KR100967932B1 - Apparatus and Method for Bonding Printed Circuit on FPD Panel - Google Patents

Abstract

Disclosed are a bonding apparatus for a driving circuit board and a method thereof. A bonding apparatus for a driving circuit board according to the present invention includes: a plurality of working parts for performing a bonding operation for bonding the driving circuit board to a flat panel display device panel; At least one panel support and transfer sharing stage for supporting the flat panel display panel in the work of any one of the plurality of work units and transferring the flat panel display panel to the other of the plurality of work units; A loading unit for loading a panel to be bonded to the plurality of panel support and transfer sharing stages; And an unloading unit for unloading the panel on which the bonding operation is completed from the plurality of panel support and transfer sharing stages. According to the present invention, the process efficiency and the production efficiency can be further improved while the tact time is shorter than that of the conventional bonding apparatus in which the transfer of the panel is entirely dependent on the transfer.

Description

Bonding device for driving circuit board and its method {Apparatus and Method for Bonding Printed Circuit on FPD Panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for a driving circuit board and a method thereof, and more particularly, to shorten the tact time more than a conventional bonding apparatus in which the transfer of panels is entirely dependent on transfer. Process efficiency and production efficiency are related to a bonding apparatus for a driving circuit board and a method thereof which can be further improved.

The flat panel display panel includes a Plasma Display Panel (PDP), a Liquid Crystal Display (LCD), an Organic Light Emitting Diode (OLED), a Vacuum Fluorescent Display (VFD), and the like.

Such flat panel display panels (hereinafter referred to as "panels") tend to become thinner while their area becomes larger. Accordingly, research on a bonding apparatus for bonding a driving circuit board (hereinafter referred to as a circuit board) to a panel has been steadily made.

Conventional circuit boards can be bonded to the panel by prebonding after attaching an anisotrofic conductive film (ACF) to the bonding surface of the panel, and then main bonding by applying heat and pressure. do.

However, in the past, only one working stage is loaded with a panel, so that one working stage is, for example, an anisotropic conductive film (ACF) attaching process, a pre-bonding process of a circuit board, and a main bonding of a circuit board. During the process individually, there is a problem in that no work can be performed in parallel in the process, thereby increasing the tact time and lowering the process efficiency.

In consideration of such a problem, a circuit board bonding apparatus includes a work unit for performing work for bonding a driving circuit board to a flat panel display panel, a plurality of work stages for supporting the flat panel display panel and transferring the same to the work unit; A plurality of loading and unloading units provided correspondingly to each of the plurality of work stages to load the flat panel display panel onto or to unload the flat panel display panel from the work stage, and one of the work stages includes: When there is a work part for performing work for bonding the driving circuit board, it is possible to control the alternating movement of the plurality of work stages to the work part so that different work stages perform the corresponding work in the respective loading and unloading parts. The control stage, the work stage being worked on By making a flat panel display device panel is loaded or unloaded on the other of the work stages, the processing time is reduced in half, it was to significantly increase the process efficiency.

At this time, the work part is a conductive film attachment part that is affixed to attach the anisotropic conductive film (ACF), the pre-bonding unit is performed to fix the driving circuit board to the flat panel display panel in the free bonding unit, the flat plate in the main bonding unit The main bonding part may be a final bonding operation of pressing the driving circuit board onto the display device panel.

In the conventional circuit board bonding apparatus, since the work stage is provided for each of the corresponding working parts, the process of attaching the anisotropic conductive film (ACF) to the panel, the pre-bonding process of the circuit board, and the main bonding process of the circuit board are performed in parallel. Proceeding, it was possible to provide the effect of reducing the tact time compared to the bonding apparatus having one working stage.

However, in the conventional circuit board bonding apparatus, in order to transfer the panel with the anisotropic conductive film (ACF) attached to the work stage of the pre-bonding portion or to transfer the panel where the pre-bonding process is completed to the work stage of the main bonding portion, Since there is a transfer provided separately from the work stage, there is a problem that causes some losses as follows.

