JP4832244B2 - Predetermined working method and predetermined working apparatus on printed circuit board - Google Patents

Predetermined working method and predetermined working apparatus on printed circuit board Download PDF

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JP4832244B2
JP4832244B2 JP2006278221A JP2006278221A JP4832244B2 JP 4832244 B2 JP4832244 B2 JP 4832244B2 JP 2006278221 A JP2006278221 A JP 2006278221A JP 2006278221 A JP2006278221 A JP 2006278221A JP 4832244 B2 JP4832244 B2 JP 4832244B2
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printed circuit
circuit board
position
work
predetermined
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JP2008098386A (en
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剛 加藤
雅史 天野
明宏 川尻
東輔 河田
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富士機械製造株式会社
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Description

  The present invention relates to a predetermined work method and a predetermined work apparatus for a printed circuit board that perform these predetermined work efficiently while inspecting the quality of the predetermined work such as mounting on a printed circuit board and solder printing.

When mounting is considered as the predetermined work, a technique according to Patent Document 1 is known as a method for inspecting the quality of mounting of mounted electronic components. As shown in FIG. 2 of Patent Document 1, this is because the printed circuit board on which the mounting of the electronic component is completed by the mounting spindle at the mounting position of the table is transported and positioned along the table to the downstream inspection position. The mounting on the printed circuit board at the mounting position and the inspection of the mounting state of the printed circuit board at the inspection position are performed in parallel. As a result, it is not necessary to take another time for checking the quality of the mounted state after the mounting is completed, and the production efficiency is improved.
Japanese Patent Laid-Open No. 06-265324 (page 6, FIGS. 1 to 3)

  However, in the technique according to Patent Document 1, when a printed circuit board that has been transported from the mounting position and placed at the inspection position is detected to have a mounting failure by inspection, the printed circuit board is removed or further downstream. It was transported to the mounting apparatus, and the work for repairing the mounting had to be performed in the downstream mounting apparatus. In addition, it is necessary to take an image of an electronic component to be mounted by a mounting inspection camera and perform image processing of a complicated captured image, which requires time and labor for image processing.

  The present invention has been made in view of the above-described conventional problems, and can quickly detect an abnormality of a predetermined work performed on a printed circuit board, and can appropriately perform the predetermined work efficiently correspondingly. It is to provide a predetermined working method and a predetermined working device on a substrate.

In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a substrate transport device that transports a printed circuit board and positions the printed circuit board at a predetermined position, and a work position that is positioned by the substrate transport device. In a predetermined working device on a printed circuit board comprising predetermined working means for performing a predetermined work on the printed circuit board, the first printed circuit board before work is moved from an upstream standby position provided on the upstream side of the working position. , Work positioning means for transporting and positioning to the work position, predetermined work means for performing a predetermined work on the first printed circuit board positioned at the work position, and at the latest before the completion of the predetermined work of the first printed circuit board And an upstream standby position carrying means for carrying the second printed circuit board into the upstream standby position, and a field of view of at least a part of the first printed circuit board. Camera means that can be accommodated, imaging control means for causing the camera means to image the first printed circuit board before and after a predetermined operation, and the first printed circuit board after the predetermined operation on the downstream side of the operation position A downstream standby position transporting means for transporting to a certain downstream standby position, the first printed circuit board after a predetermined operation is transported to the downstream standby position, and the second printed circuit board is transported from the upstream standby position. A new work positioning means for transporting and positioning to a work position, a new predetermined work means for performing a predetermined work on the second printed circuit board, and the first printed circuit board after the predetermined work are imaged by the camera means. Image processing means for performing image processing by comparing the image data with the image data captured by the camera means on the first printed circuit board before a predetermined operation; Image processing means that is performed in parallel with a predetermined operation being performed on the printed circuit board, and at the downstream standby position, a substrate standby shelf configured in two stages, upper and lower, and the substrate standby shelf is moved up and down. A lift device for aligning upper and lower substrate standby shelves at the end of the working position at the moving end, and a printed circuit board can be carried from the work position to the substrate standby shelf, from the substrate standby shelf to the working position. A loading / unloading device capable of returning the printed circuit board and capable of unloading the printed circuit board from the substrate standby shelf to the downstream side; and a control device for driving and controlling the lifting device and the loading / unloading device. .

The structural feature of the invention according to claim 2 is that, in the first aspect, the control device determines that the first printed circuit board placed on the upper and lower substrate standby shelves is defective. Drives the lifting device to align the other substrate standby shelf with the end of the working position, and drives the loading / unloading device to move the second printed circuit board on which the predetermined operation has been performed to the other substrate standby shelf. After the second printed circuit board is loaded, the lifting device is driven to align one substrate standby shelf at the end of the working position, and the loading / unloading device is driven to determine that the work is defective. The first printed circuit board is returned to the work position .

