WO2020152766A1 - Transporting device - Google Patents

Transporting device Download PDF

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Publication number
WO2020152766A1
WO2020152766A1 PCT/JP2019/001769 JP2019001769W WO2020152766A1 WO 2020152766 A1 WO2020152766 A1 WO 2020152766A1 JP 2019001769 W JP2019001769 W JP 2019001769W WO 2020152766 A1 WO2020152766 A1 WO 2020152766A1
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WO
WIPO (PCT)
Prior art keywords
detection sensor
guide rail
circuit board
electronic component
substrate
Prior art date
Application number
PCT/JP2019/001769
Other languages
French (fr)
Japanese (ja)
Inventor
貴規 ▲高▼木
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to JP2020567692A priority Critical patent/JP7116195B2/en
Priority to PCT/JP2019/001769 priority patent/WO2020152766A1/en
Publication of WO2020152766A1 publication Critical patent/WO2020152766A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a transfer device that includes a conveyor device that transfers a substrate and a support pin that supports a substrate that has been transferred to a predetermined position by the conveyor device from below.
  • some transfer devices include a conveyor device that transfers a substrate and a support pin that supports a substrate that has been transferred to a predetermined position by the conveyor device from below. Further, it is desired that the carrier device detects the presence or absence of a foreign substance as described in Patent Document 2 below.
  • An object of the present invention is to suitably detect the presence or absence of a foreign matter in a transfer device that includes a conveyor device that transfers a substrate and a support pin that supports a substrate that is transferred to a predetermined position by the conveyor device from below.
  • the present specification discloses a conveyor device that conveys a substrate, a support pin that is placed on a mounting table and that supports a substrate that is conveyed to a predetermined position by the conveyor device from below, A detection sensor for detecting the presence or absence of the support pin placed on the mounting table, wherein the detection sensor detects the presence or absence of foreign matter in a predetermined region of the mounting table on which the support pin is not mounted.
  • a carrier device is disclosed.
  • the presence or absence of foreign matter in a predetermined area of the mounting table on which the support pins are not mounted is detected by the detection sensor for detecting the presence or absence of the supporting pins mounted on the mounting table.
  • the presence/absence of foreign matter can be suitably detected in the transport device including the conveyor device that transports the substrate and the support pin that supports the substrate transported from the conveyor device to the predetermined position from below.
  • FIG. 4 is a sectional view taken along the line BB in FIG. 3.
  • FIG. 1 shows an electronic component mounting device 10.
  • the electronic component mounting apparatus 10 has one system base 12 and two mounting machines 16 arranged side by side on the system base 12.
  • the direction in which the mounting machines 16 are arranged is referred to as the X direction
  • the horizontal direction perpendicular to the direction is referred to as the Y direction
  • the vertical direction perpendicular to the direction is referred to as the Z direction.
  • Each mounting machine 16 mainly includes a mounting machine main body 20, a pair of substrate transfer/holding devices 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 24, a mounting head 26, a supply device 28, A control device (see FIG. 7) 30 is provided.
  • the mounting machine body 20 includes a frame 31 and a beam 32 mounted on the frame 31.
  • Each of the pair of substrate transport holding devices 22 has a conveyor device 50 and a substrate holding device 52, as shown in FIGS. 2 to 5.
  • FIG. 2 is a diagram showing the substrate transport holding device 22 from an obliquely upper perspective
  • FIG. 3 is a diagram showing the substrate transport holding device 22 from an upper perspective.
  • FIG. 4 is a diagram showing a perspective from the AA line of FIG. 3
  • FIG. 5 is a diagram showing a perspective from the BB line of FIG.
  • the conveyor device 50 has a pair of guide rails 60, 62 and a conveyor belt 66 provided on each guide rail 60, 62.
  • the pair of guide rails 60, 62 are arranged in parallel to each other, and each guide rail 60, 62 is supported on the upper surface of a support plate 72 via a pair of support legs 70.
  • the direction in which the guide rails 60 and 62 extend is called the X direction
  • the direction that is orthogonal to the X direction horizontally is called the Y direction
  • the direction orthogonal to both the X direction and the Y direction is called the Z direction.
  • two pulleys 74 and 76 are arranged on the side surfaces of the guide rails 60 and 62 with the Y direction as the axis center.
  • the two pulleys 74, 76 are arranged at both ends of each guide rail 60, 62.
  • the guide rail 60 and the guide rail 62 are arranged such that the surfaces on which the pulleys 74 and 76 are arranged face each other.
  • the conveyor belt 66 is wound around the pulleys 74 and 76 of the guide rails 60 and 62, and the conveyor belt 66 is rotated by driving an electromagnetic motor (see FIG. 7) 78.
  • the orbiting direction of the conveyor belt 66 is the clockwise direction in FIG.
  • the circuit board 80 faces from the side where the pulley 74 is arranged to the side where the pulley 76 is arranged. And is conveyed by the conveyor belt 66.
  • the conveyor device 50 has a width changing device (see FIG. 7) 81, and can change the distance between the guide rails 60 and 62.
  • the pair of support legs 70 that support the guide rails 62 are slidable in the Y direction. Then, the pair of support legs 70 is moved to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 7) 82.
  • the guide rails 62 supported by the pair of support legs 70 approach and separate from the guide rails 60 while being parallel to the guide rails 60.
  • the distance between the guide rail 60 and the guide rail 62 is changed. In this way, by changing the distance between the guide rails 60 and 62, it becomes possible to carry circuit boards 80 of various sizes.
  • a detection sensor 83 is arranged on the pair of support legs 70 of the guide rail 62.
  • the detection sensor 83 includes a light projecting portion 84 and a light receiving portion 85.
  • the light projecting portion 84 is arranged on one of the pair of support legs 70, and the light receiving portion 85 is connected to the pair of support legs 70. Is arranged on the other side of.
  • the light projecting portion 84 and the light receiving portion 85 are arranged so as to face each other. As a result, the light emitted from the light projecting unit 84 is received by the light receiving unit 85.
  • the substrate holding device 52 also includes a lifting table 86, a plurality of backup pins 88, a table lifting mechanism 90, and a clamp device 92.
  • the lifting table 86 has a generally rectangular shape, and is arranged below the guide rails 60 and 62 so as to extend between the pair of support legs 70 of each guide rail 60 and 62. Further, on the upper surface of the elevating table 86, for example, a plurality of backup pins 88 are arranged in 3 ⁇ 3 rows, that is, 3 rows in the X direction and 3 rows in the Y direction. It stands on the table 86.
  • the lifting table 86 is disposed on the upper surface of the support plate 72 via the table lifting mechanism 90, and the table lifting mechanism 90 drives the electromagnetic motor (see FIG. 7) 96 to lift the lifting table 86.
  • the clamp device 92 also has a pair of clamp bars 100 and a pair of clamp plates 102.
  • the clamp bar 100 has a generally plate shape, and the length dimension of the clamp bar 100 is longer than the length dimension of the elevating table 86 in the X direction.
  • Each of the pair of clamp bars 100 is fixed to the upper surfaces of the guide rails 60 and 62 so that the lifting table 86 is located between both ends of each clamp bar 100. That is, the clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so that the elevating table 86 extends below the clamp bar 100.
  • the clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to extend above the conveyor belt 66 arranged on the guide rails 60 and 62.
  • the clamp plate 102 has a generally rectangular plate shape, and the length dimension of the clamp plate 102 in the longitudinal direction is substantially the same as the length dimension of the clamp bar 100.
  • the clamp plate 102 extends in the same direction as the clamp bar 100 below the clamp bar 100 that extends above the conveyor belt 66, and is vertically slidable by the guide rails 60 and 62 in an upright state. Is held. That is, the holder 108 is provided on the side surface of the guide rails 60 and 62 on the side where the conveyor belt 66 is provided. Then, with the side surfaces of the guide rails 60 and 62 and the side surface of the clamp plate 102 facing each other, the clamp plate 102 is held by the holder 108 so as to be slidable in the vertical direction below the clamp bar 100.
  • the upper end of the clamp plate 102 is located above the upper surface of the conveyor belt 66, as shown in FIG. It is located below, and the lower end of the clamp plate 102 is located above the upper surface of the lifting table 86 in a state where it is not lifted.
  • the circuit board 80 transferred by the conveyor device 50 is clamped by the board holding device 52.
  • the circuit board 80 is carried into the electronic component mounting apparatus 10 and conveyed by the conveyor device 50 to a predetermined work position.
  • both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50 are vertically aligned with the clamp bar 100 as shown in FIG. It is located between the clamp plate 102.
  • the lifting/lowering table 86 is lifted by the operation of the table lifting/lowering mechanism 90.
  • the lower end of the clamp plate 102 contacts the upper surface of the elevating table 86, and the clamp plate 102 also rises as the elevating table 86 rises.
  • the upper end of the clamp plate 102 contacts the lower surface of the circuit board 80 supported by the conveyor belt 66.
  • the height dimension of the backup pin 88 mounted on the upper surface of the lifting table 86 is the same as the length dimension of the clamp plate 102 in the vertical direction.
  • the upper end of the backup pin 88 also contacts the lower surface of the circuit board 80. Then, as the lifting table 86 rises, the circuit board 80 supported by the conveyor belt 66 is lifted from the conveyor belt 66 by the clamp plate 102 and the backup pin 88 and rises. At this time, as shown in FIG. 6, the table lifting mechanism 90 operates until the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, and the circuit board 80 is lifted by the clamp plate 102 and the backup pin 88. To be As a result, the circuit board 80 is sandwiched by the clamp bar 100 and the clamp plate 102 at both edges while being supported by the backup pin 88 from below in the central portion.
  • the moving device 24 is an XY robot type moving device.
