JP2003289197A - Method and device for arranging electronic component - Google Patents
Method and device for arranging electronic componentInfo
- Publication number
- JP2003289197A JP2003289197A JP2002090426A JP2002090426A JP2003289197A JP 2003289197 A JP2003289197 A JP 2003289197A JP 2002090426 A JP2002090426 A JP 2002090426A JP 2002090426 A JP2002090426 A JP 2002090426A JP 2003289197 A JP2003289197 A JP 2003289197A
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- Prior art keywords
- thickness
- upper plate
- lower plate
- electronic component
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品の整列方
法及び電子部品整列装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component aligning method and an electronic component aligning apparatus.
【０００２】[0002]
【従来の技術】図４は電子部品の斜視図でる。図８はサ
ーモモジュールの斜視図である。図８に示すサーモモジ
ュールは、上基板１２、下基板１３、複数の電子部品１
１により構成されるもので、電子部品のＷＴ面と、上基
板１２と下基板１３の電極パターン（不図示）が接続さ
れて成るものである。たとえば、上記サーモモジュール
の組み立て工程においては、直方体形状の電子部品を所
定の整列位置にならべる工程があるが、電子部品のＷＬ
面を下面にして整列するのが一般的である。従来、この
ような工程において、１．直方体形状の電子部品を１つ
ずつピンセットで上下面を合わせながら並べていた。
２．パーツフィーダーで直方体形状の電子部品を整列さ
せＰ＆Ｐユニットで一つずつ供給していた。３．振込プ
レートを用いて電子部品を振り込んだあと供給してい
た。2. Description of the Related Art FIG. 4 is a perspective view of an electronic component. FIG. 8 is a perspective view of the thermo module. The thermo module shown in FIG. 8 includes an upper substrate 12, a lower substrate 13, and a plurality of electronic components 1.
It is configured by connecting the WT surface of the electronic component and the electrode patterns (not shown) of the upper substrate 12 and the lower substrate 13 to each other. For example, in the process of assembling the thermo module, there is a process of arranging rectangular parallelepiped-shaped electronic components in a predetermined alignment position.
It is common to align with the face down. Conventionally, in such a process, 1. The rectangular parallelepiped electronic parts were arranged one by one using tweezers while aligning the upper and lower surfaces.
2. The parts feeder arranged the rectangular parallelepiped-shaped electronic parts and supplied them one by one with the P & P unit. 3. It was supplied after the electronic parts were transferred using the transfer plate.
【０００３】[0003]
【発明が解決しようとする課題】上記１の方法では、作
業者がピンセットにて１つずつ処理するため作業時間が
かかってしまう。また、電子部品にキズをつけてしまう
という問題があった。２の方法では、装置が高価な物に
なってしまいその割に生産性が低いという問題がある。
３の方法では、ＷＬ面またはＴＬ面を下面にして振込を
行うのが一般的で、その方法の場合ＷＴ面を下面にする
ため振込後一度向きを変更する作業または装置が必要と
なる。In the above method 1, it takes a long working time because the worker processes each by tweezers. In addition, there is a problem that the electronic parts are damaged. The second method has a problem that the apparatus becomes expensive and the productivity is low.
In the method No. 3, the transfer is generally performed with the WL surface or the TL surface being the lower surface, and in the case of the method, the work or apparatus for changing the orientation once after the transfer is required to make the WT surface the lower surface.
【０００４】本発明は、上記問題点を解決するものであ
り、電子部品などを効率よく整列させることが可能な電
子部品整列方法および電子部品整列装置を提供すること
を目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to provide an electronic component aligning method and an electronic component aligning apparatus which can align electronic components and the like efficiently.
