JP2002302248A - Substrate reversing device, and panel manufacturing device using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase yield of a process of part mounting on both faces of a substrate, by stabilizing reversing operation of the substrate with one side face previously connected with a part. SOLUTION: The substrate 1 mounting the part 2 is clamped by a pair of holding plates 71, 72. A pair of holding plates 31, 32 press and hold the pair of holding plates 71, 72. The pair of the holding mechanism 31, 32 clamping the substrate 1 through the pair of holding plates 71, 72 rotationally drive a motor 10a, and transfer the substrate 1 reversed by 180 deg.. Thus, the substrate mounting the part 2 is pressed and held from both surfaces by the pair of the holding plates 71, 72 to be reversed, whereby the fluttering or the like and breakage of the substrate 1 and the part 2 are largely reduced, thereby enable mounting of the part with high quality.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate reversing device suitable for assembling and manufacturing, for example, a liquid crystal panel or a plasma display panel, and to an improvement in a panel manufacturing device using the same.

[0002]

2. Description of the Related Art In a flat display such as a liquid crystal display panel or a plasma display panel, a TCP (Tape Carrier Packa) is formed on an electrode portion of a glass substrate.
ge) and the like, and are connected and mounted. As an apparatus for manufacturing such a flat panel display, a panel manufacturing apparatus is known.

[0003] Among flat panel displays, a simple matrix type liquid crystal display panel is configured so that a liquid crystal layer is sandwiched between two rectangular glass substrates. The two substrates are formed so as to be orthogonal to each other on opposing surfaces of two opposing substrates. As described above, since the electrode portions of the two substrates are provided to face each other, it is necessary to once turn the substrates by 180 degrees in order to connect electronic components to the individual substrates. Therefore, the panel manufacturing apparatus is provided with a substrate reversing device.

FIG. 13 is a perspective view showing a schematic structure of a conventional substrate reversing device for reversing a two-layer substrate, and FIG. 14 is a side view of a main part thereof. An electronic component is connected in advance to an electrode portion of one of the substrates via a connection member such as an anisotropic conductor.

That is, as shown in FIG. 13, one of the two substrates 1 (1A, 1B) bonded to each other (the lower part in the figure) has an electrode portion on the electrode portion of an electronic component 2 as a connection component. As shown in FIG. 14, the substrate 1 is sandwiched from above and below both outer surfaces by a U-shaped grip portion 3 of the substrate reversing device and is pressed and held.

The grip 3 is connected to a reversing mechanism 4,
The grip part 3 is configured to be able to reciprocate 180 degrees in the direction of arrow R by driving a motor built in the reversing mechanism 4.
The substrate 1 is turned 180 degrees and delivered to the next component mounting apparatus.

In FIG. 13, the reversing mechanism 4 is connected to a moving mechanism 5 such as a cylinder, so that the reversing operation of the rectangular substrate 1 in the substrate reversing device can be performed smoothly without coming into contact with the surrounding mechanisms. Is required. Therefore, the moving mechanism 5 connects the reversing mechanism 4 to the pair of guide rails 6.
While being guided by 1, 62, it is configured to move upward in the direction of arrow Z and turn over the substrate 1 in a state where the rotation space of the substrate 1 is secured.

Further, in FIGS. 13 and 14, the details of the gripping portion 3 are not shown, but the gripping portion 3 has a cylinder mechanism and a spring mechanism. The side is pressed and held or released, so that the substrate 1 can be received from the previous process and can be delivered to the next process after the reversal.

With the substrate reversing device having the above structure,
The substrate 1 is inverted, and as shown in FIG.
In the next step of receiving the inverted substrate 1 in which the electrode portion of (1B) is exposed upward, the electronic component 2 is similarly mounted on the electrode portion via an anisotropic conductor.

[0010]

As described above, in the conventional board reversing apparatus, the reversing operation is performed while holding the board 1 on which the electronic component 2 is mounted on one of the boards (1A) in advance by the holding section 3. It is configured as follows.

