JP3275743B2 - Chip mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a chip mounting apparatus for mounting a driver chip on a substrate such as a liquid crystal panel or a plasma panel.

[0002]

2. Description of the Related Art A driver chip is mounted on a substrate for a display panel such as a liquid crystal panel. As a method for joining the substrate and the chip, a method using an anisotropic conductive material (hereinafter, referred to as “ACF”) is known. In mounting a chip by this method, a step of attaching the ACF to an electrode on a circuit surface of the substrate, a step of mounting the chip on the attached ACF, and then, the mounted chip is heat-pressed for a predetermined time. Process.

[0003] Among the types of substrates for display panels, there are single-function devices such as pagers and calculators that perform only character display, and the number of driver chips mounted is one.
There is only one thing. These generally have low product prices and low manufacturing costs. Therefore, it is required that the devices used for the production have high productivity.

[0004]

A chip mounting apparatus for mounting a chip on a substrate as described above requires not only high mounting accuracy but also high speed in order to improve productivity. Therefore, it is desirable that this type of chip mounting apparatus be able to perform the above-described steps in a coordinated manner so as to be able to set up well. However, conventionally, a technology that satisfies both such high mounting accuracy and high speed has not yet been established.

In the process of attaching the ACF or mounting the chip, the process is completed in a short time because the target location is generally one. However, the chip pressing process requires a considerable pressing time. For this reason, the line balance between the respective steps is poor, and conventionally, the tact time of the entire apparatus is determined by the pressing time of the chip.
Also, since the number of mounted chips is small, the ratio of the net time required for mounting to the tact time is low. Therefore, in order to reduce the tact time of the entire apparatus, it is required to reduce the time other than the net mounting time, that is, the time required for transportation and the waiting time. However, the conventional chip mounting apparatus has a problem that the line balance between the processes is not maintained, and the transport is a transport method that waits for the completion of each process, so that the loss time is large and the efficiency is inefficient. .

SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip mounting device having high productivity for the display panel and the like as described above.

[0007]

According to the present invention, there is provided a chip mounting apparatus comprising: an anisotropic conductive material attaching station for attaching an anisotropic conductive material to a substrate; A first stage for positioning the substrate, a chip mounting station for mounting a chip on an anisotropic conductive material stuck on the substrate, a second stage for positioning the substrate on the chip mounting station, A chip mounting apparatus comprising: a crimping station having a plurality of crimping heads for crimping a chip to a substrate; and a plurality of third stages for individually positioning a substrate with respect to each of the crimping heads. A first transfer head for transferring a substrate of the second stage to the second stage;
A second transfer head for selectively transferring the substrate of the first stage to the plurality of third stages, and a horizontal moving means for simultaneously moving the first and second transfer heads in the horizontal direction And interval changing means for changing an interval between the first transfer head and the second transfer head.

[0008]

According to the present invention having the above-described structure, a plurality of pressure bonding heads and a stage for positioning a plurality of substrates are provided in a pressure bonding station for performing a chip pressing process requiring the longest time. In addition, a transfer head pitch changing means is provided so that a single transfer head can supply and take out the substrates with respect to the stage for positioning the plurality of substrates. For this reason, line balance between each process can be taken,
Moreover, a chip mounting device with high transport efficiency can be realized.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of a chip mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the chip mounting apparatus, FIG. 3 is a perspective view of an ACF attaching station of the chip mounting apparatus, and FIG. Is a perspective view of a chip mounting station of the chip mounting apparatus, FIG. 5 is a perspective view of a crimping station of the chip mounting apparatus, and FIGS. 6, 7, 8, 9, 10, and 11 are the same chip. FIG. 6 is a plan view showing a method of transporting a substrate of the mounting device of FIG.

First, an overall configuration of a chip mounting apparatus will be described with reference to FIGS. 1 and 2, reference numeral 1 denotes a substrate, which is supplied in the direction of the arrow. The chip mounting apparatus includes three stations of an ACF attaching station 10, a chip mounting station 30, and a pressure bonding station 40 in order from the supply direction of the substrate 1. These stations are arranged on the common gantry 5 in a horizontal row.

The ACF attaching station 10 cuts an ACF tape (to be described later) into a predetermined length and affixes it to a predetermined position on the substrate 1. A first stage 50 is provided in front of the ACF attaching station 10, and positions the substrate 1 with respect to the ACF attaching station 10.