That is, in order to transfer the panel on which the anisotropic conductive film (ACF) is attached to the work stage of the pre-bonding portion, or to transfer the panel where the pre-bonding process is completed to the work stage of the main bonding portion, the transfer absorbs and lifts the panel, and transports the predetermined distance. In this case, the anisotropic conductive film (ACF), which is not completely attached during the transfer process, is likely to be separated from the panel, and even if it is not separated, there is a high possibility that the panel may shake or twist on the transfer being transferred. You must further align the panels at the up stage.

In particular, the anisotropic conductive film (ACF) is often separated from the panel when the panel in which the prebonding process is completed is transferred to the work stage of the main bonding portion.

When the transfer is used to transfer the panel, the anisotropic conductive film (ACF) is separated from the panel of the transfer being transferred, resulting in a reduction in process efficiency and production efficiency, and also as the panel is shaken or twisted on the transfer being transferred. If the alignment work on the panel needs to be redone, the tact time will increase.

In fact, in the case of a panel applied to a mobile phone, an anisotropic conductive film (ACF) is separated from the panel during transfer of the panel by transfer, and it is known that the frequency of the work to be renewed again is quite high.

Therefore, the process line and the production efficiency reduction due to the transfer-dependent transfer of the panel as a whole, while the in-line process line of the conductive film attaching process, the pre-bonding process, and the main bonding process are established. There is a need for research and development on a bonding apparatus that can improve a problem of increasing time.

SUMMARY OF THE INVENTION An object of the present invention is to bond a driving circuit board that can shorten the tact time and improve the process efficiency and the production efficiency more than the conventional bonding apparatus, in which the transfer of the panel depends solely on transfer. It is to provide an apparatus and a method thereof.

According to an aspect of the present invention, there is provided a flat panel display device, comprising: a plurality of working parts in which a bonding operation for bonding a driving circuit board to a flat panel display device panel is performed; Combine and support at least one panel for supporting the flat panel display device panel at any one of the plurality of work units and transferring the flat panel display device panel to another one of the plurality of work units. A sharing stage; A loading unit configured to load a panel of a bonding work target with the plurality of panel support and transfer sharing stages; And an unloading unit for unloading the panel on which the bonding operation is completed from the plurality of panel support and transfer sharing stages.

The plurality of working parts may include a conductive film attaching part on which an anisotrofic conductive film (ACF) is attached to one surface of a panel to be bonded; At least one pre-bonding unit which bonds the anisotropic conductive film (ACF) to the panel by bonding the anisotropic conductive film (ACF) to the panel; And at least one main bonding unit bonding the anisotropic conductive film (ACF), which has been press-bonded, to the panel side to bond the anisotropic conductive film (ACF) to the panel, and supporting the at least one panel. The shared double sharing stage may transfer the flat panel display panel while moving between the pre-bonding unit and the main bonding unit.

The shared panel supporting and transferring stage may support the panel when pressed in the pre-bonding unit, transfer the panel to the main bonding unit, and support the panel during main compression in the main bonding unit.

The prebonding part may be provided, the main bonding part may be provided in two, and the two main bonding parts may be provided on both sides of the prebonding part with the prebonding part interposed therebetween.

The loading part, the conductive film attaching part, the pre-bonding part, the main bonding part, and the unloading part may form an in-lined process line.

The at least one panel support and transfer sharing stage may be provided in plural, and each of the panel support and transfer sharing stages may include a main body portion; A panel support part connected to the main body part and having a plurality of suction holes formed at one side thereof to suck the panel; It may include a film support connected to the panel support and supporting the anisotropic conductive film (ACF) to be attached to the panel.

An X-axis moving unit for moving the panel support and transfer sharing stage in a virtual X-axis direction connecting the loading unit and the unloading unit; A Y-axis moving unit for moving the panel support and feed sharing stage in the Y-axis direction so that the panel support and feed sharing stage is approached and spaced apart from the work unit; And a θ-axis rotation unit configured to rotate the panel support and transfer sharing stage in the θ-axis direction.

