JP4908404B2 - Bonding apparatus and bonding system having the same - Google Patents

Bonding apparatus and bonding system having the same Download PDF

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JP4908404B2
JP4908404B2 JP2007514585A JP2007514585A JP4908404B2 JP 4908404 B2 JP4908404 B2 JP 4908404B2 JP 2007514585 A JP2007514585 A JP 2007514585A JP 2007514585 A JP2007514585 A JP 2007514585A JP 4908404 B2 JP4908404 B2 JP 4908404B2
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holding
bonding
mounting member
workpiece
bonding apparatus
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泰司 田村
聰 奈良場
誠次 松田
義浩 木下
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Toray Engineering Co Ltd
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    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788Glasses, e.g. amorphous oxides, nitrides or fluorides

Description

本発明は、電子部品などのチップ部品やフィルム状の回路基板などを、ガラスや樹脂の基板などからなるワークに実装するボンディング装置およびこれを用いたボンディングシステムに関する。   The present invention relates to a bonding apparatus for mounting a chip component such as an electronic component or a film-like circuit board on a workpiece made of a glass or resin substrate, and a bonding system using the same.

従来のボンディング装置は、基板保持テーブルに保持したガラスや樹脂の回路基板の所定箇所に異方導電性フィルムなど導電性接合材料を供給し、ボンディングヘッドによって吸着保持した電子部品であるチップ部品を当該箇所に押圧しながら異方導電性フィルムを加熱して実装している(例えば、特許文献1参照)。   A conventional bonding apparatus supplies a chip material, which is an electronic component that is sucked and held by a bonding head, by supplying a conductive bonding material such as an anisotropic conductive film to a predetermined portion of a circuit board made of glass or resin held on a substrate holding table. The anisotropic conductive film is heated and mounted while being pressed to a place (see, for example, Patent Document 1).

また、チップ部品とは異なる実装部材であるFPC(Flexible Printed Circuit)を個別のボンディング装置を利用して回路基板に実装している(例えば、特許文献2参照参照)。
特開2003−59975号公報 特開2003−66479号公報
Further, an FPC (Flexible Printed Circuit), which is a mounting member different from a chip component, is mounted on a circuit board using an individual bonding apparatus (see, for example, Patent Document 2).
JP 2003-59975 A JP 2003-66479 A

近年、携帯電話や携帯端末のPDA(Personal Digital Assistant)などの小型の機器においては、液晶パネルを搭載しつつも、小型かつ軽量化が要求されている。そのため、液晶ガラス基板には、面実装タイプの電子部品やLSI(Large Scale Integrated circuit)、および小さい筐体内の空間利用が容易で軽量なFPCとが実装されている。特に、FPCは、湾曲させて筐体内の限られたスペースに収納させるので複雑な形状をしている。このような複雑な形状のFPCを小型の液晶ガラス基板に自動実装することが困難な状況にある。   In recent years, small devices such as mobile phones and PDAs (Personal Digital Assistants) of portable terminals have been required to be small and light while mounting a liquid crystal panel. Therefore, on the liquid crystal glass substrate, a surface mount type electronic component, an LSI (Large Scale Integrated circuit), and an FPC that is easy to use and light in space in a small casing are mounted. In particular, the FPC has a complicated shape because it is curved and stored in a limited space in the housing. It is difficult to automatically mount such a complicated shaped FPC on a small liquid crystal glass substrate.

また、小型の液晶ガラス基板は、その電極のピッチが狭くなる傾向にあり、LSIなどのチップ部品のみならずFPCの実装精度を高めることが要求されている。しかしながら、FPCは撓みやすく取り扱いが困難であるので、手動装置にて実装するが、手動で精度よく実装することが困難である。   In addition, a small liquid crystal glass substrate tends to have a narrower pitch of electrodes, and it is required to improve not only chip components such as LSIs but also FPC mounting accuracy. However, since FPC is flexible and difficult to handle, it is mounted with a manual device, but it is difficult to mount it manually with high accuracy.

また、従来のように、実装部品ごとに異なるボンディング装置を利用した場合、装置間の基板搬送過程で人が介在して基板に塵埃が付着し、品質不良が発生するといった問題もある。   In addition, when different bonding apparatuses are used for different mounting parts as in the prior art, there is a problem in that a person is interposed in the process of transporting the board between the apparatuses and dust adheres to the board, resulting in poor quality.

本発明は、このような事情に鑑みてなされたものであって、基板などのワークに異なる実装部品を精度よく実装することができるボンディング装置およびこれを備えたボンディングシステムを提供することを主たる目的とする。   The present invention has been made in view of such circumstances, and a main object of the present invention is to provide a bonding apparatus capable of accurately mounting different mounting components on a workpiece such as a substrate, and a bonding system including the same. And

本発明は、このような目的を達成するために、次のような構成をとる。
すなわち、本発明のボンディング装置は、ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、前記ワークを載置保持する第1保持テーブルと、前記実装部材であるチップ部品を保持する第1保持手段と、前記実装部材であるフィルム状またはシート状の基板を保持する第2保持手段と、前記第1保持手段と第2保持手段を取り付ける仮圧着ヘッドと、前記第1保持テーブルの載置保持されたワークに前記各実装部材を実装するとき、前記第1保持手段と第2保持手段による各実装部材の保持タイミングを制御するタイミング制御手段と、前記第1保持テーブルとヘッドとを相対的に昇降移動させる第1駆動手段と、前記第1駆動手段を作動させて前記第1保持テーブルと仮圧着ヘッドとを相対的に昇降移動させ、前記第1または第2保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱してワークに仮圧着する加熱手段とを備えたことを特徴とする。
In order to achieve such an object, the present invention has the following configuration.
That is, the bonding apparatus of the present invention is a bonding apparatus that mounts a mounting member on a workpiece via a conductive bonding material, and includes a first holding table for mounting and holding the workpiece, and a chip component that is the mounting member. First holding means for holding, second holding means for holding the film-like or sheet-like substrate as the mounting member, a temporary pressure-bonding head to which the first holding means and the second holding means are attached, and the first holding Timing control means for controlling the holding timing of each mounting member by the first holding means and the second holding means when mounting each mounting member on the work placed and held on the table, the first holding table and the head a first driving means for relatively vertically movable bets, relatively to the lifting movement between the first holding table and the pre-press bonding head actuates the first drive means Characterized by comprising a heating means for preliminary press bonding to the work by heating the first or the conductive bonding material in a state where the held mounted member is pressed against the workpiece to the second holding means.

本発明のボンディング装置によれば、ワークに実装する実装部材に応じて、ヘッドに取り付けた第1保持手段または第2保持手段のいずれかの保持を作動させることができる。つまり、チップ部品またはフィルム状の基板など異なる形状の実装部品を単一のヘッドでワークに実装することができる。なお、本発明のチップ部品としては、例えば、LSIや電子部品などである。したがって、発明装置は、実装ずれのない高度な実装精度の要求されるLSIの実装が可能となるので、フィルム状の基板の実装精度の向上も図ることができる。   According to the bonding apparatus of the present invention, either the first holding means or the second holding means attached to the head can be operated in accordance with the mounting member to be mounted on the workpiece. That is, mounting components having different shapes such as chip components or film-like substrates can be mounted on the workpiece with a single head. The chip component of the present invention is, for example, an LSI or an electronic component. Therefore, the inventive device can mount LSIs that require high mounting accuracy without mounting deviation, and can therefore improve the mounting accuracy of a film-like substrate.

なお、第1保持手段は、チップ部品の中央または/および幅方向に均等に吸着保持し、 第2保持手段は、前記基板の複数の角部近傍を吸着保持するよう構成することが好ましい。   Preferably, the first holding means is configured to suck and hold evenly in the center or / and the width direction of the chip component, and the second holding means is configured to suck and hold near the plurality of corners of the substrate.

この構成によれば、第1保持手段は、チップ部品のような硬質な部品を精度よく吸着保持することができる。また、第2保持手段は、フィルム状の撓みやすい基板を平面状に保持することができる。すなわち、チップ部品やフィルム状の基板などをワークに精度よく実装することができる。   According to this configuration, the first holding means can accurately hold and hold a hard component such as a chip component. The second holding means can hold the film-like flexible substrate in a flat shape. That is, a chip component, a film-like substrate, or the like can be accurately mounted on the workpiece.

また、本発明のボンディング装置は、第1保持手段または第2保持手段の少なくともともいずれかを昇降させる第2駆動手段と、第1保持手段および第2保持手段に保持される両実装部材の厚みの差に応じて、第2駆動手段の作動制御する駆動制御手段とを備えることが好ましい。   In the bonding apparatus of the present invention, the thicknesses of the second driving means for raising and lowering at least one of the first holding means and the second holding means, and the thicknesses of both mounting members held by the first holding means and the second holding means. It is preferable to include drive control means for controlling the operation of the second drive means in accordance with the difference between the two.

この構成によれば、実装部材をワークに実装する場合に、実装部材を保持している保持手段を降下、または、実装部材を保持していない保持手段を上昇させることにより、実装部材を保持しないいずれかの保持手段が、近隣にある部材と接触および押圧して破損させるのを防止することができる。   According to this configuration, when the mounting member is mounted on the workpiece, the mounting member is not held by lowering the holding means holding the mounting member or raising the holding means not holding the mounting member. Any of the holding means can be prevented from being damaged by contacting and pressing a member in the vicinity.

また、駆動制御手段は、第1保持手段および第2保持手段の両方が実装部材を保持した状態で第2駆動手段を作動制御し、両保持手段が実装部材を同時にワークに実装するように構成してもよい。この構成によれば、作業効率の向上を図ることができる。   The drive control means is configured to control the operation of the second drive means while both the first holding means and the second holding means hold the mounting member, and both the holding means simultaneously mount the mounting member on the workpiece. May be. According to this configuration, work efficiency can be improved.

また、本発明のボンディング装置を備えたボンディングシステムは、前記ワークを載置保持する第2保持テーブルと、前記第2保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料供給手段と、異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第1ワーク搬送手段と、前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をワークに固着させる加熱圧着手段と、前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送する第2ワーク搬送手段と、を備えたことを特徴とする。   In addition, a bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table having a width corresponding to a mounting member. A plurality of conductive material supply means for supplying an anisotropic conductive film, a first work transfer means for transferring the work supplied with the anisotropic conductive film to a bonding apparatus, and a mounting for transferring a mounting member to the bonding apparatus After heating the anisotropic conductive film supplied to the workpiece by the member conveying means and the bonding apparatus, the polymerization reaction is advanced halfway to mount the mounting member on the workpiece in an uncured state, and then the anisotropic of the workpiece The conductive film is further heated to terminate the polymerization reaction, and the thermocompression bonding means for fixing the mounting member to the work, and mounting by the bonding apparatus. Characterized by comprising a second workpiece carrying means for carrying the implemented workpiece timber in the heat pressing means.

すなわち、この構成によれば、ワークに異方導電性フィルムを供給してから、当該供給箇所に実装部材を実装するまでの一連の処理を、人を介さずに行なうことができる。したがって、搬送過程などにおいて、ワークに塵埃が付着するのを回避することができるので、高品位のワークを得ることができる。   That is, according to this configuration, a series of processes from supplying the anisotropic conductive film to the workpiece to mounting the mounting member at the supply location can be performed without human intervention. Therefore, dust can be prevented from adhering to the workpiece during the conveyance process and the like, so that a high-quality workpiece can be obtained.

