JP5302773B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus, for example, an electronic component mounting apparatus for mounting a semiconductor device on a display panel such as a liquid crystal panel.

  In the LCD industry, in recent years, the market has expanded from PCs to monitors. Along with such a situation, the size of the liquid crystal panel (substrate) is increased, and the price is required to be reduced.

Display panels such as liquid crystal panels are electronic components for drivers (for example, TAB (Tape Automated Bonding), COG (Chip On Glass), TCP (Tape Carrier Package), or FPC (Flexible Printed Circuit)) on the edge of a glass substrate. Etc.). An apparatus used for mounting electronic components on the display panel includes an ACF attachment portion for attaching an anisotropic conductive film (ACF) to the edge of a glass substrate, Electronic component mounting part that mounts an electronic component via a conductive film and temporarily press-bonds, an electronic component pressure-bonded part that heat-presses by applying heat and a load to the electronic component in the temporary press-bonded state and the anisotropic conductive film, etc. It consists of a working mechanism.
Electronic component mounting apparatuses used for assembling such display panels are generally general-purpose types targeting a wide variety of substrates of different sizes from small to large, and the above-described arrangement of the working mechanism and the movement stroke of the substrate holding stage Is set with reference to the assumed maximum size substrate.

  On the other hand, the temporary crimping portion of the electronic component in the liquid crystal module mounting facility is mounted using a fixed rotary head in which mounting heads on which members such as TAB and COG are mounted are equally divided (for example, Patent Document 1). reference).

  Accordingly, as the liquid crystal panel size increases, the space size of the temporary crimping portion of the electronic component is set on the basis of the maximum size substrate that assumes the space size.

JP 2006-202877 A

FIG. 9 shows a fixed rotary head used in the above-described temporary crimping portion of the electronic component. The liquid crystal panel (substrate) must be transported to a predetermined position of the fixed rotary head 104 (position where it can be aligned and corrected and mounted) by moving the position where the substrate 106 should be mounted by pitch feed.
Therefore, (1) the processing speed of the equipment depends on the mounting capacity of the rotary head.
In addition, (2) the necessary area of the facility is required to be at least twice as large as the maximum substrate size targeted by the facility. That is, when the electronic components are sequentially arranged and mounted on the long side of the substrate, the rotary head is fixed, so that it is naturally necessary to move the substrate. In FIG. 9, assuming that the length of the long side of the substrate is L, for example, the substrate 106 needs to move a distance L from the left direction to the right direction in FIG. It is necessary to secure 2L or more.
(3) Furthermore, when a plurality of fixed rotary heads 104 are arranged with respect to one side of the substrate 106, there is a problem that the mounting pitch change cannot be accommodated.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus (temporary crimping apparatus) that can improve the processing capacity as equipment while maintaining the necessary operation process time. It is to provide an electronic component mounting apparatus capable of processing in a space, and to provide an electronic component mounting apparatus capable of selecting a target head according to a mounting process.

  In order to achieve the above object, the present invention provides an electronic component mounting apparatus that mounts electronic components at predetermined locations on a panel, an electronic component supply unit that supplies a plurality of electronic components mounted on the panel, and the electronic components An electronic component mounting unit for positioning the electronic component supplied from the supply unit and mounting on the panel, and a transfer unit for taking out the electronic component from the electronic component supply unit and transferring the electronic component to the electronic component mounting unit are provided. The panel is positioned and fixed with respect to the base on which the electronic component mounting portion is disposed, and the electronic component mounting portion is movable in parallel with respect to the processing side on the panel to mount the electronic component. It is characterized by having a mounting head.

  That is, the unit configuration of the temporary pressure bonding unit is separated into an electronic component supply unit, an electronic component transfer unit, and an electronic component mounting unit. Further, in the mounting portion, the processing time can be shortened and the space can be saved by making it possible to move a plurality of mounting heads in a direction parallel to the processing side of the panel (substrate).

According to the present invention, it is possible to improve the processing capability as equipment while maintaining the necessary operation process time.
In addition, processing can be performed in a minimum space. Furthermore, the target head can be selected according to the mounting process.

