JP7126839B2 - Substrate transfer device and electronic component mounting device - Google Patents

Description

The present invention relates to a board transfer apparatus and an electronic component mounting apparatus.

An electronic component mounting apparatus is used in the production of electronic equipment. 2. Description of the Related Art In the technical field related to electronic component mounting apparatuses, substrate transfer apparatuses having three buffers, an in-buffer, a center buffer, and an out-buffer, are known. As substrate transport devices having three buffers, a 3-buffer 3-motor type substrate transport device and a 3-buffer 1-motor type substrate transport device are known.

A 3-buffer, 3-motor type substrate transfer apparatus is a substrate transfer apparatus in which a transfer belt is provided for each of the three buffers and a motor is provided for each of the three transfer belts. By operating the motor, the substrate supported by the transport belt is transported. By stopping the operation of the motor, the transport of the substrate is stopped.

The 3-buffer 1-motor type substrate transfer apparatus is a substrate transfer apparatus in which one transfer belt is provided over three buffers and one motor is provided for each transfer belt. By operating the motor, the substrate supported by the transport belt is transported. The transfer of the substrate is stopped by contacting the substrate with a stopper member provided in each of the three buffers.

JP 2011-014777 A

In a 3-buffer, 1-motor type substrate transfer device, when the substrate is stopped at high speed, if the substrate touches the stopper member at high speed, the substrate may be damaged or the electronic components mounted on the substrate may be displaced. have a nature. Therefore, in the 3-buffer 1-motor type substrate transfer apparatus, the motor is controlled so that the transfer speed of the transfer belt decreases when the substrate approaches the stopper member.

In a three-buffer, one-motor type substrate transport apparatus, one transport belt is driven by one motor. Therefore, for example, if the motor is controlled so that the substrate approaches the stopper member in the out-buffer and the conveying speed of the conveying belt decreases, the conveying speed of the conveying belt also decreases in the in-buffer. Although there is no need to reduce the transport speed of the transport belt in the in-buffer, if the transport speed of the transport belt in the in-buffer decreases, the time required for the substrate to move from the in-buffer to the center buffer becomes longer. As a result, the board transfer efficiency of the board transfer apparatus is lowered, and the electronic device production efficiency of the electronic component mounting apparatus is lowered.

An object of an aspect of the present invention is to suppress a decrease in substrate transfer efficiency and to suppress a decrease in electronic device production efficiency.

According to the first aspect of the present invention, a conveying belt that supports and conveys a substrate in a conveying direction, a motor that generates power to drive the conveying belt, and a substrate that is supported by the conveying belt is brought into contact with the substrate. a center stopper member for stopping the substrate at the mounting position; a weight sensor for detecting the substrate being transported by the transport belt before the substrate is transported to the loading standby position; and a support for supporting the weight stopper member and the weight sensor. A substrate transfer apparatus is provided that includes a member and a guide mechanism that guides the support member in the transfer direction.

According to a second aspect of the present invention, an electronic component mounting device comprising: the substrate transfer apparatus according to the first aspect; and a mounting head for mounting an electronic component on the substrate arranged at the mounting position by the substrate transfer apparatus. An apparatus is provided.

According to the aspect of the present invention, it is possible to suppress a decrease in substrate transport efficiency, and it is possible to suppress a decrease in electronic device production efficiency.

FIG. 1 is a plan view schematically showing an electronic component mounting apparatus according to the first embodiment. FIG. 2 is a side view schematically showing the substrate transfer device according to the first embodiment. FIG. 3 is a side view schematically showing the substrate transfer device according to the first embodiment. FIG. 4 is a functional block diagram showing the control device of the substrate transfer device according to the first embodiment. FIG. 5 is a side view schematically showing the substrate transfer device according to the first embodiment. FIG. 6 is a side view schematically showing the substrate transfer device according to the first embodiment. FIG. 7 is a side view schematically showing the substrate transfer device according to the first embodiment. FIG. 8 is a flow chart showing a substrate transfer method according to the first embodiment. FIG. 9 is a schematic diagram for explaining the effects of the transport method according to the first embodiment. FIG. 10 is a side view schematically showing the substrate transfer device according to the second embodiment.

Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. The constituent elements of the embodiments described below can be combined as appropriate. Also, some components may not be used.

In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to the XYZ orthogonal coordinate system. The direction parallel to the X-axis in the horizontal plane is the X-axis direction, the direction parallel to the Y-axis in the horizontal plane orthogonal to the X-axis is the Y-axis direction, and the direction parallel to the Z-axis orthogonal to the X-axis and the Y-axis is Let it be in the Z-axis direction. The rotation or tilting direction about the X axis is the θX direction, the rotating or tilting direction about the Y axis is the θY direction, and the rotating or tilting direction about the Z axis is the θZ direction. The XY plane is a horizontal plane. The Z-axis direction is the vertical direction.

[First embodiment]
<Electronic component mounting equipment>
FIG. 1 is a plan view schematically showing an electronic component mounting apparatus 1 according to this embodiment. The electronic component mounting apparatus 1 mounts an electronic component C on a substrate P. As shown in FIG. As shown in FIG. 1, an electronic component mounting apparatus 1 includes an electronic component supply device 2 that supplies electronic components C, a substrate transfer device 3 that transfers a substrate P, and a nozzle 4 that detachably holds the electronic components C. a mounting head 5 for mounting an electronic component C on a substrate P; a head moving device 6 for moving the mounting head 5; a nozzle moving device 7 for moving a nozzle 4; , a mounting head 5 , a main frame 8 for supporting a head moving device 6 , and a mounting control device 9 .

The electronic component supply device 2 supplies electronic components C to be mounted on the board P to the component supply position AP. The electronic component supply device 2 has a feeder bank 20 that supports a plurality of tape feeders 21 . In the feeder bank 20, a plurality of tape feeders 21 are arranged in the X-axis direction. The tape feeder 21 transports the carrier tape supplied from the tape reel in a specified transport direction. In this embodiment, the direction in which the carrier tape is conveyed by the tape feeder 21 is the Y-axis direction. A plurality of electronic components C are held on the carrier tape. A component supply position AP is defined in a portion of the tape feeder 21 . The tape feeder 21 conveys the carrier tape so that the electronic component C held on the carrier tape is arranged at the component supply position AP. By conveying the carrier tape, each of the plurality of electronic components C is sequentially arranged at the component supply position AP.

In this embodiment, the electronic component supply device 2 is arranged on both sides of the board transfer device 3 in the Y-axis direction. Two mounting heads 5 are arranged so as to correspond to the two electronic component feeders 2 respectively. Note that the electronic component supply device 2 may be arranged only on one side of the substrate transfer device 3 in the Y-axis direction. Only one mounting head 5 may be arranged.

The substrate transport device 3 transports the substrate P in a specified transport direction. In this embodiment, the transport direction of the substrate P by the substrate transport device 3 is the X-axis direction. The substrate transport device 3 includes a transport belt 34 that supports and transports the substrate P in the X-axis direction, and a motor 35 that generates power to drive the transport belt 34 . The substrate transport device 3 transports the substrate P to the mounting position MP.

The mounting head 5 has a nozzle 4 that detachably holds the electronic component C. As shown in FIG. A plurality of nozzles 4 are provided on the mounting head 5 . The nozzle 4 may be a suction nozzle that sucks and holds the electronic component C, or a grasping nozzle that holds the electronic component C by sandwiching it. When the nozzle 4 is a suction nozzle, the nozzle 4 can suction the electronic component C by operating a vacuum system connected to the nozzle 4 . When the nozzle 4 is a gripping nozzle, the nozzle 4 can pinch the electronic component C by operating an actuator capable of driving the nozzle 4 .

