JP2012164706A - Mounting device and mounting method of mounted member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device which enables tape carrier packages (TCP) to be efficiently mounted to substrates.SOLUTION: A mounting device includes: a supply part 5 supplying rectangular shape substrates; a pair of first mounting part 14A, 14B arranged parallel to the supply part and mounting a TCP on a long side of each substrate supplied from the supply part; an ejection part 11 arranged parallel to the first mounting parts and ejecting each substrate on which the TCP has been mounted in the mounting part; a first transport table for supply 23 supplying each substrate in the supply part alternately to the pair of first mounting parts; and a delivery table for transportation 52 alternately taking out each substrate on which the TCP has been mounted and transporting the substrates to the ejection part.

Description

  The present invention relates to a mounting apparatus and mounting method for a mounted member that mounts an electronic component such as a TCP (Tape Carrier Package) as a mounted member on a substrate such as a glass panel used in a liquid crystal display device.

  For example, when manufacturing a liquid crystal display device, there is a step of mounting TCP, which is an electronic component as a mounted member, on a rectangular substrate such as a glass panel using a mounting device. The TCP is mounted on at least one long side of the four long sides and the short side of the substrate.

  The mounting apparatus includes a support unit such as a mounting table on which the substrate is supplied and mounted. The support portion has a placement surface having a smaller area than the planar shape of the substrate, and the substrate is supplied and placed on the placement surface. At that time, the substrate is positioned and held by causing the peripheral portion on which the TCP is mounted to protrude outward from the periphery of the mounting surface of the mounting stage.

  After the substrate is supplied and mounted on the support portion, a tape-like anisotropic conductive member, which is a mounted member, is attached to the side of the substrate on which the TCP is mounted. Next, after a plurality of the TCPs are temporarily pressure-bonded one by one to the place where the anisotropic conductive member is adhered, the temporarily pressure-bonded TCPs are pressure-heated with a pressure tool and finally pressure-bonded to the substrate. That is done.

  When TCP is pressure-bonded to the substrate, an anisotropic conductive member obtained by temporarily bonding TCP to the substrate has to be melt-cured. It may take longer work time than the process.

  Therefore, the following mounting work is performed in order to improve productivity. That is, in the previous step, two rectangular substrates with TCP temporarily bonded to three sides, one long side and two short sides, are transported one by one by the transport means and sequentially supplied to one mounting stage. Place. At that time, each substrate is positioned and placed on the mounting stage so that the three sides to which the TCP is temporarily press-bonded protrude outward from the mounting stage.

  In this state, the mounting stage is driven in the X direction, the Y direction, and the rotation direction, and the respective side portions to which the TCPs located in the same direction of the two substrates are temporarily bonded are positioned above the backup tool. Then, the pressure tool arranged above the backup tool is driven in the downward direction, and the TCP temporarily bonded to one side portion located in the same direction of the two substrates is finally pressure bonded.

  If the TCP temporarily bonded to one side portion located in the same direction of the two substrates is subjected to main pressure bonding, the mounting stage is rotated by 90 degrees and the TCP temporarily bonded to the next side portion is fixed to the main side. The TCPs on the three side portions of each substrate are finally pressure-bonded by pressure-bonding and then finally pressure-bonding the TCPs temporarily bonded to the remaining side portions.

  In this way, when the TCP is finally pressure-bonded, the two substrates on the mounting stage are sequentially taken out by the transport means and transported to the discharge unit disposed on the side of the mounting stage.

Japanese Patent No. 4579658

  As described above, if two substrates are supplied and placed on one mounting stage and TCPs temporarily bonded to the side portions located in the same direction of these substrates are simultaneously finally bonded to the mounting stage, Productivity can be improved as compared with the case where the substrates are supplied one by one and the TCP temporarily bonded to the side portion is finally bonded.

  However, if TCP is simultaneously mounted on the side portions located in the same direction of the two substrates supplied and placed on one mounting stage, the two substrates are mounted on the mounting stage from the previous process. There are cases where it is necessary to sequentially supply, and there are cases where two substrates on which TCP is mounted must be sequentially taken out from the mounting stage and transported to the discharge section.

  For this reason, the TCP mounting on the board is performed from the start to the end of the supply of the two substrates to the mounting stage and from the start to the end of the unloading of the two boards on which the TCP has been mounted. Since the work is interrupted, the operating rate of the mounting apparatus may be reduced accordingly. That is, since a series of mounting operations cannot be performed continuously, productivity may be reduced.

  The present invention provides a mounting apparatus for a mounted member that can improve productivity by allowing the mounting operation to be continuously performed when mounting the mounted member on the substrate. And providing a mounting method.

The present invention is a mounting device for mounting a mounted member on at least one of four sides of a rectangular substrate,
A supply unit for supplying the substrate;
A plurality of mounting portions that are mounted in parallel to the supply portion and mount the mounted member on at least one side of the substrate supplied from the supply portion;
A discharge unit that is arranged in parallel with the mounting unit and from which the substrate on which the mounted member is mounted is discharged.
Conveying means for alternately supplying the substrate of the supply unit to the plurality of mounting units, and alternately taking out the substrate on which the mounted member has been mounted from the plurality of mounting units and transporting them to the discharging unit And a mounting apparatus for a member to be mounted.

Having imaging means for imaging the substrate supplied from the supply unit to the mounting unit;
It is preferable that the conveying means positions and supplies the substrate to the mounting portion based on the imaging of the imaging means.

The mounting part above is
It is preferable that it is comprised by the two 1st mounting parts which mount the said to-be-mounted member with respect to one long side of the said board | substrate.

The mounting part above is
Two first mounting portions for mounting the mounted member on one long side of the substrate, and two second mounting portions for mounting the mounted member on one short side of the substrate It is preferable that it is comprised.

The mounting part above is
One first mounting portion for mounting the mounted member on one long side of the substrate, and two for mounting the mounted member on one short side of the two short sides of the substrate It is preferable that the second mounting portion and one third mounting portion that mounts the mounted member on the other short side of the two short sides of the substrate.

  The imaging means is provided so as to be movable between one of the two first mounting portions and the other, and when the substrate is alternately supplied to the two first mounting portions by the transport means, the substrate is supplied. It is preferable to be positioned at a position facing the mounting portion to be mounted.