In the chip mounting station 30, the substrate 1
The chip 3 is mounted on the ACF 2 attached to the ACF 2. A second stage 70 is provided in front of the chip mounting station 30, and positions the substrate 1 with respect to the chip mounting station 30.

In the crimping station 40, the mounted chip 3 is crimped on the substrate 1 for a predetermined time. This station 4
Reference numeral 0 includes two crimping heads, a first crimping head 46 and a second crimping head 47. Further, a third stage 80 and a fourth stage 90 for positioning the substrate 1 with respect to the respective pressure bonding heads 46 and 47 are provided.

A pre-center stage 6 is provided upstream of the first stage 50. Pre-center stage 6
Position the substrate 1 in advance and supply it to the first stage. An unloading stage 7 is provided downstream of the fourth stage 90. The unloading stage 7 receives the substrate 1 unloaded from the third stage 80 or the fourth stage 90.

A plurality of transfer heads described below are provided for sucking and transporting the substrate 1 between the stages. The supply transfer head 100 is mounted on the pre-center stage 6.
From the first stage 50 to the first stage 50, the first transfer head 101 from the first stage 50 to the second stage 70, and the second transfer head 102 from the second stage 70 to the third stage 80 or the fourth stage. The unloading transfer head 103 is moved to the third stage 80 or the fourth stage 90 to the stage 90.
The substrate 1 is sucked and transported to the unloading stage 7 from each of them.

Next, the ACF will be described with reference to FIGS.
The configuration of the attaching station 10 and the first stage 50 for positioning the substrate 1 on the ACF attaching station 10 will be described. Reference numeral 11 denotes a main body frame, on which components described below are arranged. Reference numeral 12 denotes a tape supply unit which has a built-in mechanism for supplying the ACF tape 13 to the inside (not shown). As shown in FIG. 3B, the ACF tape 13 is configured by attaching an ACF 2 to a separator tape 14.

The tape supply unit 12 includes an ACF tape 1
An opening 15 for taking out a tape for pulling out the tape 3 is provided. Reference numeral 16 denotes a chuck having an opening / closing mechanism and a horizontal feed mechanism (not shown), and an opening 1 for taking out a tape.
Then, the tape 13 is chucked from 5 and pulled out. Further, a cutter 17 including two upper and lower cutting blades is provided near the opening 15 for taking out the tape. The cutter 17 is moved up and down by driving means (not shown), and is pulled out from the opening 15 to cut the ACF tape 13 into a predetermined length.

ACF drawn by chuck 16
Above the tape 13, a suction head 18 is provided. The suction head 18 is connected to a rod 19a of a cylinder 19, and moves up and down as the rod 19a protrudes and retracts. The suction head 18 is connected to a vacuum source (not shown), and the inside of the suction head 18 is vacuum-sucked so that a contact object is vacuum-sucked on the lower surface of the suction head 18. Therefore, when the suction head 18 descends and comes into contact with the surface of the separator 14 of the ACF tape 13 in a state where the tip is clamped by the chuck 16, the ACF tape 13 is suctioned. The above-mentioned cutter 17 holds the ACF tape 1 in this state.
Cut 3 Further, the suction head 18 further descends and presses the ACF tape 13 in the state of being sucked and cut to the substrate 1 to adhere thereto.

The separator tape 1 is attached to the main body frame 11.
Four peeling units 20 are mounted. The peeling unit 20 is for peeling only the separator tape 14 from the ACF tape 13 adhered to the substrate 1, and includes the following elements. A supply reel 23 and a take-up reel 24 for the adhesive tape 22 are provided on the front surface of the frame 21. A cylinder 25 is provided beside the supply reel 23 and the take-up reel 24. A roller 26 is mounted on a rod of the cylinder 25. Reference numeral 22 denotes an adhesive tape which is pulled out from the supply reel 23 and
Is wound around by the take-up reel 24.

Therefore, when the rod of the cylinder 25 projects while the peeling unit 20 is positioned above the substrate 1, the roller 26 descends, and the adhesive tape 22 circling the roller 26 is pressed against the substrate 1. In this state, if the substrate 1 and the roller 26 are relatively moved and the roller 26 is rolled, only the separator tape 14 of the ACF tape 13 adhered to the substrate 1 is peeled off by the adhesive tape 22.

