KR102272610B1 - Transfer apparatus of electronic component and transfer process thereof - Google Patents

Abstract

The present invention relates to an electronic component transfer device and a transfer process thereof. When some electronic components such as an electronic component handled in the form of an end product chip including a multilayer ceramic capacitor (MLCC), an inductor, a coil, etc., or an electronic component used as a unit device component before the end product chip are mounted on an object, it is required that the electronic components be mounted only on a specific surface depending on the object. The electronic component transfer device automates a transfer process of transferring and aligning the electronic components to face in the same direction and loads the electronic components into the following process, thereby simplifying the transfer process. Thus, it is possible to shorten the processing time and improve productivity. In addition, it is possible to align the electronic components faster and more accurately than conventional methods, thus providing high accuracy in aligning the electronic components. According to the present invention, since the delay of the transfer process is prevented by enabling the transfer process to be repetitive and continuous, the efficiency of the transfer process is increased.

Description

Electronic component transfer apparatus and transfer process {Transfer apparatus of electronic component and transfer process thereof}

The present invention relates to an electronic component transfer apparatus and a transfer process, and more particularly, to an electronic component for handling in the form of a chip of a finished product including a multilayer ceramic capacitor (MLCC), an inductor, a coil, and the like, or a finished product Electronic components used as unit device components before the chip of , when mounted on an object, transfer electronic components that require mounting only on a specific surface according to the object to be mounted, align them to have the same directionality, and then load them in a subsequent process It relates to a part transfer device and a transfer process.

In general, a multilayer ceramic capacitor is called a multi-layer ceramic capacitor (MLCC), and a thin sheet with a circuit pattern is cut into a shape of a certain size, a plurality of these sheets are laminated and pressed by a press, and then an appropriate It is a small-sized surface-mount capacitor, such as cut to size, and is applied for impedance matching of mobile communication terminals, LC resonance circuits, and electromagnetic noise removal of digital devices.

On the other hand, recently, a micro inductor chip for stably supplying power supplied from a battery to a semiconductor has been developed, and the inductor chip is used as a core component in a smart phone and an electric vehicle.

Here, among electronic components that are handled in the form of a chip of a finished product including a multilayer ceramic capacitor (MLCC), an inductor, a coil, etc., or electronic components used as unit device components before the chip of the finished product, it is mounted on an object In the case of an electronic component that is required to be mounted only on a specific surface according to an object to be mounted, it is arranged and loaded so as to have the same direction through a loading process through an electronic component loading device.

To this end, in the prior art, when the loading process through the electronic component loading device is performed, the transfer process of aligning the electronic components to have the same directionality is manually performed by the operator, and then the electronic components aligned to have the same directionality by hand are reloaded by the loading device. was loaded as a post-process through

In other words, in order to transport electronic components that include a multilayer ceramic capacitor (MLCC), an inductor, and a coil, but that require mounting only on a specific surface on an object to a post-process, the electronic components are aligned so that they have the same directionality. During the process, an operator places an alignment plate (AP) in which a plurality of alignment grooves formed in the form of a pocket are arranged horizontally and in a row on a vibration device, and a hopper provided on the top of the vibration device Through Hopper, electronic components such as multilayer ceramic capacitors (MLCC), inductors, or coils are supplied on the alignment plate seated on the vibrating device, and the alignment plate supplied with electronic components through the vibrating device is supplied. By vibrating for a predetermined time, each electronic component is inserted into each alignment groove of the alignment plate AP.

In this way, after each electronic component is inserted into each alignment groove of the alignment plate AP, as shown in FIGS. 1 to 4, the alignment plate (AP; Align Plate, 3) in the vibrating device (not shown) A plurality of transfer holes (3a) are formed through the alignment plate (3) removed after removal, and the number and shape of the transfer holes (5a) to correspond to the alignment grooves (3a) formed in the alignment plate (3) The transfer plate (CP: Carrier Plate, 5) arranged in this horizontal and column is positioned and assembled and combined.

At this time, the transfer plate 5 is transferred by attaching a transfer tape (Silicon Tape, 7) having an adhesive surface bonded to either one side or the other side, and then the transfer tape 7 is not attached. The transfer plate 5 is assembled and coupled to the alignment plate 3 so that the side with the hole 5a open is located on the top of the alignment plate 3 .

In this way, the transfer plate 5 is seated on the upper part of the alignment plate 3 and assembled, and then a plate-shaped flip plate (FP: Flip Plate, 9) is assembled and installed on the transfer plate 5 .

Then, after the operator grips the alignment plate 3, the transfer plate 5 and the flip plate 9, which are arranged to be sequentially positioned from the bottom to the top, flip the plate by 180° and rotate the flip plate from the bottom to the top ( 9) and the transfer plate 5 and the alignment plate 3 are arranged to be inverted so that they are sequentially positioned, so that each electronic component (not shown) inserted into the alignment groove 3a of the alignment plate 3 is naturally dropped to the transfer plate It is transferred to the adhesive surface of the transfer tape (7) through the transfer hole (5a) of (5).

At this time, despite the rotation of each plate (3, 5, 9), some electronic components remaining in the alignment groove (3a) of the alignment plate (3) without being transferred from the alignment plate (3) to the transfer plate (5) In order to transfer back to the transfer plate 5, each inverted plate 3, 5, 9 is seated on a vibrating device (not shown) again, and then vibrated for a certain time through the vibrating device to form a part of the alignment plate 3 The remaining electronic components inserted into the alignment grooves 3a are naturally dropped into the transfer holes 5a of the transfer plate 5 to be inserted and seated, thereby transferring them to the adhesive surface of the transfer tape 7 .

In this way, vibration is generated again in each of the plates 3, 5, and 9 inverted through the vibrating device, so that the electronic components remaining in some alignment grooves 3a are not transferred from the alignment plate 3 to the transfer plate 5. After transferring to the transfer tape 7 through the transfer hole 5a of the transfer plate 5, the alignment plate 3 installed on the transfer plate 5 is removed, and the transfer hole 5a of the transfer plate 5 is removed. ), the operator visually confirms that the electronic component inserted and seated is transferred to the adhesive surface of the transfer tape 7 .

Then, the transfer plate 5 is inserted and seated in the transfer hole 5a of the transfer plate 5 to adhere the electronic component transferred to the transfer tape 7 to the adhesive surface of the transfer tape 7 . Press the pressure plate or roller (Roller, not shown) by placing it on the upper surface.

That is, after positioning the roller on the upper surface of the transfer plate 5 where the transfer hole 5a is opened, the operator reciprocates the roller one or more times on the transfer plate 5 to transfer each transfer plate 5 . It presses so as to improve the adhesive force between the electronic component inserted into the hole 5a and the adhesive surface of the transfer tape 7 .

Here, it is inserted and seated in the transfer plate 5 by pressing through a pressure mechanism such as a roller, and after attaching the electronic component to the adhesive surface of the transfer tape 7 , the flip plate 9 is removed.

