JPH0258300A - Device for mounting parts on circuit board - Google Patents

Device for mounting parts on circuit board

Info

Publication number
JPH0258300A
JPH0258300A JP63208898A JP20889888A JPH0258300A JP H0258300 A JPH0258300 A JP H0258300A JP 63208898 A JP63208898 A JP 63208898A JP 20889888 A JP20889888 A JP 20889888A JP H0258300 A JPH0258300 A JP H0258300A
Authority
JP
Japan
Prior art keywords
circuit board
area
positioning
parts
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63208898A
Other languages
Japanese (ja)
Inventor
Junichi Sato
純一 佐藤
Yasuaki Sakano
坂野 保昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP63208898A priority Critical patent/JPH0258300A/en
Publication of JPH0258300A publication Critical patent/JPH0258300A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To position a circuit board to a plurality of positions by using the same reference section for positioning so that the need of an excessive space for positioning can be eliminated from the circuit board by positioning the circuit board by using the same reference section for positioning when parts are mounted in an area of the circuit board after another parts are mounted in another area of the circuit board. CONSTITUTION:With a device by which parts are mounted in a prescribed area of a circuit board 1 after the circuit board 1 is positioned on a conveyor 7, the circuit board 1 is positioned by using the same reference section for positioning when parts are mounted in an area B after another parts are mounted in another area A. For example, a pair of reference holes are formed in the side section of the area A of the circuit board 1 and a pair of positioning pins 5 are provided to the locations corresponding to the reference holes of a positioning jig 4. After the circuit board 1 is first positioned so that the area A can be brought into a mounting area and the parts are mounted in the area A, the positioning jig 4 is moved rightward by a distance l by means of a drive cylinder 8 so that the area B of the circuit board 1 can be brought into the mounting area and the parts are mounted in the area B.

Description

【発明の詳細な説明】 [産業上の利用分野1 本発明は大版サイズの回路基板に複数個のエリアに分け
て部品を実装する回路基板への部品ltc着vcfff
iに関するものである。
[Detailed Description of the Invention] [Industrial Application Field 1] The present invention is a method for attaching parts to a circuit board (LTC vcfff) in which parts are mounted on a large-sized circuit board in a plurality of areas.
It is related to i.

[従来の技術]、− 近年、大版サイズの回路基板を用いられる傾向゛にある
が、回路基板に部品を装着する部品自動装着機は従来の
比較的小さいサイズの回路基板の大きさのエリアに実装
できるものしかない(大きなエリアに実装できるものに
するためには大幅の設備変更を要して設備投資が多大に
なる)、このため大版サイズの回路基板を複数個のエリ
アに分けて部品を実装する必要がある。
[Prior art] - In recent years, there has been a trend toward using large-sized circuit boards, but automatic component mounting machines that mount components on circuit boards have an area the size of conventional relatively small circuit boards. (In order to make it possible to mount it in a large area, a large amount of equipment changes are required and a large amount of capital investment is required.) Therefore, a large-sized circuit board is divided into multiple areas. It is necessary to mount the parts.

従来、大版サイズの回路基板を複数個のエリアに分けて
部品を実装するものとして例えば特開昭63−7359
0号公報に示されるものが提供されている。かかる従来
例のものは第7図、第8図に示すように回路基板aに第
1の基準孔す、b’ と第2の基準孔e、C’ を設け
てあり、まず部品実装部dに搬送してきた回路基板aの
第1の基準孔す、b’ と位置決めビンeとを合致させ
、位置決めビンeを第1の基準孔す、b’に挿入して回
路基板aを位置決めし、第7図(s)の左下がりの斜線
で示すエリアrに部品自動装着機のヘッドgにて実装し
、次いで回路基板aを少し搬送してtI42の基準孔e
、e’ と位置決めビンeとを合致させ、位置決めビン
eを第2の基準孔e、e’に挿入して回路基板aを位置
決めし、第7図(b)の右下がりの斜線で示すエリアi
に部品が実装されるようになっている。
Conventionally, as a method for mounting components on a large-sized circuit board by dividing it into multiple areas, for example, Japanese Patent Laid-Open No. 63-7359
What is shown in Publication No. 0 is provided. In such a conventional example, as shown in FIGS. 7 and 8, first reference holes b' and second reference holes e and C' are provided in the circuit board a, and the component mounting area d is first provided. Align the first reference holes, b', of the circuit board a, which has been transported to The head g of the automatic component mounting machine is used to mount the circuit board in the area r indicated by diagonal lines downward to the left in FIG.
, e' and the positioning pin e, and insert the positioning pin e into the second reference holes e and e' to position the circuit board a, and move the area shown by diagonal lines downward to the right in FIG. 7(b). i
Parts are now being implemented.

