CN116234287A

CN116234287A - Substrate conveying device and component mounting device

Info

Publication number: CN116234287A
Application number: CN202211526025.6A
Authority: CN
Inventors: 佐藤祐太
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2021-12-03
Filing date: 2022-12-01
Publication date: 2023-06-06
Also published as: JP2023082867A

Abstract

The invention relates to a substrate conveying device and a component mounting device, which can restrain the reduction of the conveying efficiency of a substrate even if the size of the substrate is changed. The substrate conveying device conveys a substrate along a conveying direction in a conveying path. The substrate conveying device comprises: a substrate size obtaining unit that obtains a substrate size in a transport direction; a buffer setting unit that sets a buffer indicating a space for stopping the substrate in the transport path based on the substrate size; and a transport control unit that controls transport of the substrates such that 1 substrate is placed in 1 buffer area.

Description

Substrate conveying device and component mounting device

Technical Field

The technology disclosed in the present specification relates to a substrate conveying device and a component mounting device.

Background

In the art related to the component mounting apparatus, a substrate conveying apparatus disclosed in patent document 1 is known. The substrate transfer apparatus disclosed in patent document 1 includes 3 buffers, i.e., a carry-in buffer, a center buffer, and a carry-out buffer.

Patent document 1: japanese patent laid-open publication No. 2019-165168

The substrate transport apparatus stops the substrate in the buffer. In the case where the substrate size is large, it may be difficult to dispose the substrates in the 3 buffer regions, respectively. As a result, the substrate transport efficiency may be lowered. If the buffer area is increased in accordance with a substrate having a large substrate size, the substrate transfer apparatus may become large.

Disclosure of Invention

The technology disclosed in the present specification aims to suppress a decrease in the conveyance efficiency of a substrate even if the size of the substrate changes.

The specification discloses a substrate conveying device. The substrate conveying device conveys a substrate along a conveying direction in a conveying path. The substrate conveying device comprises: a substrate size obtaining unit that obtains a substrate size in a transport direction; a buffer setting unit that sets a buffer indicating a space for stopping the substrate in the transport path based on the substrate size; and a transport control unit that controls transport of the substrates such that 1 substrate is placed in 1 buffer area.

According to the technology disclosed in the present specification, even if the size of the substrate changes, a decrease in the conveyance efficiency of the substrate can be suppressed.

Drawings

Fig. 1 is a plan view schematically showing a component mounting apparatus of an embodiment.

Fig. 2 is a block diagram showing a component mounting apparatus according to an embodiment.

Fig. 3 is a side view schematically showing a substrate transport apparatus according to an embodiment.

Fig. 4 is a diagram schematically showing a clamping device of the embodiment.

Fig. 5 is a diagram schematically showing a clamping device of the embodiment.

Fig. 6 is a functional block diagram showing a control device according to an embodiment.

Fig. 7 is a diagram schematically showing an example of a state in which the conveyance path according to the embodiment is set to the 5-buffer mode.

Fig. 8 is a view schematically showing an example of a state after components are mounted on the production board shown in fig. 7.

Fig. 9 is a diagram schematically showing an example of a state in which the conveyance path according to the embodiment is set to the 5-buffer mode.

Fig. 10 is a view schematically showing an example of a state after components are mounted on the production board shown in fig. 9.

Fig. 11 is a diagram schematically showing an example of a state in which the conveyance path according to the embodiment is set to the 4-buffer mode.

Fig. 12 is a view schematically showing an example of a state after components are mounted on the production board shown in fig. 11.

Fig. 13 is a diagram schematically showing an example of a state in which the conveyance path according to the embodiment is set to the 2-buffer mode.

Fig. 14 is a view schematically showing an example of a state after components are mounted on the production board shown in fig. 13.

Fig. 15 is a diagram schematically showing an example of a state in which the conveyance path of the embodiment is set to the 2-buffer mode.

Fig. 16 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 15.

Fig. 17 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 15.

Fig. 18 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 15.

Fig. 19 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 15.

Fig. 20 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 15.

Fig. 21 is a diagram schematically showing an example of a state in which an extended conveyance path is added to the conveyance path according to the embodiment.

Fig. 22 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 21.

Fig. 23 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 21.

Fig. 24 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 21.

Fig. 25 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 21.

Fig. 26 is a diagram for explaining a step of mounting components on each of the two substrates shown in fig. 21.

Fig. 27 is a diagram schematically showing an example of a state in which the conveyance path according to the embodiment is set to the long mode.

Fig. 28 is a view schematically showing an example of a state after components are mounted on the production board shown in fig. 27.

Fig. 29 is a diagram schematically showing an example of a state in which the conveyance path according to the embodiment is set to the long mode.

Fig. 30 is a view schematically showing a state after mounting components on the production substrate shown in fig. 29.

Fig. 31 is a diagram schematically showing a clamping range changing mechanism according to the embodiment.

Fig. 32 is a diagram schematically showing the clamp range changing mechanism when the conveyance path of the embodiment is set to the 2-buffer mode.

Fig. 33 is a diagram schematically showing a modification of the clamping range changing mechanism of the embodiment.

Fig. 34 is a diagram schematically showing a modification of the clamping range changing mechanism of the embodiment.

Fig. 35 is a diagram schematically showing an example of a method of clamping a substrate according to the embodiment.

Fig. 36 schematically illustrates an example of a substrate clamping method according to the embodiment.

Fig. 37 schematically illustrates an example of a substrate clamping method according to the embodiment.

Fig. 38 is a diagram schematically showing an example of a method of clamping a substrate according to the embodiment.

Fig. 39 is a diagram schematically showing an example of a method of clamping a substrate according to the embodiment.

Fig. 40 schematically illustrates an example of a substrate clamping method according to the embodiment.

Fig. 41 is a diagram schematically showing an example of a method of clamping a substrate according to the embodiment.

Fig. 42 is a plan view schematically showing the component mounting apparatus when mounting components on a substrate in a state where the substrate clamping reference position on the upstream side of the center of the conveyance path in the conveyance direction is set at the downstream side end of the substrate and the substrate clamping reference position on the downstream side of the center is set at the upstream side end of the substrate.

Fig. 43 is a plan view schematically showing the component mounting apparatus when mounting components on a substrate in a state where the substrate clamping reference position on the upstream side of the center of the conveyance path in the conveyance direction is set at the upstream side end of the substrate and the substrate clamping reference position on the downstream side of the center is set at the downstream side end of the substrate.

Detailed Description

Hereinafter, embodiments will be described with reference to the drawings, but the technology disclosed in the present specification is not limited to the embodiments. The constituent elements of the embodiments described below can be appropriately combined. In addition, some of the constituent elements may not be used.

In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part is described with reference to the XYZ orthogonal coordinate system. The direction parallel to the X axis in the horizontal plane is defined as the X axis direction. The direction parallel to the Y axis in the horizontal plane orthogonal to the X axis is referred to as the Y axis direction. The direction parallel to the Z axis orthogonal to the X axis and the Y axis is referred to as the Z axis direction. The rotation direction or the tilt direction about the X axis is defined as θx direction. The rotation direction or the tilt direction about the Y axis is defined as θy direction. The rotation direction or the tilt direction about the Z axis is defined as θz direction. The XY plane is a horizontal plane. The Z-axis direction is the up-down direction.

[ component mounting device ]

Fig. 1 is a plan view schematically showing a component mounting apparatus 1 of an embodiment. Fig. 2 is a block diagram showing the component mounting apparatus 1 according to the embodiment.

The component mounting apparatus 1 mounts components on a substrate P. As the substrate P, a printed wiring board (PWB: printed Wiring Board) is exemplified. A printed circuit board (PCB: printed Circuit Board) is produced by mounting components to the substrate P.

As shown in fig. 1 and 2, the component mounting apparatus 1 includes a component supply apparatus 2, a substrate transfer apparatus 3, a substrate sensor 4, a mounting head 5, a suction nozzle 6, a head moving apparatus 7, a suction nozzle moving apparatus 8, an imaging apparatus 9, a base frame 10, and a control apparatus 11.

The component supply device 2 supplies components to be mounted on the substrate P. The component feeder 2 has a feeder container 12. The feeder container 12 supports a plurality of tape feeders 13. In the feeder container 12, a plurality of tape feeders 13 are arranged in the X-axis direction. The tape feeder 13 conveys the carrier tape supplied from the reel in the Y-axis direction. A plurality of components are held on the carrier tape. The tape feeder 13 conveys the carrier tape so that the components held on the carrier tape are arranged at predetermined supply positions. By conveying the carrier tape, the plurality of components are sequentially arranged at predetermined supply positions.

In the embodiment, the component supply device 2 has 4 feeder containers 12. The 2 feeder containers 12 are arranged on the +y side of the substrate transfer apparatus 3. The 2 feeder containers 12 are arranged on the-Y side of the substrate transfer apparatus 3. The 2 feeder containers 12 disposed on the +y side of the substrate transfer apparatus 3 are disposed at intervals in the X-axis direction. The 2 feeder containers 12 arranged on the-Y side of the substrate transfer apparatus 3 are arranged at intervals in the X-axis direction.

The substrate conveying device 3 has a conveying path 14 for conveying the substrate P. The substrate conveying device 3 conveys the substrate P in a predetermined conveying direction in the conveying path 14. In the embodiment, the conveyance direction of the substrate P by the substrate conveyance device 3 is the X-axis direction. The substrate conveying device 3 conveys the substrate P in the +x direction from the end on the-X side of the conveying path 14 toward the end on the +x side.

In the following description, the position or the approaching direction of the end portion on the minus X side in the conveying path 14 is appropriately referred to as the upstream side, and the position or the approaching direction of the end portion on the plus X side in the conveying path 14 is appropriately referred to as the downstream side. The substrate conveying device 3 conveys the substrate P from the upstream side toward the downstream side.

Fig. 3 is a side view schematically showing the substrate transfer apparatus 3 according to the embodiment. As shown in fig. 2 and 3, the substrate conveying device 3 includes a conveyor belt 15, a pulley 16, a motor 17, and a clamping device 18.

The conveyor belt 15 supports the substrate P. The conveyor belt 15 is endless. The conveyor belt 15 is an endless belt. The conveyor belt 15 is wound around a pulley 16. The substrate P supported by the conveyor belt 15 is conveyed in the X-axis direction by the rotation of the conveyor belt 15.

The pulley 16 supports the conveyor belt 15. The pulley 16 includes a driving pulley and a driven pulley. The pulley 16 rotates in a state of supporting the conveyor belt 15.

The motor 17 generates power to rotate the conveyor belt 15. The motor 17 is connected to the drive pulley. The motor 17 rotates the drive pulley. The conveyor belt 15 rotates in conjunction with the drive pulley. The driven pulley rotates in conjunction with the conveyor belt 15. The substrate P supported by the conveyor belt 15 is conveyed in the X-axis direction by the rotation of the conveyor belt 15.

In the embodiment, 5 conveyor belts 15 are provided. The 5 conveyor belts 15 are arranged in the X-axis direction. The conveyor belt 15 includes a 1 st conveyor belt 15A disposed on the most upstream side, a 2 nd conveyor belt 15B disposed on the upstream side next to the 1 st conveyor belt 15A, a 3 rd conveyor belt 15C disposed on the upstream side next to the 2 nd conveyor belt 15B, a 4 th conveyor belt 15D disposed on the upstream side next to the 3 rd conveyor belt 15C, and a 5 th conveyor belt 15E disposed on the most downstream side among the 5 conveyor belts 15.

The pulleys 16 are provided 14. Pulleys 16 include 4 1 st pulleys 16A supporting 1

st conveyor belt

15A, 2 nd pulleys 16B supporting 2

nd conveyor belt

15B, 2 rd pulleys 16C supporting 3

rd conveyor belt

15C, 2 th pulleys 16D supporting 4

th conveyor belt

15D, and 4 th pulleys 16E supporting 5 th conveyor belt 15E.

The number of motors 17 is 5. The motor 17 includes a 1 st motor 17A that generates power to rotate the 1 st conveyor belt 15A, a 2 nd motor 17B that generates power to rotate the 2 nd conveyor belt 15B, a 3 rd motor 17C that generates power to rotate the 3 rd conveyor belt 15C, a 4 th motor 17D that generates power to rotate the 4 th conveyor belt 15D, and a 5 th motor 17E that generates power to rotate the 5 th conveyor belt 15E.

1 st pulley 16A of the 4 1 st pulleys 16A is allocated as a driving pulley connected to the 1 st motor 17A, and the other 3 1 st pulleys 16A are allocated as driven pulleys. 1 st 2 nd pulley 16B of the 2 nd pulleys 16B is allocated as a driving pulley connected to the 2 nd motor 17B, and the other 1 nd pulley 16B is allocated as a driven pulley. 1 3 rd pulley 16C of the 2 3 rd pulleys 16C is allocated as a driving pulley connected to the 3 rd motor 17C, and the other 1 rd pulley 16C is allocated as a driven pulley. 1 4 th pulley 16D of the 2 4 th pulleys 16D is allocated as a driving pulley connected to the 4 th motor 17D, and the other 1 4 th pulley 16D is allocated as a driven pulley. 1 of the 4 5 th pulleys 16E is allocated as a driving pulley connected to the 5 th motor 17E, and the other 3 5 th pulleys 16E are allocated as driven pulleys.

