JP3731513B2 - Display panel assembly equipment - Google Patents

Display panel assembly equipment Download PDF

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Publication number
JP3731513B2
JP3731513B2 JP2001270137A JP2001270137A JP3731513B2 JP 3731513 B2 JP3731513 B2 JP 3731513B2 JP 2001270137 A JP2001270137 A JP 2001270137A JP 2001270137 A JP2001270137 A JP 2001270137A JP 3731513 B2 JP3731513 B2 JP 3731513B2
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JP
Japan
Prior art keywords
display panel
substrate
stage
work
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001270137A
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Japanese (ja)
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JP2003076290A (en
Inventor
安登 鬼塚
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP2001270137A priority Critical patent/JP3731513B2/en
Publication of JP2003076290A publication Critical patent/JP2003076290A/en
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Publication of JP3731513B2 publication Critical patent/JP3731513B2/en
Expired - Fee Related legal-status Critical Current
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a display panel assembling apparatus for assembling a display panel by mounting electronic components for drivers on a substrate.
[0002]
[Prior art]
A display panel such as a liquid crystal panel is configured by mounting electronic components for drivers on the edge of a substrate such as glass. This display panel assembling apparatus includes an adhesive tape attaching stage for attaching an adhesive tape for adhering an electronic component to the edge of a substrate, an electronic component mounting stage for temporarily pressing the electronic component on the adhesive tape, A work stage such as a main pressure bonding stage that hardens and fixes the adhesive tape by applying heat and load to the electronic component in a crimped state, and a transport mechanism that transports the display panel between these work stages are provided.
[0003]
In recent years, high-definition large-sized panels such as wall-mounted flat panel display panels have been manufactured. In such a display panel assembly apparatus for large panels, as a transport mechanism for transporting the display panel between work stages, a substrate is conventionally supported from the lower surface by a transport arm, and the transport arm is supported between the work stages. In general, a transport mechanism of the type moved by the motor is used. In this transfer mechanism, a plurality of transfer arms, a drive mechanism for moving these transfer arms, and the like are arranged along an assembly line configured by arranging each work stage in series.
[0004]
[Problems to be solved by the invention]
However, in the display panel assembly apparatus using the conventional transport mechanism, the drive mechanism is disposed along the assembly line, so the width of each work stage, that is, the apparatus occupation width in the direction orthogonal to the assembly line direction. As the dimensions become larger and it is necessary to provide a standby position for each transfer arm, the interval between the work stages is widened, and the total length of the assembly line is increased. For this reason, in the assembling apparatus for large panels, there is a problem that it is difficult to make the equipment space compact.
[0005]
Accordingly, an object of the present invention is to provide a display panel assembling apparatus capable of downsizing an equipment space for a large panel.
[0006]
[Means for Solving the Problems]
The display panel assembling apparatus according to claim 1 is an apparatus for assembling a display panel for assembling a display panel formed by mounting electronic components on an edge of a substrate, and performs an operation on the substrate at a predetermined work position. Between a work stage, a substrate transport unit arranged on the side of the work position and carrying a substrate into and out of the work stage by a pair of horizontal transport conveyors, and the pair of transport conveyors of the work stage And a substrate support unit that supports the substrate carried in by the substrate transport unit from below, and a substrate support unit that is supported by the substrate support unit by moving the substrate support unit in a space between the pair of transport conveyors. And a moving table for aligning the edge with the working position.
[0007]
A display panel assembling apparatus according to a second aspect of the present invention is the display panel assembling apparatus according to the first aspect of the present invention, and has a substrate lower receiving portion for receiving the lower surface of the substrate at the work position.
[0008]
The display panel assembling apparatus according to claim 3 is the display panel assembling apparatus according to claim 1 or 2, wherein the work stage is bonded by attaching an adhesive tape for bonding electronic components to an edge of the substrate. It is a tape application stage.
[0009]
The display panel assembling apparatus according to claim 4 is the display panel assembling apparatus according to claim 1 or 2, wherein the work stage places electronic components on an adhesive tape affixed to an edge of the substrate. This is an electronic component mounting stage that is mounted and temporarily crimped.
