JPS61224395A - Method and apparatus for mounting flat package type electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention Technical Field The present invention relates to a method and apparatus for automatically mounting flat package type electronic components onto a component support such as a printed circuit board, and particularly relates to improving mounting position accuracy. It is something.

Conventional technology As a method for mounting flat package type electronic components on a component support such as a printed circuit board, a conventional method has been disclosed in Japanese Patent Application Laid-Open No. 59-9.
A method as described in Japanese Patent No. 2163 is known. In this method, the electronic component is transported by a transport/mounting device and placed at a predetermined position on the printed circuit board, and a pressing device pushes the main body of the electronic component or the lead terminal protruding from its side toward the printed circuit board. Soldering is performed using a heating device such as a laser while the lead terminal is brought into close contact with the printed circuit board, and the electrical performance of the electronic component is not impaired and the electronic component can be mounted efficiently.

Problems to be Solved by the Invention However, the present applicant has discovered that when electronic components are mounted on a printed circuit board as described above, the conveyance/mounting device that places the electronic components on the printed circuit board is separated from the electronic components. It has been discovered that when the electronic component is pressed or when the pressing device comes into contact with the electronic component, the electronic component may move slightly and misalign, causing a problem in which the accuracy of the mounting position is reduced.

゛If soldering is performed while the electronic components are held in the transport/mounting device, it is possible to avoid a decrease in the accuracy of the mounting position. The mounting equipment cannot receive and pick up the next electronic component, reducing the efficiency of the mounting process.Furthermore, the transport and mounting equipment is affected by the flux splashes and gas that sometimes occur during soldering. Undesirable because it gets dirty.

Means for Solving the Problems The present invention has been made based on the discovery of such problems and in order to solve them. A protruding flat package type electronic component is transported by a transport/mounting device and placed at a predetermined position on a component support such as a printed circuit board, and the main body or lead terminal of the electronic component is moved to the component support by a pressing device. In an automatic mounting method in which the lead terminals are brought into close contact with the component support by pressing and soldered by heating with a heating device, after the electronic component is placed by the transportation/placing device, the electronic component is removed from the electronic component by the transportation/placing device. Before separating, a pressing device is used to push the electronic component main body or lead terminal toward the component support, and the solder of the electronic component is pressed against the component support by the pressing device after transportation, placement bag, and separation. It is designed to attach the tag. - Furthermore, the second invention provides an automatic mounting device for flat package type electronic components that can suitably implement the method according to the first invention, and which places a component support such as a printed circuit board at a predetermined position. A component support support device that positions and supports the electronic component, and a transport system that transports a flat package electronic component with multiple lead terminals protruding to the side of the electronic component body and places it at a predetermined position on the component support.・A mounting device;
An automatic mounting device that includes a pressing device that pushes the main body or lead terminal of the mounted electronic component toward the component support to bring the lead terminal into close contact with the component support, and a laser head that solders the lead terminal to the component support. In this case, the pressing device is used to press the main body or lead electron of the electronic component while the electronic component is placed on the component support and not yet separated from the electronic component, and the laser head is The electronic component is placed in the retracted position until the transport/mounting device places the electronic component on the component support and separates it, and then moves to the normal position to perform soldering.

Effects of the First Invention According to the method described above, when the pressing device is brought into contact with the electronic component body or the lead terminal, the transportation/mounting device holds the electronic component, so that the transportation・
When the mounting device separates from the electronic component, the pressing device holds the electronic component, so the electronic component does not move when the device comes into contact with or leaves the electronic component again, and remains at the specified position on the component support. It will be placed with high accuracy and the soldering by the heating device will be performed reliably.

Also, while soldering is being performed, the transport/mounting device is operated to transport the electronic components to be mounted next.

Since positioning etc. can be performed, cycle time is shortened and work efficiency is improved.

Effects of the second invention Furthermore, according to the apparatus of the second invention, the method of the first invention can be carried out satisfactorily, and the laser head is configured such that the conveying/mounting device places the electronic component on the component support. The laser head remains in the retracted position until it is separated, and then moved to the normal position to perform soldering. In terms of needle installation, it becomes easy to install both, and the laser head can be moved to an optimal position for operation, resulting in the effect of improving the reliability of soldering.