【０００５】[0005]
【課題を解決するための手段】横Ｗ、厚みＴ、長さＬ
（ただしＷ≧Ｔ、Ｗ＜Ｌ）の直方体形状の電子部品を整
列させるための方法で、横Ｗ、厚みＴで規定されるＷＴ
面の対角寸法よりも大きく、横Ｗ、長さＬのＷＬ面の対
角寸法および厚みＴ、長さＬのＴＬ面の対角寸法より小
さい直径を有する円形の穴が所定の整列位置関係となる
ように複数個配設された上プレートと、横Ｗ、厚みＴよ
りそれぞれわずかに大きな寸法を有する正方形または長
方形の穴が所定の整列位置関係となるように複数個配設
された下プレートと、整列された電子部品を支持して搬
送させる搬送治具が配置された状態に組み合わせる工程
と、電子部品を上プレートから下プレートに振り込んで
搬送治具上に整列させる電子部品の整列方法とする。[Means for Solving the Problems] Side W, Thickness T, Length L
(However, W ≧ T, W <L) is a method for aligning rectangular parallelepiped-shaped electronic components, and WT defined by lateral W and thickness T
A circular hole having a diameter larger than the diagonal dimension of the surface and smaller than the diagonal dimension of the WL surface having the width W and the length L and the thickness T and the diagonal dimension of the TL surface having the length L has a predetermined alignment positional relationship. And a lower plate having a plurality of square or rectangular holes each having a size slightly larger than the width W and the thickness T in a predetermined alignment relationship. And a step of combining the aligned electronic components in a state in which a transportation jig for supporting and transporting the electronic components is arranged, and an electronic component alignment method for transferring the electronic components from the upper plate to the lower plate and aligning them on the transportation jig. To do.
【０００６】横Ｗ、厚みＴ、長さＬ（ただしＷ≧Ｔ、Ｗ
＜Ｌ）の直方体形状の電子部品を整列させるための装置
で、横Ｗ、厚みＴで規定されるＷＴ面の対角寸法よりも
大きく、横Ｗ、長さＬのＷＬ面の対角寸法および厚み
Ｔ、長さＬのＴＬ面の対角寸法より小さい直径を有する
円形の穴が所定の整列位置関係となるように複数個配設
された上プレートと、横Ｗ、厚みＴよりそれぞれわずか
に大きな寸法を有する正方形または長方形の穴が所定の
整列位置関係となるように複数個配設された下プレート
と、整列された電子部品を支持して搬送させる搬送治具
とを有し、電子部品を上プレートから下プレートに振り
込んで搬送治具上に整列させるための装置で、上プレー
トと下プレートの穴が重なり合う位置関係になるような
固定手段と、振り込まれた部品を支持して搬送する搬送
治具とを具備する電子部品整列装置とする。Width W, thickness T, length L (where W ≧ T, W
<L) A device for aligning rectangular parallelepiped-shaped electronic components, which is larger than a diagonal dimension of a WT plane defined by a lateral W and a thickness T, and a diagonal dimension of a WL plane having a lateral W and a length L and An upper plate in which a plurality of circular holes having a diameter smaller than the diagonal dimension of the TL surface having a thickness T and a length L are arranged so as to have a predetermined aligned positional relationship, and a width W and a thickness slightly smaller than the thickness T, respectively. The electronic component includes a lower plate in which a plurality of square or rectangular holes having large dimensions are arranged so as to have a predetermined alignment positional relationship, and a transportation jig that supports and transports the aligned electronic components. A device for transferring the parts from the upper plate to the lower plate and aligning them on the transfer jig. The fixing means that the holes of the upper plate and the lower plate overlap each other and the transferred parts are supported and transferred. Power supply equipped with a transfer jig And component alignment apparatus.
【０００７】上プレート及び、下プレートの厚みが電子
部品の長さＬと同等かまたは、それよりわずかに大きい
か小さい電子部品整列装置とする。The thickness of the upper plate and the lower plate is equal to the length L of the electronic component, or slightly larger or smaller than the length L of the electronic component.
【０００８】少なくとも、上プレートに供給された電子
部品を振動または揺動させることにより部品のＷＴ面が
上下面となるような姿勢で前記搬送治具上に整列させる
ための振動、揺動印加手段を備えている電子部品整列装
置とする。At least a vibration / swing applying means for aligning the electronic parts supplied to the upper plate on the carrying jig in such a posture that the WT surfaces of the parts are vertically arranged by vibrating or rocking the electronic parts. The electronic component aligning device is provided with.