なお、本発明のボンディングシステムは、チップ部品およびフィルム状またはシート状の両実装部材を洗浄する洗浄手段を備えることが好ましい。この洗浄手段としては、例えば、気体または超音波を付与した気体を実装部材に吹き付けるよう構成があげられる。   In addition, it is preferable that the bonding system of this invention is equipped with the washing | cleaning means which wash | cleans both chip components and a film-like or sheet-like mounting member. As this cleaning means, for example, a configuration in which a gas or a gas to which ultrasonic waves are applied is blown onto the mounting member can be mentioned.

また、本発明のボンディング装置装置は、ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、前記ワークを載置保持する第1保持テーブルと、
前記実装部材であるフィルム状またはシート状の基板およびチップ部品の両実装部材の実装部位を吸着保持する複数個の吸着孔の形成された保持手段と、前記保持手段を取り付ける仮圧着ヘッドと、前記保持手段に保持する実装部材の形状に応じて、当該保持手段に形成された複数個の吸着孔の吸着作動を切換制御する制御手段と、前記第1保持テーブルとヘッドとを相対的に昇降移動させる第1駆動手段と、前記第1駆動手段を作動させて前記第1保持テーブルと仮圧着ヘッドとを相対的に昇降移動させ、前記保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱して仮圧着する加熱手段と、を備えたことを特徴とする。
Further, the bonding apparatus apparatus of the present invention is a bonding apparatus for mounting a mounting member on a work via a conductive bonding material, a first holding table for mounting and holding the work,
A holding means having a plurality of suction holes for sucking and holding the mounting parts of both the mounting member of the film-like or sheet-like substrate and chip component as the mounting member, a temporary pressure-bonding head for attaching the holding means, According to the shape of the mounting member held by the holding means, the control means for switching and controlling the suction operation of the plurality of suction holes formed in the holding means, and the first holding table and the head are relatively moved up and down. The first driving means to be moved, and the first driving means to be operated to move the first holding table and the temporary press-bonding head relatively up and down, and the mounting member held by the holding means is pressed against the workpiece. And heating means for heating and temporarily press- bonding the conductive bonding material in a state of being present.

この構成によれば、保持手段の形成された複数個の吸着孔の作動を制御することにより、単一の保持手段を利用してチップと基板の両方を適時に吸着保持することができる。また、チップの実装精度と同じ実装精度によって基板を精度よく実装することができる。   According to this configuration, by controlling the operation of the plurality of suction holes formed with the holding means, both the chip and the substrate can be suctioned and held in a timely manner using a single holding means. In addition, the substrate can be mounted with high accuracy by the same mounting accuracy as the mounting accuracy of the chip.

なお、本発明のボンディング装置は、さらに保持手段によって基板を吸着保持したときに、保持手段からはみ出る部位を吸着保持する支持手段を備えることが好ましい。   Note that the bonding apparatus of the present invention preferably further includes support means for sucking and holding a portion protruding from the holding means when the substrate is sucked and held by the holding means.

この構成によれば、保持手段からはみ出した基板を支持手段により吸着保持するので、基板の撓みによる実装部位への位置ずれなどを回避することができる。   According to this configuration, since the substrate protruding from the holding means is sucked and held by the supporting means, it is possible to avoid a positional shift to the mounting site due to the bending of the substrate.

また、支持手段は、基板の複数の角部近傍を吸着保持するよう構成することが好ましい。   Further, it is preferable that the support means is configured to suck and hold the vicinity of a plurality of corners of the substrate.

この構成によれば、フィルム基板などを撓ますことなく平坦状態を維持したまま取り扱うことができる。   According to this configuration, the film substrate or the like can be handled while being kept flat without being bent.

また、本発明のボンディング装置は、保持手段または支持手段の少なくともともいずれかを昇降させる第2駆動手段と、保持手段および支持手段に保持される両実装部材の厚みの差に応じて、第2駆動手段の作動制御する駆動制御手段と、を備えることが好ましい。   Further, the bonding apparatus of the present invention has a second driving unit that moves up and down at least one of the holding unit and the supporting unit, and the second driving unit according to a difference in thickness between the mounting members held by the holding unit and the supporting unit. Drive control means for controlling the operation of the drive means.

また、駆動制御手段は、保持手段および第支持手段の両方が実装部材を保持した状態で第2駆動手段を作動制御し、保持手段が両実装部材を同時にワークに実装するように構成することがより好ましい。   The drive control means may be configured to control the operation of the second drive means in a state where both the holding means and the first support means hold the mounting member, and the holding means simultaneously mounts both the mounting members on the workpiece. More preferred.

また、本発明のボンディング装置を備えたボンディングシステムは、前記ワークを載置保持する第2保持テーブルと、前記第2保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料供給手段と、異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第1ワーク搬送手段と、前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をワークに固着させる加熱圧着手段と、前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送する第2ワーク搬送手段と、を備えたことを特徴とする。   In addition, a bonding system including the bonding apparatus according to the present invention includes a second holding table for placing and holding the workpiece, and a predetermined portion of the workpiece placed and held on the second holding table having a width corresponding to a mounting member. A plurality of conductive material supply means for supplying an anisotropic conductive film, a first work transfer means for transferring the work supplied with the anisotropic conductive film to a bonding apparatus, and a mounting for transferring a mounting member to the bonding apparatus After heating the anisotropic conductive film supplied to the workpiece by the member conveying means and the bonding apparatus, the polymerization reaction is advanced halfway to mount the mounting member on the workpiece in an uncured state, and then the anisotropic of the workpiece The conductive film is further heated to terminate the polymerization reaction, and the thermocompression bonding means for fixing the mounting member to the work, and mounting by the bonding apparatus. Characterized by comprising a second workpiece carrying means for carrying the implemented workpiece timber in the heat pressing means.

すなわち、この構成によれば、ワークに異方導電性フィルムを供給してから、当該供給箇所に実装部材を実装するまでの一連の処理を、人を介さずに行なうことができる。したがって、搬送過程などにおいて、ワークに塵埃が付着するのを回避することができるので、高品位のワークを得ることができる。   That is, according to this configuration, a series of processes from supplying the anisotropic conductive film to the workpiece to mounting the mounting member at the supply location can be performed without human intervention. Therefore, dust can be prevented from adhering to the workpiece during the conveyance process and the like, so that a high-quality workpiece can be obtained.

本発明に係るにボンディング装置によれば、ワークに実装する実装部材に応じて、ヘッドに取り付けた第1保持手段または第2保持手段のいずれかの保持を作動させ、チップ部品またはフィルム状の基板など異なる形状の実装部品をワークに実装することができる。   According to the bonding apparatus of the present invention, the holding of either the first holding means or the second holding means attached to the head is operated according to the mounting member to be mounted on the work, and the chip component or the film-like substrate Mounting parts with different shapes can be mounted on the workpiece.

また、この発明に係るボンディングシステムによれば、ワークに異方導電性フィルムを供給してから、当該供給箇所に実装部材を実装するまでの一連の処理を、人を介さずに行なうことができる。すなわち、搬送過程などにおいて、ワークに塵埃が付着するのを回避することができるので、高品位のワークを得ることができる。   Moreover, according to the bonding system which concerns on this invention, a series of processes after supplying an anisotropic conductive film to a workpiece | work until mounting a mounting member in the said supply location can be performed without a person. . That is, since it is possible to avoid the dust from adhering to the workpiece during the conveyance process, a high-quality workpiece can be obtained.

また、装置およびシステムが簡素化されるので、装置導入費用を抑えることができるとともに、生産効率を上げることができる。   In addition, since the apparatus and the system are simplified, it is possible to suppress the apparatus introduction cost and increase the production efficiency.

実施例に係るボンディングシステムの斜視図である。It is a perspective view of the bonding system which concerns on an Example. 実装部材供給ユニットの概略構成を示した斜視図である。It is the perspective view which showed schematic structure of the mounting member supply unit. 第1および第2実装部材移送機構の吸着部材の下面から見た図である。It is the figure seen from the lower surface of the adsorption member of the 1st and 2nd mounting member transfer mechanism. 基板に実装部材を実装した様子を示す図である。It is a figure which shows a mode that the mounting member was mounted in the board | substrate. 仮圧着ヘッドに備わった第1および第2保持部材の下面から見た図である。It is the figure seen from the lower surface of the 1st and 2nd holding member with which the temporary crimping head was equipped. 仮圧着ヘッドの概略構成を示す斜視図である。It is a perspective view which shows schematic structure of a temporary crimping | compression-bonding head. 実施例2に係る仮圧着ヘッドに備わった第1および第2保持部材の下面から見た図である。FIG. 10 is a view of the first and second holding members provided in the provisional pressure bonding head according to the second embodiment when viewed from the lower surface. 変形例のボンディング装置の動作を説明する図である。It is a figure explaining operation | movement of the bonding apparatus of a modification.

符号の説明Explanation of symbols

1a… ボンディング部位(チップ用)
1b… ボンディング部位(FPC用)
2 … チップ
4 … FPC
20 … 基板供給ユニット
30 … 実装部材供給ユニット
31A… 第1実装部材移送機構
31B… 第2実装部材移送機構
40 … 導電材料供給ユニット
50 … 仮圧着ユニット
52 … 仮圧着ヘッド
54 … 基板保持ステージ
56A… 第1保持部材
56B… 第2保持部材
56C… 第1保持部材
56D… 第2保持部材
60A… 本圧着ユニット(チップ用)
60B… 本圧着ユニット(FPC用)
70 … 基板収納ユニット
90 … 制御部
1a ... Bonding part (for chip)
1b ... Bonding part (for FPC)
2 ... Chip 4 ... FPC
DESCRIPTION OF SYMBOLS 20 ... Board | substrate supply unit 30 ... Mounting member supply unit 31A ... 1st mounting member transfer mechanism 31B ... 2nd mounting member transfer mechanism 40 ... Conductive material supply unit 50 ... Temporary pressure bonding unit 52 ... Temporary pressure bonding head 54 ... Substrate holding stage 56A ... First holding member 56B ... Second holding member 56C ... First holding member 56D ... Second holding member 60A ... Main pressure bonding unit (for chip)
60B ... Main crimping unit (for FPC)
70 ... Substrate storage unit 90 ... Control unit

以下、図面を参照して本発明のボンディング装置を備えたボンディングシステムの実施例を説明する。なお、本実施例では、チップ部品としてLSIを、フィルム状の基板などとしてはFPC(Flexible Printed Circuit)をワークであるガラス基板に実装する場合を例にとって説明する。なお、チップ部品としては、その他に例えば、電子部品、ICチップ、半導体チップ、光素子、表面実装部品、ウエハなどの種類や大きさに関係なく、基板と接合させる側の全ての形態を示す。なお、以下、本実施例では、LSIを単にチップという。   Embodiments of a bonding system including a bonding apparatus according to the present invention will be described below with reference to the drawings. In this embodiment, an example will be described in which an LSI is mounted as a chip component, and an FPC (Flexible Printed Circuit) is mounted as a film substrate on a glass substrate as a workpiece. In addition, as the chip component, for example, all forms on the side to be bonded to the substrate are shown regardless of the types and sizes of electronic components, IC chips, semiconductor chips, optical elements, surface mount components, wafers, and the like. Hereinafter, in this embodiment, the LSI is simply referred to as a chip.

また、基板としては、例えば、樹脂基板やガラス基板などチップ部品などが接合される側の全ての形態を示す。なお、本実施例では液晶ディスプレイパネル用のガラス基板を利用する。   Moreover, as a board | substrate, all the forms by the side to which chip components etc., such as a resin substrate and a glass substrate, are joined are shown, for example. In this embodiment, a glass substrate for a liquid crystal display panel is used.