Embodiments Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

FIGS. 1 and 2 are diagrams showing an automatic mounting device for flat package type electronic components which is an embodiment of the second invention, and in the figures, 10 is a base.

An index table 12 is rotatably attached to the center of the base 1O, and a plurality of pallets 14 are placed on the index table 12 at equal angular intervals. The inside of each pallet 14 is partitioned into many parts,
One flat package type electronic component is housed in each partition, and when electronic components are mounted on a printed circuit board serving as a component support, a pallet 14 containing electronic components to be mounted is placed on the base 10. It is designed to be stopped at an electronic component supply position determined approximately in the center.

As shown in FIG. 3, this electronic component has lead terminals B protruding in all directions from the side surface of the main body A, and solder is applied in advance to the portion of each lead terminal B that is fixed to the printed circuit board.

Above the index table 12, a printed circuit board transfer device 16 is installed across the base 10, and a support device 18 for positioning and supporting the printed circuit board is provided in the middle. Note that these transport devices 16 and support devices 1
8 is similar to the printed circuit board conveying and positioning device disclosed in Japanese Patent Application No. 59-113553 filed by the present applicant, and is explained in detail in the specification of the same application. are only briefly illustrated and explained.

The printed circuit board transfer device 16 includes a pair of side frames 20 extending across the base 10 and auxiliary side frames 22 and 23 provided on the outside of one side frame 20. The shaft 2 is formed by one end and the auxiliary side frame 22.
4 is rotatably supported. A sprocket 26 attached to the protruding end of the auxiliary side frame 22 of this shaft 24
A chain 32 is wound around a sprocket 3o fixed to the output shaft of a motor 28, and when the shaft 24 is rotated by the motor 28, the two pulleys 34 attached to the shaft 24 and the side frame 20 are rotated. Two endless belts (not shown) wound around two pulleys 36 attached to the other end are driven, and the printed circuit board supported by these endless belts is conveyed.

The support device 18 stops at the electronic component supply position.

A lifter 42 is provided at a position adjacent to the pallet 14 and is guided by a pair of guide lofts 38 on the lower side of the side frame 20 and is raised and lowered by a lift cylinder 40. A support jig is attached to the lifter 42, and the printed circuit board transported by the transport device 16 is stopped just above the lifter 42, and the support jig is raised together with the lifter 42. The jig engages with and lifts the printed circuit board, and positioning pins (not shown) fixed downward to the side frame 20 fit into holes provided in the printed circuit board to position the printed circuit board.

The side frame 20 and the auxiliary side frames 22 and 23 also support three screw shafts 44 rotatably but immovably in the axial direction. Auxiliary side frame 22 and side frame 20 of these screw shafts 44
A sprocket 46 is fixed to each of the protruding ends of the sprocket 46, and a chain (not shown) is wound around two of each of the four sprockets 46.
By turning the handle 48 attached to one screw shaft 44, the three screw shafts 44 are rotated simultaneously, one side frame 20 is moved, and the width between the pair of side frames 20 is changed. It is designed to be able to transport printed circuit boards of different sizes.

As shown in FIG. 2, five pillars 50 are erected around the base 10, and at the upper ends of these pillars 50 there are a pair of pillars 50 extending in the Y-axis direction perpendicular to the conveyance direction of the printed circuit board. The frames 52 are fixed, and another pair of frames 54 are provided to connect the frames 52, forming a rectangular frame as a whole. A pair of frames 52 each have a rail-shaped guide portion 56 and a groove-shaped guide portion 5 extending in the longitudinal direction thereof.
A pallet is provided at one side of the guide portions 56 and 58 with respect to the printed circuit board conveying device 16, that is, a pallet that is stopped at the electronic component supply position when electronic components are mounted on the printed circuit board. On the side where 14 is located, there is a transport/mounting device 60 that takes out the electronic components from the bullet 14, transports them to the printed circuit board, and places them thereon, and on the other side, the electronic components are mounted on the printed circuit board. A pressing/heating device 62 is installed, which includes a pressing device for pressing the electronic component onto the printed circuit board, and a heating device for soldering the lead terminals of the electronic component to the printed circuit board.