Meanwhile, flat panel displays such as recent liquid crystal display panels and plasma display panels tend to become larger and larger, and the substrates themselves also take up a considerable weight with the increase in size. I have. In addition, the increase in the size of the substrate has led to an increase in the capacity and functionality of the electronic components 2 connected and mounted on the electrode portions of the substrate 1, and the components mounted and connected are not limited to semiconductor chips such as LSIs, but also to heat sinks and printing. Additional connection of a wiring board or the like has also been performed.

As a result, in the reversing operation in the substrate reversing device, parts and the like connected to the electrode portion far from the rotation center axis have a large inertial stress (or moment) at the time of reversal, which causes a large bending stress on the substrate. This is one of the factors that cause the substrate made of glass or the like to bend and break.

In particular, when the electronic component 2 is an FPC (Flexible
e Printed Circuit) or COF (Ch
In the case of (ip On Film), the film portion, which is the main portion, is originally easily bent, and the connecting component fluctuates due to the rotation reversal operation. There has been a risk of causing problems such as breakage of the substrate and the like, and there has been a fear that the connection portion may be peeled off due to centrifugal force. Therefore, improvement has been demanded.

Accordingly, the present invention provides a highly reliable substrate reversing apparatus and a panel manufacturing apparatus using the same, which avoids damage to a substrate and mounted components, and also avoids damage to component connection portions and the like. The purpose is to:

[0015]

According to a first aspect of the present invention, in a board reversing device, a pair of holding plates for holding a board on which components are mounted from both sides and a grip for holding the pair of holding plates while pressing the pair from the outside. And a reversing mechanism for reversing the substrate by rotating the gripping portion.

As described above, according to the first aspect, the reversing mechanism reverses the substrate on which the components are mounted by sandwiching the substrate between the pair of holding plates. Therefore, while the components and the substrate are protected by the holding plate, the fluttering and the like are greatly suppressed, and a substrate reversing device that avoids damage to the substrate and the components can be provided.

According to a second aspect of the present invention, there is provided a board reversing device for reversing a board mounted with parts protruding from an outer peripheral portion, wherein a holding member for holding the board, a supporting member for supporting the parts, A rotation mechanism configured to rotate the holding member and the support member around a straight line parallel to the surface of the substrate as a common rotation center axis.

As described above, according to the second aspect, the rotating mechanism reverses the holding member for holding the substrate and the supporting member for supporting the components. Therefore, the component and the substrate are protected by the holding member and the support member, and the fluttering and the like are greatly suppressed, so that it is possible to provide a substrate reversing device in which the substrate and the component are prevented from being damaged.

A third invention relates to a panel manufacturing apparatus,
It is characterized in that the substrate reversing device according to the first or second invention is used.

As described above, according to the third aspect, in the panel manufacturing apparatus, since the first or second substrate reversing device is employed, it is possible to prevent the substrate and components from being damaged when the substrate is reversed. This makes it possible to assemble and manufacture a highly reliable liquid crystal panel or the like with a high yield.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a substrate reversing apparatus and a panel manufacturing apparatus using the same according to the present invention will be described below in detail with reference to FIGS. The same components as those of the conventional substrate reversing device shown in FIGS. 13 to 15 are denoted by the same reference numerals, and detailed description is omitted.

FIG. 1 is a layout diagram of a panel manufacturing apparatus using a substrate reversing apparatus according to the present invention.

In FIG. 1, the panel manufacturing apparatus 20
Is used for manufacturing a flat panel display such as a liquid crystal panel or a plasma display panel, and is provided with a substrate supply device 21, a first substrate cleaning device 22a, and a first connecting member attaching device for providing the substrate 1 described in FIG. 23a, a first electronic component mounting device 24a, a substrate reversing device 25, a second substrate cleaning device 22b, a second connecting member attaching device 23b, a second electronic component mounting device 24b, and a substrate housing device 26. .