  • the moving device 24 includes an electromagnetic motor (see FIG. 7) 112 that slides the slider 110 in the X direction and an electromagnetic motor (see FIG. 7) 114 that slides the slider 110 in the Y direction.
  • the mounting head 26 is attached to the slider 110, and the mounting head 26 is moved to an arbitrary position on the frame 31 by the operation of the two electromagnetic motors 112 and 114.
  • the mounting head 26 mounts electronic components on the circuit board 80.
  • the mounting head 26 has a suction nozzle 120 provided on the lower end surface.
  • the suction nozzle 120 communicates with a positive/negative pressure supply device (see FIG. 7) 122 via negative pressure air and positive pressure air passages.
  • the suction nozzle 120 sucks and holds an electronic component by negative pressure, and separates the held electronic component by positive pressure.
  • the mounting head 26 has a nozzle lifting device (see FIG. 7) 124 for lifting the suction nozzle 120.
  • the mounting head 26 changes the vertical position of the held electronic component by the nozzle lifting device 124.
  • the supply device 28 is a feeder-type supply device, and is arranged at the front end of the frame 31.
  • the supply device 28 has a tape feeder 130.
  • the tape feeder 130 accommodates the taped parts in a wound state.
  • the tape component is a taped electronic component.
  • the tape feeder 130 feeds the tape-formed component by the feeding device (see FIG. 7) 132.
  • the feeder-type supply device 28 supplies the electronic component at the supply position by feeding the tape-formed component.
  • the control device 30 has a controller 140 and a plurality of drive circuits 142, as shown in FIG. 7.
  • the plurality of drive circuits 142 are connected to the electromagnetic motors 78, 82, 96, 112, 114, the positive/negative pressure supply device 122, the nozzle lifting device 124, and the delivery device 132.
  • the controller 140 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 142. As a result, the operation of the substrate transport holding device 22, the moving device 24, etc. is controlled by the controller. Further, the controller 140 is connected to the detection sensor 83 of the substrate transport holding device 22. Therefore, the detection result of the detection sensor 83 is input to the controller 140.
  • the electronic component mounting apparatus 10 is capable of mounting the circuit board 80 held by the board transfer and holding apparatus 22 by the mounting head 26.
  • the conveyor device 50 conveys the circuit board 80 to the working position, and the board holding device 52 clamps the circuit board 80 at the position.
  • the tape feeder 130 sends out the tape-formed component and supplies the electronic component at the supply position according to a command from the controller 140.
  • the mounting head 26 moves to a position above the electronic component supply position in response to a command from the controller 140, and the suction nozzle 120 sucks and holds the electronic component. Subsequently, the mounting head 26 moves to the upper side of the circuit board 80 according to a command from the controller 140, and mounts the held electronic component on the circuit board 80.
  • the circuit board 80 conveyed to the work position is clamped by the board holding device 52, and the mounting work of the electronic component is performed on the circuit board 80 in the clamped state. It In the circuit board 80 clamped by the board holding device 52, the circuit board 80 is sandwiched and fixed by the clamp bar 100 and the clamp plate 102, so that proper electronic component mounting work is ensured. Further, in the state where the circuit board 80 is clamped by the board holding device 52, the central portion of the circuit board 80 is supported by the backup pin 88. As a result, the mounting work of the electronic component is ensured while the circuit board 80 is prevented from bending.
  • an electronic component may fall onto the substrate transfer/holding device 22.
  • the dropped electronic component may cause the backup pin 88 to be properly disposed on the upper surface of the lifting table 86.
  • the circuit board 80 cannot be clamped properly.
  • the electronic component 150 that has dropped onto the substrate transport holding device 22 may be located below the guide rail 62 on the upper surface of the elevating table 86. In such a case, when the lifting table 86 is raised, as shown in FIG. 8, the electronic component 150 is sandwiched between the upper surface of the lifting table 86 and the lower end of the guide rail 62, so that the lifting table 86 is raised. Be hindered.
  • the electronic component 150 that has dropped onto the substrate transport holding device 22 may be located below the clamp plate 102 on the upper surface of the lifting table 86.
  • the elevating table 86 rises, the electronic component 150 is sandwiched between the upper surface of the elevating table 86 and the lower end of the clamp plate 102 as shown in FIG. Is higher than the upper end position of the backup pin 88 by a distance corresponding to the height dimension of the electronic component 150. Therefore, the circuit board 80 is fixed by being clamped by the clamp bar 100 and the clamp plate 102 as the lift table 86 is raised, but is not supported from below by the backup pin 88.
  • the detection sensor 83 detects the presence or absence of the electronic component 150 that has dropped onto the lift table 86.
  • the detection sensor 83 is provided to detect the presence/absence of the backup pin 88 placed at a predetermined position on the elevating table 86.
  • the light projecting portion 84 and the light receiving portion 85 that form the detection sensor 83 are arranged on a pair of support legs 70 that support the guide rail 62. Further, the pair of support legs 70 that support the guide rails 62 are slidable in the Y direction in order to change the distance between the guide rails 60 and 62. In this way, the pair of support legs 70 supporting the guide rails 62 are slidable in the Y direction, and the distance between the guide rails 60 and 62 is changed, so that circuit boards of various sizes can be obtained. Can be mounted.
  • the guide rail 62 is slid toward the guide rail 60.
  • the distance between the guide rail 60 and the guide rail 62 is shortened.
  • the backup pins 88 placed on the elevating table 86 during the work of mounting a large-sized circuit board are removed from the elevating table 86 before the guide rail 62 is slid.
  • the operation of removing the backup pin 88 may be forgotten.
  • the clamp plate 102, the guide rail 62, etc. come into contact with the backup pin 88 remaining on the lifting table 86, and the clamp plate 102,
  • the guide rail 62, the backup pin 88, etc. may be damaged.
  • the detection sensor 83 is provided on the support leg 70 that supports the guide rail 62, and the detection sensor 83 detects when the guide rail 62 slides. That is, the light is emitted from the light projecting unit 84, and it is detected whether or not the light receiving unit 85 receives the light. Then, when light is detected by the light receiving unit 85 when the guide rail 62 slides, the guide rail 62 continuously slides. On the other hand, when the detection of light by the light receiving unit 85 is stopped during the sliding of the guide rail 62, the sliding of the guide rail 62 stops at that timing. As a result, when the guide rail 62 slides, contact of the clamp plate 102, the guide rail 62 and the like with the backup pin 88 remaining on the lifting table 86 is prevented. Further, when the guide rail 62 is slid, an error notification is given at the timing when the detection of light by the light receiving unit 85 is interrupted. As a result, the operator can be encouraged to remove the backup pin 88 from the lift table 86.
  • the pair of support legs 70 that support the guide rails 62 are provided with the detection sensor 83 for detecting the presence or absence of the backup pin 88 remaining on the lift table 86. Therefore, the detection sensor 83 is used to detect the presence/absence of the electronic component 150 that has dropped onto the lifting table 86. Specifically, for example, at the timing after the circuit board is unloaded from the electronic component mounting apparatus 10 at the time of setup change, or before the circuit board is loaded into the electronic component mounting apparatus 10, the lifting table 86 is moved. From the top all backup pins 88 are removed. That is, in the electronic component mounting apparatus 10, all the backup pins 88 are removed from the upper and lower table 86 at the timing when the circuit board 80 is not transported.
  • the detection sensor 83 detects whether the electronic component 150 is dropped on the lift table 86. Absent.
  • the conveyor device 50 conveys the circuit board 80 and arranges the backup pins 88, and The circuit board 80 is clamped by the substrate holding device 52.
  • the detection of light by the light receiving unit 85 is stopped when the guide rail 62 is slid, the electronic component 150 that has fallen on the elevating table 86 is detected and an error is notified.
  • the operator can recognize the electronic component 150 that has dropped onto the lifting table 86 and remove the electronic component 150.
  • the guide rail 62 slides toward the guide rail 60 by operating the button for restarting the detection of the electronic component 150 when the guide rail 62 slides.
  • the detection of the electronic component 150 by the detection sensor 83 is restarted.
  • the conveyor device 50 conveys the circuit board 80 and the circuit by the board holding device 52.
  • the substrate 80 is clamped.
  • the electronic component 150 that has dropped onto the lifting table 86 is a factor, and it is possible to eliminate the arrangement failure of the backup pin 88 and the situation where the circuit board 80 cannot be clamped properly.
  • the elevating table 86 from which the backup pin 88 has been removed when the light detection by the light receiving unit 85 is stopped, not only the electronic components 150 dropped on the elevating table 86, but also misplaced jigs, large dust, etc.
  • the detection sensor 83 detects the electronic components 150 dropped on the lifting table 86, the misplaced jig, and large foreign substances such as dust.
  • the detection sensor 83 detects foreign matter in the entire area of the upper surface of the elevating table 86 where the guide rail 62 can slide. It takes a long time. Therefore, when it is desired to shorten the detection time of the foreign matter by the detection sensor 83, for example, when the setup change time is short, only the area in which the foreign matter such as the electronic component 150 may be caught when the substrate holding device 52 clamps is determined. Is detected by the detection sensor 83.
  • the electronic component 150 that has fallen onto the lifting table 86 when the lifting table 86 is raised is the electronic component 150 that has fallen onto the guide rail 62 or the clamp plate 102. It is sandwiched by the lifting table 86. Therefore, unless foreign matter such as the electronic component 150 has fallen below the guide rail 62 and the clamp plate 102, the clamp by the substrate holding device 52 is secured. Therefore, of the entire area of the lifting table 86 on which the guide rail 62 can slide, only the area below the guide rail 62 and the clamp plate 102 is detected by the detection sensor 83. As a result, the detection time can be shortened and the clamping by the substrate holding device 52 can be secured.