The conveying and placing device 60 includes a slide 64 that is engaged with the guide portions 56 and 58 of the frame 52 and moves in the Y-axis direction. As shown in FIG. 1, the vertical center of the slide 64 is threadedly engaged with a screw shaft 66 disposed in the Y-axis direction and supported rotatably and immovably in the axial direction by the frames 52 and 54. A nut 67 is fixed thereto, and a boot IJ 68 is fixed to the end of the screw shaft 66 protruding from the frame 54.
A belt 74 is wound around a Boo I772 fixed to the output shaft of a servo motor 70 disposed below the servo motor 77,
The screw shaft 66 is rotated by the servo motor 70, and the slide 64 is moved.

A slide 77 of an electronic component mounting unit 76 is attached to the side of the slide 64 facing the pressing/heating device 62 so as to be movable in the X-axis direction, which is perpendicular to the Y-axis direction. There is. As shown in FIG. 2, the slide 77 is provided with a nut (not shown) that is threaded into a screw shaft 78 that is attached to the slide 64 so as to be immovable and rotatable in the axial direction, and the screw shaft 78 is connected to the pulley 80. ．． Belt 82. It is moved in the X-axis direction by being rotated by a servo motor 86 via a pulley 84. Therefore, the unit 76 can be moved in any direction within the horizontal plane by a combination of the movement of the slide 77 in the X-axis direction and the movement of the slide 64 in the Y-axis direction. 87 is slide 7
7 and covers the main part of the unit 76.

Further, like the conveying/placing device 60, the pressing/heating device 62 is guided by the guide portions 56, 58, and the screw shaft 88. A slide 92 is provided that is moved in the Y-axis direction by a servo motor 90 or the like, and inside the slide 92 is a first
As shown in the figure, another slide 93 is mounted so as to be movable in the X-axis direction. A screw shaft (not shown) is screwed into the slide 93, and this screw shaft is connected to the servo motor 9.
6, the slide 93 is rotated by
can be moved axially. By the combination of the movement of the slide 93 in the X-axis direction and the movement of the slide 92 in the Y-axis direction, the pressing device and heating device attached to the lower side of the slide 93 can be moved to any position in the horizontal plane. It is being done.

Hereinafter, the electronic component mounting unit 76 and the pressing/heating device 62 will be explained in detail.

FIG. 4 is a diagram showing the electronic component mounting unit 76 taken out, and the slide 77 is provided with a slide 104 that is moved in the vertical direction by the air cylinder 102 shown in FIG. A suction head holder 106 is fixed to 104 . The suction head holder 106 includes a holder portion 108 extending horizontally from its lower end, and the suction head 110 is rotatably supported by the holder portion 108 around a vertical axis.

The housing 112 of the Af head 110 has a substantially cylindrical shape, and a flange portion 114 is formed on the outer peripheral surface of one end in the axial direction.A cylindrical sleeve 116 is fixed to the holder portion 108. The suction head 11
0 is rotatably fitted into this sleeve 116, and the flange portion 114 is supported from below.

Further, the outer peripheral part of the flange part 114 is a gear 118, which is meshed with a pinion 122 attached to the motor shaft of a servo motor 120 fixed to the holder part 108.
10 is adapted to be rotated around the axis of the housing 112.

Inside the housing 112, two transparent glass plates 124 and 126 coated with a low-reflection coating are fixed in parallel with each other at a certain distance and in a horizontal state. This forms an airtight space 128. An adsorption tube 130 is fixed to the lower glass plate 124.

The suction tube 130 includes an outer tube 132 and an inner tube 134 slidably fitted inside the outer tube 132. While the outer tube 132 is fixed to the glass plate 124, the inner tube 134 is fitted inside the outer tube 132. The outer cylinder 132 is compressed by the attached compression coil spring.
It is maintained in a state where it protrudes a certain length from the surface. The periphery of this suction tube 130 can be seen through the glass plates 124 and 126 from above.

Furthermore, a connection passage 144 is formed in the side wall of the housing 112, passing through it in the radial direction and opening to the outer peripheral surface of the housing 112. On the other hand, an annular groove 146 is formed in a portion of the inner peripheral surface of the sleeve 116 corresponding to the opening of the connection passage 144;
46 and the external space are connected to each other.
is formed. A hose 15 from a vacuum source such as a vacuum pump (not shown) is connected to this connection boat 148.
0 is connected. That is, regardless of the rotational position of the suction head 110 with respect to the holder portion 108, the vacuum source is connected to the hose 150. Connection boat 148. connected to the space 128 via an annular groove 146 and a connecting passage 144;
When the space 128 is connected to a vacuum source, air is suctioned from the suction tube 130 through the space 128, and the electronic components are suctioned to the tip of the suction tube 130. This is how it is supposed to be done.

