KR100835699B1 - In-line auto cog bonding m/c - Google Patents

Abstract

An in-line auto COG(Chip On Glass) bonding apparatus is provided to reduce a bonding process time by automating an ACF process and a COG bonding process. A loader(1) loads an LCD panel. An ACF(Anisotropic Conductive Film) bonding unit(3) attaches and inspects an anisotropic conductive film on a glass loaded on the loader. A pre-bonding unit(5) mounts a semiconductor chip on the glass including the ACF by using a rotary method and identifies patterns and positions of the semiconductor chip and the glass. A main bonding unit(7) mounts the semiconductor chip on the glass. An unloader(9) discharges the glass by using a conveyer method. A plurality of transfers(13) are arranged among the loader, the ACF bonding unit, the pre-bonding unit, the main bonding unit, and the unloader in order to transfer the glass. A control unit(11) controls the loader, the ACF bonding unit, the pre-bonding unit, the main bonding unit, and the unloader.

Description

IN-LINE AUTO COG BONDING M / C}

1 is a perspective view showing the structure of an IN LINE automatic COG bonding apparatus according to a preferred embodiment of the present invention.

2 is a plan view of FIG.

3 is a front view of FIG.

4 is a perspective view showing the ACF bonding portion shown in FIG.

FIG. 5 is a perspective view showing the head of the ACF bonding portion shown in FIG. 4. FIG.

6 is a side view of FIG.

FIG. 7 is a diagram schematically illustrating a process of cutting an ACF film by the cutter of the ACF bonding portion shown in FIG. 4.

FIG. 8 is a perspective view illustrating a preliminary bonding portion of the chip illustrated in FIG. 1.

FIG. 9 is a perspective view showing a head portion of the preliminary bonding portion of the chip illustrated in FIG. 8. FIG.

10 is a front view of FIG.

Figure 11 is a side view of Figure 9;

FIG. 12 is a perspective view illustrating a chip supply unit supplying chips to the preliminary bonding unit illustrated in FIG. 8.

Figure 13 is a side view of Figure 12;

14 is a plan view of FIG.

FIG. 15 is a side view illustrating a process of supplying a chip from a chip supply unit to the preliminary bonding unit illustrated in FIG. 8.

FIG. 16 is a plan view schematically illustrating a disposition relationship between a chip head and a vision unit provided at a rotary of the preliminary bonding unit shown in FIG. 8 to pick up chips; FIG.

17 is a perspective view showing the mail bonding part shown in FIG.

18 is a side view of FIG.

19 is a front view of FIG. 17;

20 is a plan view of FIG.

The present invention relates to an in-line automatic COG bonding apparatus, and more particularly, to improve the structure of the inline automatic COG bonding apparatus that can be bonded more efficiently by automating the ACF attachment and chip bonding process. It is about.

In general, in a COG bonding process, a chip on glass (COG) or film on glass (FOG) method attaches an anisotropic conductive film (ACF) to an electrode of a glass, arranges a semiconductor chip on the ACF, and applies an appropriate pressure. It is a method in which the bump and the LCD electrode are brought into contact with each other by applying pressure.

In this case, the ACF contains conductive particles, and when a predetermined pressure and heat are applied, the insulating film is broken to allow electricity to be applied through the conductive particles.

The COG bonding method includes an ACF bonding process, a preliminary bonding process of a semiconductor chip and glass, and a main bonding process.

However, this conventional COG bonding method has the following problems.

First, since the ACF work and the COG bonding work are performed in separate devices and each process of loading, bonding, and unloading is performed manually, the bonding work may take a long time and work efficiency may be reduced.

Second, in case of the preliminary bonding head, there are one or more bonding heads, and each of the semiconductor chip and glass alignment mark recognition cameras is separately provided or each pattern is recognized by one camera so that the alignment mark recognition can be performed. It takes a lot of time, so the tact time is long and productivity is lowered.

Third, in the case of supplying chips from the chip tray during bonding, the chip pick-up device can supply only one chip at a time, thereby reducing chip supply efficiency.

Fourth, only one chip can be attached to the glass in one operation, so the productivity is low, the bonding work efficiency is lowered, and the chips cannot be attached to the surface.

Fifth, in the case of the conventional COG can be used only as a COG alone equipment, it is not compatible with other equipment such as FOG equipment.

Sixth, as the number of preliminary bonding heads increases for high speed time, the size of equipment increases and space utilization decreases.

Seventh, it is difficult to correct the variation of the thickness of the POL film, so that the alignment degree is lowered and the panel is easily broken.

Eighth, it is impossible to check the degree of attachment and alignment by checking the presence or absence of ACF by using the sensor during ACF attachment inspection.

Ninth, there is no alignment camera in the main bonding, which prevents glass breakage, poor alignment, and underpressure.

Tenth, the feeding method of the Teflon tape of the main bonding part is a left-right feeding method, which consumes a lot of time and takes a long time to replace the tape.

Eleventh, since the operation of the preliminary bonding head is a cylinder type, fine adjustment is difficult and alignment accuracy is lowered.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor chip by automating a COG bonding process consisting of loading, ACF attachment, bonding, and unloading by sequencing an ACF process and a COG bonding process. To provide a COG bonding apparatus that can bond on glass more efficiently and accurately.

Another object of the present invention is to provide a COG bonding apparatus capable of producing ultra-high speed 3.5 seconds by reducing the bonding time.