  • the backup pins 88 are naturally not placed in the areas below the guide rails 62 and the clamp plate 102. It is not necessary to remove the backup pin 88 from above. Therefore, not only the detection time by the detection sensor 83 can be shortened, but also the time required for the preparation for detecting the foreign matter by the detection sensor 83 can be shortened. That is, the detection sensor 83 detects only a region where the backup pins 88 of the lift table 86 are not placed and which interferes with the clamping of the circuit board 80 by the substrate holding device 52 as the predetermined region. By the work for a short time, the clamp by the substrate holding device 52 can be secured.
  • the substrate transfer/holding device 22 is an example of the transfer device.
  • the conveyor device 50 is an example of a conveyor device.
  • the circuit board 80 is an example of a board.
  • the detection sensor 83 is an example of a detection sensor.
  • the lifting table 86 is an example of a mounting table.
  • the backup pin 88 is an example of a support pin.
  • the present invention is not limited to the above-described embodiments, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art.
  • the area where the backup pin 88 is removed is set as a predetermined area and the detection sensor 83 is used.
  • the detection sensor 83 is used.
  • the area including the position where the backup pin 88 is placed is set as a predetermined area. Detection of foreign matter may be performed by.
  • the detection sensor 83 may detect the foreign matter not only in the area where the backup pin 88 is not placed, but also in the position where the backup pin 88 is placed.
  • a pair of support legs 70 supporting the guide rail 62 are provided with a pair of support legs extending toward the guide rail 60.
  • the arm 160 of FIG. Then, the light projecting portion 84 is disposed at one tip portion of the pair of arms 160, and the light receiving portion 85 is disposed at the other tip portion of the pair of arms 160.
  • the detection sensor 83 detects a foreign substance while the backup pin 88 is placed on the lift table 86, information about the placement position of the backup pin 88 is stored in the control device 30 in advance. Has been done. Then, even if the detection sensor 83 detects a foreign substance at the mounting position of the backup pin 88, that is, even if the backup pin 88 is detected as a foreign substance, the detection result is canceled.
  • the error is notified only when the foreign matter is detected at a position other than the mounting position of the backup pin 88 according to the information stored in the control device 30.
  • the detection result is canceled, so no error notification is given.
  • the electronic component 150 by the detection sensor 83 is eventually set as a predetermined region in which the backup pin 88 is not placed. It is possible to detect foreign matter such as.
  • the presence or absence of foreign matter is detected by the detection sensor 83 including the light projecting unit 84 and the light receiving unit 85, but the presence or absence of foreign matter may be detected by other types of detection sensors. .. Specifically, for example, a height sensor or the like may be used to detect a foreign matter by detecting a portion protruding from the upper surface of the lifting table 86.
  • the detection sensor 83 is provided on the pair of support legs 70, but it is provided on the guide rail on the moving side or another structure that moves together with the guide rail on the moving side. May be.
  • the accurate position confirmation and removal of the electronic components falling on the lifting table 86 detected by the detection sensor 83 may be performed automatically instead of operator management.
  • an accurate position may be confirmed by an image pickup device (for example, a mark camera) that moves together with the mounting head 26, and an electronic component may be removed by a component holder (for example, a suction nozzle) included in the mounting head 26.
  • the light used by the detection sensor 83 is preferably parallel light, and for example, laser or laser light may be used.
  • Substrate transfer holding device (transfer device) 50: Conveyor device 80: Circuit board (board) 83: Detection sensor 86: Lifting table (mounting table) 88: Backup pin (support pin)

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

This transporting device is provided with a conveyor device for transporting a substrate; supporting pins that are placed on a placement table and support, from below, the substrate transported to a predetermined position by the conveyor device; and a detection sensor that detects the presence/absence of the supporting pins placed on the placement table, wherein the detection sensor detects whether foreign matters are present in a predetermined region of the placement table on which the supporting pins are not placed.

Description

搬送装置Transport device
 本発明は、基板を搬送するコンベア装置と、コンベア装置により所定の位置に搬送された基板を下方から支持する支持ピンとを備える搬送装置に関するものである。 The present invention relates to a transfer device that includes a conveyor device that transfers a substrate and a support pin that supports a substrate that has been transferred to a predetermined position by the conveyor device from below.
 搬送装置には、下記特許文献1に記載されているように、基板を搬送するコンベア装置と、コンベア装置により所定の位置に搬送された基板を下方から支持する支持ピンとを備えるものがある。また、搬送装置では、下記特許文献2に記載されているように、異物の有無を検出することが望まれている。 As described in Patent Document 1 below, some transfer devices include a conveyor device that transfers a substrate and a support pin that supports a substrate that has been transferred to a predetermined position by the conveyor device from below. Further, it is desired that the carrier device detects the presence or absence of a foreign substance as described in Patent Document 2 below.
特開2009-259962号公報JP, 2009-259962, A 特開2014-14989号公報JP, 2014-14989, A
 本発明の課題は、基板を搬送するコンベア装置と、コンベア装置により所定の位置に搬送された基板を下方から支持する支持ピンとを備える搬送装置において、異物の有無を好適に検出することである。 An object of the present invention is to suitably detect the presence or absence of a foreign matter in a transfer device that includes a conveyor device that transfers a substrate and a support pin that supports a substrate that is transferred to a predetermined position by the conveyor device from below.
 上記課題を解決するために、本明細書は、基板を搬送するコンベア装置と、載置台に載置され、前記コンベア装置により所定の位置に搬送された基板を下方から支持する支持ピンと、前記載置台に載置された前記支持ピンの有無を検出するための検出センサとを備え、前記検出センサが、前記支持ピンが載置されていない前記載置台の所定の領域の異物の有無を検出する搬送装置を開示する。 In order to solve the above problems, the present specification discloses a conveyor device that conveys a substrate, a support pin that is placed on a mounting table and that supports a substrate that is conveyed to a predetermined position by the conveyor device from below, A detection sensor for detecting the presence or absence of the support pin placed on the mounting table, wherein the detection sensor detects the presence or absence of foreign matter in a predetermined region of the mounting table on which the support pin is not mounted. A carrier device is disclosed.
 本開示によれば、載置台に載置された支持ピンの有無を検出するための検出センサによって、支持ピンが載置されていない載置台の所定の領域の異物の有無が検出される。これにより、基板を搬送するコンベア装置と、コンベア装置により所定の位置に搬送された基板を下方から支持する支持ピンとを備える搬送装置において、異物の有無を好適に検出することができる。 According to the present disclosure, the presence or absence of foreign matter in a predetermined area of the mounting table on which the support pins are not mounted is detected by the detection sensor for detecting the presence or absence of the supporting pins mounted on the mounting table. Thus, the presence/absence of foreign matter can be suitably detected in the transport device including the conveyor device that transports the substrate and the support pin that supports the substrate transported from the conveyor device to the predetermined position from below.
電子部品装着装置を示す斜視図である。It is a perspective view which shows an electronic component mounting apparatus. 基板搬送保持装置を示す斜視図である。It is a perspective view showing a substrate transportation holding device. 基板搬送保持装置を示す平面図である。It is a top view which shows a board|substrate conveyance holding device. 図3のAA線における断面図である。It is sectional drawing in the AA line of FIG. 図3のBB線における断面図である。FIG. 4 is a sectional view taken along the line BB in FIG. 3. 回路基板をクランプした状態の基板搬送保持装置を示す図である。It is a figure which shows the board|substrate conveyance holding device in the state which clamped the circuit board. 制御装置を示すブロック図である。It is a block diagram which shows a control apparatus. 回路基板を適切にクランプできない状態の基板搬送保持装置を示す図である。It is a figure which shows the board|substrate conveyance holding device in the state which cannot clamp a circuit board appropriately. 回路基板を適切にクランプできない状態の基板搬送保持装置を示す図である。It is a figure which shows the board|substrate conveyance holding device in the state which cannot clamp a circuit board appropriately. 変形例の基板搬送保持装置を示す平面図である。It is a top view which shows the substrate conveyance holding apparatus of a modification.
 以下、本発明を実施するための形態として、本発明の実施例を、図を参照しつつ詳しく説明する。 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings as a mode for carrying out the present invention.
 図1に、電子部品装着装置10を示す。電子部品装着装置10は、1つのシステムベース12と、そのシステムベース12の上に並んで配設された2つの装着機16とを有している。なお、以下の説明では、装着機16の並ぶ方向をX方向と称し、その方向に直角な水平の方向をY方向と称し、その方向に直角な鉛直方向をZ方向と称する。 FIG. 1 shows an electronic component mounting device 10. The electronic component mounting apparatus 10 has one system base 12 and two mounting machines 16 arranged side by side on the system base 12. In the following description, the direction in which the mounting machines 16 are arranged is referred to as the X direction, the horizontal direction perpendicular to the direction is referred to as the Y direction, and the vertical direction perpendicular to the direction is referred to as the Z direction.
 各装着機16は、主に、装着機本体20、1対の基板搬送保持装置22、装着ヘッド移動装置(以下、「移動装置」と略す場合がある)24、装着ヘッド26、供給装置28、制御装置(図7参照)30を備えている。装着機本体20は、フレーム31と、そのフレーム31に上架されたビーム32とによって構成されている。 Each mounting machine 16 mainly includes a mounting machine main body 20, a pair of substrate transfer/holding devices 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 24, a mounting head 26, a supply device 28, A control device (see FIG. 7) 30 is provided. The mounting machine body 20 includes a frame 31 and a beam 32 mounted on the frame 31.