The body portion may further be provided with at least one control panel for setting the vacuum pressure formed in the plurality of suction holes.

At least two panels may be supported by the panel support part.

The film support unit, a support for supporting the anisotropic conductive film (ACF) from the bottom; And a pair of support connecting portions provided at both sides of the panel support and connected to both ends of the support.

A panel support stage provided in the conductive film attaching region to support the flat panel display panel; A first transfer to transfer the panel on which the anisotropic conductive film (ACF) is attached onto the panel support stage to the panel support and transfer shared stage; And a second transfer to take out the panel bonded by the main bonding part from the shared panel supporting and transferring stage to the unloading part.

The first and second transfers may form independent paths that are different from the movement paths of the panel support and transfer sharing stage.

On the other hand, the object, according to the present invention, the loading step of loading the panel of the bonding operation target to the panel support stage (loading); A conductive film attaching step in which an anisotrofic conductive film (ACF) is attached to one surface of the panel on the panel support stage; A panel transfer step of transferring the panel having the anisotropic conductive film (ACF) attached thereto from the panel support stage to any one of the panel support and transfer sharing stages; Bonding the anisotropic conductive film (ACF) to the panel by pressing and bonding the anisotropic conductive film (ACF) on the panel support and transfer sharing stage; A panel support and transfer step of supporting the panel on which the anisotropic conductive film (ACF) is press-bonded to the main bonding portion while supporting the panel support and transfer share stage; Bonding the anisotropic conductive film (ACF) to the panel by main compression of the anisotropic conductive film (ACF) on which the pressure bonding is completed; And an unloading step of unloading the panel on which the bonding operation is completed, is also achieved by the bonding method of the driving circuit board.

Here, the main bonding step may be performed on the panel support and transfer sharing stage in which the panel is transferred from the pre-bonding unit to the main bonding unit.

According to the present invention, the process efficiency and the production efficiency can be further improved while the tact time is shorter than that of the conventional bonding apparatus in which the transfer of the panel is entirely dependent on the transfer.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

For reference, a flat panel display panel to be described below includes a plasma display panel (PDP), an LCD (liquid crystal display), an organic light emitting diode (OLED), and a fluorescent display panel (VFD). In the following description, a flat panel display panel is simply referred to as a panel for convenience of description. The driving circuit board will also be described as simply a circuit board.

1 is a schematic configuration diagram of a bonding apparatus for a driving circuit board according to an exemplary embodiment of the present invention, FIG. 2 is an enlarged view of the shared stage region for supporting and transporting the panel shown in FIG. 4 is a view schematically illustrating a bonding method of a driving circuit board according to an embodiment of the present invention, and FIG. 4 is a flowchart illustrating a bonding method of a driving circuit board according to an embodiment of the present invention.

As shown in these drawings, the bonding apparatus for a driving circuit board according to the present embodiment includes a plurality of working parts (bonding) for bonding the circuit board F to the panel P. And a plurality of panel supporting and conveying sharing stages 700 for supporting the panel P and transferring the panel P to the corresponding ones among the plurality of working stages, and a plurality of panel supporting and conveying The loading unit 100 for loading the panel P to be bonded to the shared stage 700 and the panel P for which the bonding operation is completed from the shared stage 700 for supporting and transferring a plurality of panels are unmounted. It includes an unloading unit 600 for loading (unloading).

As illustrated in FIG. 1, the plurality of working parts include a conductive film attaching part 200 in which an anisotrofic conductive film (ACF) is attached to one surface of the panel P as a bonding work object. , One pre-bonding unit 400 for bonding the anisotropic conductive film ACF to the panel P to bond the anisotropic conductive film ACF to the panel P, and the anisotropic conductive film ACF having completed the pressure bonding. ) And two first and second main bonding parts 300 and 500 for finally bonding the anisotropic conductive film ACF to the panel P.