[発明が解決しようとする課題] ところが、上記従来例では回路基板を2位置に位置決め
するのに第1の基準孔と第2の基準孔を設けなければな
らなく、多くの基準孔を設けなければならなくて回路基
板に余分なスペースを要するという問題があり、また必
要な基準孔を形成できない大きさや形状の回路基板には
不向きであるという問題がある。
[Problems to be Solved by the Invention] However, in the conventional example described above, a first reference hole and a second reference hole must be provided to position the circuit board at two positions, and many reference holes must be provided. Therefore, there is a problem that extra space is required on the circuit board, and there is also a problem that it is not suitable for circuit boards whose size and shape do not allow the formation of necessary reference holes.

本発明は叙述の点に鑑みてなされたものであって、本発
明の目的とするところは同一の位置決め基学部を用いて
回路基板を複数の位置に位置決めできて回路基板に位置
決めのための余分なスペースを安したりしない回路基板
への部品装着gciを提供するにある。
The present invention has been made in view of the above points, and an object of the present invention is to be able to position a circuit board at a plurality of positions using the same positioning base part, and to provide an extra space for positioning the circuit board. The purpose of the present invention is to provide a GCI for mounting components onto a circuit board without wasting space.

[課題を解決するための手段J 上記目的を達成するため本発明回路基板への部品装着装
置は、回路基板の一部分に部品を装着した後、他の部分
に部品を装着する際、同一の位置決め基準部を用いて位
置決めを行なうようにした。
[Means for Solving the Problems J] In order to achieve the above object, the device for mounting components onto a circuit board of the present invention is provided such that after mounting a component on one part of the circuit board, when mounting the component on another part, the same positioning is performed. Positioning is performed using a reference part.

1作用] 同一の位置決め基準部を用いて回路基板を複数の位置に
位置決めできて従来のように多(の位置決め基準部を設
ける必要がなくなった。
1 Effect] The circuit board can be positioned at a plurality of positions using the same positioning reference part, and there is no need to provide multiple positioning reference parts as in the past.

[実施例1 第1図は回路基板1に部品を装着する部分を示すもので
あり、フィーダ2の部品をヘッド3にて回路基板1に実
装するようになっている。4は位置決め治具であって、
位置決めビン5を基準孔6に挿入して回路基板1の位置
決めができるようになっている。第1図(a)の右下が
9の斜線で示rエリアXが部品供給エリアであり、クロ
ス斜線で示すエリアY(NXw)が部品を装着する実装
エリアであり、エリアX、Yはヘッド3が移動するエリ
アである。
[Embodiment 1] FIG. 1 shows a part where components are mounted on a circuit board 1, and components from a feeder 2 are mounted onto the circuit board 1 using a head 3. 4 is a positioning jig,
The circuit board 1 can be positioned by inserting a positioning pin 5 into a reference hole 6. Area X shown by the diagonal line 9 in the lower right of Figure 1 (a) is the component supply area, area Y (NXw) shown by the cross diagonal line is the mounting area where components are mounted, and areas X and Y are the head 3 is the area to move to.