図1は、本実施例に係るボンディングシステムの斜視図である。
本実施例に係るチップ実装装置は、大きく分けて、装置基台10と、この装置基台10の一端側(図1では左端)に配設された基板供給ユニット20と、装置基台10の奥側に配設された実装部材供給ユニット30と、基板供給ユニット20の隣に配設された導電材料供給ユニット40と、その隣に配設された仮圧着ユニット50と、さらにその隣に配設された本圧着ユニット60A、60Bと、装置基台10の他端側(図1では右端)に配設された基板収納ユニット70と、装置基台10の手前側に配設された4つの基板搬送機構80A〜80Dとから構成されている。なお、実装部材供給ユニット30は、本発明の実装部材搬送手段に相当し、導電材料供給ユニット40は導電材料供給手段に相当し、本圧着ユニット60A、60Bは加熱圧着手段に相当する。
FIG. 1 is a perspective view of the bonding system according to the present embodiment.
The chip mounting apparatus according to the present embodiment is roughly divided into an apparatus base 10, a substrate supply unit 20 disposed on one end side (left end in FIG. 1) of the apparatus base 10, and an apparatus base 10. The mounting member supply unit 30 disposed on the back side, the conductive material supply unit 40 disposed adjacent to the substrate supply unit 20, the temporary pressure bonding unit 50 disposed adjacent thereto, and further disposed adjacent thereto. The main crimping units 60A and 60B provided, the substrate storage unit 70 disposed on the other end side (the right end in FIG. 1) of the apparatus base 10, and the four units disposed on the front side of the apparatus base 10. It is comprised from board | substrate conveyance mechanisms 80A-80D. The mounting member supply unit 30 corresponds to the mounting member conveying means of the present invention, the conductive material supply unit 40 corresponds to the conductive material supply means, and the main pressure bonding units 60A and 60B correspond to the thermocompression bonding means.

基板供給ユニット20は、実装部材であるLSIとFPCの実装前の複数枚のガラス基板1(以下、単に「基板」という)を一定間隔で多段に収納する基板収納マガジン21と、この基板収納マガジン21から基板1を順に取り出す昇降および水平移動可能な昇降テーブル22とを備えている。また、基板供給ユニット20は、基板1を順に供給可能であれば、その構造は特に限定されず、例えば、複数枚の基板1を水平面内に整列配置したトレイ構造であってもよい。   The substrate supply unit 20 includes a substrate storage magazine 21 that stores a plurality of glass substrates 1 (hereinafter simply referred to as “substrates”) before mounting LSI and FPC, which are mounting members, in multiple stages at regular intervals, and the substrate storage magazine. And a lifting table 22 capable of moving up and down and horizontally moving the substrate 1 in order. The substrate supply unit 20 is not particularly limited in structure as long as the substrates 1 can be sequentially supplied. For example, the substrate supply unit 20 may have a tray structure in which a plurality of substrates 1 are arranged in a horizontal plane.

実装部材供給ユニット30は、図2に示すように、基板1に実装すべき複数個のチップ2をフェイスアップ状態で縦横に整列配置したチップトレイ3からチップ2を1個ずつ順に取り出し、フェイスアップ状態で移送する第1実装部材移送機構31Aと、基板1に実装すべき複数個のFPC4をフェイスアップ状態で縦横に整列配備したFPCトレイ5から、FPC4を1個ずつ順に取り出し、そのFPC4をフェイスアップ状態で移送する第2実装部材移送機構31Bと、これら第1および第2実装部材搬送機構31A、31Bから交互に各実装部材を受け取り、その実装部材を保持して上下反転することにより、そのチップ2およびFPC4をフェイスダウン状態の姿勢変換する反転テーブル32と、この反転テーブル32から各実装部材を受け取り、各実装部材をフェイスダウン状態で保持する保持テーブル33とを備える。この保持テーブル33から各実装部材を、さらに第1および第2実装部材移送機構31A、31Bが受け取り、保持して移送することにより、その各実装部材を所定位置(具体的には、待機位置にあるスライダー34上の所定位置)にフェイスダウン状態などで供給する。   As shown in FIG. 2, the mounting member supply unit 30 sequentially takes out the chips 2 one by one from the chip tray 3 in which a plurality of chips 2 to be mounted on the substrate 1 are arranged vertically and horizontally in a face-up state. The FPC 4 is taken out one by one from the FPC tray 5 in which the first mounting member transport mechanism 31A for transporting in a state and a plurality of FPCs 4 to be mounted on the substrate 1 are arranged in the vertical and horizontal directions in a face-up state. By receiving each mounting member alternately from the second mounting member transport mechanism 31B that transports in the up state, and the first and second mounting member transport mechanisms 31A, 31B, and holding the mounting member upside down, A reversing table 32 for converting the posture of the chip 2 and the FPC 4 in a face-down state, and each mounting unit from the reversing table 32 Receive, each mounting member and a holding table 33 for holding face-down state. Each mounting member is further received from the holding table 33 by the first and second mounting member transfer mechanisms 31A and 31B, and held and transferred to move the mounting member to a predetermined position (specifically, to the standby position). A predetermined position on a slider 34) is supplied in a face-down state or the like.

具体的には、チップトレイ3の一辺に沿う方向(Y方向)に固定レール35Aが設けられており、この固定レール35A上を、X方向に延びる可動レール35Bが走行するようになっている。この可動レール35B上を走行する可動ベース36に上述した第1実装部材移送機構31Aと第2実装部材移送機構31Bとが間隔をあけて取り付けられている。   Specifically, a fixed rail 35A is provided in a direction (Y direction) along one side of the chip tray 3, and a movable rail 35B extending in the X direction travels on the fixed rail 35A. The first mounting member transfer mechanism 31A and the second mounting member transfer mechanism 31B described above are attached to the movable base 36 that travels on the movable rail 35B with an interval therebetween.

第1実装部材移送機構31Aの下端部には、チップ2を吸着保持可能な吸着ヘッド6Aが取り付けられている。また、第2実装部材移送機構31Bの下端部には、FPC4を吸着保持可能な吸着ヘッド6Bが取り付けられている。吸着ヘッド6Aは、図3(a)に示すように、チップ2の全面を覆う横長矩形状であり、その中央にチップ2を吸着保持する吸着孔8Aが形成されている。また吸着ヘッド6Bは、図3(b)に示すように、FPC4の全面を覆う横長矩形状であり、FPC4が撓むことのないように複数の角部の近傍を吸着保持する吸着孔8Bが形成されている。   A suction head 6A capable of sucking and holding the chip 2 is attached to the lower end of the first mounting member transfer mechanism 31A. A suction head 6B capable of sucking and holding the FPC 4 is attached to the lower end portion of the second mounting member transfer mechanism 31B. As shown in FIG. 3A, the suction head 6A has a horizontally long rectangular shape that covers the entire surface of the chip 2, and a suction hole 8A that sucks and holds the chip 2 is formed at the center thereof. Further, as shown in FIG. 3B, the suction head 6B has a horizontally long rectangular shape that covers the entire surface of the FPC 4, and has suction holes 8B that suck and hold the vicinity of a plurality of corners so that the FPC 4 does not bend. Is formed.

反転テーブル32には、Y方向の軸心P周りに180度の範囲で回動可能に構成されている。なお、第1および第2実装部材移送機構31A、31Bからスライダー34に実装部材が移送される途中の下方に認識手段であるカメラ91が配備されており、両実装部材移送機構31A、31Bの下端に吸着保持された各実装部材の吸着保持姿勢を認識するようになっている。そして、認識された画像情報に基づいて、各実装部材移送機構31A、31Bの吸着ヘッドをθ方向に回転させたり、各可動レール35A、35BによってX、Y方向の位置を調整したりして、各実装部材をスライダー34に載置するようになっている。   The reversing table 32 is configured to be rotatable around the axis P in the Y direction within a range of 180 degrees. It should be noted that a camera 91 as a recognition means is provided below the way the mounting member is transferred from the first and second mounting member transfer mechanisms 31A, 31B to the slider 34, and the lower ends of both the mounting member transfer mechanisms 31A, 31B. The suction holding posture of each mounting member held by suction is recognized. Based on the recognized image information, the suction heads of the mounting member transfer mechanisms 31A and 31B are rotated in the θ direction, or the positions in the X and Y directions are adjusted by the movable rails 35A and 35B. Each mounting member is placed on the slider 34.

図2に示すように、上述した保持テーブル33に並んで実装部材洗浄ブロック38が配設されている。チップ洗浄ブロック38は、その上面の中央部に窒素ガスあるいは清浄空気などの気体を噴出する気体噴出孔38Aが設けられている。この気体噴出孔は図示しないガス供給源に接続されている。気体噴出孔の両隣に気体噴出孔から噴出された気体を吸引排気する一対の排気孔38Bが設けられている。この排気孔38Bは図示しない減圧ポンプに接続されている。   As shown in FIG. 2, the mounting member cleaning block 38 is arranged alongside the holding table 33 described above. The chip cleaning block 38 is provided with a gas ejection hole 38A for ejecting a gas such as nitrogen gas or clean air at the center of the upper surface thereof. This gas ejection hole is connected to a gas supply source (not shown). A pair of exhaust holes 38B for sucking and exhausting the gas ejected from the gas ejection holes are provided on both sides of the gas ejection holes. The exhaust hole 38B is connected to a decompression pump (not shown).

保持テーブル33および実装部材洗浄ブロック38は、スライドテーブル39上に並べて配設されている。このスライドテーブル39は、反転テーブル32の回動軸心Pに沿って往復移動可能に構成されている。このスライドテーブル39の移動によって、各実装部材をフェイスダウン状態に保持している反転テーブル32の下方位置に、保持テーブル33および実装部材洗浄ブロック38を択一的に進入させるようになっている。   The holding table 33 and the mounting member cleaning block 38 are arranged side by side on the slide table 39. The slide table 39 is configured to reciprocate along the rotation axis P of the reversing table 32. By the movement of the slide table 39, the holding table 33 and the mounting member cleaning block 38 are selectively entered under the reversing table 32 that holds each mounting member in a face-down state.

スライダー34は、Y方向に配設された固定レール35Cに沿って往復移動可能に構成されている。スライダー34は、待機位置(図2の状態)にあるときに、第1または第2実装部材移送機構31A、31Bから順に、例えば、チップ2をフェイスダウン状態で載置され、そのチップ2を仮圧着ユニット50に供給する。また、その後にFPC4を同様に処理する。   The slider 34 is configured to be able to reciprocate along a fixed rail 35C disposed in the Y direction. When the slider 34 is in the standby position (the state shown in FIG. 2), for example, the chip 2 is placed face down in order from the first or second mounting member transfer mechanism 31A, 31B. Supply to the crimping unit 50. Thereafter, the FPC 4 is similarly processed.