Above the suction head 110 as described above, a television camera 156 is provided coaxially with the suction head 110 while being supported by an arm 154 fixed to the slide 77. Various types of information can be obtained to accurately position the device at a predetermined mounting position on the printed circuit board. In other words, it is possible to obtain image information necessary for positioning the electronic component, such as the suction state of the electronic component suctioned by the suction tube 130 and the position of the printed pattern of the printed circuit board on which the electronic component is to be mounted. .

On the other hand, below the slide 93 of the pressing/heating device 62, as shown in FIGS. It is fixed to the lower end of a shaft 164 that is rotated about a vertical axis by a servo motor 163 shown, and a pressing device 166 and a heating device 1 are attached to this housing 162.
68 is installed.

The pressing device 166 is attached to the lower portion of the opening 160 of the housing 162, as shown in FIGS. 6 and 8. The front end side of the housing 162, that is, the opening 1
The central portion of the side wall portion on the side where 60 is formed is extended forward to form a support portion 170, and within this support portion 170 are two guide rods 1 as shown in FIG.
72 are lined up one after the other and are fitted to each other so as to be slidable in the vertical direction. A support 176 to which a suppressor 174 is attached is fixed to the lower ends of both guide rods 172 by bolts 178. Further, a tension coil spring 180 is disposed between both guide rods 172.
The support body 176 is connected to this spring 180 by a bolt 182 and urged upward, and is brought into contact with the support portion 170.

The end of the support body 176 opposite to the side to which the pressing tool 174 is attached extends horizontally to form an engaging portion 184.
A piston rod 190 of an air cylinder 188 attached to the support portion 170 is connected by 86 . The support body 176 is guided by the guide rod 172 and raised and lowered by the expansion and contraction of the piston rod 190, and its rising end is connected to the dog 1 provided on the engaging portion 184.
92 is detected by activating a photoswitch 194 attached to the mounting plate 186, and the lowering end is also detected in the same manner, although not shown.

On the other hand, many parts of the heating device 168 are connected to the housing 16.
It is provided in a state housed in 2.

As shown in FIGS. 5 and 7, a guide rail 196 and a guide rod 1 are provided on the inner surface of the housing 162.
98 are attached in the front and back direction, and slides 20 are attached to these guide rails 196 and guide rods 198.
0 is movably attached. The slide 200 is slidably fitted onto the guide rod 198, while a roller 201 attached to the side surface of the slide 200 is engaged with the guide rail 196 with a slight gap in a groove 203. An air cylinder 202 is further installed inside the housing 162 in parallel with the axis of the guide rod 198, and an air cylinder 202 is connected to an engaging portion 206 provided at the head of the piston rod 204, and an air cylinder 202 is provided at the rear end of the slide 200. By engaging the flat protrusion 208, the slide 200 can be moved by the expansion and contraction of the piston rod 204.

A mounting member 2 is mounted on the slide 200 along the direction of movement thereof.
10 is fixed, and a slide 212 that moves independently of the slide 200 is attached to the front end side of the slide 200. The slide 212 is attached to the slide 200 via a bearing in which a plurality of balls 218 are arranged between a rod 214 fixed to the slide 212 and a rod 216 fixed to the slide 200. A screw shaft 222 is screwed into a nut 220 provided at the portion. The screw shaft 222 is the mounting member 2
The slide 212 is rotated by a servo motor 224 attached to the rear end of the slide 10, and the slide 212 is moved by this rotation. Also, slide 212
As shown in FIGS. 5 and 6, at the front end of the slide 2, there is a support frame 226 that is opened upward and forward.
A pair of laser heads 228 are attached to this support frame 226, which is provided at right angles to the moving direction of the laser beams 00 and 212.