第2図は位置決め基準部として基準孔6を設けた実施例
を示す0回路基@1は幅が―で長さは2rまたは21以
上であり、符号Aで示す領域と符号Bで示す領域とに分
けて部品が装着されるようになっている。回路基板1の
符号A″C示す領域の側部には一対の基準孔6を穿孔し
である0位置決め治具4には上記基準孔6と対応するよ
うに一対の位置決めビン5を設けである、この位置決め
治具4はコンベア7の搬送方向と平行に駆動シリング8
にて往復移動できるよ)になっている。しかして最初駆
動シリング8にて位置決め治具4が第2図の左側に位置
しており、コンベア7で回路基板1が第2図の矢印イ方
向に搬送されてきて回路基板1の符号Aで示す領域が位
置決め治具4のある位置にきたとき、tI42図(、)
に示すように位置決めビン5が基準孔6に挿入されて実
装エリアに符号Aで示す領域が位置するように回路基板
1が位置決めされ、回路基板1の符号Aに示す領域に部
品が実装され、次いで駆動シリング8で位置決め治具4
が第2図矢印口に示すように右側に2の距離移動させら
れ、第2図(b)に示すように回路基板1の符号Bで示
す領域が実装エリアに位置するように位置決めされ、符
号Bで示す領域に部品が実装され、位置決めビン5が基
準孔6がら抜かれ、位置決め治具4が駆動シリング8で
最初の位置に戻り、上記同様に次の回路基板1に部品を
実装する。このようにして回路基板1の符号Aで示す領
域も符号Bで示す領域も同一の基準孔6を用いて実装エ
リアに位置決めでき、符号Bで示す領域に基準孔6を要
しない。
FIG. 2 shows an embodiment in which a reference hole 6 is provided as a positioning reference part. The 0 circuit board @1 has a width of - and a length of 2r or 21 or more, and has an area indicated by A and an area indicated by B. The parts are installed separately. A pair of reference holes 6 are bored in the side of the area indicated by the symbol A''C of the circuit board 1, and a pair of positioning pins 5 are provided in the positioning jig 4 so as to correspond to the reference holes 6. , this positioning jig 4 is driven by a driving sill 8 parallel to the conveying direction of the conveyor 7.
You can go there and back.) Initially, the positioning jig 4 is located on the left side of FIG. 2 by the driving sill 8, and the circuit board 1 is conveyed by the conveyor 7 in the direction of arrow A in FIG. When the area shown is at the position of the positioning jig 4, Figure tI42 (,)
As shown in the figure, the positioning bin 5 is inserted into the reference hole 6, the circuit board 1 is positioned so that the area indicated by the symbol A is located in the mounting area, and the component is mounted in the area indicated by the symbol A of the circuit board 1. Next, the positioning jig 4 is moved by the driving sill 8.
is moved to the right by a distance of 2 as shown by the arrow in FIG. 2, and as shown in FIG. The component is mounted in the area indicated by B, the positioning bin 5 is removed from the reference hole 6, the positioning jig 4 is returned to the initial position by the driving sill 8, and the component is mounted on the next circuit board 1 in the same manner as described above. In this way, both the region A and the region B of the circuit board 1 can be positioned in the mounting area using the same reference hole 6, and the region B does not require the reference hole 6.

