KR101104808B1 - Apparatus for bonding fpc - Google Patents

Abstract

An FPC bonding apparatus is disclosed. Such FPC bonding apparatus includes an ACF bonding portion attaching an anisotropic conductive film on the upper and lower surfaces of the FPC; A panel stage for moving a panel consisting of an upper plate and a lower plate to a preliminary bonding position, a panel jaw spreading the upper plate and the lower plate of the panel seated on the panel stage up and down, and an FPC stage for inserting the FPC between the upper plate and the lower plate; A preliminary bonding unit including a preliminary bonding head for prebonding the aligned FPC and the panel, and a camera system for confirming and aligning the insertion position by photographing the posture of the panel and the FPC; A panel supply unit supplying the panel formed of the upper and lower plates to the preliminary bonding unit; A main bonding unit for finally mounting the FPC mounted on the panel supplied from the preliminary bonding unit; And a transfer disposed between the ACF bonding portion, the preliminary bonding portion, and the main bonding portion. When the FPC bonding apparatus inserts the FPC into the touch panel, the panel panel jaws spread the upper and lower panels of the touch panel up and down, inserting the FPC therebetween, and the bonding process proceeds automatically, thereby increasing work efficiency. There is an advantage that can be.

FPC, ACF, Bonding, Touch Panel, Jaw

Description

FPC bonding device {APPARATUS FOR BONDING FPC}

The present invention relates to an FPC bonding apparatus of a TOUCH SCREEN PANEL (TSP) process, and more particularly, to an FPC bonding apparatus that automates the process of inserting and bonding an FPC between touch panels.

In general, in the FPC bonding process, the FPC method attaches an anisotropic conductive film (hereinafter referred to as an ACF) to an electrode of a panel, arranges an FPC on the ACF, and pressurizes at an appropriate pressure so that the pattern and the LCD electrode are brought into contact with each other. That's the way.

At this time, the ACF contains conductive particles, and when a predetermined pressure and heat are applied, the insulating film is broken to allow electricity to be applied through the conductive particles.

In addition, the panel includes a touch panel, and the panel is composed of an upper and lower plates, and the upper and lower plates each have a structure consisting of a film (FILM) and a film, a film and a glass, a glass and a glass.

The FPC bonding method includes an ACF bonding process, a process of inserting and prebonding an FPC between panels, and a main bonding process.

However, in the conventional FPC bonding apparatus, when the FPC is inserted between the upper plate and the lower plate, the operation time is increased by spreading the upper plate and the lower plate up and down by a manual method, and inserting and bonding the FPC between the upper plate and the lower plate. This takes a long time and there is a problem that the working precision is degraded.

In addition, the FPC bonding apparatus has a problem in that the work time is long and the work process is complicated by attaching the ACF to one side of the upper or lower surface of the FPC first, and then attaching the ACF to the other side.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to provide an apparatus for inserting an FPC into the touch panel which can improve the work efficiency by automating the process of inserting the FPC between the panel. It is.

In order to achieve the object of the present invention as described above, the present invention is an ACF bonding portion for attaching an anisotropic conductive film on the upper and lower surfaces of the FPC; A panel stage for moving a panel consisting of an upper plate and a lower plate to a preliminary bonding position, a panel jaw spreading the upper plate and the lower plate of the panel seated on the panel stage up and down, and an FPC stage for inserting the FPC between the upper plate and the lower plate; A preliminary bonding unit including a preliminary bonding head for pre-bonding the aligned FPC and the panel with a camera system for photographing the position of the panel and the FPC to check and align the insertion position; A panel supply unit supplying the upper plate and the lower plate to the preliminary bonding unit; A main bonding unit for finally mounting the FPC mounted on the panel supplied from the preliminary bonding unit; The present invention provides an FPC bonding apparatus including a transfer disposed between the ACF bonding unit, the preliminary bonding unit, and the main bonding unit.

As described above, in the FPC bonding apparatus according to the embodiment of the present invention, when the FPC is inserted into the touch panel, the upper and lower plates of the touch panel are opened up and down by the panel jaw, and the FPC is inserted therebetween, and the bonding is performed. There is an advantage that the work efficiency can be increased by automatically proceeding.

Hereinafter, an FPC bonding apparatus according to an embodiment of the present invention will be described in detail with the accompanying drawings.

1 is a layout view schematically showing the structure of an FPC bonding apparatus according to the present invention.