【０００９】[0009]
【発明の実施の形態】図１は、本発明による電子部品整
列装置の斜視図、図２は平面図、図３は正面図の部分断
面図である。1 is a perspective view of an electronic component aligning apparatus according to the present invention, FIG. 2 is a plan view, and FIG. 3 is a partial sectional view of a front view.
【００１０】電子部品１１が振り込まれる穴Ｄ１が所定
の整列位置関係となるように多数個配設された上プレー
ト１と、上プレート１と同じピッチで穴Ｄ２が多数個配
設された上プレート下面側に配置された下プレート２
と、下プレート下面側に配置された搬送治具３と、振動
手段５、揺動手段６を備えている。An upper plate 1 in which a large number of holes D1 into which electronic parts 11 are inserted are arranged so as to have a predetermined alignment positional relationship, and an upper plate in which a plurality of holes D2 are arranged at the same pitch as the upper plate 1 Lower plate 2 arranged on the lower surface side
And a conveying jig 3 arranged on the lower plate lower surface side, a vibrating means 5, and a swinging means 6.
【００１１】電子部品１１は、その寸法が、横がＷ
（０．５ｍｍ）、厚みがＴ（０．５ｍｍ）、長さがＬ
（０．８ｍｍ）である。The size of the electronic component 11 is W on the side.
(0.5 mm), thickness T (0.5 mm), length L
(0.8 mm).
【００１２】上プレート１の厚みｔ１は、電子部品１１
の長さＬとほぼ同等に設定されている。電子部品１１が
振り込まれる穴Ｄ１は所定の整列位置関係となるように
設定されている。また下プレート２の厚みｔ２は、電子
部品１１の長さＬとほぼ同等に設定されている。電子部
品の振り込まれる正方形の穴Ｄ２は所定の整列位置関係
となるように設定されている。上プレート１、下プレー
ト２の厚みを電子部品１１の長さＬとほぼ同等に設定す
ることにより、振り込まれた電子部品１１が上プレート
上１の電子部品１１の動きを妨げることがなく振込の信
頼性を増している。上プレート１、下プレート２は樹脂
や金属で構成されている。また上プレート１、下プレー
ト２は、加工上特に問題無ければ、一体で製作してもか
まわない。The thickness t1 of the upper plate 1 is equal to the electronic component 11
Is set to be almost equal to the length L. The hole D1 into which the electronic component 11 is inserted is set to have a predetermined alignment positional relationship. The thickness t2 of the lower plate 2 is set to be substantially equal to the length L of the electronic component 11. The square holes D2 into which electronic components are transferred are set to have a predetermined alignment positional relationship. By setting the thicknesses of the upper plate 1 and the lower plate 2 to be substantially equal to the length L of the electronic component 11, the transferred electronic component 11 does not interfere with the movement of the electronic component 11 on the upper plate 1 and can be transferred. It is becoming more reliable. The upper plate 1 and the lower plate 2 are made of resin or metal. Further, the upper plate 1 and the lower plate 2 may be integrally manufactured as long as there is no particular problem in processing.
【００１３】上プレート１、下プレート２および搬送時
治具３の整列位置関係を確保するため、穴の空いていな
い場所に位置関係を確保した基準穴１ａ、２ａ、３ａを
それぞれ２カ所ずつ設け、電子部品整列装置にガイドピ
ン４を２本設けることでそれぞれの整列位置関係を確保
している。In order to secure the alignment positional relationship among the upper plate 1, the lower plate 2 and the carrying jig 3, two reference holes 1a, 2a and 3a each having a positional relationship are provided in places where there are no holes. By providing two guide pins 4 in the electronic component aligning device, the alignment positional relationship between the guide pins 4 is secured.
【００１４】上記発明の実施形態の電子部品整列装置に
おいては、上プレート１に電子部品を供給して振動手段
５、揺動手段６により振動、揺動を電子部品に印加する
ことにより上プレート１のＷＴ面の対角寸法よりも大き
くＷＬ面、ＴＬ面の対角寸法より小さい直径を有する円
形の穴Ｄ１にＷＴ面を下面にして振り込ませることがで
きる。In the electronic component aligning apparatus of the above-described embodiment of the present invention, the electronic components are supplied to the upper plate 1 and the vibrating means 5 and the swinging means 6 apply vibration and swing to the electronic components. The WT surface can be inserted into the circular hole D1 having a diameter larger than the diagonal dimension of the WT surface and smaller than the diagonal dimension of the TL surface with the WT surface as the lower surface.