図1に戻って、導電材料供給ユニット40は、基板供給ユニット20から搬送されてきた基板1を水平姿勢で保持する可動テーブル41と、図2および図4に示す基板1にチップ2を実装する部位であるボンディング部位1aと、FPC4を実装する部位であるボンディング部位1bとに異方導電性フィルム(ACF:Anisotropic Conductive Film )から導電材料を各部位に転写する、フィルム幅の異なる2つのヘッド42A、42Bを備えている。可動テーブル41は、基板1を吸着保持する基板保持ステージ43を備え、この基板保持ステージ43が水平2軸(X,Y)方向、上下(Z)方向、およびθ方向に移動自在に構成されている。基板1の一端側である各ボンディング部位1a、1bは基板保持ステージ43から前方に延び出ている。   Returning to FIG. 1, the conductive material supply unit 40 mounts the chip 2 on the movable table 41 that holds the substrate 1 conveyed from the substrate supply unit 20 in a horizontal posture and the substrate 1 shown in FIGS. 2 and 4. Two heads 42A having different film widths for transferring a conductive material from an anisotropic conductive film (ACF) to each part to a bonding part 1a that is a part and a bonding part 1b that is a part on which the FPC 4 is mounted. , 42B. The movable table 41 includes a substrate holding stage 43 that holds the substrate 1 by suction. The substrate holding stage 43 is configured to be movable in two horizontal axes (X, Y), up and down (Z), and θ. Yes. Each bonding part 1 a, 1 b which is one end side of the substrate 1 extends forward from the substrate holding stage 43.

なお、この異方性導電フィルムは、接着・導電・絶縁という3つの機能を同時にもつ接続材料で、熱圧着することにより、膜の厚み方向には導通性、面方向には絶縁性という電気的異方性をもつ高分子膜であり、接着性のあるバインダー内に導電粒子が混在している。   This anisotropic conductive film is a connecting material that has the three functions of adhesion, conduction and insulation at the same time. By thermocompression bonding, it is electrically conductive in the thickness direction of the film and insulative in the surface direction. It is a polymer film having anisotropy, and conductive particles are mixed in an adhesive binder.

仮圧着ユニット50は、導電材料供給ユニット40から搬送されてきた基板1を水平姿勢で保持する可動テーブル51と、導電材料が転写された基板1の各ボンディング部位1a、1b にチップ2およびFPC4を仮圧着する仮圧着ヘッド52と、仮圧着時に基板1とチップ2およびFPC4との位置合わせを行なう上下2方向の認識視野をもつ2視野の認識手段(例えば、2視野カメラ)53とを備えている。なお、可動テーブル51は、本発明の第1保持テーブルに相当する。
The temporary press-bonding unit 50 includes a movable table 51 that holds the substrate 1 conveyed from the conductive material supply unit 40 in a horizontal position, and the chip 2 and the FPC 4 on the bonding portions 1a and 1b of the substrate 1 to which the conductive material is transferred. A provisional crimping head 52 for provisional crimping, and a two-field recognition means (for example, a two-field camera) 53 having a recognition field in two vertical directions for aligning the substrate 1 with the chip 2 and the FPC 4 during provisional crimping are provided. Yes. The movable table 51 corresponds to the first holding table of the present invention .

また、仮圧着ヘッド52の下方にバックアップ55が固定設置されている。可動テーブル51は、基板1を吸着保持する基板保持ステージ54を備え、この基板保持ステージ54が水平2軸(X,Y)方向、上下(Z)方向、およびZ軸周り(θ)方向に、それぞれ移動自在に構成されている。なお、基板保持ステージ54は、本発明の第1駆動手段に相当する。   In addition, a backup 55 is fixedly installed below the temporary pressure bonding head 52. The movable table 51 includes a substrate holding stage 54 that holds the substrate 1 by suction, and the substrate holding stage 54 is arranged in two horizontal axes (X, Y), up and down (Z), and around the Z axis (θ). Each is configured to be freely movable. The substrate holding stage 54 corresponds to the first driving means of the present invention.

仮圧着ヘッド52は昇降自在であって、その下端には、チップ2とFPC4を吸着保持する第1保持部材56Aと、第2保持部材56Bとを備えている。図5に示すように、第1保持部材56Aは、チップ2の電極側とは反対面の全面を覆うように当接し、その中央を吸着する横長の吸着孔57Aが形成されている。また、第2保持部材56Bは、FPC4の電極側とは反対面の全面を覆うように当接し、面積の広い領域の中央部分および複数の角部の近傍に吸着孔57Bが形成されている。これら第1保持部材56Aおよび第2保持部材56Bの各吸着孔57A、57Bは、図6に示すように、吸気管58を介して減圧ポンプ59と連通接続されている。また、仮圧着ヘッド52には、加熱手段であるヒータが内蔵されている。なお、第1保持部材56Aは、本発明の第1保持手段に相当し、第2保持部材56Bは第2保持手段に相当する。   The temporary press-bonding head 52 can be moved up and down, and includes a first holding member 56A and a second holding member 56B that hold the chip 2 and the FPC 4 by suction. As shown in FIG. 5, the first holding member 56 </ b> A abuts so as to cover the entire surface opposite to the electrode side of the chip 2, and has a horizontally long suction hole 57 </ b> A that sucks the center. Further, the second holding member 56B abuts so as to cover the entire surface opposite to the electrode side of the FPC 4, and suction holes 57B are formed in the vicinity of a central portion and a plurality of corner portions of a wide area. The suction holes 57A and 57B of the first holding member 56A and the second holding member 56B are connected to a decompression pump 59 through an intake pipe 58 as shown in FIG. Further, the temporary press-bonding head 52 has a built-in heater as a heating means. The first holding member 56A corresponds to the first holding means of the present invention, and the second holding member 56B corresponds to the second holding means.

また、各保持部材56A、56Bの先端に向かって分岐している吸気管58の途中には、電磁弁E1、E2が設けられており、各電磁弁E1、E2の開閉動作に応じて第1保持部材56Aまたは第2保持部材56Bの吸着保持を切換作動できるようになっている。なお、この切換動作は、予め決められて処理プログラムに基づいて制御部90によって行なわれる。例えば、第1保持部材56Aと第2保持部材56Bを交互に作動させたり、いずれかの吸着エラーが発生した場合には、エラー補正するようにエラー発生側の実装部材を吸着保持させるように連続作動させたりする。なお、制御部90は、本発明のタイミング制御手段に相当する。   In addition, electromagnetic valves E1 and E2 are provided in the middle of the intake pipe 58 branched toward the tips of the holding members 56A and 56B. The first and second operations are performed according to the opening / closing operation of the electromagnetic valves E1 and E2. The suction holding of the holding member 56A or the second holding member 56B can be switched. This switching operation is performed by the control unit 90 based on a predetermined processing program. For example, when the first holding member 56A and the second holding member 56B are operated alternately, or any suction error occurs, the mounting member on the error occurrence side is continuously sucked and held so as to correct the error. To make it work. The control unit 90 corresponds to the timing control means of the present invention.

具体的な動作は、実装部材供給ユニット30のスライダー34で移送されてきたフェイスダウン状態のチップ2またはFPC4を第1または第2保持部材56A、56Bに吸着保持し、各実装部材を所定温度で加熱し、導電材料の重合反応をさせながら所定圧力で基板1の各ボンディング部位1a、1bのいずれかに押し付ける。このとき、重合反応が開始してから反応終了するまでの未硬化状態で加熱および押し付けを終了する。これにより接着剤が半硬化状態になってチップ2およびFPC4が基板1に仮圧着される。なお、仮圧着ヘッド52の保持構造は吸着式に限らず、静電気を使った静電吸着、磁石を使った磁気吸着など、任意の保持構造を用いることもできる。   Specifically, the chip 2 or the FPC 4 in the face-down state transferred by the slider 34 of the mounting member supply unit 30 is sucked and held by the first or second holding members 56A and 56B, and each mounting member is held at a predetermined temperature. It heats and it presses against each bonding site | part 1a, 1b of the board | substrate 1 with predetermined pressure, making the polymerization reaction of an electrically-conductive material. At this time, heating and pressing are finished in an uncured state from the start of the polymerization reaction to the end of the reaction. Thereby, the adhesive is in a semi-cured state, and the chip 2 and the FPC 4 are temporarily bonded to the substrate 1. The holding structure of the temporary press-bonding head 52 is not limited to an adsorption type, and any holding structure such as electrostatic adsorption using static electricity or magnetic adsorption using magnets can be used.

図1に戻り、2視野の認識手段53は、水平2軸(X,Y)方向および上下(Z)方向に移動可能であって、仮圧着ヘッド52に吸着保持されたチップ2およびFPC4の認識マークと、可動テーブル51上に移送された基板1の認識マークとをそれぞれ認識して、両認識マークの位置ズレを検出する。この位置ズレを無くすように仮圧着時に可動テーブル51がX、Y、およびθ方向に駆動制御される。   Returning to FIG. 1, the two-field recognition means 53 is movable in two horizontal (X, Y) directions and up and down (Z) directions, and recognizes the chip 2 and the FPC 4 that are sucked and held by the temporary pressure bonding head 52. The mark and the recognition mark of the substrate 1 transferred onto the movable table 51 are respectively recognized, and the positional deviation between the both recognition marks is detected. The movable table 51 is driven and controlled in the X, Y, and θ directions at the time of temporary pressure bonding so as to eliminate this positional deviation.

本圧着ユニット60は2ブロック60A、60Bからなり、各ブロック60A、60Bは、仮圧着ユニット50から搬送されてきた基板1を水平姿勢で保持する可動テーブル61A、61Bと、基板1の各ボンディング部位1a、1bに仮圧着されたチップ2およびFPC4のそれぞれを加圧および加熱し、導電材料の重合反応を完了させて硬化させ、各ボンディング部位1a、1bに各実装部材を本圧着する2本1組からなる本圧着ヘッド62A、62Bとを備えている。各本圧着ヘッド62A、62Bのそれぞれの下方にバックアップ63A、63Bが固定設置されている。また、可動テーブル61A、61Bは、導電材料供給ユニット40の可動テーブル41と同様の基板保持ステージ64A、64Bを備えている。さらに、各本圧着ユニット60A、60Bは、本圧着ヘッド62Aでチップ2を、ヘッド62BでFPC4を加圧するときに、基板1に付着された導電材料に含まれる接着剤が各本圧着ヘッド62A、62Bに付着するのを防止するために、フッソ樹脂製の保護テープTを供給する機構をそれぞれのブロック60A、60Bに備えている。保護テープTは、本圧着ユニット60の本体フレームに取り付けられた供給ローラ65A、65Bから繰り出されて、巻き取りローラ66A、66Bに巻き取られる。なお、本実施例では、ブロック60Aでチップ2を本圧着し、その後に基板1をブロック60Bに搬送し、FPC4の本圧着を行なう。   The main crimping unit 60 includes two blocks 60A and 60B. Each of the blocks 60A and 60B includes movable tables 61A and 61B that hold the substrate 1 conveyed from the temporary crimping unit 50 in a horizontal posture, and each bonding portion of the substrate 1. Each of the chip 2 and the FPC 4 temporarily press-bonded to 1a and 1b is pressurized and heated to complete and harden the polymerization reaction of the conductive material, and each mounting member is finally press-bonded to each bonding site 1a and 1b. A pair of main pressure bonding heads 62A and 62B is provided. Backups 63A and 63B are fixedly installed below the main pressure bonding heads 62A and 62B, respectively. The movable tables 61A and 61B include substrate holding stages 64A and 64B similar to the movable table 41 of the conductive material supply unit 40. Furthermore, each press-bonding unit 60A, 60B has an adhesive contained in the conductive material attached to the substrate 1 when the chip 2 is pressed by the main press-bonding head 62A and the FPC 4 is pressed by the head 62B. In order to prevent adhering to 62B, each block 60A, 60B is equipped with the mechanism which supplies the protective tape T made from a fluororesin. The protective tape T is unwound from supply rollers 65A and 65B attached to the main body frame of the main pressure bonding unit 60, and is wound around the winding rollers 66A and 66B. In this embodiment, the chip 2 is finally pressure-bonded in the block 60A, and then the substrate 1 is transported to the block 60B, and the FPC 4 is pressure-bonded.