The structural feature of the invention according to claim 3 is the determination means according to claim 1 or 2, wherein the determination means determines whether the predetermined work on the printed circuit board is good or not based on the data processed by the image processing means. A determination unit that is performed in parallel with a predetermined operation being performed on the second printed circuit board, and a first printed circuit board that is determined to be defective by the determination unit is driven by the loading / unloading device, and the downstream side And a work position return means for returning the work position from the standby position to the work position .

According to a fourth aspect of the present invention, there is provided a structural feature of the first printed circuit board according to the third aspect, wherein the determination unit determines that the work on the printed circuit board is defective, and the first printed circuit board returned to the work position by the loading / unloading device. It is further provided with the repair means for repairing .

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the working position is a mounting position, and the predetermined working means sucks an electronic component and places it on a printed circuit board. It is a component transfer device having a component mounting head to be mounted, and the predetermined working device is a mounting device having the component transfer device .

According to the first aspect of the present invention, the image data obtained by capturing the first printed circuit board after the predetermined operation by the camera unit is compared with the image data obtained by capturing the first printed circuit board before the predetermined operation by the camera unit. Therefore, the image data is simplified and can be quickly processed. In parallel with the new predetermined work to be performed on the second printed circuit board at the predetermined work position, image processing of the first printed circuit board that has been performed previously and waits at the downstream standby position is performed. When the predetermined work is performed on the printed circuit board, the work time and the image processing time proceed in parallel, so that the predetermined work and the image processing can be completed in a short time as a whole .
Then, the printed circuit boards on which the predetermined work has been performed can be made to stand by on the upper and lower board standby shelves provided at the downstream standby position. As a result, for example, the printed circuit board determined to be defective at the downstream standby position and the printed circuit board at the work position are exchanged, the order of the printed circuit boards sent to the next process is exchanged, or a specific printed circuit board is While storing in the substrate standby shelf, it is possible to produce a buffering effect in substrate transportation such as sending another printed circuit board to the next process.

According to the invention of claim 2, when it is determined that the first printed circuit board placed on one of the upper and lower substrate standby shelves is defective in operation, the second printed circuit board in the operation position is replaced with the other printed circuit board. Since the first printed circuit board loaded on the one board standby shelf can be returned to the working position, the second printed circuit board at the working position is returned to the upstream standby position. Therefore, it is possible to repair the first printed circuit board that is determined to be defective, and it is possible to quickly perform a predetermined predetermined operation .

According to the invention according to claim 3, it is possible to automatically determine whether or not the printed circuit board is defective in work, and return the printed circuit board determined to be defective due to the determination to the working position, for example, reexamine with a camera again, A defective printed circuit board can be removed, and the removed printed circuit board can be repaired and returned at another location .

According to the invention of claim 4, since the defective printed circuit board is repaired (for example, notification to the operator, correction or re-correction), the predetermined operation is efficiently performed on the printed circuit board without sending the defective printed circuit board to the downstream process. Can be done .

According to the invention of claim 5, when mounting the electronic component on the printed circuit board , the electronic component is first mounted in the downstream standby position in parallel with the new mounting operation for mounting on the second printed circuit board at the mounting position. In order to perform image processing of the first printed circuit board to stand by, when a plurality of printed circuit boards are mounted, the mounting time and the image processing time will proceed in parallel. Implementation and image processing can be terminated. In addition, the printed circuit board determined to be defective in mounting can be returned to the mounting position to perform repair work. Moreover, the buffer effect in board | substrate conveyance of mounting can be produced with the board | substrate standby shelf of two steps | paragraphs of upper and lower sides .

  A first embodiment in which a predetermined working method for a printed circuit board according to the present invention is specifically implemented in a mounting apparatus will be described below. FIG. 1 is a plan view showing the outline of the mounting apparatus according to the present embodiment, and FIG. 2 is a side view showing the outline of the mounting apparatus.

  As shown in FIGS. 1 and 2, the mounting device 2 includes a substrate transport device 6 that transports the printed circuit board 4 and positions the printed circuit board 4 at a predetermined position, and the entire printed circuit board 4 that is loaded, positioned, and placed at the predetermined position. Provided on a CCD camera 8 that can be accommodated in the field of view at a time, and a movable table 12 supported so as to be movable in the X direction (conveyance direction) and the Y direction (direction perpendicular to the X direction) with respect to the base 10. The component transfer device 16 and the substrate recognition camera 18 having the component mounting head 14, the control device 20 for controlling the imaging by the CCD camera 8 and the mounting by the component transfer device 16, and the image captured by the CCD camera 8 are processed. An image processing device 22 as an image processing means to perform, and a determination device 26 as a determination means for determining the quality of the printed circuit board 4 from the imaging data image-processed by the image processing device 22 It is equipped with a.