The loading part 100, the conductive film attaching part 200, the first main bonding part 300, the free bonding part 400, the second main bonding part 500, and the unloading part 600 are in-line (in−). Form a lined process line.

As described above, as the plurality of work units including the loading unit 100 and the unloading unit 600 form inlined process lines, the work may be efficiently performed and the tact time may be reduced. Also, considering that they are housed in a single outer housing (not shown), there is an advantage of reducing the foot print of the device.

First, the loading unit 100 and the unloading unit 600 will be described. The loading part 100 is a part for supplying the panel P of the work object to the work part along the direction A of FIG. 1, and the unloading part 600 is a panel in which work is completed, that is, an anisotropic conductive film (ACF) is bonded. (P) is a part taken out in the B direction of FIG.

In the present embodiment, the loading unit 100 and the unloading unit 600 are applied as conveyors for smooth supply and withdrawal of the panel P, respectively. However, since the scope of the present invention is not limited thereto, the loading unit 100 and the unloading unit 600 may be changed to a roller and a stage type in addition to the conveyor.

The conductive film attaching part 200 is a part attaching the anisotropic conductive film ACF to the panel P supplied from the loading part 100. Here, the attachment does not mean a complete adhesion, that is, a fixed state that does not fall, but merely means that the anisotropic conductive film (ACF) is slightly attached to the bonding position of the panel (P).

Therefore, although not shown, the conductive film attachment part 200 is further provided with a film supply part (not shown) for supplying an anisotropic conductive film (ACF) to be attached to one side of the panel (P). For reference, a method in which the film supply unit is continuously supplied by a plurality of roller combinations may be applied.

In order to attach the anisotropic conductive film ACF to one side of the panel P in the conductive film attaching part 200, an element for supporting the panel P is required. The panel support stage 800 is responsible for this.

The two panel support and transfer sharing stage 700 which will be described later is provided between the first main bonding unit 300 and the free bonding unit 400, and the free bonding unit 400 and the second main bonding unit 500. While the liver may be moved as shown in 2 and 3 of FIG. 3, the panel support stage 800 exists only in the region of the conductive film attachment portion 200. However, the panel support stage 800 also has a structure capable of moving in the X-axis, Y-axis, and θ-axis like the panel support and feed sharing stage 700.

Therefore, after the anisotropic conductive film ACF is attached to one side of the panel P supported by the panel support stage 800 through the conductive film attaching part 200, the panel P in this state is supported and transported. Must be transferred to the shared sharing stage 700. This is the first transfer 910.

The first transfer 910 also transfers the panel P from the loading unit 100 to the panel support stage 800, while also transferring the panel P from the panel support stage 800 to the panel support and transfer sharing stage 700. It also serves to convey the panel P.

For reference, the bonding apparatus of the present embodiment is further provided with a second transfer 920 in addition to the first transfer 910. The second transfer 920 is used to transfer the panel P, in which the bonding operation is finally completed, by the first and second main bonding parts 300 and 500 to the unloading part 600.

As shown in Figures 1 and 3, the panel support and transfer sharing stage 700 also moves in the X-axis direction, and the first and second transfers 910 and 920 also move in the X-axis direction, so that the movement therebetween. If the paths are the same, there is a conflict between them. In order to prevent such a phenomenon, in the present embodiment, the first and second transfers 910 and 920 are configured to form independent paths different from the panel support and transfer sharing stage 700. As shown in FIG. 1, the first and second transfers 910 and 920 are moved along the independent path 930 along the X axis to perform the corresponding work.

Meanwhile, in the present exemplary embodiment, separate transfers are not further provided except for the first and second transfers 910 and 920. Of course, although the first and second transfers 910 and 920 are provided in the present embodiment, the number of the first and second transfers 910 and 920 is significantly smaller, and the first and second transfers 910 and 920 of the present embodiment transfer the panel P only in a certain section. Since it is in charge of, it does not cause the same problem as before.