 1対の基板搬送保持装置22の各々は、図2乃至図5に示すように、コンベア装置50と、基板保持装置52とを有している。図2は、基板搬送保持装置22を斜め上方からの視点において示す図であり、図3は、基板搬送保持装置22を上方からの視点において示す図である。また、図4は、図3のAA線からの視点において示す図であり、図5は、図3のBB線からの視点において示す図である。 Each of the pair of substrate transport holding devices 22 has a conveyor device 50 and a substrate holding device 52, as shown in FIGS. 2 to 5. FIG. 2 is a diagram showing the substrate transport holding device 22 from an obliquely upper perspective, and FIG. 3 is a diagram showing the substrate transport holding device 22 from an upper perspective. Further, FIG. 4 is a diagram showing a perspective from the AA line of FIG. 3, and FIG. 5 is a diagram showing a perspective from the BB line of FIG.
 コンベア装置50は、1対のガイドレール60,62と、各ガイドレール60,62に設けられたコンベアベルト66を有している。1対のガイドレール60,62は、互いに平行に配設されており、各ガイドレール60,62は、1対の支持脚70を介して支持プレート72の上面において支持されている。なお、ガイドレール60,62の延びる方向をX方向、そのX方向に水平に直行する方向をY方向、X方向及びY方向の両方に直交する方向をZ方向と称する。 The conveyor device 50 has a pair of guide rails 60, 62 and a conveyor belt 66 provided on each guide rail 60, 62. The pair of guide rails 60, 62 are arranged in parallel to each other, and each guide rail 60, 62 is supported on the upper surface of a support plate 72 via a pair of support legs 70. The direction in which the guide rails 60 and 62 extend is called the X direction, the direction that is orthogonal to the X direction horizontally is called the Y direction, and the direction orthogonal to both the X direction and the Y direction is called the Z direction.
 また、各ガイドレール60,62の側面には2個のプーリ74,76がY方向を軸心として配設されている。それら2個のプーリ74,76は、各ガイドレール60,62の両端部に配設されている。なお、ガイドレール60とガイドレール62とは、互いのプーリ74,76の配設面が対向する状態で配設されている。そして、コンベアベルト66が、各ガイドレール60,62のプーリ74,76に巻き掛けられており、コンベアベルト66は、電磁モータ(図7参照)78の駆動により周回する。 Also, two pulleys 74 and 76 are arranged on the side surfaces of the guide rails 60 and 62 with the Y direction as the axis center. The two pulleys 74, 76 are arranged at both ends of each guide rail 60, 62. The guide rail 60 and the guide rail 62 are arranged such that the surfaces on which the pulleys 74 and 76 are arranged face each other. The conveyor belt 66 is wound around the pulleys 74 and 76 of the guide rails 60 and 62, and the conveyor belt 66 is rotated by driving an electromagnetic motor (see FIG. 7) 78.
 なお、コンベアベルト66の周回方向は、図4での時計回りの方向とされている。これにより、コンベアベルト66の上に回路基板(図5参照)80を載置することで、回路基板80は、プーリ74が配設されている側からプーリ76が配設されている側に向かって、コンベアベルト66によって搬送される。 The orbiting direction of the conveyor belt 66 is the clockwise direction in FIG. Thus, by placing the circuit board (see FIG. 5) 80 on the conveyor belt 66, the circuit board 80 faces from the side where the pulley 74 is arranged to the side where the pulley 76 is arranged. And is conveyed by the conveyor belt 66.
 また、コンベア装置50は、幅変更装置(図7参照)81を有しており、ガイドレール60とガイドレール62との間の距離を変更することが可能とされている。詳しくは、ガイドレール62を支持する1対の支持脚70は、Y方向にスライド可能とされている。そして、それら1対の支持脚70は、電磁モータ(図7参照)82の駆動によりY方向の任意の位置に移動する。この際、それら1対の支持脚70により支持されているガイドレール62は、ガイドレール60と平行な状態で、ガイドレール60に対して接近・離間する。これにより、ガイドレール60とガイドレール62との間の距離が変更される。このように、ガイドレール60とガイドレール62との間の距離が変更されることで、種々のサイズの回路基板80を搬送することが可能となる。 Further, the conveyor device 50 has a width changing device (see FIG. 7) 81, and can change the distance between the guide rails 60 and 62. Specifically, the pair of support legs 70 that support the guide rails 62 are slidable in the Y direction. Then, the pair of support legs 70 is moved to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 7) 82. At this time, the guide rails 62 supported by the pair of support legs 70 approach and separate from the guide rails 60 while being parallel to the guide rails 60. As a result, the distance between the guide rail 60 and the guide rail 62 is changed. In this way, by changing the distance between the guide rails 60 and 62, it becomes possible to carry circuit boards 80 of various sizes.
 また、ガイドレール62の1対の支持脚70には、検出センサ83が配設されている。検出センサ83は、投光部84と受光部85とにより構成されており、投光部84は、1対の支持脚70の一方に配設され、受光部85は、1対の支持脚70の他方に配設されている。なお、投光部84と受光部85とは、互いに対向するように配設されている。これにより、投光部84から照射された光が、受光部85により受光される。そして、投光部84と受光部85との間に、何らかの物が存在する場合に、その物に、投光部84から照射された光が遮られることで、検出センサ83により、投光部84と受光部85との間に何らかのものが存在することが検出される。 A detection sensor 83 is arranged on the pair of support legs 70 of the guide rail 62. The detection sensor 83 includes a light projecting portion 84 and a light receiving portion 85. The light projecting portion 84 is arranged on one of the pair of support legs 70, and the light receiving portion 85 is connected to the pair of support legs 70. Is arranged on the other side of. The light projecting portion 84 and the light receiving portion 85 are arranged so as to face each other. As a result, the light emitted from the light projecting unit 84 is received by the light receiving unit 85. Then, when any object is present between the light projecting section 84 and the light receiving section 85, the light emitted from the light projecting section 84 is blocked by the object, so that the detection sensor 83 causes the light projecting section. It is detected that something exists between 84 and the light receiving unit 85.
 また、基板保持装置52は、昇降テーブル86と、複数のバックアップピン88と、テーブル昇降機構90と、クランプ装置92とを有している。昇降テーブル86は、概して矩形をなし、各ガイドレール60,62の1対の支持脚70の間に延びだすように、ガイドレール60,62の下方に配置されている。また、昇降テーブル86の上面には、例えば、複数のバックアップピン88が、3×3列に並んだ状態、つまり、X方向に3列に並び、Y方向に3列に並んだ状態で、昇降テーブル86の上に立設されている。その昇降テーブル86は、テーブル昇降機構90を介して、支持プレート72の上面に配設されており、テーブル昇降機構90は、電磁モータ(図7参照)96の駆動により昇降テーブル86を昇降させる。 The substrate holding device 52 also includes a lifting table 86, a plurality of backup pins 88, a table lifting mechanism 90, and a clamp device 92. The lifting table 86 has a generally rectangular shape, and is arranged below the guide rails 60 and 62 so as to extend between the pair of support legs 70 of each guide rail 60 and 62. Further, on the upper surface of the elevating table 86, for example, a plurality of backup pins 88 are arranged in 3×3 rows, that is, 3 rows in the X direction and 3 rows in the Y direction. It stands on the table 86. The lifting table 86 is disposed on the upper surface of the support plate 72 via the table lifting mechanism 90, and the table lifting mechanism 90 drives the electromagnetic motor (see FIG. 7) 96 to lift the lifting table 86.
 また、クランプ装置92は、1対のクランプバー100と、1対のクランププレート102とを有している。クランプバー100は、概して板状をなし、クランプバー100の長さ寸法が、昇降テーブル86のX方向における長さ寸法より長くされている。そして、1対のクランプバー100の各々は、各クランプバー100の両端の間に昇降テーブル86が位置するように、ガイドレール60,62の上面に固定されている。つまり、クランプバー100の下方に昇降テーブル86が延び出すように、クランプバー100がガイドレール60,62の上面に固定されている。なお、クランプバー100は、ガイドレール60,62に配設されているコンベアベルト66の上方に延びだすように、ガイドレール60,62の上面に固定されている。 The clamp device 92 also has a pair of clamp bars 100 and a pair of clamp plates 102. The clamp bar 100 has a generally plate shape, and the length dimension of the clamp bar 100 is longer than the length dimension of the elevating table 86 in the X direction. Each of the pair of clamp bars 100 is fixed to the upper surfaces of the guide rails 60 and 62 so that the lifting table 86 is located between both ends of each clamp bar 100. That is, the clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so that the elevating table 86 extends below the clamp bar 100. The clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to extend above the conveyor belt 66 arranged on the guide rails 60 and 62.
 また、クランププレート102は、概して矩形の板状をなし、クランププレート102の長手方向における長さ寸法が、クランプバー100の長さ寸法と略同じとされている。クランププレート102は、コンベアベルト66の上方に延びだすクランプバー100の下方において、クランプバー100と同じ方向に延び出しており、立設した状態で、ガイドレール60,62により上下方向にスライド可能に保持されている。つまり、ガイドレール60,62のコンベアベルト66が配設された側の側面に、保持具108が配設されている。そして、そのガイドレール60,62の側面と、クランププレート102の側面とが対向した状態で、クランプバー100の下方において、クランププレート102が保持具108により上下方向にスライド可能に保持されている。 The clamp plate 102 has a generally rectangular plate shape, and the length dimension of the clamp plate 102 in the longitudinal direction is substantially the same as the length dimension of the clamp bar 100. The clamp plate 102 extends in the same direction as the clamp bar 100 below the clamp bar 100 that extends above the conveyor belt 66, and is vertically slidable by the guide rails 60 and 62 in an upright state. Is held. That is, the holder 108 is provided on the side surface of the guide rails 60 and 62 on the side where the conveyor belt 66 is provided. Then, with the side surfaces of the guide rails 60 and 62 and the side surface of the clamp plate 102 facing each other, the clamp plate 102 is held by the holder 108 so as to be slidable in the vertical direction below the clamp bar 100.