The head moving device 6 moves the mounting head 5 in the X-axis direction and the Y-axis direction. The head moving device 6 has an X-axis moving device 61 that moves the mounting head 5 in the X-axis direction and a Y-axis moving device 62 that moves the mounting head 5 in the Y-axis direction. The X-axis moving device 61 includes an X-axis guide rail that guides the mounting head 5 in the X-axis direction, and at least a portion of the X-axis moving device 61 is arranged between the mounting head 5 and the X-axis guide rail to move the mounting head 5 in the X-axis direction. and a linear actuator that generates power for movement. The Y-axis moving device 62 has a Y-axis guide rail that guides the X-axis guide rail in the Y-axis direction, and at least a part of the Y-axis guide rail is arranged between the X-axis guide rail and the Y-axis guide rail. and a linear actuator for generating power to move in the axial direction.

The nozzle moving device 7 moves the nozzle 4 in the Z-axis direction and the θZ direction. The nozzle moving device 7 is provided on the mounting head 5 . A nozzle moving device 7 is provided for each of the plurality of nozzles 4 . The nozzle moving device 7 has a Z-axis motor that generates power to move the nozzle 4 in the Z-axis direction, and a θZ motor that generates power to rotate the nozzle 4 in the θZ direction.

The nozzle 4 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by a head moving device 6 and a nozzle moving device 7 . The mounting head 5 can be moved between a component supply position AP and a mounting position MP by a head moving device 6 . The mounting head 5 holds the electronic component C with the nozzle 4 at the component supply position AP and moves to the mounting position MP. The mounting head 5 mounts the electronic component C on the board P placed at the mounting position MP by the board transfer device 3 .

The mounting control device 9 includes a computer system and controls operations of the nozzle 4 and the mounting head 5 . The mounting control device 9 has an arithmetic processing device including a processor such as a CPU (Central Processing Unit), and a storage device including memory and storage such as ROM (Read Only Memory) or RAM (Random Access Memory). The arithmetic processing unit controls the operation of the nozzle 4 and the mounting head 5 according to a production program that defines the mounting process procedure for mounting the electronic component C on the board P. A production program is stored in a storage device.

The mounting control device 9 controls the movement of the mounting head 5 by controlling the head moving device 6 . The mounting control device 9 controls the movement of the nozzle 4 by controlling the nozzle moving device 7 . When the nozzle 4 is a suction nozzle, the mounting control device 9 controls the vacuum system connected to the nozzle 4 to control the suction operation of the nozzle 4 . When the nozzle 4 is a gripping nozzle, the mounting control device 9 controls the gripping operation of the nozzle 4 by controlling an actuator capable of driving the gripping nozzle.

<Substrate transfer device>
FIG. 2 is a side view schematically showing the substrate transfer device 3 according to this embodiment. FIG. 3 is a plan view schematically showing the substrate transfer device 3 according to this embodiment. As shown in FIGS. 1, 2, and 3, the substrate transport device 3 includes a transport belt 34 that supports and transports the substrate P in the X-axis direction, and a motor 35 that generates power to drive the transport belt 34. Prepare.

The substrate transport device 3 transports the substrate P in the +X direction. The substrate transfer device 3 has a carry-in port 38 defined at the end on the -X side, into which the substrate P is carried in, and a carry-out port 39 defined at the end on the +X side, through which the substrate P is carried out.

A carry-in side external device is connected to the carry-in port 38 . At least one of an electronic component mounting device different from the electronic component mounting device 1 and a printing device that prints solder on the board P is exemplified as the carry-in side external device.

A carry-out side external device is connected to the carry-out port 39 . At least one of an electronic component mounting device other than the electronic component mounting device 1 and a reflow furnace that heats the board P to melt the solder on the board P is exemplified as the carry-out side external device.

The substrate P is carried into the carry-in port 38 from the carry-in side external device. The board P loaded into the carry-in port 38 is transported in the +X direction, and the electronic component C is mounted at the mounting position MP. The board P on which the electronic component C is mounted is unloaded from the unloading port 39 to the unloading-side external device.

The substrate transport device 3 has an in-buffer 31 , a center buffer 32 and an out-buffer 33 . The in-buffer 31, the center buffer 32, and the out-buffer 33 are arranged in series in the X-axis direction.

The in-buffer 31 is an area in which the substrate P loaded from the loading-side external device is kept waiting. The carry-in port 38 is defined at the −X side end of the in-buffer 31 .

The center buffer 32 is an area where the mounting process for mounting the electronic component C on the substrate P is performed. A center buffer 32 is defined between the in-buffer 31 and the out-buffer 33 . The mounting head 5 can move over the entire area of the center buffer 32 within the XY plane.

The out-buffer 33 is an area in which the substrate P to be unloaded to the unloading-side external device is kept on standby. The carry-out port 39 is defined at the +X side end of the out-buffer 33 .

A carry-in standby position CP is defined in the in-buffer 31 . The carry-in standby position CP is a position where the substrate P carried in from the carry-in side external device is made to stand by. The board transfer device 3 waits in the in-buffer 31 before the board P on which the electronic component C is mounted is carried into the center buffer 32 . When making the substrate P wait in the in-buffer 31 before being loaded into the center buffer 32, the substrate transfer device 3 stops the substrate P at the loading standby position CP.

A mounting position MP is defined in the center buffer 32 . The mounting position MP is a position where the board P on which the electronic component C is mounted is arranged. When mounting the electronic component C on the board P, the board transfer device 3 stops the board P at the mounting position MP.

A carry-out waiting position TP is defined in the out buffer 33 . The unloading standby position TP is a position where the substrate P to be unloaded to the unloading-side external device is kept on standby. The board transfer device 3 causes the board P on which the electronic component C is mounted to wait in the out-buffer 33 before being carried out to the carry-out side external device. When making the substrate P wait in the out-buffer 33 before being unloaded to the unloading-side external device, the substrate transport device 3 stops the substrate P at the unloading standby position TP.

The transport belt 34 extends in the X-axis direction. A pair of transport belts 34 are provided in the Y-axis direction. One transport belt 34 supports the +Y side edge of the lower surface of the substrate P. As shown in FIG. One transport belt 34 supports the edge of the lower surface of the substrate P on the -Y side. The transport belt 34 is driven while supporting the substrate P by the operation of the motor 35 to transport the substrate P in the +X direction.

The substrate transfer device 3 is a 3-buffer 1-motor type substrate transfer device. The conveying belt 34 is arranged over each of the in-buffer 31 , the center buffer 32 and the out-buffer 33 . One motor 35 is provided. The power generated by one motor 35 drives the conveyor belt 34 .

The substrate conveying device 3 includes a driving pulley 36 and a driven pulley 37 that rotate in contact with the conveying belt 34 . The driving pulley 36 supports the +X side end of the conveying belt 34 . The driven pulley 37 supports the −X side end of the conveyor belt 34 . Motor 35 is connected to drive pulley 36 to rotate drive pulley 36 . As the drive pulley 36 rotates by the power generated by the motor 35, the substrate P is transported in the X-axis direction while the transport belt 34 in contact with the drive pulley 36 is supported by the drive pulley 36 and the driven pulley 37. Drive like

The substrate transfer device 3 supports a holding member 70 facing at least a portion of the upper surface of the substrate P stopped at the mounting position MP and at least a portion of the lower surface of the substrate P stopped at the mounting position MP, and ascends. and a clamping member 80 that sandwiches at least part of the substrate P between itself and the holding member 70 . The holding member 70 and the clamping member 80 are arranged on the center buffer 32 .

