良く位置ずれ検査を行うことができる。   The moving means includes an X table that moves in the X direction parallel to the substrate transport direction and the longitudinal direction of the warp correction unit, and a Y table that is disposed on the movable part of the X table and moves in the Y direction perpendicular to the X direction. And a substrate holder that can be moved up and down in the Z direction perpendicular to the XY plane and rotated in the θ direction around the vertical axis on the movable part of the Y table to hold the substantial center portion of the substrate. And a connecting means for slidably connecting the movable part of the Y-axis table in the Y direction while connecting the warp correcting part fixed in the Y direction and the movable part of the Y table. When the X-axis table is moved in the X direction parallel to the longitudinal direction of the warp correction part, the warp correction part is moved together with the movement of the X-axis table. In conjunction with the movement of only the X direction The side edge of the substrate can be moved and positioned in the X direction in a state in which the vicinity of the side edge of the substrate is sucked and held by the warp correction unit in complete synchronization with the movement of the substrate in the X direction. Thus, it is possible to perform the positional deviation inspection efficiently and accurately with a simple configuration.

また、本発明の部品実装装置は、以上の部品実装基板の検査装置を、基板の実装部位に異方性導電材を貼付ける異方性導電材貼付装置と、実装部位に貼付けられた異方性導電材を介して部品を基板の実装部位に仮圧着する仮圧着装置と、仮圧着された部品を本圧着する本圧着装置とを配設した実装ラインにおいて、実装ライン内の本圧着装置の後段側の実装ライン下流側に配設したものであり、基板に部品を実装する実装ライン内で実装状態の検査を行うことができる。   Further, the component mounting apparatus of the present invention includes the above component mounting board inspection apparatus, an anisotropic conductive material pasting apparatus for pasting an anisotropic conductive material to a mounting part of the board, and an anisotropic part pasted to the mounting part. In a mounting line in which a temporary crimping device for temporarily crimping a component to a mounting portion of a substrate via a conductive conductive material and a final crimping device for final crimping a temporarily crimped component are disposed, It is arranged downstream of the mounting line on the rear stage side, and the mounting state can be inspected in the mounting line for mounting components on the board.

また、検査装置による検査結果データを分析して位置ずれエラーの発生原因を解析し、位置ずれエラーの原因となった装置に補正データをフィードバックする制御部を設けると、検査装置による検査結果に基づいて各実装装置をフィードバック制御することができ、応答性良くエラー要因に対する対策を行うことができて、高品質の基板を効率的にかつ安定して生産することができる。   In addition, by analyzing the inspection result data by the inspection device to analyze the cause of the misalignment error, and providing a control unit that feeds back correction data to the device causing the misalignment error, based on the inspection result by the inspection device Thus, each mounting apparatus can be feedback-controlled, measures against error factors can be taken with good responsiveness, and high-quality boards can be produced efficiently and stably.

本発明の部品実装基板の検査方法及び装置によれば、複数の部品が実装された基板の側縁部の近傍位置を、側縁部の長手方向に移動可能な反り矯正部により、側縁部の実質的な全長にわたって吸着保持した状態のままで、基板を側縁部の長手方向に沿って移動させて各部品の実装位置を順次、固定した位置の所定の検査位置に位置決めし、画像認識によって各部品の実装位置ずれを検査するので、基板の側縁部の平面度を保持して画像認識することができて焦点深度の浅い高精度の認識カメラにて高精細度で検査することができ、しかも基板の側縁部近傍を吸着保持したまま基板を側縁部の長手方向に移動させ、各部品の実装位置を検査位置に順次位置決めして複数の部品の検査を行うので、短いタクトで検査することができ、実装ラインに配設してもその実装タクトに合わせることができる。   According to the component mounting board inspection method and apparatus of the present invention, the side edge portion can be moved near the side edge portion of the board on which a plurality of components are mounted by the warp correction portion that can move in the longitudinal direction of the side edge portion. With the substrate held in a substantially full length, the substrate is moved along the longitudinal direction of the side edge, and the mounting positions of each component are sequentially positioned at a predetermined inspection position, and image recognition is performed. Since the mounting position deviation of each component is inspected, the image can be recognized while maintaining the flatness of the side edge of the board, and it can be inspected with high precision by a high-precision recognition camera with a shallow depth of focus. In addition, since the board is moved in the longitudinal direction of the side edge while holding the vicinity of the side edge of the board by suction, the mounting position of each component is sequentially positioned at the inspection position to inspect a plurality of parts. Can be inspected in the mounting line Even if the set can be matched to the mounting tact.

以下、本発明を、LCDやPDPのガラス基板などの基板の側縁部に複数の部品を実装する部品実装装置の実装ラインに配設した部品実装基板の検査装置の一実施形態について、図1〜図10を参照して説明する。   Hereinafter, an embodiment of an inspection apparatus for a component mounting board in which the present invention is disposed in a mounting line of a component mounting apparatus for mounting a plurality of components on a side edge portion of a substrate such as an LCD or PDP glass substrate will be described with reference to FIG. Description will be made with reference to FIG.