The top view which shows the panel in which the electronic component was mounted. FIG. 3 is a three-dimensional view of the electronic component mounting apparatus shown in the first embodiment. FIG. 2 is a plan view of the electronic component mounting apparatus shown in the first embodiment. FIG. 6 is a three-dimensional view of the electronic component mounting apparatus shown in the second embodiment. FIG. 6 is a plan view of the electronic component mounting apparatus shown in the second embodiment. FIG. 6 is a three-dimensional view of the electronic component mounting apparatus shown in the third embodiment. FIG. 9 is a plan view of the electronic component mounting apparatus shown in the third embodiment. FIG. 9 is a plan view of the electronic component mounting apparatus shown in the fourth embodiment. The top view of the conventional fixed rotary head.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, FIG. 1 shows how electronic components (for example, COF (for abbreviation of Chip on Film)) are mounted on a panel (for example, a liquid crystal display panel) 1. In the drawing, the long side and the short side of the lower substrate in the panel 1 are projected from the upper substrate one by one, and a plurality of long side projecting portions 1a and short side projecting portions 1b of the lower substrate are provided. The electronic component 2 is mounted.

  Here, regardless of whether the electronic component 2 is COF, TAB, TCP, or FPC, the electronic component 2 includes an electrode formed on the protruding portion 1a or 1b of the lower substrate in the panel 1, an electrode on the electronic component 2 side, Are electrically connected using an ACF (Anisotropic Conductive Film). This ACF (not shown) is made of a binder resin in which conductive particles are uniformly dispersed so that the electrode on the electronic component 2 side and the electrode on the panel 1 side are electrically connected via the conductive particles. It has become. The binder resin is made of a thermosetting adhesive, and is thermocompression bonded by pressing the electronic component 2 against the panel 1 under heating. However, in the mounting process, after the electronic component 2 is bonded to the panel 1 on which the ACF has been pasted in advance, the pressure is applied in a state where the electronic component 2 is temporarily pressed and then heated to a temperature equal to or higher than the curing temperature of the binder resin. By this action, this pressure bonding is performed.

  As described above, in order to mount the electronic component 2 on the panel 1, first, an ACF adhering step of adhering the ACF to a predetermined position of the panel 1, and temporary crimping in which the electronic component 2 is mounted and temporarily crimped. It consists of a process and a main press-bonding process. And in order to convey the panel 1 between these each process, the panel 1 is made to be conveyed by a panel conveyance means (not shown).

The electronic component mounting apparatus according to the present invention performs this temporary pressure bonding step.
First, a three-dimensional view of an electronic component mounting apparatus 200 described in the present embodiment is shown in FIG. 2, and a plan view thereof is shown in FIG.

  As shown in FIG. 2, the main configuration of the electronic component mounting apparatus 200 is an electronic component for holding and taking out an electronic component (here, an electronic component mounted on a COF will be described as an example). A supply unit 4, electronic component mounting parts 7 a and 7 b that temporarily press-bond electronic components to the panel 1, and electronic component transfer parts 6 a and 6 b for transporting the electronic components to the mounting head unit are provided.

  Further, details of each component will be described with reference to FIG. Here, the members arranged separately on the left and right, for example, the COF reels 3a and 3b and the pull-out dies 5a and 5b are arranged separately on the left and right, respectively, because the equipment is stopped when the COF reel is replaced. It is for preventing. Therefore, in the following description, the description will be focused on the part shown on the right side of the drawing (subscript a).

  The electronic component supply unit 4 includes a COF reel 3a on which a COF having a plurality of electronic components 15 mounted on a tape is wound, a pull-out mold 5a for punching out and extracting the electronic components on the tape, A direct electronic component pick-up 11 for sucking and transporting the electronic component to a predetermined position, and an electronic component transport mechanism (X direction) 13 for moving the direct electronic component pick-up in the X direction and moving it in the Y direction. And an electronic component transport mechanism (Y direction) 14.

An electronic component collecting tray 16 is provided in the vicinity of the electronic component supply unit 4 for arranging a predetermined number (here, 16 cases are shown) of the extracted electronic components sequentially and collecting them. Yes.
Further, the electronic component collecting tray 16 has a suction function and is fixed.

  The electronic component transfer unit 6a includes an electronic component pickup 17a having a suction head for sequentially taking out the electronic components 15 arranged on the electronic component collecting tray 16 one by one, an adhesive surface of the electronic component 15 and its A transfer unit main body 18a for moving and placing the electronic component on the electronic component mounting unit 7a is provided.