As described above, the electronic components pressed through a pressing mechanism such as a roller are aligned to have the same direction by bonding the same side to the adhesive surface of the transfer tape, and are aligned to the adhesive surface of the transfer tape, but the electronic component is The transferred transfer plate was again uploaded to the electronic component loading device by the operator and supplied to the post-process, and mounted on the object through a gripper, vacuum adsorption, or robot arm.

However, as described above, in order to mount the manufactured electronic components including the multilayer ceramic capacitor (MLCC), the inductor, and the coil on the object, the transfer process of aligning the electronic components to have the same directionality is the operator's task. Since the transfer process is carried out manually, there are problems such as cumbersome transfer and a lot of work time is required.

In addition, since the transfer process is performed manually, skilled workers are required, and if the coupling is misaligned when installed so that each plate is in contact with each other due to the carelessness of the operator, the plate may fall to the floor during rotation of the plate, or the alignment of each plate There is a problem in that the electronic component inserted into the hole or/and the transfer hole is separated from the plate and falls to the floor, causing the electronic component to be damaged and contaminated at the same time.

In addition, the transfer plate is installed on the alignment plate, the flip plate is assembled on the transfer plate, and then rotated to transfer the electronic component inserted into the alignment groove of the alignment plate into the transfer hole of the transfer plate, and transfer the electronic component to the transfer hole of the transfer plate. After cleaning, the flip plates are collected and circulated, and the process of reinstalling and reusing the collected flip plates on the transfer plate is repeated, so that a certain number of flip plates is required and the process of collecting, circulating and installing flip plates is required. There were problems such as complicating the entire process.

Therefore, it is mounted on a target object among electronic components that are handled in the form of chips of finished products including multilayer ceramic capacitors (MLCCs), inductors, coils, etc., or electronic components used as unit device components before the chip of the finished product. There is a need for a transfer device that aligns and transfers electronic components that require mounting on a specific surface only to have the same directionality depending on the object to be mounted and the automation of the transfer process.

Republic of Korea Registration No. 10-2020034

The present invention is intended to solve the above problems, and electronic components handling electronic components in the form of a finished product including a multilayer ceramic capacitor (MLCC), an inductor, a coil, etc., or before the chip of the finished product Among the electronic components used as unit device components, when mounted on an object, the transfer process of transferring electronic components that require mounting on only a specific surface according to the object to be mounted and aligning them with the same directionality is automated, making loading as a post-process easy It is easy and simplifies the transfer process to shorten the series of process times to improve productivity, to align electronic components faster and more accurately than conventional methods, to provide high accuracy when aligning electronic components, and to An object of the present invention is to provide an electronic component transfer apparatus and a transfer process capable of preventing a delay in the transfer process by enabling a continuous transfer process, thereby improving the efficiency of the transfer process.

Further, in the present invention, since a flip plate for transferring from the alignment plate to the transfer plate is integrally formed in the transfer device during the transfer process of the electronic component, a separate flip plate is not required, so there is no need to reuse the flip plate. The process for collecting and circulating flip plates is not required, and the cost of consumables such as flip plates and equipment costs due to repeated use of the plates can be reduced, and a separate process for combining and installing flip plates is eliminated. An object of the present invention is to provide an electronic component transfer apparatus and transfer process capable of simplifying the entire process and improving the efficiency of the apparatus, and reducing the overall process time.

In addition, the technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned are clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. it could be

In order to achieve the above object, the present invention is formed as a rectangular parallelepiped-shaped plate body, and a pair of moving rails are respectively protruded from one side and the other side, on the lower surface, on both sides of the longitudinal direction, and on the alignment plate. a flip plate for transferring the aligned electronic components to a transfer plate to which a transfer tape is attached; a rotation motor connected to the center of one side of the flip plate to rotate and invert the flip plate; an assembly plate provided on one upper part and the other lower part in the longitudinal direction of the flip plate based on the center of the flip plate connected to the rotation motor, and connected to the rail piece so as to be movable forward and backward on the moving rail of the flip plate; and a transfer plate provided on one lower side and the other upper side of the flip plate in the longitudinal direction based on the center of the flip plate connected to the rotation motor, and connected to the rail piece so as to be movable forward and backward on the moving rail of the flip plate. It is characterized in that it comprises a.

Here, on one side and the other side based on the center of the flip plate, waiting holes for the assembly plate and the transfer plate to stand by are respectively formed through, and the seating holes for installing the alignment plate and the transfer plate are formed penetratingly spaced apart from the waiting hole. do.

And, the assembly plate is provided with an upper vacuum suction plate connected to the upper pressing plate and the upper pressing plate, the transfer plate is provided with a lower vacuum suction plate connected to the lower pressing plate and the lower pressing plate, the upper vacuum suction plate and the lower vacuum suction plate has a long slot type A plurality of suction grooves are formed to be spaced apart from each other, and at least one suction hole is formed in each suction groove to vacuum the alignment plate and the transfer plate interposed between the upper vacuum suction plate and the lower vacuum suction plate.

At this time, through-holes are respectively formed in the center of the assembly plate and the transfer plate, and installation holes are respectively extended in the center of both sides of each through-hole, and each installation hole is connected to the side surface of the fixing piece and the fixing piece to vertically up/down. A moving part composed of a moving piece moving down is installed, the fixed piece of the moving part is connected on the assembly plate and the transfer plate close to the installation hole, and the moving piece is connected to the upper press plate and the lower press plate, and the vertical side of the moving piece in the fixed piece When the direction is up/down, each upper press plate and the lower press plate are made up/down in the vertical direction based on the assembly plate and the transfer plate.

On the other hand, the shaft is provided at each edge of the assembly plate and the transfer plate, the shaft presses each edge of each upper press plate and the lower press plate to press and fix the alignment plate and the transfer plate interposed between the upper press plate and the lower press plate. is done

Here, a vibrator is provided on the lower pressing plate of each transfer plate.

On the other hand, after moving the transfer plate provided at the lower side of the flip plate of the transfer device forward to the lower portion of the seating hole using a transfer mechanism to install the alignment plate on the upper portion of the transfer plate; Assembling and installing a transfer plate to which a transfer tape having an adhesive surface is attached to an upper portion of the alignment plate using a transfer mechanism; moving the assembly plate provided on one side of the upper part of the flip plate forward to the upper part of the seating hole; transferring the electronic components of the alignment plate to the transfer plate by rotating the flip plate by 180° to invert the assembly plate and the transfer plate up and down; moving the transfer plate backward; removing the alignment plate from the transfer plate through the transfer mechanism; and transferring the transfer plate to which the electronic components are transferred to a post-process; Including, but characterized in that the above-described process is repeatedly and continuously performed.