図1において、1は実装ラインとして構成された部品実装装置であり、その実装ラインに基板10を供給するローダ2と、実装部位10cが配設されている基板10の側縁部を洗浄する洗浄機3と、基板10の各実装部位10cにACF(異方性導電材)を貼り付けるACF貼付装置4と、部品供給ユニット6から部品を順次取り出し、基板10の各実装部位10cに部品11を移載し、実装部位10cに貼付けられた異方性導電材を介して部品を基板の実装部位10cに加熱しつつ押圧して仮圧着する仮圧着装置5と、基板10の長辺側と短辺側の側縁部に仮圧着された部品11をそれぞれ仮圧着よりも高い温度と押圧力にて加熱しつつ押圧して本圧着する長辺側と短辺側の本圧着装置7a、7bと、本圧着装置7a、7bの後段側の実装ライン下流側にて、基板10の側縁部に部品11が実装された部品実装基板100における部品11の実装位置ずれを検査する検査装置8と、検査済の部品実装基板100を次工程に向けて搬出するアンローダ9にて構成されている。   In FIG. 1, reference numeral 1 denotes a component mounting apparatus configured as a mounting line. A loader 2 for supplying a substrate 10 to the mounting line and a cleaning for cleaning a side edge portion of the substrate 10 on which a mounting portion 10c is disposed. The parts are sequentially taken out from the machine 3, the ACF attaching device 4 for attaching an ACF (anisotropic conductive material) to each mounting portion 10 c of the substrate 10, and the component supply unit 6, and the component 11 is attached to each mounting portion 10 c of the substrate 10. Temporary pressure bonding device 5 that transfers and presses and temporarily presses components to mounting portion 10c of the substrate via an anisotropic conductive material attached to mounting portion 10c, and the long side and short side of substrate 10 Long-side and short-side main crimping devices 7a and 7b that press and heat-bond the parts 11 temporarily crimped to the side edges of the sides at higher temperatures and pressing forces than the temporary crimping, respectively. , Mounting on the rear side of the main crimping devices 7a and 7b On the downstream side, the inspection device 8 for inspecting the mounting position deviation of the component 11 on the component mounting substrate 100 in which the component 11 is mounted on the side edge of the substrate 10 and the inspected component mounting substrate 100 are directed to the next process. The unloader 9 is carried out.

以上の部品実装装置1の実装ラインの各装置2〜9は制御部12にて制御され、また制
御部12は各装置2〜9の稼動状況に関する各種データの管理が行われている。さらに、本実施形態の制御部12では、検査装置8による検査データが検査データ格納部13に格納されるとともに、そのデータが検査結果解析部14で分析されてエラー発生傾向が認められると未然にその要因の解析が行われ、その解析結果に基づいてフィードバック制御データ作成部15で関係する装置に対する補正データを作成して当該装置にフィードバックするように構成されている。
The devices 2 to 9 on the mounting line of the component mounting device 1 are controlled by the control unit 12, and the control unit 12 manages various data related to the operating status of the devices 2 to 9. Further, in the control unit 12 of the present embodiment, the inspection data by the inspection device 8 is stored in the inspection data storage unit 13, and when the data is analyzed by the inspection result analysis unit 14 and an error occurrence tendency is recognized, The factor is analyzed, and based on the analysis result, the feedback control data creation unit 15 creates correction data for the related device and feeds back to the device.

検査装置8は、図2〜図5に示すように、架台16上に、基板10に部品11が実装されている部品実装基板100を搬入する搬送手段17と、搬入された部品実装基板100の実質的な中央部を基板保持部19にて吸着保持可能にして移動・位置決めする移動手段18と、部品11が実装された基板10の側縁部の実装部位10cより基板中央側に向かって内側である基板10の側縁部の近傍を吸着保持する反り矯正部20と、基板10の側縁部に配設された実装部位10cに実装された部品11に、上方から部品11を透過する赤外光を照射して部品11の実装面11cに設けられている位置マーク11a(図7、図8(a)参照)を画像認識する赤外光カメラからなる第1の認識手段21と、基板10の側縁部の各実装部位10cに設けられている位置マーク10a(図7、図8(b)参照)に基板10の下方から可視光を照射して画像認識する可視光カメラからなる第2の認識手段22とを備えている。   As shown in FIGS. 2 to 5, the inspection apparatus 8 includes a transfer means 17 that carries a component mounting board 100 on which a component 11 is mounted on a board 10, and a component mounting board 100 that has been loaded. A moving means 18 that moves and positions a substantial center portion so that the substrate holding portion 19 can suck and hold, and a mounting portion 10c at a side edge portion of the substrate 10 on which the component 11 is mounted, toward the center side of the substrate. The warp correction portion 20 that sucks and holds the vicinity of the side edge portion of the substrate 10 and the component 11 mounted on the mounting portion 10c disposed on the side edge portion of the substrate 10 are transmitted through the component 11 from above. A first recognizing means 21 composed of an infrared light camera for irradiating external light and recognizing an image of a position mark 11a (see FIGS. 7 and 8A) provided on the mounting surface 11c of the component 11; 10 on each mounting portion 10c on the side edge Its dependent position mark 10a and a second recognition means 22 comprising a lower substrate 10 is irradiated with visible light from the image recognizing visible light camera (Fig. 7, and FIG. 8 (b) refer).

搬送手段17は、実装ラインにおける基板10の搬送方向であるX方向と直交するY方向の手前側に配設されており、部品実装基板11のX方向の両側部を下方から支持する一対のアーム23aを有する支持アーム部23と、支持アーム部23をX方向に移動自在に支持するガイド部24と、支持アーム部23をX方向に往復移動させる移動機構25にて構成されている。移動機構25は、支持アーム部23に連結されたナット25aとボールねじ軸25bを回転駆動するモータ25cから成る送りねじ機構にて構成されている。   The transport means 17 is disposed on the near side in the Y direction orthogonal to the X direction, which is the transport direction of the substrate 10 in the mounting line, and a pair of arms that support both sides in the X direction of the component mounting substrate 11 from below. The support arm unit 23 includes a support arm unit 23, a guide unit 24 that supports the support arm unit 23 movably in the X direction, and a moving mechanism 25 that reciprocates the support arm unit 23 in the X direction. The moving mechanism 25 includes a feed screw mechanism including a nut 25a connected to the support arm portion 23 and a motor 25c that rotationally drives the ball screw shaft 25b.

移動手段18は、架台16上のY方向の中間部に配設され、X軸テーブル26とY軸テーブル27とによってX−Y方向に移動及び位置決め可能な可動部28上にZ軸方向の昇降及びθ方向の回転が可能な昇降回転機構29を介して基板保持部19を配設して構成されている。基板保持部19には基板10の実質的な中央部を吸着保持する吸着手段(図示せず)が配設されている。   The moving means 18 is disposed at the intermediate portion in the Y direction on the gantry 16, and is moved up and down in the Z axis direction on the movable portion 28 that can be moved and positioned in the XY direction by the X axis table 26 and the Y axis table 27. The substrate holding unit 19 is disposed via an elevating and rotating mechanism 29 that can rotate in the θ direction. The substrate holding portion 19 is provided with a suction means (not shown) for sucking and holding the substantial center portion of the substrate 10.