The transfer unit main body 18a moves on the electronic component transfer unit shaft 19 along the X direction parallel to the processing side on which the electronic component of the panel 1 is mounted in accordance with the position of the electronic component mounting unit 7a.
The electronic component mounting portion 7a is provided with a mounting head 9 for temporarily mounting the electronic component 15 on the processing side of the panel 1 (for example, 1a shown in FIG. 1), and the mounting head 9 in a predetermined direction. It is comprised from the mounting slider 8a for moving to.

  The mounting slider 8a includes a mechanism capable of moving in the X direction on the mounting slider shaft 20.

  The electronic component mounting portion 7a is provided with an electronic component / panel alignment camera 10a for detecting position detection alignment marks respectively provided on the electronic component 15 and the panel 1.

Next, the operation of each component will be described.
First, in order to take out a plurality of electronic components formed on the COF reel, the pull-out die 5a is raised, while the direct die member take-out 11 is lowered. The pulled-out electronic component 11 receives the pulled-out electronic component and starts to rise. Thereafter, the electronic component transport mechanism (X direction) 13 and the electronic component transport mechanism (Y direction) 14 are used to move to a predetermined position, the electronic component 15 is transported to the electronic component collecting tray 16, and sequentially to the predetermined position. The electronic components 15 are arranged.

  In FIG. 3, 16 electronic components are arranged in the electronic component collecting tray 16. The reason why the number shown here is 16 is that a maximum of 16 electronic components are usually arranged in the peripheral portion of the panel that is the target of this apparatus.

  Next, each electronic component 15 arranged on the electronic component collecting tray 16 is picked up and lifted by the electronic component pickup 17a. The arm portion that supports the electronic component pickup is rotated 180 degrees, the front and back of the electronic component 15 are reversed, and the electronic component 15 is transferred to the electronic component mounting portion 7a. By rotating the arm portion about 180 degrees, the electronic component 15 is inverted so that the electrodes of the electronic component 15 face the electrodes on the panel side and can be crimped to each other.

  The electronic component transfer unit 6a including the electronic component pickup moves on the electronic component transfer unit shaft 19 to a position suitable for delivering the electronic component 15 to the electronic component mounting unit 7a.

  The control of the positional relationship between the electronic component transfer unit 6a and the electronic component mounting unit 7a is performed by a control device (not shown).

  The electronic component mounting portion 7a that has received the electronic component 15 moves the electronic component 15 to a predetermined region in the peripheral portion (processing side) of the panel 1 to which the electronic component 15 is temporarily bonded. The movement is performed by moving the mounting slider 8a on the electronic component mounting portion axis 20. The electronic component mounting portion 7a moves in parallel to the processing side of the panel 1.

  The electronic component 15 must be mounted on the panel 1 in a state where the electronic component 15 is accurately positioned. That is, it is necessary to temporarily press-bond the electrodes provided on the electronic component 15 and the electrodes on the panel 1 side so as to be exactly the same. For this reason, the electronic component 15 and the panel 1 are each provided with alignment marks (not shown) for position detection, and these alignment marks are mounted so as to coincide with each other. In order to match the alignment marks, an electronic component / panel alignment camera is provided as an alignment mark detection means. Mutual displacement is detected based on the image acquired by the alignment camera. If there is a positional deviation between the electronic component and the panel, the position is corrected. In this embodiment, two left and right cameras are installed.

  When the alignment between the electronic component 15 and the panel 1 is completed in this way, a predetermined pressure is applied to the electronic component, whereby the electronic component 15 is temporarily crimped to the panel 1.

  At this time, in the present embodiment, the mounting head 9 is set to a desired temperature in the range of about 60 to 100 degrees, and the pressurizing pressure is set to a desired pressure in the range of 20 to 98 N (Newton). Yes.

  Regarding the mounting head 9 described above, the type of mounting head to be installed on the mounting slider 8a can be selected according to the electronic components to be mounted, the size of the panel, and the like. Also, the mounting pitch can be changed by adjusting the amount of movement of the mounting slider 8a.

As described above, for the sake of convenience of explanation, with regard to the constituent parts that are paired on the left and right, one (the right side of the drawing) is mainly described. The operation of b) is the same as that on the right side.
In addition, the operational relationship between the components is controlled by a control device (not shown). For example, two electronic component mounting portions 7a and 7b are provided. For each mounting head, two electronic component / panel alignment cameras are provided on the left and right sides of the mounting head as a set. The mutual operation relationship between the electronic component mounting portions 7a and 7b is controlled by the control device.