The substrate supply device 21 takes out the substrates 1 housed in a magazine or the like and supplies them one by one. The substrate 1 supplied by the substrate supply device 21 is transported to a first substrate cleaning device 22a by a transport device (not shown).

The first substrate cleaning device 22a is provided on the side of the substrate 1 to which the electronic component 2 is connected, as described with reference to FIG. 13, of the two substrates 1 (1A, 1B) bonded together. The edge of the substrate 1A where the portion is exposed upward is formed by cleaning the edge of the substrate 1A where the electrode is formed, using a solvent to remove dirt from the electrode. The substrate 1 that has been cleaned is transported to a first connection member attaching device 23a by a transport device (not shown).

The first connecting member sticking device 23a sticks a connecting member such as an anisotropic conductor to the edge portion cleaned by the first substrate cleaning device 22a. The substrate 1 to which the connecting member is attached is transported to the first electronic component mounting device 24a by a transport device (not shown).

The first electronic component mounting device 24a is connected to the first connecting member attaching device 23a through the connecting member attached by the first connecting member attaching device 23a.
The electrode section of the substrate 1A is connected to the electrode section of the electronic component 2. Electronic component 2 by the first electronic component mounting apparatus 24a
The substrate 1 on which is mounted is transported to the substrate reversing device 25 by a transport device (not shown).

As will be described in detail later, the substrate reversing device 25 reverses the substrate 1 in which the electronic parts 2 are connected to the electrode portions of the substrate 1A, and turns the electrode portion of the substrate 1B, which has been facing downward, upward. Is to be exposed. The inverted substrate 1 is transported to a second substrate cleaning device 22b by a transport device (not shown).

Thereafter, the same operation as described above is performed on the electrode portion of the substrate 1B exposed upward by the second substrate cleaning device 22b, the second connecting member attaching device 23b, and the second electronic component mounting device 24b. carry out. The substrate 1 in which the electronic components 2 are connected to the electrode portions of the substrate 1B is transferred to the substrate storage device 26 by a transfer device (not shown), and stored one by one in a magazine or the like.

FIG. 2 is a front view showing a first embodiment of the substrate reversing device 25 according to the present invention, and FIG. 3 is an enlarged front view of an essential part of FIG.

In the substrate reversing device shown in FIGS. 2 and 3, first, an electronic component 2 on which a semiconductor chip such as an LSI is already mounted is connected to an electrode portion of one of two substrates 1 (substrate 1A). Then, it is mounted on the substrate reversing device and shows a state in which the substrate reversing device can perform a 180-degree reversing operation. Here, the electronic component 2 is mainly composed of a film-like member such as a polyimide resin.

That is, a plurality of buffer members 7a are provided on the opposing surfaces of a pair of upper and lower plate-like holding plates 71 and 72 which constitute a part of the substrate reversing device.
The substrate 1 is conveyed and mounted on the substrate reversing device main body in a state where the substrate 1 is sandwiched between the holding plates 71 and 72 provided with a.

The cushioning member 7a itself is made of an elastic body such as a rubber member or a spring member. The height of each cushioning member 7a is such that the substrate 1 and the holding plates 71 and 72 are parallel, When 71 and 72 are pressed from both outer surfaces,
It is provided so that the force is applied to the substrate 1 and the component 2 almost uniformly.

In the state where the substrate 1 is sandwiched between the holding plates 71 and 72 with the buffer member 7a interposed therebetween, the transfer from the transfer device 8 shown in FIG. 2 to the substrate reversing device main body is performed.

Therefore, the main body of the substrate reversing device has a pair of left and right gripping mechanisms 31 and 32, each of which forms a U-shaped arm when viewed from the front. 1, a pair of upper and lower holding plates 71
72 is configured to be pressed and gripped.