It is still another object of the present invention to provide a COG bonding apparatus capable of bonding chips of various shapes by enabling a heterogeneous chip or a plurality of chip bonding.

Another object of the present invention is to provide a COG bonding apparatus that can reduce the bonding time by applying a camera system that can simultaneously recognize the alignment mark of the LCD panel and the chip in the preliminary bonding apparatus.

Still another object of the present invention is to provide a COG bonding apparatus capable of checking alignment, attachment length, attachment state, and inspection by inspecting the attachment state of the ACF film by the camera during ACF operation.

Still another object of the present invention is to provide a COG bonding apparatus that can minimize alignment errors that may occur during chip transfer by applying two 180 degree rotation head methods during preliminary bonding and reduce the text time.

It is still another object of the present invention to provide a COG bonding apparatus that can shorten the preliminary bonding time by dividing the Z-axis driving method of the preliminary bonding head in a first and second manner by a submotor and a cylinder.

Another object of the present invention is to automatically adjust the height of the stage according to the thickness deviation of the POL by measuring the thickness of the POL by a contact displacement sensor, the level of the alignment stage (ALIGN STAGE) and the back up stage (BACK UP STAGE) This prevents the glass from damaging the glass, and automatically adjusts the height of the alignment stage to cope with glass of various thicknesses. It is also possible to work with glass with the smallest thickness and to reduce setup time. It is to provide a bonding device.

Another object of the present invention is to apply the supply method of the Teflon tape in the main bonding in the forward and backward manner, by applying the cartridge method can reduce the consumption of the Teflon tape, COG bonding apparatus that can shorten the replacement time of the Teflon tape To provide.

It is still another object of the present invention to provide a COG bonding apparatus capable of preventing and correcting an error in alignment of glass that may occur during transportation by including a camera in the main bonding portion.

Still another object of the present invention is to provide a COG bonding apparatus capable of fine control and coping with various models of glass by improving a stage for aligning chips or glasses to a structure capable of movement in the X, Y, Z, and θ directions. It is.

Still another object of the present invention is to provide a COG bonding apparatus capable of varying the width as required by applying the cylinder to the loading unit transfer apparatus in a manner of being mounted.

It is still another object of the present invention to improve a chip supply unit, thereby providing a COG bonding apparatus in which two chips (same or homogeneous) are simultaneously supplied by an inverting unit irrespective of the direction of the chip bump (IC BUMP), thereby reducing work time. To provide.

In order to realize the object of the present invention, the present invention includes a loading unit for loading the LCD panel; An ACF bonding unit for automatically attaching an anisotropic conductive film on the glass loaded by the loading unit; A preliminary bonding unit which pre-mounts a semiconductor chip on the glass to which the ACF is attached by a rotary method; A main bonding unit for finally mounting a semiconductor chip on the glass supplied from the preliminary bonding unit; An unloading part which discharges the glass to the outside by a conveyor method; A transfer unit for transferring glass between the loading unit, the ACF bonding unit, the preliminary bonding unit, the main bonding unit, and the unloading unit; And a control unit for controlling the loading unit, the ACF bonding unit, the preliminary bonding unit, the main bonding unit, and the unloading unit.

Hereinafter, a structure of a semiconductor bonding apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 2, the semiconductor bonding apparatus includes an LCD panel L (hereinafter, referred to as a loader 1 for loading glass G) and a glass loaded by the loader 1. ACF bonding part 3 for automatically attaching anisotropic conductive film on G) and prebonding part for pre-mounting semiconductor chip C on a glass G to which ACF is attached by rotary method. 5), the main bonding portion 7 for finally mounting the semiconductor chip C on the glass G supplied from the preliminary bonding portion 5, and the glass G in a conveyor method. It consists of an unloader (9) to discharge to the outside by the control unit 11 for controlling the loading unit (1), the main body, the unloading unit (9).

In addition, a transfer 13 is provided between the loading unit 1, the preliminary bonding unit 5, the main bonding unit 7, and the unloading unit 9 to transfer the chip C or the glass G. You can.

In the COG bonding apparatus having such a structure, the loading part 1 includes a seating plate 15 slidably mounted on a rail and loading and loading glass G on the upper surface thereof.

Therefore, the glass G conveyed from the previous process is loaded in a state where it is placed on the seating plate 15.

At this time, since the vacuum hole is formed in the seating plate 15, the bottom surface of the glass G may be absorbed and fixed by the suction force generated by the vacuum device (not shown).

In this way, the loaded glass G is transferred to the ACF bonding portion 3 by the transfer 13.

The transfer 13 includes a first transfer 17 for transferring the glass G of the loading unit 1 to the ACF bonding unit 3, and a preliminary bonding unit for transferring the glass G from the ACF bonding unit 3. 5 transfer to the second transfer 19, the third transfer 21 to transfer the glass G from the preliminary bonding portion 5 to the main bonding portion 7, and the glass from the main bonding portion 7 And a fourth transfer 23 for transferring (G) to the unloading portion 9.

These first to fourth transfer 13 is provided with a vacuum device to pick up the glass (G) by the vacuum adsorption method and transfers for each section.