The plurality of mounting portions include a backup tool that supports a lower surface of one side on which the mounted member of the substrate supplied by the transport unit is mounted, and an upper surface of one side supported by the backup tool. A pressure tool for mounting the mounted member;
It is preferable that the backup tool and the pressure tool of the plurality of mounting units are arranged in a line.

The mounting portion is provided with support means for supporting the substrate supplied by the transport means,
The support means includes a first suction support portion that sucks and supports a lower surface of a portion different from a portion supported by the backup tool on one side of the substrate on which the mounted member is mounted; It is preferable to have a second suction support portion that sucks and supports the upper surface of the side facing the one side on which the mounted member is mounted.

The transport means is a transport table mounted on the upper surface and driven in a horizontal direction, a vertical direction and a rotation direction,
The transfer table is driven between the supply unit and the plurality of mounting units to supply a substrate to each mounting unit, and is driven between each mounting unit and the discharge unit to each of the mounting units. It is preferable to have a discharge transport table for transporting the substrate on which the mounted member has been mounted in the mounting section to the discharge section.

The plurality of mounting portions include a backup tool that supports the lower surface of one side on which the mounted member of the substrate supplied by the transport unit is mounted, and a plurality of mounting parts on the upper surface of one side supported by the backup tool. A plurality of pressure tools for mounting each of the mounted members one by one,
The backup tool and the plurality of pressure tools of the plurality of mounting portions are arranged in a line, and the plurality of pressure tools are provided so as to be positioned with respect to the plurality of mounting portions,
The plurality of pressurizing tools may be configured to be positioned so that the number corresponding to the number of mounted members mounted on one side of the substrate in each mounting portion faces the backup tool of each mounting portion. preferable.

The present invention is a mounting method for mounting a mounted member on at least one of four sides of a rectangular substrate,
Supplying the substrate taken out from the supply unit alternately to the plurality of supply units that are arranged in parallel to the supply unit and mount the mounted member on at least one side of the substrate; and
And a step of alternately taking out the substrate on which the mounted member has been mounted from the plurality of mounting portions.

  According to the present invention, the substrate is alternately supplied to the plurality of mounting portions, and the substrate on which the member to be mounted is mounted in each mounting portion is alternately taken out from the plurality of mounting portions.

  For this reason, among the plurality of mounting parts, the mounting work is interrupted for one mounting part that supplies a board or takes out the board on which the mounted member is mounted, but the remaining mounting parts continue the mounting work. Can do. That is, since a series of mounting operations can be performed continuously, it is possible to improve the operating rate of the mounting unit and improve productivity.

The top view which shows the mounting apparatus of 1st Embodiment of this invention. The front view of the mounting part of the mounting apparatus shown in FIG. The side view which shows a supply side support part and a discharge side support part. The top view of the board | substrate with which TCP was temporarily crimped | bonded to the long side and the short side. The front view which shows the 1st conveyance table, the 2nd conveyance table, and the carrying table support part for carrying out. The side view which shows the 1st, 2nd mounting part. The control system diagram of a mounting apparatus. Explanatory drawing at the time of supplying a board | substrate from a supply part to two 1st mounting parts. Explanatory drawing of the state which one 2nd conveyance table moved below the board | substrate supplied to one 1st mounting part. The substrate on which the TCP is finally bonded to the long side at one first mounting portion is transported to one second mounting portion, and the other second second is placed on the lower surface of the substrate supplied to the other first mounting portion. Explanatory drawing of the state which the conveyance table for supply moved. One of the second supply transport tables moves from the lower side of the substrate of the one second mounting unit to the lower side of the substrate newly supplied to the one first mounting unit, and the carry-out transport table of one of the second mounting units Explanatory drawing of the state which moved below the board | substrate by which the short side TCP was finally pressure-bonded in the 2nd mounting part. Explanatory drawing of the state by which the board | substrate which this crimping | compression-bonding complete | finished by one 2nd mounting part was conveyed to the discharge part by the carrying table for carrying out while a new board | substrate was supplied to the other 1st mounting part. The board on which the long-side TCP is finally pressure-bonded in one first mounting section is transported to one second mounting section, and the other second supply transport table is transferred to the other first mounting section. Explanatory drawing of the state which passed through below the newly supplied board | substrate. The top view which shows 2nd Embodiment of this invention, Comprising: The schematic structure of the mounting apparatus which carries out this pressure bonding of TCP temporarily crimped | bonded to one long side and two short sides of a board | substrate. In the third embodiment of the present invention, when different numbers of TCPs are mounted on two different sides of the substrate, the first mounting unit having a plurality of pressure tools corresponding to the number of TCPs and the first mounting unit The front view which shows the mounting part of 2. FIG. Front view showing a state in which the number of pressure tools in the first mounting unit and the second mounting unit is changed when the number of TCPs temporarily bonded to two different sides of the substrate is changed from the state shown in FIG. Figure.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 13 show a first embodiment of the present invention. In the first embodiment, as shown in FIG. 4, for example, a tape-like anisotropic conductive member is formed on one long side and one short side of a glass-made rectangular substrate W used in a liquid crystal display panel. A mounting apparatus for permanently press-bonding TCP 2 which is an electronic component as a mounted member temporarily bonded by 3 will be described.

  The TCP 2 has the anisotropic conductive member 3 cut to a predetermined length on the lower surface of one end before being temporarily press-bonded to the substrate W, and the anisotropic conductive member 3 is attached to the TCP 2. The plurality of attached TCPs 2 are temporarily pressed onto the upper surfaces of the long side and the short side of the substrate W at predetermined intervals. In other words, five TCP2 are temporarily bonded to the long side and three are short-bonded to the short side of the substrate W in the pre-bonding step.

  FIG. 1 is a plan view showing a schematic configuration of the mounting apparatus. This mounting apparatus includes a rectangular base 4. At one end portion of the base 4 in the longitudinal direction, the substrate W supply unit 5 is provided. The supply unit 5 has a supply-side support unit 6 that horizontally supports the substrate W that has been transferred by a transfer means (not shown) such as a transfer table from the previous step as shown in FIG.