【００１５】図５は本発明の実施の形態の一つにおいて
上プレート１の穴Ｄ１、下プレート２の穴Ｄ２に電子部
品１１を振り込む状態を示す断面図である。図６は本発
明の実施の形態の一つにおいて上プレート１の穴Ｄ１に
電子部品１１が振り込まれた状態を示す平面図である。
図７は本発明の実施の形態の一つにおいて下プレート２
の穴Ｄ２に部品が振り込まれた状態を示す平面図であ
る。振動、揺動を継続させることにより、上プレート１
の円形の穴Ｄ１に振り込まれた電子部品１１は穴の側面
をガイドに回転を始める。回転を始めた電子部品１１は
下プレートの横Ｗ、厚みＴよりもわずかに大きな寸法を
持つ角穴Ｄ２と角度が一致したとき下プレートの角穴に
振り込まれる。まず上プレート１で電子部品をＷＴ面を
下面にして振り込ませることにより、下プレート２への
振込、搬送治具３への所定の整列位置関係での整列を確
実なものにしている。FIG. 5 is a sectional view showing a state in which the electronic component 11 is fed into the hole D1 of the upper plate 1 and the hole D2 of the lower plate 2 in one of the embodiments of the present invention. FIG. 6 is a plan view showing a state in which the electronic component 11 is inserted into the hole D1 of the upper plate 1 in one of the embodiments of the present invention.
FIG. 7 shows a lower plate 2 according to one embodiment of the present invention.
It is a top view which shows the state in which the components were transferred in the hole D2. By continuing the vibration and swing, the upper plate 1
The electronic component 11 transferred into the circular hole D1 starts rotating with the side surface of the hole as a guide. The electronic component 11 that has started to rotate is thrown into the square hole of the lower plate when the angle coincides with the square hole D2 having a dimension slightly larger than the width W and the thickness T of the lower plate. First, the upper plate 1 is used to transfer the electronic components with the WT surface facing down, so that the transfer to the lower plate 2 and the alignment to the transport jig 3 in a predetermined alignment positional relationship are ensured.
【００１６】[0016]
【発明の効果】本発明の電子部品の整列方法によれば、
上プレートの穴から下プレートの穴と順番に構成してい
るので、電子部品が安定した姿勢で振り込まれるため結
果的に確実に電子部品を整列できた。According to the method of aligning electronic components of the present invention,
Since the holes of the upper plate and the holes of the lower plate are formed in order, the electronic components are transferred in a stable posture, and as a result, the electronic components can be reliably aligned.
【００１７】本発明の電子部品整列装置によれば、上プ
レートのＷＴ面の対角寸法よりも大きく、ＷＬ面、ＴＬ
面の対角寸法よりも小さな寸法を有する穴Ｄ１の重心を
下プレートのＷ、Ｔ寸法よりもそれぞれわずかに大きな
寸法を持つ正方形又は、長方形の穴Ｄ２の重心が一致す
るように配設されかつ搬送治具３を備えた部品整列装置
を用いることにより、請求項１の部品整列方法を確実に
実施することが可能になり、所定の整列位置関係で効率
良く整列させることが可能となる。According to the electronic component aligning device of the present invention, the diagonal dimension of the WT surface of the upper plate is larger than that of the WL surface, and the TL surface is TL.
The center of gravity of the hole D1 having a dimension smaller than the diagonal dimension of the surface is arranged so that the center of gravity of a square or rectangular hole D2 having a dimension slightly larger than the W and T dimensions of the lower plate coincides with each other, and By using the component aligning device provided with the transfer jig 3, the component aligning method according to the first aspect can be reliably performed, and the components can be efficiently aligned in a predetermined alignment positional relationship.
【００１８】また、振動手段、揺動手段を備えたことに
より短時間で整列可能となり作業時間の短縮になった。Further, since the vibrating means and the swinging means are provided, the alignment can be performed in a short time, and the working time is shortened.