As shown, the FPC bonding apparatus proposed by the present invention includes an ACF bonding portion 1 for attaching an anisotropic conductive film (ACF) to the upper and lower surfaces of the FPC (F); A preliminary bonding unit (3) for inserting the FPC (F) to which the ACF is attached by the ACF bonding unit (1) between the panels (P) and bonding in advance; A panel supply part 5 for supplying upper and lower plates P1 and P2 to the preliminary bonding part 3; A main bonding unit (7) for finally mounting the FPC (F) mounted on the panel (P) supplied from the preliminary bonding unit (3); And a transfer 9 arranged between the ACF bonding portion 1, the preliminary bonding portion 3, and the main bonding portion 7.

In the FPC bonding apparatus having such a structure, the ACF bonding portion (1) comprises a frame (11), as shown in Figs. Upper and lower ACF reels (R1, R2, R3, R4) provided in the frame (11) for winding the upper and lower ACFs (A1, A2) necessary for the bonding operation; Upper and lower silicon rolls R5, R6, R7 and R8 for moving the ACFs A1 and A2; Upper and lower cutters C1 and C2 cutting the ACFs A1 and A2 by a predetermined length; An upper head 13 provided at the frame 11 to attach the upper ACF A1 to the upper surface of the FPC F by reciprocating vertically; A lower head (15) disposed below the pair of upper heads (13) to attach the lower ACF (A2) to the lower surface of the FPC (F) by reciprocating; And a feeding stage 17 for moving the FPC F to the bonding position.

The ACF bonding unit 1 includes: a separator 19 for separating and leaving only the corresponding ACF among the ACFs (A1 and A2) attached to the surface of the FPC (F); A sensor 21 for inspecting whether the ACF is attached; It includes a camera 23 for aligning by adjusting the supply stage 17 by photographing the posture of the FPC (F).

In the ACF bonding part having such a structure, the upper ACF reels R1 and R2 are the upper unwinding roll R2 on which the upper ACF A1 is wound and the ACF A1 supplied from the upper unwinding roll R2. It consists of an upper winding roll (R1) winding.

Therefore, the ACF A1 wound on the upper unwinding roll R2 may be released by the upper feeding roll so that only the ACF is attached and the protective film is wound on the upper winding roll R1.

At this time, the upper silicon reels (R5, R6) are disposed in the adjacent positions of the upper ACF reels (R1, R2) serves as a buffer when the ACF is attached.

The lower ACF reels R3 and R4 and the lower silicon reels R7 and R8 perform the same structure and the same function as the upper ACF reels R1 and R2 and the upper silicon reels R5 and R6. Since only the arrangement direction is reversed, detailed description thereof will be omitted.

The upper cutter (C1) is provided on the upper portion of the frame 11 to cut the ACF (A1, A2). That is, the upper cutter (C1) has a structure that can be moved up and down in the Z-axis direction to form a cutting flaw (H) on the surface of the ACF (A1) located between the bottom contact of the stopper when descending Done.

At this time, the lower cutter (C2) performs the same structure and function as the upper cutter (C1), and since only the arrangement direction is reversed, a detailed description thereof will be omitted.

The upper head 13 has a structure capable of reciprocating up and down by a cylinder or the like in the frame 11. The lower end of the head 13 is provided with a heating wire for generating heat.

Therefore, when the upper ACF A1 is cut by the cutter 17 and positioned on the upper surface of the FPC F, the ACF A1 is attached to the FPC F by the heat and pressure of the head 13.

In addition, the lower head 15 performs the same structure and function as the upper head 13, and since only the arrangement direction is reversed, a detailed description thereof will be omitted.

As the upper and lower heads 13 and 15 move up and down, respectively, in the upper and lower portions of the FPC F, the upper ACF A1 and the lower ACF A2 are thermally compressed on the upper and lower surfaces of the FPC F, respectively. You can.

The separator 19 is disposed between the upper and lower heads 13 and 15 to reciprocate in the X-axis direction.

3 and 4, the separator 19 includes a main body 25 connected to the cylinder 24 and a pair of separation pins 26 and 27 protruding from the main body 25. At this time, the pair of separation pins 26 and 27 respectively separate the upper separation pin 26 for separating the ACF (A1) attached to the upper surface of the FPC (F), and the lower portion for separating the ACF (A2) attached to the lower surface. It consists of a separating pin (27).