Further, the substrate transport device 3 includes a weight stopper member 41 for stopping the substrate P in the in-buffer 31, a center stopper member 42 for stopping the substrate P in the center buffer 32, and a center stopper member for stopping the substrate P in the out-buffer 33. 42.

Further, the substrate transport device 3 includes an in-sensor 50 that detects the substrate P at the carry-in port 38, a weight sensor 51 that detects the substrate P in the in-buffer 31, a center sensor 52 that detects the substrate P in the center buffer 32, and an out-sensor 52 that detects the substrate P at the center buffer 32. and an out sensor 53 for detecting the substrate P in the buffer 33 .

The substrate transport device 3 also includes a support member 90 that supports the weight stopper member 41 and the weight sensor 51, and a guide mechanism 91 that guides the support member 90 in the X-axis direction.

The holding member 70 is arranged above the upper surface of the transport belt 34 that supports the substrate P. As shown in FIG. The holding members 70 are arranged on the +Y side and the -Y side of the center of the pair of conveyor belts 34 in the Y-axis direction. Further, the holding member 70 is arranged inside the pair of conveyor belts 34 in the Y-axis direction. The holding member 70 is a plate-like member elongated in the X-axis direction.

The clamp member 80 is movable in the Z-axis direction by actuation of the clamp actuator 83 . An example of the clamp actuator 83 is an air cylinder. The clamp members 80 are arranged on the +Y side and the -Y side of the center of the pair of conveyor belts 34 in the Y-axis direction. In addition, the clamp member 80 is arranged inside the pair of conveyor belts 34 in the Y-axis direction.

The clamp member 80 includes a first clamp member 81 that supports a first area AR1 on the bottom surface of the substrate P, and a second clamp member 81 that supports a second area AR2 on the bottom surface of the substrate P that is closer to the loading standby position CP than the first area AR1. and a clamping member 82 .

Each of the first area AR1 and the second area AR2 is an edge area of the lower surface of the substrate P in the Y-axis direction. The second area AR2 is defined on the -X side of the first area AR1. Each of the first area AR1 and the second area AR2 is defined inside the pair of conveyor belts 34 in the Y-axis direction.

The first clamp member 81 is a plate-like member elongated in the X-axis direction. The first clamp member 81 has a support surface 81S capable of supporting the first region AR1 on the bottom surface of the substrate P. As shown in FIG. The clamp actuator 83 moves the first clamp member 81 in the Z-axis direction. The support surface 81S of the first clamp member 81 is arranged below the upper surface of the transport belt 34 that supports the substrate P in the state where the first clamp member 81 is arranged at the lowest position in the movable range in the Z-axis direction. be. The support surface 81S of the first clamp member 81 is arranged above the upper surface of the transport belt 34 that supports the substrate P in a state where the first clamp member 81 is arranged at the uppermost position in the movable range in the Z-axis direction. be.

The first clamp member 81 is lifted by the operation of the clamp actuator 83 and supports the substrate P by bringing the support surface 81S into contact with the first region AR1 on the bottom surface of the substrate P. As shown in FIG. The first clamp member 81 is lowered by the actuation of the clamp actuator 83 to separate the support surface 81S from the lower surface of the substrate P, thereby releasing the substrate P from its support.

The second clamp member 82 is rotatably supported by the first clamp member 81 in the θY direction. A plurality of second clamp members 82 are arranged in the X-axis direction. In this embodiment, two second clamp members 82 are arranged in the X-axis direction. Note that three or more second clamp members 82 may be arranged in the X-axis direction. One second clamp member 82 may be arranged in the X-axis direction. The second clamp member 82 has a support surface 82S capable of supporting the second area AR2 on the bottom surface of the substrate P. As shown in FIG.

The second clamp member 82 supports the substrate P by bringing the support surface 82S into contact with the second region AR2 on the bottom surface of the substrate P. As shown in FIG. The second clamp member 82 releases the support of the substrate P by rotating in the θY direction and separating the support surface 82S from the lower surface of the substrate P. As shown in FIG.

That is, the first clamp member 81 can switch between supporting and releasing the substrate P by moving in the Z-axis direction. The second clamp member 82 can switch between supporting and releasing the substrate P by rotating in the θY direction.

The clamp member 80 is movable in the Z-axis direction so as to pass between the pair of conveyor belts 34 while being separated from the conveyor belts 34 without contacting the conveyor belts 34 . The substrate P carried from the in-buffer 31 to the center buffer 32 stops at the mounting position MP while being supported on the upper surface of the transport belt 34 . When the clamp member 80 lifts while supporting at least a part of the lower surface of the substrate P stopped at the mounting position MP in a state separated from the transport belt 34 , the substrate P is lifted away from the upper surface of the transport belt 34 . When the clamp member 80 is further raised while supporting the substrate P, the substrate P is sandwiched between the holding member 70 and the clamp member 80 . Thereby, the position of the board|substrate P is fixed. The electronic component C is mounted on the board P by the mounting head 5 while the position of the board P is fixed.

The weight stopper member 41 contacts the substrate P supported by the transport belt 34 before the substrate P is carried into the mounting position MP of the center buffer 32, and moves the substrate P to the loading standby position CP of the in-buffer 31. stop. The weight stopper member 41 is arranged between the pair of conveyor belts 34 in the Y-axis direction. The weight stopper member 41 is movable in the Z-axis direction by the operation of the weight stopper actuator 44 . An example of the weight stopper actuator 44 is an air cylinder.

At least a part of the weight stopper member 41 is arranged above the upper surface of the transport belt 34 that supports the substrate P when the transport of the substrate P is stopped. At least part of the weight stopper member 41 is arranged above the upper surface of the conveying belt 34 , so that the weight stopper member 41 contacts the end of the substrate P on the +X side. As a result, the transport of the substrate P by the transport belt 34 is restricted, and the substrate P stops.

When transporting the substrate P, the weight stopper member 41 is arranged below the upper surface of the transport belt 34 . By disposing the weight stopper member 41 below the upper surface of the conveying belt 34 , the weight stopper member 41 and the substrate P are separated, and the substrate P is released from being stopped by the weight stopper member 41 . The substrate P is movable in the +X direction while being supported by the transport belt 34 .

The center stopper member 42 contacts the substrate P supported by the transport belt 34 and stops the substrate P at the mounting position MP of the center buffer 32 . The center stopper member 42 is arranged between the pair of conveyor belts 34 in the Y-axis direction. The center stopper member 42 is arranged between the pair of first clamp members 81 . The center stopper member 42 is rotatably supported by the first clamp member 81 in the θY direction. The center stopper member 42 is rotatable in the θY direction by the operation of the center stopper actuator 45 . A stepping motor, for example, is exemplified as the center stopper actuator 45 .

At least part of the center stopper member 42 is arranged above the upper surface of the transport belt 34 when the transport of the substrate P is stopped. At least part of the center stopper member 42 is arranged above the upper surface of the transport belt 34 , so that the center stopper member 42 contacts the edge of the substrate P on the +X side. As a result, the transport of the substrate P by the transport belt 34 is restricted, and the substrate P stops.

When transporting the substrate P, the center stopper member 42 is arranged below the upper surface of the transport belt 34 . By disposing the center stopper member 42 below the upper surface of the conveying belt 34 , the center stopper member 42 and the substrate P are separated, and the substrate P is released from being stopped by the center stopper member 42 . The substrate P is movable in the +X direction while being supported by the transport belt 34 .