The clamping device 18 clamps the substrate P, the conveyance of which is stopped by the conveyor belt 15. The position of the substrate P is fixed by the substrate P being clamped by the clamping device 18.

Fig. 4 is a diagram schematically showing the clamping device 18 of the embodiment. As shown in fig. 4, the clamping device 18 includes a support table 19, a clamping actuator 20, a lifting member 21, and a clamping member 22.

The support table 19 is lifted and lowered by power generated by the clamp actuator 20. The clamping actuator 20 is controlled by the control device 11.

The lifting member 21 can be lifted and lowered while supported by the support table 19. The lifting member 21 is lifted and lowered together with the support table 19. The lifting member 21 can support at least a portion of the lower surface of the substrate P. The elevating members 21 are arranged in a pair at an interval in the Y-axis direction. One of the pair of elevating members 21 disposed in the Y-axis direction supports an end portion on the +y side of the lower surface of the substrate P, and the other elevating member 21 supports an end portion on the-Y side of the lower surface of the substrate P. The pair of lifting members 21 arranged in the Y-axis direction are lifted and lowered together.

The clamp member 22 clamps the substrate P supported by the conveyor belt 15 between at least a part of the lifting member 21. The position of the clamping member 22 is fixed. The clamping member 22 does not move. The clamping member 22 can support at least a portion of the upper surface of the substrate P. The clamp members 22 are arranged in a pair at a spacing in the Y-axis direction. One of the pair of clamp members 22 arranged in the Y-axis direction is opposed to the +y-side end of the upper surface of the substrate P, and the other clamp member 22 is opposed to the-Y-side end of the upper surface of the substrate P.

Fig. 5 is a diagram schematically showing the clamping device 18 of the embodiment. As shown in fig. 5, if the support table 19 is raised by driving the clamp actuator 20, the lifting member 21 supported by the support table 19 is raised together with the support table 19. If the elevation member 21 is elevated, the substrate P supported by the elevation member 21 is elevated together with the elevation member 21. If the lifting member 21 and the substrate P are lifted, the substrate P is held by the clamping member 22 and the lifting member 21 from the up-down direction. Thereby, the substrate P is clamped by the clamping device 18, and the position of the substrate P is fixed.

As shown in fig. 4, if the support 19 is lowered, the elevating member 21 and the substrate P are lowered together with the support 19. Thereby, the clamping device 18 releases the clamping of the substrate P. The conveyor belt 15 is capable of conveying the substrate P.

The pulley 16 is supported by the lifting member 21. The pulley 16 rotates in a state supported by the lifting member 21.

As shown in fig. 3, a plurality of elevating members 21 are arranged in the X-axis direction. The plurality of lifting members 21 arranged in the X-axis direction can be lifted and lowered individually. In the embodiment, 7 lifting members 21 are arranged in the X-axis direction. The lifting member 21 includes a 1 st lifting member 21A disposed on the most upstream side, a 2 nd lifting member 21B disposed on the upstream side next to the 1 st lifting member 21A, a 3 rd lifting member 21C disposed on the upstream side next to the 2 nd lifting member 21B, a 4 th lifting member 21D disposed on the upstream side next to the 3 rd lifting member 21C, a 5 th lifting member 21E disposed on the upstream side next to the 4 th lifting member 21D, a 6 th lifting member 21F disposed on the upstream side next to the 5 th lifting member 21E, and a 7 th lifting member 21G disposed on the most downstream side among the 7 lifting members 21.

21 st pulleys 16A out of the 4 1 st pulleys 16A are supported by the 1

st lifting member

21A, and 21 st pulleys 16A are supported by the 2 nd lifting member 21B. The 1 st conveyor belt 15A is supported by the 1 st lifting member 21A and the 2 nd lifting member 21B via 4 1 st pulleys 16A, respectively.

The 2 nd pulley 16B is supported by the 3 rd lifting member 21C. The 2 nd conveyor belt 15B is supported by the 3 rd lifting member 21C via 2 nd pulleys 16B.

The 2 3 rd pulley 16C is supported by the 4 th lifting member 21D. The 3 rd conveyor belt 15C is supported by the 4 th lifting member 21D via 2 3 rd pulleys 16C.

The 2 th pulley 16D is supported by the 5 th lifting member 21E. The 4 th conveyor belt 15D is supported by the 5 th lifting member 21E via 2 4 th pulleys 16D.

2 5 th pulleys 16E among the 4 5 th pulleys 16E are supported by the 6

th lifting member

21F, and 2 5 th pulleys 16E are supported by the 7 th lifting member 21G. The 5 th conveyor belt 15E is supported by the 6 th lifting member 21F and the 7 th lifting member 21G via 4 5 th pulleys 16E, respectively.

The substrate sensor 4 detects the substrate P conveyed in the conveying path 14. The substrate sensor 4 is disposed above the substrate transfer apparatus 3. The substrate sensor 4 detects the substrate P from above the conveyance path 14. The substrate sensor 4 detects the substrate P contactlessly. As the substrate sensor 4, an optical sensor having a light projecting portion that emits detection light and a light receiving portion that receives the detection light is exemplified. The substrate sensor 4 has a detection position. The detection position of the substrate sensor 4 includes an irradiation position where the detection light is irradiated. The substrate sensor 4 detects the presence or absence of the substrate P at the detection position. The position of the substrate sensor 4 is fixed. The substrate sensor 4 detects the presence or absence of the substrate P at the detection position, thereby detecting the position of the substrate P in the X-axis direction.

The substrate sensor 4 is disposed in the transport path 14 at a plurality of intervals in the X-axis direction. In the embodiment, 10 substrate sensors 4 are provided. The substrate sensor 4 includes a 1 st substrate sensor 4A disposed on the most upstream side, a 2 nd substrate sensor 4B disposed on the upstream side next to the 1 st substrate sensor 4A, a 3 rd substrate sensor 4C disposed on the upstream side next to the 2 nd substrate sensor 4B, a 4 th substrate sensor 4D disposed on the upstream side next to the 3 rd substrate sensor 4C, a 5 th substrate sensor 4E disposed on the upstream side next to the 4 th substrate sensor 4D, a 6 th substrate sensor 4F disposed on the upstream side next to the 5 th substrate sensor 4E, a 7 th substrate sensor 4G disposed on the upstream side next to the 6 th substrate sensor 4F, an 8 th substrate sensor 4H disposed on the upstream side next to the 7 th substrate sensor 4G, a 9 th substrate sensor 4I disposed on the upstream side next to the 8 th substrate sensor 4H, and a 10 th substrate sensor 4J disposed on the most downstream side among the 10 substrate sensors 4.

The detection position of the 1 st substrate sensor 4A is set at the upstream end of the 1 st conveyor 15A. The detection position of the 2 nd substrate sensor 4B is set at the boundary between the 1 st elevation member 21A and the 2 nd elevation member 21B. The detection position of the 3 rd substrate sensor 4C is set at the boundary between the 1 st conveyor 15A and the 2 nd conveyor 15B (the boundary between the 2 nd lifting member 21B and the 3 rd lifting member 21C). The detection position of the 4 th substrate sensor 4D is set at the boundary between the 2 nd conveyor 15B and the 3 rd conveyor 15C (the boundary between the 3 rd lifting member 21C and the 4 th lifting member 21D). The detection position of the 5 th substrate sensor 4E is set at the upstream end of the 3 rd conveyor belt 15C. The detection position of the 6 th substrate sensor 4F is set at the end portion on the downstream side of the 3 rd conveyor belt 15C. The detection position of the 7 th substrate sensor 4G is set at the boundary between the 3 rd conveyor 15C and the 4 th conveyor 15D (the boundary between the 4 th lifting member 21D and the 5 th lifting member 21E). The detection position of the 8 th substrate sensor 4H is set at the boundary between the 4 th conveyor 15D and the 5 th conveyor 15E (the boundary between the 5 th elevation member 21E and the 6 th elevation member 21F). The detection position of the 9 th substrate sensor 4I is set at the boundary between the 6 th lift member 21F and the 7 th lift member 21G. The detection position of the 10 th substrate sensor 4J is set at the end of the 5 th conveyor 15E on the downstream side.

As shown in fig. 3, the detection positions of the plurality of substrate sensors 4 are symmetrically arranged in the X-axis direction with respect to the center CL of the transport path 14 in the X-axis direction. The number of substrate sensors 4 disposed upstream of the center CL is equal to the number of substrate sensors 4 disposed downstream of the center CL. In the embodiment, 5 substrate sensors 4 (4A, 4B, 4C, 4D, 4E) are disposed upstream of the center CL, and 5 substrate sensors 4 (4F, 4G, 4H, 4I, 4J) are disposed downstream of the center CL. The distance Le from the center CL to the 5 th substrate sensor 4E is equal to the distance Lf from the center CL to the 6 th substrate sensor 4F in the X-axis direction. In the X-axis direction, the distance Ld from the center CL to the 4 th substrate sensor 4D is equal to the distance Lg from the center CL to the 7 th substrate sensor 4G. In the X-axis direction, a distance Lc from the center CL to the 3 rd substrate sensor 4C is equal to a distance Lh from the center CL to the 8 th substrate sensor 4H. The distance Lb from the center CL to the 2 nd substrate sensor 4B is equal to the distance Li from the center CL to the 9 th substrate sensor 4I in the X-axis direction. In the X-axis direction, a distance La from the center CL to the 1 st substrate sensor 4A is equal to a distance Lj from the center CL to the 10 th substrate sensor 4J.

The plurality of elevating members 21 are symmetrically arranged in the X-axis direction with respect to a center CL of the conveying path 14 in the X-axis direction. The number of the elevating members 21 disposed upstream of the center CL is equal to the number of the elevating members 21 disposed downstream of the center CL. In the embodiment, a half of the 4

th lifting member

21D and 3 lifting members 21 (21A, 21B, 21C) are disposed upstream of the center CL, and a half of the 4

th lifting member

21D and 3 lifting members 21 (21E, 21F, 21D) are disposed downstream of the center CL. The distance from the center CL to the upstream side end of the 4 th lifting member 21D is equal to the distance from the center CL to the downstream side end of the 4 th lifting member 21D in the X-axis direction. The distance from the center CL to the 3 rd lifting member 21C is equal to the distance from the center CL to the 5 th lifting member 21E in the X-axis direction. The distance from the center CL to the 2 nd lifting member 21B is equal to the distance from the center CL to the 6 th lifting member 21F in the X-axis direction. The distance from the center CL to the 1 st elevation member 21A is equal to the distance from the center CL to the 7 th elevation member 21G in the X-axis direction.

In the X-axis direction, the size of the 3 rd lifting member 21C is equal to the size of the 5 th lifting member 21E. In the X-axis direction, the size of the 2 nd lifting member 21B is equal to the size of the 6 th lifting member 21F. In the X-axis direction, the size of the 1 st lifting member 21A is equal to the size of the 7 th lifting member 21G. In the X-axis direction, the size of the 3 rd lifting member 21C, the size of the 4 th lifting member 21D, and the size of the 5 th lifting member 21E are substantially equal. The lift member 21 having the largest dimension in the X-axis direction among the 1 st, 2 nd, 3 rd, 4 th, 5 th, 6 th, 7

th lift members

21A, 21B, 21C, 21D, 21E, 21F, 21G is the 3 rd, 4 th, 5

th lift members

21C, 21D, 21E, then the lift member 21 having the larger dimension in the X-axis direction of the 3 rd, 4 th, 5

th lift members

21C, 21D, 21E is the 1 st, 7

th lift members

21A, 21G, and the lift member 21 having the smallest dimension in the X-axis direction is the 2 nd, 6

th lift members

21B, 21F.

The plurality of conveyor belts 15 are symmetrically arranged in the X-axis direction with respect to a center CL of the conveyor path 14 in the X-axis direction. The number of conveyor belts 15 disposed upstream of the center CL is equal to the number of conveyor belts 15 disposed downstream of the center CL. In the embodiment, half of the 3

rd conveyor belt

15C and 2 conveyor belts 15 (15A, 15B) are disposed upstream of the center CL, and half of the 3

rd conveyor belt

15C and 2 conveyor belts 15 (15D, 15E) are disposed downstream of the center CL. The distance from the center CL to the upstream-side end of the 3 rd conveyor belt 15C is equal to the distance from the center CL to the downstream-side end of the 3 rd conveyor belt 15C in the X-axis direction. The distance from the center CL to the 2 nd conveyor belt 15B is equal to the distance from the center CL to the 4 th conveyor belt 15D in the X-axis direction. The distance from the center CL to the 1 st conveyor belt 15A is equal to the distance from the center CL to the 5 th conveyor belt 15E in the X-axis direction.

In the X-axis direction, the size of the 1 st conveyor belt 15A is equal to the size of the 5 th conveyor belt 15E. In the X-axis direction, the size of the 2 nd conveyor belt 15B, the size of the 3 rd conveyor belt 15C, and the size of the 4 th conveyor belt 15D are substantially equal. The 2 nd, 3 rd, 4

th conveyor belts

15B, 15C, 15D may have a larger size than the 1 st, 5

th conveyor belts

15A, 15E or a smaller size than the 1 st, 5

th conveyor belts

15A, 15E in the X-axis direction.