【００１９】直径が、ＷＴ面の対角寸法よりも大きく、
ＷＬ面及びＴＬ面の対角寸法よりも小さい上プレート１
の穴Ｄ１は、確実にＷＴ面を上下面として振込が行え、
Ｗ、Ｔそれぞれよりわずかに大きな寸法を有する正方形
または長方形の穴Ｄ２の空いた下プレート２に確実に振
り込んで部品を支持、搬送治具上に所定のピッチ、向き
で整列させることが可能となる。The diameter is larger than the diagonal dimension of the WT surface,
Upper plate 1 smaller than the diagonal dimensions of the WL and TL planes
Hole D1 can be transferred with the WT surface as the upper and lower surfaces,
It becomes possible to reliably transfer the components to the lower plate 2 having a square or rectangular hole D2 having a size slightly larger than each of W and T to support the components and to align them on the transport jig at a predetermined pitch and orientation. .
【００２０】上プレート１の厚み方向の寸法ｔ１およ
び、下プレート２の厚み方向の寸法ｔ２を電子部品の高
さＬ寸法と同等か、またはそれより多少大きいか、小さ
くすることにより電子部品が上プレート１上を自由に移
動して振込の確実性を上げることができる。The thickness t1 of the upper plate 1 in the thickness direction and the thickness t2 of the lower plate 2 in the thickness direction are made equal to, slightly larger or smaller than the height L of the electronic component, so that the electronic component is raised. It is possible to freely move on the plate 1 and increase the reliability of the transfer.
【００２１】上プレート１で所定のピッチで、ＷＴ面を
上下面にさせる整列を行い下プレート２上面で振動また
は揺動で電子部品に回転を加えながら、下プレート２の
正方形または長方形の方向を合わせて搬送治具３に整列
させることが可能となる。The upper plate 1 is aligned at a predetermined pitch such that the WT surfaces are the upper and lower surfaces, and the square or rectangular direction of the lower plate 2 is changed while the electronic components are rotated by vibration or swing on the upper surface of the lower plate 2. It is also possible to align them on the transfer jig 3.
【図１】本発明の実施の形態の一つを説明するための斜
視図。FIG. 1 is a perspective view for explaining one of the embodiments of the present invention.
【図２】本発明の実施の形態の一つを説明するための平
面図。FIG. 2 is a plan view for explaining one of the embodiments of the present invention.
【図３】本発明の実施の形態の一つを説明するための正
面図。FIG. 3 is a front view for explaining one of the embodiments of the present invention.
【図４】電子部品の斜視図。FIG. 4 is a perspective view of an electronic component.
【図５】本発明の実施の形態の一つにおいて上プレート
１の穴Ｄ１、下プレート２の穴Ｄ２に電子部品を振り込
む状態を示す断面図。FIG. 5 is a cross-sectional view showing a state where electronic components are fed into the hole D1 of the upper plate 1 and the hole D2 of the lower plate 2 in one of the embodiments of the present invention.
【図６】本発明の実施の形態の一つにおいて上プレート
１の穴Ｄ１に電子部品が振り込まれた状態を示す平面
図。FIG. 6 is a plan view showing a state in which an electronic component is placed in a hole D1 of an upper plate 1 according to one of the embodiments of the present invention.
【図７】本発明の実施の形態の一つにおいて下プレート
２の穴Ｄ２に電子部品が振り込まれた状態を示す平面
図。FIG. 7 is a plan view showing a state in which an electronic component is placed in a hole D2 of the lower plate 2 according to one of the embodiments of the present invention.
【図８】サーモモジュールの斜視図。FIG. 8 is a perspective view of a thermo module.