After the substrate P is unloaded from the mounting position MP of the center buffer 32, the out-stopper member 43 contacts the substrate P supported by the transport belt 34 to stop the substrate P at the unloading standby position TP of the out-buffer 33. Let The out-stopper member 43 is arranged between the pair of conveyor belts 34 in the Y-axis direction. The out-stopper member 43 is movable in the Z-axis direction by the operation of the out-stopper actuator 46 . An example of the out-stopper actuator 46 is an air cylinder.

At least part of the out-stopper member 43 is arranged above the upper surface of the transport belt 34 when the transport of the substrate P is stopped. At least part of the out-stopper member 43 is arranged above the upper surface of the conveying belt 34, so that the out-stopper member 43 contacts the +X side end of the substrate P. As shown in FIG. As a result, the transport of the substrate P by the transport belt 34 is restricted, and the substrate P stops.

When transporting the substrate P, the out-stopper member 43 is arranged below the upper surface of the transport belt 34 . By arranging the out-stopper member 43 below the upper surface of the conveying belt 34 , the out-stopper member 43 and the substrate P are separated, and the stoppage of the substrate P by the out-stopper member 43 is released. The substrate P is movable in the +X direction while being supported by the transport belt 34 .

In this embodiment, each of the weight stopper member 41, the center stopper member 42, and the out stopper member 43 can stop the transport of the substrate P while the transport belt 34 is being driven. For example, the weight stopper actuator 44 moves the weight stopper member 41 so that at least part of the weight stopper member 41 is arranged above the upper surface of the conveying belt 34 while the motor 35 is operating. can be done. When the weight stopper member 41 is in contact with the +X side edge of the substrate P, the transport belt 34 can continue to be driven. The transport belt 34 can be driven while rubbing at least a portion of the lower surface of the substrate P. As shown in FIG. Similarly, the center stopper actuator 45 moves the center stopper member 42 so that at least part of the center stopper member 42 is arranged above the upper surface of the conveying belt 34 while the motor 35 is operating. be able to. The out-stopper actuator 46 can move the out-stopper member 43 so that at least part of the out-stopper member 43 is arranged above the upper surface of the conveying belt 34 while the motor 35 is operating. .

The in-sensor 50 detects the substrate P carried into the carry-in port 38 from the carry-in side external device. The in-sensor 50 has, for example, an emitting portion that emits detection light and a light receiving portion that receives the detection light. When the substrate P is arranged in the optical path of the detection light, at least a part of the detection light emitted from the emitting portion and reflected by the substrate P is received by the light receiving portion. The state in which the substrate P is arranged in the optical path of the detection light differs from the state in which the substrate P is not arranged in the light receiving section. The in-sensor 50 can detect whether or not the substrate P exists in the optical path of the detection light based on the light receiving state of the light receiving section when the detection light is emitted from the emission section.

The weight sensor 51 detects the substrate P transported by the transport belt 34 before the substrate P is loaded into the loading standby position CP. The weight sensor 51 is arranged in the in-buffer 31 . The weight sensor 51 is arranged between the loading port 38 and the loading standby position CP in the X-axis direction. Similar to the in-sensor 50, the weight sensor 51 has an emitting portion for emitting detection light and a light receiving portion for receiving the detection light. The weight sensor 51 can detect whether or not the substrate P exists in the optical path of the detection light based on the light receiving state of the light receiving section when the detection light is emitted from the emission section.

The center sensor 52 detects the board P transported by the transport belt 34 between the loading standby position CP and the mounting position MP. Center sensor 52 is arranged in center buffer 32 . The center sensor 52 is arranged between the loading standby position CP and the mounting position MP in the X-axis direction. Similar to the in-sensor 50 and the weight sensor 51, the center sensor 52 has an emitting portion for emitting detection light and a light-receiving portion for receiving the detection light. The center sensor 52 can detect whether or not the substrate P exists in the optical path of the detection light based on the light receiving state of the light receiving section when the detection light is emitted from the emission section.

The out sensor 53 detects the board P transported by the transport belt 34 between the mounting position MP and the unloading standby position TP. The out sensor 53 is arranged in the out buffer 33 . The out sensor 53 is arranged between the mounting position MP and the unloading standby position TP in the X-axis direction. Similar to the in-sensor 50, weight sensor 51, and center sensor 52, the out-sensor 53 has an emitting portion for emitting detection light and a light receiving portion for receiving the detection light. The out sensor 53 can detect whether or not the substrate P exists in the optical path of the detection light based on the light receiving state of the light receiving section when the detection light is emitted from the emission section.

At least part of the support member 90 is arranged below the conveyor belt 34 . At least part of the support member 90 is arranged between the pair of conveyor belts 34 in the Y-axis direction. Weight sensor 51 is fixed to support member 90 . The relative positions of the weight sensor 51 and the support member 90 do not change. The weight stopper member 41 is supported by the support member 90 so as to be movable in the Z-axis direction. The weight stopper member 41 is supported by the support member 90 so as not to move in the X-axis direction and the Y-axis direction. That is, although the relative position between the weight stopper member 41 and the support member 90 changes in the Z-axis direction, the relative position between the weight stopper member 41 and the support member 90 does not change in the X-axis direction and the Y-axis direction. The support member 90 supports the weight stopper member 41 and the weight sensor 51 so that the relative position between the weight stopper member 41 and the weight sensor 51 is maintained in each of the X-axis direction and the Y-axis direction.

The guide mechanism 91 guides the support member 90 in the X-axis direction. The guide mechanism 91 includes guide rails extending in the X-axis direction. A pair of guide mechanisms 91 are provided in the Y-axis direction. The support member 90 is movable in the X-axis direction while being guided by the guide mechanism 91 .

The support member 90 has a pushing portion 92 arranged at a position farther from the loading standby position CP than the weight stopper member 41 in the X-axis direction. The push-in portion 92 is a convex portion that protrudes in the +X direction from the weight stopper member 41 . When the support member 90 moves in the +X direction, the pushing portion 92 contacts the second clamp member 82 .

The second clamp member 82 releases the support of the second area AR2 on the bottom surface of the substrate P based on the position of the support member 90 in the X-axis direction. When the support member 90 moves in the +X direction so as to approach the first clamp member 81, the lower end of the second clamp member 82 is pushed by the pushing portion 92 in the +X direction. As a result, the second clamp member 82 rotates in one direction to release the support of the second area AR2 on the bottom surface of the substrate P. As shown in FIG. When the support member 90 moves in the −X direction away from the first clamp member 81 , the pushing portion 92 leaves the second clamp member 82 . As a result, the second clamp member 82 rotates in the opposite direction to support the second area AR2 on the bottom surface of the substrate P. As shown in FIG.

<Conveyance control device>
FIG. 4 is a functional block diagram showing the transfer control device 100 of the substrate transfer device 3 according to this embodiment. As shown in FIG. 4 , the substrate transfer device 3 has a transfer control device 100 . The transport control device 100 includes a computer system and controls the substrate transport device 3 . The transport control device 100 has an arithmetic processing unit including a processor such as a CPU (Central Processing Unit), and a storage device including memory and storage such as ROM (Read Only Memory) or RAM (Random Access Memory). The arithmetic processing unit performs arithmetic processing according to a computer program stored in a storage device.

The transport control device 100 has a data acquisition section 101 , a motor control section 102 , a stopper control section 103 and a clamp control section 104 .