  The supply side support portion 6 has a plurality of suction holes 7a formed on the upper surface at predetermined intervals in the longitudinal direction, and a support member 7 that sucks and supports the lower surface on one long side of the substrate W by the upper surface. And a pad drive source 8 such as a linear motor. A plurality of suction pads 9 (only one is shown) are attached to a drive shaft 8 a driven in the vertical direction of the drive source 8, and the lower surface of one long side of this suction pad 9 is attracted to the upper surface of the support member 7. The upper surface of the other long side of the substrate W is sucked and held.

  As a result, when the substrate W is transported and positioned at the supply position of the supply unit 5 by a transport table (not shown) in the previous process, the lower surface of one long side of the substrate W has the support member 7 as shown in FIG. The upper surface on the other long side is sucked and supported by the upper surface, and the upper surface on the other long side is sucked by the suction pad 9 to be held horizontally at a predetermined height.

  On the other end of the base 4 in the longitudinal direction, a pair of first mounting portions 14A and 14B, which will be described later, and a pair of second mounting portions 15A and 15B are provided on the long side and the short side of the substrate W. The temporarily crimped TCP 2 has main discharge sequentially, that is, a discharge unit 11 on which the mounted substrate W is conveyed. The discharge section 11 has the same configuration as the supply side support section 6 of the supply section 5 shown in FIG. 3, that is, a discharge side support section 12 having a support member 7 and a suction pad 9.

  The lower surface on one long side of the substrate W transported from the second mounting portions 15A and 15B is sucked and supported by the support member 7, and the upper surface on the other long side is sucked by the suction pad 9. By supporting it, the substrate W is held horizontally at a predetermined height.

  When the substrate W for which the main pressure bonding of the TCP 2 has been completed is supplied to the discharge unit 11, a transport table (not shown) for the next process enters the lower surface thereof, and receives the substrate W and delivers it to the next process. It has become.

  Between the supply unit 5 and the discharge unit 11, the two first mounting units 14A and 14B and the two second mounting units 15A and 15B described above are provided in a line along the longitudinal direction of the base 4. It has been.

  As shown in FIG. 2, the first and second mounting portions 14 </ b> A, 14 </ b> B and 15 </ b> A, 15 </ b> B have a backup tool 17 having a length that is slightly longer than the long side of the substrate W. These backup tools 17 are provided at predetermined intervals on the upper surface of a base 18 provided along the longitudinal direction on the rear end side of the base 4 in the front-rear direction.

  Above each backup tool 17, a pressurizing tool 19 having the same length as the backup tool 17 is provided so as to be vertically driven by a pressurizing drive source 21 such as a linear motor.

  The backup tool 17 and the pressure tool 19 are provided with heaters (not shown). As will be described later, after the side on which the TCP2 of the substrate W is temporarily pressed is positioned and placed on the backup tool 17, the pressing tool 19 is driven in the downward direction to pressurize the TCP2. The anisotropic conductive member 3 having the TCP 2 bonded to the substrate W is melted and cured. Therefore, the TCP 2 is fixed to the substrate W. That is, the TCP 2 is finally bonded to the substrate W.

  As shown in FIG. 1, the substrate W that is supplied to the supply unit 5 and supported horizontally is taken out by the first supply transfer table 23, and is applied to one and the other of the pair of first mounting units 14A and 14B. Alternately supplied.

  In the case where there are three first mounting portions, the substrates W may be supplied alternately to the three first mounting portions by the first supply transport table 23, that is, in order.

  As shown in FIG. 5, the first supply transport table 23 has an X movable body 25 provided so as to be movable along an X guide 24 provided along the longitudinal direction of the base 4. The X guide 24 and the X movable body 25 constitute an X linear motor (not shown).

On the upper surface of the X movable body 25, there is provided a Y movable body 28 that is movable along the Y direction that intersects the X direction (indicated by an arrow in FIG. 5) that is the movement direction of the X movable body 25. The movable body 28 is driven by a Y drive source 29 provided on the X movable body 25.
The X direction and Y direction in the base 4 are indicated by arrows in FIG.

  A θ movable body 31 movable in the rotational direction is provided on the upper surface of the Y movable body 28, and the θ movable body 31 is driven in the rotational direction by a θ drive source 32 provided on the Y movable body 28. It has become. A Z drive source 33 is provided on the upper surface of the θ movable body 31, and a rectangular table 34 is horizontally provided on the upper end of a drive shaft 33 a in which the axis of the Z drive source 33 is vertical.

  Driving of the first supply transport table 23 having the above-described configuration is controlled by the control device 26 shown in FIG. That is, the drive of the X linear motor, the Y drive source 29, the θ drive source 32, and the Z drive source 33 is controlled by the control device 26.

The table 34 is formed in a rectangular shape smaller than the substrate. Accordingly, when the substrate W supported by the supply unit 5 is transferred to the upper surface of the table 34, the peripheral portion of the substrate W protrudes outward from the peripheral portion of the table 34.
Although not shown, a plurality of suction holes for sucking and holding the substrate W are formed in the upper surface of the table 34.

  After the substrate W transported and supplied to the first mounting portion 14A or 14B by the first supply transport table 23 is positioned as described later, each mounting portion 14A of the gantry 18 as shown in FIG. , 14B is supported by a support means 36 provided at a position opposite to 14B.

  The support means 36 has a plurality of suction holes 37a (only one shown) formed on the upper surface at predetermined intervals along the longitudinal direction, and the upper surface supports the lower surface of one long side of the substrate W by suction. A member 37 and a plurality of suction pads 38 (only one is shown) for sucking and holding the upper surface of the other long side of the substrate W are provided.

  The suction pad 38 is attached to a drive shaft 39a of a pad drive source 39 such as a linear motor or a cylinder, and is driven in the vertical direction by the drive shaft 39a.

  When the substrate W is transported to the first mounting portion 14A by the first supply transport table 23, for example, the long side on which the TCP2 of the substrate W is temporarily press-bonded is located above the backup tool 17. Positioning marks (not shown) provided on both ends of the long side of the substrate W just before facing each other are provided by a pair of first imaging cameras 41 provided on the front surface (side surface on the −Y direction side) of the gantry 18. Imaged.

  As shown in FIG. 2, the pair of first imaging cameras 41 is provided on the upper surface of the movable body 42 elongated along the X direction at intervals shorter than the length of the long side of the substrate W by a predetermined dimension. As shown in FIG. 6, the movable body 42 is movably provided on a guide 43 provided along the X direction on the front surface of the gantry 18. The guide 43 and the movable body 42 constitute a first imaging linear motor 44 (shown in FIG. 7).