【符号の説明】 １ 上プレート ２ 下プレート ３ 搬送治具 ４ プレート固定手段 ５ 振動手段 ６ 揺動手段 １１ 電子部品 １２ 上基板 １３ 下基板 Ｌ 電子部品の長さ Ｔ 電子部品の厚み Ｗ 電子部品の幅 Ｄ１ 上プレートの穴 Ｄ２ 下プレートの穴 ｔ１ 上プレートの厚み ｔ２ 下プレートの厚み[Explanation of symbols] 1 Upper plate 2 Lower plate 3 Transfer jig 4 Plate fixing means 5 Vibration means 6 Swinging means 11 electronic components 12 Upper substrate 13 Lower substrate L Electronic component length Thickness of electronic components W Electronic component width D1 Upper plate hole D2 Lower plate hole t1 Upper plate thickness t2 Lower plate thickness
Claims (4)
Ｗ＜Ｌ）の直方体形状の電子部品を整列させるための方
法で、横Ｗ、厚みＴで規定されるＷＴ面の対角寸法より
も大きく、横Ｗ、長さＬのＷＬ面の対角寸法および厚み
Ｔ、長さＬのＴＬ面の対角寸法より小さい直径を有する
円形の穴が所定の整列位置関係となるように複数個配設
された上プレートと、横Ｗ、厚みＴよりそれぞれわずか
に大きな寸法を有する正方形または長方形の穴が所定の
整列位置関係となるように複数個配設された下プレート
と、整列された電子部品を支持して搬送させる搬送治具
が配置された状態に組み合わせる工程と、電子部品を上
プレートから下プレートに振り込んで搬送治具上に整列
させることを特徴とする電子部品の整列方法。1. A lateral W, a thickness T, and a length L (where W ≧ T,
W <L) is a method for aligning rectangular parallelepiped electronic components and is larger than the diagonal dimension of the WT plane defined by the lateral W and the thickness T, and the diagonal dimension of the WL plane having the lateral W and the length L. And an upper plate having a plurality of circular holes each having a diameter smaller than the diagonal dimension of the TL surface having a thickness T and a length L arranged in a predetermined aligned positional relationship, and a width W and a thickness slightly less than the thickness T, respectively. In the state in which a lower plate in which a plurality of square or rectangular holes having a large size are arranged in a predetermined alignment position and a transfer jig for supporting and transferring the aligned electronic components are arranged. A method of aligning electronic parts, which comprises a step of combining and electronic parts are transferred from an upper plate to a lower plate and aligned on a transfer jig.
Ｗ＜Ｌ）の直方体形状の電子部品を整列させるための装
置で、横Ｗ、厚みＴで規定されるＷＴ面の対角寸法より
も大きく、横Ｗ、長さＬのＷＬ面の対角寸法および厚み
Ｔ、長さＬのＴＬ面の対角寸法より小さい直径を有する
円形の穴が所定の整列位置関係となるように複数個配設
された上プレートと、横Ｗ、厚みＴよりそれぞれわずか
に大きな寸法を有する正方形または長方形の穴が所定の
整列位置関係となるように複数個配設された下プレート
と、整列された電子部品を支持して搬送させる搬送治具
とを有し、電子部品を上プレートから下プレートに振り
込んで搬送治具上に整列させるための装置で、上プレー
トと下プレートの穴が重なり合う位置関係になるような
固定手段と、振り込まれた部品を支持して搬送する搬送
治具とを具備することを特徴とする電子部品整列装置。2. A lateral W, a thickness T, and a length L (where W ≧ T,
(W <L) A device for aligning rectangular parallelepiped-shaped electronic components, which is larger than the diagonal dimension of the WT plane defined by the lateral W and thickness T and is the diagonal dimension of the WL plane of lateral W and length L. And an upper plate having a plurality of circular holes each having a diameter smaller than the diagonal dimension of the TL surface having a thickness T and a length L arranged in a predetermined aligned positional relationship, and a width W and a thickness slightly less than the thickness T, respectively. A lower plate in which a plurality of square or rectangular holes having a large dimension are arranged so as to have a predetermined alignment positional relationship, and a transportation jig that supports and transports the aligned electronic components. A device for transferring parts from the upper plate to the lower plate and aligning them on the transfer jig.A fixing means that positions the holes of the upper plate and the lower plate so that they overlap each other, and supports the transferred parts for transfer. And a carrying jig Electronic component alignment apparatus according to claim and.