The ACF bonding portion 3 is shown in more detail in FIGS. 4 to 6. That is, the ACF bonding part 3 includes a frame 25, a pair of heads 27 provided on one side of the frame 25 and capable of vertically reciprocating movement, and a pair of heads 27. And a pair of reels (29) for winding the ACF required for the bonding operation, and a transfer member (31) for transferring the glass (G) to the pair of heads (27) provided at an adjacent side position of the pair. And a cutter 33 provided at the lower portion of the head 27 to cut the ACF, and an ACF inspection vision unit K1 for attaching the ACF to the glass G and inspecting the attachment position.

In the ACF bonding part having such a structure, the pair of heads 27 are mounted on the frame 25 to enable the vertical reciprocating motion. That is, by being connected to the drive part of a piston system, it moves up and down suitably as needed.

In addition, a plurality of reels 29 are provided in the pair of heads 27 to wind the ACF film and maintain a constant tension.

The lower end of the head 27 is provided with a heating wire for generating heat. Therefore, when the ACF film is cut by the cutter 33 and positioned on the upper surface of the glass G, the ACF film is attached to the glass G by the heat and pressure of the head.

The cutter 33 is provided under the head 27 to cut the ACF. That is, as shown in Fig. 7, the cutter 33 has a structure that can be moved up and down, so that the cutter 33 contacts the bottom surface of the stopper 37 and forms cutting cuts on the ACF surface located therebetween. do.

Again, referring to FIGS. 4 to 6, the transfer member 31 allows the ACF to be attached by placing the glass G on the object to be stacked and moving in the head direction.

The conveying member 31 includes an X-axis conveying unit 39 movable in the X-axis direction, a Y-axis conveying unit 41 movable in the Y-axis direction, a Z-axis conveying unit 40 movable in the Z-axis direction, It consists of a θ conveyance part 38 rotatable in the θ axis direction and a mounting table 42 mounted on an upper surface of the Y axis conveying part 41 and fixing the glass G to the upper surface by a vacuum suction method.

The X-axis, Y-axis, Z-axis, and θ-axis feeder 39, 41, 40, 38 are respectively connected to the servo motor can be moved properly when driving the servo motor.

In addition, the first transfer 13 moves the glass G picked up by the vacuum suction method to the upper surface of the loading rack.

Therefore, when the servo motors are driven, the X, Y, Z, and θ-axis feed units 39, 41, 40, and 38 move properly so that the glass G seated on the loading stand is moved in the head direction. Departure.

In addition, the ACF inspection vision unit K1 is disposed under the head 27 to inspect the attachment state of the ACF by a camera. The camera may be connected to the control unit 11 to photograph the ACF attached to the glass G and transmit image information to the control unit and the monitor so that the inspection operator can automatically determine the alignment degree, the attachment length, and the attachment state of the ACF. Make sure

In addition, the ACF bonding unit 3 is provided with a collection box to collect and process the remaining ACF protective film generated during the ACF bonding process. At this time, the collection box is possible in a variety of ways, but preferably by applying a vacuum eject method to treat the ACF film.

As shown in Fig. 7, in the case of attaching the ACF on the glass G by the ACF bonding portion 3 described above, first, the ACF wound on the pair of rolls 29 receives the intermediate roll r. It is arranged across between the cutter 33 and the stopper 37.

In this state, the cutter 33 is raised to press the ACF to the bottom surface of the stopper 37 to form cutting scratches on the bottom surface of the ACF. In this case, since the ACF has a structure attached to the protective film (not shown) so as to be detachable, a cut scratch is formed only on the surface of the ACF, and the cut film is not formed on the protective film.

In this state, the loading stand 42 of the transfer member 31 moves in the Y-axis direction to the lower end of the pair of heads 27 so that the glass G is positioned below the heads 27. . At this time, the cutter 33 and the stopper 37 also move together in the Z Y-axis direction.

Therefore, the glass G seated on the mounting table 42 is located under the head 27. In this state, the head 27 descends, so that its lower end presses only the ACF on the protective film. It is crimped | bonded to the predetermined position of G), ie, an electrode part.

In this case, since the ACF is already formed by the cutter 33, the ACF may be easily separated and attached to the glass G.

Then, the lower ends of the pair of heads 27 adhere to the glass G by transferring heat and pressure of a predetermined temperature to the ACF.

As described above, after the adhesion of the ACF to the glass G is completed, the glass G is picked up by the second transfer 13 and transferred to the preliminary bonding part 5 so that the semiconductor chip C is primarily Bonded

As shown in FIGS. 8 to 11, the preliminary bonding unit 5 applies a rotary index method of a direct motor (DD motor) driving type.

In more detail, the preliminary bonding unit 5 includes a frame 45, a DD motor-driven rotary 46 rotatably provided in the frame 45, and the rotary 46. A chip head 47 attached to the chip head, a chip supply part 49 for sequentially supplying the semiconductor chip C to the chip head 47, and the glass G to the bonding position. An alignment stage 50 to align, and a vision unit 51 for recognizing the alignment mark of the chip (C) and the glass (G) supplied to the preliminary bonding position.

In the preliminary bonding portion having such a structure, the frame 45 supports the horizontal plate 52 provided with the rotary 46 and both ends of the horizontal plate 52, and the alignment stage 50 is disposed therebetween. It consists of a pair of legs 53 provided to be movable.

In addition, the horizontal plate 52 is provided with a rotary 46 that rotates at a predetermined angle, preferably 180 degrees, so that the chip C is supplied onto the glass and preliminarily bonded.

The rotary 46 is composed of a stepping motor 54 provided on the upper portion of the horizontal plate 52, and a disk 55 that is connected to the stepping motor 54 and rotatable.