基板収納ユニット70は、各実装部材の実装された複数枚の基板1を一定間隔で多段に収納する基板収納マガジン71と、この基板収納マガジン71に基板1を順に収納する昇降および水平移動可能な昇降テーブル72とを備えている。この基板収納マガジン71に代えて、基板供給ユニット20で説明したと同様に、トレイ構造の収納構造を備えてもよい。また、基板供給ユニット20と基板収納ユニット70とは必ずしも個別である必要はなく、これらを単一のユニットにして、チップ2が実装された基板1を元の基板供給ユニットに戻すようにしてもよい。   The substrate storage unit 70 is capable of moving up and down and horizontally moving the substrate storage magazine 71 that stores a plurality of substrates 1 mounted with each mounting member in multiple stages at regular intervals, and that sequentially stores the substrates 1 in the substrate storage magazine 71. Elevating table 72 is provided. Instead of the substrate storage magazine 71, a tray structure storage structure may be provided as described in the substrate supply unit 20. Further, the substrate supply unit 20 and the substrate storage unit 70 do not necessarily have to be separate, and they may be made a single unit so that the substrate 1 on which the chip 2 is mounted is returned to the original substrate supply unit. Good.

基板搬送機構80A〜80Dは、装置基台10の長手方向に配設されたレール81と、このレール81に沿って走行する支柱82と、この支柱82に昇降自在に取り付けられて基板1を吸着保持する基板保持具83とを備えている。   The substrate transport mechanisms 80A to 80D are attached to the rail 81 arranged in the longitudinal direction of the apparatus base 10, the support 82 that runs along the rail 81, and the support 82 that can be moved up and down to adsorb the substrate 1. And a substrate holder 83 to be held.

次に上述した構成を備えたボンディングシステムの動作を説明する。図1から図6を参照しながら説明する。   Next, the operation of the bonding system having the above-described configuration will be described. This will be described with reference to FIGS.

基板搬送機構80Aは、基板供給ユニット20から処理対象の基板1を取り出して、この基板1を導電材料供給ユニット40に搬送する。この基板1は可動テーブル41の基板保持ステージ43上に移載されて吸着保持される。基板保持ステージ43が前方(Y方向)に移動して、基板1のボンディング部位をバックアップ44上に載せる。   The substrate transport mechanism 80A takes out the substrate 1 to be processed from the substrate supply unit 20 and transports the substrate 1 to the conductive material supply unit 40. The substrate 1 is transferred onto the substrate holding stage 43 of the movable table 41 and held by suction. The substrate holding stage 43 moves forward (Y direction), and the bonding portion of the substrate 1 is placed on the backup 44.

基板1のチップ2を実装するボンディング部位1aがバックアップ44によって水平に支持された状態で、ヘッド42Aが下降しボンディング部位1a上にチップ2の電極幅に応じた導電材料が転写される。その後、基板1を図中の左水平方向に移動させてFPC4を実装するボンディング部位1bに位置合わせを行ない、ヘッド42Bを降下させてFPC4の電極幅に応じた導電材料をボンディング部位1bに転写する。各ボンディング部位1a、1bへの導電材料の転写が終わると、基板保持ステージ43が基板1の受け渡し位置に水平移動する。受け渡し位置に戻された基板1は基板搬送機構80Bによって、仮圧着ユニット50に搬送される。   In a state where the bonding part 1a for mounting the chip 2 on the substrate 1 is horizontally supported by the backup 44, the head 42A is lowered, and a conductive material corresponding to the electrode width of the chip 2 is transferred onto the bonding part 1a. Thereafter, the substrate 1 is moved in the left horizontal direction in the drawing to align with the bonding part 1b where the FPC 4 is mounted, and the head 42B is lowered to transfer the conductive material corresponding to the electrode width of the FPC 4 to the bonding part 1b. . When the transfer of the conductive material to each bonding site 1a, 1b is completed, the substrate holding stage 43 moves horizontally to the delivery position of the substrate 1. The substrate 1 returned to the delivery position is transported to the temporary pressure bonding unit 50 by the substrate transport mechanism 80B.

仮圧着ユニット50に搬送された基板1は可動テーブル51の基板保持ステージ54上に移載されて吸着保持される。基板保持ステージ54が前方(Y方向)に移動して、先ず基板1のボンディング部位1aをバックアップ55上に位置させる。   The substrate 1 transported to the temporary pressure bonding unit 50 is transferred onto the substrate holding stage 54 of the movable table 51 and held by suction. The substrate holding stage 54 moves forward (Y direction), and the bonding portion 1 a of the substrate 1 is first positioned on the backup 55.

一方、実装部材供給ユニット30では、可動ベース36とがX、Y方向にそれぞれ移動することにより、第1実装部材移送機構31Aがチップトレイ3の所定のチップ2上に移動する。続いて第1実装部材移送機構31Aが下降して、チップトレイ3内のチップ2を第1保持部材6Aで吸着保持する。第1実装部材移送機構31Aが上昇してチップ2をチップトレイ3から取り出した後、可動ベース36とがX、Y方向にそれぞれ移動することにより、第1実装部材移送機構31Aが反転テーブル32上に移動する。このとき反転テーブル32は、チップ載置面が上方を向いた待機姿勢(図2に示す状態)にある。次に第1実装部材移送機構31Aが下降し、第1保持部材6Aで保持していたチップ2を反転テーブル32上に移す。   On the other hand, in the mounting member supply unit 30, the first mounting member transfer mechanism 31 </ b> A moves onto the predetermined chip 2 of the chip tray 3 by moving the movable base 36 in the X and Y directions. Subsequently, the first mounting member transfer mechanism 31A descends, and the chips 2 in the chip tray 3 are sucked and held by the first holding members 6A. After the first mounting member transfer mechanism 31A is lifted and the chip 2 is taken out from the chip tray 3, the first mounting member transfer mechanism 31A moves on the reversing table 32 by moving the movable base 36 in the X and Y directions. Move to. At this time, the reversing table 32 is in a standby posture (state shown in FIG. 2) with the chip placement surface facing upward. Next, the first mounting member transfer mechanism 31 </ b> A descends, and the chip 2 held by the first holding member 6 </ b> A is transferred onto the reversing table 32.

反転テーブル32上にチップ2が載置されて吸着保持されると、軸心P周りに反転し、フェイスアップ状態のチップ2をフェイスダウン状態に姿勢変換する。反転した反転テーブル32の下に実装部材洗浄ブロック38が進入する。   When the chip 2 is placed on the reversing table 32 and sucked and held, the chip 2 is reversed around the axis P and the posture of the chip 2 in the face-up state is changed to the face-down state. The mounting member cleaning block 38 enters under the inverted reversing table 32.

チップ2の洗浄が終わると、スライドテーブル39が移動することにより、実装部材洗浄ブロック38が反転テーブル32の下方位置から退出するとともに、保持テーブル33が反転テーブル32の下方に進入する。続いて反転テーブル32から保持テーブル33へチップ2が受け渡される。反転テーブル32はフェイスダウン状態で受け渡されたチップ2を吸着保持する。チップ2を受け渡した後、反転テーブル32は逆方向に反転して待機姿勢に復帰する。   When the cleaning of the chip 2 is completed, the mounting table cleaning block 38 is retracted from the lower position of the reversing table 32 and the holding table 33 is moved below the reversing table 32 by moving the slide table 39. Subsequently, the chip 2 is delivered from the reverse table 32 to the holding table 33. The reversing table 32 sucks and holds the chip 2 delivered in the face-down state. After delivering the chip 2, the reversing table 32 reverses in the reverse direction and returns to the standby posture.

反転テーブル32が待機姿勢に復帰すると、第1実装部材移送機構31Aが保持テーブル33のチップ2の上方に移動する。   When the reversing table 32 returns to the standby position, the first mounting member transfer mechanism 31A moves above the chip 2 of the holding table 33.

各位置に達した第1実装部材移送機構31Aは下降して、保持テーブル33上のチップ2を吸着部材6Aで吸着保持する。   The first mounting member transfer mechanism 31A that has reached each position descends and holds the chip 2 on the holding table 33 by suction with the suction member 6A.

保持テーブル33上のチップ2をフェイスダウン状態で保持した第1実装装置移送機構31Aは、そのチップ2を移送してカメラ91の上に移送する。カメラ91でチップ2の外形またはアライメントマークを利用して位置を認識する。そして、認識された画像情報に基づいて吸着ヘッドをθ方向に回転したり、可動ベース36をX、Y方向に位置調整したりして、スライダー34に受け渡す。チップ2をフェイスダウン状態で受け取ったスライダー34は仮圧着ユニット50に向けて移動し、そのチップ2を仮圧着ヘッド52の下方にまで移送する。その間、第2実装部材移送機構31Bは、チップ2と同じ手順でFPCトレイ5からFPC4を取り出して処理を行なう。   The first mounting device transfer mechanism 31 </ b> A that holds the chip 2 on the holding table 33 in a face-down state transfers the chip 2 and transfers it onto the camera 91. The camera 91 recognizes the position using the outer shape of the chip 2 or the alignment mark. Then, based on the recognized image information, the suction head is rotated in the θ direction, or the position of the movable base 36 is adjusted in the X and Y directions to be transferred to the slider 34. The slider 34 that has received the chip 2 in the face-down state moves toward the temporary pressure bonding unit 50, and transfers the chip 2 to a position below the temporary pressure bonding head 52. Meanwhile, the second mounting member transfer mechanism 31B takes out the FPC 4 from the FPC tray 5 and performs processing in the same procedure as the chip 2.

制御部90によって電磁弁E2を閉じた状態で電磁弁E1を開放させ、スライダー34で移送されたチップ2を仮圧着ヘッド52の下端の第1吸着部材56Aにより吸着保持させる。続いて、仮圧着ヘッド52と、基板1のボンディング部位1aとの間に2視野の認識手段53が進出してきて、仮圧着ヘッド52の第1吸着部材56Aに吸着保持されたチップ2と基板1との位置ズレを検出するために、それぞれに印字されたアライメントマーク検出する。この位置ズレを無くすように可動テーブル51がX、Yおよびθ方向に制御されて、チップ2と基板1との位置合わせが行われる。   The electromagnetic valve E1 is opened while the electromagnetic valve E2 is closed by the control unit 90, and the chip 2 transferred by the slider 34 is sucked and held by the first suction member 56A at the lower end of the temporary pressure bonding head 52. Subsequently, the recognition means 53 having two fields of view advances between the temporary press-bonding head 52 and the bonding part 1 a of the substrate 1, and the chip 2 and the substrate 1 sucked and held by the first suction member 56 </ b> A of the temporary press-bonding head 52. In order to detect misalignment, the alignment mark printed on each is detected. The movable table 51 is controlled in the X, Y, and θ directions so as to eliminate this positional deviation, and the alignment between the chip 2 and the substrate 1 is performed.

位置合わせが終わると、2視野の認識手段53は元の位置にまで後退する。続いて、仮圧着ヘッド52が下降して、導電材料が転写された基板1のボンディング部位1aにチップ2を仮圧着する。   When the alignment is completed, the two-field recognition means 53 moves back to the original position. Subsequently, the temporary press-bonding head 52 is lowered, and the chip 2 is temporarily press-bonded to the bonding portion 1a of the substrate 1 to which the conductive material is transferred.