  The imaging signal of the first imaging camera 41 is output to the image processing unit 45 shown in FIG. 7, where it is binarized. The imaging signal processed by the image processing unit 45 is output to the control device 26 and processed. Accordingly, the substrate W transferred to the first mounting portion 14A by the first supply transfer table 23 is transferred to the X direction, the Y direction, and the θ direction before the long side is transferred onto the backup tool 17. A deviation in direction is calculated.

  Then, the control device 26 drives and controls the first supply transport table 23 based on the calculated deviation amounts of the substrate W in the X direction, the Y direction, and the θ direction, and corrects the deviation amount. The first supply transport table 23 is driven in the + Y direction indicated by an arrow in FIG. 6 to position one long side of the substrate W above the backup tool 17 of the first mounting portion 14A.

  After the positioned substrate W is horizontally supported by the support member 37 and the suction pad 38, the first supply transport table 23 is driven in the downward direction as the table 34 is indicated by a chain line in FIG. Then, the process returns to the supply unit 5.

  In the meantime, in the first mounting portion 14A on which the substrate W is supplied and supported, the pressure tool 19 above the backup tool 17 is driven in the downward direction. As a result, the TCP 2 temporarily bonded to the long side of the substrate W is finally bonded.

  The first supply transport table 23 returned to the supply unit 5 receives the next substrate W at the supply unit 5 and supplies the substrate W to the other first mounting unit 14B. At this time, as shown by a chain line in FIG. 2, the movable body 42 to which the pair of first imaging cameras 41 that are opposed to the first mounting portion 14A is attached is a first imaging linear motor 44 (FIG. 7) to the position facing the other first mounting portion 14B.

  Accordingly, a pair of alignment marks (not shown) provided on the long side of the substrate W that has been transferred to the other first mounting portion 14B by the first supply transfer table 23 is provided on the movable body 42. The first imaging camera 41 takes an image, and the position is corrected and positioned based on the imaging signal.

  The substrate W positioned on the other first mounting portion 14B has a lower surface on one long side and an upper surface on the other long side by the support means 36 provided facing the first mounting portion 14B. After being supported, the TCP 2 temporarily bonded to one of the long sides is finally bonded.

  The substrate W on which the TCP 2 temporarily bonded to one long side by the pair of first mounting portions 14A and 14B is bonded to the first mounting portion by the two second supply transport tables 47A and 47B. 14A and the other first mounting portion 14B are taken out alternately, that is, TCP2 temporarily press-bonded to the long side in the order of final press-bonding to one second mounting portion 15A and the other second mounting portion 15B. On the other hand, they are supplied alternately, that is, in order.

  The second supply transport tables 47A and 47B have the same configuration as the first supply transport table 23 shown in FIG.

  That is, one second supply transfer table 47A is shown in FIG. 1 when the first supply transfer table 23 returns to the supply unit 5 after supplying the substrate W to the first first mounting unit 14A. From the position facing one of the second mounting portions 15A, it enters the lower surface side of the substrate W supported by the first mounting portion 14A and waits for the mounting to be completed.

  Then, when the main pressure bonding to the long side of the substrate W is completed in one first mounting portion 14A, the one second supply transport table 47A receives the substrate W, rotates it 90 degrees, and rotates the second second one. It is conveyed to the mounting part 15A.

  Similarly to the first mounting portion 14A, the other second supply transport table 47B has the supply portion after the first supply transport table 23 has finished supplying the substrate W to the other first mounting portion 14B. When the process returns to 5, the process waits for the mounting to be completed after entering the lower surface side of the substrate W supported by the other first mounting part 14B from the position facing the other second mounting part 15B shown in FIG. ing.

  When the main pressure bonding to the long side of the substrate W is completed in the other first mounting portion 14B, the other second supply transfer table 47B receives the substrate W, rotates 90 degrees, and rotates the other second It is conveyed to the mounting part 15B.

  At a portion facing the pair of second mounting portions 15A and 15B on the front surface side of the gantry 18, support means 36 having a support member 37 and a suction pad 38 is provided as in the case of the first mounting portions 14A and 14B. Is provided. Further, on the front surface of the gantry 18, a space between one second mounting portion 15A and the other second mounting portion 15B is guided along a guide 43 by a second imaging linear motor 48 (shown in FIG. 7). The movable body 42 is driven. As shown in FIG. 2, the movable body 42 is provided with a pair of second imaging cameras 49 at intervals slightly shorter than the length of the short side on which the TCP 2 of the substrate W is temporarily bonded.

  The pair of second imaging cameras 49 is located at the position indicated by the solid line in FIGS. 1 and 2, and the short side of the substrate W supplied to one second mounting portion 15 </ b> A by one second supply transfer table 47 </ b> A. An alignment mark (not shown) is imaged, and on the basis of the imaging, the control device 26 controls the one second supply transfer table 47A so that the short side of the substrate W is positioned on the one second mounting portion 15A. Is controlled.

  When the substrate W is supplied to the other second mounting portion 15B by the other second supply transport table 47B, the pair of second imaging cameras 49 are moved by the second imaging linear motor 48 to the first one. The second mounting portion 15A is driven to a position facing the other second mounting portion 15B, and an alignment mark (not shown) on the short side of the substrate W supplied to the second mounting portion 15B is imaged. Then, the control device 26 controls the other second supply transfer table 47B so that the short side of the substrate W is positioned on the one second mounting portion 15A based on the image pickup by the second image pickup camera 49. Is controlled.

  In this way, when the substrate W is supplied to one second mounting portion 15A and the other second mounting portion 15B and each short side is sequentially positioned with respect to the backup tool 17, the positioning is performed. The pressurizing tool 19 is driven in the descending direction in order, and the TCP2 temporarily press-bonded to each short side is sequentially main-bonded.

  That is, in the pair of second mounting portions 15A and 15B, the TCP2 temporarily press-bonded to the short side of the substrate W is alternately subjected to the main pressing in the order in which the TCP2 is supplied to the second mounting portions 15A and 15B.

  The substrate W on which the TCP2 is finally crimped to the short side by the pair of second mounting portions 15A and 15B is taken out by the carry-out transfer table 52 and transferred to the discharge portion 11, and the discharge portion 11 is provided with the above-described substrate W. It is supported by the discharge side support part 12.