Here, transferring the electronic components remaining in the alignment plate to the transfer plate by vibrating the vibrator to transfer the electronic components remaining in the alignment plate to the transfer plate; further includes

As described above, the present invention having the above configuration improves productivity by shortening a series of process times by automating and simplifying the transfer process of electronic components, which previously relied on manual labor by workers, and improving productivity, compared to the existing method. It can align and transfer electronic components quickly and accurately, provide high accuracy when aligning and transferring electronic components, improve efficiency by preventing the delay of the transfer process, and transfer electronic components to the object through post-processing. It is possible to improve the accuracy during mounting, thereby reducing the defect rate of the object on which the electronic component is mounted, thereby improving the accuracy, and thereby improving the reliability of the product.

In addition, the present invention provides an electronic component handling in the form of a chip of a finished product including a multilayer ceramic capacitor (MLCC), an inductor, a coil, etc., or an electronic component used as a unit device component before the chip of the finished product In the transfer process for transferring the data, since the flip plate is integrally formed with the transfer device, the flip plate can be deleted, so a process for collection and circulation of the flip plate is not required, and thus a separate process for combining and installing the flip plate can be deleted, simplification of the process and efficiency of the device can be improved, the cost of separate consumables and equipment can be reduced, and the overall process time can be shortened.

1 is a view schematically showing an alignment plate for aligning electronic components;
2 is a view schematically showing a transfer plate for transferring an electronic component;
3 is a view schematically showing an alignment plate, a transfer plate and a flip plate for transferring electronic components;
4 is a view schematically showing a transfer process of an electronic component according to the prior art;
5 is a view schematically showing an electronic component loading device according to the present invention;
6 is a view schematically showing a transfer device in the electronic component loading device according to the present invention;
7 is an enlarged cross-sectional view schematically showing the structure of the flip plate and the transfer plate of the electronic component transfer device according to the present invention;
8 to 15 are views showing step by step a transfer process through the electronic component transferring apparatus according to the present invention, and FIG. 8 is a view showing the state in the initial position of the electronic component transferring apparatus, and FIG. 9 is the electronic component transferring apparatus. It is a view showing the state that the assembly plate of the stand-by hole is located, Figure 10 is a view showing the state that the alignment plate and the transfer plate are installed on the upper portion of the transfer plate moved forward to the lower portion of the seating hole of the electronic component transfer device, Figure 11 is It is a view showing the state in which the assembly plate is moved forward to the upper part of the seating hole after the alignment plate and the transfer plate are installed in the seating hole of the electronic component transfer device, and FIGS. 12 and 13 are the flip plate of the electronic component transferring device for driving the rotary motor. It is a view showing a state that the electronic component transfer device is rotated by, Fig. 14 is a view showing a state in which the flip plate of the electronic component transfer device is transferred, and Fig. 15 is a view showing a state after the transfer plate transferred from the electronic component transfer device is transferred to a post-process .

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. In addition, the present embodiment does not limit the scope of the present invention, but is presented only as an example, and various changes are possible within the scope without departing from the technical gist thereof.

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and will be described in the detailed description.

However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In describing each figure, like reference numerals have been used for like elements.

The terms used herein are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being “connected” or “connected” to another component, it is understood that the other component may be directly connected or connected to the other component, but other components may exist in between. it should be On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that no other element is present in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

In addition, terms such as "unit", "unit", "module" and the like described in the specification mean a unit that processes at least one function or operation, which may be implemented as hardware or software or a combination of hardware and software.

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. 5 is a view schematically showing an electronic component loading apparatus according to the present invention, FIG. 6 is a diagram schematically showing a transfer device in an electronic component loading apparatus according to the present invention, and FIG. 7 is an electronic component transferring apparatus according to the present invention It is an enlarged cross-sectional view schematically showing the structure of the flip plate and the transfer plate, and FIGS. 8 to 15 are views showing the transfer process step by step through the electronic component transfer apparatus according to the present invention, and FIG. 8 is the electronic component transfer apparatus is a view showing the state in the initial position of, Figure 9 is a view showing the state that the assembly plate of the electronic component transfer device is located in the waiting hole, Figure 10 is the transfer plate moved forward to the lower portion of the seating hole of the electronic component transfer device It is a view showing the state that the alignment plate and the transfer plate are installed on the upper part, and FIG. 11 is a view showing the state that the assembly plate is moved forward to the upper part of the seating hole after the alignment plate and the transfer plate are installed in the seating hole of the electronic component transfer device, 12 and 13 are views illustrating a state in which the flip plate of the electronic component transfer device is rotated by driving a rotation motor, FIG. 14 is a view showing a state in which the flip plate of the electronic component transfer device is transferred, and FIG. 15 is an electronic component It is a view showing the appearance after the transfer plate transferred from the transfer device is transferred to the post process.

The electronic component transfer device according to the present invention is an electronic component that is included in the electronic product loading device 1 and handles in the form of a chip of a finished product including a multilayer ceramic capacitor (MLCC), an inductor, a coil, and the like, It is a device that performs a transfer process so that electronic components that are required to be mounted only on a specific surface according to the object to be mounted among the electronic components used as unit element components before the chip of the finished product have the same directionality. This is to supply it to the post-process after transferring it.

First, an electronic component loading apparatus will be schematically described. 5, as shown in the drawings, the electronic component loading device 1 is formed in a table shape, and an empty alignment plate and an empty transfer plate are circulated, and an alignment plate on which electronic components are aligned. and each transfer (not shown) for moving the transfer plate to which the electronic component is transferred, circulating the plate in which the alignment plate and the transfer plate are coupled, and taking out the transfer plate to which the electronic component has been transferred. , an empty alignment plate and a transfer plate, and each elevator (not shown) for moving the alignment plate and the transferred transfer plate after the transfer is completed.

And, a transfer mechanism (not shown) including a supply unit 100 for supplying electronic components to the alignment plate, a gripper for gripping each plate, a vacuum adsorber or a robot arm, and a transfer mechanism connected to the upper end of the transfer mechanism It further includes a transfer rail (not shown) for moving the transfer mechanism to each process.

Here, the supply unit 100 is preferably made of a hopper (not shown) to supply the electronic components to be inputted to an empty alignment plate, but a hopper into which the electronic components are put and a plurality of electronic components discharged after being put into the hopper It may also be configured to include a guide member (not shown) that is rotated and moved to the upper portion of the alignment plate to guide and supply the dog, but is not limited thereto.

On the other hand, when the electronic component is supplied on the empty alignment plate through the supply unit 100, it further includes a vibrating device 200 for aligning each supplied electronic component to the alignment plate.