The mounting head 5 mounts the component on the substrate P. The mounting head 5 has a suction nozzle 6 for removably holding a component. The mounting head 5 is provided with a plurality of suction nozzles 6. The suction nozzle 6 is arranged at the lower end of the support shaft. The main body of the mounting head 5 supports a support shaft. The suction nozzle 6 is supported by the main body of the mounting head 5 via a support shaft. The suction nozzle 6 may be a suction nozzle for sucking and holding the component, or may be a gripping nozzle for gripping and holding the component. In the case where the suction nozzle 6 is a suction nozzle, the suction nozzle 6 can suction a component by the operation of a vacuum system connected to the suction nozzle 6. When the suction nozzle 6 is a grip, the suction nozzle 6 can clamp the component by the operation of an actuator capable of driving the suction nozzle 6.

The head moving device 7 moves the mounting head 5 in the X-axis direction and the Y-axis direction, respectively. The head moving device 7 has an X-axis guide rail 7A, Y, an axis linear actuator 7C and a Y-axis linear actuator 7D of the guide rail 7B, X. The X-axis guide rail 7A guides the mounting head 5 in the X-axis direction. The Y-axis guide 7B guides the X-axis guide 7A in the Y-axis direction. The Y-axis guide rails 7B are provided in a pair at an interval in the X-axis direction. The X-axis linear actuator 7C generates power to move the mounting head 5 in the X-axis direction. At least a part of the X-axis linear actuator 7C is disposed between the mounting head 5 and the X-axis guide rail 7A. The Y-axis linear actuator 7D generates power to move the X-axis guide rail 7A in the Y-axis direction. At least a part of the Y-axis linear actuator 7D is disposed between the X-axis guide rail 7A and the Y-axis guide rail 7B.

The nozzle movement device 8 moves the nozzle 6 in the Z-axis direction and the θz direction. The nozzle moving device 8 is provided to the mounting head 5. The nozzle moving devices 8 are provided to the plurality of nozzles 6, respectively. The nozzle moving device 8 has a Z-axis motor 8A that generates power to move the nozzle 6 in the Z-axis direction, and a θz motor 8B that generates power to rotate the nozzle 6 in the θz direction.

The nozzle 6 is movable in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θz-direction by the head movement device 7 and the nozzle movement device 8, respectively. The mounting head 5 is movable between the component supply device 2 and the substrate transfer device 3 by a head moving device 7. The mounting head 5 holds components by the suction nozzles 6 in the component supply device 2 and moves toward the substrate P supported by the substrate transport device 3. The mounting head 5 mounts components on the substrate P supported by the substrate conveying device 3.

The mounting head 5 is movable within the mountable range 23 in the XY plane by the head moving device 7. The predetermined supply position for supplying the components in the component supply device 2 is defined inside the attachable range 23. At least a part of the substrate transfer apparatus 3 is disposed inside the mountable range 23. The substrate conveying device 3 can convey at least a part of the substrate P to the inside of the mountable range 23. The component is mounted to the substrate P disposed inside the mountable range 23. The mounting head 5 can mount components on the substrate P disposed inside the mountable range 23 by the substrate conveying device 3. The mounting head 5 cannot mount components on the substrate P disposed outside the mountable range 23.

In the embodiment, the mounting heads 5 are arranged 2 in the X-axis direction. The head moving devices 7 are arranged 2 in the X-axis direction. In the embodiment, 2 mountable ranges 23 are defined at intervals in the X-axis direction. The mountable ranges 23 include a 1 st mountable range 23A and a 2 nd mountable range 23B defined on the downstream side of the 1 st mountable range 23A. The upstream-side mounting head 5 is movable within the 1 st mountable range 23A. The downstream-side mounting head 5 is movable within the 2 nd mountable range 23B.

A part of the downstream side of the 1 st conveyor belt 15A is disposed inside the 1 st mountable range 23A. The 2 nd conveyor belt 15B is disposed inside the 1 st mountable range 23A. The 3 rd conveying belt 15C is arranged between the 1 st mountable range 23A and the 2 nd mountable range 23B. The 4 th conveyor belt 15D is disposed inside the 2 nd mountable range 23B. A part of the upstream side of the 5 th conveyor belt 15E is disposed inside the 2 nd attachable range 23B.

The imaging device 9 images the component held by the suction nozzle 6. The imaging device 9 is disposed between the component supply device 2 and the substrate conveyance device 3 in the XY plane. After the component is held by the component supply device 2 by the suction nozzle 6, the mounting head 5 moves to above the imaging device 9 before moving to the substrate P. The imaging device 9 images the component held by the suction nozzle 6 from a position below the suction nozzle 6. The image data of the obtained component photographed by the photographing device 9 is sent to the control device 11. The control device 11 determines whether the component held by the suction nozzle 6 is normal or not based on the image data of the component. When it is determined that the component is normal, the mounting head 5 moves above the board P, and the component held by the suction nozzle 6 is mounted on the board P. When it is determined that the component is abnormal, the mounting head 5 discards the component, for example.

The imaging device 9 is disposed inside the mountable range 23 in the XY plane. The imaging device 9 includes a 1 st imaging device 9A disposed in the 1 st mountable range 23A and a 2 nd imaging device 9B disposed in the 2 nd mountable range 23B.

The base frame 10 supports the component supply device 2, the substrate transfer device 3, the mounting head 5 including the suction nozzle 6, the head movement device 7, the suction nozzle movement device 8, and the imaging device 9, respectively.

The control device 11 controls the component supply device 2, the substrate transfer device 3, the mounting head 5 including the suction nozzle 6, the head movement device 7, and the suction nozzle movement device 8, respectively.

[ substrate conveying device ]

Fig. 6 is a functional block diagram showing the control device 11 according to the embodiment. The control means 11 comprise a computer system. The control device 11 includes an arithmetic processing device having a processor such as CPU (Central Processing Unit), and a storage device having a memory such as ROM (Read Only Memory) or RAM (Random Access Memory) and a storage memory (storage).

The control device 11 includes a production program storage unit 24, a substrate size acquisition unit 25, a buffer setting unit 26, a conveyance control unit 27, and a chucking control unit 28.

The production program storage unit 24 stores a production program that defines the mounting conditions of the component mounting device 1. As mounting conditions, the kind of the substrate P to which the components are to be mounted, the kind of the components to be mounted to the substrate P, and the number of the components to be mounted to the substrate P are exemplified. In the embodiment, the mounting conditions include the size of the substrate P on which the component is to be mounted. The size of the substrate P includes the substrate size in the conveying direction in which the substrate P is conveyed by the substrate conveying device 3. That is, in the embodiment, the production program storage section 24 stores the substrate size in the conveyance direction in which the substrate P is conveyed by the substrate conveyance device 3.

The substrate size obtaining section 25 obtains the substrate size in the conveying direction in which the substrate conveying device 3 conveys the substrate P. That is, the substrate size obtaining unit 25 obtains the substrate size in the X-axis direction. In the embodiment, the substrate size obtaining unit 25 obtains the substrate size in the X-axis direction from the production program storage unit 24.

When the input device is connected to the control device 11, the substrate size obtaining unit 25 may obtain the substrate size in the X-axis direction from the input device. As the input device, a keyboard or a touch panel for a computer is exemplified. An operator or manager of the component mounting apparatus 1 can operate the input device to input the substrate size in the X-axis direction to the control device 11.

The buffer setting unit 26 sets a buffer indicating a space for stopping the substrate P in the transport path 14 based on the substrate size acquired by the substrate size acquisition unit 25. The setting of the buffer includes at least one of the setting of the buffer size in the conveyance direction of the substrate P and the setting of the number of buffers. Depending on the kind of the printed wiring board to be produced, the kind of the substrate P to be used may vary. Depending on the kind of the printed wiring board to be produced, for example, the substrate size may be changed. The buffer setting section 26 flexibly sets the buffer in the case where the substrate size is changed. In the case where the substrate size is changed, the buffer setting section 26 flexibly sets the buffer size and the number of buffers based on the substrate size.

The conveyance control unit 27 controls conveyance of the substrate P based on the buffer set by the buffer setting unit 26. In the embodiment, the conveyance control unit 27 controls conveyance of the substrate P based on the substrate size acquired by the substrate size acquisition unit 25 and the buffer set by the buffer setting unit 26. The control of the conveyance of the substrate P includes control of the motor 17. The conveyance control unit 27 controls the motor 17 based on the detection signal of the substrate sensor 4. The transport control unit 27 stops the substrate P in the buffer based on the detection signal of the substrate sensor 4. The transport control unit 27 controls transport of the substrates P such that 1 substrate P of the substrate size acquired by the substrate size acquisition unit 25 is placed in 1 buffer area. In the embodiment, the conveyance control unit 27 controls conveyance of the substrates P based on the detection signal of the substrate sensor 4 so that 1 substrate P is stopped in 1 buffer area.

The clamping control section 28 controls the clamping device 18. The control of the clamping device 18 includes the control of the clamping actuator 20. As described above, the conveyance control unit 27 controls the motor 17 so that the substrate P stops in the buffer set by the buffer setting unit 26. The clamping device 18 clamps the substrate P stopped at the buffer area disposed in the mountable range 23. The clamp control unit 28 clamps the clamping device 18 to the substrate P stopped in the buffer area disposed in the mountable range 23. The position of the substrate P stopped in the buffer area disposed in the mountable range 23 is fixed by the clamping device 18.

[5 buffer mode ]

Fig. 7 is a diagram schematically showing an example of a state in which the conveyance path 14 according to the embodiment is set to the 5-buffer mode. The 5-buffer mode is a buffer mode in which 5 buffers are set in the conveyance path 14.

As shown in fig. 7, when the substrate size in the X-axis direction is small, the buffer setting unit 26 sets 5 buffers on the conveyance path 14. As shown in fig. 7, for example, when the substrate size is smaller than the distance JL between the detection position of the 5 th substrate sensor 4E and the detection position of the 6 th substrate sensor 4F, the buffer setting unit 26 sets 5 buffers on the conveyance path 14.

In the 5-buffer mode, the buffer setting unit 26 sets the 1 st buffer, the 2 nd buffer, the 3 rd buffer, the 4 th buffer, and the 5 th buffer in the conveyance path 14. The buffer setting unit 26 sets 5 buffers on the conveyance path 14 so that the 5 buffers do not overlap with each other.

The buffer setting section 26 sets the buffers such that at least 2 buffers out of the 5 buffers are arranged within the mountable range 23. In the example shown in fig. 7, a part of the downstream side of the 1 st buffer area is arranged inside the 1 st mountable range 23A. The 2 nd buffer is disposed inside the 1 st mountable range 23A. The 3 rd buffer is disposed between the 1 st mountable range 23A and the 2 nd mountable range 23B. The 4 th buffer is disposed inside the 2 nd mountable range 23B. A part of the upstream side of the 5 th buffer is disposed inside the 2 nd mountable range 23B. That is, in the 5-buffer mode, 5 buffers are set so as to correspond to the 5 conveyor belts 15, respectively.

The buffer setting unit 26 sets the buffer so that at least 1 detection position of the substrate sensor 4 is arranged in 1 buffer. In the example shown in fig. 7, the buffer setting unit 26 sets 5 buffers in the conveyance path 14 such that the detection position of the 1 st substrate sensor 4A, the detection position of the 2 nd substrate sensor 4B, and the detection position of the 3 rd substrate sensor 4C are disposed in the 1 st buffer, the detection position of the 4 th substrate sensor 4D is disposed in the 2 nd buffer, the detection position of the 5 th substrate sensor 4E and the detection position of the 6 th substrate sensor 4F are disposed in the 3 rd buffer, the detection position of the 7 th substrate sensor 4G is disposed in the 4 th buffer, the detection position of the 8 th substrate sensor 4H, the detection position of the 9 th substrate sensor 4I, and the detection position of the 10 th substrate sensor 4J are disposed in the 5 th buffer.

The substrate P includes a production substrate stopped for mounting components and a standby substrate stopped for standby. The production substrate and the standby substrate have an upstream end portion indicating an upstream end portion in the X-axis direction and a downstream end portion indicating a downstream end portion in the X-axis direction, respectively. The clamping device 18 clamps the production substrate. The buffer setting unit 26 sets the detection position of at least one substrate sensor 4 among the plurality of substrate sensors 4 to the clamp reference position 29. The clamping reference position 29 is: the clamping device 18 is made to clamp the position of the production substrate when at least one of the upstream side end portion and the downstream side end portion of the production substrate coincides.

In the example shown in fig. 7, the substrates P2, P4 out of the 5 substrates P1, P2, P3, P4, P5 are production substrates, and the substrates P1, P3, P5 are standby substrates.

The substrate P1 as the standby substrate stops in the 1 st buffer. The conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in the 1 st buffer zone in a state where the downstream side end portion of the substrate P1 slightly exceeds the detection position of the 2 nd substrate sensor 4B. The substrate P1 waits in the 1 st buffer for movement to the 2 nd buffer.

The substrate P2 as a production substrate is stopped at the 2 nd buffer overlapping the 1 st mountable range 23A. The detection position of the 4 th substrate sensor 4D is set at the chucking reference position 29 of the substrate P2. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in the 2 nd buffer zone in a state where the downstream side end portion of the substrate P2 coincides with the detection position of the 4 th substrate sensor 4D. The clamp control unit 28 clamps the substrate P2 stopped with the clamp device 18 with reference to the detection position of the 4 th substrate sensor 4D. After the substrate P2 is clamped by the clamping device 18, components are mounted to the substrate P2 by the mounting head 5.