 なお、ガイドレール60,62により上下方向にスライド可能に保持されたクランププレート102が、最も下方にスライドした際に、図5に示すように、クランププレート102の上端は、コンベアベルト66の上面より下方に位置しており、クランププレート102の下端は、上昇していない状態での昇降テーブル86の上面より上方に位置している。 When the clamp plate 102 held by the guide rails 60 and 62 so as to be slidable in the vertical direction slides to the bottom, the upper end of the clamp plate 102 is located above the upper surface of the conveyor belt 66, as shown in FIG. It is located below, and the lower end of the clamp plate 102 is located above the upper surface of the lifting table 86 in a state where it is not lifted.
 このような構造により、基板搬送保持装置22では、コンベア装置50により搬送された回路基板80が基板保持装置52によりクランプされる。詳しくは、回路基板80が電子部品装着装置10に搬入され、コンベア装置50により所定の作業位置まで搬送される。なお、回路基板80が作業位置まで搬送されると、コンベア装置50のコンベアベルト66の上に載置される回路基板80の両縁が、図5に示すように、上下方向においてクランプバー100とクランププレート102との間に位置する。 With such a structure, in the board transfer/holding device 22, the circuit board 80 transferred by the conveyor device 50 is clamped by the board holding device 52. Specifically, the circuit board 80 is carried into the electronic component mounting apparatus 10 and conveyed by the conveyor device 50 to a predetermined work position. When the circuit board 80 is conveyed to the working position, both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50 are vertically aligned with the clamp bar 100 as shown in FIG. It is located between the clamp plate 102.
 次に、回路基板80が作業位置まで搬送されると、テーブル昇降機構90の作動により、昇降テーブル86が上昇する。この際、クランププレート102の下端が昇降テーブル86の上面に接触し、昇降テーブル86の上昇に伴って、クランププレート102も上昇する。そして、クランププレート102の上昇に伴って、クランププレート102の上端が、コンベアベルト66により支持されている回路基板80の下面に接触する。また、昇降テーブル86の上面に載置されているバックアップピン88の高さ寸法は、クランププレート102の上下方向の長さ寸法と同じとされている。 Next, when the circuit board 80 is transported to the work position, the lifting/lowering table 86 is lifted by the operation of the table lifting/lowering mechanism 90. At this time, the lower end of the clamp plate 102 contacts the upper surface of the elevating table 86, and the clamp plate 102 also rises as the elevating table 86 rises. Then, as the clamp plate 102 rises, the upper end of the clamp plate 102 contacts the lower surface of the circuit board 80 supported by the conveyor belt 66. Further, the height dimension of the backup pin 88 mounted on the upper surface of the lifting table 86 is the same as the length dimension of the clamp plate 102 in the vertical direction.
 このため、クランププレート102の上端が、コンベアベルト66により支持されている回路基板80の下面に接触したタイミングで、バックアップピン88の上端も、回路基板80の下面に接触する。そして、昇降テーブル86が上昇することで、コンベアベルト66により支持されていた回路基板80が、クランププレート102とバックアップピン88とによりコンベアベルト66から持ち上げられ、上昇する。この際、図6に示すように、回路基板80の上面がクランプバー100の下面に接触する位置まで、テーブル昇降機構90が作動し、回路基板80が、クランププレート102とバックアップピン88とにより持ち上げられる。これにより、回路基板80が、中央部において、下方からバックアップピン88により支持された状態で、両縁において、クランプバー100とクランププレート102とによって挟持される。 Therefore, at the timing when the upper end of the clamp plate 102 contacts the lower surface of the circuit board 80 supported by the conveyor belt 66, the upper end of the backup pin 88 also contacts the lower surface of the circuit board 80. Then, as the lifting table 86 rises, the circuit board 80 supported by the conveyor belt 66 is lifted from the conveyor belt 66 by the clamp plate 102 and the backup pin 88 and rises. At this time, as shown in FIG. 6, the table lifting mechanism 90 operates until the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, and the circuit board 80 is lifted by the clamp plate 102 and the backup pin 88. To be As a result, the circuit board 80 is sandwiched by the clamp bar 100 and the clamp plate 102 at both edges while being supported by the backup pin 88 from below in the central portion.
 また、図1に示すように、移動装置24は、XYロボット型の移動装置である。移動装置24は、スライダ110をX方向にスライドさせる電磁モータ(図7参照)112と、Y方向にスライドさせる電磁モータ(図7参照)114とを備えている。スライダ110には、装着ヘッド26が取り付けられており、その装着ヘッド26は、2つの電磁モータ112,114の作動によって、フレーム31上の任意の位置に移動する。 Further, as shown in FIG. 1, the moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (see FIG. 7) 112 that slides the slider 110 in the X direction and an electromagnetic motor (see FIG. 7) 114 that slides the slider 110 in the Y direction. The mounting head 26 is attached to the slider 110, and the mounting head 26 is moved to an arbitrary position on the frame 31 by the operation of the two electromagnetic motors 112 and 114.
 装着ヘッド26は、回路基板80に対して電子部品を装着するものである。装着ヘッド26は、下端面に設けられた吸着ノズル120を有している。吸着ノズル120は、負圧エア,正圧エア通路を介して、正負圧供給装置(図7参照)122に通じている。吸着ノズル120は、負圧によって電子部品を吸着保持し、保持した電子部品を正圧によって離脱する。また、装着ヘッド26は、吸着ノズル120を昇降させるノズル昇降装置(図7参照)124を有している。そのノズル昇降装置124によって、装着ヘッド26は、保持する電子部品の上下方向の位置を変更する。 The mounting head 26 mounts electronic components on the circuit board 80. The mounting head 26 has a suction nozzle 120 provided on the lower end surface. The suction nozzle 120 communicates with a positive/negative pressure supply device (see FIG. 7) 122 via negative pressure air and positive pressure air passages. The suction nozzle 120 sucks and holds an electronic component by negative pressure, and separates the held electronic component by positive pressure. Further, the mounting head 26 has a nozzle lifting device (see FIG. 7) 124 for lifting the suction nozzle 120. The mounting head 26 changes the vertical position of the held electronic component by the nozzle lifting device 124.
 供給装置28は、フィーダ型の供給装置であり、フレーム31の前方側の端部に配設されている。供給装置28は、テープフィーダ130を有している。テープフィーダ130は、テープ化部品を巻回させた状態で収容している。テープ化部品は、電子部品がテーピング化されたものである。そして、テープフィーダ130は、送出装置(図7参照)132によって、テープ化部品を送り出す。これにより、フィーダ型の供給装置28は、テープ化部品の送り出しによって、電子部品を供給位置において供給する。 The supply device 28 is a feeder-type supply device, and is arranged at the front end of the frame 31. The supply device 28 has a tape feeder 130. The tape feeder 130 accommodates the taped parts in a wound state. The tape component is a taped electronic component. Then, the tape feeder 130 feeds the tape-formed component by the feeding device (see FIG. 7) 132. As a result, the feeder-type supply device 28 supplies the electronic component at the supply position by feeding the tape-formed component.
 制御装置30は、図7に示すように、コントローラ140と複数の駆動回路142とを有している。複数の駆動回路142は、上記電磁モータ78,82,96,112,114、正負圧供給装置122、ノズル昇降装置124、送出装置132に接続されている。コントローラ140は、CPU,ROM,RAM等を備え、コンピュータを主体とするものであり、複数の駆動回路142に接続されている。これにより、基板搬送保持装置22、移動装置24等の作動が、コントローラによって制御される。また、コントローラ140は、基板搬送保持装置22の検出センサ83に接続されている。このため、検出センサ83による検出結果が、コントローラ140に入力される。 The control device 30 has a controller 140 and a plurality of drive circuits 142, as shown in FIG. 7. The plurality of drive circuits 142 are connected to the electromagnetic motors 78, 82, 96, 112, 114, the positive/negative pressure supply device 122, the nozzle lifting device 124, and the delivery device 132. The controller 140 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 142. As a result, the operation of the substrate transport holding device 22, the moving device 24, etc. is controlled by the controller. Further, the controller 140 is connected to the detection sensor 83 of the substrate transport holding device 22. Therefore, the detection result of the detection sensor 83 is input to the controller 140.
 電子部品装着装置10では、上述した構成によって、基板搬送保持装置22に保持された回路基板80に対して、装着ヘッド26によって装着作業を行うことが可能とされている。具体的には、コントローラ140の指令により、コンベア装置50が、回路基板80を作業位置まで搬送し、その位置において、基板保持装置52が回路基板80をクランプする。また、テープフィーダ130は、コントローラ140の指令により、テープ化部品を送り出し、電子部品を供給位置において供給する。そして、装着ヘッド26が、コントローラ140の指令により、電子部品の供給位置の上方に移動し、吸着ノズル120によって電子部品を吸着保持する。続いて、装着ヘッド26は、コントローラ140の指令により、回路基板80の上方に移動し、保持している電子部品を回路基板80に装着する。 With the configuration described above, the electronic component mounting apparatus 10 is capable of mounting the circuit board 80 held by the board transfer and holding apparatus 22 by the mounting head 26. Specifically, according to a command from the controller 140, the conveyor device 50 conveys the circuit board 80 to the working position, and the board holding device 52 clamps the circuit board 80 at the position. Further, the tape feeder 130 sends out the tape-formed component and supplies the electronic component at the supply position according to a command from the controller 140. Then, the mounting head 26 moves to a position above the electronic component supply position in response to a command from the controller 140, and the suction nozzle 120 sucks and holds the electronic component. Subsequently, the mounting head 26 moves to the upper side of the circuit board 80 according to a command from the controller 140, and mounts the held electronic component on the circuit board 80.