Each laser head 228 is attached to a slide 229, and the slide 229 is connected to a guide rod 229 supported by the left and right side walls of the support frame 226, as shown in FIG.
30 and is provided symmetrically with respect to a vertical plane including the center line of the pressing tool 174, and is threadedly engaged with a threaded shaft 232 disposed parallel to the guide rod 230.

This threaded shaft 232 has a left-hand thread in the left part and a right-hand thread in the right part in FIG.
The solid slides 229 are screwed into the left-hand and right-hand threads, respectively, and the screw shaft 232 is connected to the servo motor 2.
34, the two laser heads 228 are moved symmetrically with respect to a vertical plane including the center line of the pressing tool 174, so that the distance between the two laser heads 228 can be changed.

The motors, air cylinders, etc. of the mechanical parts detailed above are listed in the 9th section.
As shown in the figure, it is controlled by a control device mainly composed of a computer. A computer is a central processing unit (CPU)
242. A read-only memory (ROM) 244 and a random access memory (RAM) 246 are provided, and a control program stored in the ROM 244 is provided, and an input device 248 is provided with an input key. The photoswitch 194
Various detectors including , and the television camera 15
The servo motor 64 and the air cylinder 104 are controlled based on input data from the servo motor 64 and the like. Note that the computer controls each servo motor and air cylinder through respective drive control circuits, but these drive control circuits are omitted in FIG. 9.

Mounting of electronic components onto a printed circuit board using the mounting apparatus configured as described above is performed as shown in the flowchart of FIG. 10.

First, a printed circuit board is supplied from the supply device 1 (not shown) to the conveying device 16, and when the printed circuit board is conveyed to the electronic component mounting position and set at a predetermined setting position by the supporting device 18, the printed circuit board is transferred from the RAM 246. Data on the position on the printed circuit board at which the electronic component is to be mounted (this position data is stored in the RAM 246 through teaching performed prior to the start of a series of mounting operations) is read out. Then, according to the position data, the slides 64 and 77 of the transport/mounting device 60 are moved in the Y-axis and X-axis directions, respectively, and the rotation center of the suction rod 110 is
The center of 6 is positioned almost directly above the portion of the printed pattern where the electronic component is to be mounted. In this state, an image from the television camera 156 is input to the CPU 242, and image information of the print pattern is acquired. If there are multiple electronic components mounted on a printed circuit board, transportation and
The mounting device 60 is sequentially moved to the plurality of positions according to device data configured from the RAM 246, and image information of all print patterns on which electronic components are to be mounted is stored in the CPU 242. Note that at this time, the suction rod 110 has been moved to the upper retracted position by the movement of the slide 104, and no electronic component is suctioned to the suction tube 130.

When the image information of the printed pattern on the printed circuit board is obtained, the type of electronic component to be installed first is read from the RAM 246, and the pallet 14 containing the electronic component is moved to the electronic component supply position.
The slides 64 and 77 are moved in accordance with an electronic component suction command from the CPU 242, and the suction tube 130 is positioned over the electronic component to be taken out from the pallet 14 stopped at the electronic component supply position. Thereafter, the suction rod 110, that is, the suction tube 130, is lowered to a predetermined position and brought into close contact with the main body A of the electronic component. At this time, the inner cylinder 134 is under pressure.

It is pushed into the outer cylinder 132 against the biasing force of the compressed coil spring, and the extra downward distance is absorbed.

In this state, the space 128 formed in the housing 112 of the suction rod 110 is connected to a vacuum source, and the electronic component is suctioned to the tip of the suction tube 130.

When the electronic component is sucked into the suction tube 13G, the suction head 1
10 is raised again, and when the lead terminal B of the electronic component is at the same height as the surface of the printed circuit board, the image from the television camera 156 is input to the control device, and image information of the electronic component is acquired.

Thereafter, the suction head 110 is further raised to the same height as the retracted position, and the slides 64 and 77 are moved again to mount the electronic component currently being suctioned on the printed pattern of the printed circuit board. It is placed directly above the desired part. While moving to this position, a suction blade 110 matches the position of the print pattern and the lead terminal B of the electronic component based on the previously acquired image information of the print pattern and the image information of the electronic component.
The horizontal position data and rotational position data are calculated, and the suction head 110 is positioned based on the horizontal position data and rotational position data. That is, the movement position of the suction head 110 is determined based on the horizontal position data calculated by the calculation, and during the movement, the servo motor 120 is rotationally driven based on the rotational position data calculated by the calculation. , the suction head 110 is rotated.