The substrate P3 as the standby substrate stops at the 3 rd buffer. The conveyance control unit 27 controls the motor 17 so that the substrate P3 is stopped in the 3 rd buffer zone in a state where the downstream end portion of the substrate P3 coincides with the detection position of the 6 th substrate sensor 4F. The substrate P3 waits in the 3 rd buffer for movement to the 4 th buffer.

The substrate P4 as a production substrate stops at the 4 th buffer area overlapping with the 2 nd mountable range 23B. The detection position of the 7 th substrate sensor 4G is set at the chucking reference position 29 of the substrate P4. The conveyance control unit 27 controls the motor 17 so that the substrate P4 is stopped in the 4 th buffer zone in a state where the upstream end portion of the substrate P4 coincides with the detection position of the 7 th substrate sensor 4G. The clamp control unit 28 causes the clamp device 18 to clamp the substrate P4 stopped with reference to the detection position of the 7 th substrate sensor 4G. After the substrate P4 is clamped by the clamping device 18, components are mounted to the substrate P4 by the mounting head 5.

The substrate P5 as the standby substrate stops at the 5 th buffer. The conveyance control unit 27 controls the motor 17 so that the substrate P5 is stopped in the 5 th buffer zone in a state where the downstream end portion of the substrate P5 coincides with the detection position of the 10 th substrate sensor 4J. The substrate P5 waits in the 5 th buffer for being carried out from the transport path 14.

In the example shown in fig. 7, the clamp reference position 29 of the substrate P2 as the 1 st production substrate disposed on the upstream side and the clamp reference position 29 of the substrate P4 as the 2 nd production substrate disposed on the downstream side are symmetrically disposed in the X-axis direction with respect to the center CL of the conveyance path 14 in the X-axis direction. The clamp reference position 29 of the substrate P2 is set at the downstream side end of the substrate P2, and the clamp reference position 29 of the substrate P4 is set at the upstream side end of the substrate P4.

Fig. 8 is a diagram schematically showing an example of the state of the production substrate P2 and P4 shown in fig. 7 after mounting components thereon. By mounting components on the substrates P2 and P4, the substrates P2 and P4 become standby substrates. As shown in fig. 8, the conveyance control unit 27 controls the motor 17 so that the substrate P4 is stopped in a state where the downstream end portion of the substrate P4 coincides with the detection position of the 8 th substrate sensor 4H.

Fig. 9 is a diagram schematically showing an example of a state in which the conveyance path 14 according to the embodiment is set to the 5-buffer mode. Fig. 9 shows an example in which the detection position of the 3 rd substrate sensor 4C is set at the chucking reference position 29 of the substrate P2, and the detection position of the 8 th substrate sensor 4H is set at the chucking reference position 29 of the substrate P4. As shown in fig. 7 and 9, in the 5-buffer mode, the clamping reference position 29 can be changed.

The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in the 2 nd buffer zone in a state where the upstream end portion of the substrate P2 coincides with the detection position of the 3 rd substrate sensor 4C. The clamp control unit 28 clamps the substrate P2 stopped with the clamp device 18 with reference to the detection position of the 3 rd substrate sensor 4C. The conveyance control unit 27 controls the motor 17 so that the substrate P4 is stopped in the 4 th buffer zone in a state where the downstream end portion of the substrate P4 coincides with the detection position of the 8 th substrate sensor 4H. The clamp control unit 28 clamps the substrate P4 stopped with the clamp device 18 with reference to the detection position of the 8 th substrate sensor 4H.

In the example shown in fig. 9, the clamp reference position 29 of the substrate P2 as the 1 st production substrate disposed on the upstream side and the clamp reference position 29 of the substrate P4 as the 2 nd production substrate disposed on the downstream side are symmetrically disposed in the X-axis direction with respect to the center CL of the conveyance path 14 in the X-axis direction. The clamp reference position 29 of the substrate P2 is set at the upstream side end of the substrate P2, and the clamp reference position 29 of the substrate P4 is set at the downstream side end of the substrate P4.

Fig. 10 is a view schematically showing an example of a state after components are mounted on the substrates P2 and P4 as production substrates shown in fig. 9. By mounting components on the substrates P2 and P4, the substrates P2 and P4 become standby substrates. As shown in fig. 10, the conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the downstream end portion of the substrate P2 coincides with the detection position of the 4 th substrate sensor 4D.

[4 buffer mode ]

Fig. 11 is a diagram schematically showing an example of a state in which the conveyance path 14 according to the embodiment is set to the 4-buffer mode. The 4 buffer mode refers to: a buffer pattern of 4 buffers is set in the conveyance path 14.

As shown in fig. 11, when a substrate P having a larger substrate size than the substrate P that can be transported in the 5-buffer mode is transported, the buffer setting unit 26 sets 4 buffers in the transport path 14. For example, when the substrate size PL is larger than the distance JL between the detection position of the 5 th substrate sensor 4E and the detection position of the 6 th substrate sensor 4F, the buffer setting unit 26 sets 4 buffers on the conveyance path 14.

In the 4-buffer mode, the buffer setting unit 26 sets the 1 st buffer, the 2 nd buffer, the 3 rd buffer, and the 4 th buffer in the conveyance path 14. The buffer setting unit 26 sets 4 buffers on the conveyance path 14 so that the 4 buffers do not overlap with each other.

The buffer setting unit 26 sets the buffers such that at least 2 buffers out of the 4 buffers overlap the attachable range 23. In the example shown in fig. 11, a part of the downstream side of the 1 st buffer area is arranged inside the 1 st mountable range 23A. A part of the upstream side of the 2 nd buffer is disposed inside the 1 st mountable range 23A. A part of the downstream side of the 2 nd buffer is arranged between the 1 st mountable range 23A and the 2 nd mountable range 23B. A part of the upstream side of the 3 rd buffer is arranged between the 1 st mountable range 23A and the 2 nd mountable range 23B. A part of the downstream side of the 3 rd buffer is disposed inside the 2 nd mountable range 23B. A part of the upstream side of the 4 th buffer is disposed inside the 2 nd mountable range 23B.

The buffer setting unit 26 sets the buffer so that at least 1 detection position of the substrate sensor 4 is arranged in 1 buffer. In the example shown in fig. 11, the buffer setting unit 26 sets 4 buffers in the conveyance path 14 such that the detection position of the 1 st substrate sensor 4A, the detection position of the 2 nd substrate sensor 4B, and the detection position of the 3 rd substrate sensor 4C are disposed in the 1 st buffer, the detection position of the 4 th substrate sensor 4D, the detection position of the 5 th substrate sensor 4E, and the detection position of the 6 th substrate sensor 4F are disposed in the 2 nd buffer, the detection position of the 7 th substrate sensor 4G is disposed in the 3 rd buffer, the detection position of the 8 th substrate sensor 4H, the detection position of the 9 th substrate sensor 4I, and the detection position of the 10 th substrate sensor 4J are disposed in the 4 th buffer.

In the example shown in fig. 11, the substrates P2 and P3 out of the 4 substrates P1, P2, P3 and P4 are production substrates, and the substrates P1 and P4 are standby substrates.

The substrate P1 as the standby substrate stops in the 1 st buffer. The conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in the 1 st buffer zone in a state where the downstream end portion of the substrate P1 coincides with the detection position of the 3 rd substrate sensor 4C. The substrate P1 waits in the 1 st buffer for movement to the 2 nd buffer.

The substrate P3 as a production substrate is stopped at the 3 rd buffer area overlapping with the 2 nd mountable range 23B. The detection position of the 7 th substrate sensor 4G is set at the chucking reference position 29 of the substrate P4. The conveyance control unit 27 controls the motor 17 so that the substrate P4 is stopped in the 3 rd buffer zone in a state where the upstream end portion of the substrate P4 coincides with the detection position of the 7 th substrate sensor 4G. The clamp control unit 28 causes the clamp device 18 to clamp the substrate P4 stopped with reference to the detection position of the 7 th substrate sensor 4G. After the substrate P4 is clamped by the clamping device 18, components are mounted to the substrate P4 by the mounting head 5.

The substrate P4 as the standby substrate stops at the 4 th buffer. The conveyance control unit 27 controls the motor 17 so that the substrate P4 is stopped in the 4 th buffer zone in a state where the downstream end portion of the substrate P4 coincides with the detection position of the 10 th substrate sensor 4J. The substrate P4 waits in the 4 th buffer for being carried out from the transport path 14.

Fig. 12 is a view schematically showing a state after components are mounted on the substrates P2 and P3 as the production substrates shown in fig. 11. By mounting components on the substrates P2 and P3, the substrates P2 and P3 become standby substrates. As shown in fig. 12, the conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the downstream end portion of the substrate P2 coincides with the detection position of the 6 th substrate sensor 4F. The conveyance control unit 27 controls the motor 17 so that the substrate P4 is stopped in a state where the downstream end portion of the substrate P4 coincides with the detection position of the 8 th substrate sensor 4H.

[2 buffer mode ]

Fig. 13 is a diagram schematically showing an example of a state in which the conveyance path 14 according to the embodiment is set to the 2-buffer mode. The 2 buffer mode refers to: a buffer pattern of 2 buffers is set in the conveyance path 14.

As shown in fig. 13, when a substrate P having a larger substrate size than the substrate P that can be transported in the 4-buffer mode is transported, the buffer setting unit 26 sets 2 buffers in the transport path 14. In the example shown in fig. 13, the substrate size is smaller than the size in the X-axis direction of the mountable range 23.

In the buffer 2 mode, the buffer setting unit 26 sets the buffer 1 and the buffer 2 in the conveyance path 14. The buffer setting unit 26 sets 2 buffers on the conveyance path 14 so that the 2 buffers do not overlap with each other.

The buffer setting unit 26 sets the buffers so that the 2 buffers overlap the attachable range 23. In the example shown in fig. 13, a part of the 1 st buffer is disposed inside the 1 st attachable range 23A. A part of the 2 nd buffer is disposed inside the 2 nd mountable range 23B.

The buffer setting unit 26 sets the buffer so that at least 1 detection position of the substrate sensor 4 is arranged in 1 buffer. In the example shown in fig. 13, the buffer setting unit 26 sets 2 buffers in the conveyance path 14, and the detection position of the 1 st substrate sensor 4A, the detection position of the 2 nd substrate sensor 4B, the detection position of the 3 rd substrate sensor 4C, the detection position of the 4 th substrate sensor 4D, the detection position of the 5 th substrate sensor 4E, and the detection position of the 6 th substrate sensor 4F are arranged in the 1 st buffer, and the detection position of the 7 th substrate sensor 4G, the detection position of the 8 th substrate sensor 4H, the detection position of the 9 th substrate sensor 4I, and the detection position of the 10 th substrate sensor 4J are arranged in the 2 nd buffer.

In the example shown in fig. 13, two substrates P1 and P2 are production substrates, respectively.

The substrate P1 as a production substrate stops at the 1 st buffer area overlapping with the 1 st mountable range 23A. The detection position of the 4 th substrate sensor 4D is set at the chucking reference position 29 of the substrate P1. The conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in the 1 st buffer zone in a state where the downstream end portion of the substrate P1 coincides with the detection position of the 4 th substrate sensor 4D. The clamp control unit 28 causes the clamp device 18 to clamp the substrate P1 stopped with reference to the detection position of the 4 th substrate sensor 4D. After the substrate P1 is clamped by the clamping device 18, components are mounted to the substrate P1 by the mounting head 5.

The substrate P2 as a production substrate is stopped at the 2 nd buffer overlapping the 2 nd mountable range 23B. The detection position of the 8 th substrate sensor 4H is set at the chucking reference position 29 of the substrate P2. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in the 2 nd buffer zone in a state where the upstream end portion of the substrate P2 coincides with the detection position of the 8 th substrate sensor 4H. The clamp control unit 28 clamps the substrate P2 stopped with the clamp device 18 with reference to the detection position of the 8 th substrate sensor 4H. After the substrate P2 is clamped by the clamping device 18, components are mounted to the substrate P2 by the mounting head 5.

Fig. 14 is a view schematically showing a state after components are mounted on the substrates P1, P2 as the production substrates shown in fig. 13. By mounting components on the substrates P1 and P2, the substrates P1 and P2 become standby substrates. As shown in fig. 14, the conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream end portion of the substrate P1 coincides with the detection position of the 6 th substrate sensor 4F. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the downstream end portion of the substrate P2 coincides with the detection position of the 10 th substrate sensor 4J.

Fig. 15 is a diagram schematically showing an example of a state in which the conveyance path 14 according to the embodiment is set to the 2-buffer mode. In the example shown in fig. 15, the substrate size is larger than the size in the X-axis direction of the mountable range 23.

In the example shown in fig. 15, a part of the substrate P1 is disposed inside the 1 st mountable range 23A, but another part of the substrate P1 is disposed outside the 1 st mountable range 23A. In addition, a part of the substrate P2 is disposed inside the 2 nd mountable range 23B, but another part of the substrate P2 is disposed outside the 2 nd mountable range 23B.

In the example shown in fig. 15, the detection position of the 2 nd substrate sensor 4B and the detection position of the 4 th substrate sensor 4D are set at the chucking reference position 29 of the substrate P1, respectively. The detection position of the 7 th substrate sensor 4G and the detection position of the 9 th substrate sensor 4I are set at the chucking reference positions 29 of the substrates P2, respectively.

Fig. 16, 17, 18, 19, and 20 are views for explaining steps of mounting components on the two substrates P1 and P2 shown in fig. 15, respectively.