The data acquisition unit 101 acquires detection data of the insensor 50 from the insensor 50 . The data acquisition unit 101 acquires detection data of the weight sensor 51 from the weight sensor 51 . The data acquisition unit 101 acquires detection data of the center sensor 52 from the center sensor 52 . The data acquisition unit 101 acquires detection data of the out sensor 53 from the out sensor 53 . The data acquisition unit 101 acquires the mounting control data of the mounting control device 9 from the mounting control device 9 . The data acquisition unit 101 acquires acceptance necessity data of the unloading-side external device 200 from the unloading-side external device 200 .

The motor control unit 102 outputs a control command for controlling the motor 35 based on the data acquired by the data acquisition unit 101 .

The stopper control unit 103 outputs control commands for controlling the weight stopper actuator 44 , the center stopper actuator 45 and the out stopper actuator 46 based on the data acquired by the data acquisition unit 101 .

The clamp control section 104 outputs a control command for controlling the clamp actuator 83 based on the data acquired by the data acquisition section 101 .

The detection data of the in-sensor 50 includes detection data when the in-sensor 50 detects the substrate P. FIG. The motor control unit 102 controls to start the operation of the motor 35 so that the substrate P carried into the carry-in port 38 is transported by the transport belt 34 based on the detection data when the in-sensor 50 detects the substrate P. Commands can be output.

The mounting control data of the mounting control device 9 includes performance data indicating whether or not the mounting process of the board P arranged in the center buffer 32 has been completed. As described above, the storage device of the mounting control device 9 stores the production program. The production program contains implementation control data. When the stopper control unit 103 determines that the mounting process of the board P placed in the center buffer 32 is not completed based on the mounting control data, the board P in the in-buffer 31 is not transported to the center buffer 32 . A control command for operating the weight stopper actuator 44 is output so as to stop at the carry-in standby position CP. That is, when the substrate P exists in the center buffer 32, the stopper control unit 103 sends a control command to the weight stopper actuator to raise the weight stopper member 41 so that the substrate P in the in-buffer 31 does not move to the center buffer 32. 44. As a result, the weight stopper member 41 comes into contact with the substrate P, and the substrate P stops at the loading standby position CP.

The detection data of the weight sensor 51 includes detection data when the weight sensor 51 detects the substrate P. FIG. When the weight sensor 51 detects the substrate P while the weight stopper member 41 is being lifted, the motor control unit 102 controls the conveying belt 34 based on the detection data when the weight sensor 51 detects the substrate P. A control command for controlling the motor 35 is output so that the conveying speed is lowered. This prevents the substrate P from hitting the weight stopper member 41 at high speed. Therefore, damage to the substrate P is suppressed. In addition, when the electronic component C is already mounted on the substrate P, the positional deviation of the electronic component C is suppressed.

The mounting control data of the mounting control device 9 includes transfer data indicating that the board P before the electronic component C is mounted has been transferred from the in-buffer 31 to the center buffer 32 . When the stopper control unit 103 determines that the board P before the electronic component C is mounted has been transported to the center buffer 32 based on the mounting control data, the center stopper 103 controls the center stopper so that the board P stops at the mounting position MP. It outputs a control command to operate the actuator 45 . That is, when a new substrate P is loaded into the center buffer 32, the stopper control section 103 outputs a control command to the center stopper actuator 45 to raise the center stopper member 42 so that it stops at the mounting position MP. . As a result, the center stopper member 42 comes into contact with the substrate P, and the substrate P stops at the mounting position MP.

The detection data of the center sensor 52 includes detection data when the center sensor 52 detects the substrate P. FIG. When the center sensor 52 detects the substrate P while the center stopper member 42 is raised, the motor control unit 102 controls the conveying belt 34 based on the detection data when the center sensor 52 detects the substrate P. A control command for controlling the motor 35 is output so that the conveying speed is lowered. This prevents the substrate P from hitting the center stopper member 42 at high speed. Therefore, damage to the substrate P is suppressed. In addition, when the electronic component C is already mounted on the substrate P, the positional deviation of the electronic component C is suppressed.

The acceptance necessity data of the unloading-side external device 200 includes permission data indicating that the unloading-side external device 200 has permitted the acceptance of the substrate P existing in the out-buffer 33 . When the stopper control unit 103 determines that the reception of the substrate P placed in the out-buffer 33 is not permitted based on the acceptance necessity data, the substrate P in the out-buffer 33 is transported to the unloading-side external device 200 . A control command for operating the out-stopper actuator 46 is output so as to stop at the unloading standby position TP without being unloaded. That is, when the unloading-side external device 200 does not permit the reception of the substrate P, the stopper control unit 103 raises the out-stopper member 43 so that the substrate P in the out-buffer 33 does not move to the unloading-side external device 200. A control command for this is output to the out-stopper actuator 46 . As a result, the out-stopper member 43 comes into contact with the substrate P, and the substrate P stops at the unloading standby position TP.

The detection data of the out-sensor 53 includes detection data when the out-sensor 53 detects the board P. FIG. When the out-sensor 53 detects the board P while the out-stopper member 43 is raised, the motor control unit 102 controls the conveying belt 34 based on the detection data when the out-sensor 53 detects the board P. A control command for controlling the motor 35 is output so that the conveying speed is lowered. This prevents the substrate P from hitting the out-stopper member 43 at high speed. Therefore, damage to the substrate P is suppressed. In addition, when the electronic component C is already mounted on the substrate P, the positional deviation of the electronic component C is suppressed.

As described above, the mounting control data of the mounting control device 9 includes performance data indicating whether or not the mounting process for the board P arranged in the center buffer 32 has been completed. When the stopper control unit 103 determines that the mounting process of the board P placed in the center buffer 32 is completed based on the mounting control data, the board P in the in-buffer 31 is transported to the center buffer 32. , outputs a control command for operating the weight stopper actuator 44 . That is, when there is no substrate P in the center buffer 32, the stopper control unit 103 sends a control command to the weight stopper actuator to lower the weight stopper member 41 so that the substrate P in the in-buffer 31 moves to the center buffer 32. 44. As a result, the substrate P existing in the in-buffer 31 is transported to the center buffer 32 .

Further, when the stopper control unit 103 determines that the mounting process of the board P arranged in the center buffer 32 is completed based on the mounting control data, the board P in the center buffer 32 is transported to the out buffer 33. , a control command for operating the center stopper actuator 45 is output. That is, when there is no substrate P in the out-buffer 33, the stopper control unit 103 issues a control command to the center stopper actuator to lower the center stopper member 42 so that the substrate P in the center buffer 32 moves to the out-buffer 33. 45. As a result, the substrate P existing in the center buffer 32 is transported to the out buffer 33 .

<Conveyance method>
Next, the operation of the substrate transfer device 3 according to this embodiment will be described. 5, 6, and 7 are side views schematically showing the substrate transfer device 3 according to this embodiment. As shown in FIG. 5, the position of the support member 90 in the X-axis direction is adjusted based on the size of the substrate P in the X-axis direction, for example. In this embodiment, the adjustment of the position of the support member 90 in the X-axis direction is performed by an operator. The support member 90 is movable in the X-axis direction while being guided by the guide mechanism 91 . A worker can manually operate the support member 90 to adjust the position of the support member 90 . A linear actuator may be provided between the support member 90 and the guide mechanism 91, and the position of the support member 90 in the X-axis direction may be adjusted by operating the linear actuator.

The support member 90 is arranged along the X-axis such that the distance La between the weight stopper member 41 and the center stopper member 42 in the X-axis direction is shorter than the distance Lb between the center stopper member 42 and the out-stopper member 43 in the X-axis direction. direction is moved.