FIG. 3A also shows the first stage 5
0 will be described. ACF sticking station 1
A first movable table 51 to be described below is disposed in front of 0. Reference numeral 52 denotes a first X table. On the first X table 52, a first Y table 53 is placed. A key-shaped support 54 is mounted on the first Y table 53 so as to project in the direction of the ACF attaching station 10. A first θ table 55 is mounted on the upper surface of the support base 54. MX1, MY1, Mθ1
Is a motor for driving each table. The first X table 52, the first Y table 53, the first θ
The table 55 and the like constitute the first movable table 51.

The first θ table 55 has a rotating shaft 56, and an arm 57 is connected to an upper end thereof.
Two substrate support tables 58 are mounted on the upper surface of the arm 57, and are horizontally rotatable about the axis of the rotating shaft 56. On each substrate support table 58, a substrate receiver 60 and three clampers 61, 62, 63 are mounted. These substrate receiver 60 and clampers 61 and 6
2, 63 are connected to four driving bodies (not shown) driven by the same driving means, and
Move back and forth symmetrically with respect to the center point (see the respective arrows).

A suction port (not shown) is opened on the upper surface of the substrate receiver 60, and the substrate 1 is suction-held by vacuum suction. That is, when driving means (not shown) is driven, the clampers 61, 62, 63 press the substrate 1 adsorbed on the substrate receiver 60 from three directions, and the substrate 1 is aligned with the center of the substrate support table 58. . The substrate 1 thus aligned by the substrate support table 58 is aligned with respect to the ACF attaching station 10 in the X, Y, and θ directions by driving the first movable table 51. .

Above the substrate support table 58 on the near side, a first transfer head 101 is provided. The first transfer head 101 is a suction head that can move up and down and move in the horizontal direction. The first transfer head 101 sucks the substrate 1 on the substrate support table 58 on the near side of the first stage 50 and transfers the substrate 1 to the second stage 70.

Next, the configuration of the chip mounting station 30 will be described with reference to FIG. In FIG. 3, reference numeral 31 denotes a pallet, which is fed in a direction indicated by an arrow by a driving means (not shown). On the pallet 31, a tray 32 is placed. Tray 32 is the chip mounting station 3
0 stores the chip 3 mounted on the substrate 1. A chip pickup head 33 is provided above the tray 32. The chip pickup head 33 can be moved and moved up and down in the X direction by driving means (not shown). The chip pickup head 33 picks up the chip 3 stored in the tray 32 with the bump surface facing upward by vacuum suction.

An inversion unit 35 is provided below the chip pickup head 33. Reversing unit 35
In the figure, a suction-type chip holding head 34 is mounted on the outer periphery of a rotatable upright disk. Chip holding head 3
4 receives the chip 3 from the chip pickup head 33 at a position directly upward. A chip pre-center 36 is provided immediately below the reversing unit 35. The chip pre-center 36 receives the chip 3 from the chip holding head 34 of the reversing unit 35. At this time, the reversing unit 35 is rotated 180 degrees in the vertical direction, and the chip 3 is reversed and the bumps are directed downward. Chip pre-center 3
6 is provided with a centering mechanism for positioning the chip 3 by pressing the chip 3 from four directions. The chip pre-center 36 is mounted on a support table 37 so as to be slidable in the front-rear direction.

A rotary head 38 is disposed above the front end of the support table 37 so as to be horizontally rotatable. The rotary head 38 is a rotating body whose position can be indexed, and a chip mounting head 39 is mounted at each indexing position. The mounting head 39 is a vertically movable suction head. When the chip pre-center 36 receives the chip 3, it performs centering, slides to the position indicated by the dotted line in the figure, and transfers the chip 3 to the mounting head 39. Chip mounting head 39
Mounts the received chip 3 on the ACF 2 attached to the substrate 1. A CCD camera (not shown) is provided below the mounting position of the chip 3 on the substrate 1, and a position recognition mark on the bump surface of the chip 3 and the surface of the substrate 1 is captured by an image, and a control unit (not shown) Send image data to

The chip mounting station 30 is provided with a second stage 70 for positioning the substrate 1 with respect to the chip mounting station 30. The second stage 70 has a second movable table 71.
The movable table 71 includes a second X table 72, a second Y table
It consists of a table 73. A support table 74 is provided on the Y table 73, and the second θ
A table 75 is provided. MX2, MY2, Mθ
2 is each drive motor. An arm 77 is connected to the upper end of the rotation shaft 76 of the second θ table 75. On the upper surface of the arm 77, two substrate support tables 78 are mounted. These second movable tables 71
And the substrate support table 78 is the first stage 50
Since the configuration is the same as that of the movable table 51 and the substrate support table 58 described above, the description is omitted.

