JP3821623B2 - Chip bonding equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip bonding apparatus in which a chip is mounted on a substrate such as a display panel and bonded with an anisotropic conductive agent.
[0002]
[Prior art]
A driver chip is mounted on a substrate such as a display panel. In this mounting operation, an anisotropic conductive agent (hereinafter abbreviated as “ACF”) is first transferred to a chip mounting position on a substrate, and a chip is mounted on the transferred ACF. Then, by pressing the chip against the substrate under a predetermined condition, the ACF is thermally cured and the chip is fixed to the substrate, and the electrode of the chip is electrically connected to the electrode of the substrate.
[0003]
In such a bonding apparatus, generally, a transfer station for transferring the above-mentioned ACF, a chip mounting station for mounting a chip on the transferred substrate, and a chip after mounting are held for a predetermined time under predetermined thermal conditions and load conditions. Thus, there are provided a crimping station for thermosetting the ACF and a conveying means for transferring the substrate between the stations. Then, the substrate carried into the transfer station from the upstream is carried out downstream after completing a predetermined operation at each station.
[0004]
[Problems to be solved by the invention]
By the way, the work form in each station differs depending on the contents of the work. For example, in the transfer station, the ACF transfer work is performed for each mounting position, and the mounting work is similarly performed for each chip in the mounting station. In the crimping station, a plurality of chips are crimped simultaneously.
[0005]
Of the operations at each of the above stations, the mounting station can operate at high speed, and the crimping station can perform multiple simultaneous processing, so the tact time per chip at these stations can be reduced relatively easily. Is possible. On the other hand, in the transfer station, depending on the type of ACF, it takes a long time to attach to the surface of the substrate, and generally the work time in this transfer operation takes the longest time in the bonding process. For this reason, the delay of the tact time at the transfer station delays the entire tact time, which is a factor that hinders the improvement of the efficiency of the bonding process.
[0006]
SUMMARY OF THE INVENTION An object of the present invention is to provide a chip bonding apparatus that can shorten the tact time and improve the efficiency of bonding work.
[0007]
[Means for Solving the Problems]
The chip bonding apparatus according to claim 1 is a chip bonding apparatus for bonding a chip to a substrate with an anisotropic conductive agent, from an anisotropic conductive tape having an anisotropic conductive agent attached thereto to the substrate. An anisotropic conductive agent transfer portion for transferring the anisotropic conductive agent; and a chip mounting portion for mounting the chip on the substrate to which the anisotropic conductive agent has been transferred. a transfer mechanism of the 2 groups of transferring the anisotropic conductive adhesive is pressed simultaneously into the two transfer object region by anisotropic conductive tape transfer head, the arrangement pitch of these transfer mechanisms relative to the pitch of the transfer target region And a pitch matching means for relatively matching.
[0008]
According to the present invention, the plurality of transfer mechanisms for transferring the anisotropic conductive tape to the anisotropic conductive agent transfer portion by pressing the anisotropic conductive tape with the crimping head, and the arrangement pitch of these transfer mechanisms with respect to the pitch of the transfer target portion By providing the pitch adjusting means for relatively aligning, the anisotropic conductive agent can be transferred simultaneously at a plurality of locations, and the overall tact time can be shortened to improve the efficiency of the bonding operation.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a chip bonding apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the chip bonding apparatus, and FIG. 3A is a perspective view of an ACF transfer station of the chip bonding apparatus. 3B is a partial front view of the transfer mechanism of the chip bonding apparatus, FIG. 4 is a perspective view of a mounting station of the chip bonding apparatus, and FIG. 5 is a perspective view of a pressure bonding station of the chip bonding apparatus. 6 is a partial front view of the bonding apparatus for the chip.
[0010]
First, the structure of the chip bonding apparatus will be described with reference to FIGS. 1 and 2, an ACF transfer station 20 (anisotropic conductive agent transfer portion), a mounting station 30 (chip mounting portion), and a crimping station 40 are arranged in series on the upper surface of the base 10. The mechanical units constituting each of these work stations are held by a frame 11 disposed on the base 10.
[0011]
Each of the ACF transfer station 20, the mounting station 30, and the crimping station 40 includes a first movable table 12A, a second movable table 12B, and a third movable table 12C. These movable tables have the same structure, and are configured by stacking a Y table 13, an X table 14, and a θ table 15.
[0012]
A supply table 2 for the substrate 1 is provided upstream of the ACF transfer station 20 (left side in FIG. 1). A moving table 5 is disposed in the longitudinal direction on the upper surface of the base 10, and the transfer arm 6 reciprocates along the moving table 5. The substrate 1 aligned on the supply table 2 is picked up by the suction pad 7 of the transfer arm 6 and transferred downstream along the transfer path N. The transported substrate 1 is placed on the θ table 15 of each movable table 12A, 12b, 12C that has moved to the transport path N. Then, chip bonding work is performed at each of the aforementioned work stations. The substrate 1 that has been bonded is placed on the collection table 4 on the downstream side (right side in FIG. 1) of the crimping station 40 and collected.