As shown in fig. 16, first, the substrate P1 is determined as a standby substrate, and the substrate P2 is determined as a production substrate. The conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream side end of the substrate P1 as the standby substrate coincides with the detection position of the 4 th substrate sensor 4D. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the downstream end of the substrate P2, which is the production substrate, coincides with the detection position of the 9 th substrate sensor 4I. A part of the downstream side of the substrate P1 is disposed in the 1 st mountable range 23A, and a part of the downstream side of the substrate P2 is disposed in the 2 nd mountable range 23B. The clamp control unit 28 clamps the substrate P2 stopped with the clamp device 18 with reference to the detection position of the 9 th substrate sensor 4I. After the substrate P2 is clamped by the clamping device 18, components are mounted to a part of the downstream side of the substrate P2 arranged in the 2 nd mountable range 23B by the mounting head 5.

Next, as shown in fig. 17, the conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream side end of the substrate P1 as the standby substrate coincides with the detection position of the 6 th substrate sensor 4F. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the upstream end of the substrate P2, which is the production substrate, coincides with the detection position of the 7 th substrate sensor 4G. A part of the upstream side of the substrate P1 is disposed in the 1 st mountable range 23A, and a part of the upstream side of the substrate P2 is disposed in the 2 nd mountable range 23B. The clamp control unit 28 clamps the substrate P2 stopped with the clamp device 18 with reference to the detection position of the 7 th substrate sensor 4G. After the substrate P2 is clamped by the clamping device 18, components are mounted to a part of the upstream side of the substrate P2 arranged in the 2 nd mountable range 23B by the mounting head 5. The mounting of the components on the substrate P2 is completed in the above manner.

In this way, in a state where the 2 nd buffer is set so that the 7 th substrate sensor 4G and the 9 th substrate sensor 4I are arranged in 1 buffer, the conveyance control unit 27 switches between: the substrate P2 is stopped at the 1 st position of the 2 nd buffer based on the detection signal of the 9 th substrate sensor 4I, and the substrate P2 is stopped at the 2 nd position of the 2 nd buffer based on the detection signal of the 7 th substrate sensor 4G.

Next, as shown in fig. 18, the substrate P1 becomes a production substrate, and the substrate P2 becomes a standby substrate. The conveyance control section 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream side end of the substrate P1 as the production substrate coincides with the detection position of the 4 th substrate sensor 4D. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the downstream end of the substrate P2, which is the standby substrate, coincides with the detection position of the 10 th substrate sensor 4J. A part of the downstream side of the substrate P1 is disposed in the 1 st mountable range 23A, and a part of the upstream side of the substrate P2 is disposed in the 2 nd mountable range 23B. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 4 th substrate sensor 4D. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the downstream side of the substrate P1 arranged in the 1 st mountable range 23A by the mounting head 5.

Next, as shown in fig. 19, the conveyance control section 27 controls the motor 17 so that the substrate P1 is stopped in a state where the upstream side end of the substrate P1 as the production substrate coincides with the detection position of the 2 nd substrate sensor 4B. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the downstream end of the substrate P2, which is the standby substrate, coincides with the detection position of the 10 th substrate sensor 4J. A part of the upstream side of the substrate P1 is disposed in the 1 st mountable range 23A, and a part of the upstream side of the substrate P2 is disposed in the 2 nd mountable range 23B. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 2 nd substrate sensor 4B. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the upstream side of the substrate P1 arranged in the 1 st mountable range 23A by the mounting head 5. In this way, the mounting of the components on the substrate P1 is completed.

In this way, in a state where the 1 st buffer is set so that the 2 nd substrate sensor 4B and the 4 th substrate sensor 4D are arranged in 1 buffer, the conveyance control unit 27 switches between: the substrate P1 is stopped at the 1 st position of the 1 st buffer based on the detection signal of the 4 th substrate sensor 4D, and the substrate P1 is stopped at the 2 nd position of the 1 st buffer based on the detection signal of the 2 nd substrate sensor 4B.

By mounting components on the substrates P1 and P2, the substrates P1 and P2 become standby substrates. As shown in fig. 20, the conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream end portion of the substrate P1 coincides with the detection position of the 6 th substrate sensor 4F. The conveyance control unit 27 controls the motor 17 so that the substrate P4 is stopped in a state where the downstream end portion of the substrate P2 coincides with the detection position of the 10 th substrate sensor 4J.

[2 addition of extended conveying Path in buffer mode ]

Fig. 21 is a diagram schematically showing an example of a state in which an extended conveyance path is added to the conveyance path 14 according to the embodiment. In the case of conveying a substrate P having a larger substrate size than the substrate P shown in fig. 15 to 20, an extended conveying path is added to the conveying path 14. The detection position of the 1 st extended substrate sensor 4Ae is arranged upstream of the 1 st substrate sensor 4A with respect to the center CL of the transport path 14 in the X-axis direction. The 1 st substrate sensor 4A may be omitted. The detection position of the 10 th extended substrate sensor 4Je is disposed downstream of the 10 th substrate sensor 4J with respect to the center CL of the transport path 14 in the X-axis direction. The 10 th substrate sensor 4J may be omitted.

In the example shown in fig. 21, the detection position of the 2 nd substrate sensor 4B and the detection position of the 4 th substrate sensor 4D are set at the chucking reference position 29 of the substrate P1, respectively. The detection position of the 7 th substrate sensor 4G and the detection position of the 9 th substrate sensor 4I are set at the chucking reference positions 29 of the substrates P2, respectively.

Fig. 22, 23, 24, 25, and 26 are views for explaining steps of mounting components on the two substrates P1 and P2 shown in fig. 21, respectively.

As shown in fig. 22, first, the substrates P1 and P2 are determined as production substrates, respectively. The conveyance control section 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream side end of the substrate P1 as the production substrate coincides with the detection position of the 4 th substrate sensor 4D. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the upstream end of the substrate P2, which is the production substrate, coincides with the detection position of the 7 th substrate sensor 4G. A part of the downstream side of the substrate P1 is disposed in the 1 st mountable range 23A, and a part of the upstream side of the substrate P2 is disposed in the 2 nd mountable range 23B. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 4 th substrate sensor 4D. The clamp control unit 28 clamps the substrate P2 stopped with the clamp device 18 with reference to the detection position of the 7 th substrate sensor 4G. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the downstream side of the substrate P1 arranged in the 1 st mountable range 23A by the mounting head 5. After the substrate P2 is clamped by the clamping device 18, the component is mounted on a part of the upstream side of the substrate P2 disposed in the 2 nd mountable range 23B by the mounting head 5.

Next, as shown in fig. 23, the substrate P1 becomes a production substrate, and the substrate P2 becomes a standby substrate. The conveyance control section 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream side end of the substrate P1 as the production substrate coincides with the detection position of the 4 th substrate sensor 4D. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the downstream end of the substrate P2, which is the standby substrate, coincides with the detection position of the 10 th extended substrate sensor 4 Je. A part of the downstream side of the substrate P1 is disposed in the 1 st mountable range 23A, and a part of the upstream side of the substrate P2 is disposed in the 2 nd mountable range 23B. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 4 th substrate sensor 4D. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the downstream side of the substrate P1 arranged in the 1 st mountable range 23A by the mounting head 5.

Next, as shown in fig. 24, the substrates P1 and P2 become standby substrates. The conveyance control unit 27 controls the motor 17, and the substrate P1 is stopped in a state where the downstream end of the substrate P1 as the standby substrate coincides with the detection position of the 4 th substrate sensor 4D. The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in a state where the downstream end of the substrate P2, which is the standby substrate, coincides with the detection position of the 10 th extended substrate sensor 4 Je. A part of the downstream side of the substrate P1 is disposed in the 1 st mountable range 23A, and a part of the upstream side of the substrate P2 is disposed in the 2 nd mountable range 23B.

Next, as shown in fig. 25, the conveyance control section 27 controls the motor 17 so that the substrate P1 is stopped in a state where the upstream side end of the substrate P1 as the production substrate coincides with the detection position of the 2 nd substrate sensor 4B. The conveyance control unit 27 controls the motor 17 so that the substrate P2, which is a standby substrate, is carried out of the conveyance path 14. A part of the upstream side of the substrate P1 is disposed in the 1 st mountable range 23A. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 2 nd substrate sensor 4B. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the upstream side of the substrate P1 arranged in the 1 st mountable range 23A by the mounting head 5.

Next, as shown in fig. 26, the conveyance control section 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream side end of the substrate P1 as the production substrate coincides with the detection position of the 9 th substrate sensor 4I. A part of the downstream side of the substrate P1 is disposed in the 2 nd mountable range 23B. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 9 th substrate sensor 4I. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the downstream side of the substrate P1 arranged in the 2 nd mountable range 23B by the mounting head 5. In this way, the mounting of the components on the substrate P1 is completed.

[ Bar mode ]

Fig. 27 is a diagram schematically showing an example of a state in which the conveyance path 14 according to the embodiment is set to the long mode. The stripe pattern is as follows: a buffer pattern of a buffer is set in the conveyance path 14 for mounting components on the long substrate P1. Fig. 27 shows an example in which the long-length mode is a 1-buffer mode in which 1 buffer is set in the conveyance path 14.

As shown in fig. 27, when the substrate P is transported, the substrate size of which is larger than the substrate P transported in the 2-buffer mode, the buffer setting unit 26 sets 1 buffer in the transport path 14. In the example shown in fig. 27, the substrate size is larger than the distance between the detection position of the 2 nd substrate sensor 4B and the detection position of the 7 th substrate sensor 4G.

In the 1 st buffer mode, the buffer setting unit 26 sets the 1 st buffer in the conveyance path 14.

The buffer setting unit 26 sets the buffer so that 1 buffer overlaps the 1 st attachable range 23A and the 2 nd attachable range 23B, respectively.

The buffer setting unit 26 sets the buffer so that all the detection positions of the 10 substrate sensors 4 are arranged in the 1 st buffer.

The detection position of the 2 nd substrate sensor 4B and the detection position of the 9 th substrate sensor 4I are set at the chucking reference position 29 of the substrate P1.

The conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in the 1 st buffer zone in a state where the upstream end portion of the substrate P1 coincides with the detection position of the 2 nd substrate sensor 4B. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 2 nd substrate sensor 4B. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the upstream side of the substrate P1 arranged in the 1 st mountable range 23A by the mounting head 5.

The conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in the 1 st buffer zone in a state where the downstream end portion of the substrate P1 coincides with the detection position of the 9 th substrate sensor 4I. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 9 th substrate sensor 4I. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the downstream side of the substrate P1 arranged in the 2 nd mountable range 23B by the mounting head 5. In this way, the mounting of the components on the substrate P1 is completed.

Fig. 28 is a view schematically showing a state after mounting components on the substrate P1 as the production substrate shown in fig. 27. By mounting components on the substrate P1, the substrate P1 becomes a standby substrate. As shown in fig. 28, the conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in a state where the downstream end portion of the substrate P1 coincides with the detection position of the 10 th substrate sensor 4J.

Fig. 29 is a diagram schematically showing an example of a state in which the conveyance path 14 according to the embodiment is set to the long mode. Fig. 29 shows an example in which an extended conveyance path is added to the conveyance path 14, and the long-length mode is a 2-buffer mode in which 2 buffers are set in the extended conveyance path 14.

As shown in fig. 29, for example, in the case of conveying the substrate P having a substrate size larger than the distance between the detection position of the 2 nd substrate sensor 4B and the detection position of the 7 th substrate sensor 4G, the conveying path 14 is extended additionally. The buffer setting unit 26 sets 2 buffers on the extended conveyance path 14.

In the buffer 2 mode, the buffer setting unit 26 sets the 1 st buffer and the 2 nd buffer in the extended conveyance path 14.

The buffer setting unit 26 sets the buffer so that the 1 st buffer overlaps the 1 st attachable range 23A and the 2 nd buffer overlaps the 2 nd attachable range 23B.

The buffer setting unit 26 sets the buffer so that the 1 st extended substrate sensor 4Ae, the 2 nd substrate sensor 4B, the 3 rd substrate sensor 4C, the 4 th substrate sensor 4D, the 5 th substrate sensor 4E, and the 6 th substrate sensor 4F are disposed in the 1 st buffer, and the 7 th substrate sensor 4G, the 8 th substrate sensor 4H, the 9 th substrate sensor 4I, and the 10 th extended substrate sensor 4Je are disposed in the 2 nd buffer.

The detection position of the 4 th substrate sensor 4D is set at the chucking reference position 29 of the substrate P1. The detection position of the 7 th substrate sensor 4G is set at the chucking reference position 29 of the substrate P2.

The conveyance control unit 27 controls the motor 17 so that the substrate P1 is stopped in the 1 st buffer zone in a state where the downstream end portion of the substrate P1 coincides with the detection position of the 4 th substrate sensor 4D. The clamp control unit 28 clamps the substrate P1 stopped with the clamp device 18 with reference to the detection position of the 4 th substrate sensor 4D. After the substrate P1 is clamped by the clamping device 18, components are mounted to a part of the downstream side of the substrate P1 arranged in the 1 st mountable range 23A by the mounting head 5.