Here, when described with reference to FIGS. 1 to 3, the alignment plate (AP; Align Plate, 3) for aligning the electronic components has a plurality of alignment grooves 3a formed in the shape of a pocket horizontally and in rows. Arranged, the transfer plate (CP: Carrier Plate, 5) for transferring the electronic component is formed through a plurality of transfer holes (5a) to correspond to the alignment groove (3a) formed in the alignment plate (3) The number and shape of the transfer holes 5a are arranged horizontally and in the same form as the alignment grooves 3a, and the transfer plate 5 has an adhesive surface bonded to either one side or the other side of the transfer plate 5. A used tape (Silicon Tape, 7) is attached.

Here, the alignment groove 3a formed in the alignment plate 3 and the transfer hole 5a formed through the transfer plate 5 are formed to correspond to the size and shape of the electronic component to be inserted.

On the other hand, the electronic component transfer device 300 is included in the electronic component loading device 1 as shown in FIGS. 5 to 15 to perform a series of processes, but is formed as a rectangular parallelepiped plate body, an alignment plate The flip plate 310 for transferring the electronic components aligned in (3) to the transfer plate 5 to which the transfer tape 7 is attached, and the flip plate 310 connected to the center of one side of the flip plate 310 ) is connected by a moving rail 315 to the upper part and the other lower part in the longitudinal direction of the flip plate 310 based on the rotation motor 320 that rotates and inverts the rotation motor 320 and the center connected to the rotation motor 320 to move forward and backward The assembly plate 330 provided movably and the central portion connected to the rotation motor 320 are connected to the lower part of one side and the upper part of the other side in the longitudinal direction of the flip plate 310 by moving rails 315 to move forward and backward. and a transfer plate 340 that is movably provided.

Here, the flip plate 310 has a rectangular shape corresponding to the assembly plate 330 and the transfer plate 340 so that the assembly plate 330 and the transfer plate 340 stand on one side and the other side that are close to each other with respect to the center. At both ends of the flip plate 310 spaced apart from each of the waiting holes 311 by a predetermined interval, the waiting holes 311 are formed through, respectively, and seating holes for installing the alignment plate 3 and the transfer plate 5 are installed. (313) is formed through each, each seating hole (313) is extended to both ends of the longitudinal direction of the flip plate 310 is formed to be open to face each other in a substantially "C" shape.

In this way, the flip plate 310 has a waiting hole 311 and a seating hole 313 on one side and the other side with respect to the center connected to the rotation motor 320, respectively, so that the alignment plate ( 3) and the transfer plate 5, which is provided on the lower side of the flip plate 310 when installing, moves the transfer plate 340 waiting in the lower part of the waiting hole 311 to the lower part of the seating hole 313, After installing the alignment plate 3 and the transfer plate 5 on the flip plate 310, the assembly plate 330, which is provided on one side of the flip plate 310, and is waiting at the top of the waiting hole 311, is inserted into the seating hole. The electrons of the alignment plate 3 are moved to the upper part of the 313 , and the flip plate 310 is rotated based on the center of the flip plate 310 by the driving of the rotation motor 320 so that the upper and lower portions are inverted. After transferring the parts to the transfer plate 5 , when the empty alignment plate 3 is removed, the transfer plate 340 , which is inverted from the lower part of one side to the upper part of the other side by the rotation of the flip plate 310 , is placed in the upper part of the seating hole 313 . It can be moved to the upper part of the waiting hole 311 in the .

That is, when the alignment plate 3 and the transfer plate 5 are seated in the seating hole 313 formed on one side of the flip plate 310, waiting at the bottom of the waiting hole 311 of the flip plate 310 The transfer plate 340 is moved forward to position the lower portion of the seating hole 313 , and the alignment plate 3 and the transfer plate are positioned on the upper portion of the transfer plate 340 that is moved forward to the lower portion of the seating hole 313 . After seating (5), the assembling plate 330 waiting at the upper part of the waiting hole 311 of the flip plate 310 is moved forward to be positioned on the upper part of the seating hole 313 so that the upper part of the seating hole 313, The lower portion is closed, and the flip plate 310 is rotated based on the central portion by the rotation motor 320 , and the alignment plate 3 and the transfer plate are interposed between the transfer plate 340 and the assembly plate 330 . (5) is inverted to transfer the electronic components of the alignment plate 3 located on the first upper part to the transfer plate 5 located on the lower side, and then reversed from the lower part of one side to the upper part of the other side by the rotation of the flip plate 310 By moving the transfer plate 340 positioned from the upper part of the seating hole 313 backward to the upper part of the waiting hole 311 and waiting, the upper part of the seating hole 313 is opened, and the transfer plate in the opened seating hole 313 is moved back to the upper part of the waiting hole 311 . It is possible to remove the alignment plate (3) except for (5).

As described above, the assembly plate 330 provided on one side of the upper portion of the flip plate 310 is positioned above the waiting hole 311 when the alignment plate 3 and the transfer plate 5 are seated and installed. By doing so, the upper part of the seating hole 313 is opened, and the assembly plate 330, which is located inverted from the upper part of one side to the lower part of the other side by the rotation of the flip plate 310, is the transfer plate 5 to which the electronic components are transferred. The transfer plate 340, which serves as a supporting flip plate, waits under the waiting hole 311 of the flip plate 310 and moves to the lower part of the seating hole 313, is aligned with the seating hole 313. When the plate 3 and the transfer plate 5 are seated and installed, the transfer plate 340 serves as a flip plate, and is inverted from the lower part of one side to the upper part of the other side by the rotation of the flip plate 310. It is moved from the upper part of the upper part of the 313 to the upper part of the waiting hole 311 and is made to remove the alignment plate 3 by opening the upper part of the seating hole 313, and this process is repeatedly and continuously performed while transferring the electronic component. process will be performed.

In this way, the assembly plate 330 provided on one upper side and the other lower side of the flip plate 310 and the transfer plate 340 provided on one side lower part and the other upper side of the flip plate 310 are seated in the waiting hole 311 or the other side. The opening and closing of the seating hole 313 are repeatedly performed by moving forward and backward between the holes 313 .

In addition, as the assembly plate 330 and the transfer plate 340 are symmetrically formed on the flip plate 310 to cross each other, the flip plate 310 is rotated clockwise or/and counterclockwise by the driving of the rotation motor 320 . When rotating in the clockwise direction, the assembly plate 330 and the transfer plate 340 are inverted while maintaining the same structure.

In one embodiment of the present invention, the flip plate 310 is formed in a rectangular parallelepiped plate body, but the flip plate 310 is formed in a rectangular parallelepiped plate body, and the side surface is formed in a cross shape like a windmill, It is also possible that the assembly plate 330 and the transfer plate 340 cross each other symmetrically on the upper and lower surfaces, but the present invention is not limited thereto, and various modifications are possible.

In addition, in one embodiment of the present invention, the flip plate 310 is formed as a rectangular parallelepiped plate body, and the assembly plate 330 and the transfer plate 340 are located on one side of the upper and lower sides with respect to the center connected to the rotation motor 320 . ) is provided, and the transfer plate 340 and the assembly plate 330 are provided on the upper and lower sides of the other side, and the assembly plate 330 and the transfer plate 340 are provided on both sides based on the center of the flip plate 310 . Although each is provided, it is also possible that the assembly plate 330 and the transfer plate 340 are provided only on one side or the other side with respect to the center of the flip plate 310 to be rotated.