In the X-axis direction, the distance Wa between the weight stopper member 41 and the weight sensor 51, the distance Wb between the center stopper member 42 and the weight sensor 52, and the distance Wc between the out stopper member 43 and the out sensor 53 are equal. That the distance La is shorter than the distance Lb means that the distance Lc between the weight sensor 51 and the center sensor 52 in the X-axis direction is shorter than the distance Lc between the center sensor 52 and the out-sensor 53 in the X-axis direction. . The reason why the distance La is shorter than the distance Lb is that the distance Le between the weight stopper member 41 and the center sensor 52 in the X-axis direction is shorter than the distance Lf between the center stopper member 42 and the out-sensor 53 in the X-axis direction. is synonymous with

In the present embodiment, the position of the +X side end of the pushing portion 92 and the position of the -X side end of the board P arranged at the mounting position MP are aligned in the X-axis direction. The position of the support member 90 in the axial direction is adjusted.

After the position of the support member 90 is adjusted, the first board P is carried into the board transfer device 3 of the electronic component mounting apparatus 1 from the carry-in side external device. When the first board P is carried into the carry-in port 38 from the carry-in side external device in a state where there is no board P in the board conveying device 3 , the motor control unit 102 controls the motor based on the detection data of the in-sensor 50 . 35 is activated. The motor control unit 102 controls the motor 35 so that the substrate P is transported at the first transport speed V1.

Further, the stopper control unit 103 adjusts the weight so that at least part of the center stopper member 42 is arranged above the upper surface of the conveying belt 34 and the weight stopper member 41 is arranged below the upper surface of the conveying belt 34 . It controls the stopper actuator 44 and the center stopper actuator 45 . Accordingly, the first substrate P carried into the carry-in port 38 is transported to the center buffer 32 by the transport belt 34 without waiting in the in-buffer 31 . The substrate P transported from the carry-in port 38 to the center buffer 32 by the transport belt 34 contacts the center stopper member 42 and stops at the mounting position MP. The center sensor 52 detects the substrate P when the substrate P approaches the center stopper member 42 . The motor control unit 102 controls the motor 35 based on the detection data when the center sensor 52 detects the substrate P so that the substrate P is transported at a second transport speed V2 lower than the first transport speed V1. do. That is, when the motor control unit 102 determines that the substrate P has approached the center stopper member 42 based on the detection data of the center sensor 52, the transport speed of the substrate P is reduced. This prevents the substrate P from contacting the center stopper member 42 at high speed.

After the first substrate P contacts the center stopper member 42 and stops at the mounting position MP, the clamp control section 104 controls the clamp actuator 83 to raise the first clamp member 81 . As a result, the first clamp member 81 ascends while supporting the first area AR1 on the bottom surface of the substrate P, and the second clamp member 82 ascends while supporting the second area AR2 on the bottom surface of the substrate P. . After the first clamping member 81 and the second clamping member 82 are lifted and the substrate P is separated from the transport belt 34, the stopper control unit 103 controls the center stopper actuator 45 to move the center stopper as shown in FIG. The member 42 is separated from the end of the substrate P on the +X side. By further raising the first clamping member 81 and the second clamping member 82, the substrate P is sandwiched between the holding member 70 and the first clamping member 81 and the second clamping member 82 as shown in FIG. . After the position of the substrate P is fixed, the mounting control device 9 controls the nozzle 4 and the mounting head 5 to mount the electronic component C on the substrate P arranged at the mounting position MP.

The first substrate P placed in the center buffer 32 is sandwiched between the holding member 70 and the first clamp member 81 and the second clamp member 82, and the first substrate P and the transport belt 34 are separated. When the second board P is carried into the carry-in port 38 from the carry-in side external device in this state, the motor control unit 102 controls the board P to move at the first transport speed V1 based on the detection data of the in-sensor 50. Control the motor 35 so that it is transported. As shown in FIG. 6 , the stopper control section 103 controls the weight stopper actuator 44 so that at least part of the weight stopper member 41 is arranged above the upper surface of the conveying belt 34 . As a result, the second substrate P loaded into the loading port 38 comes into contact with the weight stopper member 41 and stops at the loading standby position CP. Further, the weight sensor 51 detects the substrate P when the substrate P approaches the weight stopper member 41 . The motor control unit 102 controls the motor 35 so that the substrate P is transported at a second transport speed V2 that is lower than the first transport speed V1, based on detection data when the weight sensor 51 detects the substrate P. do. That is, when the motor control unit 102 determines that the substrate P has approached the weight stopper member 41 based on the detection data of the weight sensor 51, the transport speed of the substrate P is reduced. This prevents the substrate P from contacting the weight stopper member 41 at high speed.

After the mounting process of the first board P is completed, the clamp control section 104 controls the clamp actuator 83 to lower the first clamp member 81 . As a result, the substrate P is supported by the transport belt 34, and the support of the substrate P by the first clamp member 81 and the second clamp member 82 is released. The transport belt 34 is driven by the operation of the motor 35 . The substrate P supported by the transport belt 34 is carried out from the center buffer 32 to the out buffer 33 .

As shown in FIG. 7 , the stopper control section 103 controls the out-stopper actuator 46 so that at least part of the out-stopper member 43 is arranged above the upper surface of the conveying belt 34 . As a result, the first substrate P transported from the center buffer 32 to the out buffer 33 contacts the out stopper member 43 and stops at the transport standby position TP. Further, the out sensor 53 detects the substrate P when the substrate P approaches the out stopper member 43 . The motor control unit 102 controls the motor 35 so that the substrate P is transported at a second transport speed V2 that is lower than the first transport speed V1, based on detection data when the out sensor 53 detects the substrate P. do. That is, when the motor control unit 102 determines that the substrate P has approached the out stopper member 43 based on the detection data of the out sensor 53, the transport speed of the substrate P is reduced. This prevents the substrate P from contacting the out-stopper member 43 at high speed.

After the first substrate P is unloaded from the center buffer 32 to the out buffer 33 , the stopper control unit 103 controls the weight stopper actuator so that the second substrate P is unloaded from the in buffer 31 to the center buffer 32 . 44 is controlled to move the weight stopper member 41 below the upper surface of the conveying belt 34 . As a result, the second substrate P is transported from the in-buffer 31 to the center buffer 32 by the transport belt 34 . The stopper control unit 103 controls the center stopper actuator 45 to move at least part of the center stopper member 42 above the upper surface of the conveying belt 34 so that the second board P is stopped at the mounting position MP. do. After the substrate P stops at the mounting position MP, the clamp control section 104 controls the clamp actuator 83 to raise the first clamp member 81 and the second clamp member 82 . Thereby, the second substrate P is sandwiched between the holding member 70 and the first clamp member 81 and the second clamp member 82 . The electronic component C is mounted on the board P by the mounting head 5 while the position of the board P is fixed.

FIG. 8 is a flow chart showing a method for transporting the substrate P according to this embodiment. FIG. 8 is a flow chart showing the operation of the substrate transfer device 3 from the state shown in FIG.

As shown in FIG. 7, the stopper controller 103 controls the weight stopper actuator 44 so that the substrate P stops at the loading standby position CP in the in-buffer 31 . Further, the stopper control unit 103 controls the center stopper actuator 45 so that the substrate P that has undergone the mounting process in the center buffer 32 stops at the mounting position MP. Further, the stopper control unit 103 controls the out-stopper actuator 46 so that the substrate P stops at the unloading standby position TP in the out-buffer 33 (step S10).

In a state in which substrates P are placed in each of the in-buffer 31, center buffer 32, and out-buffer 33, the data acquisition unit 101 determines whether permission data has been acquired from the unloading-side external device 200 (step S20). As described above, the permission data indicates that the unloading-side external device 200 has permitted reception of the substrate P existing in the out-buffer 33 .