反り矯正部20は、架台16上でY方向に、移動手段18を間に挟んで搬送手段17とは反対側に設けられ、X方向に沿って配設されている。具体的には、X方向に沿ってステージ30が配設され、このステージ30上にガイドレール31がX方向に延設され、このガイドレール31に沿って移動自在な複数のスライドガイド32を介して長尺の吸着固定部材33がX方向に移動自在に配設されている。吸着固定部材33は、基板10の実装部位10cを配設した側縁部の近傍の基板10の下面を、少なくとも実装部位10cの配設領域を含む略全長にわたって吸着保持する長さを有しており、その長手方向に適当間隔置きに、吸引手段(図示せず)に接続された吸着穴34が配設されている。さらに、図6(a)、(b)に示すように、各吸着穴34には、その内部に退入可能に吸着固定部材33の上面から突出するジャバラパット35が配設され、図6(a)に示すように、吸着固定部材33上に基板10の側縁部の近傍が反りのある状態で載置されても、ジャバラパット35が確実に基板10の下面に密着し、その状態で吸着穴34から吸引することで、図6(b)に示すように、吸着固定部材33の上面に基板10の側縁部の近傍を密着させて平面状態に矯正して吸着固定するように構成されている。   The warp correction unit 20 is provided on the gantry 16 in the Y direction, on the side opposite to the conveying unit 17 with the moving unit 18 interposed therebetween, and is disposed along the X direction. Specifically, a stage 30 is disposed along the X direction, and a guide rail 31 extends in the X direction on the stage 30, and a plurality of slide guides 32 that are movable along the guide rail 31 are interposed. A long suction fixing member 33 is arranged to be movable in the X direction. The suction fixing member 33 has a length for sucking and holding the lower surface of the substrate 10 in the vicinity of the side edge portion where the mounting portion 10c of the substrate 10 is disposed over substantially the entire length including the mounting region of the mounting portion 10c. In the longitudinal direction, suction holes 34 connected to suction means (not shown) are arranged at appropriate intervals. Further, as shown in FIGS. 6A and 6B, each suction hole 34 is provided with a bellows pad 35 protruding from the upper surface of the suction fixing member 33 so as to be retractable. As shown in a), even if the vicinity of the side edge portion of the substrate 10 is placed on the suction fixing member 33 in a warped state, the bellows pad 35 is securely attached to the lower surface of the substrate 10 and in this state By sucking from the suction hole 34, as shown in FIG. 6B, the vicinity of the side edge portion of the substrate 10 is brought into close contact with the upper surface of the suction fixing member 33 so as to be corrected to a flat state and fixed by suction. Has been.

図3、図4に示すように、吸着固定部材33は、移動手段18の可動部28のX方向の移動のみに連動してX方向に移動するように、連結手段36にて可動部28に連結されている。連結手段36は、具体的には、可動部28のX方向の一側端にY方向のスライドガ
イド37が配設され、このスライドガイド37によってY方向に移動自在に支持されたガイドレール38がL字連結杆39の水平杆部39aの側面に固定され、L字連結杆39の垂直杆部39bの上端側が吸着固定部材33に連結固定されている。
As shown in FIGS. 3 and 4, the suction fixing member 33 is moved to the movable portion 28 by the connecting means 36 so as to move in the X direction only in conjunction with the movement of the movable portion 28 of the moving means 18 in the X direction. It is connected. Specifically, the connecting means 36 is provided with a slide guide 37 in the Y direction at one end of the movable portion 28 in the X direction, and a guide rail 38 supported by the slide guide 37 so as to be movable in the Y direction. The L-shaped coupling rod 39 is fixed to the side surface of the horizontal collar portion 39 a, and the upper end side of the vertical collar portion 39 b of the L-shaped coupling rod 39 is coupled and fixed to the suction fixing member 33.

図3〜図5、図7に示すように、第1の認識手段21と第2の認識手段22は、部品実装基板100の部品11が実装されている基板10の側縁部の近傍を吸着固定部材33にて吸着固定した状態で吸着固定部材33をX方向に移動させたときに部品11が通過する位置に設定された検査位置40を通る垂直軸心にその光軸の軸心を一致させて配設されている。第1の認識手段21は、シリコンチップから成る部品11を透過してその実装面11cに設けられた位置マーク11aに照射する赤外光を出力する赤外光照明手段21aを有する赤外光(IR)カメラにて構成され、第2の認識手段22は、基板10を透過して基板10の側縁部の上面に設けられた位置マーク10aに照射する可視光を出力する可視光照明手段22aを有する可視光カメラにて構成されている。   As shown in FIG. 3 to FIG. 5 and FIG. 7, the first recognizing means 21 and the second recognizing means 22 adsorb the vicinity of the side edge portion of the substrate 10 on which the component 11 of the component mounting substrate 100 is mounted. When the suction fixing member 33 is moved in the X direction with the fixing member 33 sucked and fixed, the axis of the optical axis coincides with the vertical axis passing through the inspection position 40 set to the position where the component 11 passes. Are arranged. The first recognizing means 21 has infrared light (infrared light) 21a that transmits infrared light that passes through the component 11 made of a silicon chip and irradiates the position mark 11a provided on the mounting surface 11c. IR) camera, and the second recognizing means 22 transmits visible light that passes through the substrate 10 and irradiates the position mark 10 a provided on the upper surface of the side edge of the substrate 10. It is comprised with the visible light camera which has.