The disc 55 is connected to the stepping motor 54, so that when the stepping motor 54 is driven, it is possible to rotate 360 degrees by dividing a predetermined angle, preferably 180 degrees, and, if necessary, 90 degrees.

In addition, the pair of chip heads 47 are mounted on the edge of the disc 55 to move up and down to pick up the chips C or supply them onto the glass.

That is, when the pair of chip heads 47 are composed of the first and second chip heads 47 and 56 and the disc 55 rotates at an angle of 180 degrees, each chip head 47 and 56 is a disc. By rotating along the rotational trajectory of 55, the chip C sequentially reaches the pick-up position P1 and the preliminary bonding position P2.

The pair of chip heads 47 is connected to the servo motor 57 and the cylinder 68 to move up and down along the Z-axis direction.

Accordingly, the pair of chip heads 47 may first pick up the chip C supplied from the chip supply unit 49 or may be driven by the sub-motor 57 primarily during preliminary bonding of the picked-up chip C. The chip head 47 may be lifted and lowered and bonded by the cylinder 68 secondarily, or the first and second driving orders may be changed depending on the product type.

As described above, the two chip heads 47 and 56 are configured to minimize the occurrence of displacement when the heads 47 and 56 pick up the chip C and move to the preliminary bonding position P2. .

In this way, the chip heads 47 and 56 preliminarily bond the chip C supplied by the chip supply unit 49 onto the glass G.

12 to 14, the chip supply unit 49 is provided at the rear of the preliminary bonding unit 5 to supply the chip (C).

The chip supply unit 49 may include a tray supply unit 58 for sequentially transferring a plurality of chip trays (not shown) transferred by the cassette lift L, and one or two chips C from the tray supply unit 58. A chip holder 59 for transferring, a reversing unit 60 for inverting the chip C transferred by the chip holder 59, and a chip C inverted by the reversing unit 60. And a chip alignment portion 61 for moving to the pick-up position of the chip head 47.

In the chip supply means having such a structure, the cassette lift (L) has a structure that can be moved up and down, so that a plurality of chip trays (not shown), preferably 60 pieces from the chip tray box (not shown) The trays are sequentially transported upwards.

In other words, the cassette lift L is lowered to pick up the chip tray from the chip tray box (not shown) and ascend.

The chip holders 59 may be picked up by being separated by the tray supply unit 58 and transported by one tray laterally.

As described above, the chip holder 59 sucks the chips C one by one by vacuum, moves them laterally a predetermined distance, and then transfers them to the inversion unit 60 to invert the chips C at an angle of 180 degrees.

The inverting unit 60 includes an inverting motor 62 and an inverting jig 63 connected to the inverting motor 62 so as to suck and invert the chip C on the upper surface thereof.

The reversing jig 63 is cylindrical in shape, and its upper surface has a flat shape. In addition, a vacuum hole is formed in this flat upper surface and is connected to a vacuum apparatus (not shown).

Therefore, the chip C seated on the upper surface of the reversing jig 63 does not fall even when the reversing jig 63 is rotated 180 degrees by being sucked by the vacuum hole.

In this way, the inverting jig 63 on which the chip C is mounted reaches the position of the chip alignment portion 61 by moving along the X-axis adjusting shaft 66.

Then, the inverting jig 63 reaching the chip alignment unit 61 transfers the chip alignment unit 61 to align the chip C at the correct position.

The chip alignment unit 61 includes an alignment stage 65 for aligning the chip C transferred from the reversing jig 63 to the correct position, and an outline of the chip C for centering the chip C. It includes a vision camera 67 to capture the.

In the chip alignment unit having such a structure, the alignment stage 65 is connected to an X, Y, Z control shaft driven by a servo motor and is movable to an appropriate position.

That is, when the chip C is seated on the alignment stage 65, the X-axis adjusting axis advances so that the alignment stage 65 moves a predetermined distance in the X-axis direction and proceeds to the vision camera 67.

In this state, the chip centering vision camera 67 captures the external shape of the chip C and aligns the captured left and right external shapes to be horizontal to each other. In this case, the vision camera 67 has a structure similar to that of the vision unit described later.

The chip C is automatically centered by appropriately operating the X, Y, and Z axis adjustment axes of the alignment stage 65 to move the alignment stage to the registered coordinates.

Therefore, the chip C can be prevented from being damaged due to mechanical external force during chip alignment, and the accurate chip alignment can be prevented to prevent the occurrence of defective chips and minimize the chip alignment time. Tact time is significantly shortened and productivity is high.

In this case, the displacement stage 64 is installed in the alignment stage 65 to measure the thickness deviation of the POL attached to the glass G to automatically adjust the height of the alignment stage 65 according to the difference in the thickness of the POL. have.

As described above, after the centering process for the chip C is completed, the preliminary bonding operation is performed by being picked up by the chip head 47.

That is, as shown in Figs. 8 and 16, when the chip C is seated on the chip alignment portion 61, the disc 55 is rotated to move the first head 47 to the first pick-up position P1, That is, it moves to the pickup position.

The first head 47, which has reached the pickup position, descends and picks up the chip C by a suction method. When the chip C is picked up by the first head 47, the disc 55 is rotated at an angle of 180 degrees to reach the preliminary bonding position, that is, the preliminary bonding position P2. At this time, the vision unit 51 is disposed at the preliminary bonding position P2 to simultaneously recognize the alignment marks of the chip C and the glass G.