In synchronization with the movement of the suction head 110 holding the electronic components onto the printed circuit board, the slides 92 and 93 are moved in the Y-axis and X-axis directions, and the housing 1σ2 is moved on the horizontal plane. Then, the pressing tool 174 is positioned on the main body A of the electronic component along with the suction tube 130. Thereafter, the suction head 110 is lowered and the electronic component is placed on the printed pattern of the printed circuit board, and the execution of step S1 is completed.

Even after the electronic component is placed on the printed circuit board, the suction tube 130 remains in close contact with the main body A of the mold component for a while to keep the electronic component pressed against the printed circuit board, while step S2 is executed during this time. .

Air is supplied to the air cylinder 188 provided in the pressing device 166 to extend the piston rod 190, and the pressing tool 174 descends and comes into contact with the main body A of the electronic component, bringing all the lead terminals B into close contact with the printed circuit board. Let it happen. After the pressing tool 174 presses the electronic component in this way, step S3 is executed and the suction head 110
is raised to the retracted position. When further mounting electronic components on the same printed circuit board, the transport and mounting device 60 moves to take out the next electronic component to be mounted from the pallet 14. If there is only one electronic component, the second
It is returned to its pre-operation position as shown in the figure.

Once the suction head 110 is evacuated, the heating device 1
68 air cylinders 202 are operated, and the slide 200 is advanced by contraction of the piston rod 204 (step S4). When the laser head 228 is moved to the normal position, the slide 2
00 is stopped, and the servo motor 224 is activated to move the slide 212 forward, and a laser beam is irradiated toward the lead terminal B to perform soldering. At this time, the housing 162
0 is in a posture facing the conveyance/mounting device 60,
Since the slides 200 and 212 are moved in the Y-axis direction, the lead terminals B protruding from the side surfaces of the electronic component body A parallel to the Y-axis direction are soldered.

After soldering in the Y-axis direction is performed as described above, the slide 212 is moved back and the laser head 228
is evacuated to the normal position (step S5)
, the piston rod 190 is retracted, and the pressing tool 174
is separated from the electronic component (step 36). Next, in step S7, it is determined whether or not the electronic component requires soldering in two directions, the Y-axis and the 228 is retracted. However, if it requires soldering in two directions,
The housing 162 is rotated 90 degrees around the axis 164, the moving direction of the slides 200 and 212 is changed to the X-axis direction, and the slides 92 and 93 are moved so that the pressing tool 174 is placed on the main body A of the electronic component. The position is corrected to the correct position (step S9 ends).

Thereafter, in the same manner as described above, the pressing tool 174 is lowered to push the main body A of the electronic component toward the printed circuit board (step 510), and the slide 212 is advanced to perform soldering in the X-axis direction by the laser head 228. is performed (step 511). After this soldering is completed, the pressing tool 174 is raised (step 512), and the housing 162 is rotated and the slides 200 and 212 are returned to the position of moving in the Y-axis direction (
Step 513), and the laser head 228 is moved to the retracted position (Step 38).

When a plurality of electronic components are mounted on a printed circuit board, after the above operations are repeated, the conveying/mounting device 60 and the pressing/heating device 62 are returned to their pre-operation positions as shown in FIG. The printed circuit board on which the electronic components have been mounted is released from the positioning support by the support device 18, and is transported to the unloading position by the transport device 16.

As detailed above, in the mounting device of this embodiment,
After the suction head 110 places the electronic component on the printed circuit board and before separating it from the electronic component, the pressing tool 174 is brought into contact with the main body A of the electronic component to bring the lead terminal B into close contact with the printed circuit board. The components are always pressed onto the printed circuit board by the suction head 110 or the pressing device 166, and when the pressing tool 174 contacts the electronic component or the suction tube 130 separates from the electronic component, the contact and separation occur. The electronic components will not be dislocated due to the impact that sometimes occurs, and will be placed on the printed circuit board with high precision, and soldering will be performed reliably.