In addition, when the upper and lower heads 13 and 15 attach the upper and lower ACFs A1 and A2 to the upper and lower surfaces of the FPC F, respectively, the front ends of the upper and lower ACFs A1 and A21 and The rear end is continuous with the adjacent ACF with the cutting groove H formed by the cutters C1 and C2 therebetween.

Therefore, the separator 19 moves in the X-axis direction so that a pair of separation pins pass through the upper and lower portions of the FPC F, respectively, to separate the upper and lower ACFs A1 and A2 from the FPC F. have.

As shown in FIG. 5, the supply stage 17 includes a stage having a conventional structure, that is, an X-axis feeder 28 movable in the X-axis direction, and a Y-axis feeder 29 movable in the Y-axis direction. And a Z-axis feeder 32 movable in the Z-axis direction, and a θ-axis feeder 30 movable in the θ-axis direction.

Therefore, the supply stage 17 can easily convey the seated FPC (F) to the attachment position.

On the other hand, the preliminary bonding portion 3 is inserted into the FPC (F) attached to the ACF between the upper plate (P1) and the lower plate (P2) of the panel P, as shown in Figure 6 to 10, It is a device for prebonding.

The preliminary bonding unit 3 includes a panel stage 34 on which a panel P transferred from the panel supply unit 5 is seated, moved to a preliminary bonding position, and preliminary bonding is performed; A panel jaw 35 which spreads the upper and lower plates P1 and P2 of the panel P seated on the panel stage 34 up and down; An FPC stage 37 for moving the FPC F to a preliminary bonding position; Pre-bonding the aligned FPC (F) and the panel (P) with the camera system (36, 39, 41) to check the insertion position by aligning the position of the panel (P) and the FPC (F) It includes a preliminary bonding head 43 for.

In the preliminary bonding portion having such a structure, the panel stage 34 is preferably composed of a pair of panel stages 34. Thus, the pair of stages 34 can alternately supply the panel P to the preliminary bonding position in the state in which the panel P is seated.

In addition, the panel stage 34 includes an X-axis feeder (X) and a Y-axis feeder (Y) capable of the X-axis movement and the Y-axis movement by a linear motor method; A θ axis feeder θ that is movable in the θ axis direction by a servo motor; A mounting plate 102 provided on an upper side of the θ-axis feeder θ, on which a panel is mounted; It is provided on one side of the seating plate 102 includes a holder 104 to prevent the upper plate (P1) and the lower plate (P2) of the panel (P) to be separated beyond a predetermined length.

Accordingly, the panel P may be moved to the preliminary bonding position by the panel stage 34, and the FPC F may be moved to the preliminary bonding position by the FPC stage 37.

6 to 8, the panel jaw (35) is composed of an upper jaw (45) which is disposed at the top and can be lowered, and a lower jaw (46) is disposed at the bottom and can be lowered. .

The upper jaw 45 is an upper stepping motor 47, an upper vertical frame 50 connected to the upper stepping motor 47, and an upper part connected to an end of the upper vertical frame 50 to open the upper plate P1. It consists of a horizontal frame 51, and the upper Z-axis feeder 48 for moving the upper jaw 45 in the Z-axis direction.

In addition, the lower jaw 46 is connected to the lower stepping motor 49, the lower vertical frame 46 connected to the lower stepping motor 49, and an end of the lower vertical frame 46 to connect the lower plate P2. The opening is composed of a lower horizontal frame 53 and a lower Z-axis carriage 54 for moving the lower jaw 46 in the Z-axis direction.

The upper and lower jaws 45 and 46 have a structure in which Z-axis movement is possible by the Z-axis moving parts 48 and 54.

Accordingly, the upper and lower jaws 45 and 46 have upper and lower horizontal frames 51 and 53 inserted between the upper plate P1 and the lower plate P2 of the panel P.

When the stepping motor (not shown) is driven, the upper and lower jaws 45 and 46 move upward and downward, respectively, so that the upper and lower plates P1 and P2 of the panel P are separated from each other. .

As such, the FPC F may be inserted between the upper plate P1 and the lower plate P2 of the separated panel P to be prebonded.

At this time, in order to insert the FPC (F) between the upper plate and the lower plate (P1, P2), when the upper and lower jaws (45,46) open the upper plate (P1) and the lower plate (P2) up and down, the upper plate (P1) ) And the lower plate (P2) is excessively open can be a bad panel.

Therefore, the holder 103 prevents the upper panel P1 and the lower panel P2 from being excessively spread, thereby preventing the defective panel from being mass produced.