Here, each of the assembly plate 330 and the transfer plate 340 is made to move in the longitudinal direction of the flip plate 310 by a rail structure, and for this purpose, one side and the other side of the flip plate 310, upper and lower surfaces A pair of moving rails 315 having a predetermined length are protruded from both side edges in the longitudinal direction, and are coupled to the moving rails 315 on one side and the other side of the assembly plate 330 and the transfer plate 340 . The rail pieces 335 and 345 are respectively provided to be slidable.

At this time, the pair of moving rails 315 are spaced apart from each other at a predetermined interval on both sides of the flip plate 310 to protrude as a pair, and are formed outside the waiting hole 311 and the seating hole 313 . each is provided.

On the other hand, on the lower surface of the assembly plate 330 provided on one side of the flip plate 310 , an upper pressing plate 331 and an upper vacuum suction plate 332 are sequentially provided in a downward direction, and the flip plate 310 . ), a lower pressing plate 341 and a lower vacuum suction plate 342 are sequentially provided on the upper surface of the transfer plate 340 provided on one side of the lower portion in the upward direction.

Here, when the flip plate 310 is rotated based on the center by the driving of the rotation motor and the assembly plate 330 and the transfer plate 340 are inverted, the transfer plate is inverted to the upper side of the other side of the flip plate 310 ( On the lower surface of the 340), a lower pressing plate 341 and a lower vacuum suction plate 342 are sequentially provided in the downward direction, and on the upper surface of the assembly plate 330 inverted to the lower side of the other side of the flip plate 310, the upper pressing plate 331 and the upper vacuum suction plate 332 are sequentially provided in the upward direction.

At this time, the upper pressure plate 331 and the upper vacuum suction plate 332 are integrally connected to each other, and the lower pressure plate 341 and the lower vacuum suction plate 342 are also integrally connected to each other, the upper vacuum suction plate 332 and A plurality of suction grooves 333 and 343 in the form of long slots are formed on the lower surface and the upper surface of the lower vacuum suction plate 342 at regular intervals, and at least one suction hole (333, 343) has at least one suction hole ( 333a, 343a) are formed.

As described above, the upper vacuum adsorption plate 332 and the lower vacuum adsorption plate 332 and the lower vacuum adsorption plate through the adsorption grooves 333 and 343 and the adsorption holes 333a and 343a formed in the upper vacuum adsorption plate 332 and the lower vacuum adsorption plate 342 The alignment plate 3 and the transfer plate 5 installed so as to abut against the 342 are vacuum-adsorbed, thereby preventing the respective plates 3 and 5 from moving.

In an embodiment of the present invention, slot-shaped suction grooves 333 and 343 are formed in the upper vacuum suction plate 332 and the lower vacuum suction plate 342, and suction holes 333a are formed in the suction grooves 333 and 343. 343a) is formed, but a plurality of suction holes 333a and 343a may be directly formed in the upper vacuum suction plate 332 and the lower vacuum suction plate 342, and other various modifications are possible.

On the other hand, after the transfer plate 5 and the alignment plate 3 are installed in the seating hole 313 on one side of the flip plate 310 , the assembly plate 330 waiting in the waiting hole 311 is installed in the seating hole 313 . When moving forward so as to be positioned on the upper side, as the assembly plate 330 moves, it interferes with the transfer plate 5 installed in the seating hole 313 , or the transfer plate inverted to the other side by the rotation of the flip plate 310 . When the 340 is moved backward from the seating hole 313 to the upper portion of the waiting hole 311 , the transfer plate 340 is moved so as not to interfere with the alignment plate 3 installed in the seating hole 313 . The assembly plate 330 provided on one upper side and the other lower side of the flip plate 310 and the transfer plate 340 provided on one side lower part and the other upper side of the flip plate 310 are vertically up/down. (DOWN) It is made possible.

To this end, substantially rectangular through-holes 337 and 347 are formed in the center of the assembly plate 330 and the transfer plate 340, respectively, and in the center of both sides of each of the through-holes 337 and 347, the "U"-shaped installation holes 337a and 347a, which are opened inside, are formed to extend from the through holes 337 and 347, respectively, and a fixing piece 351 and the fixing piece are provided in each of the installation holes 337a and 347a. A moving part 350 comprising a moving piece 353 connected to the side of the 351 and vertically moving up/down by an electric signal or hydraulic pressure is installed, and the fixed piece 351 of the moving unit 350 is installed. ) is connected to the upper surface of the assembly plate 330 and the transfer plate 340 close to the installation holes 337a and 347a, and the moving piece 353 is the upper surface of the upper pressing plate 331 and the lower pressing plate 341. ) is connected to the lower surface of the

In this way, the upper pressing plate 331 and the lower pressing plate 341 are connected to the assembly plate 330 and the transfer plate 340 by the fixed piece 351 and the moving piece 353, so that the upper pressing plate 331 and the lower pressing plate are connected. The upper vacuum suction plate 332 and the lower vacuum suction plate 342 connected to the upper pressure plate 331 and the lower pressure plate 341 by being made to vertically up/down the 341 also vertically up/down. Due to this, when the assembly plate 330 moves forward after the alignment plate 3 and the transfer play are installed in the seating hole 313, the upper pressing plate 331 located under the assembly plate 330 first and After raising the upper vacuum suction plate 332, it is moved forward along the moving rail 315, and when the assembly plate 330 is located on the upper part of the seating hole 313, it is located again under the assembly plate 330. The upper pressing plate 331 and the upper vacuum suction plate 332 are lowered and placed in contact with the upper surface of the transfer plate 5 seated in the seating hole 313, and the other side is moved upward by the rotation of the flip plate 310. When the inverted transfer plate 340 is moved backwards to remove the alignment plate 3, the lower pressing plate 341 and the lower vacuum suction plate 342 positioned under the transfer plate 340 are raised, and then the moving rail 315. moves backward along the , and when the transfer plate 340 is located on the upper part of the waiting hole 311, the lower pressing plate 341 and the lower vacuum suction plate 342 positioned under the transfer plate 340 are down again. The transfer plate 340 may be positioned in the waiting hole 311 .

In one embodiment of the present invention, the upper pressing plate 331 and the lower pressing plate 341 provided in the assembly plate 330 and the transfer plate 340 are vertically up/down, but the assembly plate 330 ) and the transfer plate 340 may be vertically up/down. In this case, the moving piece 353 is provided on the assembly plate 330 and the transfer plate 340 , and the flip plate 310 is mounted on the flip plate 310 . It is also possible that a fixing piece 351 is provided, or the assembly plate 330 and the transfer plate 340 are vertically up/down in the flip plate 310 in a cylindrical elevating and descending structure, and others. Various changes are possible.