That is, each of the gripping mechanisms 31 and 32 has upper and lower pairs of gripping pieces 3b and 3c, respectively, and both gripping pieces 3b and 3c are guided by the linear guides 3e and 3e by the operation of the cylinder 3d. It moves in the direction of arrow Z1, and holds and fixes the holding plates 71, 72 by sandwiching the holding plates 71, 72 between the gripping pieces 3b, 3c.

The gripping pieces 3b of the gripping mechanisms 31, 32,
3c, exhaust holes 3g, 3g are formed as shown in FIG. 3, and the exhaust holes 3g, 3g are connected to an intake pump (not shown), and each of the adsorbing members 3a, 3g connected to the exhaust holes 3g, 3g. 3a sucks and holds the holding plates 71, 72 in response to the suction operation of the suction pump.

Further, as shown in FIG.
32 cylinders 3d, 3d
f, 3f, and a pair of ball screw mechanisms 91, 9 provided correspondingly to the grip main bodies 3f, 3f, respectively.
2 is incorporated.

The ball screw mechanisms 91 and 92 are driven by the rotation of the servo motors 9a and 9a to hold the gripping mechanisms 31 and 3 respectively.
2 is configured to be movable in the X direction shown in the figure.

That is, the servo motors 9a and 9a of the ball screw mechanisms 91 and 92 are
L-shaped frames 10b, 10b which rotate together by driving
The pair of gripping mechanisms 31 and 32 are configured to be capable of moving forward and backward on the rotation axis of the reversing mechanism 10 and moving away from each other.

As shown in FIG. 2, the pair of L-shaped frame members 10b, 10b are commonly connected by a connection beam 10c having a substantially U-shape in plan view.
While the c and the frames 10b, 10b are supported by the bearing 10d at the other end, the motor 10a rotates in the direction of the arrow R to repeat the 180-degree reversing operation.

In the configuration shown in FIG. 2, the substrate reversing device includes the holding plates 71 and 72 sandwiching the substrate 1 at the center.
The state of receiving and holding from the transport device 8 is shown,
After the substrate 1 is inverted, the inverted substrate 1 is held by the holding plates 71 and 72.
Is transferred to the transport device 8. This transport device 8
Is a transfer table 8a on which the substrate 1 is mounted, and XY-θ which supports the transfer table 8a movably in X, Y, and θ directions.
The transfer table 8a has a stage 8b, and has a suction member 8d that sucks the substrate 1 and moves in the arrow Z direction by a vertical movement device such as a cylinder 8c.

Next, the transfer device 8 transfers the substrate 1 together with the holding plates 71 and 72 to the substrate reversing device main body, and the inverted substrate 1 is transferred together with the holding plates 71 and 72 to the transfer device 8.
Will be described below with reference to FIGS. 2, 4, and 5. FIG.

First, as shown in FIG. 4, the servo motors 9a, 9a on the main body of the substrate reversing device are driven under the control of control means (not shown) to form a pair of gripping mechanisms 31, 32.
Moves (retreats) left and right, and in the open space, the pair of holding plates 71 and 72 sandwiching the substrate 1 are held by the suction member 8d while the cylinder 8c is moved from above the transfer table 8a of the transfer device 8. Is pushed up in the direction of arrow Z1 shown in the figure, and is positioned at the position shown in FIG.

In this state, the control means (not shown)
Activate the servo motors 9a, 9a, and
1 and 32 are moved forward in the arrow X1 direction,
The a and 3a are stopped at predetermined positions at positions where the holding plates 71 and 72 can be attracted while being pressed.

Next, by operating the cylinders 3d of the pair of gripping mechanisms 31, 32, as shown in FIG. 2, the holding plates 71, 72 are pressed and held from above and below, and the suction member 8d of the transfer device 8 is The suction is released, and the cylinder 8c is moved down to the position shown in FIG. 2 by the operation of the cylinder 8c. In this state, the holding plate 71 holding the substrate 1 is rotated by 180 degrees in the direction of arrow R by driving the motor 10a. , 72 are inverted.