In more detail, as shown in FIGS. 9 to 11, the holder 103 is connected to the rotating cylinder 108 and the rotating cylinder 108 provided on one side of the seating plate 102 to rotate. And a fixing plate 104 fixed to the connecting bar 106 and fixing the panel P on the seating plate 102.

When the rotary cylinder 108 is driven, the connecting bar 106 is rotated in a clockwise or counterclockwise direction, and the fixed plate 104 is also rotated.

The fixing plate 104 rotates in the counterclockwise direction to fix the panel P on the seating plate 102.

At this time, the pocket 110 formed on the fixing plate 104 is positioned on the same line in the vertical direction with the groove 109 of the seating plate 102 with the panel P therebetween.

Then, one end L1 of the pocket 110 of the fixing plate 104 presses a position away from the edge of the panel P by a predetermined distance.

Therefore, when the upper and lower jaws enter the pocket 110 of the fixing plate 104 to open the upper plate P1 and the lower plate P2, one end L1 of the pocket 110 presses the panel P. Since the state, the upper plate (P1) and the lower plate (P2) is opened up and down only up to this point and is prevented from opening any more.

As a result, the upper panel P1 and the lower panel P12 of the panel P can be opened only within a predetermined range, so that mass production of the defective panel can be prevented.

On the other hand, the camera system (36), (39), (41) includes a camera (39), a panel alignment camera (36), and an FPC alignment camera (F) to allow the FPC (F) and the panel (P) to be inserted at the correct positions. 41), the postures of the panel P and the FPC F are photographed and controlled.

The panel alignment camera 36 and the FPC alignment camera 41 are movable in the X-axis direction.

The camera 39 is movable in the Z-axis direction and measures the gap between the height camera 56 measuring the height of the FPC F and the upper plate P1 and the lower plate P2 of the panel P. The gap camera 57 is included.

Accordingly, the camera 39 is raised along the Z-axis direction and is positioned between the FPC F and the panel P, and the FPC F and the panel are formed by the height camera 56 and the gap camera 57. Measure posture and position of P).

In this way, the image information obtained by the gap camera 57 and the height camera 56 is transmitted to the control unit (not shown), and the control unit appropriately moves the FPC stage and the panel stage by the image information. .

Therefore, the FPC (F) and the panel (P) can be inserted in alignment with each other in the correct position by appropriately adjusting the position and posture.

In this case, the camera 39 is lowered along the Z axis to prevent the FPC (F) from interfering in the process of being inserted into the panel (P).

The preliminary bonding head 43 has a structure that can be moved up and down by a cylinder (not shown). In addition, the preliminary bonding head 43 is a heatable structure provided by the heating wire.

Therefore, when the FPC F is inserted between the upper plate P1 and the lower plate P2 of the panel P, the preliminary bonding head 43 is lowered to thereby open the FPC F and the panel P. It can be prebonded by thermocompression bonding.

On the other hand, the panel supply unit 5, as shown in Figure 12, the frame 66; A panel tray lift 67 installed on the frame 66 to supply a panel tray on which a panel P is loaded; A tray holder 69 for transferring the panel trays one by one from the panel tray lift 67; A tray conveying unit (71) which pulls out the panel (P) from the panel tray and fixes it at a predetermined position; A panel holder 76 for picking up and moving panels P of the panel tray; An alignment unit 73 for supplying and pre-aligning the panel P to the preliminary bonding position; The panel P includes a tray unloader 75 for returning the used empty panel tray to its original position.

In the panel supply unit having such a structure, the panel tray lift 67 is able to be transported up and down on the frame 66, and the panel tray at the uppermost level after placing the panel tray to work on the tray lift 67 in the lowered state. The panel tray lift 67 is raised in order for the tray holder 69 to pick up one sheet.

In addition, the pair of conversion guides 75 has a structure in which each guide is arranged to be transported along the rail r1, so that the guides can be fixed by adjusting the position of the stacked panel tray by transporting each guide if necessary.

Thus, by appropriately adjusting the spacing of the conversion guide 75, panel trays of various sizes can be used.

Then, the tray holder 69 sucks one uppermost tray from the raised panel tray by vacuum, and lowers all remaining trays.

The tray holder 69 includes a pair of conversion guides 75 and a pair of conversion guides 75 that are transportably mounted on a rail r1 disposed in the Y-axis direction on the upper portion of the frame 66. It is provided at the lower end of the jig J to pick up the panel tray by vacuum.