  In addition, although each component, such as a mounting head, has been described using a plurality of cases, it may be single.

  The above operations are sequentially repeated, and a predetermined number of electronic components are mounted on the periphery of the panel 1. Thereafter, the panel 1 is transported to the next step, and the electronic component 15 is fixed to the panel 1 by pressurizing under heating, that is, by performing the main pressure bonding.

  In the present embodiment, the case where the same type of electronic components is mounted on the long side 1a and the short side 1b shown in FIG. 1 in the panel 1 is shown. However, different types of electronic components can also be mounted. .

As described above, according to the present embodiment, the following effects can be expected.
1) First, the position of the panel 1 is fixed. On the other hand, the electronic component mounting portions 7 a and 7 b having a mounting head for temporarily press-bonding the electronic component 15 move parallel to the processing side of the panel 1. Accordingly, since the panel 1 does not need to move, the panel does not move a distance of about twice the peripheral length as shown in FIG. 9, and at least the lateral direction (X direction) of the device is almost the panel. Therefore, the device can be made compact.
2) Since the operation of temporary crimping of the electronic component mounting portions 7a and 7b is not restricted by the supply operation of the electronic component 15, the operation time of temporary crimping of the electronic component mounting portions 7a and 7b is the electronic component mounting portions 7a and 7b. Therefore, it is possible to increase the processing speed of the apparatus.
3) Moreover, when temporary crimping | compression-bonding with respect to one panel is completed, the panel will be transferred to the main crimping | compression-bonding process which is the next process. On the other hand, a new panel for temporary crimping is transferred from the upstream process. During this transfer, the electronic component 15 can be arranged on the electronic component collecting tray 16 from the electronic component supply unit 4. As a result, work can be performed independently of the idle time (dead time) for transferring the panel 1, so that it is not necessary to stop the electronic component supply work and wait for the panel transfer, and the speed of the apparatus can be increased.
4) The target head can be selected according to the mounting process.

In the present embodiment, each component and its operation will be described with a focus on the differences from the first embodiment.
A three-dimensional view of the electronic component execution apparatus 201 described in the present embodiment is shown in FIG. 4, and a plan view thereof is shown in FIG.

  As shown in FIG. 4, the main component of the electronic component mounting apparatus 201 is an electronic component for holding and taking out an electronic component (here, an electronic component mounted on a COF will be described as an example). A supply unit 4, electronic component mounting units 7 a and 7 b that temporarily press-bond electronic components to the panel 1, and an electronic component batch transfer unit 33 for collectively transporting electronic components to the mounting head unit are provided.

Further, details of each component will be described with reference to FIG.
First, an electronic component take-out mechanism in the electronic component supply unit 4 will be described. The electronic component take-out unit includes a three-part rotary electronic component take-out unit 31. The electronic component 15 extracted by the pull-out mold 5a is sucked and extracted by the three-divided rotary electronic component extraction unit 31. The three-divided rotary electronic component take-out unit 31 has three electronic component take-outs 30 that sequentially suck and pick up the electronic components 15 and arrange them on the electronic component collecting tray 16. At this time, the electronic component collecting tray 16 is movable in the X direction and the Y direction, and the electronic components 15 can be sequentially arranged at appropriate positions on the electronic component collecting tray 16 by the movement. The number of electronic components arranged in the member collecting tray is 16. This number is the same as that described in the first embodiment.

  Next, the electronic component transfer unit 6 sucks and picks up the electronic components 15 arranged on the electronic component collecting tray 16 by the suction head 32 provided in the electronic component batch transfer unit 33. In the present embodiment, since eight suction heads 32 are provided, eight electronic components 15 are collectively sucked from the electronic component collecting tray 16.

The electronic component batch transfer unit 33 can move the electronic component 15 sucked by the suction head 32 to the electronic component mounting portion 7a side by moving in the Y direction.
The mounting slider portion 8a is provided with an electronic component temporary placement table 35. The eight electronic components 15 sucked by the suction head 32 are collectively conveyed to the electronic component temporary placement table 35 from the suction head 32. Transfer to

The mounting slider 8a further includes an electronic component pickup 38, and thereby, the eight electronic components 15 arranged on the electronic component temporary placement table 35 are sequentially picked up. The picked-up electronic component 15 is moved in the Y direction, reversed during the movement, and brought to a desired position of the mounting head 9.
The mounting slider 8a moves on the electronic component transfer portion shaft 37 in the X direction parallel to the peripheral portion of the panel on which the electronic component is mounted.