[0010]
The display panel assembling apparatus according to claim 5 is the display panel assembling apparatus according to claim 1 or 2, wherein the work stage performs main pressure bonding of electronic parts temporarily bonded to the edge of the substrate. It is a stage.
[0011]
According to the present invention, the substrate transport unit that carries in and out the substrate to and from the work stage that performs work at a predetermined work position with respect to the substrate is configured by the pair of transport conveyors, and the substrate carried by the substrate transport unit The substrate support unit that supports the substrate from below is moved in the space between the pair of transfer conveyors so that the edge of the substrate is aligned with the work position, so that the substrate transfer unit does not protrude from the work stage. It is possible to reduce the space occupied by the assembly line.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of a display panel assembly apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a display panel assembly apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a perspective view of an adhesive tape application stage of a display panel assembly apparatus according to an embodiment of the present invention, and FIG. 5 is an embodiment of the present invention. FIG. 6 is a perspective view of the electronic component mounting stage of the display panel assembling apparatus according to one embodiment of the present invention, and FIG. 7 is one embodiment of the present invention. FIG. 8 is a perspective view of the main pressure bonding stage of the display panel assembling apparatus according to one embodiment of the present invention, and FIGS. 9 and 10 are one embodiment of the present invention. Of the substrate positioning operation of the display panel assembly device It is an explanatory diagram.
[0013]
First, the overall configuration of the display panel assembling apparatus will be described with reference to FIGS. This display panel assembling apparatus assembles a display panel by crimping a driver electronic component to a glass substrate via an adhesive tape. 1, the display panel assembly apparatus 1 is configured by arranging an adhesive tape application stage 2, an electronic component mounting stage (temporary pressure bonding stage) 3, a first main pressure bonding stage 4 and a second main pressure bonding stage 5 in a horizontal row. Has been.
[0014]
The adhesive tape application stage 2 holds a display panel 6 as a substrate on a panel support table 21 mounted on an XYZθ table 20, and an edge portion of the display panel 6 is attached to the display panel 6 by an adhesive tape crimping head 24. Adhere an adhesive tape of a predetermined length. When attaching the adhesive tape, the XYZθ table 20 is driven to move the display panel 6 held on the panel support table 21, and the edge of the display panel 6 is received by the substrate receiving portion 23.
[0015]
Above the XYZθ table 20, a pair of horizontal conveyors 22 are arranged in the X direction. The conveyor 22 carries the display panel 6 supplied from the upstream side (left side in FIG. 1) into the adhesive tape application stage 2 and carries the display panel 6 after application of the adhesive tape to the electronic component mounting stage 3.
[0016]
The electronic component mounting stage 3 mounts an electronic component 8 for a driver on the adhesive tape affixed to the display panel 6 in the adhesive tape affixing stage 2 and temporarily presses it. Here, the electronic component 8 (see FIG. 6) is taken out from the electronic component supply unit 70 by the electronic component mounting mechanism 34 and temporarily crimped to the edge of the display panel 6 held by the panel support table 31. At the time of temporary pressure bonding, the XYZθ table 30 is driven to move the display panel 6 held on the panel support table 31, and the edge of the display panel 6 is received by the substrate receiving portion 33.
[0017]
Above the XYZθ table 30, a pair of horizontal conveyors 32 are arranged in the X direction. The conveyor 32 carries in the display panel 6 from the adhesive tape application stage 2 and carries out the display panel 6 after mounting the electronic components to the first main pressure-bonding stage 4.
[0018]
The first final crimping stage 4 and the second final crimping stage 5 have the same structure, and include XYZθ tables 40 and 50, panel support tables 41 and 51, and conveyors 42 and 52, respectively. The first final crimping stage 4 and the second final crimping stage 5 hold the display panel 6 on the panel support tables 41 and 51, and the electronic component 8 temporarily crimped to the display panel 6 is replaced with the final crimping head 48. , 58 is used for final pressure bonding to the display panel 6.