 このように、電子部品装着装置10では、作業位置まで搬送された回路基板80が、基板保持装置52によってクランプされ、そのクランプされた状態の回路基板80に対して電子部品の装着作業が実行される。基板保持装置52によりクランプされた状態の回路基板80では、回路基板80がクランプバー100とクランププレート102とにより挟持され、固定されることで、適切な電子部品の装着作業が担保される。また、回路基板80が基板保持装置52によりクランプされた状態において、回路基板80の中央部は、バックアップピン88により支持される。これにより、回路基板80の撓みなど防止した状態での電子部品の装着作業が担保される。 As described above, in the electronic component mounting apparatus 10, the circuit board 80 conveyed to the work position is clamped by the board holding device 52, and the mounting work of the electronic component is performed on the circuit board 80 in the clamped state. It In the circuit board 80 clamped by the board holding device 52, the circuit board 80 is sandwiched and fixed by the clamp bar 100 and the clamp plate 102, so that proper electronic component mounting work is ensured. Further, in the state where the circuit board 80 is clamped by the board holding device 52, the central portion of the circuit board 80 is supported by the backup pin 88. As a result, the mounting work of the electronic component is ensured while the circuit board 80 is prevented from bending.
 ただし、基板搬送保持装置22の上に電子部品が落下する場合があり、このような場合に、落下した電子部品が要因となり、バックアップピン88を昇降テーブル86の上面に適切に配設することができない、あるいは、回路基板80を適切にクランプできない虞がある。例えば、基板搬送保持装置22の上に落下した電子部品150が、昇降テーブル86の上面において、ガイドレール62の下方に位置する場合がある。このような場合に、昇降テーブル86が上昇すると、図8に示すように、昇降テーブル86の上面とガイドレール62の下端との間に、電子部品150が挟まることで、昇降テーブル86の上昇が阻害される。この際、バックアップピン88とクランププレート102とにより、コンベアベルト66から持ち上げられた回路基板80が、クランプバー100に接触する前、つまり、クランプバー100とクランププレート102とにより挟持される前に、昇降テーブル86の上昇が停止する。このような場合には、回路基板80を、クランプバー100とクランププレート102とにより挟持することができず、固定できない。 However, an electronic component may fall onto the substrate transfer/holding device 22. In such a case, the dropped electronic component may cause the backup pin 88 to be properly disposed on the upper surface of the lifting table 86. There is a risk that the circuit board 80 cannot be clamped properly. For example, the electronic component 150 that has dropped onto the substrate transport holding device 22 may be located below the guide rail 62 on the upper surface of the elevating table 86. In such a case, when the lifting table 86 is raised, as shown in FIG. 8, the electronic component 150 is sandwiched between the upper surface of the lifting table 86 and the lower end of the guide rail 62, so that the lifting table 86 is raised. Be hindered. At this time, before the circuit board 80 lifted from the conveyor belt 66 by the backup pin 88 and the clamp plate 102 comes into contact with the clamp bar 100, that is, before being clamped by the clamp bar 100 and the clamp plate 102, The lifting of the lifting table 86 stops. In such a case, the circuit board 80 cannot be clamped by the clamp bar 100 and the clamp plate 102, and cannot be fixed.
 また、基板搬送保持装置22の上に落下した電子部品150が、昇降テーブル86の上面において、クランププレート102の下方に位置する場合がある。このような場合に、昇降テーブル86が上昇すると、図9に示すように、昇降テーブル86の上面とクランププレート102の下端との間に、電子部品150が挟まることで、クランププレート102の上端位置が、バックアップピン88の上端位置より、電子部品150の高さ寸法に相当する距離、高くなる。このため、昇降テーブル86の上昇に伴って、回路基板80が、クランプバー100とクランププレート102とにより挟持されることで、固定されるが、バックアップピン88により下方から支持されない。 Also, the electronic component 150 that has dropped onto the substrate transport holding device 22 may be located below the clamp plate 102 on the upper surface of the lifting table 86. In such a case, when the elevating table 86 rises, the electronic component 150 is sandwiched between the upper surface of the elevating table 86 and the lower end of the clamp plate 102 as shown in FIG. Is higher than the upper end position of the backup pin 88 by a distance corresponding to the height dimension of the electronic component 150. Therefore, the circuit board 80 is fixed by being clamped by the clamp bar 100 and the clamp plate 102 as the lift table 86 is raised, but is not supported from below by the backup pin 88.
 このように、基板搬送保持装置22の上に落下した電子部品150が、昇降テーブル86の上面において、ガイドレール62及びクランププレート102の下方に位置するような場合には、回路基板80を適切にクランプすることができない虞がある。そこで、昇降テーブル86の上に落下した電子部品150の有無が検出センサ83によって検出される。なお、検出センサ83は、昇降テーブル86の所定の位置に載置されたバックアップピン88の有無を検出するために設けられたものである。 In this way, when the electronic component 150 that has dropped onto the board transport holding device 22 is located below the guide rails 62 and the clamp plate 102 on the upper surface of the elevating table 86, the circuit board 80 is properly mounted. It may not be possible to clamp. Therefore, the detection sensor 83 detects the presence or absence of the electronic component 150 that has dropped onto the lift table 86. The detection sensor 83 is provided to detect the presence/absence of the backup pin 88 placed at a predetermined position on the elevating table 86.
 具体的には、検出センサ83を構成する投光部84と受光部85とは、ガイドレール62を支持する1対の支持脚70に配設されている。また、ガイドレール62を支持する1対の支持脚70は、ガイドレール60とガイドレール62との間の距離を変更するために、Y方向にスライド可能とされている。このように、ガイドレール62を支持する1対の支持脚70がY方向にスライド可能とされ、ガイドレール60とガイドレール62との間の距離が変更されることで、種々のサイズの回路基板に対する装着作業を実行することができる。 Specifically, the light projecting portion 84 and the light receiving portion 85 that form the detection sensor 83 are arranged on a pair of support legs 70 that support the guide rail 62. Further, the pair of support legs 70 that support the guide rails 62 are slidable in the Y direction in order to change the distance between the guide rails 60 and 62. In this way, the pair of support legs 70 supporting the guide rails 62 are slidable in the Y direction, and the distance between the guide rails 60 and 62 is changed, so that circuit boards of various sizes can be obtained. Can be mounted.
 このため、例えば、大きなサイズの回路基板への装着作業が実行された後に、その回路基板より小さいサイズの回路基板が作業対象となる場合には、ガイドレール62をガイドレール60に向かってスライドさせることで、ガイドレール60とガイドレール62との間の距離が短くされる。この際、大きなサイズの回路基板の装着作業時に昇降テーブル86の上に載置されていたバックアップピン88は、ガイドレール62をスライドさせる前に、昇降テーブル86の上から取り除かれるが、作業者がバックアップピン88を取り除く作業を忘れる場合がある。このような場合に、ガイドレール62をガイドレール60に向かってスライドさせると、昇降テーブル86の上に残存しているバックアップピン88にクランププレート102,ガイドレール62などが接触し、クランププレート102,ガイドレール62,バックアップピン88などが破損する虞がある。 For this reason, for example, after the mounting work on the large-sized circuit board is executed, when the circuit board of a smaller size than the circuit board is the work target, the guide rail 62 is slid toward the guide rail 60. As a result, the distance between the guide rail 60 and the guide rail 62 is shortened. At this time, the backup pins 88 placed on the elevating table 86 during the work of mounting a large-sized circuit board are removed from the elevating table 86 before the guide rail 62 is slid. The operation of removing the backup pin 88 may be forgotten. In such a case, when the guide rail 62 is slid toward the guide rail 60, the clamp plate 102, the guide rail 62, etc. come into contact with the backup pin 88 remaining on the lifting table 86, and the clamp plate 102, The guide rail 62, the backup pin 88, etc. may be damaged.
 このため、ガイドレール62を支持する支持脚70に検出センサ83が設けられており、ガイドレール62のスライド時において、検出センサ83による検出が行われる。つまり、投光部84から光が照射され、受光部85による光の受光の有無が検出される。そして、ガイドレール62のスライド時において、受光部85により光が検出されている場合には、ガイドレール62は、継続してスライドする。一方、ガイドレール62のスライド時において、受光部85による光の検出が途絶えると、そのタイミングにおいて、ガイドレール62のスライドが停止する。これにより、ガイドレール62のスライド時において、昇降テーブル86の上に残存しているバックアップピン88へのクランププレート102,ガイドレール62などの接触が防止される。また、ガイドレール62のスライド時において、受光部85による光の検出が途絶えたタイミングで、エラー報知がなされる。これにより、昇降テーブル86の上からバックアップピン88を取り除く作業を、作業者に促すことができる。 Therefore, the detection sensor 83 is provided on the support leg 70 that supports the guide rail 62, and the detection sensor 83 detects when the guide rail 62 slides. That is, the light is emitted from the light projecting unit 84, and it is detected whether or not the light receiving unit 85 receives the light. Then, when light is detected by the light receiving unit 85 when the guide rail 62 slides, the guide rail 62 continuously slides. On the other hand, when the detection of light by the light receiving unit 85 is stopped during the sliding of the guide rail 62, the sliding of the guide rail 62 stops at that timing. As a result, when the guide rail 62 slides, contact of the clamp plate 102, the guide rail 62 and the like with the backup pin 88 remaining on the lifting table 86 is prevented. Further, when the guide rail 62 is slid, an error notification is given at the timing when the detection of light by the light receiving unit 85 is interrupted. As a result, the operator can be encouraged to remove the backup pin 88 from the lift table 86.