第3図、第4図は回路基板1の外形を位置決め基準部と
したものである。この場合回路基板1の搬送方向側の端
縁が位置決め基準部となる基準端縁9となっている。コ
ンベア7の搬送経路には第1位置決めストッパー10と
第2位置決めストンバー11とを上下動自在に設けてあ
り、第1位置決めストッパー10の近傍に第1センサー
12を設けると共に第2位置決めストッパー11の近傍
にPt52センサー13を設けである。また実装エリア
の近傍にはクランプ14を設けである。しかして回路基
板1が矢印イ方向に搬送されてくると、上に突出して第
1位置決めストッパー10に回路基板1の基準端縁9が
当たって回路基板1が位置決めされ、クランプ14でク
ランプされて実装エリアと回路基板1の符号へで示す領
域とが合致して符号へで示す領域に部品が実装される6
次いで1位置決めストッパー10が下降すると共にクラ
ンプが解除されて回路基板1が搬送され、上に突出した
第2位置決めストッパー11に基準端縁9が当たって回
路基板1が位置決めされ、クランプ14でクランプされ
て実装エリアと符号Bで示す領域とが合致して符号Bで
示す領域に部品が実装さバ、$2位置決めストッパー1
1が下降すると共にクランプが解除されて部品を実装し
て回路基板1が搬出される。この動作タイミングを第5
図により詳しく説明すると次の通りである1回路故板1
が搬送されてきて時開L1になると第1センサー12が
回路基板1を検知してオンになり、第1センサー12が
オンになることによりクランプ】4がオンになり、コン
ベア7がオフになり、またクランプ14がオンになると
符号Aで示す領域への実装がオンになる。符号Aで示す
領域への実装を終えて時開t2になると、実装がオフさ
れてクランプ14がオフされ、第1位置決めストッパー
11がダウンすると共にコンベア7がオンになり、回路
基板1が搬送される0回路基板】が一定距離搬送されて
時間り、になると回路基板1を第2センサー13が検知
して第2センサー13がオンになってクランプ14がオ
ンになり、コンベア7がオフになり、また符号Bで示す
領域への実装がオンになる。符号Bで示す領域への実装
を終えて時間り。
3 and 4, the outer shape of the circuit board 1 is used as a positioning reference portion. In this case, the edge of the circuit board 1 on the transport direction side serves as a reference edge 9 serving as a positioning reference portion. A first positioning stopper 10 and a second positioning stopper 11 are provided on the conveyance path of the conveyor 7 so as to be movable up and down. A Pt52 sensor 13 is provided at the top. A clamp 14 is also provided near the mounting area. When the circuit board 1 is conveyed in the direction of arrow A, it protrudes upward and the reference edge 9 of the circuit board 1 hits the first positioning stopper 10, positioning the circuit board 1 and clamping it with the clamp 14. The mounting area and the area shown by the symbol 1 on the circuit board 1 match, and the component is mounted in the area shown by the symbol 6.
Next, the first positioning stopper 10 is lowered, the clamp is released, and the circuit board 1 is transported, the reference edge 9 hits the second positioning stopper 11 that protrudes upward, the circuit board 1 is positioned, and the circuit board 1 is clamped by the clamp 14. The mounting area and the area indicated by symbol B match and the component is mounted in the area indicated by symbol B. $2 Positioning stopper 1
1 is lowered, the clamps are released, and the circuit board 1 is carried out with components mounted thereon. This operation timing is set as
To explain in detail with the diagram, it is as follows: 1 circuit failure board 1
When it is conveyed and the time opens L1, the first sensor 12 detects the circuit board 1 and turns on, and as the first sensor 12 turns on, the clamp 4 turns on, and the conveyor 7 turns off. , and when the clamp 14 is turned on, mounting in the area indicated by symbol A is turned on. When the mounting in the area indicated by the symbol A is completed and the time opens t2, the mounting is turned off, the clamp 14 is turned off, the first positioning stopper 11 is lowered, and the conveyor 7 is turned on, and the circuit board 1 is transported. When the circuit board 1 is conveyed a certain distance and a certain amount of time elapses, the second sensor 13 detects the circuit board 1, turns on the second sensor 13, turns on the clamp 14, and turns off the conveyor 7. , and the implementation in the area indicated by symbol B is turned on. It's been a while since I finished the implementation in the area indicated by code B.

になると、実装がオフになってクランプ14がオフにな
り、第2位置決めストッパー11がダウンし、コンベア
7がオンなる。そして時間1sになると、第1センサー
12がオンになり、第1位置決めストッパー10がアッ
プする1次いで時間L6になると#2センサー13がオ
ンになり、第2位置決めストッパー11がアップする。
When this happens, the mounting is turned off, the clamp 14 is turned off, the second positioning stopper 11 is lowered, and the conveyor 7 is turned on. Then, at time 1 s, the first sensor 12 is turned on and the first positioning stopper 10 is raised. Then, at time L6, the #2 sensor 13 is turned on and the second positioning stopper 11 is raised.