  The substrate transfer device 6 is stretched between a pair of support walls 26, 28 arranged in parallel along the transfer direction (X direction) on the base 10, and the opposing wall surfaces of these support walls 26, 28. The conveyor belt 30 is provided with a lifter device, which will be described later, arranged side by side inside the opposing conveyor belt 30, and a clamp device 40 that positions and supports the printed circuit board 4 at a mounting position JP as a work position.

  The conveyor belt 30 is connected to a conveyor driving device (not shown), and the conveyor belt 30 transports the printed circuit board 4 in the transport direction by driving the conveyor driving device. The support wall 28 is fixed to a slider 42 at the lower part, and the slider 42 is assembled to a plurality of moving rails 44 extending in a direction perpendicular to the conveying direction. The lifter device includes a mounting position lifter device 34 provided at the mounting position JP, an upstream lifter device 36 provided at an upstream standby position AP upstream of the mounting position, and a downstream standby downstream of the mounting position. And a downstream lifter device 38 provided at the position BP, and each of the lifter devices 34, 36, 38 can move independently. Each lifter device 34, 36, 38 includes a support frame 46 and a lift support piece 48, and the support frame 46 is erected on the base 10 in parallel with the conveyor belt 30. A plurality of cylinder devices 50 driven by an air pump (not shown) are provided at the upper end of the support frame 46, and the lifting support pieces 48 can be moved up and down by these cylinder devices 50. The vertical position of the upper end surface of the elevating support piece 48 moves up and down between the upper and lower positions of the upper surface of the conveyor belt 30 so that the printed circuit board 4 can be transferred between the conveyor belt and the elevating support piece 48. It is configured.

  A clamping device 40 is disposed at a mounting position JP inside the mounting position lifter device 34. As shown in FIG. 3, the clamping device 40 includes a clamping device 52 that clamps the printed circuit board 4, a plurality of unillustrated backup pins standing on the upper surface, and a substrate support base 54 that supports the printed circuit board 4 from below. The substrate support 54 is moved up and down by a lifting device 56 that expands and contracts by air. The holding device 52 is provided so as to be slidable in a direction perpendicular to the conveying direction by a guide (not shown), and is driven by an air cylinder device 58. When the printed circuit board 4 is transported and stopped by a stopper, which will be described later, the printed circuit board 4 is delivered from the conveyor belt 30 by the mounting position lifter device 34, and the lifting device 56 of the clamp device 40 is further extended to extend the mounting position lifter device 34. The printed board 4 placed on the board is received by the board support base 54, raised to a raised position where the printed board 4 is mounted, and the printed board 4 is held by the holding device 52 to hold the printed board 4.

  As shown in FIG. 4, the substrate transport device 6 is provided with a carry-in detection sensor SB that detects that the printed circuit board 4 is transported from the upstream side toward the upstream standby position AP. An upstream standby position confirmation sensor S1 that confirms that the printed circuit board 4 has reached the upstream standby position AP is provided in the downstream portion. Further, a stopper 59 for positioning the printed circuit board 4 at the mounting position JP when the tip of the printed circuit board 4 comes into contact with the downstream portion of the mounting position JP is provided. The stopper 59 is provided with a mounting position confirmation sensor S2 for confirming that the printed circuit board 4 has come into contact with the stopper 59 and has reached the mounting position JP. Immediately downstream of the mounting position confirmation sensor S2, a mounting position return confirmation sensor S3 is provided for detecting that the printed circuit board 4 has left the downstream standby position BP and headed toward the mounting position JP. Further, a downstream standby position confirmation sensor S4 for confirming that the printed circuit board 4 has reached the downstream standby position BP is provided in the downstream portion of the downstream standby position BP. These sensors are, for example, optical sensors, and detect that light is blocked by passage of the printed circuit board 4 and the like, and transmit the information to the control device 20.

  The control device 20, the conveyor belt 30, the mounting position lifter device 34, the clamping device 40, the stopper 59, and the mounting position confirmation sensor S2 constitute a work positioning means and a new work positioning means. Further, the control device 20, the conveyor belt 30, the carry-in detection sensor SB, the upstream standby position confirmation sensor S1, and the upstream lifter device 36 constitute an upstream standby position carry-in means, and the control device 20, the conveyor belt 30, the downstream standby The position confirmation sensor S4 and the downstream lifter device 38 constitute downstream standby position carry-in means. Further, the control device 20, the conveyor belt 30, the mounting position return confirmation sensor S3, the mounting position lifter device 34, the clamp device 40, and the mounting position confirmation sensor S2 constitute a work position return means, and the control device 20, the conveyor belt 30 and the upstream The upstream standby position check sensor S1 and the upstream lifter device 36 constitute upstream standby position return means.