 このように、ガイドレール62を支持する1対の支持脚70には、昇降テーブル86に残存するバックアップピン88の有無を検出するための検出センサ83が設けられている。そこで、その検出センサ83を利用して、昇降テーブル86の上に落下した電子部品150の有無が検出される。具体的には、例えば、段取り替え時などの、電子部品装着装置10から回路基板が搬出された後のタイミング、電子部品装着装置10に回路基板が搬入される前のタイミングにおいて、昇降テーブル86の上から全てのバックアップピン88が取り除かれる。つまり、電子部品装着装置10において、回路基板80が搬送されていないタイミングにおいて、昇降テーブル86の上から全てのバックアップピン88が取り除かれる。 As described above, the pair of support legs 70 that support the guide rails 62 are provided with the detection sensor 83 for detecting the presence or absence of the backup pin 88 remaining on the lift table 86. Therefore, the detection sensor 83 is used to detect the presence/absence of the electronic component 150 that has dropped onto the lifting table 86. Specifically, for example, at the timing after the circuit board is unloaded from the electronic component mounting apparatus 10 at the time of setup change, or before the circuit board is loaded into the electronic component mounting apparatus 10, the lifting table 86 is moved. From the top all backup pins 88 are removed. That is, in the electronic component mounting apparatus 10, all the backup pins 88 are removed from the upper and lower table 86 at the timing when the circuit board 80 is not transported.
 そして、バックアップピン88が取り除かれた昇降テーブル86の上面のうちの、ガイドレール62がスライド可能な全領域において、検出センサ83により電子部品150の有無が検出される。つまり、例えば、ガイドレール62がガイドレール60から最も離間した位置から、ガイドレール60に向かってスライドし、その際に、検出センサ83による検出が行われる。この際、受光部85による光の検出が途絶えることなく、ガイドレール62がガイドレール60に最も接近する位置までスライドした場合に、昇降テーブル86の上に異物、つまり、電子部品150は落下していない。そこで、受光部85による光の検出が途絶えることなく、ガイドレール62がガイドレール60に最も接近する位置までスライドした場合に、コンベア装置50による回路基板80の搬送及び、バックアップピン88の配置、そして、基板保持装置52による回路基板80のクランプが実行される。 Then, the presence or absence of the electronic component 150 is detected by the detection sensor 83 in the entire area where the guide rail 62 can slide on the upper surface of the lifting table 86 from which the backup pin 88 has been removed. That is, for example, the guide rail 62 slides toward the guide rail 60 from the position farthest from the guide rail 60, and at that time, the detection sensor 83 performs detection. At this time, when the guide rail 62 slides to the position closest to the guide rail 60 without interrupting the detection of the light by the light receiving unit 85, the foreign matter, that is, the electronic component 150 is dropped on the lift table 86. Absent. Therefore, when the guide rail 62 slides to the position closest to the guide rail 60 without interrupting the detection of light by the light receiving unit 85, the conveyor device 50 conveys the circuit board 80 and arranges the backup pins 88, and The circuit board 80 is clamped by the substrate holding device 52.
 一方、ガイドレール62のスライド時に、受光部85による光の検出が途絶えた場合に、昇降テーブル86に落下している電子部品150が検出され、エラー報知がなされる。これにより、作業者が、昇降テーブル86の上に落下している電子部品150を認識し、電子部品150を取り除くことが可能となる。そして、作業者が電子部品150を取り除いた後に、ガイドレール62のスライド時における電子部品150の検出を再開するためのボタンを操作することで、ガイドレール62がガイドレール60に向ってスライドし、検出センサ83による電子部品150の検出が再開される。この際、受光部85による光の検出が途絶えることなく、ガイドレール62がガイドレール60に最も接近する位置までスライドした場合に、コンベア装置50による回路基板80の搬送及び、基板保持装置52による回路基板80のクランプが実行される。これにより、昇降テーブル86の上に落下した電子部品150が要因となり、バックアップピン88の配置不良や、回路基板80を適切にクランプできない状況をなくすことができる。なお、バックアップピン88が取り除かれた昇降テーブル86において、受光部85による光の検出が途絶えた場合には、昇降テーブル86に落下した電子部品150だけでなく、置き忘れられた冶具,大きな埃等も、検出センサ83により検出される。このため、バックアップピン88が取り除かれた昇降テーブル86では、昇降テーブル86に落下した電子部品150,置き忘れられた冶具,大きな埃等の異物が、検出センサ83により検出される。 On the other hand, when the detection of light by the light receiving unit 85 is stopped when the guide rail 62 is slid, the electronic component 150 that has fallen on the elevating table 86 is detected and an error is notified. As a result, the operator can recognize the electronic component 150 that has dropped onto the lifting table 86 and remove the electronic component 150. Then, after the operator removes the electronic component 150, the guide rail 62 slides toward the guide rail 60 by operating the button for restarting the detection of the electronic component 150 when the guide rail 62 slides. The detection of the electronic component 150 by the detection sensor 83 is restarted. At this time, when the detection of light by the light receiving unit 85 is not interrupted and the guide rail 62 slides to the position closest to the guide rail 60, the conveyor device 50 conveys the circuit board 80 and the circuit by the board holding device 52. The substrate 80 is clamped. As a result, the electronic component 150 that has dropped onto the lifting table 86 is a factor, and it is possible to eliminate the arrangement failure of the backup pin 88 and the situation where the circuit board 80 cannot be clamped properly. In addition, in the elevating table 86 from which the backup pin 88 has been removed, when the light detection by the light receiving unit 85 is stopped, not only the electronic components 150 dropped on the elevating table 86, but also misplaced jigs, large dust, etc. , Detected by the detection sensor 83. Therefore, on the lifting table 86 from which the backup pin 88 has been removed, the detection sensor 83 detects the electronic components 150 dropped on the lifting table 86, the misplaced jig, and large foreign substances such as dust.
 また、バックアップピン88が載置されていない状態において、昇降テーブル86の上面のうちの、ガイドレール62がスライド可能な全領域において、検出センサ83による異物の検出を行うことが好ましいが、検出に要する時間が長くなる。このため、検出センサ83による異物の検出時間を短縮したい場合、例えば、段取り替え時間が短い場合などには、基板保持装置52によるクランプ時に電子部品150等の異物が挟まる虞のある領域のみを所定の領域として、検出センサ83により検出される。 Further, in the state where the backup pin 88 is not placed, it is preferable that the detection sensor 83 detects foreign matter in the entire area of the upper surface of the elevating table 86 where the guide rail 62 can slide. It takes a long time. Therefore, when it is desired to shorten the detection time of the foreign matter by the detection sensor 83, for example, when the setup change time is short, only the area in which the foreign matter such as the electronic component 150 may be caught when the substrate holding device 52 clamps is determined. Is detected by the detection sensor 83.
 詳しくは、上述したように、基板保持装置52によるクランプ時において、昇降テーブル86が上昇した際に、昇降テーブル86の上に落下している電子部品150は、ガイドレール62若しくはクランププレート102と、昇降テーブル86とによって挟まれる。このため、ガイドレール62及びクランププレート102の下方に、電子部品150等の異物が落下していなければ、基板保持装置52によるクランプは担保される。そこで、ガイドレール62がスライド可能な昇降テーブル86の全領域のうちの、ガイドレール62及びクランププレート102の下方の領域のみが、検出センサ83により検出される。これにより、検出時間の短縮を図るとともに、基板保持装置52によるクランプを担保することが可能となる。 More specifically, as described above, when the substrate holding device 52 is clamped, the electronic component 150 that has fallen onto the lifting table 86 when the lifting table 86 is raised is the electronic component 150 that has fallen onto the guide rail 62 or the clamp plate 102. It is sandwiched by the lifting table 86. Therefore, unless foreign matter such as the electronic component 150 has fallen below the guide rail 62 and the clamp plate 102, the clamp by the substrate holding device 52 is secured. Therefore, of the entire area of the lifting table 86 on which the guide rail 62 can slide, only the area below the guide rail 62 and the clamp plate 102 is detected by the detection sensor 83. As a result, the detection time can be shortened and the clamping by the substrate holding device 52 can be secured.
 なお、ガイドレール62がスライド可能な昇降テーブル86の全領域のうちの、ガイドレール62及びクランププレート102の下方の領域には、当然、バックアップピン88は載置されていないため、昇降テーブル86の上からバックアップピン88を取り除く作業も必要ない。このため、検出センサ83による検出時間の短縮だけでなく、検出センサ83により異物を検出するための前準備に要する時間をも短縮することができる。つまり、昇降テーブル86のバックアップピン88が載置されていない領域であって、基板保持装置52による回路基板80のクランプを邪魔する領域のみを所定の領域として、検出センサ83により検出することで、短時間の作業によって、基板保持装置52によるクランプを担保することができる。 Of all the areas of the lifting table 86 on which the guide rails 62 can slide, the backup pins 88 are naturally not placed in the areas below the guide rails 62 and the clamp plate 102. It is not necessary to remove the backup pin 88 from above. Therefore, not only the detection time by the detection sensor 83 can be shortened, but also the time required for the preparation for detecting the foreign matter by the detection sensor 83 can be shortened. That is, the detection sensor 83 detects only a region where the backup pins 88 of the lift table 86 are not placed and which interferes with the clamping of the circuit board 80 by the substrate holding device 52 as the predetermined region. By the work for a short time, the clamp by the substrate holding device 52 can be secured.
 ちなみに、上記実施例において、基板搬送保持装置22は、搬送装置の一例である。コンベア装置50は、コンベア装置の一例である。回路基板80は、基板の一例である。検出センサ83は、検出センサの一例である。昇降テーブル86は、載置台の一例である。バックアップピン88は、支持ピンの一例である。 By the way, in the above embodiment, the substrate transfer/holding device 22 is an example of the transfer device. The conveyor device 50 is an example of a conveyor device. The circuit board 80 is an example of a board. The detection sensor 83 is an example of a detection sensor. The lifting table 86 is an example of a mounting table. The backup pin 88 is an example of a support pin.