The substrate W supported by the discharge side support portion 12 is taken out by a transfer table (not shown) in a post-mounting process and transferred to the next process.
Since the carry-out transfer table 52 has the same configuration as the first supply transfer table 23, detailed illustration and description thereof will be omitted.

  The carry-out transfer table 52 is configured such that one of the second supply transfer tables 47A supplies the substrate W to the one second mounting portion 15A, and then is supplied and supported by the one first mounting portion 14A. When returning to the lower side of W, it moves to the lower side of the substrate W supplied and supported by the second mounting portion 15A from the discharge portion 11 and waits for the final press-bonding here to end.

  When the main pressure bonding at the one second mounting portion 15A is completed, the carry-out transport table 52 takes out the substrate W, transports it to the discharge portion 11, and supports it on the discharge-side support portion 12. Next, the carry-out transport table 52 moves below the substrate W supplied and supported by the other second mounting portion 15B, and the TCP2 temporarily crimped to the short side of the substrate W is finished. stand by.

  When the main pressure bonding is completed, the substrate W is transported to the discharge unit 11. In other words, the discharge transfer table 52 is configured to transfer the substrates W to which the TCP2 is finally pressure-bonded to the short side by the pair of second mounting portions 15A and 15B to the discharge portion 11 alternately. That is, the substrate W is transported to the discharge unit 11 in the order in which the TCP 2 is finally crimped to the short side by the pair of second mounting portions 15A and 15B.

  Even when there are three or more second mounting portions, the substrates W may be transported to the discharge portion 11 in the order in which the TCPs 2 are finally pressure-bonded, that is, alternately.

  As shown in FIG. 7, the pad drive source 8, the pressurization drive source 21, the first supply transport table 23, the pad drive source 39, the first imaging linear motor 44, and a pair of second sources. Driving of the supply transport tables 47A and 47B, the second imaging monitor 48, and the transport table 52 is controlled by the control device 26.

  In this embodiment, the first supply transport table 23, the first imaging linear motor 44, the second supply transport tables 47A and 47B, the second imaging linear motor 48, and the transport transport. The table 52 constitutes a conveying unit.

  Next, a procedure for final pressure-bonding the TCP 2 temporarily bonded to one long side and one short side of the substrate W by the mounting apparatus having the above configuration will be described with reference to FIGS. 8 to 13.

  First, as shown by an arrow A in FIG. 8, the substrate W is supplied from the supply unit 5 to the first mounting unit 14A by the first supply transfer table 23 and positioned, and then the first supply transfer table is provided. As shown by the arrow B by the table 23, the substrate W is supplied to the other first mounting portion 14B and positioned. Thereafter, the first supply transfer table 23 returns to the supply unit 5, and the next substrate W is supplied to the first supply transfer table 23.

  Next, as shown by an arrow C in FIG. 9, the second mounting portion 15A is in a stand-by state as shown in FIG. 8 below the substrate W positioned on the first mounting portion 14A. One second supply transport table 47A enters, and waits for the end of the final press-bonding of the TCP 2 temporarily bonded to the long side of the substrate W.

  Next, as shown by an arrow D in FIG. 10, the other second mounting transfer table 47B (shown in FIG. 9) that has been waiting in the other second mounting portion 15B is replaced with the other first mounting portion. It waits for completion | finish of the main crimping | compression-bonding of TCP2 which entered below the board | substrate W positioned by 14B and was temporarily crimped | bonded to the board | substrate W.

  At substantially the same time, since the final press-bonding of the TCP 2 temporarily bonded to the long side of the substrate W supplied to the first mounting portion 14A is completed, the second second waiting on the lower surface of the substrate W is completed. The supply transfer table 47A takes out the substrate W from the first mounting portion 14A and supplies the substrate W to the second mounting portion 15A while rotating the substrate W by 90 degrees. This movement is indicated by an arrow E in FIG.

  Next, as shown in FIG. 11, the substrate W that has been subjected to the final press-bonding of the long side TCP 2 at the other first mounting portion 14B is taken out by the other second supply transport table 47B that has been waiting on its lower surface. Then, the substrate W is conveyed to the other second mounting portion 15B as indicated by an arrow F while being rotated 90 degrees. Further, a new substrate W is supplied from the supply unit 5 to the first mounting unit 14A.

  At the same time, one second supply transport table 47A that transports the substrate W to one second mounting portion 15A is supplied and supported from one second mounting portion 15A to one first mounting portion 14A. While moving to the lower surface of the substrate W, as shown by an arrow G in FIG. 11, the carry-out transfer table 52 moves from the discharge portion 11 to the lower surface of the substrate W supported by one second mounting portion 15A.

  Next, as shown in FIG. 12, the substrate W that has been subjected to the final press-bonding of the TCP 2 on the short side in one of the second mounting portions 15A is taken out by the discharge transport table 52 as indicated by the arrow H, and is discharged. It is conveyed to. At the same time, as indicated by an arrow I, a new substrate W is transported and supplied from the supply unit 5 to the other first mounting unit 14B by the first supply transport table 23.

  Next, as indicated by an arrow J in FIG. 13, the first supply transport table 23 returns from the other first mounting portion 14 </ b> B to the supply portion 5, and the other second supply transport table 47 </ b> B moves to the arrow K. As shown in FIG. 8, the substrate moves from the other second mounting portion 15B to the lower side of the substrate W supplied and supported by the other first mounting portion 14B.

  Thereafter, the carry-out transport table 52 moves below the substrate W supported by the other second mounting portion 15B as indicated by an arrow L, and the substrate W on which the TCP2 is finally crimped to the short side is taken out. As indicated by the arrow L, it is conveyed to the discharge unit 11.

  By repeating such an operation, the substrate W is alternately supplied from the supply unit 5 to the pair of first mounting units 14A and 14B, and is supplied by the pair of first mounting units 14A and 14B. The TCP 2 temporarily bonded to the long side of the substrate W in this order is finally bonded.

  The substrates W on which the TCP2 is finally pressure-bonded on the long side by the pair of first mounting portions 14A, 14B are alternately supplied to the pair of second mounting portions 15A, 15B in the order in which they are finally pressure-bonded. TCP2 temporarily bonded to the short side of W is finally bonded.