The inverted substrate 1 is not shown in the drawing, but is operated in the opposite manner, ie, "upward movement of the suction member 8d of the transfer device 8" → "suction of the holding plate by the suction member 8d" →
Through the sequence of “opening of the holding plates 71, 72 by the cylinder 3d” → “retraction of the gripping mechanisms 31, 32 by the servomotors 9a, 9a” → “downward movement of the suction member 8d”,
The inverted substrate 1 is transported and transferred to the next component mounting step together with the holding plates 71 and 72.

In the next step of the delivery, the holding plate 71,
Since the state 72 is removed and the state shown in FIG. 15 is obtained, parts such as electronic parts are mounted on the electrode portion of the substrate 1B facing upward by inversion.

In the first embodiment, the plurality of suction members 3a, 3a are configured to suck and hold the holding plates 71, 72. However, together with the holding plates 71, 72, the substrate 1 or the component 2 is held. It can also be configured to adsorb.

FIG. 6 is a side view of a main part of a substrate reversing device according to a second embodiment of the present invention.
Through holes 71a, 72a are provided in 72, and some of the suction members 3a, 3a directly suck and hold the substrate 1 (1A, 1B) through the through holes 71a, 72a, and the substrate 1 shifts during the reversing operation. It is configured to reduce the

Of course, the through holes 71a, 72a may be configured so that the suction members 3a, 3a directly suck the electronic component 2.

In the first and second embodiments,
If an exhaust pipe or the like is erected on the surface of the substrate 1,
In order to avoid the exhaust pipe and the like, each of the holding plates 71 and 72 is provided with a through hole or the like in advance, and the holding mechanisms 31 and 32 are provided.
It can also be configured by appropriately modifying its shape so that it does not come into contact with the exhaust pipe or the like during its forward and backward operations.

In any case, according to the substrate reversing devices according to the first and second embodiments, a substrate on which components such as electronic components are mounted is sandwiched between a pair of holding plates, and the holding plates are held. The effect of the stress caused by the rotational movement of components and the like on the board is reduced, and the mounted parts and the board are not only damaged, but also the connection parts between the board and the parts are damaged. Can also be reduced.

Next, a third embodiment of the substrate reversing device according to the present invention will be described with reference to FIGS.

FIG. 7 is a plan view showing a third embodiment of the substrate reversing device according to the present invention, FIG. 8 is a transverse sectional view of FIG. 7, and FIG. 9 is an operation of the substrate reversing device shown in FIG. FIG. 10 is a cross-sectional view of FIG. 9, FIG. 11 is a plan view of another operation state of the substrate reversing device shown in FIG. 7, and FIG.
FIG. 12 is a cross-sectional view of FIG.

The substrate reversing device 40 shown in FIGS. 7 to 12
Can be mounted on the substrate 1 without using the pair of holding plates 71 and 72.
To a pair of upper and lower suction members (constituting a holding member) 3a, 3
a electronic components 2 directly held by suction and connected to the substrate 1
A pair of upper and lower support members (constituting a support member) 4
It is characterized in that it is supported from both upper and lower surfaces by 1, 41.

That is, a pair of upper and lower suction members 3a, 3a for sucking and holding the substrate 1 are formed by a pair of left and right slide mechanisms 4.
Two pairs are provided for each of the pair 2 and 42. The slide mechanisms 42, 42 are respectively disposed on the upper side and the lower side of the rotating frame 43, and have slide arms 44, 44 which are movable while being guided in the arrow X direction by a feed mechanism using a motor or the like as a drive source. It is configured. Support arms 46, 46 are supported on the respective slide arms 44, 44 via vertical cylinders 45, movably in the vertical direction, and the suction members 3a, 3a are supported by the support brackets 46, 46. It is supported by. Further, support members 41, 41 are fixedly arranged on the respective slide arms 44, 44, and the opposing surfaces of the support members 41, 41 opposing in the vertical direction are
The electronic component 2 functions as a support surface that can hold the electronic component 2 from both front and back surfaces.