On the other hand, each edge of the assembly plate 330 and the transfer plate 340 is provided with a shaft 360, the shaft 360 is operated in the vertical direction, each of the upper pressing plate 331 and the lower pressing plate 341. is made to press each edge.

With the structure as described above, between the upper vacuum suction plate 332 of the assembly plate 330 provided on one side of the flip plate 310 and the lower vacuum suction plate 342 of the transfer plate 340 provided on the lower side of the flip plate 310 . When the alignment plate 3 and the transfer plate 5 are seated and interposed, the shaft 360 provided in the assembly plate 330 operates vertically downward, and the lower end of each edge of the upper pressing plate 331 is the upper surface. is pressed, and the upper vacuum suction plate 332 presses and fixes the alignment plate 3 by the pressing of the upper pressing plate 331, and the shaft 360 provided on the transfer plate 340 is vertical in the upward direction. The upper end presses the lower surface of each edge of the lower pressure plate 341 , and the lower vacuum suction plate 342 presses and fixes the transfer plate 5 by the pressure of the lower pressure plate 341 .

On the other hand, a vibrator 370 is provided on the lower surface of the transfer plate 340 , and the flip plate 310 is rotated based on the central portion by driving the rotation motor 320 , so that one side of the flip plate 310 is rotated. When the transfer plate 340 provided in the lower part is inverted to be positioned on the other side, the vibrator 370 is positioned on the upper surface of the inverted transfer plate 340, and the flip plate 310 is rotated and assembled in this way. Although the positions of the plate 330 and the transfer plate 340 are reversed so that the alignment plate 3 interposed therebetween is located on the top of the transfer plate 5, the transfer plate 5 in the alignment plate 3 is reversed. ), some electronic components remaining in the alignment grooves 3a of the alignment plate 3 without naturally falling from the alignment plate 3 to the transfer plate 5 are transferred to the transfer plate 5 ) is located on the upper surface of the inverted transfer plate 340 in order to transfer it to the transfer hole 5a, and the alignment plate 3 vibrates in the alignment plate 3 by operating the vibrator 370 installed thereunder. causes

That is, the transfer plate 5 to which the alignment plate 3 and the transfer tape 7 having a bonded adhesive surface are attached on the seating hole 313 of the flip plate 310 is sequentially directed upward. After being seated and installed, the flip plate 310 is rotated by the rotation motor 320 so that the assembly plate 330 and the transfer plate 340 positioned on one side of the flip plate 310 and the lower part are located on the other side, below and above the flip plate 310 . When the assembly plate 330 and the transfer plate 340 are inverted up and down, the alignment plate 3 and the transfer plate 5 on the seating hole 313 of the flip plate 310 are sequentially directed downward. In addition to the electronic components that are inverted to be seated and installed and naturally fall from the alignment plate 3 to the transfer plate 5 and transferred, some remaining on the alignment plate 3 without being transferred from the alignment plate 3 to the transfer plate 5 A vibrator 370 for generating vibration in the alignment plate 3 is provided on each transfer plate 340 so that the electronic component is transferred to the transfer plate 5 .

Hereinafter, a transfer process through the electronic component transfer apparatus according to the present invention will be described.

First, the empty alignment plate 3 is seated and installed on the upper part of the vibrating device 200 through a transfer mechanism (not shown) provided in the electronic component loading device.

And, after supplying electronic components to the empty alignment plate 3 seated and installed on the upper surface of the vibrating device 200 through the supply unit 100 provided on the upper part of the vibrating device 200, the vibrating device 200 is driven. to vibrate for a predetermined time so that the electronic component is inserted into each alignment groove 3a formed in the empty alignment plate 3 .

In this way, after checking whether each electronic component is normally inserted into each alignment groove 3a of the alignment plate 3 by vibration through the vibrating device 200, each electronic component is placed in the alignment groove 3a through the transfer mechanism. ) and move the alignment plate (3) inserted into the transfer device.

At this time, after moving the transfer plate 340 located in the waiting hole 311 forward to the lower portion of the seating hole 313 formed on one side of the flip plate 310 of the transfer device, the upper portion of the transfer plate 340 is moved forward. The alignment plate 3 is seated and installed on the lower vacuum suction plate 342 integrally connected to the lower pressing plate 341 .

In this way, after the alignment plate 3 is seated and installed on the lower vacuum suction plate 342 provided on the transfer plate 340, a transfer mechanism having an adhesive surface bonded on the alignment plate 3 with a transfer mechanism. Assemble the transfer plate 5 to which the tape 7 is attached.

As described above, the transfer plate 340 is moved forward to the lower portion of the seating hole 313 formed on one side of the flip plate 310 , and is applied to the lower vacuum suction plate 342 provided in the transfer plate 340 . After assembling the alignment plate 3 and the transfer plate 5 on the alignment plate 3 , the assembly plate 330 located in the waiting hole 311 formed on one side of the flip plate 310 is seated. The hole 313 is moved forward so as to be located in the upper part.

At this time, when the assembly plate 330 moves forward after installing the alignment plate 3 and the transfer play in the seating hole 313 , first the upper pressing plate 331 and the upper vacuum suction plate positioned under the assembly plate 330 . After lifting 332, it is moved forward along the moving rail 315, and when the assembly plate 330 is located on the upper portion of the seating hole 313, the upper pressing plate located under the assembly plate 330 again ( 331) and the upper vacuum suction plate 332 are brought down and positioned so as to abut against the upper surface of the transfer plate 5 installed in the seating hole 313.

As described above, after the alignment plate 3 and the transfer plate 5 are installed between the assembly plate 330 and the transfer plate 340, the upper vacuum suction plate 332 and the transfer plate ( 340) by operating the lower vacuum suction plate 342 to vacuum the alignment plate 3 and the transfer plate 5, it is possible to prevent the movement of each plate.

In addition, by operating the shaft 360 provided at each edge of the assembly plate 330 and the transfer plate 340 to press each edge of the upper pressing plate 331 and the lower pressing plate 341, the alignment plate (3) and the assembly and coupling of the transfer plate 5 can be fixed.

In this way, the alignment plate 3 and the transfer plate 5 are seated and installed in the seating hole 313 formed through one side of the flip plate 310, and then the rotation motor 320 is driven to the flip plate 310. The assembly plate 330 and the transfer plate 340 are inverted up and down by rotating 180° with respect to the center.

That is, by driving the rotation motor 320 to rotate the flip plate 310 by 180°, the assembly plate 330 and the transfer plate 340 positioned on one side of the flip plate 310 and the lower side are located on the lower and upper sides of the flip plate 310 . The transfer plate 340 and the assembly plate 330 positioned on the upper and lower sides of the other side are inverted up and down so that they are positioned on the upper and lower sides of the other side.