First, the prebonding unit 400 will be described. In the bonding apparatus of the present embodiment, one prebonding unit 400 is provided. The pre-bonding unit 400 press-bonds the anisotropic conductive film ACF slightly attached to the panel P in the conductive film attaching unit 200 through a constant heating temperature and a bonding time.

Of course, although the anisotropic conductive film ACF is pressed onto the panel P through the pre-bonding unit 400, this also does not mean complete bonding. Complete bonding is performed only through the first and second main bonding parts 300 and 500 which will be described later.

Both the first and second main bonding parts 300 and 500 have the same configuration, and bonding processes of the main compression bonding are separately performed at respective positions. The first and second main bonding parts 300 and 500 main-compress the anisotropic conductive film ACF, which has been press-bonded, to the panel P side through a constant heating temperature and a bonding time, thereby anisotropic conductive film ACF on the panel P. ) And finally bond.

For reference, in the present exemplary embodiment, one pre-bonding unit 400 is provided and two main bonding units are provided. In particular, the two first and second main bonding units 300 and 500 may use the pre-bonding unit 400. One is provided in the both sides of the prebonding part 400 in between.

Specifically, the heating temperature and bonding time required to prebond an anisotropic conductive film (ACF), which is usually applied to a mobile phone, for example, attached to a small panel P, is approximately 80 degrees and 0.2 seconds, It is known that the heating temperature and bonding time required for main bonding are approximately 220 degrees and 4.5 seconds.

As such, since the pre-bonding process requires a relatively low heating temperature and a relatively fast bonding time compared to the main bonding process, in the present embodiment, one pre-bonding unit is formed on both sides of the pre-bonding unit 400. While the second main bonding parts 300 and 500 are provided, one free bonding part 400 is provided.

However, since the scope of the present invention is not limited to the number thereof, the number of free bonding units 400 and the number of main bonding units may be the same. In addition, in the present embodiment, one main bonding part is provided on both sides of the free bonding part 400, but two main bonding parts may have a structure in which one main bonding part is arranged in one direction of the free bonding part 400. .

Meanwhile, the conductive film attaching process, the prebonding process, and the main bonding process may be performed through the conductive film attaching part 200, the prebonding part 400, and the first and second main bonding parts 300 and 500, respectively. The panel P or the panel P with the anisotropic conductive film ACF attached must be transferred to the work position.

In the prior art, this transfer operation is entirely dependent on the transfer, resulting in a problem of reduced process efficiency and production efficiency, and increased tact time.

However, the present embodiment does not use any transfer other than the operation degree of the first and second transfers 910 and 920 described above, and instead, the panel P or anisotropic conductive film ACF is attached to the corresponding work position. Solving the problem of the prior art by having the panel support and transfer sharing stage 700 to take charge of the operation of the conveyed panel (P).

For reference, when one panel support and transfer sharing stage 700 is provided, since the efficiency of a work falls, the present embodiment uses a plurality of panel support and transfer sharing stage 700. In this embodiment, two panel support and transfer sharing stages 700 are used.

As shown in FIG. 2, each of the panel support and transfer sharing stages 700 includes a main body 710 and a plurality of suctions connected to the main body 710 and adsorbing the panel P to one side. A panel support part 720 having a hole 721 is formed, and a film support part 730 connected to the panel support part 720 and supporting an anisotropic conductive film (ACF) to be attached to the panel (P).

The main body 710 further includes two control panels 711 for setting the vacuum pressure formed in the plurality of suction holes 721. Since the control panel 711 is provided with a plurality of operation buttons 711a and a panel window 711b, the operator checks the information displayed on the panel window 711b and the vacuum pressure is controlled by the plurality of operation buttons 711a. It can be set.

The reason why two control panels 711 are provided in the main body 710 is that two panels P are supported on both sides of the end region of the panel support 720 as shown in the drawing. If one panel P is supported by the panel support unit 720, one control panel 711 may be provided in the main body unit 710.

Thus, in the present embodiment, the two panels P are supported on both sides of the end region of the panel support portion 720. Of course, such a case may be due to the small size of the panel (P) applied to the mobile phone, for example.