これら第1の認識手段21と第2の認識手段22による実装位置ずれを検査する要領について説明すると、部品実装状態では、図7に示すように、基板10の実装部位10cの電極10bと、部品11の電極11bが異方性導電材の導電粒子41を介して接合されるとともに、電極10b、10b間、11b、11b間に分離状態で導電粒子41が存在しているが、赤外光にて部品11を透過して部品11の実装面11cに設けられた位置マーク11aに照射されることで、導電粒子41の影響を受けることなく、第1の認識カメラ21にて位置マーク11aが画像認識され、また可視光にて基板10を透過して実装部位10cに設けられた位置マーク10aに照射されることで、導電粒子41の影響を受けることなく、第2の認識カメラ22にて位置マーク10aが画像認識される。これらの画像認識された位置マーク11aと10aの相対位置関係によって実装された部品11の位置ずれ量が検出される。   The procedure for inspecting the mounting position deviation by the first recognizing means 21 and the second recognizing means 22 will be described. In the component mounting state, as shown in FIG. 7, the electrode 10b of the mounting portion 10c of the substrate 10 and the components 11 electrodes 11b are bonded via the conductive particles 41 of anisotropic conductive material, and the conductive particles 41 exist in a separated state between the electrodes 10b, 10b, 11b, 11b. Thus, the position mark 11 a is imaged by the first recognition camera 21 without being affected by the conductive particles 41 by being irradiated to the position mark 11 a provided on the mounting surface 11 c of the component 11 through the component 11. The second recognition camera 2 is recognized without being influenced by the conductive particles 41 by being irradiated with the visible light and passing through the substrate 10 and irradiating the position mark 10a provided on the mounting portion 10c. Position mark 10a is the image recognition at. The positional deviation amount of the mounted component 11 is detected based on the relative positional relationship between the image-recognized position marks 11a and 10a.

すなわち、例えば、図8(a)に示すような位置マーク11aが部品11の実装面11cに設けられ、図8(b)に示すような位置マーク10aが基板10の側縁部上面の実装部位10cに設けられている場合、検査時に第1の認識手段21にて位置マーク11aが、第2の認識手段22にて位置マーク10aが画像認識されるので、それらの認識画像を重ね合わせることで、図8(c)に示すような位置関係を基準として、両者の位置ずれ量によって部品11の実装位置ずれ量が算出される。   That is, for example, a position mark 11a as shown in FIG. 8A is provided on the mounting surface 11c of the component 11, and a position mark 10a as shown in FIG. 10c, the first recognition means 21 recognizes the position mark 11a and the second recognition means 22 recognizes the image of the position mark 11a at the time of inspection. With reference to the positional relationship as shown in FIG. 8C, the mounting positional deviation amount of the component 11 is calculated from the positional deviation amount between them.

次に、以上の構成の検査装置8により基板10に部品11が実装されている部品実装基板100の実装位置ずれ検査において、基板10の側縁部に配設された実装部位10cに実装されている部品11の実装位置ずれを検査する動作を図9、図10を参照して説明する。   Next, in the mounting position deviation inspection of the component mounting substrate 100 in which the component 11 is mounted on the substrate 10 by the inspection device 8 having the above configuration, the inspection device 8 is mounted on the mounting portion 10c disposed on the side edge portion of the substrate 10. The operation for inspecting the mounting position deviation of the component 11 is described with reference to FIG. 9 and FIG.

まず、基板10の側縁部に複数の部品11が実装された部品実装基板100を、図10(a)に示すように、搬送手段17にて検査装置8の基板受渡位置に搬入する(ステップS1)。次に、その基板受渡位置で待機させていた移動手段18の基板保持部19上に部品実装基板100を受け取った後、図10(b)に示すように、移動手段18を動作させて基板10の検査対象の部品11が実装された側縁部の近傍を反り矯正部20上に載置し(ステップS2)、反り矯正部20にて基板10の側縁部近傍を下面より吸着保持して基板10の側縁部の反りを矯正し、部品11が実装された基板10の側縁部の平面度と高さ位置を高精度に確保する(ステップS3)。   First, as shown in FIG. 10A, the component mounting board 100 having a plurality of components 11 mounted on the side edge of the board 10 is carried into the board delivery position of the inspection apparatus 8 by the transport means 17 (step S1). Next, after receiving the component mounting board 100 on the board holding portion 19 of the moving means 18 that has been waiting at the board delivery position, the moving means 18 is operated as shown in FIG. The vicinity of the side edge where the component 11 to be inspected is mounted is placed on the warp correction unit 20 (step S2), and the vicinity of the side edge of the substrate 10 is sucked and held by the warp correction unit 20 from the lower surface. The warpage of the side edge portion of the substrate 10 is corrected, and the flatness and height position of the side edge portion of the substrate 10 on which the component 11 is mounted are ensured with high accuracy (step S3).

次に、移動手段18の基板保持部19を移動・位置決めして基板10に実装された複数の部品11の内、X方向であり側縁部長手方向の端に位置する最初の部品11を検査位置40に位置決めし(ステップS4)、部品11の実装面11cに設けられた位置マーク1
1aと基板10の実装部位10cに設けられた位置マーク10aを画像認識して、部品11の実装位置ずれを検査する(ステップS5)。次に、全ての部品11の検査が終了したか否かの判断を行い(ステップS6)、未検査の部品11がある場合には、図10(c)にX方向の白抜矢印で示すように、基板10の側縁部近傍を反り矯正部20で保持したまま、次の部品11を検査位置40に位置決めし(ステップS7)、部品11の実装位置ずれを検査する(ステップS5)という動作を繰り返す(ステップS5〜S7)。
Next, the first component 11 located in the X direction and at the end in the longitudinal direction of the side edge portion is inspected among the plurality of components 11 mounted on the substrate 10 by moving and positioning the substrate holding portion 19 of the moving means 18. Positioned at the position 40 (step S4), the position mark 1 provided on the mounting surface 11c of the component 11
1a and the position mark 10a provided on the mounting portion 10c of the substrate 10 are image-recognized to inspect the mounting position deviation of the component 11 (step S5). Next, it is determined whether or not all the parts 11 have been inspected (step S6). If there is an uninspected part 11, the white arrow in the X direction is shown in FIG. 10C. In addition, the next component 11 is positioned at the inspection position 40 while the vicinity of the side edge of the substrate 10 is held by the warp correction unit 20 (step S7), and the mounting position deviation of the component 11 is inspected (step S5). Is repeated (steps S5 to S7).