子部品の長さＬと同等かまたは、それよりわずかに大き
いか小さいことを特徴とする請求項２記載の電子部品整
列装置。3. The electronic component aligning device according to claim 2, wherein the thicknesses of the upper plate and the lower plate are equal to or slightly larger or smaller than the length L of the electronic component.
子部品を振動または揺動させることにより部品のＷＴ面
が上下面となるような姿勢で前記搬送治具上に整列させ
るための振動手段、揺動手段を備えていることを特徴と
する請求項２又は３記載の電子部品整列装置。4. A vibrating means for arranging at least the electronic parts supplied to the upper plate on the carrying jig in a posture such that the WT surfaces of the parts become upper and lower surfaces by vibrating or rocking the electronic parts. 4. The electronic component aligning device according to claim 2, further comprising moving means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002090426A JP4324342B2 (en) | 2002-03-28 | 2002-03-28 | Electronic component alignment method and electronic component alignment apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002090426A JP4324342B2 (en) | 2002-03-28 | 2002-03-28 | Electronic component alignment method and electronic component alignment apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003289197A true JP2003289197A (en) | 2003-10-10 |
| JP4324342B2 JP4324342B2 (en) | 2009-09-02 |
Family
ID=29235740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002090426A Expired - Fee Related JP4324342B2 (en) | 2002-03-28 | 2002-03-28 | Electronic component alignment method and electronic component alignment apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4324342B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100975917B1 (en) * | 2008-03-17 | 2010-08-13 | 삼성전기주식회사 | Electronic parts array apparatus |
| JP2015096433A (en) * | 2013-11-15 | 2015-05-21 | 株式会社ウエステック | Pallet for part alignment and production method thereof |
| CN107444886A (en) * | 2017-08-04 | 2017-12-08 | 滁州爱沃富光电科技有限公司 | A kind of Novel mortice balance equipment |
| CN108116848A (en) * | 2016-11-28 | 2018-06-05 | 镇江市丹徒区荣炳欣荣机械厂 | A kind of rivet transports conveying device |
| JP2021054572A (en) * | 2019-09-28 | 2021-04-08 | 太陽誘電株式会社 | Parts aligner, parts-aligning plate and method of manufacturing parts-aligning plate |
| KR102272610B1 (en) * | 2020-11-27 | 2021-07-05 | (주)삼정오토메이션 | Transfer apparatus of electronic component and transfer process thereof |
| WO2022186542A1 (en) * | 2021-03-04 | 2022-09-09 | 삼성전자 주식회사 | Multi-layer ceramic capacitor supply apparatus |
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2002
- 2002-03-28 JP JP2002090426A patent/JP4324342B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100975917B1 (en) * | 2008-03-17 | 2010-08-13 | 삼성전기주식회사 | Electronic parts array apparatus |
| JP2015096433A (en) * | 2013-11-15 | 2015-05-21 | 株式会社ウエステック | Pallet for part alignment and production method thereof |
| CN108116848A (en) * | 2016-11-28 | 2018-06-05 | 镇江市丹徒区荣炳欣荣机械厂 | A kind of rivet transports conveying device |
| CN108116848B (en) * | 2016-11-28 | 2021-07-13 | 镇江市丹徒区荣炳欣荣机械厂 | Rivet transferring and conveying device |
| CN107444886A (en) * | 2017-08-04 | 2017-12-08 | 滁州爱沃富光电科技有限公司 | A kind of Novel mortice balance equipment |
| JP2021054572A (en) * | 2019-09-28 | 2021-04-08 | 太陽誘電株式会社 | Parts aligner, parts-aligning plate and method of manufacturing parts-aligning plate |
| JP7385413B2 (en) | 2019-09-28 | 2023-11-22 | 太陽誘電株式会社 | Component alignment device, component alignment plate, and manufacturing method of component alignment plate |
| KR102272610B1 (en) * | 2020-11-27 | 2021-07-05 | (주)삼정오토메이션 | Transfer apparatus of electronic component and transfer process thereof |
| WO2022186542A1 (en) * | 2021-03-04 | 2022-09-09 | 삼성전자 주식회사 | Multi-layer ceramic capacitor supply apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4324342B2 (en) | 2009-09-02 |
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