[0019]
At the time of the main pressure bonding, the XYZθ tables 40 and 50 are driven to move the display panel 6 held by the panel support tables 41 and 51, and the edge of the display panel 6 is lowered by the substrate lower receiving portions 43 and 53. I accept. The conveyors 42 and 52 carry the display panel 6 carried in from the upstream side to the respective work stages and carry it out to the downstream side.
[0020]
Next, the adhesive tape application stage 2 will be described with reference to FIGS. In FIG. 3, a pair of horizontal transfer conveyors 22 is disposed on the base 2 a, and the display panel 6 is placed on the transfer conveyor 22. As shown in FIG. 4, the transfer conveyor 22 is disposed above the XYZθ table 20. In FIG. 3, the XYZθ table 20 is not shown.
[0021]
The conveyor 22 has a structure in which a belt 22c is adjusted to two pulleys 22a and 22d at the front and rear ends and a drive pulley 22b. The display panel 6 is conveyed by 22c.
[0022]
The XYZθ table 20 is configured by sequentially stacking a Y table 25, an X table 26, and a Zθ table 27 from the bottom, and a panel support table 21 that holds the display panel 6 by vacuum suction is mounted on the Zθ table 27. Has been. By driving the XYZθ table 20, the panel support table 21 moves in the horizontal direction in the space between the two conveyors 22, and the held display panel 6 is aligned with the work position by the adhesive tape crimping head 24 described later. be able to.
[0023]
A substrate support 23 is disposed behind the XYZθ table 20. The substrate lower receiving portion 23 supports the edge portion of the display panel 6 from below when the adhesive tape is attached. A tape attaching unit 28 is disposed above the substrate lower receiving portion 23. The tape applying unit 28 has a configuration in which an adhesive tape supply reel 28b, an adhesive tape cutting portion 28c, a leader tape peeling mechanism 28d, an adhesive tape crimping head 24, and a leader tape recovery reel 28e are arranged on a vertical vertical frame 28a. .
[0024]
The adhesive tape supply reel 28b supplies the laminated tape 7 stored in a wound state to the downstream side. The laminated tape 7 has a configuration in which an adhesive tape 7a for bonding electronic components is laminated on a leader tape 7b serving as a base. The adhesive tape cutting portion 28c has a cutting blade that advances and retreats with respect to the laminated tape 7, and cuts only the adhesive tape 7a of the laminated tape 7 drawn from the adhesive tape supply reel 28b by the cutting blade. The adhesive tape pressing head 24 presses the adhesive tape 7 a on the lower surface side of the laminated tape 7 against the display panel 6 by contacting the upper surface of the laminated tape 7 and pressing it against the upper surface of the display panel 6.
[0025]
The leader tape peeling mechanism 28d peels the leader tape 7b with a pin from the adhesive tape attached to the display panel 6. The leader tape collection reel 28e winds up and collects the leader tape 7b peeled off from the adhesive tape 7a.
[0026]
Next, the electronic component mounting stage will be described with reference to FIGS. The electronic component mounting stage 3 mounts a driver electronic component 8 on the adhesive tape 7a attached to the display panel 6 in the adhesive tape applying stage 2 and temporarily presses it. 5 and 6, a pair of horizontal transfer conveyors 32 is disposed on the base 3 a, and the display panel 6 is placed on the transfer conveyor 32. As shown in FIG. 6, the transfer conveyor 32 is disposed above the XYZθ table 30. In FIG. 5, the XYZθ table 30 is not shown.
[0027]
The transport conveyor 32 has a structure in which a belt 32c is adjusted to two pulleys 32a and 32d at the front and rear ends and a drive pulley 32b. The display panel 6 is conveyed by 32c. The conveyance conveyor 32 carries in the display panel from the adhesive tape application stage 2 and carries out the display panel 6 after mounting the electronic components to the first main crimping stage 4.
[0028]
The XYZθ table 30 is configured by sequentially stacking a Y table 35, an X table 36, and a Zθ table 37 from the bottom, and a panel support table 31 that holds the display panel 6 by vacuum suction is mounted on the Zθ table 37. Has been. By driving the XYZθ table 30, the panel support table 31 moves in the horizontal direction in the space between the two transport conveyors 32, and the held display panel 6 can be aligned with the work position by the holding head 38b described later. it can.