なお、図示例のように基板10の長辺側と短辺側の側縁部にそれぞれ部品11が実装されている場合には、長辺側の全ての部品11の検査が終了すると、反り矯正部20による吸着保持を解除し、基板保持部19を上昇させ、移動手段18のX軸テーブル26、Y軸テーブル27及び昇降回転機構29を移動制御して短辺側の側縁部の近傍を反り矯正部20上に位置させ、基板保持部19を下降させて反り矯正部20にて短辺側の側縁部の近傍を吸着保持し、上記検査動作を繰り返す。   In the case where the components 11 are mounted on the side edges of the long side and the short side of the substrate 10 as in the illustrated example, the warp correction is performed after the inspection of all the components 11 on the long side is completed. The suction holding by the unit 20 is released, the substrate holding unit 19 is raised, and the X-axis table 26, the Y-axis table 27 and the lifting / lowering rotation mechanism 29 of the moving unit 18 are controlled to move near the side edge on the short side. The substrate holding unit 19 is moved down on the warp correction unit 20, the vicinity of the side edge on the short side is sucked and held by the warp correction unit 20, and the above inspection operation is repeated.

以上のようにしてステップS6の判断で全ての部品11の検査が終了すると、移動手段18にて基板保持部19を搬送手段17との基板受渡位置に移動させ(ステップS8)、検査の終了した部品実装基板100を搬送手段17にて次の工程に向けて搬出する(ステップS9)。   As described above, when all the components 11 have been inspected in the determination of step S6, the substrate holding unit 19 is moved to the substrate delivery position with the conveying unit 17 by the moving unit 18 (step S8), and the inspection is completed. The component mounting board 100 is unloaded for the next process by the transport means 17 (step S9).

以上の本実施形態によれば、複数の部品11が実装された基板10の側縁部の近傍位置を反り矯正部20で実質的な全長にわたって吸着保持した状態で、基板10を側縁部の長手方向であるX方向に移動させて各部品11の実装位置を順次所定の検査位置40に位置決めし、第1と第2の認識手段21、22によって各部品11の位置マーク11aと基板10の実装部位10cの位置マーク10aを画像認識して実装位置ずれを検査するので、基板10の側縁部の平面度を保持して画像認識することができ、基板の10の薄型化や大型化によって反りが発生し易く、また実装部位10cの配列ピッチがより精細化されても、第1と第2の認識手段21、22として焦点深度の浅い高精度の認識カメラを用いて高精細度で検査することができる。しかも、基板10の側縁部を反り矯正部20で吸着保持したまま基板10を側縁部の長手方向に移動させ、各部品11の実装位置を固定した位置の検査位置40に順次位置決めして複数の部品11の検査を行うので、短いタクトで検査することができ、実装ラインに配設してもその実装タクトに合わせることができる。   According to the above-described embodiment, the substrate 10 is held at the side edge portion in a state where the vicinity position of the side edge portion of the substrate 10 on which the plurality of components 11 are mounted is sucked and held by the warp correction portion 20 over substantially the entire length. The mounting position of each component 11 is sequentially positioned at a predetermined inspection position 40 by moving in the X direction which is the longitudinal direction, and the position mark 11a of each component 11 and the substrate 10 are aligned by the first and second recognition means 21 and 22. Since the position mark 10a of the mounting part 10c is image-recognized to inspect the mounting position deviation, the image can be recognized while maintaining the flatness of the side edge of the substrate 10, and the substrate 10 can be reduced in thickness and size. Even if the warpage is likely to occur and the arrangement pitch of the mounting portions 10c is further refined, the first and second recognition means 21 and 22 are inspected with high precision using a high-precision recognition camera with a shallow focal depth. can doIn addition, the substrate 10 is moved in the longitudinal direction of the side edge portion while the side edge portion of the substrate 10 is sucked and held by the warp correction portion 20, and the mounting position of each component 11 is sequentially positioned at the inspection position 40. Since a plurality of components 11 are inspected, they can be inspected with a short tact, and even if they are arranged on a mounting line, they can be matched to the mounting tact.

また、基板10の実装部位10cに設けられた位置マーク10aを、基板10を透過する可視光を検査光として照射して可視光カメラからなる第2の認識手段22で画像認識し、実装された部品11の実装面11cに設けられた認識マーク11aを、部品11を透過する赤外光を照射して赤外光カメラからなる第1の認識手段21で画像認識するようにしているので、基板10の実装部位10cと部品11の実装面11cの間に異方性導電材の無数の微細な導電粒子41が存在し、かつ部品11がシリコンチップなどの可視光を透過しない部品11である場合でも、異方性導電材の導電粒子41の影響を受けることなく、基板10の実装部位10cに設けられた位置マーク10aを、基板11を通して認識するとともに部品11の実装面11cに設けられた位置マーク11aを、部品11を通して認識することができるので、部品11の実装位置の位置ずれを確実に検査することができる。   Further, the position mark 10a provided on the mounting portion 10c of the substrate 10 is irradiated with visible light transmitted through the substrate 10 as inspection light, and image recognition is performed by the second recognition means 22 including a visible light camera. Since the recognition mark 11a provided on the mounting surface 11c of the component 11 is irradiated with infrared light transmitted through the component 11, the image is recognized by the first recognition means 21 including an infrared camera. When innumerable fine conductive particles 41 of an anisotropic conductive material exist between 10 mounting parts 10c and a mounting surface 11c of the component 11, and the component 11 is a component 11 that does not transmit visible light such as a silicon chip. However, the position mark 10a provided on the mounting portion 10c of the substrate 10 is recognized through the substrate 11 without being affected by the conductive particles 41 of the anisotropic conductive material, and the mounting surface 11 of the component 11 is recognized. Position mark 11a provided on a, it is possible to recognize through the part 11, the positional deviation of the mounting position of the component 11 can be reliably inspected.