If it is determined in step S20 that the permission data has not been acquired (step S20: No), the stopper control unit 103 keeps the substrate P in the out-buffer 33 stopped at the unloading standby position TP. That is, the out-stopper actuator 46 is controlled so that at least part of the out-stopper member 43 is arranged above the upper surface of the conveying belt 34 .

When it is determined in step S20 that the permission data has not been acquired (step S20: No), the stopper control section 103 controls the out-stopper actuator 46 to lower the out-stopper member 43. FIG. As a result, the substrate P in the out-buffer 33 is carried out to the carry-out side external device 200 by the transport belt 34 (step S30).

After the substrate P in the out-buffer 33 is unloaded to the unloading-side external device 200, the stopper control section 103 controls the center stopper actuator 45 to lower the center stopper member . As a result, the board P in the center buffer 32 for which the mounting process has been completed is carried out to the out buffer 33 by the transport belt 34 (step S40).

After the substrate P in the center buffer 32 is unloaded to the out buffer 33, the stopper control section 103 controls the weight stopper actuator 44 to lower the weight stopper member 41. As shown in FIG. As a result, the substrate P in the in-buffer 31 is carried into the center buffer 32 by the transport belt 34 (step S50).

In step S50, when the substrate P in the in-buffer 31 moves to the center buffer 32 and the center sensor 52 detects the substrate P, the motor control unit 102 changes the transportation speed of the substrate P from the first transportation speed V1 to the second transportation speed. Decrease to speed V2.

In this embodiment, the distance Le (La, Lc) is shorter than the distance Lf (Lb, Ld). Therefore, the substrate P of the in-buffer 31 reaches the center sensor 52 before the substrate P of the center buffer 32 reaches the out-sensor 53 . That is, the center sensor 52 detects the substrate P carried from the in-buffer 31 to the center buffer 32 before the out-sensor 53 detects the substrate P carried out from the center buffer 32 to the out-buffer 33 .

In this embodiment, the center sensor 52 detects the substrate P carried from the in-buffer 31 to the center buffer 32 before the out-sensor 53 detects the substrate P carried out from the center buffer 32 to the out-buffer 33 . be. Therefore, in the section where the transport speed of the substrate P loaded from the in-buffer 31 to the center buffer 32 does not need to be lowered, the transport speed of the substrate P is maintained at the first transport speed V1. As a result, it is possible to prevent the time required for the substrate P to move from the in-buffer 31 to the center buffer 32 from becoming longer.

FIG. 9 is a schematic diagram for explaining the effect of the transport method according to this embodiment. FIG. 9A is a diagram showing the transport speed profile of the substrate P transported from the center buffer 32 to the out buffer 33. FIG. FIG. 9B is a diagram showing the transport speed profile of the substrate P transported from the in-buffer 31 to the center buffer 32 when the distance La (Le) and the distance Lb (Lf) are equal. FIG. 9(C) is a diagram showing the transport speed profile of the substrate P in the substrate transport apparatus 3 according to the present embodiment. 4 is a diagram showing a transport speed profile of a substrate P loaded into a center buffer 32; FIG. 9A, 9B, and 9C, the horizontal axis indicates the position in the X-axis direction, and the vertical axis indicates the substrate P transport speed.

As shown in FIG. 9A, the substrate P, which has been stopped by the center stopper member 42 at the mounting position MP of the center buffer 32, is released and transported to the out-buffer 33 at the first transport speed V1. be done. When the substrate P reaches the out-sensor 53 and the out-sensor 53 detects the substrate P, the motor control unit 102 reduces the transportation speed of the transportation belt 34 from the first transportation speed V1 to the second transportation speed V2. This prevents the substrate P from hitting the out-stopper member 43 at high speed.

In this embodiment, the substrate transport device 3 is a 3-buffer 1-motor type substrate transport device, and one transport belt 34 is driven by one motor 35 . Further, in the present embodiment, after the board P stopped by the center stopper member 42 in the center buffer 32 is released, the board P stopped by the weight stopper member 41 in the in-buffer 31 is released. (see steps S40 and S50).

Therefore, as shown in FIG. 9B, when the distance Le (La) and the distance Lf (Lb) are equal, the substrate P transported from the in-buffer 31 to the center buffer 32 is detected by the center sensor 52. Furthermore, since the substrate P transported from the center buffer 32 to the out buffer 33 is detected by the out sensor 53, the transport speed of the substrate P transported from the in buffer 31 to the center buffer 32 decreases. In order to prevent the substrate P from contacting the center stopper member 42 at a high speed, it is sufficient to reduce the transport speed of the substrate P at the timing when the substrate P is detected by the center sensor 52 . However, if the substrate P transported from the center buffer 32 to the out buffer 33 is detected by the out sensor 53 before the substrate P transported from the in buffer 31 to the center buffer 32 is detected by the center sensor 52, At the position Px on the -X side of the position where the sensor 52 is arranged, the transport speed of the substrate P transported from the in-buffer 31 to the center buffer 32 starts to decrease. The position Px indicates that the substrate P carried out from the center buffer 32 to the out buffer 33 is detected by the out sensor 53 before the substrate P carried into the center buffer 32 from the in buffer 31 is detected by the center sensor 52 . This is the position where the transport speed of the substrates P transported from the in-buffer 31 to the center buffer 32 starts to decrease due to .

Although the substrate P can be transported at the first transport speed V1 between the position Px and the position where the center sensor 52 is arranged, the substrate P transported from the in-buffer 31 to the center buffer 32 is Due to the detection by the out sensor 53 of the substrate P carried out from the center buffer 32 to the out buffer 33 before being detected by the center sensor 52, the transport speed of the substrate P at the position Px becomes the first transport speed. The conveying speed is lowered from V1 to the second conveying speed V2. Thus, when the distance Le (La) and the distance Lf (Lb) are equal, the section in which the substrate P is transported at the second transport speed V2 becomes long. As a result, the time required for the substrate P to move from the in-buffer 31 to the center buffer 32 becomes longer, and the transport efficiency of the substrate transport device 3 decreases.

FIG. 9C shows a transfer speed profile of the substrate P in the substrate transfer device 3 according to this embodiment. As shown in FIG. 9C, in this embodiment, since the distance Le (La) is shorter than the distance Lf (Lb), the substrate P carried out from the center buffer 32 to the out buffer 33 reaches the out sensor 53. The substrate P carried from the in-buffer 31 to the center buffer 32 is detected by the center sensor 52 before being detected. As a result, it is possible to prevent the substrate P from being transported from the in-buffer 31 to the center buffer 32 at the second transport speed V2 from becoming longer, while suppressing the substrate P from hitting the center stopper member 42 at a high speed. be done.

In the example shown in FIG. 9(C), the center sensor 52 detects the substrate P before the substrate P carried out from the center buffer 32 to the out buffer 33 is detected by the out sensor 53. Therefore, the transport speed of the substrate P transported from the center buffer 32 to the out buffer 33 may decrease. That is, there is a possibility that the transport speed of the substrate P transported from the center buffer 32 to the out buffer 33 will start to decrease at the position on the +X side of the position where the out sensor 53 is arranged. In order to suppress a decrease in the transport efficiency of the board P by the board transport apparatus 3 and to suppress a decrease in the production efficiency of the electronic device by the electronic component mounting apparatus 1, the board P is quickly transported from the out buffer 33 to the transport-side external device. Rather, it is important to quickly carry the substrate P from the in-buffer 31 to the center buffer 32 where the mounting process is performed.