In addition to this reason, the reason why two panels P are loaded and supported on one panel support 720 is simultaneous operation for two panels P, that is, pre-bonding process for two panels P and main In order to implement tact time faster by performing simultaneous work of each bonding process.

However, one panel P may be supported by one panel support 720 regardless of the size of the panel P, or three or more panels P may be supported to support and transport one panel at a time. The operation of the combined sharing stage 700 may be implemented such that simultaneous bonding to three or more panels P is implemented.

The film support 730 includes a support 731 for supporting an anisotropic conductive film (ACF) from the bottom, and a pair of support connecting portions 732 provided at both sides of the panel support 720 to be connected to both ends of the support 731. It includes. The support connecting portion 732 is provided with a bolt (not shown), the operator can connect the support 731 through the support connecting portion 732 by loosening or tightening the bolt.

Meanwhile, in a state in which the panel P is supported on the panel support and transfer sharing stage 700 without a transfer, a panel in which the panel P is supported in order to proceed with the pre-bonding process and the two main bonding processes is used. The support and feed sharing stage 700 should be rotated in the X-axis direction, the Y-axis direction, and θ-axis direction as necessary.

To this end, in the bonding apparatus of the present embodiment, the X-axis moving unit 741, the Y-axis direction is the eastern portion 742 and the θ-axis rotation unit 743 is further provided.

The X-axis moving unit 741 serves to move the panel support and feed sharing stage 700 in the X axis direction of FIG. 1, and the Y-axis move unit 742 serves as the panel support and feed sharing stage ( 1 and the θ-axis rotation part 743 rotates the panel support and transfer sharing stage 700 by a predetermined angle.

For this operation to be implemented, for example, the X-axis moving unit 741 may be applied as a linear motor partially connected with the panel support and transfer sharing stage 700, and the Y-axis moving unit 742. ) May be implemented as a combination structure of a motor and a ball screw, and the θ-axis rotation part 743 may be implemented as a rotating motor.

For the sake of convenience, these structures are not shown and described, but the structures of the X-axis moving unit 741, the Y-axis moving unit 742 and the θ-axis rotating unit 743 are not necessarily the same as described above. For example, the Y-axis direction moving part 742 may be changed to the cylinder structure instead of the combination structure of a motor and a ball screw, and this is enough if it is selected suitably and used according to a site situation.

For reference, movement in the Z-axis direction is required for the pre-bonding operation and the main bonding operation. The movement in the Z-axis direction may be implemented on the panel support and transfer sharing stage 700 or on the prebonding unit 400, the first and second main bonding units 300 and 500. If the movement in the Z-axis direction is implemented on the shared stage 700 for both the panel support and the transfer, the movement may be considerably complicated. The first and second main bonding parts 300 and 500 are implemented. Such an operation can be simply implemented by, for example, a cylinder structure or the like.

A bonding method of a driving circuit board having such a configuration will be described with reference to FIGS. 3 and 4 as follows.

First, the panel P transferred through the loading unit 100 is loaded into the panel support stage 800 (S11). Such an operation may be performed by the first transfer 910 described above.

When the panel P of the work object is loaded on the panel support stage 800, the anisotropic conductive film ACF is applied to the panel P by the interaction of the panel support stage 800 and the conductive film attaching part 200. It is attached (S12).

Next, the first transfer 910 is operated to support the panel P on which the anisotropic conductive film (ACF) is attached to the panel P, which is located in the pre-bonding unit 400, among the two panel supporting and transfer sharing stages 700. It transfers to the shared feed stage 700 (S13, (1) of FIG. 3).

When the panel P on which the anisotropic conductive film (ACF) is attached is transferred to the panel support and transfer sharing stage 700 positioned on the free bonding unit 400, the panel P is transferred on the panel support and transfer sharing stage 700. After the alignment (align) for the bonding operation, the pre-bonding operation is performed by the interaction between the panel support and transfer sharing stage 700 and the pre-bonding unit 400 (S14). As described above, the time required for the prebonding operation is relatively short, so it is performed quickly.