 なお、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。具体的には、例えば、上記実施例では、昇降テーブル86の上に載置されているバックアップピン88が取り除かれた後に、そのバックアップピン88が取り除かれた領域を所定の領域として、検出センサ83による異物の検出が実行されているが、昇降テーブル86の上にバックアップピン88が載置された状態で、そのバックアップピン88が載置された位置を含む領域を所定の領域として、検出センサ83による異物の検出が実行されてもよい。つまり、バックアップピン88が載置されていない領域だけでなく、バックアップピン88が載置された位置をも、検出センサ83により異物の検出が実行されてもよい。ただし、ガイドレール62等とバックアップピン88との当接を防止するべく、図10に示すように、ガイドレール62を支持する1対の支持脚70に、ガイドレール60に向って延び出す1対のアーム160を配設する。そして、1対のアーム160の一方の先端部に、投光部84を配設し、1対のアーム160の他方の先端部に、受光部85を配設する。このように、投光部84及び受光部85を配設することで、検出センサ83による異物の検出時に、ガイドレール62をガイドレール60に向ってスライドさせても、ガイドレール62等とバックアップピン88との当接を防止することができる。ただし、昇降テーブル86の上にバックアップピン88が載置された状態で、検出センサ83による異物の検出が実行される場合には、バックアップピン88の載置位置に関する情報が制御装置30に予め記憶されている。そして、バックアップピン88の載置位置において、検出センサ83により異物が検出されても、つまり、バックアップピン88が異物として検出されても、その検出結果がキャンセルされる。このため、制御装置30に記憶されている情報に応じたバックアップピン88の載置位置以外で異物が検出された場合にのみ、エラー報知がなされる。言い換えれば、バックアップピン88の載置位置で異物が検出された場合に、その検出結果がキャンセルされるため、エラー報知はなされない。これにより、昇降テーブル86の上にバックアップピン88が載置された領域であっても、結果的は、バックアップピン88が塔置されていない領域を所定の領域として、検出センサ83による電子部品150等の異物の検出を行うことができる。 It should be noted that the present invention is not limited to the above-described embodiments, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, after the backup pin 88 placed on the lifting table 86 is removed, the area where the backup pin 88 is removed is set as a predetermined area and the detection sensor 83 is used. Although the foreign matter is detected by the detection sensor 83 with the backup pin 88 placed on the lifting table 86, the area including the position where the backup pin 88 is placed is set as a predetermined area. Detection of foreign matter may be performed by. That is, the detection sensor 83 may detect the foreign matter not only in the area where the backup pin 88 is not placed, but also in the position where the backup pin 88 is placed. However, in order to prevent contact between the guide rail 62 and the like and the backup pin 88, as shown in FIG. 10, a pair of support legs 70 supporting the guide rail 62 are provided with a pair of support legs extending toward the guide rail 60. The arm 160 of FIG. Then, the light projecting portion 84 is disposed at one tip portion of the pair of arms 160, and the light receiving portion 85 is disposed at the other tip portion of the pair of arms 160. By disposing the light projecting unit 84 and the light receiving unit 85 in this way, even when the guide rail 62 is slid toward the guide rail 60 when the detection sensor 83 detects a foreign substance, the guide rail 62 and the backup pin are The contact with 88 can be prevented. However, when the detection sensor 83 detects a foreign substance while the backup pin 88 is placed on the lift table 86, information about the placement position of the backup pin 88 is stored in the control device 30 in advance. Has been done. Then, even if the detection sensor 83 detects a foreign substance at the mounting position of the backup pin 88, that is, even if the backup pin 88 is detected as a foreign substance, the detection result is canceled. Therefore, the error is notified only when the foreign matter is detected at a position other than the mounting position of the backup pin 88 according to the information stored in the control device 30. In other words, when a foreign object is detected at the mounting position of the backup pin 88, the detection result is canceled, so no error notification is given. As a result, even if the backup pin 88 is placed on the lifting table 86, the electronic component 150 by the detection sensor 83 is eventually set as a predetermined region in which the backup pin 88 is not placed. It is possible to detect foreign matter such as.
 また、上記実施例では、異物の有無が、投光部84と受光部85とにより構成される検出センサ83によって検出されるが、他の種類の検出センサにより異物の有無が検出されてもよい。具体的には、例えば、高さセンサなどを利用して、昇降テーブル86の上面から突出した箇所を検出することで、異物を検出してもよい。 Further, in the above embodiment, the presence or absence of foreign matter is detected by the detection sensor 83 including the light projecting unit 84 and the light receiving unit 85, but the presence or absence of foreign matter may be detected by other types of detection sensors. .. Specifically, for example, a height sensor or the like may be used to detect a foreign matter by detecting a portion protruding from the upper surface of the lifting table 86.
 また、上記実施例では、検出センサ83は1対の支持脚70に配設されているが、移動する側のガイドレール、あるいは移動する側のガイドレールとともに移動する別の構造物に配設されてもよい。 Further, in the above embodiment, the detection sensor 83 is provided on the pair of support legs 70, but it is provided on the guide rail on the moving side or another structure that moves together with the guide rail on the moving side. May be.
 また、検出センサ83によって検出された昇降テーブル86の上に落下している電子部品の正確な位置の確認や取り除きを、作業者管理ではなく、自動で行なってもよい。例えば、正確な位置の確認を装着ヘッド26とともに移動する撮像装置(例えば、マークカメラ)で、電子部品の取り除きを装着ヘッド26が備える部品保持具(例えば、吸着ノズル)で行なってもよい。 Also, the accurate position confirmation and removal of the electronic components falling on the lifting table 86 detected by the detection sensor 83 may be performed automatically instead of operator management. For example, an accurate position may be confirmed by an image pickup device (for example, a mark camera) that moves together with the mounting head 26, and an electronic component may be removed by a component holder (for example, a suction nozzle) included in the mounting head 26.
 また、検出センサ83で用いられる光は平行光が望ましく、例えば、レーザーやレーザー光などを用いてもよい。 Also, the light used by the detection sensor 83 is preferably parallel light, and for example, laser or laser light may be used.
 22:基板搬送保持装置(搬送装置)  50:コンベア装置  80:回路基板(基板)  83:検出センサ  86:昇降テーブル(載置台)  88:バックアップピン(支持ピン) 22: Substrate transfer holding device (transfer device) 50: Conveyor device 80: Circuit board (board) 83: Detection sensor 86: Lifting table (mounting table) 88: Backup pin (support pin)

Claims (4)

  1.  基板を搬送するコンベア装置と、
     載置台に載置され、前記コンベア装置により所定の位置に搬送された基板を下方から支持する支持ピンと、
     前記載置台に載置された前記支持ピンの有無を検出するための検出センサと
     を備え、
     前記検出センサが、
     前記支持ピンが載置されていない前記載置台の所定の領域の異物の有無を検出する搬送装置。
    A conveyor device for conveying the substrate,
    A support pin mounted on a mounting table and supporting from below the substrate transported to a predetermined position by the conveyor device,
    And a detection sensor for detecting the presence or absence of the support pin placed on the mounting table,
    The detection sensor,
    A carrier device for detecting the presence or absence of a foreign matter in a predetermined area of the mounting table on which the support pin is not mounted.
  2.  前記所定の領域が、前記載置台に載置された前記支持ピンが取り除かれた後の領域である請求項1に記載の搬送装置。 The transfer device according to claim 1, wherein the predetermined area is an area after the support pins placed on the mounting table are removed.
  3.  前記検出センサが、
     前記コンベア装置により基板が搬送されていないタイミングで、前記所定の領域の異物の有無を検出する請求項1または請求項2に記載の搬送装置。
    The detection sensor,
    The transport device according to claim 1, wherein the presence or absence of foreign matter in the predetermined area is detected at a timing when the substrate is not transported by the conveyor device.
  4.  前記検出センサが、
     前記所定の領域と異なり、前記支持ピンが載置されている前記載置台の載置位置も、異物の有無を検出するが、当該載置位置での検出結果をキャンセルする請求項1ないし請求項3のいずれか1つに記載の搬送装置。
    The detection sensor,
    Different from the predetermined area, the mounting position of the mounting table on which the support pin is mounted also detects the presence or absence of foreign matter, but cancels the detection result at the mounting position. 3. The transfer device according to any one of 3.
PCT/JP2019/001769 2019-01-22 2019-01-22 Transporting device WO2020152766A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7418142B2 (en) 2019-09-03 2024-01-19 株式会社Fuji Board-to-board work equipment and foreign object detection method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235312A (en) * 2007-03-16 2008-10-02 Hitachi High-Tech Instruments Co Ltd Printed board supporting device
JP2015228452A (en) * 2014-06-02 2015-12-17 ヤマハ発動機株式会社 Detector, detection method, substrate transfer device and substrate processing device
JP2016146454A (en) * 2015-02-02 2016-08-12 Juki株式会社 Electronic component mounting device and method for rearranging substrate support member

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235312A (en) * 2007-03-16 2008-10-02 Hitachi High-Tech Instruments Co Ltd Printed board supporting device
JP2015228452A (en) * 2014-06-02 2015-12-17 ヤマハ発動機株式会社 Detector, detection method, substrate transfer device and substrate processing device
JP2016146454A (en) * 2015-02-02 2016-08-12 Juki株式会社 Electronic component mounting device and method for rearranging substrate support member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7418142B2 (en) 2019-09-03 2024-01-19 株式会社Fuji Board-to-board work equipment and foreign object detection method

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