第6図は上記実施例の2倍の大きさの回路基板1に部品
を実装する場合のものを示す。この回路基板1は幅が2
w長さが21であり、符号Aで示す領域、符号Bで示す
領域、符号Cで示す領域、符号りで示す領域に分けて部
品が実装されるようになっている。まず第6図(a)に
示すように符号へで示す領域が実装エリアと合致するよ
うに位置決めされ、符号Aで示す領域に部品が実装され
、次いで矢印凸方向に回路基板1が搬送されて第6図(
b)に不動ように符号B″C示す領域と実装エリアとが
合致するように位置決めされ、符号Bで示す領域に部品
が実装される、次いで矢印二方向に回路基板1が180
°回転されて第6図(e)に示すように符号Cで示す領
域と実装エリアとが合致するように位置決めされ、符号
Cで示す領域に部品が実装され、次いで矢印ホ方向に回
路基板1が搬送されて第6図(d)に示すように符号り
で示す領域と実装エリアとが合致するように位置決めさ
れ、符号りで示す領域に部品が実装される。このように
符号A、B、C,Dで示す領域に分けて部品を実装する
場合も、第2図に示すように同一の基準孔6を基準にし
て位置決めしたり、第3図や第4図の実・°本例のよう
に同一の基準端縁9を基準にして位置決めしたりできる
FIG. 6 shows a case where components are mounted on a circuit board 1 twice the size of the above embodiment. This circuit board 1 has a width of 2
The length w is 21, and components are mounted in an area indicated by a symbol A, an area indicated by a symbol B, an area indicated by a symbol C, and an area indicated by a symbol. First, as shown in FIG. 6(a), the area indicated by the symbol A is positioned so that it coincides with the mounting area, the component is mounted in the area indicated by the symbol A, and then the circuit board 1 is transported in the convex direction of the arrow. Figure 6 (
b) The circuit board 1 is positioned immovably so that the area indicated by the symbol B"C and the mounting area match, and the component is mounted in the area indicated by the symbol B. Then, the circuit board 1 is moved in the two directions of the arrows by 180 degrees.
° The circuit board is rotated and positioned so that the area shown by symbol C and the mounting area match as shown in FIG. is transported and positioned so that the region indicated by the symbol matches the mounting area as shown in FIG. 6(d), and the component is mounted in the region indicated by the symbol. Even when parts are mounted in areas indicated by symbols A, B, C, and D, positioning may be performed based on the same reference hole 6 as shown in Fig. 2, or as shown in Figs. As shown in the figure, positioning can be performed using the same reference edge 9 as a reference as in this example.

[発明の効果) 本発明は叙述の如く回路基板の一部分に部品を装着した
後、他の部分に部品を装着する際、同一の位置決め基準
部を用いて位置決めを行なうようにしているので、同一
の位置決め基準部で回路基板の複数の領域の位置決めが
できるものであって、従来のように多くの位置決め基準
を要しなくて回路基板に余分なスペースを取ったりする
ことなく、また各領域に位置決め基準を設けられない大
きさや形状のものでも位置決めできるものである。
[Effects of the Invention] As described above, the present invention uses the same positioning reference part to perform positioning when parts are mounted on one part of the circuit board and then on other parts. It is possible to position multiple areas of the circuit board using the positioning reference section of Even objects of a size and shape for which no positioning reference can be provided can be positioned.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(、)(b)は本発明の部品5i!を着部を説明
する概略平面図及び側面図、第2図(a)(b)は本発
明の一実施例を説明する平面図、PIS3図(、>(b
)は同上の他の実施例を説明する平面図、第4図は第3
図の正面図、第5図は同上の動作のタイミングチャート
、第6図(a)(b)(c)(d)は同上の他の実施例
を説明する平面図、第7図(a)(b)は従来例を説明
する平面図、第8図は従来例の側断面図であって、1は
回路基板、7はコンベアである。 代理人 弁理士 石 1)艮 七 第 図 第7図 (b) 第8図
FIG. 1(,)(b) shows the part 5i of the present invention! 2(a) and 2(b) are plan views illustrating one embodiment of the present invention, and PIS 3 (, >(b)
) is a plan view illustrating another embodiment of the same as above, and FIG.
5 is a timing chart of the same operation as above, FIGS. 6(a), (b), (c), and (d) are plan views illustrating other embodiments of the same as above, and FIG. 7(a) (b) is a plan view illustrating the conventional example, and FIG. 8 is a side sectional view of the conventional example, where 1 is a circuit board and 7 is a conveyor. Agent Patent Attorney Ishi 1) Ai Figure 7 Figure 7 (b) Figure 8