  The mounting head 9 is a swivel type in this embodiment, and two heads are provided. The electronic component picked up by the electronic component pickup 38 is first delivered to the head 9x that has turned. The electronic component 15 is moved to a position where the electronic components in the peripheral portion of the panel are temporarily crimped by rotating 180 degrees to the position of the head 9y that was located before the head 9x turned.

  The mounting head 9 described above is the same as in the first embodiment, and the type of mounting head to be installed on the mounting slider 8a can be selected according to the electronic components to be mounted, the size of the panel, and the like.

With respect to the subsequent steps, the alignment between the electronic component and the panel, the temporary pressing operation and the subsequent shift to the main pressing are the same as those in the first embodiment.
In addition, the control of the mutual operation relationship of each component is controlled by the control device as in the first embodiment.

As described above, according to the present embodiment, the following effects can be expected.
1) By having the three-part rotary electronic component take-out unit 31, the work time for arranging the electronic components 15 on the electronic component collecting tray 16 can be shortened.
2) Since a large number of electronic components can be collectively moved by the eight suction / adsorption heads 32 provided in the electronic component batch transfer unit 33, the movement time per electronic component to the electronic component mounting unit 7a side Can be shortened.
3) Since a plurality (eight in this case) of electronic components can be temporarily placed on the electronic component temporary placing table 35, it is possible to prevent idle time waiting for the supply of electronic components and speed up the temporary crimping operation.
4) Since the panel is not moved in this embodiment, the apparatus is made compact as in the first embodiment.
5) The target head can be selected according to the mounting process.

  In the present embodiment, each component and its operation will be described with a focus on the differences from the first embodiment.

  A three-dimensional view of the electronic component execution apparatus 202 described in the present embodiment is shown in FIG. 6, and a plan view thereof is shown in FIG.

  As shown in FIG. 6, the main component of the electronic component mounting apparatus 202 is an electronic component for holding and taking out an electronic component (here, an electronic component mounted on a COF will be described as an example). A supply unit 4, an electronic component mounting unit that temporarily press-bonds the electronic component to the panel 1, and electronic component transfer units (1) 43 and (2) 44 for transporting the electronic component to the mounting head unit are provided. .

  Further, details of each component will be described with reference to FIG.

The electronic component supply unit 4 shown in this embodiment is characterized by including two pull-out molds 42 a and four suction head molds 40.
First, an electronic component take-out mechanism in the electronic component supply unit 4 will be described. Two electronic components 15 are extracted from the COF two at a time by a pull-out die 42a. The operation of extracting the mold 42a and the electronic component when extracting is the same as that in the first embodiment. The two extracted electronic components are sucked by the four suction head molds 40, and further, two electronic components are extracted by the operation of the next mold 42a and electronic component extraction, and the four suction heads. Adsorbed by the mold 40. At this time, in the first suction operation, the four suction head dies 40 are separated from the back side (upper side of the drawing) and the front side (drawing) of the two pull-out type dies 42a (the dies arranged on the right side of the drawing). (Lower side) are sucked, and in the next suction operation, the four suction head molds 40 are placed in two pull-out molds 42b (molds arranged on the left side of the drawing). Two pieces, the back side (upper side of the drawing) and the near side (lower side of the drawing) are adsorbed, and a total of four pieces are adsorbed and held.

  Next, the back side electronic component sucked and held in the first operation and the back side electronic component sucked in the next suction operation were attached to the shuttle 46b to the electronic component transfer part (1) 43. It is transferred to the shuttle 46b by the electronic component pickup 45b. On the other hand, in the electronic component transfer section (2) 44, the electronic component on the near side sucked and held in the first operation and the electronic component on the near side sucked in the next sucking operation are attached to the shuttle 46a. It is transferred to the shuttle 46a by the electronic component pickup 45a. The electronic component mounting portion 7a is provided with a temporary table 47, on which the two previous electronic components 15 are arranged.

  The two electronic components 15 held by the electronic component pickup 45a are moved in the Y direction by the shuttle 46a and transferred to the electronic component mounting portion 7a. At this time, the shuttle 46a is movable in the X direction on the electronic component transfer part shaft 48. Therefore, according to the position of the electronic component mounting portion 7a, the shuttle 46a can move to that position.