The conveyance control unit 27 controls the motor 17 so that the substrate P2 is stopped in the 2 nd buffer zone in a state where the upstream end portion of the substrate P2 coincides with the detection position of the 7 th substrate sensor 4G. The clamp control unit 28 clamps the substrate P2 stopped with the clamp device 18 with reference to the detection position of the 7 th substrate sensor 4G. After the substrate P2 is clamped by the clamping device 18, components are mounted to a part of the upstream side of the substrate P2 arranged in the 2 nd mountable range 23B by the mounting head 5.

Fig. 30 is a view schematically showing a state after components are mounted on the substrates P1 and P2 as production substrates shown in fig. 29. By mounting components on the substrates P1 and P2, the substrates P1 and P2 become standby substrates. As shown in fig. 30, the conveyance control unit 27 controls the motor 17 such that the substrate P1 is stopped in a state where the downstream end portion of the substrate P1 coincides with the detection position of the 6 th substrate sensor 4F, and the substrate P2 is stopped in a state where the downstream end portion of the substrate P2 coincides with the detection position of the 10 th extended substrate sensor 4 Je.

[ mechanism for changing clamping Range ]

Fig. 31 is a diagram schematically showing the clamping range changing mechanism 30 according to the embodiment. As shown in fig. 31, the clamping device 18 includes a support base 19, a clamping actuator 20, a lifting member 21, a clamping member 22, and a clamping range changing mechanism 30.

As described above, the support table 19 can be moved in the up-down direction by the power generated by the clamp actuator 20. The lifting member 21 is movable in the up-down direction while being supported by the support table 19. In fig. 31, the 1 st lifting member 21A, the 2 nd lifting member 21B, and the 3 rd lifting member 21C are shown as lifting members 21, the 1 st conveyor belt 15A and the 2 nd conveyor belt 15B are shown as conveyor belts 15, and the 1 st pulley 16A and the 2 nd pulley 16B are shown as pulleys 16. The 1 st lifting member 21A, the 2 nd lifting member 21B, and the 3 rd lifting member 21C are arranged in the X-axis direction. The 1 st conveying belt 15A and the 2 nd conveying belt 15B are arranged in the X-axis direction. The 1 st lifting member 21A and the 2 nd lifting member 21B support the 1 st conveyor belt 15A via the 1 st pulley 16A, respectively. The 3 rd lifting member 21C supports the 2 nd conveyor belt 15B via the 2 nd pulley 16B. The clamp member 22 clamps the substrate P supported by the conveyor belt 15 between the clamp member and the lifting member 21.

The clamping range changing mechanism 30 changes the clamping range of the clamping device 18 to the substrate P. In the example shown in fig. 31, the clamp member 22 is disposed at a position where it can clamp the substrate P with the 2 nd lift member 21B and the 3 rd lift member 21C, respectively. That is, the clamp member 22 is disposed directly above the 2 nd lifting member 21B and the 3 rd lifting member 21C. A part of the upstream side of the clamp member 22 is disposed directly above the 2 nd lifting member 21B, and a part of the downstream side of the clamp member 22 is disposed directly above the 3 rd lifting member 21C. A part of the 1 st conveyor belt 15A on the upstream side is disposed outside the 1 st mountable range 23A, and a part of the 1 st conveyor belt 15A on the downstream side is disposed inside the 1 st mountable range 23A.

The clamp range changing mechanism 30 includes a lifting mechanism 31 that lifts and lowers the 2 nd lifting member 21B relative to the support table 19. The 2 nd lifting member 21B can be lifted and lowered separately from the 1 st lifting member 21A and the 3 rd lifting member 21C by the lifting mechanism 31. The clamping range is changed by lifting and lowering the 2 nd lifting and lowering member 21B relative to the support table 19.

In the example shown in fig. 31, the lifting mechanism 31 includes a selection member 32 that can be disposed between the lower surface of the 2 nd lifting member 21B and the upper surface of the support table 19. The selection member 32 is interposed between the lower surface of the 2 nd elevating member 21B and the upper surface of the support table 19, so that the 2 nd elevating member 21B is elevated with respect to the support table 19. By extracting the selection member 32 from between the lower surface of the 2 nd elevating member 21B and the upper surface of the support table 19, the 2 nd elevating member 21B is lowered relative to the support table 19.

Fig. 31 shows a state in which the conveyance path 14 is set to the 5-buffer mode. The clamp control unit 28 controls the clamp range changing mechanism 30 based on the buffer set by the buffer setting unit 26. When the buffer setting unit 26 sets the buffer to the 5-buffer mode, the clamp control unit 28 controls the clamp range changing mechanism 30 so that the clamp range is reduced. In the case of decreasing the clamping range, the clamping control section 28 controls the lifting mechanism 31 so that the 2 nd lifting member 21B is lowered.

As described with reference to fig. 7 and the like, in the 5-buffer mode, the substrate P2 as the production substrate is disposed in the 2 nd buffer, and the substrate P1 as the standby substrate is disposed in the 1 st buffer. The clamping control section 28 controls the clamping range changing mechanism 30 so that the substrate P2 is clamped by the clamping device 18 and the substrate P1 is not clamped by the clamping device 18.

The 3 rd lifting member 21C is disposed in the 2 nd buffer. If the support base 19 is raised by the operation of the clamp actuator 20, the 3 rd lifting member 21C is raised together with the support base 19. Thereby, as shown in fig. 31, the substrate P2 is sandwiched between the 3 rd lifting member 21C and the clamping member 22. The substrate P1 as the standby substrate is disposed in the 1 st buffer. The clamping range changing mechanism 30 lowers the 2 nd elevating member 21B relative to the support table 19 so that the substrate P1 disposed in the 1 st buffer is not clamped by the clamping device 18. As a result, as shown in fig. 31, even if the support table 19 is lifted, the 2 nd lifting member 21B is separated from the clamping member 22, and therefore the substrate P1 is not clamped by the clamping device 18.

Fig. 32 is a diagram schematically showing the clamp range changing mechanism 30 when the conveyance path 14 according to the embodiment is set to the 2-buffer mode. The clamp control unit 28 controls the clamp range changing mechanism 30 based on the buffer set by the buffer setting unit 26. When the buffer setting unit 26 sets the buffer to the 2-buffer mode, the clamp control unit 28 controls the clamp range changing mechanism 30 so that the clamp range increases. In the case of increasing the clamping range, the clamping control section 28 controls the lifting mechanism 31 so that the 2 nd lifting member 21B is lifted. As shown in fig. 32, the selection member 32 is inserted between the lower surface of the 2 nd elevating member 21B and the upper surface of the support table 19, so that the 2 nd elevating member 21B is elevated relative to the support table 19.

As described with reference to fig. 13 and the like, in the 2-buffer mode, the substrate P1 as the production substrate is arranged in the 1 st buffer. The clamp control unit 28 controls the clamp range changing mechanism 30 so that the substrate P1 is clamped by the clamp device 18.

In the 2 nd buffer mode, the 1 st lifting member 21A, the 2 nd lifting member 21B, and the 3 rd lifting member 21C are respectively arranged in the 1 st buffer. As shown in fig. 32, since the substrate P1 has a large substrate size, in the 1 st buffer area, a part of the substrate P1 is disposed directly above the 2 nd lifting member 21B, and a part of the substrate P1 is disposed directly above the 3 rd lifting member 21C. When the support table 19 is raised by the operation of the clamp actuator 20, the 2 nd lifting member 21B and the 3 rd lifting member 21C are raised together with the support table 19. As a result, as shown in fig. 32, a part of the substrate P1 is sandwiched between the 2 nd lifting member 21B and the clamping member 22, and a part of the substrate P1 is sandwiched between the 3 rd lifting member 21C and the clamping member 22.

In the 2-buffer mode, the standby substrate is not present on the upstream side of the 2 nd elevating member 21B. The production substrate is supported by a portion on the downstream side of the 1 st conveyor 15A, but the standby substrate is not supported by the 1 st conveyor 15A. That is, the standby substrate does not exist in the 1 st buffer. Therefore, as shown in fig. 32, a part of the 1 st conveyor 15A can be lifted.

As described above, as described with reference to fig. 31, when the substrate P having a small substrate size conveyed in the 5-buffer mode is clamped, the clamp control unit 28 controls the lifting mechanism 31 so that the support table 19 is lifted up together with the 3 rd lifting member 21C and the 2 nd lifting member 21B is lowered down with respect to the support table 19. The substrate P1 is supported by the 1 st conveyor 15A in a state where the substrate P2 supported by the 2 nd conveyor 15B is sandwiched by the 3 rd lifting member 21C and the clamp member 22. As described with reference to fig. 32, when clamping a substrate P having a large substrate size conveyed in the 2-buffer mode, the clamping control unit 28 controls the lifting mechanism 31 so that the support table 19 is lifted up together with the 3 rd lifting member 21C and the 2 nd lifting member 21B is lifted up with respect to the support table 19. As shown in fig. 32, the substrate P1 having a large substrate size is held between the 2 nd lift member 21B and the 3 rd lift member 21C and the clamp member 22.

The clamping device 18 including the clamping range changing mechanism 30 provided upstream of the center CL of the conveying path 14 is described above with reference to fig. 31 and 32. The clamp range changing mechanism 30 provided on the upstream side of the center CL of the conveying path 14 is configured to reduce the clamp range by not raising the 2 nd lifting member 21B when the 3 rd lifting member 21C is raised as shown in fig. 31, and to increase the clamp range by raising the 2 nd lifting member 21B when the 3 rd lifting member 21C is raised as shown in fig. 32.

The clamping device 18 including the clamping range changing mechanism 30 is disposed symmetrically in the X-axis direction with respect to the center CL of the conveying path 14 in the X-axis direction. The clamp range changing mechanism 30 provided downstream of the center CL of the conveying path 14 does not raise the 6 th lifting member 21F when the 5 th lifting member 21E is raised, thereby reducing the clamp range, and raises the 6 th lifting member 21F when the 5 th lifting member 21E is raised, thereby increasing the clamp range.

Fig. 33 is a diagram schematically showing a modification of the clamping range changing mechanism 30 according to the embodiment. In the example shown in fig. 31 and 32, the lifting mechanism 31 has a selection member 32 interposed between the lower surface of the 2 nd lifting member 21B and the upper surface of the support table 19. As shown in fig. 33, the lifting mechanism 31 may have a selection member 33 movably supported by a cylinder (not shown). The cylinder is mounted on a conveying rail (not shown). The conveying rail is disposed between a pair of 3 rd lifting members 21C disposed along the Y-axis direction. In the Z-axis direction, the size of the 2 nd lifting member 21B is smaller than the size of the 3 rd lifting member 21C. A part of the 3 rd lifting member 21C on the upstream side is arranged below the 2 nd lifting member 21B. The selection member 33 is inserted between the lower surface of the 2 nd lifting member 21B and the 3 rd lifting member 21C, whereby the 2 nd lifting member 21B is lifted up with respect to the support table 19. By pulling out the selection member 33 from between the lower surface of the 2 nd lifting member 21B and the 3 rd lifting member 21C, the 2 nd lifting member 21B is lowered relative to the support table 19.

Fig. 34 schematically shows a modification of the clamping range changing mechanism 30 according to the embodiment. In the example shown in fig. 31, 32, and 33, the clamping range is changed by lifting the 2 nd lifting member 21B. As shown in fig. 34, in the case of expanding the clamping range, the support pin 34 may be provided on the support base 19 without raising the 2 nd lifting member 21B. The support pins 34 support the lower surface of the substrate P1 on the upstream side of the 3 rd lifting member 21C. A part of the upstream side of the substrate P1 is held by the support pins 34 and the clamp member 22, and a part of the downstream side of the substrate P1 is held by the 3 rd lifting member 21C and the clamp member 22. Further, a plurality of support pins 34 may be arranged, and at least 1 support pin of the plurality of support pins 34 may support a central portion of the lower surface of the substrate P1 in the Y-axis direction. When the support pins 34 support the central portion of the lower surface of the substrate P1, the deflection of the substrate P1 can be suppressed.

[ substrate sensor ]

The functions of the plurality of substrate sensors 4 (4A, 4B, 4C, 4D, 4E, 4F, 4G, 4H, 4I, 4J) are changed based on the buffer set by the buffer setting section 26. As the functions of the substrate sensor 4, a function of a carry-in sensor, a function of a deceleration sensor, a function of a stop sensor, and a function of a carry-out sensor are exemplified. The substrate sensor 4 functions as a carry-in sensor, a carry-out sensor, a deceleration sensor, or a stop sensor based on the buffer set by the buffer setting unit 26.

The function of the carry-in sensor means: and detecting the substrate P carried into the target buffer area. The substrate P is detected by the carry-in sensor, and the conveyance control unit 27 starts carrying in the substrate P into the target buffer.

The function of the deceleration sensor means: and a function of decelerating the substrate P when detecting the presence or absence of the conveyed substrate P. The presence or absence of the substrate P is detected by the deceleration sensor, and the conveyance control unit 27 decelerates the substrate P. The conveyance control unit 27 may decelerate the substrate P when the state where the substrate P is present at the detection position of the deceleration sensor changes to the state where the substrate P is absent, or may decelerate the substrate P when the state where the substrate P is absent at the detection position of the deceleration sensor changes to the state where the substrate P is present.

The function of the stop sensor means: and a function of stopping the substrate P when the conveyed substrate P is detected. The substrate P is detected by the stop sensor, and the conveyance control unit 27 stops the substrate P.