In addition, two jigs J are provided in each conversion guide, and are connected to a vacuum apparatus (not shown) to suck the FPC tray by vacuum.

Then, while the tray holder 69 is picking up the panel tray, the tray transfer part 71 moves to the lower side of the panel tray, and the panel tray is seated on the upper surface thereof.

Therefore, the tray transfer part 71 can move the panel tray to an appropriate position by appropriately moving the rail r2 according to the input coordinate value, and the panel holder 76 is mounted on the panel tray ( P) will be picked up.

The panel holder 76 is mounted to be transportable on the panel transfer 78 capable of Y-axis movement, and has a structure capable of lifting up and down.

In addition, since the pad is provided at the lower end of the panel holder 76, the panel P may be sucked by vacuum.

As a result, the panel holder 76 picks up the panel P using a pad in the process of transferring in the Y-axis direction by the panel transfer 78, and the panel pre-aligned portion of the panel P is picked up. Can be transferred to (73).

Meanwhile, as shown in FIG. 13, the main bonding part 7 is provided on one side of the frame 80 and the frame 80 to perform bonding between the FPC F and the panel P. A head 84, a transfer unit 84 for moving the pre-bonded panel P to the bonding position or discharging the bonded panel P from the bonding position, and in front of the frame 80; And a film cassette 86 for supplying the film.

In the main bonding part having such a structure, the bonding heads 82 are provided in plural, preferably three in one set, and three in number. These three bonding heads 82 perform the bonding operation by sequentially raising and lowering the movement.

That is, the driving motors 87 are provided on the bonding heads 82, respectively, and when the driving motors 87 are driven, the bonding heads 82 may move up and down.

A bonding tip 88 is provided below the bonding head 82 to generate constant heat.

Therefore, the bonding operation can be performed by positioning the panel P to which the FPC F is preliminarily attached and heating the bonding tip 88.

The film cassette 86 is provided between a pair of support frames 89 and a pair of support frames 89 and includes a winding reel 90 for winding a film, preferably a film made of Teflon.

Then, the teflon wound on the cassette-type winding reel 90 is installed on the bottom of the bonding head 82 and is inserted across the front to rear direction.

Therefore, the bonding head 82 is lowered to attach the teflon to the bonding portion, thereby improving the ball crack of the ACF and preventing foreign substances and scratches.

1 and 11, the transfer T is disposed in the ACF bonding portion, the preliminary bonding portion, and the main bonding portion, and transfers the FPC (F) or the panel (P).

The transfer T includes a table B and at least one arm T1 movably provided on the table B to transfer or transfer the FPC F or the panel P.

The table B and the at least one arm T1 may be transferred by various coupling structures, but are preferably coupled by a linear motor method.

Therefore, the arm T1 moves along the table B, thereby receiving and transferring the FPC F from the previous step.

1 is a schematic view showing the structure of an FPC bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a side view schematically illustrating a structure of the ACF bonding unit illustrated in FIG. 1.

3 is a side view of FIG. 2.

4 is a diagram schematically illustrating a process of separating an ACF from an FPC by the separator illustrated in FIG. 2.

FIG. 5 is an enlarged perspective view showing an enlarged supply stage shown in FIG. 2.

6 is a perspective view schematically illustrating a structure of the preliminary bonding part illustrated in FIG. 1.

Figure 7 (a) is an enlarged perspective view of the panel, Figure 7 (b) is a view showing the structure of the upper and lower panels of the panel, Figure 7 (c) is an enlarged perspective view of the FPC.

FIG. 8 is a view schematically illustrating a state in which the upper and lower plates of the panel are opened up and down by the panel jaw illustrated in FIG. 6.

9 is a side view showing the side of the panel stage shown in FIG.

FIG. 10 is an operating state diagram illustrating a state in which the fixing plate of the panel stage illustrated in FIG. 9 fixes the panel.

FIG. 11 is a plan view of FIG. 9.

12 is a perspective view showing the panel supply unit shown in FIG.

FIG. 13 is a perspective view illustrating a main bonding part illustrated in FIG. 1.