Such a vision unit 51 is disposed at the preliminary bonding position P2 and is disposed at the first camera 70 and the preliminary bonding position P2 that recognize images of the alignment marks M1 of the crisscross shape of the chip C. And a second camera 71 arranged to recognize images of the alignment marks M2 of the cross shape of the glass G, respectively, and the first and second cameras 70 and 71 are provided in the control unit 11 (Fig. 1). ), Preferably by connecting to a personal computer (PC) to process the image information.

8, the first and second cameras 70 and 71 are integrally connected to each other and have the same structure.

In addition, the first and second cameras 70 and 71 are supported by the support shaft 69. At this time, the support shaft 69 is connected to the stepping motor to move in the X, Y, and Z directions. It is possible.

Accordingly, the first and second cameras 70 and 71 can be properly moved to accurately recognize the alignment marks of the chip C and the glass G.

The first camera 70 recognizes the alignment mark M1 of the chip C as described above. In the chip C, an alignment mark M1 is provided for pattern alignment, and the alignment mark M1 can be edited by a camera to obtain image information edited in two colors, black and white. . The image information on the alignment mark M1 of the chip C is transmitted to the personal computer.

The second camera 71 recognizes an image of the alignment mark M2 of the glass G transferred to the preliminary bonding position P2 by the alignment stage 50.

The video information of the alignment mark M2 of the glass G recognized by the second camera 71 is transmitted to the personal computer.

Therefore, the image information transmitted from the first and second cameras 70 and 71 is processed by the personal computer to control the alignment stage 50 so that the chip C may be pre-bonded at the correct position on the glass G. To help.

In more detail, the personal computer aligns the alignment marks M1 and M2 of the chips C and the glass G transmitted by the first camera 70 and the second camera 71. Processing by the mark editing program makes it possible to recognize a more accurate position.

That is, the alignment mark editing program adjusts the resolution by editing the image in two colors, black and white, when the outline of the mark is not clear.

Therefore, the recognition rate of the alignment mark M1 can be improved by automatically removing unnecessary images around the alignment mark M1 of the semiconductor chip C. FIG.

In the case of the alignment mark M2 of the glass G, the alignment mark M2 is automatically aligned by arithmetic processing based on a distance away from the original mark by a predetermined distance.

As described above, the personal computer appropriately moves the alignment stage 50 by the processed image information so that the chip C can be prebonded at the correct position on the LCD.

8 and 15, the alignment stage 50 may include an X-axis transfer unit 75 capable of moving in the X-axis direction, a Y-axis transfer unit 76 capable of moving in the Y-axis direction, and Z. Z-axis feeder 77 that is movable in the axial direction, θ-feeder 78 that is movable in the θ-axis direction, and a seating plate 73 provided on the X-axis feeder 75 for mounting the glass G. It includes.

In the alignment stage having such a structure, the X-axis, Y-axis, Z-axis, and θ-axis conveying portions 75, 76, 77, and 78 move properly when the power is applied to move the seating plate 73 accurately. Can be moved to a location.

In this case, the seating 73 may be transported at least one glass (G) at the same time by having at least one seating, preferably four seating. Of course, the number of seats 73 can be changed according to the production capacity and the product.

As described above, when the alignment stage 50 on which the glass G is seated reaches the home position by the control signal of the controller, the chip head 47 is picking up the chip C at the preliminary bonding position P2. ) Is lowered to preliminary bonding by placing the chip (C) on the glass (G).

In more detail, the heating device of the chip head 47 heats the bonding tip to generate heat of a predetermined temperature, thereby thermally compressing the semiconductor chip C. At this time, the temperature of the heat is preferably about 60 degrees, the pressing time is 0.1-60 seconds.

Through this process, the semiconductor chip C may be preliminarily bonded onto the glass G.

In addition, during the preliminary bonding, the semiconductor chip C may be automatically aligned at the correct position of the glass G. This is due to the interaction between the vision unit 51 and the alignment stage 50. It is possible through the alignment work of C).

As such, the glass G to which the semiconductor chip C is pre-bonded may be transferred to the main bonding part 7 by the third transfer 21, and thus the bonding operation may be performed secondarily.

In more detail, as shown in FIGS. 17 to 20, the main bonding unit 7 is provided on the frame 80 and one side of the frame 80 to bond the semiconductor chip C to each other. A bonding head 81 for carrying out, a transfer member 87 for moving the pre-bonded glass G to a bonding position, or for discharging the glass G bonded with a chip C from the bonding position; It is provided in front of the frame 80 includes a film supply unit 83 for supplying a buffer film.

In the main bonding portion having such a structure, the bonding heads 81 are provided in plural, preferably two in two, four are provided. The four bonding heads 81 perform the lifting operation in order to perform the bonding operation.

That is, the driving motors 88 are provided on the bonding heads 81, respectively, and when the driving motors 88 are driven, the bonding heads 81 may move up and down.

In addition, a bonding tip for generating a constant heat is provided below the bonding head 81. Therefore, by placing the semiconductor chip C on the glass G and heating the bonding tip 89, it is possible to minimize the instantaneous heat loss caused by the glass G to perform the bonding operation.

The film supply unit 83 includes a pair of support frames 90 and a winding reel 92 provided between the pair of support frames 90 to wind a buffer film.