  The substrate W on which the TCP2 is finally crimped to the short side by the pair of second mounting portions 15A and 15B is transported to the discharge unit 11 in the order of the final crimping and is delivered to the next process.

  Therefore, when such an operation is continuously performed, the pair of first mounting portions 14A and 14B and the pair of second mounting portions 15A and 15B are respectively used by either one or the other mounting portion. The TCP2 main pressure bonding is performed without interruption.

  That is, when a substrate is supplied to or taken out of one of the pair of first mounting portions 14A and 14B and one of the pair of second mounting portions 15A and 15B. However, mounting (main press bonding) is performed at the other mounting portion.

  Therefore, when the substrate W is supplied or taken out, it is possible to perform the mounting continuously without stopping both the first mounting parts 14A and 14B and the second mounting parts 15A and 15B. It is possible to improve the performance.

  In addition, by doing so, the substrate W on which the TCP 2 is finally crimped to the long side and the short side is carried out from the second mounting part 15A and the second mounting part 15B to the discharge part 11 alternately. Since it can be smoothly supplied from the discharge unit 11 to the next process at regular intervals, it is possible to improve the operating rate of a device for mounting a circuit board on the TCP 2, for example, provided in a subsequent process of the mounting device. it can.

  Mounting positions of the pair of first mounting portions 14A and 14B and the pair of second mounting portions 15A and 15B with respect to the substrate W, that is, the backup tool 17 that supports the substrate W and the upper side of the backup tool 17 are opposed to each other. The provided pressure tool 19 was arranged in series along the X direction. That is, it arrange | positions so that it may be located on a straight line.

  Therefore, when installing the plurality of mounting parts 14A, 14B and 15A, 15B on the base 4, the positioning of each mounting part can be easily performed. In particular, in this embodiment, the backup tools 17 of the mounting portions 14A, 14B and 15A, 15B are provided in a row on the upper surface of one gantry 18, so that a plurality of mounting portions 14A, 14B and Installation of 15A and 15B becomes easy.

  In each of the mounting portions 14A, 14B and 15A, 15B, the supply portion 5, and the discharge portion 11, the support means 36 that supports the substrate W, the supply side support portion 6, and the discharge side support portion 12 are the lower surface of one side of the substrate W and one side thereof. Since the upper surface of the other side opposite to the substrate is sucked and supported horizontally, there is almost no obstacle on the lower surface side of the horizontally supported substrate W.

  Therefore, the first supply transfer table 23, the pair of second supply transfer tables 47A and 47B, and the carry-out transfer table 52, which are driven in the X direction and the X direction on the base 4 to transfer the substrate W, are supplied from the supply unit. 5. Each mounting part 14A, 14B and 15A, 15B can be easily moved to the lower surface side of the substrate W supported by the discharge part 11. That is, the movement route of each table 23, 47A, 47B and 52 is not limited as in the case where there is an obstacle.

  Therefore, the movement path of the first supply conveyance table 23, the pair of second supply conveyance tables 47A and 47B, and the carry-out conveyance table 52 can be shortened, and the time required for movement can be shortened. It is possible to improve the performance.

  When positioning the substrate W with respect to one first mounting portion 14A and the other first mounting portion 14B that are permanently pressure-bonded with the TCP 2 to the long side of the substrate W, a pair of first images to be imaged to position the substrate W One imaging camera 41 can be moved between one first mounting portion 14A and the other first mounting portion 14B so that they can be used together.

  Similarly, the second imaging camera 49 can be moved between the second mounting portion 15A and the other second mounting portion 15B so that they can be used together.

  Therefore, compared with the case where an imaging camera is installed in each mounting part 14A, 14B and 15A, 15B, the amount of use of the imaging camera can be reduced by half and cost can be reduced.

  That is, the pair of first mounting portions 14A and 14B and the pair of second mounting portions 15A and 15B are arranged in a row, so that a pair of the first imaging camera 41 and the second pair are mounted between the mounting portions. The imaging camera 49 can be used in two mounting portions.

  In the first embodiment, an example in which the TCP 2 is permanently pressure-bonded to one long side and the short side of the substrate W has been described. However, the two first steps are performed only on one long side of the substrate W. Even in the case where TCP2 is finally pressure-bonded by the mounting portions 14A and 14B, as in the first embodiment, the supply and unloading of the substrate W to and from the two first mounting portions 14A and 14B are alternately performed. The operating rate of the mounting apparatus can be increased.

  FIG. 14 shows a second embodiment of the present invention. This embodiment shows a mounting apparatus that performs final pressure bonding of a TCP 2 temporarily bonded to one long side and two short sides of a substrate W. Note that in the second embodiment of the present invention, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  That is, the TCP 2 temporarily bonded to the long side of the substrate W is finally bonded by one first mounting portion 14. The main press-bonding of the TCP2 temporarily bonded to one short side of the substrate W on which the TCP2 is finally bonded to the long side is performed by the pair of second mounting portions 15A and 15B. The main pressure bonding of the TCP 2 temporarily bonded to the other short side of the substrate W is performed by one third mounting portion 55.

  The substrate W is transported from the supply unit 5 to the first mounting unit 14 by the first supply transport table 23, and transports the substrate W from the first mounting unit 14 to the second mounting units 15 </ b> A and 15 </ b> B and the second mounting unit 14. The substrate W is transported from the mounting portions 15A and 15B to the third mounting portion 55 alternately by the two second supply transport tables 47A and 47B. The substrate W is transported from the third mounting unit 55 to the discharge unit 11 by the unloading transport table 52.

  The support structure and positioning of the substrate W in each of the mounting portions 14, 15A, 15B, and 55 are performed in the same manner as in the first embodiment. Further, when positioning the substrate W, the first mounting unit 14 captures an image by a pair of first imaging cameras 41 provided in a fixed manner, and the second mounting units 15A and 15B move between these mounting units. This is performed by a pair of second imaging cameras 49 provided as possible. In the 3rd mounting part 55, it carries out by a pair of 3rd imaging cameras 56 provided fixedly here.

  Even in such a configuration, the substrate W is transferred from the first mounting portion 14 to the pair of second mounting portions 15A and 15B, and from the pair of second mounting portions 15A and 15B to the third mounting portion 55. Since the substrate W is transferred alternately by the two second supply transfer tables 47A and 47B, the operating rate of the mounting apparatus can be increased and the productivity can be improved.