The function of the carry-out sensor means: the function of detecting the substrate P carried out of the target buffer. The conveyance control unit 27 recognizes that the substrate P has been completely carried out from the target buffer area by detecting the presence or absence of the substrate P by the carry-out sensor.

The 1 substrate sensor 4 may have a plurality of functions. For example, with respect to the 2 nd buffer zone of the 5-buffer zone mode described with reference to fig. 7, the 3 rd substrate sensor 4C functions as a carry-in sensor and a deceleration sensor, and the 4 th substrate sensor 4D functions as a carry-out sensor and a stop sensor.

In addition, the substrate sensor 4 that does not function may be present based on the buffer set by the buffer setting unit 26. For example, in the 5-buffer mode described with reference to fig. 7, the 9 th substrate sensor 4I does not function (is not used).

The substrate sensor 4 that functions in a certain buffer area may be the substrate sensor 4 disposed inside the buffer area, or may be the substrate sensor 4 disposed outside the buffer area.

In addition, when the conveyance control unit 27 determines that the substrate P is not present in the target buffer based on the detection signal of the substrate sensor 4, it is possible to output a carry-in permission signal that permits the substrate P located upstream of the target buffer to be carried in the target buffer. In this case, the substrate P existing on the upstream side may be the substrate P existing in the buffer region set in the conveyance path 14, or may be the substrate P existing in a device different from the substrate conveyance device 3.

In addition, when the conveyance control unit 27 determines that the substrate P is present, which can be carried into the target buffer, based on the detection signal of the substrate sensor 4, it is possible to output a carry-out permission signal for carrying out the substrate P present in the target buffer to the space on the downstream side. In this case, the space on the downstream side may be a buffer area set in the conveyance path 14 or may be a space outside the substrate conveyance device 3.

Clamping mode

As mentioned above, the clamping means 18 are used separately in the following clamping manner, namely: a clamping manner of clamping the substrate P when an upstream side end portion of the substrate P coincides with the clamping reference position 29 and a clamping manner of clamping the substrate P when a downstream side end portion of the substrate P coincides with the clamping reference position 29.

As described with reference to fig. 7, in the 5-buffer mode, when the production substrate is clamped at a position upstream of the center CL, the clamping device 18 clamps the substrate P when the downstream end of the substrate P coincides with the clamp reference position 29, and when the production substrate is clamped at a position downstream of the center CL, the clamping device 18 clamps the substrate P when the upstream end of the substrate P coincides with the clamp reference position 29.

As described with reference to fig. 15, in the 2-buffer mode, when two production substrates are clamped 2 times, the clamping device 18 clamps the substrate P when the downstream end portion of the substrate P coincides with the clamping reference position 29 in the 1 st clamping, and the clamping device 18 clamps the substrate P when the upstream end portion of the substrate P coincides with the clamping reference position 29 in the 2 nd clamping.

As described with reference to fig. 27, in the 1-buffer mode, when 1 production substrate is clamped 2 times, the clamping device 18 clamps the substrate P when the upstream end of the substrate P coincides with the clamp reference position 29, and when the downstream end of the substrate P coincides with the clamp reference position 29, the clamping device 18 clamps the substrate P when the downstream end of the substrate P coincides with the clamp reference position 29. Thereby, the long substrate is pulled to the inside of the substrate transport apparatus 3, and the components are mounted on the production substrate.

As described with reference to fig. 29, in the 2-buffer mode in which the transport path 14 is extended, when two production substrates are clamped, the clamping device 18 clamps the substrate P when the downstream end of the substrate P coincides with the clamp reference position 29, and when the upstream end of the substrate P coincides with the clamp reference position 29, the clamping device 18 clamps the substrate P when the downstream end of the substrate P coincides with the clamp reference position 29.

[ method of clamping ]

Fig. 35, 36 and 37 are diagrams schematically showing an example of a clamping method of the substrate P according to the embodiment. Fig. 35, 36 and 37 each show an example of clamping the substrate P as a production substrate in the buffer 2 of the buffer 5 mode described with reference to fig. 7.

As shown in fig. 35, the substrate P stands by in the 1 st buffer.

After the other substrate P is carried out from the buffer 2 to the buffer 3, the conveyance control unit 27 controls the motor 17 to convey the substrate P in the buffer 1 to the buffer 2.

As shown in fig. 36, the transport control unit 27 decelerates the substrate P after the substrate P moves downstream of the detection position of the 3 rd substrate sensor 4C by a predetermined distance from the detection position of the 3 rd substrate sensor 4C.

Next, as shown in fig. 37, the conveyance control unit 27 stops the substrate P after the downstream end of the substrate P is disposed at the detection position of the 4 th substrate sensor 4D. The clamp control unit 28 moves up the 3 rd lifting member 21C in a state where the downstream end portion of the substrate P coincides with the detection position of the 4 th substrate sensor 4D, and clamps the substrate P with the 3 rd lifting member 21C and the clamp member 22. As described with reference to fig. 31, the clamp control unit 28 controls the clamp range changing mechanism 30 so that the 2 nd lifting member 21B does not rise when the 3 rd lifting member 21C rises.

Fig. 38, 39, 40, and 41 are diagrams schematically showing an example of a clamping method of the substrate P according to the embodiment. As described with reference to fig. 7, fig. 38, 39, 40, and 41 show examples in which the substrate P as the production substrate is clamped in the 4 th buffer zone of the 5-buffer zone mode, respectively.

As shown in fig. 38, the substrate P stands by in the 3 rd buffer.

After the other substrates P are carried out from the 4 th buffer area to the 5 th buffer area, the conveyance control section 27 controls the motor 17 to convey the substrates P of the 3 rd buffer area to the 4 th buffer area.

As shown in fig. 39, the conveyance control unit 27 decelerates the substrate P after the substrate P passes the detection position of the 6 th substrate sensor 4F.

Next, as shown in fig. 40, the conveyance control unit 27 rotates the 4 th conveyor belt 15D in the reverse direction after the substrate P passes the detection position of the 7 th substrate sensor 4G.

Next, as shown in fig. 41, the conveyance control unit 27 stops the substrate P after the upstream end of the substrate P is disposed at the detection position of the 7 th substrate sensor 4G. The clamp control unit 28 lifts the 5 th lift member 21E in a state where the upstream end portion of the substrate P coincides with the detection position of the 7 th substrate sensor 4G, and clamps the substrate P with the 5 th lift member 21E and the clamp member 22. The clamping range changing mechanism 30 is also provided to the 5 th lifting member 21E. The clamp control unit 28 controls the clamp range changing mechanism 30 so that the 6 th lifting member 21F does not rise when the 5 th lifting member 21E rises.

[ selection of clamping reference position ]

As described with reference to fig. 7 and 9, the clamping reference position 29 at which the clamping device 18 clamps the substrate P can be selected. In the example shown in fig. 7, the clamp reference position 29 of the substrate P on the upstream side of the center CL is set at the downstream side end of the substrate P, and the clamp reference position 29 of the substrate P on the downstream side of the center CL is set at the upstream side end of the substrate P. In the example shown in fig. 9, the clamp reference position 29 of the substrate P on the upstream side of the center CL is set at the upstream side end of the substrate P, and the clamp reference position 29 of the substrate P on the downstream side of the center CL is set at the downstream side end of the substrate P.

Fig. 42 is a plan view schematically showing the component mounting apparatus 1 when mounting components on the substrate P in a state in which the clamp reference position 29 of the substrate P on the upstream side of the center CL of the conveyance path 14 in the conveyance direction is set at the downstream side end of the substrate P and the clamp reference position 29 of the substrate P on the downstream side of the center CL of the conveyance path 14 in the conveyance direction is set at the upstream side end of the substrate P. That is, fig. 42 is a diagram corresponding to the state of fig. 7 in detail.

Fig. 43 is a plan view schematically showing the component mounting apparatus 1 when mounting components on the substrate P in a state in which the clamp reference position 29 of the substrate P on the upstream side of the center CL of the conveyance path 14 in the conveyance direction is set at the upstream side end of the substrate P and the clamp reference position 29 of the substrate P on the downstream side of the center CL of the conveyance path 14 in the conveyance direction is set at the downstream side end of the substrate P. That is, fig. 43 is a diagram corresponding to the state of fig. 9 in detail.

In the example shown in fig. 42, when mounting components on the substrate P disposed in the 1 st mountable range 23A, the mounting head 5 on the upstream side passes over the 1 st imaging device 9A after holding the components by the suction nozzle 6 in the component supply device 2 disposed on the +y side of the conveying path 14. As described above, the 1 st imaging device 9A images the component held by the suction nozzle 6. The 1 st imaging device 9A can take an image of the component held by the suction nozzle 6 by the mounting head 5 passing over the 1 st imaging device 9A. After passing over the 1 st imaging device 9A, the mounting head 5 moves upward of the substrate P, and mounts a component on the substrate P. In the case of the example shown in fig. 42, the position of the 1 st imaging device 9A is separated from the position of the substrate P on which the component is mounted in the XY plane. In this case, the moving distance of the mounting head 5 from the component supply device 2 to the substrate P via the upper side of the 1 st imaging device 9A increases. If the moving distance of the mounting head 5 is long, the time until the components are mounted on 1 substrate P may be long.

In the example shown in fig. 42, when mounting components on the substrate P disposed in the 2 nd mountable range 23B, the downstream-side mounting head 5 holds components by the suction nozzle 6 in the component supply device 2 disposed on the-Y side of the conveying path 14, and then moves upward of the substrate P to mount the components on the substrate P. In the case of the example shown in fig. 42, the position of the tape feeder 13 of the supply member is separated from the position of the substrate P of the mounting member in the XY plane. In this case, the moving distance of the mounting head 5 from the component supply device 2 to the substrate P may be long, and the time until the components are mounted on 1 substrate P may be long.

In the embodiment, the clamping reference position 29 of the substrate P is selected so that the moving distance of the mounting head 5 becomes short.

As shown in fig. 43, the position of the 1 st imaging device 9A is close to the position of the substrate P on which the component is mounted by setting the clamp reference position 29 of the substrate P on the upstream side of the center CL at the upstream side end of the substrate P. Therefore, the moving distance of the mounting head 5 from the component supply device 2 to the substrate P via the upper side of the 1 st imaging device 9A becomes shorter. Therefore, the time required for mounting the components on 1 substrate P can be suppressed from increasing.

As shown in fig. 43, the position of the tape feeder 13 for supplying the components is close to the position of the mounting component substrate P by setting the clamp reference position 29 of the substrate P on the downstream side of the center CL at the downstream side end of the substrate P. Therefore, the moving distance of the mounting head 5 from the component supply device 2 to the substrate P becomes shorter. Therefore, the time required for mounting the components on 1 substrate P can be suppressed from increasing.

In addition, the selection of the clamping reference position 29 can also be implemented in the 4-buffer mode.

[ Effect ]

As described above, the buffer region indicating the space for stopping the substrate P is set in the conveyance path 14 of the substrate conveyance device 3 based on the substrate size in the conveyance direction. At least one of a buffer size and the number of buffers in the conveyance direction is set based on the substrate size. By flexibly setting the buffer regions based on the substrate size, the substrate transfer apparatus 3 can dispose 1 substrate P in 1 buffer region. Therefore, even if the substrate size of the substrate P on which the component is mounted is changed, a decrease in the conveyance efficiency of the substrate P can be suppressed.

When mounting components on a substrate P having a small substrate size, a plurality of substrates P are arranged on the conveyance path 14 by setting buffers such that the buffer size is small and the number of buffers is large. This can shorten the distance between the standby board and the mountable range 23. Therefore, the substrate transfer device 3 can move the standby substrate to the mountable range 23 immediately after the components are mounted on the previous production substrate. When mounting components on a substrate P having a large substrate size, the substrate transport apparatus 3 can transport the substrate P without increasing the size by setting the buffer so that the buffer size is large and the number of buffers is small. By flexibly setting the buffer region based on the substrate size in this way, it is possible to suppress an increase in the size of the substrate conveying device 3 and a decrease in the conveying efficiency of the substrate P.

The substrate sensor 4 is disposed in the conveyance path 14 at a plurality of intervals along the conveyance direction. The detection positions of the plurality of substrate sensors 4 are symmetrically arranged in the conveyance direction with respect to the center CL of the conveyance path 14 in the conveyance direction. Thereby, even if at least one of the buffer size and the number of buffers is changed, the substrate P can be detected by the substrate sensor 4. In addition, there are cases where the substrate P is transported from the-X side to the +x side and cases where the substrate P is transported from the +x side to the-X side. By arranging the detection positions of the plurality of substrate sensors 4 symmetrically in the conveyance direction with reference to the center CL, the conveyance control unit 27 can control conveyance of the substrate P based on the detection signal of the substrate sensor 4 even if the conveyance direction of the substrate P changes.

The buffer setting unit 26 sets the buffer so that at least 1 detection position of the substrate sensor 4 is arranged in 1 buffer. Thereby, the conveyance control unit 27 can stop the substrate P in the buffer based on the detection signal of the substrate sensor.

The function of the substrate sensor 4 can be switched to the function of the carry-in sensor, the function of the deceleration sensor, the function of the stop sensor, and the function of the carry-out sensor based on the buffer set by the buffer setting section 26. Thus, even if at least one of the buffer size and the number of buffers is changed, the conveyance control section 27 can appropriately convey the substrate P based on the detection signal of the substrate sensor.