When the pre-bonding operation is completed, the panel support and transfer sharing stage 700 is directly moved in the + X-axis or -X-axis direction to the first and second main bonding parts 300 and 500. For example, the panel support and transfer sharing stage 700 is moved as it is in the -X axis direction of ② shown in FIG. 3 to approach the first main bonding part 300.

Then, the main bonding operation is performed by the interaction between the panel support and transfer sharing stage 700 and the first main bonding unit 300 (S15). In the main bonding operation, a separate secondary alignment is not performed because the conventional transfer is not used and the panel support and transfer sharing stage 700 supporting the panel P is transferred as it is. ) Process can be omitted.

Next, in parallel with the operation, a process of attaching the anisotropic conductive film ACF to the new panel P is performed in the conductive film attaching part 200 region. The new panel P to which the anisotropic conductive film ACF is attached is transferred back to the panel support and transfer sharing stage 700 located in the free bonding portion 400 by the first transfer 910, where Pre-bonding operation is in progress.

When the pre-bonding operation is completed, this time the panel support and transfer sharing stage 700 is moved as it is in the + X-axis direction of (3) shown in Figure 3 as it approaches the second main bonding part 500. Then, the main bonding operation is performed by the interaction between the panel support and transfer sharing stage 700 and the second main bonding part 500.

Meanwhile, while the bonding operation for the new panel P is performed on the second main bonding unit 500, the bonding operation for the panel P on the first main bonding unit 300 is completed. The panel P on which the bonding operation is completed is taken out to the unloading unit 600 by the second transfer 920 (S16).

After the panel P is taken out, the panel support and transfer sharing stage 700 positioned on the first main bonding part 300 is moved in the + X axis direction of ② shown in FIG. 3 to be prebonded. 400 is reached. Then, the new panel P is received from the conductive film attachment part 200 again, and the above-described process is repeated.

As described above, in the present exemplary embodiment, the plurality of panel support and transfer sharing stages 700 directly move to the pre-bonding unit 400 and the first and second main bonding units 300 and 500 while directly supporting the panel P. By performing the bonding operation, the process efficiency and the production efficiency can be further improved while shortening the tact time more than the conventional bonding apparatus in which the transfer of the panel P is entirely dependent on the transfer.

Although the description is omitted in the above-described embodiment, the series of processes of the above-described embodiment may be applied to a so-called chip on glass (COG) bonding process. As described above, the COG bonding process refers to a conductive film attaching process, a prebonding process, and a main bonding process. However, if the spirit of the present invention is applied to a FOG bonding process, the FOG bonding apparatus may be disposed adjacent to the COG bonding apparatus.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1 is a schematic diagram of a bonding apparatus for a driving circuit board according to an exemplary embodiment of the present invention.

FIG. 2 is an enlarged view of the panel support and transfer shared stage area shown in FIG. 1.

3 is a view schematically illustrating a bonding method of a driving circuit board according to an embodiment of the present invention.

4 is a flowchart illustrating a bonding method of a driving circuit board according to an exemplary embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

100: loading portion 200: conductive film attachment portion

300: first main bonding portion 400: free bonding portion

500: second main bonding portion 600: unloading portion

700: shared stage for panel support and transfer

800: panel support stage

910,920: first and second transfer

Claims (14)