[0013]
Next, each work station will be described with reference to the drawings. First, the ACF transfer station 20 will be described with reference to FIGS. Two transfer mechanisms 21 are mounted on the block 20a held by the frame 11 (see FIG. 1). The transfer mechanism 21 includes a supply reel 22 and a transfer head 23. The supply reel 22 supplies the ACF tape T stored in a wound state. The ACF tape T is obtained by adhering ACF (anisotropic conductive agent) to a resin base tape T ′. The transfer head 23 transfers the ACF 8 to the surface of the substrate 1 by pressing the ACF tape T drawn from the supply reel 22 against the substrate 1. After the ACF transfer, the base tape T ′ is wound around the collection reel 24 and collected.
[0014]
FIG. 3B shows the transfer operation of the ACF 8 by the transfer head 23. The ACF tape T drawn from the supply reel 22 is guided by the guide 25 and is positioned parallel to the lower surface of the transfer head 23. The ACF tape T is pressed against the surface of the substrate 1 by depressing the transfer head 23 in a state where the ACF transfer portion of the substrate 1 is aligned with the transfer head 23. Thereafter, when the transfer head 23 is raised, the ACF 8 attached to the ACF tape T is transferred to the surface of the substrate 1 and only the base tape T ′ is peeled off, whereby the transfer of the ACF 8 is completed.
[0015]
As shown in FIG. 2, the transfer unit 21 on one side is provided with a feed screw mechanism 26. By rotating a feed screw 28 screwed into a nut 27 fixed to the transfer mechanism 21 with a handle 29, the arrangement pitch of the two transfer heads 23 can be changed. Accordingly, by adjusting the arrangement pitch P of the transfer head 23 to the arrangement pitch of the two ACF transfer target sites on the surface of the substrate 1 or a distance that is an integral multiple thereof, the ACF 8 is simultaneously transferred to two separated ACF transfer target sites. can do. That is, the feed screw mechanism 26 is a pitch adjusting means for relatively aligning the arrangement pitch of the transfer mechanism for transferring the ACF 8 with the pitch of the transfer target portion.
[0016]
Next, the mounting station 30 will be described with reference to FIGS. In FIG. 4, a tray 37 is placed on the tray supply table 36. In the tray 37, the chips 3 are stored in a grid-like arrangement. An XY table in which uniaxial tables 34 and 35 are combined is disposed on the tray supply table 36, and the chip 3 is picked up from the tray 37 by a pickup head 33 mounted on the XY table.
[0017]
The picked-up chip 3 is placed on the holding unit 39 on the slide table 38. Then, the chip 3 aligned by the holding unit 39 moves to the pickup position by the transfer nozzle 32 on the slide table 38. Next, the chip 3 picked up by the transfer nozzle 32 moves to above the substrate 1 held by the second movable table 12B as the turntable 31 rotates. The ACF 8 has already been transferred to the chip mounting position of the substrate 1 at the previous station. Then, by recognizing the substrate 1 by the camera 16, the substrate 1 and the chip 3 are aligned, and the chip 3 is mounted on the ACF transferred to the substrate 1.
[0018]
Next, the crimping station 40 will be described with reference to FIG. In FIG. 5, a pressure-bonding head 41 is mounted on a block 40 a held by a frame 11 (see FIG. 1) by a lifting / lowering pressing mechanism 42 so as to be movable up and down. The substrate 1 is mounted on the third movable table 12C, and the chip 3 is mounted on the ACF 8 transferred to the substrate 1.
[0019]
The lower surface of the edge portion of the substrate 1 is supported by the lower receiving block 43. When the crimping head 41 is lowered in this state, the crimping head 41 comes into contact with the upper surface of the chip 3, thereby causing the chip 3 to pass through the ACF 8. Pressed against the surface of the substrate 1. The pressure bonding head 41 is provided with a heater for heating, and the ACF is heated through the chip 3 when pressed. The chip 3 is bonded to the substrate 1 by holding this pressed heating state for a predetermined time.
[0020]
The chip bonding apparatus is configured as described above, and the operation will be described below. First, in FIG. 1, the substrate 1 positioned on the supply table 2 is picked up by the suction pad 7 of the transport arm 6 and transported along the transport path N to the ACF transfer station 20. Here, the substrate 1 placed on the θ table 15 of the first movable table 12 </ b> A moves to the ACF transfer position and is aligned with the transfer mechanism 21. The ACF is transferred to the substrate 1 by the two transfer mechanisms 21.