また、移動手段18を、基板搬送方向及び反り矯正部20の長手方向と平行なX方向に移動するX軸テーブル26と、X軸テーブル26の可動部上に配設されX方向と直交するY方向に移動するY軸テーブル27と、Y軸テーブル27の可動部28上にX−Y平面に対して垂直なZ方向に昇降及び垂直軸心回りのθ方向に回転可能に配設され基板10の実質的な中央部を保持可能な基板保持部19とを備えた構成とし、そのY軸テーブル27の可動部28とY方向の移動が固定された反り矯正部20との間を連結したままで、Y軸テ
ーブルの可動部をY方向にスライド自在に連結する連結手段36にて連結しているので、反り矯正部20の長手方向と平行なX方向に、X軸テーブル26を移動させることにより、連結手段36にてX軸テーブル26の移動とともに反り矯正部20を基板保持部19のX方向の移動に連動して移動させることができ、基板10のX方向の移動に完全に同期して基板の側縁部の近傍を反り矯正部20で吸着保持した状態で基板10の側縁部をX方向に移動・位置決めすることができ、簡単な構成にて効率的にかつ精度良く位置ずれ検査を行うことができる。また、反り矯正部20はX方向の1軸方向にのみ移動するだけであるので、2軸方向に移動可能な構成に比して、移動中及び移動前後の位置精度及び平面度を高い精度で保持することができる。
In addition, the moving means 18 is moved in the X direction parallel to the substrate transport direction and the longitudinal direction of the warp correction unit 20, and Y is disposed on the movable part of the X axis table 26 and is orthogonal to the X direction. The Y-axis table 27 that moves in the direction and the movable part 28 of the Y-axis table 27 are disposed on the movable portion 28 so as to be movable up and down in the Z direction perpendicular to the XY plane and rotatable in the θ direction around the vertical axis. The substrate holding portion 19 that can hold the substantial center portion of the Y-axis table 27 is connected to the movable portion 28 of the Y-axis table 27 and the warp correction portion 20 to which the movement in the Y direction is fixed. Thus, since the movable part of the Y-axis table is connected by the connecting means 36 slidably connected in the Y direction, the X-axis table 26 is moved in the X direction parallel to the longitudinal direction of the warp correction part 20. By the connecting means 36, the X axis table The warp correction unit 20 can be moved in conjunction with the movement of the substrate holding unit 19 in the X direction along with the movement of the substrate 26, and the vicinity of the side edge of the substrate is warped completely in synchronization with the movement of the substrate 10 in the X direction. The side edge portion of the substrate 10 can be moved and positioned in the X direction while being sucked and held by the correction unit 20, and the displacement inspection can be performed efficiently and accurately with a simple configuration. In addition, since the warp correction unit 20 only moves in one axial direction in the X direction, the positional accuracy and flatness before and after the movement are highly accurate compared to a configuration that can move in two axial directions. Can be held.

また、本実施形態の部品実装装置1においては、図1に示すように、上記検査装置8を、基板10の実装部位10cに異方性導電材41aを貼付けるACF貼付装置4と、実装部位10cに貼付けられた異方性導電材41a(図7参照)を介して部品11を基板10の実装部位10cに仮圧着する仮圧着装置5と、仮圧着された部品11を本圧着する本圧着装置7a、7bとを配設した実装ラインにおいて、実装ライン内の本圧着装置7bの後段側の実装ライン下流側に配設したので、基板10に部品11を実装する実装ライン内で実装状態の検査を行うことができ、かつ制御部12にて検査装置8による検査結果データを分析して位置ずれエラーの発生原因を解析し、位置ずれエラーの原因となった装置に補正データをフィードバックするようにしているので、応答性良くエラー要因に対する対策を行うことができて、高品質の部品実装基板100を効率的にかつ安定して生産することができる。   Further, in the component mounting apparatus 1 of the present embodiment, as shown in FIG. 1, the inspection apparatus 8 includes an ACF attaching apparatus 4 for attaching an anisotropic conductive material 41 a to the mounting part 10 c of the substrate 10, and a mounting part. Temporary pressure bonding apparatus 5 for temporarily pressure-bonding component 11 to mounting portion 10c of substrate 10 via anisotropic conductive material 41a (see FIG. 7) affixed to 10c and main pressure bonding for final pressure bonding of temporarily pressure-bonded component 11 In the mounting line in which the devices 7a and 7b are disposed, the mounting line is disposed on the downstream side of the mounting line downstream of the main crimping device 7b in the mounting line. The control unit 12 analyzes the inspection result data from the inspection device 8 to analyze the cause of the misregistration error, and feeds back correction data to the device causing the misregistration error. Since Unishi and has, can be able to take countermeasures against good response error cause, produced efficiently and stably a high-quality component mounting board 100.

本発明によれば、複数の部品が実装された基板の側縁部の近傍位置を、側縁部の長手方向に移動可能な反り矯正部により、側縁部の実質的な全長にわたって吸着保持した状態のままで、基板を側縁部の長手方向に沿って移動させて各部品の実装位置を順次、固定した位置の所定の検査位置に位置決めし、画像認識によって各部品の実装位置ずれを検査するので、基板の側縁部の平面度を保持して画像認識することができて焦点深度の浅い高精度の認識カメラにて高精細度で検査することができ、しかも基板の側縁部を吸着保持したまま基板を側縁部の長手方向に移動させ、各部品の実装位置を検査位置に順次位置決めして複数の部品の検査を行うので、短いタクトで検査することができ、実装ラインに配設してもその実装タクトに合わせることができるので、各種基板に各種部品を実装する部品実装装置における実装状態の検査に好適に利用することができる。   According to the present invention, the vicinity position of the side edge portion of the substrate on which a plurality of components are mounted is sucked and held over the substantially entire length of the side edge portion by the warp correction portion that is movable in the longitudinal direction of the side edge portion. In this state, the board is moved along the longitudinal direction of the side edge, and the mounting position of each component is sequentially positioned at a fixed inspection position, and the mounting position deviation of each component is inspected by image recognition. Therefore, it is possible to recognize the image while maintaining the flatness of the side edge of the substrate, and to inspect with high definition with a high precision recognition camera with a shallow depth of focus. The board is moved in the longitudinal direction of the side edge while holding the vacuum, and the mounting position of each part is sequentially positioned at the inspection position to inspect multiple parts. Even if it is installed, it must match the mounting tact. Since it is, it can be suitably used for inspecting mounting state of the component mounting apparatus for mounting various components on a variety of substrates.