The second transfer head 102 is a suction head similar to the first transfer head 101, and suctions the substrate 1 on the substrate support table 78 on the front side of the second stage 70, and
To the second stage 80 or the fourth stage 90. This transfer will be described later in detail.

Next, the structure of the crimping station 40 will be described with reference to FIG. Reference numeral 41 denotes a gate-shaped frame,
2. It comprises a top plate 43 and a column 44. A support plate 45 is attached to the top plate 43. Support plate 4
5 includes a first crimping head 46 and a second crimping head 47
Is installed. A crimping tool 48 is provided below each of the crimping heads 46 and 47 to heat the chip 3 and apply a pressing force to the chip 3 from above.
A receiving stand 49 is provided at a crimping position below the crimping tool 48, and receives the lower surface of the substrate 1 to which the chip 3 is crimped and supports the crimping load.

A third stage 80 and a fourth stage 9 for separately positioning the substrate 1 with respect to the respective press heads 46 and 47 corresponding to the press station 40.
0 is provided. The third stage 80 is provided with two substrate support tables 88, and the fourth stage 90 is similarly provided with two substrate support tables 98. In FIG. 5, reference numeral 82 denotes a third X table. Two Y tables, a third Y table 83 and a fourth Y table 93, are mounted on the third X table 82 using a common slide rail (not shown). Third X
The tables 82 are provided with motors MX3 and MX4 corresponding to these two Y tables, respectively, and are driven independently. MY3 is the motor of the third Y table 83, M
Y4 is a motor of the fourth Y table 93. Third Y
The support table 8 is placed on the table 83 and the fourth Y table 93.
4, 94 are provided. Support tables 84, 94
Above are provided a third θ table 85 and a fourth θ table 95, respectively. Mθ3 and Mθ4 are respective drive motors. Arms 87 and 97 are connected to the rotating shafts 86 and 96 of the θ tables 85 and 95, and two substrate support tables 88 and 98 are mounted on the arms 87 and 97.
Are installed.

Reference numeral 103 denotes a carry-out transfer head, which is a suction head similar to the first transfer head 101. The unloading transfer head 103 is provided with a substrate support table 88 of the third stage 80 or a substrate support table 98 of the fourth stage 90.
The upper substrate 1 is selectively sucked by vacuum and transferred to the unloading stage 7 (FIG. 1).

Next, with reference to FIG. 6, the structure of the transport means of the chip mounting apparatus will be described. Reference numeral 104 denotes a moving frame, on which the respective transfer heads for substrates described below are arranged on the common moving frame 104. The supply transfer head 100 is disposed at the most upstream side, and is located on the pre-center stage 6 during standby. The feed transfer head 100 is moved from the pre-center stage 6 to the first stage 50.
The substrate 1 is transferred to Following the feed transfer head 100,
A first transfer head 101 is provided, and is located on the first stage 50 during standby. This first transfer head 10
1 transfers the substrate 1 from the first stage 50 to the second stage 70.

A second transfer head 102 is provided following the first transfer head 101, and is located on the second stage 70 during standby. The second transfer head 102 selectively transfers the substrate 1 from the second stage 70 to the third stage 80 or the fourth stage 90. The carry-out transfer head 103 is located at the most downstream side, and is located on the third stage 80 or the fourth stage 90 during standby. The unloading transfer head 103 transfers the substrate 1 from the third stage 80 or the fourth stage 90 to the unloading stage 7.

A rod 105a of a cylinder 105 as a horizontal moving means is connected to a side surface of the moving frame 104. When the rod 105a of the cylinder 105 protrudes and retracts, all the transfer heads 100, 101, 102, 103
Simultaneously slide in the horizontal direction (X direction).

The pitch between adjacent stages is X1 between the pre-center stage 6 and the third stage 80 and between the third stage 80 and the unloading stage 7, and the pitch between the third stage 80 and the third stage 80 is X1. Stage 90 of 4
Only the interval is X2. The second transfer head 101 is a rod 1 of a cylinder 106 which is a first pitch changing means.
06a and the unloading / transporting head 103 are connected to a rod 107a to a cylinder 107 as a second pitch changing means. The stroke of these two cylinders 106 and 107 is X2. Therefore, these cylinders 10
The second transfer head 102 and the unloading transfer head 1 are caused by the rods 106a and 107a
03 on the moving frame 104 can be moved by X2.