A plurality of working parts configured to perform a bonding operation for bonding the driving circuit board to the flat panel display device panel; Combine and support at least one panel for supporting the flat panel display device panel at any one of the plurality of work units and transferring the flat panel display device panel to another one of the plurality of work units. A sharing stage; A loading unit for loading a panel to be bonded to the at least one panel support and transfer sharing stage; And It includes an unloading unit for unloading the panel in which the bonding operation is completed from the plurality of panel support and transfer sharing stage, The at least one panel support and transfer sharing stage, Main body; A panel support part connected to the main body part and having a plurality of suction holes formed at one side thereof to suck the panel; And A support for supporting an anisotropic conductive film (ACF) from the bottom and a pair of support connecting portion provided on both sides of the panel support and connected to both ends of the support, connected to the panel support to the panel Bonding device for a driving circuit board comprising a film support for supporting the anisotropic conductive film (ACF) to be attached. The method of claim 1, The plurality of work parts, A conductive film attaching part having a viscosity that is not separated during transfer to one surface of the panel to be bonded and having an anisotropic conductive film (ACF) attached thereto; Forming an after-process of the conductive film attaching part, and pressing the anisotropic conductive film (ACF) against the panel to which the anisotropic conductive film (ACF) is attached on the at least one panel support and transfer sharing stage. At least one pre-bonding unit pre-bonding the anisotropic conductive film (ACF); And Forming a post-process of the pre-bonding unit, and main compression of the anisotropic conductive film (ACF) of the pressure bonding to the panel side to at least one main bonding portion for bonding the anisotropic conductive film (ACF) to the panel, And the at least one panel support and transfer sharing stage transfers the flat panel display panel while moving between the free bonding portion and the main bonding portion. The method of claim 2, The at least one panel supporting and conveying sharing stage may support the panel when the prebonding part is pressed and transfer the panel to the main bonding part, and support the panel when the main bonding part is main compression. Bonding device for a driving circuit board. The method of claim 3, The prebonding unit is provided one, the main bonding unit is provided two, And the two main bonding parts are provided on both sides of the free bonding part with the free bonding part interposed therebetween. The method of claim 2, And the loading part, the conductive film attaching part, the pre-bonding part, the main bonding part, and the unloading part form an in-line process line. The method of claim 1, Bonding device for a driving circuit board, characterized in that the at least one panel support and transfer sharing stage is provided in plurality. The method of claim 6, An X-axis moving unit for moving the panel support and transfer sharing stage in a virtual X-axis direction connecting the loading unit and the unloading unit; A Y-axis moving unit for moving the panel support and feed sharing stage in the Y-axis direction so that the panel support and feed sharing stage is approached and spaced apart from the work unit; And It further comprises a θ axis direction rotating unit for rotating the panel support and transfer sharing stage in the θ axis direction, And the X-axis movement unit, the Y-axis movement unit, and the θ-axis rotation unit are disposed on the plurality of working units. The method of claim 6, Bonding device for the driving circuit board, characterized in that the main body portion is further provided with at least one control panel for setting the vacuum pressure formed in the plurality of suction holes. The method of claim 6, At least two panels are supported by the panel support. delete The method of claim 2, A panel support stage provided in the conductive film attaching region to support the flat panel display panel; A first transfer to transfer the panel on which the anisotropic conductive film (ACF) is attached onto the panel support stage to the panel support and transfer shared stage; And And a second transfer for taking out the panel bonded by the main bonding part from the shared stage for supporting and transporting the panel to the unloading part. delete A loading step in which a panel of a bonding work object is loaded into the panel support stage; A conductive film attaching step in which an anisotrofic conductive film (ACF) is attached to the panel support stage, the viscosity of which is not separated when transferred to one surface of the panel; A panel transfer step of transferring the panel having the anisotropic conductive film (ACF) attached thereto from the panel support stage to any one of the panel support and transfer sharing stages; A prebonding step of bonding the anisotropic conductive film (ACF) to the panel by pressing the anisotropic conductive film (ACF) on the panel support and transfer sharing stage; A panel support and transfer step of supporting the panel on which the anisotropic conductive film (ACF) is press-bonded to the main bonding portion while supporting the panel support and transfer share stage; Bonding the anisotropic conductive film (ACF) to the panel by main compression of the anisotropic conductive film (ACF) on which the pressure bonding is completed; And And an unloading step of unloading the panel on which the bonding operation is completed, And the main bonding step is performed on the panel support and transfer sharing stage in which the panel is transferred from the pre-bonding unit to the main bonding unit. delete

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