  Further, the electronic component mounting portion 7a is movable in the X direction on the mounting slider shaft 49.

  With respect to the subsequent steps, the alignment between the electronic component and the panel, the temporary pressing operation and the subsequent shift to the main pressing are the same as in the case of the first embodiment.

The mounting head 9 described above is the same as in the first embodiment, and the type of mounting head to be installed on the mounting slider 8a can be selected according to the electronic components to be mounted, the size of the panel, and the like.
In addition, the control of the mutual operation relationship of each component is controlled by the control device as in the first embodiment.

As described above, according to the present embodiment, the following effects can be expected.
1) By having the two pull-out molds 42a and the four suction head molds 40, the plurality of electronic components 15 can be taken out and transferred further, so that the working time can be shortened.
2) Since the shuttle and the mounted slider can move independently in the X direction, the work time for transferring electronic components between them can be shortened.
3) Since the panel is not moved also in the present embodiment, the downsizing of the apparatus is the same as in the first embodiment.
4) The target head can be selected according to the mounting process.

  In the present embodiment, each component and its operation will be described with a focus on the differences from the first embodiment.

  FIG. 8 is a plan view of the electronic component execution apparatus 203 described in this embodiment.

The electronic component supply unit 4 shown in the present embodiment includes a pull-out mold 42 a and two suction head molds 50.
First, an electronic component take-out mechanism in the electronic component supply unit 4 will be described. One electronic component 15 is extracted from the COF by a pull-out die 42a. The operation of extracting the mold 42a and the electronic component when extracting is the same as that in the first embodiment. One extracted electronic component is sucked by the two suction heads 50, and further, one electronic component is extracted by the operation of the next mold 42 a and electronic component extraction, and the two suction heads 50 are used. Adsorbed.

  In the present embodiment, an example in which the pull-out mold 42a is removed is shown, but it is possible to provide one or more corresponding devices.

  The present embodiment is different from the third embodiment in the means for transferring the electronic component 15 sucked by the two suction heads 50 to the electronic component transfer portion 6a. That is, in this embodiment, the two suction heads 50 can move on the electronic component transfer portions (Y direction) 52a, b, and the electronic component transfer portions (Y direction) 52a, b X direction) 51 can be moved.

  With this mechanism, the electronic component sucked and held by the two suction heads 50 can be delivered to the electronic component pickup 53a, and the electronic component 15 sucked and held by the electronic component pickup 53a is electronically transferred by the shuttle 54a. It can be transferred to the component mounting portion 7a. The electronic component pickup 53b and the shuttle 54b are the same as the electronic component pickup 53a and the shuttle 54a.

  The electronic component transfer unit (Y direction) 52a and the electronic component transfer unit (Y direction) b are started under the condition that they do not interfere with each other, and both perform the extraction operation alternately.

  With respect to the subsequent steps, the alignment between the electronic component and the panel, the temporary pressing operation and the subsequent shift to the main pressing are the same as in the case of the first embodiment.

The mounting head 9 described above is the same as in the first embodiment, and the type of mounting head to be installed on the mounting slider 8a can be selected according to the electronic components to be mounted, the size of the panel, and the like.
In addition, the control of the mutual operation relationship of each component is controlled by the control device as in the first embodiment.

As described above, according to the present embodiment, the following effects can be expected.
1) The electronic component transfer unit (Y direction) 52a and the electronic component transfer unit (Y direction) 52b can also move in the direction of the electronic component transfer unit (X direction) 51, and thereby the electronic component transfer unit Since it can move in accordance with the movement in the X direction, it is possible to shorten the time for transferring electronic components between the electronic component transfer unit (Y direction) 52a and the electronic component transfer unit (Y direction) 52b and details such as electronic components.
2) Since the electronic component is transferred by alternately operating the electronic component transfer unit (Y direction) 52a and the electronic component transfer unit (Y direction) 52b, the work time per electronic component can be shortened.
3) Since the panel is not moved also in the present embodiment, the downsizing of the apparatus is the same as in the first embodiment.
4) The target head can be selected according to the mounting process.