The chip mounting apparatus has the above-described configuration, and the entire operation will be described below with reference to the drawings. First, the operation of the ACF attaching station 10 will be described with reference to FIG. In FIG. 3, the ACF tape 13 is pulled out of the tape supply unit 12 by a predetermined length by a chuck 16 and its tip is clamped. Next, when the cylinder 19 projects, the suction head 18 descends. The suction head 18 is the separator tape 14 of the ACF tape 13
When the suction head 18 comes into contact with the upper surface of the
To adsorb.

Next, the cutter 17 operates and the ACF tape 13
Disconnect. Next, the chuck 16 is opened and the ACF tape 13 is opened.
When the clamp at the leading end is released, the cut ACF tape 13 is in a state of being suction-held by only the suction head 18.

Next, the suction head 18 descends toward the upper surface of the substrate 1 which has been positioned in advance, presses the cut ACF tape 13 to a predetermined position on the substrate surface, and adheres the ACF 2. After sticking, the suction head 18 moves up and returns to the standby position. A
The CF tape 13 is clamped upstream of the cutter 17 position, and the tip of the ACF tape 13 projects to the cutter 17 position in a free state.

Next, the chuck 16 is retracted in the open state, and once the tip of the protruding tape 13 is clamped, it advances again. By this operation, the ACF tape 13 is pulled out by a predetermined length, and returns to the state at the start of the description. The separator tape 14 on the surface of the attached ACF tape 13 is peeled off by the peeling unit 20 and transferred to the surface of the adhesive tape 22.

Next, the operation of the first stage 50 will be described with reference to FIG. The substrate 1 positioned by the pre-center stage 6 is sucked by the supply / transfer head 100, and the substrate support table 5 on the near side of the first stage 50.
8 During the transfer, the clampers 61, 62, 63 of the substrate support table 58 are at the retracted position. That is, the area surrounded by the front end faces of the clampers 61, 62, 63 is larger than the substrate 1. Therefore, when transferring the substrate 1, the substrate may be placed within a range surrounded by the front end surfaces of the clampers 61, 62, 63. Substrate 1 placed in this area
Is the substrate support table 58 by the centering function described above.
Is accurately positioned with respect to

Next, the substrate support table 58 on which the substrate 1 is set is rotated by 180 degrees by the first θ table 55,
It is positioned with respect to the ACF application station 10. The ACF tape 13 is attached to the substrate 1 positioned in this manner.
Is affixed. After the application of the ACF tape 13 is completed,
The substrate supporting table 58 on which the substrate 1 is set is the first
Is again turned by the θ table 55 to return to the position on the near side. Next, the clampers 61, 62, 63 are retracted, and the vacuum suction of the substrate receiver 60 is released. In this state, the substrate 1 becomes free, and the first transfer head 101
Can be transported. This operation is performed in the second stage 7
The same applies to 0 or less.

Next, the operation of the chip mounting station 30 will be described with reference to FIG. The chips 3 are stored in the tray 32 with the bumps facing upward. The chip pickup head 33 slides in the X direction, and the chip 3 of the tray 32
To pick up.

The chip 3 thus picked up is transferred to the holding head 34 of the reversing unit 35 with the bumps facing upward. The reversing unit 35 delivers the received chip 3 rotated 180 degrees to the chip pre-center 36 with the bump surface facing downward. The chip pre-center 36 slides to a transfer position (see a dotted line) of the rotary head 38 with the mounting head 39. The mounting head 39 moves down on the chip pre-center 36, moves up after adsorbing the chip 3.

Next, the rotary head 38 turns and stops when the chip 3 reaches the mounting position and waits. On the other hand, the substrate 1 to which the ACF 2 has been attached on the first stage 50
From the first stage 50, it is sucked by the first transfer head 101 and transferred to the substrate support table 78 on the near side of the second stage 70. The substrate 1 is centered by the substrate support table 78 similarly to the first stage 50,
Thereafter, it turns 180 degrees and is positioned with respect to the chip mounting station 30.