Then, the buffer film wound on the cartridge-type winding reel 92 is installed on the bottom surface of the bonding head 81 and inserted across the front to rear direction.

Accordingly, the bonding head 81 is lowered to attach the buffer film to the bonding portion, thereby improving the ball cracking of the ACF and preventing foreign substances and scratches.

The conveying member 87 includes an X-axis conveying part 94 that is movable in the X-axis direction, a Y-axis conveying part 95 that is movable in the Y-axis direction, and a Z-axis conveying part 96 that is movable in the Z-axis direction. And a [theta] conveying part 97 capable of moving in the [theta] axis direction, and a mounting base 98 provided on the X-axis conveying part 94 on which glass G is seated.

In the conveying member having such a structure, the X-axis, Y-axis, Z-axis, and θ-axis conveying portions 94, 95, 96, and 97 are moved properly when the power source is applied, thereby accurately positioning the loading stand 98. Can be moved to

As such, when the transfer member 87 on which the glass G is seated reaches the bonding position by the control signal of the control unit 11, the bonding head 81 descends and the chip C is placed on the glass G. Bond.

The glass alignment camera 85 may be disposed on the upper front surface of the bonding head 81 to recognize the position of the alignment mark of the glass. As described above, the image information recognized by the camera 85 is processed by the controller 11, and the controller 11 controls the transfer member 87 so that the glass G reaches the correct bonding position.

On the other hand, the glass (G), the bonding operation is completed as described above is picked up by the fourth transfer 23 when the transfer member 87 is reversed to reach a predetermined position through the unloading unit 9 provided on the exit side Can be discharged.

Hereinafter, an operation process of a semiconductor bonding apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3, when the semiconductor chip C is bonded to the glass G by using the semiconductor bonding apparatus proposed by the present invention, the glass G is first bonded using the loading unit 1. Transfer to the inside of the device.

That is, the glass G transferred from the whole process is seated on the seating plate 15 of the loading part 1.

Then, the transferred glass G is picked up in a vacuum manner by the first transfer 17, and the transfer 13 is composed of two jigs, and the interval adjustment of each jig is varied by the cylinder during operation, thereby ACF bonding. It is conveyed to the part 3.

Referring to the process of the ACF bonding portion 3 in more detail, as shown in Figures 4 to 7, the transfer member 31 which is movable in the X, Y, Z, θ axis direction is a vacuum suction method As a result, the glass G is seated on the upper surface of the loading table 42.

Then, the transfer member 31 on which the glass G is seated is positioned at the lower end of the head 27 by moving in the Y-axis direction.

In this state, after the glass G is aligned in position, the reel 29 is rotated so that the ACF wound on the reel 29 is unwound to a predetermined length and passes through a plurality of intermediate reels r to pass the glass G. It is located at the top of the cut by a cutter (Cutter; 33) to a predetermined length and then conveyed.

And the lower end of the head 27 pressurizes an ACF by the head 27 of the ACF bonding part 3 descend | falling. Preferably, the electrode of the glass G is pressed.

In addition, the head 27 is attached to the glass (G) by transferring a constant temperature heat to the ACF.

After attaching the ACF on the glass G, the cutter 33 cuts the ACF tape. In addition, the separator 35 separates the ACF from the protective film portion (not shown) so that the ACF is attached to the glass G.

Then, after the process is completed, the length and adhesion of the ACF is inspected by vision and the foreign matter is inspected by the sensor.

As described above, after the ACF attaching process is completed, the glass G is transferred to the preliminary bonding part 5 by the second transfer 19 while being placed on the loading stand 42 so that the semiconductor chip C is 1. Preliminarily bonded.

More specifically, the glass G to which the ACF is pressed is seated on the alignment stage 50 of the preliminary bonding portion 5 and moved in the Y-axis direction to reach the preliminary bonding position P2.

At this time, the chip heads 47 and 56 provided in the rotary 46 pick up the chip C supplied from the chip supply unit 49 at the first pick-up position P1 and then place the chip C at the preliminary bonding position P2. do.

That is, as shown in Figs. 8, 12, 15 and 16, the rotary 46 rotates at an angle, preferably 180 degrees, to reach the first pick-up position P1 along the circular trajectory. .

At this time, the chip C is supplied to the first pick-up position P1 through the chip supply unit 49. The process of supplying the chip C to the chip head 47 will now be described.

In other words, the cassette lift L is lowered to pick up the chip tray from the chip tray box (not shown) and ascend.

The chip holders 59 may be picked up by being separated by the tray supply unit 58 and transported by one tray laterally.

As described above, the chip holder 59 having two head tips sucks a total of two chips C at a time by vacuum and moves a predetermined distance in the lateral direction, and then transfers them to the inversion unit 60. The chip C is inverted at an angle of 180 degrees at the same time.

In addition, the chip C seated on the upper surface of the inversion jig 63 does not fall even when the inversion jig 63 rotates halfway by being sucked by the vacuum hole.

In this way, the inverting jig 63 on which the chip C is mounted reaches the position of the chip alignment portion 61 by moving along the X-axis adjusting shaft 66.

When the inversion motor 62 is driven, the inversion jig 63 having reached the position of the chip alignment portion 61 is inverted to freely fall the chip C and rest on the alignment stage 65.

As such, when the chip C is seated on the chip alignment unit 61, the preliminary bonding operation is performed by being picked up by the head 56.