[0021]
That is, ACF is transferred by the respective transfer mechanisms 21 to two different transfer target portions of the same substrate 1. At this time, since the arrangement pitch between the transfer mechanisms 21 is variable by the feed screw mechanism 20, the arrangement pitch between the transfer mechanisms 21 can be matched to the pitch of the transfer target portion even for substrates of different types.
[0022]
Thereafter, the substrate 1 on which the ACF transfer has been performed returns to the transport path N, where it is picked up again by the transport arm 6 and transported to the mounting station 30. Here, the chip 3 is mounted on the ACF 8 transferred by the ACF transfer station 20. Next, the substrate 1 on which the chip 3 is mounted is transported to the crimping station 40 by the transport arm 6 and placed on the third movable table 12C. Then, the chip 3 mounted at the mounting station 30 is pressed and heated by the pressure bonding head 41, so that the chip 3 is bonded to the substrate 1, and the connection electrode of the chip 3 is the electrode of the substrate 1 by the conductive component in the ACF. And electrically conductive.
[0023]
Thereafter, the substrate 1 that has been bonded is taken out by the transfer arm 6 and placed on the collection table 4, and one cycle of the bonding operation is completed. In the bonding operation described above, the ACF transfer station 20 having the longest work time can simultaneously perform ACF transfer to two transfer target sites, thereby maintaining the line balance between the ACF transfer, mounting, and crimping processes. It is possible to perform efficient chip bonding.
[0024]
In this embodiment, an example in which simultaneous transfer is performed on two transfer sites on the same substrate has been described. However, the present invention can be applied even when two substrates are used for bonding. . In this case, as shown in FIG. 6 (a), two substrates 1A and 1B are mounted on a movable table 12 having individual X tables 14A and 14B and θ tables 15A and 15B as pitch adjusting means. Put. Thus, the pitch P2 between the transfer target portions of the substrates 1A and 1B can be matched with the pitch P1 of the transfer head 23. In this case, the X tables 14A and 14B and the θ tables 15A and 15B are pitch adjusting means.
[0025]
Further, instead of performing such individual positioning, the two arms 1A and 1B are placed on a common placement table provided on the movable table 12 of the ACF transfer station 20 by the transfer arm 6 provided with a positioning mechanism. At this time, it may be so arranged that the pitch between the transfer target parts is equal to the pitch P1 between the two transfer heads 23. In this case, the transfer arm 6 corresponds to the pitch adjusting means.
[0026]
【The invention's effect】
According to the present invention, the plurality of transfer mechanisms for transferring the anisotropic conductive tape to the anisotropic conductive agent transfer portion by pressing the anisotropic conductive tape with the crimping head, and the arrangement pitch of these transfer mechanisms with respect to the pitch of the transfer target portion Therefore, the anisotropic conductive agent can be transferred simultaneously at a plurality of locations, and the overall tact time can be shortened to improve the efficiency of the bonding operation.
[Brief description of the drawings]
FIG. 1 is a perspective view of a chip bonding apparatus according to an embodiment of the present invention. FIG. 2 is a front view of a chip bonding apparatus according to an embodiment of the present invention. FIG. 4B is a perspective view of the ACF transfer station of the chip bonding apparatus according to the embodiment of the present invention. FIG. 4 is a partial front view of the transfer mechanism of the chip bonding apparatus according to the embodiment of the present invention. FIG. 5 is a perspective view of a bonding station of a chip bonding apparatus according to an embodiment of the present invention. FIG. 6 is a partial front view of a chip bonding apparatus according to an embodiment of the present invention. [Explanation of symbols]
1 Substrate 3 Chip 6 Transfer arm 8 ACF
20 ACF transfer station 21 Transfer mechanism 23 Transfer head 26 Feed screw mechanism 30 Mounting station 40 Crimping station

Claims (3)

A chip bonding apparatus for bonding a chip to a substrate with an anisotropic conductive agent, wherein the anisotropic conductive agent is transferred to the substrate from an anisotropic conductive tape having an anisotropic conductive agent attached thereto. A conductive agent transfer portion; and a chip mounting portion for mounting a chip on a substrate onto which the anisotropic conductive agent has been transferred. Two anisotropic conductive tapes are transferred to the anisotropic conductive agent transfer portion by a transfer head. a transfer mechanism of the 2 groups of transferring the anisotropic conductive adhesive is pressed at the same time the target site, and a pitch alignment means to align relatively arrangement pitch of these transfer mechanisms relative to the pitch of the transfer target region A chip bonding apparatus. 2. The chip bonding apparatus according to claim 1, wherein the two transfer target parts are two different transfer target parts on one substrate. 2. The chip bonding apparatus according to claim 1, wherein the two transfer target portions are transfer target portions of the two substrates placed on the movable table.

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