In this state, a CCD camera (not shown) located below the chip mounting position captures the images of the bumps of the chip 3 and the position recognition marks of the substrate 1, and the chip 3 and the substrate 1 are aligned with the image. Will be This alignment is performed by the second X table 72, the second Y table 73, the second
Is performed by minutely driving the θ table 75.
After this alignment, the mounting head 39 is lowered to mount the chip 3 on the ACF 2 of the substrate 1.

Next, the operation of the crimping station 40 will be described with reference to FIG.
This will be described with reference to FIG. Chip 3 from the second stage 70
Is mounted on the substrate 1 by the second transfer head 102.
The substrate is transferred to one of the substrate support tables 88 and 98 on the near side of the third stage 80 or the fourth stage 90. Hereinafter, the case where the wafer is transferred to the third stage 80 will be described. The substrate 1 is positioned with respect to the center of the substrate positioning table 88 of the third stage 80 by the centering function described above. Thereafter, the substrate support table 88 is further rotated by 180 degrees by the third θ table 85, and the third Y table 86 is moved forward by the first Y table 86.
Is positioned with respect to the pressure bonding head 46.

In this position, the chip mounting portion of the substrate 1 is placed on the receiving table 49 of the pressure bonding station 40. Next, the first pressure bonding head 46 descends,
The crimping tool 48 at the tip contacts the upper surface of the chip 3 to heat the chip 3 and press it for a predetermined time. At this time, the pressing force is supported by the receiving table 49 and the substrate support table 88
No pressing load acts on.

After a predetermined pressing time has elapsed, the first pressure bonding head 46 is raised, and the third stage 80 is moved backward by the third Y table 83. Next, the third θ table 83
Substrate support table 8 on which substrate 1 after pressure bonding is placed
8 returns to the near side. The substrate 1 after this pressure bonding is used as the unloading head 1
03 is transferred to the unloading stage 7.

Next, the operation of the entire transport system of the chip mounting apparatus will be described with reference to FIGS. FIG.
, I represent the substrate 1 and the alphabetical order represents the order in which the substrate 1 was supplied to the apparatus. That is, the substrate A is supplied first to the apparatus, and the substrate I is supplied last. In FIG. 6, the substrate A is under pressure bonding, the substrate B is pressure bonding started, and the substrate C,
The substrate D is in a state of waiting for pressure bonding. Similarly, substrate E is mounting chip 3, substrate F is waiting for mounting chip 3, and substrate G is A
During the attachment of CF2, the substrate H waits for ACF2 to be attached,
Indicates that it is in a state of waiting for carry-in.

FIG. 7 shows that the ACF2 is adhered to the substrate G in the first stage 50 as the process of each station proceeds.
In the second stage 70, the chip 3 is mounted on the substrate E,
The third stage 80 shows a state in which the press-bonding of the substrate A has been completed, and the substrate support table has turned 180 degrees in each stage after the process. At the fourth stage 90, the substrate B is still under pressure bonding of the chip 3.

FIG. 8 shows a state in which four substrates, ie, the substrate I which has been waiting to be carried in and the substrates G, E and A which have completed the process, are being transported simultaneously. This transfer is performed by the four transfer heads 100, 101, 102, and 103 adsorbing the substrate 1, and the moving frame 104 is horizontally moved by X1 by the horizontal moving means 105.

FIG. 9 shows a state where the process has progressed thereafter.
A new substrate J is supplied to the pre-center stage 6 and is waiting for carry-in. In the first stage 50, the substrate I is waiting for ACF2 to be attached, and the substrate H is being attached to ACF2. Second stage 7
0, the board G waits for the mounting of the chip 3, and the board F
Is being installed. The third stage 80 is in a state where the substrate E is waiting for pressure bonding and the substrate C has started pressure bonding. At the fourth stage 90, the substrate D is waiting for pressure bonding, and the substrate B is still under pressure bonding. The substrate A is waiting to be unloaded at the unloading stage. At this time, the carry-out head 103 has the cylinder 107 as the second pitch changing means protruding, and the pitch is X1 + X2.
Is in a standby state so that the substrate D can be taken out from the fourth stage 90.

FIG. 10 shows a state where the process has further progressed. That is, in the first stage 50, the A
Attachment of CF2, mounting of chip 3 on substrate F at second stage 70, and pressure bonding of substrate B at fourth stage 90 have been completed. In the third stage 80, the press-fitting of the substrate C does not increase in time and is in progress. In this state, each transfer head 100, 101, 102, 103
Moves down to the suction operation of the substrate J waiting to be loaded and the substrates H, F, and B that have completed the respective steps.