For this reason, when the alignment plate 3 and the transfer plate 5 are sequentially assembled in the seating hole 313 on one side of the flip plate 310 in the upward direction, when the flip plate 310 rotates 180° The transfer plate 5 and the alignment plate 3 are reversed in a state in which they are sequentially positioned in the upward direction.

As described above, the electronic component inserted into the alignment groove 3a of the alignment plate 3 due to the inversion of the alignment plate 3 and the transfer plate 5 by the rotation of the flip plate 310 is transferred to the transfer plate. It falls naturally into the transfer hole 5a of (5) and is transferred.

That is, the rotation motor 320 is driven to rotate 180° with respect to the center of the flip plate 310 so that the assembly plate 330 and the transfer plate 340 provided on one side and the other side of the flip plate 310 are imaged. , by inverting the structure in which the alignment plate 3 and the transfer plate 5 are sequentially arranged in the upward direction to a structure in which the transfer plate 5 and the alignment plate 3 are sequentially arranged in the upward direction. The electronic component inserted into the alignment groove 3a of the alignment plate 3 is transferred to the transfer hole 5a of the transfer plate 5 .

At this time, the electronic component transferred to the transfer hole 5a of the transfer plate 5 is adhered to the adhesive surface of the transfer tape 7 attached to the transfer plate 5 .

Here, in order to transfer some electronic components remaining in the alignment plate 3 to the transfer plate 5 without being transferred from the alignment plate 3 to the transfer plate 5 despite the rotation of the flip plate 310 , By operating the vibrator 370 provided in the lower pressing plate 341 of the transfer plate 340, some electronic components remaining in the alignment groove 3a of the alignment plate 3 are transferred to the transfer hole ( 5a).

As described above, after transferring the electronic component from the alignment groove 3a of the alignment plate 3 to the transfer hole 5a of the transfer plate 5, the flip plate 310 is rotated from one side to the other side. The transfer plate 340 positioned on the other upper side of the flip plate 310 is moved backward, and the alignment plate 3 installed on the seating hole 313 is removed through the transfer mechanism.

Even at this time, the lower pressing plate 341 positioned under the transfer plate 340 when the alignment plate 3 is removed by moving the transfer plate 340 reversed to the upper side on the other side by the rotation of the flip plate 310 backwards. and the lower vacuum suction plate 342 is lifted up and then moved backward along the moving rail 315 , and when the transfer plate 340 is located above the waiting hole 311 , it is again located at the lower portion of the transfer plate 340 . The lower pressing plate 341 and the lower vacuum suction plate 342 are down to place the transfer plate 340 in the waiting hole 311 .

On the other hand, the transfer plate 340 is moved forward again to the transfer plate 5 from which the alignment plate 3 is removed, but the lower pressing plate 341 provided in the transfer plate 340 is lowered to the transfer plate 5 . After being positioned so as to contact the upper surface of the transfer plate 340, the lower vacuum suction plate 342 of the transfer plate 340 performs a pressing process on the upper surface of the transfer plate 5 for a certain time, or the lower vacuum of the transfer plate 340 The suction plate 342 comes into contact with the upper surface of the transfer plate 5 and performs a pressing process while moving forward and backward to insert electronic components and transfer tape 7 into each transfer hole 5a of the transfer plate 5 . It is also possible to improve the adhesion with the adhesive surface of the transfer plate 5, but after the transfer plate 5 from which the alignment plate 3 is removed moves to the post-process through the transfer mechanism, a roller is placed on the upper surface of the transfer plate 5 It is also possible to improve adhesion between the electronic component inserted into each transfer hole 5a of the transfer plate 5 and the adhesive surface of the transfer tape 7 by performing a pressing process through the transfer plate 5 .

In this way, the transfer plate 5 on which the transfer process is completed and the electronic components are transferred is transferred to the post process again through a transfer mechanism such as a gripper, and a multilayer ceramic capacitor (MLCC), an inductor, and a coil transferred to the post process. Electronic components that are handled in the form of chips of finished products, including (Coil), or electronic components used as unit device components before the chip of the finished product are mounted on the target product.

As described above, the assembly plate 330 and the transfer plate 340 provided on one side and the lower side of the flip plate 310 are inverted to the other side with respect to the center of the flip plate 310 to the upper and lower sides of the flip plate 310 . The electronic component of the alignment plate 3 is transferred to the transfer plate 5 so that the transfer plate 340 and the assembly plate 330 are positioned on the plate, and the transfer plate 5 to which the electronic component is transferred is removed and then rotated again. By driving the motor 320 to invert the transfer plate 340 and the assembly plate 330 of the flip plate 310 to one side, the assembly plate 330 and the transfer plate 340 are located on one side of the flip plate 310 on the upper and lower sides. ) is positioned, and then, by driving the rotation motor 320 such as installing the alignment plate 3 and the transfer plate 5 in which electronic components are aligned again, the flip plate 310 is repeatedly and continuously rotated while transferring carry out the process

As mentioned above, although the present invention has been shown and described in relation to specific embodiments, it is common knowledge in the art that various modifications and changes are possible without departing from the spirit and scope of the invention as set forth in the appended claims. Anyone who has it will know it easily.

1: electronic component loading device, 3: alignment plate,
3a: alignment groove, 5: transfer plate,
5a: transfer hole, 7: transfer tape,
100: supply unit, 200: vibration device,
300: electronic component transfer device, 310: flip plate,
311: waiting hole, 313: seating hole,
315: moving rail, 320: rotating motor,
330: assembly plate, 331: upper pressing plate,
332: upper vacuum suction plate, 333: suction groove,
333a: suction hole, 337: through hole,
337a: installation hole, 340: transfer plate,
341: lower pressing plate, 342: lower vacuum suction plate,
343: suction groove, 343a: suction hole,
345: rail piece, 347: through hole,
347a: installation hole, 350: moving part,
351: fixed piece, 353: mobile piece,
360: shaft, 370: vibrator.