チップ2の仮圧着が終わると、制御部90は電磁弁E2を開放して電磁弁E1を閉じ、スライダー34で移送されてきたFPC4を仮圧着ヘッド52の下端の第2吸着部材56Bが吸着保持させる。続いて、仮圧着ヘッド52と、基板1のボンディング部位1bとの間に2視野の認識手段53が進出してきて、仮圧着ヘッド52の第2吸着部材56Bに吸着保持されたFPC4と基板1との位置ズレを検出するために、それぞれに印字されたアライメントマーク検出する。この位置ズレを無くすように可動テーブル51がX、Yおよびθ方向に制御されて、FPC4と基板1との位置合わせが行われる。   When the provisional pressure bonding of the chip 2 is completed, the control unit 90 opens the electromagnetic valve E2 and closes the electromagnetic valve E1, and the second adsorption member 56B at the lower end of the temporary pressure bonding head 52 adsorbs and holds the FPC 4 transferred by the slider 34. Let Subsequently, the recognition means 53 having two fields of view advances between the temporary press-bonding head 52 and the bonding portion 1b of the substrate 1, and the FPC 4 and the substrate 1 which are sucked and held by the second suction member 56B of the temporary press-bonding head 52 In order to detect the positional deviation, the alignment marks printed on each are detected. The movable table 51 is controlled in the X, Y, and θ directions so as to eliminate this positional deviation, and the FPC 4 and the substrate 1 are aligned.

位置合わせが終わると、2視野の認識手段53は元の位置にまで後退する。続いて、仮圧着ヘッド52が下降して、導電材料が転写された基板1のボンディング部位1bにFPC4を仮圧着する。   When the alignment is completed, the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered to temporarily pressure bond the FPC 4 to the bonding portion 1b of the substrate 1 to which the conductive material is transferred.

両実装部材の仮圧着が終了すると、基板保持ステージ54が基板1の受け渡し位置に水平移動する。受け渡し位置に移動した基板1は基板搬送機構80Cによって、先ず本圧着ユニット60Aに搬送される。   When the temporary pressure bonding of both the mounting members is completed, the substrate holding stage 54 moves horizontally to the delivery position of the substrate 1. The substrate 1 moved to the delivery position is first transported to the main pressure bonding unit 60A by the substrate transport mechanism 80C.

本圧着ユニット60Aに搬送された基板1は可動テーブル61Aの基板保持ステージ64A上に移載されて吸着保持される。基板保持ステージ64Aが前方(Y方向)に移動して、基板1のボンディング部位1aをバックアップ63A上に位置させる。ボンディング部位1aがバックアップ63Aで支持されると、本圧着ヘッド62Aが下降して、仮圧着されたチップ2を保護テープTを介して加熱・加圧する。これによりチップ2のバンプが導電材料を介して基板1の電極に電気的に接続する。   The substrate 1 conveyed to the main pressure bonding unit 60A is transferred onto the substrate holding stage 64A of the movable table 61A and is sucked and held. The substrate holding stage 64A moves forward (Y direction), and the bonding portion 1a of the substrate 1 is positioned on the backup 63A. When the bonding part 1a is supported by the backup 63A, the main pressure bonding head 62A is lowered, and the temporarily pressure-bonded chip 2 is heated and pressurized via the protective tape T. As a result, the bumps of the chip 2 are electrically connected to the electrodes of the substrate 1 through the conductive material.

チップ2の本圧着が終わると、基板保持ステージ64Aが基板1の受け渡し位置に水平移動する。受け渡し位置に移動した基板1は基板搬送機構80Cで移送されて本圧着ユニット60Bに搬送される。   When the final pressure bonding of the chip 2 is completed, the substrate holding stage 64A moves horizontally to the transfer position of the substrate 1. The substrate 1 moved to the delivery position is transferred by the substrate transfer mechanism 80C and transferred to the main pressure bonding unit 60B.

本圧着ユニット60Bに搬送された基板1は可動テーブル61Bの基板保持ステージ64B上に移載されて吸着保持される。基板保持ステージ64Bが前方(Y方向)に移動して、基板1のボンディング部位1bをバックアップ63B上に位置させる。ボンディング部位1bがバックアップ63Bで支持されると、本圧着ヘッド62Bが下降して、仮圧着されたFPC4を保護テープTを介して加熱・加圧する。これによりFPC4の電極が導電材料を介して基板1の電極に電気的に接続する。   The substrate 1 transported to the main pressure bonding unit 60B is transferred and held on the substrate holding stage 64B of the movable table 61B. The substrate holding stage 64B moves forward (Y direction), and the bonding portion 1b of the substrate 1 is positioned on the backup 63B. When the bonding part 1b is supported by the backup 63B, the main pressure bonding head 62B is lowered, and the temporarily bonded FPC 4 is heated and pressurized via the protective tape T. Thereby, the electrode of the FPC 4 is electrically connected to the electrode of the substrate 1 through the conductive material.

FPC4の本圧着が終わると、基板保持ステージ64Bが基板1の受け渡し位置に水平移動する。受け渡し位置に移動した基板1は基板搬送機構80Dで移送されて基板収納ユニット70の昇降テーブル72に受け渡され、この昇降テーブル72によって基板収納トレイ71に収納される。   When the final press-bonding of the FPC 4 is completed, the substrate holding stage 64B moves horizontally to the delivery position of the substrate 1. The substrate 1 moved to the delivery position is transferred by the substrate transport mechanism 80D and transferred to the lifting table 72 of the substrate storage unit 70, and is stored in the substrate storage tray 71 by the lifting table 72.

以上で一枚の基板1のチップ実装が終了する。なお、ある基板1が仮圧着ユニット50でチップ2を仮圧着されている間に、導電材料供給ユニット40では次の基板1へ接着剤が転写されている。このように各ユニットでは基板1への接着剤の転写、チップ2またはFPC4の仮圧着、チップ2またはFPC4の本圧着が並行して行われている。また、仮圧着ユニット50から搬送される基板1は、各1組の本圧着ユニット60A、60Bのタクトタイムを調整して基板1の処理が滞ることなくスムーズに処理できるよにしている。   Thus, the chip mounting of one substrate 1 is completed. The adhesive is transferred to the next substrate 1 in the conductive material supply unit 40 while a certain substrate 1 is temporarily crimped to the chip 2 by the temporary crimping unit 50. As described above, in each unit, the transfer of the adhesive to the substrate 1, the temporary pressure bonding of the chip 2 or the FPC 4, and the main pressure bonding of the chip 2 or the FPC 4 are performed in parallel. In addition, the substrate 1 transported from the temporary crimping unit 50 can be processed smoothly without delaying the processing of the substrate 1 by adjusting the tact time of each pair of the final crimping units 60A and 60B.

上述の本実施例に係るボンディング装置を備えたボンディングシステムは、LSIのようなチップ2と、取り扱い時に撓むようなFPC4を単一のボンディング装置でワークである基板1の所定の実装部位に実装することができる。また、この実施例のボンディング装置は、電極のピッチの狭いLSIを高精度で実装が可能であるので、ピッチの狭いFPC4に対しても、高精度な実装が実現できる。さらに、この実施例のボンディングシステムは、チップ2とFPC4の各トレイから1台機構を利用して取り出して仮圧着ユニット50に搬送することができるので、搬送過程での基板1への塵埃の付着を抑制することができる。つまり、処理効率を一層向上させることもできる。   The bonding system including the bonding apparatus according to the above-described embodiment mounts the chip 2 such as an LSI and the FPC 4 that bends during handling on a predetermined mounting portion of the substrate 1 as a workpiece with a single bonding apparatus. be able to. In addition, since the bonding apparatus according to this embodiment can mount an LSI with a narrow electrode pitch with high accuracy, it can realize high-accuracy mounting even for an FPC 4 with a narrow pitch. Furthermore, since the bonding system of this embodiment can be taken out from each tray of the chip 2 and the FPC 4 using a single mechanism and transported to the temporary press-bonding unit 50, dust adheres to the substrate 1 during the transporting process. Can be suppressed. That is, the processing efficiency can be further improved.

本実施例では、仮圧着ヘッド52の構成のみが上記実施例1と異なるので、他の同じ構成部分には同一符号を付すに留め、異なる部分について具体的に説明する。   In the present embodiment, only the configuration of the provisional pressure bonding head 52 is different from that of the first embodiment. Therefore, the same reference numerals are given to other same components, and different portions will be specifically described.

仮圧着ヘッド52は、その下端に第1保持部材56Cと、第2保持部材56Dとを備えている。第1保持部材56Cは、仮圧着ヘッド5を昇降させる軸芯に、その中央が位置するように仮圧着ヘッド52に取り付けられている。また、図7に示すように、第1保持部材56Cは、チップ2よりも大きく、かつ、FPC4を基板1に実装するボンディング部位1bの全面を少なくとも覆う程度の大きさを有する横長矩形状をしている。また、第1保持部材56Cの下面には、実装部材を吸着する複数個の吸着孔57C、57Dが形成されている。   The temporary press-bonding head 52 includes a first holding member 56C and a second holding member 56D at the lower end thereof. 56 C of 1st holding members are attached to the temporary crimping head 52 so that the center may be located in the axial center which raises / lowers the temporary crimping head 5. Further, as shown in FIG. 7, the first holding member 56 </ b> C has a horizontally long rectangular shape that is larger than the chip 2 and has a size that covers at least the entire surface of the bonding portion 1 b that mounts the FPC 4 on the substrate 1. ing. A plurality of suction holes 57C and 57D for sucking the mounting member are formed on the lower surface of the first holding member 56C.

吸着孔57Cは、チップ2の長手方向の中央を吸着する位置に形成されている。また吸着孔57Dは、FPC4の長手方向の両端側または/および中央を吸着する位置に形成されている。   The suction hole 57 </ b> C is formed at a position that sucks the center in the longitudinal direction of the chip 2. Further, the suction holes 57D are formed at positions for sucking both ends or / and the center of the FPC 4 in the longitudinal direction.

第2保持部材56Dは、第1保持部材56CによってFPC4を吸着保持した場合に、第1保持部材56Cによって保持しきれない第1保持部材56Cからはみ出た部分を吸着保持するように同じ仮圧着ヘッド52に近接配置されている。その形状は、第1保持部材56Cからはみ出た部分の全面を覆う形状をしている。また、第2保持部材56Dの下面には複数個の吸着孔57Eが形成されている。これら吸着孔57Eは、FPC4の角部の近傍を吸着する位置にある。   When the FPC 4 is sucked and held by the first holding member 56C, the second holding member 56D has the same temporary pressure-bonding head so as to suck and hold the portion protruding from the first holding member 56C that cannot be held by the first holding member 56C. 52. The shape covers the entire surface of the portion protruding from the first holding member 56C. A plurality of suction holes 57E are formed on the lower surface of the second holding member 56D. These suction holes 57E are at positions for sucking the vicinity of the corners of the FPC 4.

第1および第2保持部材56C、56Dは、図6に示すように、吸気管58を介して減圧ポンプ59と連通接続されている。この吸気管58は、減圧ポンプ59側の上流で、図示しないが3方向に分岐され、各吸気管に電磁弁を備えている。具体的には、第1保持部材56Cに2本の吸気管が連通接続され、第2保持部材56Dに1本の吸気管が連通接続されている。   As shown in FIG. 6, the first and second holding members 56 </ b> C and 56 </ b> D are connected to a decompression pump 59 through an intake pipe 58. The intake pipe 58 is branched in three directions (not shown) upstream of the decompression pump 59 side, and each intake pipe is provided with an electromagnetic valve. Specifically, two intake pipes are connected in communication with the first holding member 56C, and one intake pipe is connected in communication with the second holding member 56D.