[0029]
A substrate lower receiving portion 33 is disposed behind the XYZθ table 30. The substrate lower receiving portion 33 supports the edge portion of the display panel 6 from below when the electronic component is mounted. Here, the electronic component 8 taken out from the electronic component supply unit 70 is obtained by sequentially rotating the holding head 38b provided on the index table 38 of the electronic component mounting mechanism 34 via the arm 38a in the direction of the arrow. It conveys to the temporary pressure bonding position on the lower receiving part 33.
[0030]
Then, by lowering the holding head 38b at the temporary pressure bonding position, the electronic component 8 is mounted on the display panel 6 held by the panel support table 31 mounted on the XYZθ table 30, and temporarily pressure bonded. At this time, the display panel 6 and the electronic component 8 are recognized by the camera 39 (see FIG. 9) disposed on the side surface of the substrate receiving portion 33, and the positions of the electronic component 8 and the display panel 6 are determined based on the recognition result. Align.
[0031]
Next, the first final crimping stage 4 and the second final crimping stage 5 will be described with reference to FIGS. In FIG. 7, two pairs of horizontal transfer conveyors 42 and 52 are arranged on the base 4 a, and the display panel 6 is placed on the transfer conveyors 42 and 52. As shown in FIG. 8, the conveyors 42 and 52 are disposed above the XYZθ tables 40 and 50, respectively. In FIG. 7, the XYZθ tables 40 and 50 are not shown.
[0032]
The conveyor 42 has a structure in which a belt 42c is adjusted to two pulleys 42a and 42d at the front and rear ends and a drive pulley 42b. The display panel 6 is conveyed by. The transfer conveyor 42 carries in the display panel 6 from the electronic component mounting stage 3, and carries out the display panel 6 after the electronic component main pressure bonding to the second main pressure bonding stage 5. The transport conveyor 52 has the same configuration, and the display panel 6 is carried in from the first main crimping stage 4 and the display panel 6 after the main crimping is carried out downstream.
[0033]
The XYZθ table 40 is configured by stacking a Y table 45, an X table 46, and a Zθ table 47 in order from the bottom, and a panel support table 41 that holds the display panel 6 by vacuum suction is mounted on the Zθ table 47. Has been. By driving the XYZθ table 40, the panel support table 41 moves in the horizontal direction, and the held display panel 6 can be aligned with a work position by a main pressure bonding head 48 described later.
[0034]
A substrate lower receiving portion 43 is disposed behind the XYZθ table 40. The substrate lower receiving portion 43 supports the edge portion of the display panel 6 from below during the main pressure bonding. A main crimping head 48 having a crimping tool 49 at its lower end is disposed above the substrate lower receiving portion 43. The display panel 6 in which the electronic component 8 is temporarily press-bonded onto the adhesive tape in the electronic component mounting stage 3 is aligned with the corresponding main press-bonding head 48, and the main press-bonding head 48 is lowered with respect to the display panel 6. By holding the pressed state for a predetermined pressure bonding time, the electronic component 8 is finally pressure bonded to the display panel 6.
[0035]
The XYZθ table 50 and the main press-bonding head 58 have the same configuration as described above. Similarly, in the second main press-bonding stage 5, the main press-bonding head 58 performs the main press-bonding of the electronic component 8 to the display panel 6. Is called.
[0036]
In the configuration of the adhesive tape application stage 2, the electronic component mounting stage 3, the first main pressure bonding stage 4, and the second main pressure bonding stage 5, the substrate receiving portions 23, 33, 43, and 53 are edges of the display panel 6. The transport conveyors 22, 32, 42, 52 are arranged on the side of the work position, and a pair of horizontal loading and unloading of the display panel 6 to the work stage is performed. It becomes a board | substrate conveyance part performed with a simple conveyance conveyor.
[0037]
The panel support tables 21, 31, 41, 51 are respectively a pair of transfer conveyors 22, 32, an adhesive tape application stage 2, an electronic component mounting stage 3, a first final crimping stage 4, and a second final crimping stage 5. It is provided between 42 and 52, and serves as a substrate support unit that supports the display panel 6 carried in by the substrate transfer unit from below. The XYZθ tables 20, 30, 40, 50 move the panel support tables 21, 31, 41, 51 within the space between the pair of transport conveyors 22, 32, 42, 52. This is a moving table for aligning the edge of the display panel supported by 41 and 51 with the work position.