The rotary frame 43 is rotatably supported by left and right support shafts 48, 48 on a frame member 47 fixedly supported by a support (not shown). Here, a pulley 49 is fixed to one of the support shafts 48 (left side in the figure).
It is connected to a pulley 51 fixed to an output shaft of a motor 50 fixed to the frame member 47 via a belt 53. Thus, the rotating frame 43 can rotate around the support shaft 48 by driving the motor 50.

In the rotary frame 43, a pair of substrate support members 52, 52 are disposed between the slide arms 44, 44 facing each other. The substrate support members 52, 52 are provided on the upper and lower surfaces of the rotating frame 43, respectively, and supported so as to be rotatable by 90 degrees between a state shown by a solid line and a state shown by a two-dot chain line in FIG. It is supported movably up and down with respect to the rotating frame 43.

Next, in the substrate reversing device 40, a procedure from the transfer of the substrate 1 from the previous process to the transfer of the substrate 1 to the subsequent process after the reversal will be described below.

First, as shown in FIG. 9, of the sliding arms 44, 44 of the rotating frame 43, the sliding arms 44, 44 located above the rotating frame 43 are separated from each other (from the state shown in FIG. 9), the upper substrate support member 52 is also rotated to a state shown by a two-dot chain line in FIG. 7 to form a space for carrying the substrate 1. Then, the substrate 1 transported by the transport device (not shown) passes through this space,
The suction members 3a, 3a and the substrate support members 52, 52 supported by the slide arms 44, 44 located below the
Supported by At this time, the support members 41 are positioned below the electronic component 2 connected to the substrate 1.

Next, as shown in FIG. 11, the slide arms 44, 44 located on the upper side of the rotating frame 43 move closer to the substrate 1 to a position facing the slide arms 44, 44 located on the lower side. At the same time, as shown in FIG.
Swivel up. Then, the suction members 3a, 3a are lowered, and the substrate support members 52, 52 are lowered to hold the substrate 1 from both upper and lower surfaces.

In this state, the substrate 1 is inverted by rotating the rotating frame 43 by 180 degrees by driving the motor 50. At this time, as shown in FIG. 7, the electronic component 2 connected to the board 1 is held by the support members 41, 41 just from the front and back.

The inverted substrate 1 is operated in the opposite manner to the above, that is, "the lifting of the suction members 3a, 3a and the lifting of the substrate support members 52, 52" → "the lifting of the slide arms 44, 44 located on the upper side. Movement in the direction away from each other, and 2 of FIG.
It is conveyed and passed to the next electronic component mounting process through the procedure of “rotation to the position indicated by the chain line”.

In the third embodiment, since the substrate 1 is reversed while being pressed and held by the suction members 3a, 3a and the substrate support members 52, 52 from above and below, the stress caused by the rotational movement is reduced. Of the electronic component 2 connected to the substrate 1 during the reversing operation of the substrate 1 is held by the support members 41, 41. The electronic component 2 can be prevented from fluttering, and the substrate 1 and the electronic component 2 can be prevented from being damaged.

[0066]

According to the present invention, a stable reversing operation can be performed without components mounted on the substrate being swung, so that a substrate such as a liquid crystal panel with high yield and high reliability can be assembled and manufactured. The effect is practically large.

[Brief description of the drawings]

FIG. 1 is a layout diagram of a panel manufacturing apparatus using a substrate reversing device according to the present invention.

FIG. 2 is a front view showing a first embodiment of the substrate reversing device according to the present invention.