第1保持部材56Cに連通接続された2本の吸気管のうち1本が、吸着孔57Cと連通され、他方の吸気管は吸着孔57Dと連通している。   One of the two intake pipes connected to the first holding member 56C is in communication with the suction hole 57C, and the other intake pipe is in communication with the suction hole 57D.

制御部90は、実装部材に応じて各吸着孔56C〜56Eの吸着を作動させるように3ポート弁の開閉動作を制御する。例えば、チップ2を実装する場合は、吸着孔57Cを作動させるように1個の電磁弁を開放する。FPC4を実装する場合は、吸着孔56D、56Eを作動させるように2個の電磁弁を開放する。   The controller 90 controls the opening / closing operation of the three-port valve so as to operate the suction of the suction holes 56C to 56E according to the mounting member. For example, when the chip 2 is mounted, one electromagnetic valve is opened so as to operate the suction hole 57C. When the FPC 4 is mounted, the two solenoid valves are opened so as to operate the suction holes 56D and 56E.

上述の本実施例に係るボンディング装置によれば、吸着孔57Cおよび57Dの作動を切り換えることによって、チップ2およびFPC4の両方のボンディング部位を第1保持部材56Cで吸着保持することができる。特に、第1保持部材56Cの中心は、仮圧着ヘッド52を昇降軸芯と一致しているので、実装時の加圧力を効率的に加えることができる。また、FPC4を実装する場合は、第1保持部材56Cからはみ出る部分は、第2保持部材56Dによって、その全面を吸着保持することができるので、FPC4を撓ました状態で取り扱うことがない。つまり、本実施例のボンディング装置は、異なる実装部材であるチップ2とFPC4を高精度に実装することができる。   According to the above-described bonding apparatus according to the present embodiment, by switching the operation of the suction holes 57C and 57D, both the bonding parts of the chip 2 and the FPC 4 can be sucked and held by the first holding member 56C. In particular, since the center of the first holding member 56C coincides with the temporary crimping head 52 with the lifting / lowering shaft core, it is possible to efficiently apply a pressing force during mounting. When the FPC 4 is mounted, the portion protruding from the first holding member 56C can be sucked and held by the second holding member 56D, so that the FPC 4 is not handled in a bent state. That is, the bonding apparatus of the present embodiment can mount the chip 2 and the FPC 4 which are different mounting members with high accuracy.

なお、本発明は上述した実施例に限らず、次のように変形実施することができる。   The present invention is not limited to the above-described embodiment, and can be modified as follows.

(1)上記実施例1において、仮圧着ユニット50の第1保持部材56A、56Bのいずれかが実装部材を吸着保持したときに、保持した側の保持部材が降下、または、保持していない側の保持部材が上昇するように構成してもよい。例えば、図8に示すよう、仮圧着ヘッド52の昇降軸芯に平行に配備されたパルスモータMに連結されたボール軸Bに可動台100を介して第2保持部材56Bを取り付ける。このように構成すれば、パルスモータMの正逆転により第2保持部材58Bを昇降させることができる。したがって、この構成によれば、チップ2を実装するときに、チップ2の近隣に在る部材と、第2保持部材56Bとが接触したりして、他の部材に損傷与えないようにすることができる。   (1) In the first embodiment, when one of the first holding members 56A and 56B of the temporary pressure bonding unit 50 holds the mounting member by suction, the holding member on the holding side descends or does not hold it. You may comprise so that this holding member may raise. For example, as shown in FIG. 8, the second holding member 56 </ b> B is attached to the ball shaft B connected to the pulse motor M arranged in parallel with the lifting axis of the temporary crimping head 52 via the movable table 100. If comprised in this way, the 2nd holding member 58B can be raised / lowered by forward / reverse rotation of the pulse motor M. Therefore, according to this configuration, when the chip 2 is mounted, the member in the vicinity of the chip 2 and the second holding member 56B are in contact with each other so that other members are not damaged. Can do.

実施例2のボンディング装置の場合、チップ2を保持した場合に、第1保持部材56Cを降下させるか、第2保持部材56Dを上昇させるように構成すればよい。   In the case of the bonding apparatus according to the second embodiment, when the chip 2 is held, the first holding member 56C may be lowered or the second holding member 56D may be raised.

また、実施例1のボンディング装置を利用してチップ2とFPC4を各保持部材56A、56Bで同時に吸着保持して基板1に同時に実装する場合、仮圧着ヘッド52の降下する距離を一定で、基板1にチップ2およびFPC4が実装される高さに同時に到達するよう、第1保持部材56Cおよび第2保持部材56Dの高さ方向の相対距離を調整すればよい。   Further, when the chip 2 and the FPC 4 are simultaneously sucked and held by the holding members 56A and 56B using the bonding apparatus of the first embodiment and are simultaneously mounted on the substrate 1, the distance by which the temporary press-fitting head 52 descends is constant, The relative distance in the height direction of the first holding member 56C and the second holding member 56D may be adjusted so that the height at which the chip 2 and the FPC 4 are mounted on 1 is reached at the same time.

また、実施例2のボンディング装置の場合、第1保持部材56Cの中心と軸心が一致しなくてもよい。ワーク形状により、第1保持部材56Cの形状が変わり、結果として、軸心と第1保持部材56Cの下面形状の中心が合わなくてもよい。   In the case of the bonding apparatus according to the second embodiment, the center of the first holding member 56C and the axis need not coincide with each other. The shape of the first holding member 56C changes depending on the work shape, and as a result, the center of the shaft center and the lower surface shape of the first holding member 56C may not match.

(2)チップ2の洗浄効果を高めるために、上記実施例のようにエアーに超音波を付与するのが好ましいが、必ずしも超音波を付与しなくてもよい。   (2) In order to enhance the cleaning effect of the chip 2, it is preferable to apply ultrasonic waves to the air as in the above embodiment, but it is not always necessary to apply ultrasonic waves.

(3)上記実施例では、第1および第2のチップ移送機構31A、31Bが一体になって移動するように構成したが、各チップ移送機構が個別に移動するように構成してもよい。   (3) In the above embodiment, the first and second chip transfer mechanisms 31A and 31B are configured to move together, but each chip transfer mechanism may be configured to move individually.

(4)上記実施例では処理効率を上げるために圧着ユニットを仮圧着ユニット50と本圧着ユニット60との2つのユニットに分割したが、チップ2の位置合わせと電気的接続とを一つの圧着ユニットで行なうようにしてもよい。   (4) In the above embodiment, the crimping unit is divided into two units, the temporary crimping unit 50 and the main crimping unit 60, in order to increase the processing efficiency. However, the positioning and electrical connection of the chip 2 are combined into one crimping unit. You may make it carry out.

(5)本発明において各ユニットおよび基板搬送機構の配置や構成は上記実施例のものに限定されず、種々変更実施可能である。例えば、複数個の基板保持具を備えた基板搬送機構をZ軸周りに回転可能に構成し、この基板搬送機構の周りに、基板供給ユニット、実装部材供給ユニット、接着剤付着ユニット、仮圧着ユニット、本圧着ユニット、および基板収納ユニットを順に配置する、例えば、ロータリー式であってもよい。   (5) In the present invention, the arrangement and configuration of each unit and substrate transport mechanism are not limited to those of the above-described embodiments, and various modifications can be made. For example, a substrate transport mechanism having a plurality of substrate holders is configured to be rotatable around the Z axis, and a substrate supply unit, a mounting member supply unit, an adhesive adhesion unit, a temporary pressure bonding unit are provided around the substrate transport mechanism. For example, a rotary type may be used in which the main pressure bonding unit and the substrate storage unit are arranged in this order.

(6)本発明に係るチップ実装装置は、チップ搭載のための単なるマウント装置や、加熱加圧プロセスを有したボンディング装置など、種々の形態のものを含む。   (6) The chip mounting apparatus according to the present invention includes various forms such as a simple mounting apparatus for chip mounting and a bonding apparatus having a heating and pressing process.

(7)実施例では、チップ2をフェイスアップ状態でチップトレイに収納したが、本発明はこれに限らず、ウエハをダイシングした状態で、かつフェイスアップで供給してもよい。   (7) In the embodiment, the chip 2 is stored in the chip tray in a face-up state. However, the present invention is not limited to this, and the wafer may be diced and supplied in a face-up state.

(8)各実施例において、実装部材供給ユニット30の第1実装部材移送機構31Aおよび第2実装部材移送機構31Bのそれぞれの吸着部材を、仮圧着ヘッドに備わった第1保持部材56Aおよび第2保持部材56Bのように実装部材に応じて形状のものを個別に利用するようにしてもよい。   (8) In each embodiment, the first holding member 56A and the second holding member 56A provided in the temporary pressure-bonding head are used as the first mounting member transfer mechanism 31A and the second mounting member transfer mechanism 31B of the mounting member supply unit 30, respectively. You may make it utilize the thing of a shape according to a mounting member like the holding member 56B separately.

(9)実施例において、チップ2およびFPC4の電極が予め下向きのフェイスダウンの状態でそれぞれのトレイ3、5にセットされている場合は、反転機構が設けられていない構成にしてもよい。   (9) In the embodiment, when the electrodes of the chip 2 and the FPC 4 are set in advance on the respective trays 3 and 5 in a face-down state facing downward, the reversing mechanism may not be provided.

(10)実施例において、実装部材供給ユニットに洗浄ブロック38を設けない構成であってもよい。   (10) In the embodiment, the mounting member supply unit may not be provided with the cleaning block 38.

(11)実施例において、本圧着ユニット60の一方のブロック60Aに備わった本圧着ヘッド62AでFPC4を本圧着し、他方のブロック60Bに備わった本圧着ヘッド62Bでチップ2を本圧着するようにしてもよい。また、ブロック60A、60Bごとに、チップ2とFPC4を同時に本圧着してもよいし、ブロック60A、60Bごとにチップ2とFPC4を順番に本圧着するようにしてもよい。   (11) In the embodiment, the FPC 4 is finally pressure-bonded by the main pressure-bonding head 62A provided in one block 60A of the main pressure-bonding unit 60, and the chip 2 is finally pressure-bonded by the main pressure-bonding head 62B provided in the other block 60B. May be. Further, the chip 2 and the FPC 4 may be finally pressure-bonded simultaneously for each of the blocks 60A and 60B, or the chip 2 and the FPC 4 may be finally pressure-bonded in order for each of the blocks 60A and 60B.

(12)実施例2では、FPC4を実装する場合に吸着孔56D、56Eを作動させるように2個の電磁弁を開放していたが、いずれか一方の電磁弁を作動させるようにしてもよい。   (12) In the second embodiment, when the FPC 4 is mounted, the two solenoid valves are opened so that the suction holes 56D and 56E are actuated. However, either one of the solenoid valves may be actuated. .

(13)実施例1では、第1実装部材移送機構31Aに備わった吸着ヘッド6Aおよび第2実装部材移送機構31Bに備わった吸着ヘッド6Bは、それぞれがチップ2およびFPC4の全面を覆う形状であったが、次のような形状であってもよい。例えば、吸着ヘッド6Aは、チップ2の中央部分を吸着保持できる形状、吸着ヘッド6Bは、FPC4の角部を含むその周り、または、角部と中央部分を覆うような形状であってもよい。   (13) In the first embodiment, the suction head 6A provided in the first mounting member transfer mechanism 31A and the suction head 6B provided in the second mounting member transfer mechanism 31B each have a shape that covers the entire surface of the chip 2 and the FPC 4. However, it may have the following shape. For example, the suction head 6A may have a shape capable of sucking and holding the central portion of the chip 2, and the suction head 6B may have a shape surrounding the corner including the corner of the FPC 4 or covering the corner and the central portion.