Further, the conveying/placing device 6o is provided so as to be movable independently of the pressing/heating device 62, and the suction device 6o
The heating device 168 is moved to the normal position after the suction head 110 is evacuated.
There is no risk that the and laser head 128 will interfere with each other, and soldering of the electronic component mounting unit 76 to which the glass plates 124, 126 of the suction plate 110, the television camera 156, etc. are attached sometimes occurs. It is possible to avoid contamination due to splashes and gas.

Furthermore, since the soldering by the heating device 168 and the unloading of electronic components by the electronic component placement unit 76 are performed in parallel, the cycle time is shortened and the efficiency of the mounting work is improved.

Furthermore, in this mounting device, the index table 12 for supplying electronic components, and the conveyance device 16 and support device 18 for conveying and positioning the printed circuit board are vertically intersected, so the configuration is compact. This has the advantage of saving space for installing the device.

Although one embodiment of the present invention has been described above in detail, the present invention can be implemented in other embodiments.

For example, in the above embodiment, the pressing tool 174 was configured to press the main body A of the electronic component, but it may also be configured to press the lead terminal B.

Furthermore, the pressing device 166 and the heating device 168 do not have to be provided in the same housing 162 and moved by a common slide 92, 93, but can also be provided separately.

Furthermore, in the transport/mounting device 60, the electronic components may be held by a chuck or the like and placed on the transporter instead of or in addition to vacuum suction, and the solder is not applied to the lead terminals. , or may be applied on a printed circuit board.

Although not illustrated in detail, the present invention can be implemented with various modifications and improvements based on the knowledge of those skilled in the art.

[Brief explanation of drawings]

FIG. 1 is a front view showing an electronic component mounting device which is an embodiment of the device invention, and FIG. 2 is a plan view. FIG. 3 is a plan view showing an example of electronic components mounted in the same device. FIG. 4 is a front view (partially) showing one electronic component mounting unit in the same device. FIG. 5 is a plan view showing the pressing device and heating device in the same device with the earthen walls of the housing removed. FIG. 6 is a sectional view taken along line Vl-VI in FIG. 5, and FIG. ■-
■It is a sectional view. FIG. 8 is a front view of the pressing device and heating device. FIG. 9 is a block diagram of the control device of the electronic component mounting apparatus, and FIG. 1O is a flowchart of the control program. 18: Support device 60: Conveyance/placing device 62: Pressing/heating device 64 Nishlide 70: Servo motor 76: Electronic component placement unit 77: Slide 86.9
0: Servo motor 92.93 Nice slide 96: Servo motor 162: Housing 163: Servo motor 174: Pressing tool 1
80: Tension coil spring 188: Air cylinder 2
00NiRide 202: Air cylinder 212NiRide 224: Servo motor 228: Laser head 229
Nislide 234: Servo motor Fig. 4 Fig. 7 Fig. 8 Fig. 9

Claims (2)

[Claims] (1) A flat package type electronic component with multiple lead terminals protruding to the side of the electronic component body is transported by a transport/mounting device, placed at a predetermined position on a component support such as a printed circuit board, and then In an automatic mounting method in which the main body or lead terminal of an electronic component is pushed toward the component support by a pressing device, the lead terminal is brought into close contact with the component support, and the lead terminal is heated by a heating device and soldered. After the component has been placed, and before the conveyance/placement device is separated from the electronic component, the pressing device is set to push the electronic component body or lead terminal toward the component support, and after the conveyance/placement device is separated. A method for mounting a flat package type electronic component, comprising performing the soldering of the electronic component pressed against a component support by a pressing device. (2) A component support rod support device that positions and supports component supports such as printed circuit boards in predetermined positions, and a device that transports flat packaged electronic components with multiple lead terminals protruding to the sides of the electronic component body. a conveyance/mounting device that places the mounted electronic component at a predetermined position on the component support, and pushes the main body or lead terminal of the mounted electronic component toward the component support to bring the lead terminal into close contact with the component support. In an automatic mounting device including a pressing device and a laser head for soldering the lead terminals thereof to a component support, The main body or lead terminal of the electronic component is pressed while the electronic component is not yet separated from the electronic component, and the laser head is separated from the electronic component after the conveyance/mounting device places the electronic component on the component support. 1. A flat package type electronic component mounting device characterized in that the flat package type electronic component mounting device is in a retracted position until soldering is performed, and then moved to a normal position after being separated to perform soldering.