That is, as shown in Fig. 16, after the first head 47 picks up the chip C at the first pick-up position P1, the rotary 46 rotates 180 degrees to the preliminary bonding position P2. To reach.

The alignment mark M1 of the chip C is recognized by the first camera 70 at the preliminary bonding position P2. At this time, an alignment mark M1 is provided for chip alignment, and the alignment mark M1 may be edited by the camera to obtain image information edited in two colors, black and white. The video information on the alignment mark of the chip C is transmitted to the personal computer.

At this time, the seating stage 73 has reached the preliminary bonding position P2 by the alignment stage 50.

Accordingly, the second camera 71 recognizes the alignment mark M2 of the glass G seated on the seating board 73 and transmits the image information to the controller.

As such, the image information transmitted from the first and second cameras 70 and 71 is processed by the personal computer to control the alignment stage 50 so that the chip C is positioned at the correct position on the upper surface of the glass G. To allow preliminary bonding.

At this time, the personal computer uses the alignment mark editing program in which the alignment marks M1 and M2 of the chips C and the glass G transmitted by the first and second cameras 70 and 71 are embedded. By doing so, we can recognize the location more accurately.

That is, the alignment mark editing program adjusts the resolution by editing the image in two colors, black and white, when the outline of the mark is not clear.

Therefore, the recognition rate of the alignment mark M1 can be improved by automatically removing unnecessary images around the alignment mark M1 of the chip C. FIG.

In the case of the alignment mark M2 of the glass G, the alignment mark M2 is automatically aligned by arithmetic processing based on a distance away from the original mark by a predetermined distance.

As described above, the personal computer properly moves the alignment stage 50 by the processed image information so that the chip C can reach the correct position on the glass G.

As described above, when the alignment stage 50 on which the glass G is seated reaches the home position by the control signal of the personal computer, the chip head 47 in the state of picking up the chip C is lowered to form the chip ( Preliminary bonding is performed by placing C) on the glass G.

In more detail, the heating device of the chip head 47 heats the bonding tip to generate heat of a predetermined temperature, thereby thermocompressing the chip C. At this time, the temperature of the heat is preferably about 60 degrees, the pressing time is 0.1-60 seconds.

Through this process, the chip C may be preliminarily bonded onto the glass G.

The glass G to which the chip C is pre-bonded is transferred to the main bonding part 7 by the third transfer 21 to perform main bonding.

That is, as shown in FIGS. 17 to 20, the glass G picked up by the third transfer 21 is placed on the mounting base 98 of the transfer member 87 of the bonding head 81. Conveyed to the bottom.

Then, the four bonding heads 81 perform the lifting operation in order to perform the bonding operation.

At this time, the lower portion of the bonding head 81 is provided with a bonding tip 89 for generating a constant heat. Therefore, the bonding operation can be performed by placing the semiconductor chip C on the glass G and heating the bonding tip 89.

The buffer film wound around the film supply unit 83 provided at the front of the bonding head 81 is supplied to the bonding portion.

In this case, the buffer film may be bonded by winding in the rear direction from the front of the bonding head 81.

As such, by adhering the buffer film to the bonding portion of the glass G, it is possible to improve the cracking of the ACF and to prevent foreign substances and scratches.

On the other hand, the glass G, the bonding operation is completed as described above, when the conveying member 87 is reversed to reach a predetermined position, the unloading portion (picked up by the fourth transfer 23 (Fig. 1) provided on the exit side ( 9) can be discharged to the outside.

As described above, the COG bonding apparatus according to the preferred embodiment of the present invention has the following advantages.

First, by automating the COG bonding process consisting of loading, ACF attachment, bonding, and unloading by sequencing the ACF work process and the COG bonding work process, the COG bonding work time can be shortened to 3.5 seconds, resulting in high speed production.

Second, the chip of various shapes can be bonded by a heterogeneous chip or a plurality of chip bonding by applying the X, Y, Z, θ axis of each stage.

Third, the bonding time can be shortened by applying a camera that can simultaneously recognize the alignment marks of the LCD panel and the chip during preliminary bonding.

Fourth, the preliminary bonding time can be shortened by finely approaching the gap between the panel and the chip by applying the Z axis of the head.

Fifth, by checking the attachment state of the ACF film by the camera during the ACF operation, the alignment degree, the attachment length, and the attachment state can be inspected.

Sixth, by measuring the thickness deviation of the POL by the contact displacement sensor, the height of the alignment stage is adjusted according to the thickness deviation of the POL film to shorten the setup time, improve the alignment accuracy, minimize the glass damage, and Correspondence is possible.

Seventh, it is possible to reduce the consumption of the Teflon tape, and to reduce the replacement cycle and replacement time of the Teflon tape by applying the cartridge of the Teflon tape supplying method back and forth during the main bonding.

Eighth, by providing a camera in the main bonding portion, it is possible to improve the accuracy by correcting the alignment error that may occur during the transfer.

Ninth, the width of the width can be adjusted by applying the loading unit transfer device in a cylindrical manner, it is possible to adjust the width as needed.

Tenth, by improving the structure of the chip supply to pick up two chips at the same time, it is possible to shorten the text time by shortening the chip supply time.

Eleventh, it is possible to work regardless of the supply direction of the chip by applying the inversion function when supplying the chip.

Twelfth, it is possible to change production from COG to FOG to FOG to COG by replacing only the chip supply or FPC supply.

Thirteenth, it is possible to work on multiple chips simultaneously such as release chips, so that productivity is high and new developed products can be coped with.