本発明の部品実装基板の検査装置を適用した部品実装装置の概略構成図。The schematic block diagram of the component mounting apparatus to which the inspection apparatus of the component mounting board | substrate of this invention is applied. 本発明の一実施形態の検査装置の全体概略構成を示す斜視図。The perspective view which shows the whole schematic structure of the test | inspection apparatus of one Embodiment of this invention. 同実施形態の検査装置の要部構成を示す斜視図。The perspective view which shows the principal part structure of the inspection apparatus of the embodiment. 同実施形態の検査装置の要部構成を示し、(a)は平面図、(b)は正面図、(c)は左側面図。The principal part structure of the inspection apparatus of the embodiment is shown, (a) is a plan view, (b) is a front view, and (c) is a left side view. 同実施形態の検査装置の部分拡大側面図(左側面図)。The partial enlarged side view (left side view) of the inspection apparatus of the embodiment. 同実施形態の検査装置における反り矯正部の吸着固定部材(正面拡大図)を示し、(a)は基板吸着前の状態説明図、(b)は基板吸着前の状態説明図。The adsorption | suction fixing member (front enlarged view) of the curvature correction part in the inspection apparatus of the embodiment is shown, (a) is a state explanatory diagram before substrate adsorption, (b) is a state explanatory diagram before substrate adsorption. 同実施形態の検査装置における位置マーク認識工程の説明図。Explanatory drawing of the position mark recognition process in the inspection apparatus of the embodiment. (a)は部品の位置マークの一例、(b)は基板の位置マークの一例をそれぞれ示し、(c)は両マークを重ね合わせて位置ずれ量を検出する様子の説明図。(A) is an example of a position mark of a component, (b) is an example of a position mark of a board, and (c) is an explanatory view of a state in which both marks are overlapped to detect a positional deviation amount. 同実施形態の検査装置における動作フロー図。The operation | movement flowchart in the inspection apparatus of the embodiment. (a)〜(d)は同実施形態の検査装置における各動作状態を説明する平面図。(A)-(d) is a top view explaining each operation state in the inspection apparatus of the embodiment. 部品実装基板の一例の斜視図。The perspective view of an example of a component mounting board. 従来例の部品実装装置の概略構成図。The schematic block diagram of the component mounting apparatus of a prior art example. 部品実装装置に適用するために想定した部品実装基板の検査装置の要部の動作説明図。Operation | movement explanatory drawing of the principal part of the inspection apparatus of the component mounting board assumed in order to apply to a component mounting apparatus.

1 部品実装装置
4 ACF貼付装置(異方性導電材貼付装置)
5 仮圧着装置
7a、7b 本圧着装置
8 検査装置
10 基板
10a 位置マーク
10c 実装部位
11 部品
11a 位置マーク
11c 実装面
12 制御部
13 検査データ格納部
14 検査結果解析部
15 フィードバックデータ作成部
18 移動手段
19 基板保持部
20 反り矯正部
21 第1の認識手段(赤外光カメラ、画像認識手段)
22 第2の認識手段(可視光カメラ、画像認識手段)
26 X軸テーブル
27 Y軸テーブル
28 可動部
33 吸着固定部材
36 連結手段
40 検査位置
100 部品実装基板
1 Component mounting device 4 ACF sticking device (anisotropic conductive material sticking device)
DESCRIPTION OF SYMBOLS 5 Temporary pressure bonding apparatus 7a, 7b Main pressure bonding apparatus 8 Inspection apparatus 10 Board | substrate 10a Position mark 10c Mounting part 11 Parts 11a Position mark 11c Mounting surface 12 Control part 13 Inspection data storage part 14 Inspection result analysis part 15 Feedback data creation part 18 Moving means 19 Substrate holding part 20 Warp correction part 21 First recognition means (infrared light camera, image recognition means)
22 Second recognition means (visible light camera, image recognition means)
26 X-axis table 27 Y-axis table 28 Movable part 33 Adsorption fixing member 36 Connection means 40 Inspection position 100 Component mounting board

Claims (7)