The substrate P includes a production substrate stopped for mounting components and a standby substrate stopped for standby. The substrate transfer apparatus 3 is provided with a clamping device 18 for clamping the production substrate. The buffer setting unit 26 sets the detection position of at least one substrate sensor 4 among the plurality of substrate sensors 4 to the clamp reference position 29. The clamp reference position 29 of the 1 st production substrate disposed on the upstream side and the clamp reference position 29 of the 2 nd production substrate disposed on the downstream side are symmetrically disposed in the conveying direction with respect to the center CL of the conveying path 14 in the conveying direction.

For example, as described with reference to fig. 7, by setting the clamp reference position 29 of the substrate P2 as the 1 st production substrate to the downstream side end portion of the substrate P2 and setting the clamp reference position 29 of the substrate P4 as the 2 nd production substrate to the upstream side end portion of the substrate P4, the moving distance when the substrate P3 as the standby substrate waiting in the 3 rd buffer is moved to the 4 th buffer is shortened. This shortens the time until the components are mounted on 1 substrate P.

For example, as described with reference to fig. 9, by setting the clamp reference position 29 of the substrate P2, which is the 1 st production substrate, at the upstream side end portion of the substrate P2, and setting the clamp reference position 29 of the substrate P4, which is the 2 nd production substrate, at the downstream side end portion of the substrate P4, the moving distance of the mounting head 5 when mounting the component onto the production substrate is shortened as described with reference to fig. 43. This shortens the time until the components are mounted on 1 substrate P.

For example, as described with reference to fig. 15, in a state where the buffer is set so that the 2 nd substrate sensor 4B and the 4 th substrate sensor 4D are arranged in the 1 st buffer, the conveyance control unit 27 switches between: stopping the substrate P1 at the 1 st position of the 1 st buffer area where the upstream side end of the substrate P1 coincides with the detection position of the 2 nd substrate sensor 4B based on the detection signal of the 2 nd substrate sensor 4B; and stopping the substrate P1 at the 2 nd position of the 1 st buffer zone where the downstream side end of the substrate P1 coincides with the detection position of the 4 th substrate sensor 4D based on the detection signal of the 4 th substrate sensor 4D. By disposing the substrate P1 at the 1 st position and the 2 nd position of the 1 st buffer area, respectively, even if the substrate size of the substrate P1 is large, the entire area of the surface of the substrate P1 can be disposed in the 1 st mountable range 23A. Therefore, the component can be mounted to the entire surface of the substrate P1.

Similarly, in a state where the buffer is set so that the 7 th substrate sensor 4G and the 9 th substrate sensor 4I are disposed in the 2 nd buffer, the conveyance control unit 27 switches between: stopping the substrate P2 at the 1 st position of the 2 nd buffer region where the upstream side end of the substrate P2 coincides with the detection position of the 7 th substrate sensor 4G based on the detection signal of the 7 th substrate sensor 4G; and stopping the substrate P2 at the 2 nd position of the 2 nd buffer zone where the downstream side end of the substrate P2 coincides with the detection position of the 9 th substrate sensor 4I based on the detection signal of the 9 th substrate sensor 4I. By disposing the substrate P2 at the 1 st position and the 2 nd position of the 2 nd buffer region, respectively, even if the substrate size of the substrate P2 is large, the entire area of the surface of the substrate P2 can be disposed in the 2 nd mountable range 23B. Therefore, the component can be mounted to the entire surface of the substrate P2.

A clamping device 18 is provided that clamps the production substrate stopped in the buffer zone disposed in the mountable range 23. Thus, the component is mounted to the production substrate in a state where the position of the production substrate is fixed by the clamping device 18.

The clamping device 18 has a clamping range changing mechanism 30 that changes the clamping range of the substrate P. The clamp control unit 28 controls the clamp range changing mechanism 30 based on the buffer set by the buffer setting unit 26.

As described with reference to fig. 31, when the substrate size is small and the conveyance path 14 is set to the 5-buffer mode, the clamp control unit 28 controls the lift mechanism 31 so that the support table 19 is lifted up together with the 3 rd lift member 21C and the 2 nd lift member 21B is lowered down relative to the support table 19. Thus, the substrate P1 as a standby substrate is supported by the 1 st conveyor 15A in the 1 st buffer zone in a state where the substrate P2 as a production substrate is sandwiched by the 3 rd lifting member 21C and the clamp member 22. The substrate P1 can be standby in a state where a part of the substrate P1 is disposed below the clamp member 22.

As described with reference to fig. 32, when the substrate size is large and the conveyance path 14 is set to the 2-buffer mode, the clamp control unit 28 controls the lift mechanism 31 so that the support table 19 is lifted up together with the 3 rd lift member 21C and the 2 nd lift member 21B is lifted up with respect to the support table 19. Thereby, the substrate P1 as a production substrate is sandwiched by the 2 nd lifting member 21B and the 3 rd lifting member 21C and the clamp member 22.

Description of the reference numerals

1: a component mounting device; 2: a component supply device; 3: a substrate conveying device; 4: a substrate sensor; 4A: a 1 st substrate sensor; 4Ae: 1 st extension substrate sensor; 4B: a 2 nd substrate sensor; 4C: a 3 rd substrate sensor; 4D: a 4 th substrate sensor; 4E: a 5 th substrate sensor; 4F: a 6 th substrate sensor; 4G: a 7 th substrate sensor; 4H: an 8 th substrate sensor; 4I: a 9 th substrate sensor; 4J: a 10 th substrate sensor; 4Je: a 10 th elongate substrate sensor; 5: a mounting head; 6: a suction nozzle; 7: a head moving device; 7A: an X-axis guide rail; 7B: a Y-axis guide rail; 7C: an X-axis linear actuator; 7D: a Y-axis linear actuator; 8: a suction nozzle moving device; 8A: a Z-axis motor; 8B: a θZ motor; 9: a photographing device; 9A: a 1 st photographing device; 9B: a 2 nd photographing device; 10: a base frame; 11: a control device; 12: a feeder receptacle; 13: a belt feeder; 14: a conveying path; 15: a conveyor belt; 15A: a 1 st conveyor belt; 15B: a 2 nd conveyer belt; 15C: a 3 rd conveyor belt; 15D: a 4 th conveyor belt; 15E: a 5 th conveyor belt; 16: a belt wheel; 16A: 1 st belt wheel; 16B: a 2 nd belt wheel; 16C: a 3 rd belt wheel; 16D: a 4 th belt wheel; 16E: a 5 th belt wheel; 17: a motor; 17A: a 1 st motor; 17B: a 2 nd motor; 17C: a 3 rd motor; 17D: a 4 th motor; 17E: a 5 th motor; 18: a clamping device; 19: a support table; 20: a clamping actuator; 21: a lifting member; 21A: a 1 st lifting member; 21B: a 2 nd lifting member; 21C: a 3 rd lifting member; 21D: a 4 th lifting member; 21E: a 5 th lifting member; 21F: a 6 th lifting member; 21G: a 7 th lifting member; 22: a clamping member; 23: a mountable range; 23A: 1 st mountable range; 23B: 2 nd installable range; 24: a production program storage unit; 25: a substrate size obtaining unit; 26: a buffer setting unit; 27: a conveyance control unit; 28: a clamping control part; 29: clamping a reference position; 30: a clamping range changing mechanism; 31: a lifting mechanism; 32: a selection member; 33: a selection member; 34: and (5) supporting the pin.

Claims

1. A substrate conveying device for conveying a substrate along a conveying direction in a conveying path is characterized by comprising:

a substrate size obtaining unit that obtains a substrate size in the transport direction;

a buffer setting unit that sets a buffer indicating a space for stopping the substrate on the transport path based on the substrate size; and

and a transport control unit that controls transport of the substrates such that 1 substrate is placed in 1 buffer area.

2. The substrate transport apparatus according to claim 1, wherein,

the setting of the buffer area includes at least one of setting of a buffer area size and setting of the number of buffer areas in the conveying direction.

3. The substrate transport apparatus according to claim 1 or 2, wherein,

the substrate conveying device is provided with a plurality of substrate sensors which are arranged in the conveying path at intervals along the conveying direction,

the detection positions of the plurality of substrate sensors are symmetrically arranged in the conveying direction with respect to a center of the conveying path in the conveying direction.

4. The substrate transport apparatus according to claim 3, wherein,

The buffer setting section sets the buffers so that at least 1 detection position of the substrate sensor is arranged in 1 buffer,

the transport control unit stops the substrate in the buffer region based on a detection signal of the substrate sensor.

5. The substrate transport apparatus according to claim 4, wherein,

based on the buffer set by the buffer setting unit, the function of the substrate sensor is switched to a function of a carry-in sensor for detecting a substrate carried in to a target buffer, a function of a deceleration sensor for decelerating the substrate when the presence or absence of the substrate to be transported is detected, a function of a stop sensor for stopping the substrate when the substrate to be transported is detected, and a function of a carry-out sensor for detecting a substrate carried out from the target buffer.

6. The substrate transport apparatus according to any one of claims 3 to 5, wherein,

the substrate includes a production substrate stopped for mounting components and a standby substrate stopped for standby,

the substrate conveying device is provided with a clamping device for clamping the production substrate,

the production substrate has an upstream-side end portion indicating an upstream-side end portion in the conveying direction and a downstream-side end portion indicating a downstream-side end portion in the conveying direction,

The buffer setting section sets a detection position of at least one of the plurality of substrate sensors to a clamping reference position at which the clamping device clamps the production substrate when the detection position coincides with at least one of the upstream side end portion and the downstream side end portion,

the clamping reference position of the 1 st production substrate arranged on the upstream side and the clamping reference position of the 2 nd production substrate arranged on the downstream side are symmetrically arranged in the conveying direction with respect to the center of the conveying path in the conveying direction.

7. The substrate transport apparatus according to claim 6, wherein,

the clamping reference position of the 1 st production substrate is set at the downstream side end portion of the 1 st production substrate,

the chucking reference position of the 2 nd production substrate is set at the upstream side end portion of the 2 nd production substrate.

8. The substrate transport apparatus according to claim 6, wherein,

the clamping reference position of the 1 st production substrate is set at the upstream side end portion of the 1 st production substrate,

the chucking reference position of the 2 nd production substrate is set at the downstream side end portion of the 2 nd production substrate.

9. The substrate transport apparatus according to any one of claims 3 to 8, wherein,

The transfer control unit switches between the following two conditions in a state where the buffer is set so that the 1 st substrate sensor and the 2 nd substrate sensor are disposed in 1 buffer: stopping the substrate at the 1 st position of the buffer area based on a detection signal of the 1 st substrate sensor; and stopping the substrate at the 2 nd position of the buffer area based on a detection signal of the 2 nd substrate sensor.

10. The substrate transport apparatus according to any one of claims 1 to 6, wherein,

the substrate conveying device comprises:

a clamping device clamping the substrate stopped in the buffer zone configured in the mountable range; and

and a clamping control part for controlling the clamping device.

11. The substrate transport apparatus according to claim 10, wherein,

the clamping device has a clamping range changing mechanism for changing the clamping range,

the clamping control unit controls the clamping range changing mechanism based on the buffer set by the buffer setting unit.

12. The substrate transport apparatus according to claim 11, wherein,

the clamping range changing mechanism is symmetrically arranged in the conveying direction with respect to a center of the conveying path in the conveying direction.

13. The substrate transport apparatus according to claim 11 or 12, wherein,

the substrate conveying device is provided with a conveying belt which supports the substrate and rotates,

the clamping device has:

a clamping actuator;

a support table which is lifted by power generated by the clamping actuator;

a lifting member that is lifted and lowered together with the support table in a state of being supported by the support table; and

a clamping member for clamping the substrate supported by the conveyor belt between the clamping member and at least a part of the lifting member,

the conveyor belt includes a 1 st conveyor belt and a 2 nd conveyor belt arranged along the conveying direction,

the lifting member includes a 1 st lifting member and a 2 nd lifting member arranged along the conveying direction,

the 1 st lifting member supports the 1 st conveyor belt via the 1 st pulley,

the 2 nd lifting member supports the 2 nd conveyor belt via the 2 nd pulley,

the clamping range changing mechanism comprises a lifting mechanism for lifting the 1 st lifting member relative to the supporting table,

the clamping member is arranged right above the 1 st lifting member and the 2 nd lifting member,

the clamping range is changed by lifting and lowering the 1 st lifting and lowering member relative to the support table.

14. The substrate transport apparatus according to claim 13, wherein,

the clamp control unit controls the lifting mechanism so that the support table is lifted together with the 2 nd lifting member when clamping a substrate of the 1 st substrate size, and the 1 st lifting member is lowered relative to the support table, and controls the lifting mechanism so that the support table is lifted together with the 2 nd lifting member and the 1 st lifting member is lifted relative to the support table when clamping a substrate of the 2 nd substrate size larger than the 1 st substrate size.

15. The substrate transport apparatus according to claim 14, wherein,

in a state where the 1 st substrate size substrate is held by the 2 nd lifting member and the clamping member, the other substrates are supported by the 1 st conveyor.

16. The substrate transport apparatus according to claim 14, wherein,

the 2 nd substrate size substrate is held by the 1 st elevation member, the 2 nd elevation member, and the clamping member.

17. A component mounting device is characterized by comprising:

the substrate conveying device of any one of claims 1 to 16; and

and a mounting head for mounting the component to the substrate which is arranged at the inner side of the mountable range by the substrate conveying device.