Claims (1)

【特許請求の範囲】 〔1〕回路基板をコンベア上で位置決めして回路基板の
所定位置に部品を装着する装置において、回路基板の一
部分に部品を装着した後、他の部分に部品を装着する際
、同一の位置決め基準部を用いて位置決めを行なうよう
にして成ることを特徴とする回路基板への部品装着装置
[Claims] [1] In a device that positions a circuit board on a conveyor and mounts components at predetermined positions on the circuit board, the device mounts components on one part of the circuit board and then mounts the components on other parts. 1. An apparatus for mounting components onto a circuit board, wherein the same positioning reference portion is used for positioning.
JP63208898A 1988-08-23 1988-08-23 Device for mounting parts on circuit board Pending JPH0258300A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63208898A JPH0258300A (en) 1988-08-23 1988-08-23 Device for mounting parts on circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63208898A JPH0258300A (en) 1988-08-23 1988-08-23 Device for mounting parts on circuit board

Publications (1)

Publication Number Publication Date
JPH0258300A true JPH0258300A (en) 1990-02-27

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ID=16563958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63208898A Pending JPH0258300A (en) 1988-08-23 1988-08-23 Device for mounting parts on circuit board

Country Status (1)

Country Link
JP (1) JPH0258300A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078297A (en) * 2001-08-31 2003-03-14 Sanyo Electric Co Ltd Positioning device for printed board
JP2006287150A (en) * 2005-04-05 2006-10-19 Matsushita Electric Ind Co Ltd Method for mounting electronic part
JP2009044084A (en) * 2007-08-10 2009-02-26 Yamaha Motor Co Ltd Surface mount device
JP2009064971A (en) * 2007-09-06 2009-03-26 Yamaha Motor Co Ltd Surface mounting machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227187A (en) * 1983-06-07 1984-12-20 松下電器産業株式会社 Device for positioning board
JPS6130760A (en) * 1984-07-24 1986-02-13 Toyota Central Res & Dev Lab Inc Oxygen sensor and manufacture thereof
JPS61135199A (en) * 1984-12-05 1986-06-23 松下電器産業株式会社 Method and apparatus for mounting electronic component
JPS6373590A (en) * 1986-09-16 1988-04-04 ソニー株式会社 Automatic parts mounter

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227187A (en) * 1983-06-07 1984-12-20 松下電器産業株式会社 Device for positioning board
JPS6130760A (en) * 1984-07-24 1986-02-13 Toyota Central Res & Dev Lab Inc Oxygen sensor and manufacture thereof
JPS61135199A (en) * 1984-12-05 1986-06-23 松下電器産業株式会社 Method and apparatus for mounting electronic component
JPS6373590A (en) * 1986-09-16 1988-04-04 ソニー株式会社 Automatic parts mounter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078297A (en) * 2001-08-31 2003-03-14 Sanyo Electric Co Ltd Positioning device for printed board
JP2006287150A (en) * 2005-04-05 2006-10-19 Matsushita Electric Ind Co Ltd Method for mounting electronic part
JP2009044084A (en) * 2007-08-10 2009-02-26 Yamaha Motor Co Ltd Surface mount device
JP2009064971A (en) * 2007-09-06 2009-03-26 Yamaha Motor Co Ltd Surface mounting machine

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