  In the first embodiment, in the four mounting portions, the TCP temporarily bonded to the long side of the substrate in the two mounting portions is finally pressure bonded, and then temporarily bonded to the short side in the other two mounting portions. Although TCP is finally pressure-bonded, TCP is temporarily pressure-bonded to the short side at the two mounting parts, and TCP is temporarily pressure-bonded to the long side at the other two mounting parts. Also good.

  In addition, after the TPC of the long side of one board is finally crimped by one mounting part, the TCP of the short side of two boards is finally crimped by two mounting parts, and then the other one by the remaining one mounting part. Alternatively, the long side TCP of one substrate may be subjected to main pressure bonding.

  On the contrary, after the TPC of the short side of one board is finally crimped by one mounting part, the TCP of the long side of two boards is finally crimped by the next two mounting parts, and then the fourth Alternatively, the TCP of the short side of the other one substrate may be subjected to main pressure bonding at the mounting portion.

  For example, when six mounting parts are provided, as in the case of having four mounting parts, long-side TCP is finally pressure-bonded with the first three mounting parts, and short-side TCP with the next three mounting parts. You may make it carry out this pressure bonding.

On the contrary, the short side TCP is finally crimped in the first three mounting parts, and the long side TCP is finally crimped in the next three mounting parts. Eight kinds of main press bonding can be performed.

  That is, if the main pressure bonding is performed on the same side, such as a long side or a short side, on two substrates in at least two adjacent mounting portions, the substrate is mounted on the two mounting portions. It is possible to supply alternately, and to carry out the substrate alternately from the two mounting parts after the main pressure bonding, thereby shortening the tact time.

  In the first and second embodiments, the imaging camera can be moved between the first mounting unit and the second mounting unit. For example, another unit such as a pressure tool or a backup tool may be used. You may make it provide so that a movement is possible. By doing so, it is possible to further reduce the cost.

  In the first and second embodiments, the pressure tool is disposed on the upper side and the backup tool is disposed on the lower side. However, the pressure tool is disposed on the lower side and the backup tool is disposed on the upper side. Also good.

  In the first and second embodiments, the lower surface of the side on which the TCP of the substrate is mounted is sucked and supported by the support member (first suction support part), and the suction pad (second suction support part) is used. Although the upper surface of the side opposite to the side on which the TCP is mounted is sucked and supported, the upper surface of the side on which the TCP of the substrate is mounted may be sucked and supported by the support member.

  In this way, the movement range of each table can be further expanded, so that the tact time required for transporting the substrate can be shortened.

  The upper surface of the substrate may be sucked and supported by the first suction support portion, the lower surface of the substrate may be sucked and supported by the second suction support portion, and the lower surface of the substrate may be sucked and supported by the first suction support portion. The second suction support portion may support the lower surface of the substrate by suction. In this case, when each table is moving, it may be configured to be movable so that each support portion is retracted from the table moving path.

  Further, the supply transport table and the carry-out transport table have been described by taking the structure of supporting and transporting the lower surface of the substrate as an example, but the upper surface of the substrate may be sucked and transported by a suction pad.

  In the first and second embodiments, the case where the TCP having the anisotropic conductive member attached is temporarily bonded to the substrate and then finally bonded is described as an example. There is no problem even if the conductive member is pasted and then the TCP is temporarily pressure-bonded to the anisotropic conductive member and then the pressure-bonded.

  15 and 16 show a third embodiment of the present invention. This embodiment is a case where a plurality of TCPs 2 temporarily bonded to the substrate W are mounted by separate pressing tools. FIG. 15 shows five TCPs 2 on the long side of the substrate W by the first mounting part 61. The two pressure tools 19A are used for the final pressure bonding, and the second mounting portion 62 is configured to perform the final pressure bonding of the three TCPs 2 to the short side of the substrate W using the three pressure tools 19A.

  The long side and the short side of the substrate W are supported by a single backup tool 17A provided on the top surface of the gantry 18, and a plurality of the side portions are provided above the backup tool 17A. In this embodiment, a pressurizing drive source 21A for driving the eight pressurizing tools 19A in the vertical direction is provided so as to be movable to a beam 63 laid horizontally and fixed at a predetermined moving position.

  Then, the five pressure tools 19A are positioned on the first mounting portion 61 so as to have a predetermined interval with respect to the long side of the substrate W, and the three pressure tools 19A are positioned on the second mounting portion 62. It is positioned so as to be at a predetermined interval with respect to the short side.

  Therefore, according to such a configuration, the first mounting portion 61 can perform the final press-bonding of the five TCPs 2 temporarily bonded to the long side of the substrate W, and the second mounting portion 62 can perform the short-bonding of the short side of the substrate W. The three TCP2s temporarily bonded to each other can be finally bonded.

  On the other hand, depending on the product type change of the substrate W, it is required that the first mounting unit 61 and the second mounting unit 62 perform main pressure bonding of the four TCPs 2 on the long side or the short side of the substrate W, respectively. There is a case.

  In such a case, since the plurality of pressure tools 19A are provided so as to be movable with respect to the beam 63, as shown in FIG. 16, one pressure tool 19A of the first mounting portion 61 is second mounted. It moves to the part 62 side, and sets the number of the pressure tools 19A of the 1st mounting part 61 and the 2nd mounting part 62 to four each.

  As a result, the four TCPs 2 temporarily bonded to each side of the substrate W supplied to the supply units 61 and 62 can be finally bonded.

  Further, when the substrate W is large and, for example, eight TCPs 2 are permanently crimped to the long sides thereof, the eight pressure tools 19A are moved along the beam 63 so that the long side of the large substrate W is long. Positioning is performed so as to correspond to the interval of TCP2 to be crimped.

  As a result, even when the number of TCPs 2 mounted on the long side is increased due to an increase in the size of the substrate W, a plurality of pressure tools 19A can be positioned and coped with in accordance with fluctuations in the number. Become.

  That is, in this case, the first mounting part 61 and the second mounting part 62 are one mounting part.

  That is, according to this embodiment, even if the number of TCPs 2 that are permanently crimped to the side of the substrate W is changed due to a change in product type or the like, the pressure tool 19A is changed according to the change in the number. Since it can be moved and positioned to another mounting part, a highly versatile mounting apparatus can be provided.