<effect>
As described above, according to this embodiment, the support member 90 that supports the weight stopper member 41 and the weight sensor 51 can move in the X-axis direction while being guided by the guide mechanism 91 . Thus, the positions of the weight stopper member 41 and the weight sensor 51 in the X-axis direction can be adjusted while maintaining the relative position (distance Wa) between the weight stopper member 41 and the weight sensor 51 in the X-axis direction.

The position of the support member 90 is such that the distance La (Lc, Le) between the weight stopper member 41 and the center stopper member 42 is shorter than the distance Lb (Ld, Lf) between the center stopper member 42 and the out stopper member 43. is adjusted, as described with reference to FIG. 32 is detected by the center sensor 52 . As a result, it is possible to prevent the substrate P from being transported from the in-buffer 31 to the center buffer 32 at the second transport speed V2 from becoming longer, while suppressing the substrate P from hitting the center stopper member 42 at a high speed. be done. Therefore, a decrease in efficiency of transporting the board P by the board transport apparatus 3 is suppressed, and a decrease in efficiency in producing electronic devices by the electronic component mounting apparatus 1 is suppressed.

[Second embodiment]
A second embodiment will be described. In the following description, the same reference numerals are given to components that are the same as or equivalent to those of the above-described embodiment, and the description thereof will be simplified or omitted.

FIG. 10 is a side view schematically showing the substrate transfer device 3 according to this embodiment. The position of the support member 90 in the X-axis direction is adjusted based on the dimensions of the substrate P, as in the above-described embodiments. FIG. 10 shows the operation of the substrate transfer device 3 when the dimension of the substrate P in the X-axis direction is small. In FIG. 10, the dimensions of the board P are such that when the board P is stopped at the mounting position MP by the center stopper member 42, the -X side end of the board P is on the +X side of the support surface 82S of the second clamp member 82. is the dimension to be placed in

As in the above-described embodiment, the position of the support member 90 in the X-axis direction is the position of the +X side end of the pushing portion 92 and the position of the −X side end of the board P arranged at the mounting position MP. are adjusted to match.

As described above, the second clamp member 82 is rotatably supported by the first clamp member 81 in the θY direction. Since the size of the substrate P is small, the position of the support member 90 is adjusted so that the position of the +X side end of the pushing portion 92 and the position of the -X side end of the substrate P arranged at the mounting position MP are aligned. Once adjusted, the support member 90 moves in the +X direction so as to approach the mounting position MP, and pushes the lower end of the second clamp member 82 in the +X direction with the pushing portion 92, as shown in FIG. The second clamp member 82 pushed by the pushing portion 92 rotates in one direction so as to release the support of the lower surface of the substrate P. As shown in FIG. Thus, the second clamp member 82 releases the support of the lower surface of the substrate P based on the position of the support member 90 in the X-axis direction.

The support member 90 is arranged so that the position of the weight stopper member 41 and the position of at least a part of the holding member 70 match in the X-axis direction in a state where the support of the lower surface of the substrate P by the second clamp member 82 is released. , can be moved in the X-axis direction. That is, the support member 90 can enter below the holding member 70 . The weight stopper member 41 can enter between the pair of holding members 70 in the Y-axis direction.

In this embodiment, the distance La (Lc, Le) can be made much shorter than the distance Lb (Ld, Lf). Thereby, the time required for the substrate P to move from the in-buffer 31 to the center buffer 32 can be further shortened. Therefore, it is possible to suppress a decrease in the transport efficiency of the board P by the board transport apparatus 3, and suppress a decrease in the production efficiency of electronic devices by the electronic component mounting apparatus 1. FIG.

DESCRIPTION OF SYMBOLS 1... Electronic component mounting apparatus, 2... Electronic component supply apparatus, 3... Board conveying apparatus, 4... Nozzle, 5... Mounting head, 6... Head moving apparatus, 7... Nozzle moving apparatus, 8... Main frame, 9... Mounting control Apparatus 20 Feeder bank 21 Tape feeder 31 In-buffer 32 Center buffer 33 Out-buffer 34 Conveyor belt 35 Motor 36 Driving pulley 37 Driven pulley 38 Loading port , 39... carry-out port, 41... weight stopper member, 42... center stopper member, 43... out stopper member, 44... weight stopper actuator, 45... center stopper actuator, 46... out stopper actuator, 50... in sensor, 51... weight sensor , 52... Center sensor, 53... Out sensor, 61... X-axis moving device, 62... Y-axis moving device, 70... Holding member, 80... Clamp member, 81... First clamp member, 81S... Support surface, 82... Third 2 clamp member 82S support surface 83 clamp actuator 90 support member 91 guide mechanism 92 pushing unit 100 transport control device 101 data acquisition unit 102 motor control unit 103 stopper Control part 104...Clamp control part 200...Unloading side external device C...Electronic component P...Board AP...Component supply position AR1...First area AR2...Second area CP...Loading standby position MP … Mounting position, TP … Unloading standby position.

Claims (7)

a transport belt that supports and transports the substrate in the transport direction;
a motor that generates power to drive the conveyor belt;
a center stopper member that contacts the substrate supported by the transport belt and stops the substrate at a mounting position;
a weight stopper member that contacts the substrate supported by the conveyor belt and stops the substrate at the loading standby position before the substrate is loaded into the mounting position;
a weight sensor that detects the substrate being transported on the transport belt before the substrate is transported to the loading standby position;
a support member that supports the weight stopper member and the weight sensor;
a guide mechanism that guides the support member in the transport direction;
a holding member facing at least a portion of the upper surface of the substrate stopped at the mounting position;
a clamp member that rises while supporting at least a portion of the lower surface of the substrate stopped at the mounting position in a state separated from the conveying belt, and clamps at least a portion of the substrate with the holding member; prepared ,
The clamping members include a first clamping member that supports a first area on the bottom surface of the substrate, and a second clamping member that supports a second area on the bottom surface of the substrate that is closer to the loading standby position than the first area. including
The second clamp member releases the support of the substrate based on the position of the support member in the transport direction.
Substrate transfer device. 2. The substrate transfer apparatus according to claim 1, wherein the support member supports the weight stopper member and the weight sensor so that the relative position between the weight stopper member and the weight sensor is maintained in the transfer direction. an out-stopper member that contacts the substrate supported by the conveyor belt to stop the substrate at the unloading standby position after the substrate is unloaded from the mounting position;
3. The support member moves in the conveying direction such that the distance between the weight stopper member and the center stopper member is shorter than the distance between the center stopper member and the out stopper member. The substrate transfer device according to 1. a center sensor that detects the substrate transported on the transport belt between the loading standby position and the mounting position;
an out-sensor that detects the board transported on the transport belt between the mounting position and the unloading standby position;
a control device that controls the motor so as to reduce the conveying speed of the conveying belt based on detection data obtained when at least one of the weight sensor, the center sensor, and the out sensor detects the substrate; 4. The substrate transport apparatus of claim 3, comprising: The support member is configured to adjust the position of the weight stopper member and the position of at least a part of the holding member in the transport direction in a state where the support of the substrate by the second clamp member is released. The substrate transfer apparatus according to any one of claims 1 to 4, which moves in the transfer direction. The support member has a push-in portion arranged at a position farther from the loading standby position than the weight stopper member in the transport direction,
The second clamp member is rotatably supported by the first clamp member, and is pushed by the pushing portion to release the support of the substrate.
The substrate transfer apparatus according to claim 5 . A substrate transfer apparatus according to any one of claims 1 to 6 ;
and a mounting head for mounting an electronic component on the substrate placed at the mounting position by the substrate transfer device.

Images