[0038]
Next, the alignment operation of the display panel 6 in each work stage will be described with reference to FIGS. Here, the electronic component mounting stage 3 has been described as an example, but the same applies to the alignment operation in other work stages. In FIG. 9A, the display panel 6 is carried into the electronic component mounting stage 3 by the conveyer 32. At this time, the panel support table 31 positioned between the transport conveyors 32 is in a lowered state and does not hinder the transport operation of the display panel 6.
[0039]
Next, as shown in FIG. 9B, the Zθ table 37 is driven to raise the panel support table 31 and support the display panel 6 from below. As a result, the display panel 6 is lifted from the transport conveyor 32. In this state, the Y table 35 is driven to horizontally move the panel support table 31, and the edge 6 a of the display panel 6 is aligned with the work position on the upper surface of the substrate receiving portion 33.
[0040]
Thereafter, the electronic component 8 held by the edge portion 6a and the holding head 38b is recognized by the camera 39, and after aligning the edge portion 6a and the electronic component 8 based on the recognition result, the Zθ table 37 is changed. Driven to lower the panel support table 31, the edge 6 a of the display panel 6 is brought into contact with the upper surface of the substrate lower receiving portion 33. After receiving the lower surface of the edge 6a in this way, the holding head 38b is lowered to mount the electronic component 8 on the edge 6a.
[0041]
FIG. 10 shows an example in which a transfer conveyor 32 ′ that can move in the vertical direction is used instead of the transfer conveyor 32 shown in FIG. FIG. 10A shows a state in which the display panel 6 is carried into the electronic component mounting stage 3 by the conveyer 32 ′. Thereafter, as shown in FIG. 10B, the conveyor 32 ′ is lowered and the lower surface of the display panel 6 is supported by the panel support table 31. In this state, the Y table 35 is driven to move the panel support table 31 horizontally. As a result, as in the example shown in FIG. 9, the edge 6 a of the display panel 6 is aligned with the work position on the upper surface of the substrate lower receiving portion 33.
[0042]
As described above, by adopting the configuration shown in the present embodiment in the transport mechanism of the display panel 6, the apparatus occupation width dimension in the direction orthogonal to the assembly line direction can be reduced, and the conventional transport arm This eliminates the need for a space for waiting for the transfer arm between the work stages required in the transfer mechanism using, thereby reducing the total length of the line. Thereby, even when a large panel is targeted, the facility space can be made compact.
[0043]
In addition, this invention is not limited to the said embodiment, For example, although the example of a belt conveyor is shown as a type of a conveyance conveyor, you may use other types of conveyors, such as a roller conveyor. Further, in the present embodiment, the substrate support portion in each work stage uses a fixed support whose vertical position is fixed, but it may be configured to be movable up and down.
[0044]
【The invention's effect】
According to the present invention, the substrate transport unit that carries in and out the substrate to and from the work stage that performs work at a predetermined work position with respect to the substrate is configured by the pair of transport conveyors, and the substrate carried by the substrate transport unit Since the substrate support portion that supports the substrate from below is moved in the space between the pair of transfer conveyors so that the edge of the substrate is aligned with the work position, the substrate transfer portion is protruded from the work stage. Therefore, the space occupied by the assembly line can be made compact.