  In the third embodiment, the case where the eight pressure tools 19A are movably provided on the beam 63 has been described as an example, but the long side and the short side of the large substrate W are provided on the beam 63. If a pressure tool 19A equal to or more than the number of TCP2s to be permanently crimped is provided, even a large substrate W, the TCP2 temporarily crimped to the long side and the short side are sequentially booked. Can be crimped.

  In the above-described embodiment, an example in which TCP is mounted (final pressure bonding) on the substrate as the mounted member has been described. However, as the mounted member, anisotropy bonded to temporarily bond TCP to the substrate is used. Even when sticking the conductive member, when temporarily bonding the TCP to the anisotropic conductive member stuck to the substrate, or when sticking the anisotropic conductive member stuck to the TCP to the substrate, The present invention can be applied. That is, the mounted member is not limited to TCP or other electronic components, and may be an anisotropic conductive member.

  The present invention can also be applied when a semiconductor chip as a member to be mounted is mounted on a glass substrate.

  The present invention can also be applied to a case where a circuit board is mounted on the other end of the TCP via an anisotropic conductive member after mounting one end of the TCP on the substrate.

  In addition, the example using the table driven in the X, Y, θ, and Z directions on the base as the transport means for transporting the substrate has been described, but the suction means for sucking and holding the substrate on the lower surface is used as the transport means. The movable body is configured to be driven in the X, Y, θ, and Z directions above the base, and the movable body alternately supplies the substrate to the plurality of first mounting portions or the plurality of second mounting portions. And you may make it carry out.

  DESCRIPTION OF SYMBOLS 2 ... TCP (mounted member), 3 ... Anisotropic conductive member, 5 ... Supply part, 11 ... Discharge part, 14A, 14B ... 1st mounting part, 15A, 15B ... 2nd mounting part, 17 ... Backup Tool, 19 ... Pressure tool, 23 ... First supply transport table (transport means), 26 ... Control device, 41 ... First imaging camera, 45 ... Image processing unit, 47A, 47B ... Second supply Transport table (transport means), 49... Second imaging camera, 52.

Claims (11)

A mounting device that mounts a member to be mounted on at least one of four sides of a rectangular substrate,
A supply unit for supplying the substrate;
A plurality of mounting portions that are mounted in parallel to the supply portion and mount the mounted member on at least one side of the substrate supplied from the supply portion;
A discharge unit that is arranged in parallel with the mounting unit and from which the substrate on which the mounted member is mounted is discharged.
Conveying means for alternately supplying the substrate of the supply unit to the plurality of mounting units, and alternately taking out the substrate on which the mounted member has been mounted from the plurality of mounting units and transporting them to the discharging unit An apparatus for mounting a member to be mounted, comprising: Having imaging means for imaging the substrate supplied from the supply unit to the mounting unit;
2. The mounting apparatus for mounting a member according to claim 1, wherein the transport unit positions and supplies the substrate to the mounting portion based on the image of the imaging unit. The mounting part above is
3. The mounting apparatus for mounted members according to claim 1, wherein the mounted member is composed of two first mounting portions that mount the mounted member on one long side of the substrate. The mounting part above is
Two first mounting portions for mounting the mounted member on one long side of the substrate, and two second mounting portions for mounting the mounted member on one short side of the substrate The mounting apparatus for a member to be mounted according to claim 1, wherein the mounting apparatus is configured as follows. The mounting part above is
One first mounting portion for mounting the mounted member on one long side of the substrate, and two for mounting the mounted member on one short side of the two short sides of the substrate The second mounting portion and one third mounting portion that mounts the mounted member on the other short side of the two short sides of the substrate, The mounting member mounting apparatus according to claim 2.   The imaging means is provided so as to be movable between one of the two first mounting portions and the other, and when the substrate is alternately supplied to the two first mounting portions by the transport means, the substrate is supplied. The mounting apparatus for a member to be mounted according to claim 3, wherein the mounting apparatus is positioned at a position facing a mounting portion to be mounted. The plurality of mounting portions include a backup tool that supports a lower surface of one side on which the mounted member of the substrate supplied by the transport unit is mounted, and an upper surface of one side supported by the backup tool. A pressure tool for mounting the mounted member;
2. The mounting member mounting apparatus according to claim 1, wherein the backup tool and the pressing tool of the plurality of mounting portions are arranged in a line. The mounting portion is provided with support means for supporting the substrate supplied by the transport means,
The support means includes a first suction support portion that sucks and supports a lower surface of a portion different from a portion supported by the backup tool on one side of the substrate on which the mounted member is mounted; 8. The mounted member according to claim 1, further comprising a second suction support portion that sucks and supports an upper surface of the side opposite to the one side on which the mounted member is mounted. Mounting device. The transport means is a transport table mounted on the upper surface and driven in a horizontal direction, a vertical direction and a rotation direction,
The transfer table is driven between the supply unit and the plurality of mounting units to supply a substrate to each mounting unit, and is driven between each mounting unit and the discharge unit to each of the mounting units. 9. The mounting apparatus for mounted members according to claim 1, further comprising a discharge transport table for transporting the substrate on which the mounted member has been mounted in the mounting section to the discharge section. The plurality of mounting portions include a backup tool that supports the lower surface of one side on which the mounted member of the substrate supplied by the transport unit is mounted, and a plurality of mounting parts on the upper surface of one side supported by the backup tool. A plurality of pressure tools for mounting each of the mounted members one by one,
The backup tool and the plurality of pressure tools of the plurality of mounting portions are arranged in a line, and the plurality of pressure tools are provided so as to be positioned with respect to the plurality of mounting portions,
The plurality of pressurizing tools are configured such that the number corresponding to the number of mounted members mounted on one side of the substrate is positioned so as to face the backup tool of each mounting unit in each mounting unit. The mounting apparatus for mounted members according to claim 1, wherein A mounting method for mounting a mounted member on at least one of four sides of a rectangular substrate,
Supplying the substrate taken out from the supply unit alternately to the plurality of supply units that are arranged in parallel to the supply unit and mount the mounted member on at least one side of the substrate; and
And a step of alternately taking out the substrate on which the member to be mounted has been mounted from the plurality of mounting parts.

Images