Claims (9)

An ACF bonding portion attaching an anisotropic conductive film to the upper and lower surfaces of the FPC; A panel stage for moving a panel consisting of an upper plate and a lower plate to a preliminary bonding position, a panel jaw spreading the upper plate and the lower plate of the panel seated on the panel stage up and down, and an FPC stage for inserting the FPC between the upper plate and the lower plate; A preliminary bonding unit including a preliminary bonding head configured to pre-bond the aligned FPC and the panel with a camera system for photographing the position of the panel and the FPC to check and align the insertion position; A panel supply unit supplying a panel consisting of the upper plate and the lower plate to the preliminary bonding unit; A main bonding unit for finally mounting the FPC mounted on the panel supplied from the preliminary bonding unit; And A transfer disposed between the ACF bonding portion, the preliminary bonding portion, and the main bonding portion, The ACF bonding unit comprises a frame; Upper and lower ACF reels provided in the frame to wind upper and lower ACFs required for bonding; Upper and lower silicon rolls that act as a buffer when attached; Upper and lower cutters for cutting the ACF by a predetermined length; An upper head provided on the frame to attach the upper ACF to the upper surface of the FPC by vertically reciprocating; A lower head disposed below the pair of upper heads and reciprocating to attach the lower ACF to the lower surface of the FPC; A supply stage for moving the FPC to the bonding position; A separator separating and leaving only the corresponding ACF among the ACFs attached to the surface of the FPC; A sensor for inspecting whether an ACF is attached; And a camera that aligns by adjusting the supply stage by photographing the posture of the FPC. delete The method of claim 1, The separator includes a main body connected to a cylinder, and a pair of separation pins protruding from the main body, wherein the pair of separation pins respectively include an upper separation pin for separating an ACF attached to an upper surface of the FPC, and a lower connection pin. FPC bonding device including a lower separation pin for separating the ACF. The method of claim 1, The panel jaw includes an upper jaw disposed on the upper portion and capable of raising and lowering, and a lower jaw disposed on the lower portion and capable of raising and lowering. The upper jaw includes an upper stepping motor, an upper vertical frame connected to the upper stepping motor, an upper horizontal frame connected to an end of the upper vertical frame to open an upper plate, and an upper Z axis moving the upper jaw in the Z-axis direction. As it is, The lower jaw has a lower stepping motor, a lower vertical frame connected to the lower stepping motor, a lower horizontal frame connected to an end of the lower vertical frame to open a lower plate, and a lower Z axis for moving the lower jaw in the Z-axis direction. FPC bonding apparatus including a songdae. The method of claim 1, The panel stage includes an X-axis feeder and a Y-axis feeder capable of X-axis motion and Y-axis motion by a linear motor method; A θ axis feeder movable in the θ axis direction by a servo motor; A seating plate provided at an upper portion of the θ-axis transporting unit, and having a panel seated thereon; It is provided on one side of the seating plate FPC bonding apparatus comprising a holder for preventing the upper plate and the lower plate of the panel to be separated by more than a predetermined length. The method of claim 5, The holder includes a rotating cylinder provided on one side of the seating plate, a connecting bar connected to the rotating cylinder and rotating, and a fixing plate fixed to the connecting bar to fix the panel on the seating plate. The fixing plate is formed with a pocket FPC bonding apparatus, characterized in that the upper and lower jaw enters to open the upper plate and the lower plate up and down. The method of claim 1, The camera system includes a camera for checking the position of the panel and the FPC to check an insertion position, an FPC align camera for photographing and aligning the posture of the FPC, and a panel align camera for photographing the position of the panel. Including; The camera is movable in the Z-axis direction, the height camera for measuring the height of the FPC; FPC bonding apparatus including a gap camera for measuring the gap between the top and bottom panels of the panel. The method of claim 1, The panel supply unit and the frame; A panel tray lift installed on the frame to supply a panel tray on which the panel is loaded; A tray holder for transferring panel trays one by one from the panel tray lift; A tray conveying unit which draws the panel from the panel tray and fixes the panel at a predetermined position; A panel holder for picking up and moving a panel of the panel tray; An alignment unit for supplying and pre-aligning the panel to a pre-bonding position; And a tray unloader for returning the empty panel tray, which has been used up, to the original position. The method of claim 1, The main bonding portion is provided with a frame, a bonding head provided at one side of the frame for bonding between the FPC and the panel, a transfer portion for moving the pre-bonded panel to the bonding position or discharging the bonded panel from the bonding position; And a film cassette provided at the front of the frame to supply a film of Teflon to the bonding position, wherein the bonding head is lowered to attach the film of Teflon to the bonding position to prevent foreign matter and gas. Device.

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