基板の側縁部に設けられた複数の実装部位に実装された各部品の実装位置ずれを検査する検査方法であって、
部品が実装された基板の側縁部の近傍位置を側縁部の長手方向に移動可能な反り矯正部にて側縁部の実質的な全長にわたって吸着保持する反り矯正工程と、
反り矯正部にて基板の側縁部の近傍位置を吸着保持したまま、反り矯正部とともに基板を側縁部の長手方向に移動させて、各部品の実装位置を順次所定の検査位置に位置決めする移動・位置決め工程と、
所定の検査位置にて検査可能に固定して設置された画像認識手段で、その検査位置に位置決めされた部品の実装位置を画像認識し、基板に実装された各部品の実装位置ずれを検査する検査工程と、を
有することを特徴とする部品実装基板の検査方法。
An inspection method for inspecting a mounting position shift of each component mounted on a plurality of mounting portions provided on a side edge portion of a substrate,
A warp correction step of adsorbing and holding a position near the side edge of the substrate on which the component is mounted over the substantially entire length of the side edge in a warp correction unit movable in the longitudinal direction of the side edge;
While the position near the side edge of the substrate is attracted and held by the warp correction unit, the substrate is moved in the longitudinal direction of the side edge together with the warp correction unit, and the mounting position of each component is sequentially positioned at a predetermined inspection position. Move / position process,
An image recognition means fixedly installed at a predetermined inspection position so as to be inspected, recognizes the image of the mounting position of the component positioned at the inspection position, and inspects the mounting position deviation of each component mounted on the board. A component mounting board inspection method comprising: an inspection step.
検査工程は、基板の実装部位に設けられた位置マークを、基板を透過する第1の検査光を照射して画像認識する基板マーク認識工程と、実装された部品の実装面に設けられた位置マークを、部品を透過する第2の検査光を照射して画像認識する部品マーク認識工程とを有することを特徴とする請求項1記載の部品実装基板の検査方法。   The inspection process includes a board mark recognition process for recognizing an image of a position mark provided at a mounting part of the board by irradiating the first inspection light transmitted through the board, and a position provided on a mounting surface of the mounted component. 2. The component mounting board inspection method according to claim 1, further comprising: a component mark recognition step of recognizing an image by irradiating the mark with a second inspection light that passes through the component. 基板の側縁部に設けられた複数の実装部位に実装された各部品の実装位置ずれを検査する検査装置であって、
固定した位置の所定の検査位置にて基板に実装された部品の実装位置を画像認識する画像認識手段と、
基板を保持して各実装部位を順次所定の検査位置に移動させ位置決めする移動手段と、
基板の実装部位が設けられた側縁部の近傍を吸着保持し、側縁部の長手方向に沿った一方向にのみ移動自在な反り矯正部と、
基板の側縁部の長手方向に沿う方向の移動に連動するように、移動手段と反り矯正部とを連結する連結手段とを
備えたことを特徴とする部品実装基板の検査装置。
An inspection apparatus for inspecting mounting position deviation of each component mounted on a plurality of mounting portions provided on a side edge portion of a substrate,
Image recognition means for recognizing an image of a mounting position of a component mounted on a board at a predetermined inspection position at a fixed position;
A moving means for holding the substrate and sequentially moving each mounting part to a predetermined inspection position;
The vicinity of the side edge portion where the mounting part of the substrate is provided is sucked and held, and the warp correction portion that is movable only in one direction along the longitudinal direction of the side edge portion;
An inspection apparatus for a component mounting board, comprising: a connecting means for connecting the moving means and the warp correction section so as to be interlocked with the movement in the direction along the longitudinal direction of the side edge portion of the board.
画像認識手段は、基板の実装部位に設けられた位置マークを、基板を透過する第1の検査光を照射して画像認識する第1の認識手段と、実装された部品の実装面に設けられた認識マークを、部品を透過する第2の検査光を照射して画像認識する第2の認識手段から成ることを特徴とする請求項3記載の部品実装基板の検査装置。   The image recognizing means is provided on the mounting surface of the mounted component and the first recognizing means for recognizing the image of the position mark provided on the mounting portion of the board by irradiating the first inspection light that passes through the board. 4. The component mounting board inspection apparatus according to claim 3, further comprising second recognition means for recognizing an image of the recognition mark by irradiating a second inspection light that passes through the component. 移動手段は、基板搬送方向及び反り矯正部の長手方向と平行なX方向に移動するX軸テーブルと、X軸テーブルの可動部上に配設されX方向と直交するY方向に移動するY軸テーブルと、Y軸テーブルの可動部上にX−Y平面に対して垂直なZ方向に昇降及び垂直軸心回りのθ方向に回転可能に配設され基板の実質的な中央部を保持可能な基板保持部とを備え、Y方向の移動が固定された反り矯正部とY軸テーブルの可動部との間を連結したままで、Y軸テーブルの可動部をY方向にスライド自在に連結する連結手段を設け、反り矯正部の長手方向と平行なX方向に、X軸テーブルを移動させることにより、X軸テーブルの移動とともに反り矯正部を移動させることを特徴とする請求項3又は4記載の部品実装基板の検査装置。   The moving means includes an X-axis table that moves in the X direction parallel to the substrate conveyance direction and the longitudinal direction of the warp correction unit, and a Y-axis that is disposed on the movable part of the X-axis table and moves in the Y direction perpendicular to the X direction. A table and a movable part of the Y-axis table are arranged so as to be able to move up and down in the Z direction perpendicular to the XY plane and rotate in the θ direction around the vertical axis, and can hold the substantial center part of the substrate. A substrate holding portion, and a connection for slidably connecting the movable portion of the Y-axis table in the Y-direction while connecting the warp correction portion whose movement in the Y-direction is fixed and the movable portion of the Y-axis table. 5. The warp correction part is moved together with the movement of the X axis table by providing means and moving the X axis table in the X direction parallel to the longitudinal direction of the warp correction part. Component mounting board inspection equipment. 請求項3〜5の何れか1つに記載の部品実装基板の検査装置を、
基板の実装部位に異方性導電材を貼付ける異方性導電材貼付装置と、実装部位に貼付けられた異方性導電材を介して部品を基板の実装部位に仮圧着する仮圧着装置と、仮圧着された部品を本圧着する本圧着装置とを配設した実装ラインにおいて、実装ライン内の本圧着装置の後段側の実装ライン下流側に配設した
ことを特徴とする部品実装装置。
The inspection apparatus for a component mounting board according to any one of claims 3 to 5,
An anisotropic conductive material pasting device that pastes an anisotropic conductive material on a mounting portion of a substrate, and a temporary crimping device that temporarily crimps a component to the mounting portion of the substrate via the anisotropic conductive material stuck on the mounting portion; A component mounting apparatus comprising: a mounting line including a main pressure bonding apparatus that performs final pressure bonding of the temporarily pressure-bonded component; and a downstream side of the mounting line downstream of the main pressure bonding apparatus in the mounting line.
検査装置による検査結果データを分析して位置ずれエラーの発生原因を解析し、位置ずれエラーの原因となった装置に補正データをフィードバックする制御部を設けた
ことを特徴とする請求項6記載の部品実装装置。
7. The apparatus according to claim 6, further comprising: a control unit that analyzes the inspection result data from the inspection device to analyze the cause of the misalignment error, and feeds back correction data to the device that has caused the misalignment error. Component mounting equipment.
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