FIG. 3 is an enlarged front view of a main part of the device shown in FIG. 2;

FIG. 4 is a front view showing a state in which a substrate is transferred in the apparatus shown in FIG. 2;

5 is a front view showing a state in which the transported substrate is to be held, following FIG. 3, in the apparatus shown in FIG. 2;

FIG. 6 is a main part enlarged front view showing a second embodiment of the substrate reversing device according to the present invention.

FIG. 7 is a plan view showing a third embodiment of the substrate reversing device according to the present invention.

8 is a cross-sectional view of the substrate reversing device shown in FIG.

9 is a plan view showing an operation state of the substrate reversing device shown in FIG.

FIG. 10 is a cross-sectional view showing an operation state of the substrate reversing device shown in FIG.

FIG. 11 is a plan view showing another operation state of the substrate reversing device shown in FIG. 7;

FIG. 12 is a cross-sectional view of the substrate reversing device shown in FIG.

FIG. 13 is a perspective view showing a conventional substrate reversing device.

FIG. 14 is a side view of a main part of the device shown in FIG.

FIG. 15 is a perspective view showing a state where components are mounted on a substrate which has been inverted by the device shown in FIG. 13;

[Explanation of symbols]

 1, 1A, 1B board 2 component 3 gripping part 31, 32 gripping mechanism 3a suction member 3b gripping piece 3c gripping part 3d cylinder 3e linear guide 3f gripping body 3g exhaust hole 4, 10 inversion mechanism 5 moving mechanism 71, 72 holding plate 71a , 72a Through hole 7a Buffer member 8 Transfer device 8a Transfer table 8b XY-θ stage 8c Cylinder 8d Suction member 91,92 Ball screw mechanism 9a Servo motor 10a Motor 10b Frame 10c Connecting beam 10d Bearing 20 Panel manufacturing device 21 Substrate Supply device 22a First substrate cleaning device 22b Second substrate cleaning device 23a First connection member bonding device 23b Second connection member bonding device 24a First electronic component mounting device 24b Second electronic component mounting device 25 Substrate reversing device 26 Substrate accommodation device 40 substrate reversing device 41 support member 42 Id mechanism 43 rotates the frame 44 slide arm 45 cylinder 46 support bracket 47 frame members 48 support shaft 49 a pulley 50 the motor 51 a pulley 52 the substrate support member 53 belt

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H088 FA16 FA17 FA18 FA24 FA30 MA20 2H092 GA50 GA59 MA31 MA35 NA29 5C012 AA09 5F031 CA05 FA02 FA20 GA24 PA18

Claims (9)

[Claims] 1. A pair of holding plates for holding a board on which components are mounted from both sides, a holding portion for holding the pair of holding plates while pressing them from outside, and turning the holding portion to invert the board. A substrate reversing device, comprising: a reversing mechanism. 2. The method according to claim 1, wherein the grip portion is configured by a pair of grip mechanisms arranged to face each other, and the reversing mechanism is configured to rotate the pair of grip mechanisms in synchronization. The substrate reversing device according to claim 1. 3. The substrate reversing device according to claim 1, wherein the pair of holding plates are configured to hold the substrate via a buffer member. 4. The substrate reversing device according to claim 3, wherein the pair of holding plates are configured to hold the component via a buffer member. 5. The substrate reversing device according to claim 1, wherein the holding unit is configured to hold the holding plate via a suction member. 6. A board reversing device for reversing a board mounted with components protruding from an outer peripheral portion, wherein: a holding member for holding the board; a support member for supporting the component; A substrate reversing device, comprising: a rotation mechanism configured to rotate the support member and a straight line parallel to the surface of the substrate as a common rotation center axis. 7. The substrate reversing device according to claim 6, wherein said holding member has a pair of upper and lower suction members, and a plurality of said pair of upper and lower suction members are arranged in a direction along a surface of said substrate. apparatus. 8. The substrate reversing device according to claim 6, wherein the support member has a pair of support surfaces capable of holding the component from both front and back surfaces. 9. A panel manufacturing apparatus using the substrate reversing device according to claim 1.