DESCRIPTION OF SYMBOLS 1 ... Panel, 1a ... Long side side, 1b ... Short side side, 2 ... Electronic component,
3a, 3b ... COF reel, 4 ... electronic component supply unit, 5a, 5b ... pull-out mold, 6a, 6b ... electronic component transfer unit, 7a, 7b ... electronic component mounting unit, 8a, 8b ... mounting slider, 9, 9x, 9y ... mounting head, 10a, 10b ... alignment camera for electronic parts / panel, 11 ... direct type electronic part taking out, 12 ... direct type electronic part taking out part, 13 ... electronic part transport mechanism (X direction), 14 ... Electronic component transport mechanism (Y direction), 15 ... Electronic components, 16 ... Electronic component collecting tray, 17a, 17b ... Electronic component pickup, 18a, 18b ... Transfer unit main body, 19 ... Electronic component transfer unit shaft, 20 … Axis for mounted slider,
DESCRIPTION OF SYMBOLS 30 ... Electronic component extraction, 31 ... Three division | segmentation rotary type electronic component extraction part, 32 ... Adsorption head, 33 ... Electronic component batch transfer part, 34 ... Transfer part main body, 35 ... Electronic component temporary placement stand, 36 ... Rotation stand 37 ... Electronic component transfer part shaft, 38 ... Electronic component pickup,
40 ... 4 suction heads, 41 ... Direct-type electronic component take-out part, 42a, b ... Two pull-out mold, 43 ... Electronic component transfer part (1), 44 ... Electronic part transfer part (2), 45a, b: Electronic component pickup unit, 46a, b ... Shuttle, 47 ... Temporary placement table, 48 ... Electronic component transfer unit axis, 49 ... Mount slider axis,
50: Two suction heads, 51: Electronic component transfer unit (X direction), 52: Electronic component transfer unit (Y direction), 53a, b ... Electronic component pickup, 54a, b ... Shuttle, 55a, b ... Electronic Temporary parts stand,
DESCRIPTION OF SYMBOLS 100 ... Upstream unit of temporary crimping unit, 101 ... Temporary crimping unit, 102 ... Downstream unit of temporary crimping unit, 104 ... Fixed rotary head, 105 ... Mounting head, 106 ... Panel in initial position, 107 ... Panel after movement, 108 ... Panel support material,
200 is a three-dimensional view of the electronic component mounting apparatus shown in the first embodiment, 201 is a three-dimensional view of the electronic component mounting apparatus shown in the second embodiment, and 202 is a three-dimensional view of the electronic component mounting apparatus shown in the third embodiment.

Claims (7)

In an electronic component mounting apparatus that mounts electronic components at predetermined locations on a panel,
An electronic component supply unit for supplying a plurality of electronic components mounted on the panel;
Positioning the electronic component supplied from the electronic component supply unit, and mounting the electronic component on the panel;
And an electronic component transfer unit for placing transfer the electronic component taken out from the electronic component supply unit to the electronic component mounting portion,
The panel is positioned and fixed with respect to a base on which the electronic component mounting portion is disposed,
The electronic component mounting portion, to the process side of the panel so as to mount the electronic component, it has a parallel movable mounting head,
Having at least two mounting heads;
An electronic component aggregating means for sequentially arranging the electronic components taken out from the electronic component supply unit and temporarily aggregating a plurality of the electronic components before delivering to the electronic component transfer unit; Component mounting equipment. The electronic component mounting apparatus according to claim 1, wherein the electronic component transfer unit includes a moving unit that is movable in parallel to the processing side of the panel. The electronic component transfer unit, the electronic component mounting apparatus according to claim 1 or 2, characterized in that it comprises means for placing transfer collectively a plurality of electronic components. 3. The electronic component mounting apparatus according to claim 1, wherein the electronic component supply unit includes a unit capable of collectively removing a plurality of electronic components. The electronic component mounting portion, the electronic component mounting apparatus according to claim 1 or 2, characterized in that it comprises means for temporarily placing a plurality of electronic components. The mounting head based on the mounting specifications of the electronic component to the panel, the electronic component mounting apparatus according to any one of claims 1 to 5, characterized in that it select the type of the mounting head. The operation of transferring the electronic component from the electronic component supply unit to the electronic component transfer unit and the operation of mounting the electronic component on the processing side on the panel by the electronic component mounting unit are independent in time. to the electronic component mounting apparatus according to any one of claims 1 to 5, characterized in that it has a controllable control device to be performed.

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