以上のように、本発明は、電子部品などのチップ部品やフィルム状の回路基板などを、ガラスや樹脂の基板などからなるワークに実装するのに適している。   As described above, the present invention is suitable for mounting a chip component such as an electronic component or a film-like circuit board on a workpiece made of a glass or resin substrate.

Claims (15)

ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、
前記ワークを載置保持する第1保持テーブルと、
前記実装部材であるチップ部品を保持する第1保持手段と、
前記実装部材であるフィルム状またはシート状の基板を保持する第2保持手段と、
前記第1保持手段と第2保持手段を取り付ける仮圧着ヘッドと、
前記第1保持テーブルの載置保持されたワークに前記各実装部材を実装するとき、前記第1保持手段と第2保持手段による各実装部材の保持タイミングを制御するタイミング制御手段と、
前記第1保持テーブルとヘッドとを相対的に昇降移動させる第1駆動手段と、
前記第1駆動手段を作動させて前記第1保持テーブルと仮圧着ヘッドとを相対的に昇降移動させ、前記第1または第2保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱してワークに仮圧着する加熱手段と、
を備えたことを特徴とするボンディング装置。
A bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material,
A first holding table for placing and holding the workpiece;
First holding means for holding a chip component which is the mounting member;
Second holding means for holding a film-like or sheet-like substrate as the mounting member;
A temporary crimping head for attaching the first holding means and the second holding means;
Timing control means for controlling the holding timing of each mounting member by the first holding means and the second holding means when mounting each mounting member on the work placed and held on the first holding table;
First driving means for moving the first holding table and the head relatively up and down;
A state in which the first driving means is operated to move the first holding table and the temporary pressure-bonding head relatively up and down and the mounting member held by the first or second holding means is pressed against the workpiece. Heating means for heating the conductive bonding material and temporarily pressing the workpiece to the workpiece ;
A bonding apparatus comprising:
請求項1に記載のボンディング装置において、
前記第1保持手段は、チップ部品の中央または/および幅方向に均等に吸着保持し、
前記第2保持手段は、前記基板の複数の角部近傍を吸着保持する
ことを特徴とするボンディング装置。
The bonding apparatus according to claim 1,
The first holding means is uniformly sucked and held in the center or / and the width direction of the chip component,
The bonding apparatus, wherein the second holding unit sucks and holds the vicinity of a plurality of corners of the substrate.
請求項1に記載のボンディング装置おいて、
前記第1保持手段または第2保持手段の少なくともともいずれかを昇降させる第2駆動手段と、
前記第1保持手段および第2保持手段に保持される両実装部材の厚みの差に応じて、前記第2駆動手段の作動制御する駆動制御手段と、
を備えたことを特徴とするボンディング装置。
In the bonding apparatus according to claim 1,
Second driving means for moving up and down at least one of the first holding means and the second holding means;
Drive control means for controlling the operation of the second drive means according to a difference in thickness between the mounting members held by the first holding means and the second holding means;
A bonding apparatus comprising:
請求項3に記載のボンディング装置おいて、
前記駆動制御手段は、前記第1保持手段および第2保持手段の両方が実装部材を保持した状態で第2駆動手段を作動制御し、両保持手段が実装部材を同時に前記ワークに実装するように構成した
ことを特徴とするボンディング装置。
In the bonding apparatus according to claim 3,
The drive control means controls the operation of the second drive means in a state where both the first holding means and the second holding means hold the mounting member, and both the holding means simultaneously mount the mounting member on the workpiece. A bonding apparatus characterized by comprising.
請求項1に記載のボンディング装置を備えたボンディングシステムにおいて、
前記ワークを載置保持する第2保持テーブルと、
前記第2保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料供給手段と、
異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第1ワーク搬送手段と、
前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、
前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をワークに固着させる加熱圧着手段と、
前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送する第2ワーク搬送手段と、 を備えたことを特徴とするボンディングシステム。
In the bonding system provided with the bonding apparatus according to claim 1,
A second holding table for placing and holding the workpiece;
A plurality of conductive material supply means for supplying an anisotropic conductive film having a width corresponding to a mounting member to a predetermined portion of the work placed and held on the second holding table;
A first workpiece transfer means for transferring the workpiece supplied with the anisotropic conductive film to a bonding apparatus;
Mounting member transport means for transporting the mounting member to the bonding apparatus;
The anisotropic conductive film supplied to the workpiece by the bonding apparatus is heated, the polymerization reaction proceeds halfway and the mounting member is mounted on the workpiece in an uncured state, and then the anisotropic conductive film of the workpiece is Further heating and pressure bonding means for terminating the polymerization reaction and fixing the mounting member to the workpiece,
And a second work transporting means for transporting a work mounted with a mounting member by the bonding apparatus to the thermocompression bonding means.
請求項5に記載のボンディングシステムにおいて、
前記チップ部品およびフィルム状またはシート状の両実装部材を洗浄する洗浄手段を備えた
ことを特徴とするボンディングシステム。
The bonding system according to claim 5,
A bonding system comprising a cleaning means for cleaning both the chip component and the film or sheet mounting member.
請求項6に記載のボンディングシステムにおいて、
前記洗浄手段は、気体または超音波を付与した気体を実装部材に吹き付ける
ことを特徴とするボンディングシステム。
The bonding system according to claim 6, wherein
The said cleaning means sprays the gas which provided gas or the ultrasonic wave on a mounting member. The bonding system characterized by the above-mentioned.
ワークに導電性接合材料を介して実装部材を実装するボンディング装置であって、
前記ワークを載置保持する第1保持テーブルと、
前記実装部材であるフィルム状またはシート状の基板およびチップ部品の両実装部材の実装部位を吸着保持する複数個の吸着孔の形成された保持手段と、
前記保持手段を取り付ける仮圧着ヘッドと、
前記保持手段に保持する実装部材の形状に応じて、当該保持手段に形成された複数個の吸着孔の吸着作動を切換制御する制御手段と、
前記第1保持テーブルとヘッドとを相対的に昇降移動させる第1駆動手段と、
前記第1駆動手段を作動させて前記第1保持テーブルと仮圧着ヘッドとを相対的に昇降移動させ、前記保持手段に保持された実装部材を前記ワークに押圧されている状態の前記導電性接合材料を加熱して仮圧着する加熱手段と、
を備えたことを特徴とするボンディング装置。
A bonding apparatus for mounting a mounting member on a workpiece via a conductive bonding material,
A first holding table for placing and holding the workpiece;
A holding means having a plurality of suction holes for sucking and holding the mounting parts of both the mounting member of the film-like or sheet-like substrate and chip component as the mounting member;
A temporary crimping head for attaching the holding means;
Control means for switching and controlling the suction operation of a plurality of suction holes formed in the holding means according to the shape of the mounting member held by the holding means;
First driving means for moving the first holding table and the head relatively up and down;
The conductive bonding in a state where the first driving means is operated to move the first holding table and the temporary press-bonding head relatively up and down and the mounting member held by the holding means is pressed against the workpiece. A heating means for heating and temporarily pressing the material;
A bonding apparatus comprising:
請求項8に記載にボンディング装置において、
前記保持手段によって前記基板を吸着保持したときに、前記保持手段からはみ出る部位を吸着保持する支持手段を備えた
ことを特徴とするボンディング装置。
In the bonding apparatus according to claim 8,
A bonding apparatus comprising: a supporting unit that sucks and holds a portion protruding from the holding unit when the substrate is sucked and held by the holding unit.
請求項9に記載にボンディング装置において、
前記支持手段は、前記基板の複数の角部近傍を吸着保持する
ことを特徴とするボンディング装置。
In the bonding apparatus according to claim 9,
The bonding device is characterized in that the supporting means sucks and holds the vicinity of a plurality of corners of the substrate.
請求項9に記載にボンディング装置において、
前記保持手段または前記支持手段の少なくともともいずれかを昇降させる第2駆動手段と、
前記保持手段および支持手段に保持される両実装部材の厚みの差に応じて、前記第2駆動手段の作動制御する駆動制御手段と、
を備えたことを特徴とするボンディング装置。
In the bonding apparatus according to claim 9,
Second driving means for raising and lowering at least one of the holding means and the support means;
Drive control means for controlling the operation of the second drive means according to the difference in thickness between the mounting members held by the holding means and the support means;
A bonding apparatus comprising:
請求項11に記載のボンディング装置おいて、
前記駆動制御手段は、前記保持手段および支持手段の両方が実装部材を保持した状態で第2駆動手段を作動制御し、保持手段が両実装部材を同時に前記ワークに実装するように構成した
ことを特徴とするボンディング装置。
The bonding apparatus according to claim 11,
The drive control means is configured to control the operation of the second drive means in a state where both the holding means and the support means hold the mounting member, and the holding means simultaneously mounts both the mounting members on the workpiece. A characteristic bonding apparatus.
請求項8に記載のボンディング装置を備えたボンディングシステムにおいて、
前記ワークを載置保持する第2保持テーブルと、
前記第2保持テーブルに載置保持されたワークの所定部分に実装部材に応じた幅の異方導電性フィルムを供給する複数の導電材料供給手段と、
異方導電性フィルムの供給された前記ワークをボンディング装置に搬送する第1ワーク搬送手段と、
前記ボンディング装置に実装部材を搬送する実装部材搬送手段と、
前記ボンディング装置によりワークに供給された異方導電性フィルムを加熱し、重合反応を途中まで進行させて未硬化状態で実装部材をワークに実装させた後、当該ワークの異方導電性フィルムを、さらに加熱して重合反応を終了させて実装部材をワークに固着させる加熱圧着手段と、
前記ボンディング装置で実装部材の実装されたワークを前記加熱圧着手段に搬送する第2ワーク搬送手段と、 を備えたことを特徴とするボンディングシステム。
In the bonding system provided with the bonding apparatus according to claim 8,
A second holding table for placing and holding the workpiece;
A plurality of conductive material supply means for supplying an anisotropic conductive film having a width corresponding to a mounting member to a predetermined portion of the work placed and held on the second holding table;
A first workpiece transfer means for transferring the workpiece supplied with the anisotropic conductive film to a bonding apparatus;
Mounting member transport means for transporting the mounting member to the bonding apparatus;
The anisotropic conductive film supplied to the workpiece by the bonding apparatus is heated, the polymerization reaction proceeds halfway and the mounting member is mounted on the workpiece in an uncured state, and then the anisotropic conductive film of the workpiece is Further heating and pressure bonding means for terminating the polymerization reaction and fixing the mounting member to the workpiece,
And a second work transporting means for transporting a work mounted with a mounting member by the bonding apparatus to the thermocompression bonding means.
請求項13に記載のボンディングシステムにおいて、
前記チップ部品およびフィルム状またはシート状の両実装部材を洗浄する洗浄手段を備えた
ことを特徴とするボンディングシステム。
The bonding system according to claim 13,
A bonding system comprising a cleaning means for cleaning both the chip component and the film or sheet mounting member.
請求項14に記載のボンディングシステムにおいて、
前記洗浄手段は、気体または超音波を付与した気体を実装部材に吹き付ける
ことを特徴とするボンディングシステム。
The bonding system according to claim 14, wherein
The said cleaning means sprays the gas which provided gas or the ultrasonic wave on a mounting member. The bonding system characterized by the above-mentioned.
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