Claims (8)

It is formed as a rectangular parallelepiped-shaped plate body, and a pair of moving rails are respectively protruded from both sides in the longitudinal direction on one side, the other side, and the lower surface of the transfer plate, and the electronic components aligned on the alignment plate are transferred to the transfer plate to which the tape is attached. a flip plate for transferring to;
a rotation motor connected to the central portion of one side of the flip plate to rotate and invert the flip plate;
an assembly plate provided on one upper part and the other lower part in the longitudinal direction of the flip plate based on the center of the flip plate connected to the rotation motor, and connected to the rail piece so as to be movable forward and backward on the moving rail of the flip plate; and
a transfer plate provided on one lower portion and the other upper portion of the flip plate in the longitudinal direction based on the central portion of the flip plate connected to the rotation motor, the transfer plate being connected to the rail piece so as to be movable forward and backward on the moving rail of the flip plate;
It is composed, including,
The assembling plate and the transfer plate are crossed symmetrically on the flip plate so that the assembly plate and the transfer plate are inverted and maintained in the same structure when the flip plate is rotated by the driving of a rotation motor,
At one side and the other side with respect to the center of the flip plate, waiting holes for waiting for the assembly plate and the transfer plate are respectively formed through, and the alignment plate and the transfer plate are installed at the ends of the flip plate spaced apart from the waiting hole by a predetermined distance. A seating hole is formed through the for-through, and the seating hole extends to both ends in the longitudinal direction of the flip plate and is opened in a "C" shape,
The assembly plate and the transfer plate move forward and backward between the seating hole and the waiting hole,
When the alignment plate and the transfer plate are installed on the flip plate, the transfer plate provided on one side of the lower part of the flip plate is moved forward from the waiting hole to the seating hole,
After the alignment plate and the transfer plate are installed on the flip plate, the assembly plate provided on one side of the flip plate is moved forward from the waiting hole to the seating hole,
After the flip plate is rotated and transferred, the assembly plate inverted to the upper part of the other side of the flip plate is moved backwards from the seating hole to the waiting hole to remove the alignment plate,
The assembly plate is sequentially provided with an upper pressure plate and an upper vacuum suction plate connected to the upper pressure plate, and the transfer plate is sequentially provided with a lower pressure plate and a lower vacuum suction plate connected to the lower pressure plate, the upper vacuum suction plate and the lower A plurality of suction grooves in the form of long slots are formed in the vacuum suction plate at regular intervals, and at least one suction hole is formed in each of the suction grooves to vacuum the alignment plate and the transfer plate interposed between the upper vacuum suction plate and the lower vacuum suction plate. made to adsorb,
A shaft is provided at each edge of the assembly plate and the transfer plate, and the shaft presses each edge of each of the upper and lower press plates to press and fix the alignment plate and the transfer plate interposed between the upper press plate and the lower press plate. Electronic component transfer device, characterized in that made to be.
The method according to claim 1,
Through-holes are formed in the center of the assembly plate and the transfer plate, respectively, and in the center of both sides of each of the through-holes, an "U"-shaped installation hole, the inside of which is opened, is formed to extend from the through-hole,
A moving part comprising a fixed piece and a moving piece connected to the side surface of the fixed piece and moved up/down in the vertical direction is installed in each of the installation holes, and the fixed piece of the moving unit is disposed on the assembly plate and the transfer plate close to the installation hole. connected to, and the moving piece is connected to the upper pressing plate and the lower pressing plate,
The electronic component transfer device, characterized in that when the moving piece is vertically up/down from the fixed piece, the upper and lower pressure plates are vertically up/down with respect to the assembly plate and the transfer plate.
The method according to claim 1,
A vibrator is provided on each of the transfer plates,
In the vibrator, the flip plate is rotated based on the center of the flip plate by the driving of the rotating motor, and the positions of the assembly plate and the transfer plate provided on one side and the lower side of the flip plate are reversed and interposed therebetween. In order to transfer some electronic components remaining in the alignment plate that are not transferred by falling from the alignment plate to the transfer plate and not transferred from the alignment plate to the transfer plate, in addition to the electronic components that are transferred from the alignment plate to the transfer plate by placing the alignment plate on the transfer plate. An electronic component transfer device, characterized in that the vibration is generated in the alignment plate.
Moving rails are respectively protruded from the upper surfaces of one side and the other side, and waiting holes are formed through each on one side and the other side based on the center thereof, and an alignment plate and a transfer plate are installed at the ends spaced apart from the waiting hole by a predetermined distance. a flip plate having a mounting hole formed therethrough for transferring the electronic components aligned on the alignment plate to the transfer plate; a rotation motor connected to the center of the flip plate to rotate and invert the flip plate; It is provided on one upper part and the other lower part of the flip plate in the longitudinal direction, it is connected to the moving rail of the flip plate by a rail piece to move forward and backward between the seating hole and the waiting hole, and an upper pressure plate and an upper vacuum suction plate are on the lower surface of the flip plate. an assembly plate provided with a shaft at each edge; and a lower portion of one side and an upper portion of the other side in the longitudinal direction of the flip plate, connected to the moving rail of the flip plate by a rail piece to move forward and backward between the seating hole and the waiting hole, and a lower pressing plate and a lower vacuum suction plate on the upper surface of the flip plate is provided, the shaft is provided at each edge, the transfer plate is provided with a vibrator; In the electronic component transfer process by the electronic component transfer device comprising a,
installing an alignment plate on the upper surface of the transfer plate using a transfer mechanism after moving the transfer plate waiting in the lower part of the waiting hole on one side of the flip plate forward to the lower part of the seating hole;
Assembling and installing a transfer plate to which a transfer tape having an adhesive surface is attached to an upper portion of the alignment plate using a transfer mechanism;
moving the assembly plate provided on one side of the upper part of the flip plate forward from the upper part of the waiting hole to the upper part of the seating hole;
Rotate the flip plate with a rotation motor, rotate the flip plate 180° with respect to the center of the assembly plate and the transfer plate up and down to invert the transfer plate to the lower part of the alignment plate. transferring to a transfer plate by dropping it;
moving the inverted transfer plate backward to the upper part of the other side of the flip plate;
removing the alignment plate installed on the upper portion of the transfer plate through the transfer mechanism; and
transferring the transfer plate to which the electronic components are transferred from the alignment plate to a post-process;
Including, but electronic component transfer process, characterized in that the above-described process is repeatedly and continuously performed.
5. The method according to claim 4,
After the step of moving the assembly plate provided on one upper side of the flip plate forward from the upper part of the waiting hole to the upper part of the seating hole
vacuum adsorbing the alignment plate and the transfer plate by operating the upper vacuum adsorption plate provided on the lower surface of the assembly plate and the lower vacuum adsorption plate provided on the upper surface of the transfer plate;
Electronic component transfer process, characterized in that it further comprises.
5. The method according to claim 4,
After the step of moving the assembly plate provided on one upper side of the flip plate forward from the upper part of the waiting hole to the upper part of the seating hole
operating shafts provided at respective edges of the assembly plate and the transfer plate in a vertical direction; and
fixing the alignment plate and the transfer plate by pressing respective edges of the upper and lower pressure plates by operating the shafts provided on the assembly plate and the transfer plate in a vertical direction;
Electronic component transfer process, characterized in that it further comprises.
5. The method according to claim 4,
After the step of transferring the electronic components of the alignment plate to the transfer plate by rotating the flip plate with the rotation motor to invert the assembly plate and the transfer plate up and down
operating a vibrator provided on the transfer plate;
generating vibration in the alignment plate by the operation of the vibrator; and
transferring some electronic components remaining in the alignment plate to the transfer plate by falling from the alignment plate to the transfer plate due to vibration of the alignment plate and not being transferred;
Electronic component transfer process, characterized in that it further comprises. delete

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