FIG. 11 shows a state in which the conveyance has been completed. Substrate J waiting to be loaded and substrates H, F, and
B has advanced to the next stage. These four
One substrate is simultaneously transferred by four transfer heads 100, 101, 102, and 103 mounted on a common moving frame 104. In this case, simultaneously with the horizontal movement of the moving frame 104, the cylinder 1 as the first pitch changing means is used.
06 protrudes, the distance between the first transfer head 101 and the second transfer head 102 is changed to X1 + X2, and at the same time, the cylinder 107, which is the second pitch changing means, retreats, and the second transfer head 102 The distance from the carry-out head 103 is changed to X1-X2.

As a result, the substrate F on the second stage 70 jumps over the third stage 80 and
Transferred to 0. The substrate F on the fourth stage 90 is transferred to the unloading stage 7 at a distance of X1-X2 closer to the common pitch X1.

The present invention is not limited to the above embodiment. For example, the horizontal moving means and the pitch changing means may be linear driving means other than the cylinder, and the number of the crimping heads of the crimping station 40 is three or more. There may be more than one.

[0058]

According to the present invention having the above-described structure, a plurality of pressure bonding heads and a stage for positioning a plurality of substrates are provided at a pressure bonding station for performing a time-consuming chip pressure bonding process. Since the stage includes a plurality of substrate support tables, the transfer of the substrate between the stages can be performed regardless of the progress of the process in each station. Further, since a plurality of substrate positioning stages are provided with a means for changing the pitch of the substrate transfer head so that substrates can be supplied and extracted by one substrate transfer head, line balance between each process can be achieved, and transfer efficiency can be improved. A good chip mounting device can be realized.

[Brief description of the drawings]

FIG. 1 is a front view of a chip mounting apparatus according to an embodiment of the present invention;

FIG. 2 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a diagram A of a chip mounting apparatus according to an embodiment of the present invention;
Perspective view of CF sticking station

FIG. 4 is a perspective view of a chip mounting station of the chip mounting apparatus according to one embodiment of the present invention;

FIG. 5 is a perspective view of a crimping station of the chip mounting apparatus according to one embodiment of the present invention.

FIG. 6 is a plan view showing a substrate transfer method of the chip mounting apparatus according to one embodiment of the present invention;

FIG. 7 is a plan view showing a method of transporting a substrate in the chip mounting apparatus according to one embodiment of the present invention;

FIG. 8 is a plan view showing a method of transporting a substrate in the chip mounting apparatus according to one embodiment of the present invention;

FIG. 9 is a plan view showing a method of transferring a substrate in the chip mounting apparatus according to one embodiment of the present invention;

FIG. 10 is a plan view showing a method of transporting a substrate in the chip mounting apparatus according to one embodiment of the present invention;

FIG. 11 is a plan view showing a method of transferring a substrate in the chip mounting apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 1 substrate 2 ACF 3 chip 6 pre-center stage 7 unloading stage 10 ACF attaching station 30 chip mounting station 40 crimping station 50 first stage 70 second stage 80 third stage 90 fourth stage

────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-1-273388 (JP, A) JP-A-6-216201 (JP, A) JP-A-7-201932 (JP, A) JP-A-8- 191086 (JP, A) JP-A-10-163265 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60 G02F 1/1345

Claims (1)

(57) [Claims] 1. An anisotropic conductive material sticking station for sticking an anisotropic conductive material to a substrate, a first stage for positioning the substrate at the anisotropic conductive material sticking station, and a first stage for sticking on the substrate. A chip mounting station for mounting the chip on the anisotropic conductive material attached thereto, a second stage for positioning the substrate on the chip mounting station, and a plurality of pressure bonding heads for pressing the mounted chip to the substrate. What is claimed is: 1. A chip mounting apparatus comprising: a pressure bonding station; and a plurality of third stages for individually positioning a substrate with respect to each pressure bonding head, wherein the substrate of the first stage is transferred to the second stage. A first transfer head, a second transfer head for selectively transferring the substrate of the second stage to the plurality of third stages, and a first transfer head and a second transfer head. A chip mounting device, comprising: a horizontal moving means for simultaneously moving the transfer heads in the horizontal direction; and an interval changing means for changing an interval between the first transfer head and the second transfer head. .