[Brief description of the drawings]
FIG. 1 is a plan view of a display panel assembling apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a display panel assembling apparatus according to an embodiment of the present invention. FIG. 4 is a perspective view of an adhesive tape application stage of a display panel assembly apparatus according to an embodiment of the present invention. FIG. 5 is an embodiment of the present invention. FIG. 6 is a perspective view of the electronic component mounting stage of the display panel assembling apparatus of the embodiment of the present invention. FIG. 7 is a perspective view of the electronic component mounting stage of the display panel assembling apparatus of the embodiment of the present invention. FIG. 8 is a perspective view of the main crimping stage of the display panel assembling apparatus of the embodiment of the present invention. FIG. 9 is a perspective view of the main crimping stage of the display panel assembling apparatus of the embodiment of the present invention. Operation explanation of substrate positioning operation of display panel assembly equipment Operation explanatory diagram of a substrate positioning operation of the apparatus for assembling a display panel of an embodiment of the invention; FIG EXPLANATION OF REFERENCE NUMERALS
2 Adhesive tape application stage 3 Electronic component mounting stage 4 First final pressure bonding stage 5 Second final pressure bonding stage 6 Display panel 7 Laminated tape 7a Adhesive tape 8 Electronic components 20, 30, 40, 50 XYZθ tables 21, 31, 41 , 51 Panel support tables 22, 32, 42, 52 Conveyors 23, 33, 43, 53

Claims (5)

  1. A display panel assembling apparatus for assembling a display panel having electronic components mounted on an edge of a substrate, the work stage performing work at a predetermined work position with respect to the substrate, and being arranged at a side of the work position The substrate transport unit that carries in and out the substrate to and from the work stage by a pair of horizontal transport conveyors and the substrate that is provided between the pair of transport conveyors of the work stage and is transported by the substrate transport unit A substrate support unit that supports the substrate from below, and a moving table that moves the substrate support unit in a space between the pair of transport conveyors and aligns the edge of the substrate supported by the substrate support unit with the working position. And a display panel assembling apparatus.
  2. 2. The display panel assembling apparatus according to claim 1, further comprising a substrate receiving portion for receiving the lower surface of the substrate at the work position.
  3. 3. The display panel assembling apparatus according to claim 1, wherein the working stage is an adhesive tape attaching stage for attaching an adhesive tape for adhering an electronic component to an edge of the substrate.
  4. 3. The display panel assembly according to claim 1, wherein the work stage is an electronic component mounting stage that mounts an electronic component on an adhesive tape affixed to an edge of a substrate and temporarily presses the electronic component. apparatus.
  5. The display panel assembling apparatus according to claim 1, wherein the work stage is a main press-bonding stage for main press-bonding an electronic component temporarily press-bonded to an edge portion of the substrate.
JP2001270137A 2001-09-06 2001-09-06 Display panel assembly equipment Expired - Fee Related JP3731513B2 (en)

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7484464B2 (en) * 2003-11-25 2009-02-03 General Motors Corporation Adhesive-based reconfigurable pallet system for assembly lines
JP4701712B2 (en) 2004-12-27 2011-06-15 パナソニック株式会社 Panel supply apparatus and panel supply method
WO2006085462A1 (en) * 2005-02-10 2006-08-17 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and substrate transfer method
JP4680621B2 (en) * 2005-02-10 2011-05-11 パナソニック株式会社 Component mounting apparatus and board conveying method
JP4695406B2 (en) * 2005-02-10 2011-06-08 パナソニック株式会社 Component mounting apparatus and component mounting method
JP4879500B2 (en) * 2005-03-25 2012-02-22 パナソニック株式会社 Method for disassembling glass substrate of display panel
JP4802003B2 (en) * 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP2009116172A (en) * 2007-11-08 2009-05-28 Hitachi High-Technologies Corp Panel assembling device and method, and liquid crystal display panel
KR20090066593A (en) * 2007-12-20 2009-06-24 삼성전자주식회사 Flip chip bonding apparatus and bonding method for the flip chip
JP4729652B2 (en) * 2008-04-01 2011-07-20 パナソニック株式会社 Component mounting apparatus and method
JP5479701B2 (en) * 2008-10-06 2014-04-23 株式会社日立ハイテクノロジーズ Display panel module assembly equipment
JP5317618B2 (en) * 2008-10-06 2013-10-16 株式会社日立ハイテクノロジーズ Display panel module assembly apparatus and substrate transfer apparatus
KR101071265B1 (en) 2008-11-26 2011-10-10 세메스 주식회사 Unit for transferring a flat panel and apparatus for processing a flat panel having the unit
TWI668789B (en) * 2017-02-03 2019-08-11 日商新川股份有限公司 Splicing device

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