Fourteenth, the COG bonding machine is a device that can be configured with other equipment and an IN LINE system, and can be configured as a high speed production line by continuously configuring a loader / unloader, a FOG bonding machine, and an AOI inspector.

The present invention can be variously changed by those skilled in the art without departing from the gist of the present invention claimed in the claims, and is not limited to the specific preferred embodiments described above. .

Claims (13)

A loading unit for loading an LCD panel; An ACF bonding unit for automatically attaching and inspecting an anisotropic conductive film on the glass loaded by the loading unit; A preliminary bonding unit which pre-mounts the semiconductor chip on the glass to which the ACF is attached by a rotary method and recognizes the pattern and the position of the semiconductor chip and the glass; A main bonding unit for finally mounting a semiconductor chip on the glass supplied from the preliminary bonding unit; An unloading part which discharges the glass to the outside by a conveyor method; A transfer unit disposed between the loading unit, the ACF bonding unit, the preliminary bonding unit, the main bonding unit, and the unloading unit to transfer glass; And And a controller for controlling the loading unit, the ACF bonding unit, the preliminary bonding unit, the main bonding unit, and the unloading unit. The method of claim 1, wherein the ACF bonding portion is provided at a frame, a pair of heads provided on one side of the frame and capable of vertically reciprocating movement, and adjacent side positions of the pair of heads for bonding operation. A pair of reels for winding the ACF required for the transfer, a transfer member for transferring glass to the pair of heads, a cutter provided at a lower end of the head, and a cutter for cutting the ACF to a predetermined length. ACF is A semiconductor bonding device comprising an ACF checker for checking whether it is attached. The semiconductor device of claim 1, wherein the preliminary bonding unit sequentially supplies a frame, a rotary rotatably provided to the frame, a chip head attached to the rotary, and a semiconductor chip to the chip head. A chip supply unit, an alignment stage for transferring the glass to a bonding position, and a vision unit for recognizing patterns and positions of chips and glasses supplied to the bonding position of the chip head, wherein the rotary is constantly A semiconductor bonding apparatus which prebonds a chip on glass by rotating by 180 degrees. According to claim 3, wherein the rotary is a direct motor (DD motor; Direct Motor) provided on the upper portion of the horizontal plate, the disk is connected to the direct motor rotatable, and the disk is provided so as to move up and down on the disk A semiconductor bonding apparatus comprising a chip head for bonding the on the ACF of the glass surface. The chip supply unit of claim 3, wherein the chip supply unit comprises a tray supply unit for sequentially transferring a plurality of chip trays transferred by a cassette lift, a chip holder for transferring one or two chips from the tray supply unit, and a chip holder transferred by the chip holder. And an inversion unit for inverting the chip as necessary, and a chip alignment unit for transferring the chip inverted by the inversion unit to a pickup position and aligning the chip. The semiconductor bonding apparatus of claim 5, wherein the inversion unit comprises an inversion motor for generating a rotational force and an inversion jig connected to the inversion motor to suck and invert a chip on an upper surface thereof. The display apparatus of claim 3, wherein the vision unit is disposed under the chip head to recognize an alignment mark of the chip, and is integrally connected to the first camera to recognize the alignment mark of glass. And a second camera, wherein the first and second cameras transmit image information to the controller. The ITO pattern of glass according to claim 7, wherein the controller recognizes the position of the semiconductor chip and the glass by the image information transmitted from the first and second cameras, and processes the image information of the alignment mark by a program. A semiconductor bonding device having a program for semiconductor chip pattern aligning that can increase the matching ratio of alignment marks with the bump surface of the chip. The semiconductor bonding device of claim 6, wherein the chip alignment unit comprises an alignment stage for aligning a chip transferred from the inversion jig to an accurate position, and a vision camera for capturing an outline of the chip to align the chip. Device. 4. The alignment stage of claim 3, wherein the alignment stage comprises: an X-axis feeder movable in the X-axis direction, a Y-axis feeder movable in the Y-axis direction, a Z-axis feeder movable in the Z-axis direction, and a θ-axis direction. And a seating plate provided on the X-axis conveying unit and movable on the X-axis conveying unit to seat the glass. The bonding method of claim 1, wherein the main bonding unit is configured to bond the frame, a vertically reciprocating movement to one side of the frame, a variable pitch bonding head, and a lower end of the bonding head to transfer heat to the glass on which the chip is bonded. A tip, a film supply unit provided at an adjacent position of the bonding head to wind a buffer film, a camera provided at an upper portion of the bonding head to recognize a position of glass, and to transmit image information to the controller; A semiconductor bonding apparatus comprising a transfer member for transferring the glass to the lower portion of the head. 12. The method of claim 11, wherein the conveying member is an X-axis feeder that can move in the X-axis direction, a Y-axis feeder that can move in the Y-axis direction, a Z-axis feeder that can move in the Z-axis direction, and in the θ-axis direction And a seating plate provided on the X-axis conveying unit and movable on the X-axis conveying unit.        The transfer apparatus of claim 1, wherein the transfer comprises: a first transfer for transferring the glass of the loading unit to an ACF bonding unit; a second transfer for transferring the glass from the ACF bonding unit to the preliminary bonding unit; and a glass from the preliminary bonding unit to the main bonding unit. And a fourth transfer to transfer the glass from the main bonding portion to the unloading portion.

Images