  In the present embodiment, the work positioning means, the upstream standby position carry-in means, the downstream standby position carry-in means, the work position return means, and the upstream standby position return means are configured as described above, but the present invention is not limited thereto. Instead, a known technical element can be added, changed, or deleted.

  A Y-direction beam 60 extending in the Y direction is provided above the substrate transfer device 6, and the Y-direction beam 60 is placed on an X-direction rail (not shown) and can move in the X direction. A moving table 12 is provided in the Y direction beam 60 so as to be movable in the Y direction. The moving table 12 holds a component transfer device 16 having a component mounting head 14 and a substrate recognition camera 18. The component transfer device 16 and the substrate recognition camera 18 have a Y-direction beam 60 moving in the X direction. Is configured to be movable in the X direction. The movement of the Y direction beam 60 in the X direction is guided by an X direction linear guide (not shown) and driven by an X axis servo motor (not shown) via a ball screw (not shown). The movement of the movable table 12 in the Y direction is guided by a Y direction linear guide (not shown) and driven by a Y axis servo motor (not shown) via a ball screw (not shown). These servo motors are controlled by the control device 20.

  As shown in FIG. 2, the component transfer device 16 as the predetermined working means is guided so that it can be moved up and down in the Z direction perpendicular to the X direction and the Y direction by the support base 62 attached to the movable table 12 and the support base 62. The component mounting head 14 is supported and driven up and down by a servo motor (not shown), and a suction nozzle 64 protruding downward from the component mounting head 14. The suction nozzle 64 is formed in a cylindrical shape, and holds and holds electronic components at the lower end. The mounting operation of the component transfer device 16 is controlled by the control device 20. Further, the component transfer device 16, the control device 20, and a signal (not shown) constitute a repair means.

  A component supply device 66 is arranged along with the substrate transfer device 6 at one end portion (lower portion in FIG. 1) of the mounting device 2 in the Y direction. These component supply devices 66 are constituted by a large number of cassette-type feeders 68 that can be attached and detached. A cassette type feeder holds a supply reel (not shown) wound with a long and narrow tape in which electronic components are sealed at a predetermined pitch. The tape is pulled out from the supply reel at a predetermined pitch, and the electronic components are released from the encapsulated state and sequentially fed into a component take-out portion (not shown).

  A component recognition camera (not shown) is provided between the substrate transport device 6 and the component supply device 66, and the electronic component sucked by the suction nozzle 64 is imaged by the component recognition camera, and the suction state is good.・ Defects and parts are checked for quality.

  The operation of the mounting apparatus of the first embodiment configured as described above will be described below. First, when the printed circuit board (first printed circuit board) 4 a is carried into the mounting device 2, it is detected by the carry-in detection sensor SB and the detection information is transmitted to the control device 20. The control device 20 drives the conveyor driving device of the substrate transport device 6 to transport the first printed circuit board 4a to the upstream standby position AP. At this time, if the previous printed circuit board 4 does not exist at the mounting position JP, the first printed circuit board 4a is further transported to the mounting position JP. When the first printed circuit board 4a is carried into the mounting position JP, the first printed circuit board 4a is positioned by confirming that the first printed circuit board 4a has hit the stopper 59 with the mounting position confirmation sensor S2. The The first printed circuit board 4 a is transferred from the conveyor belt 30 to the lifter device 34 as the lifting support piece 48 of the lifter device 34 rises. And it is clamped from both sides by the clamping device 52 in the raising position. At the same time, the lifting / lowering device 56 raises the substrate support base 54 on which a plurality of backup pins are erected on the upper surface to support the first printed circuit board 4a from below. At this time, the component transfer device 16 including the component mounting head 14 is retracted so as to be out of the field of view of the CCD camera 8 by moving the Y-direction beam 60 upstream or downstream. Then, the first printed circuit board 4a that is supported and fixed as described above is imaged by the CCD camera 8 so that the entire first printed circuit board 4a is within the field of view (first imaging step).

  Next, the component transfer device 16 is returned to the first printed circuit board 4a, the fiducial marks (usually two) on the first printed circuit board 4a are read by the circuit board recognition camera 18, and these fiducial marks are read. The electronic component supplied from the component supply device 66 is mounted on the basis of the position.

  Note that a new printed circuit board (second printed circuit board) 4b is carried into the upstream standby position AP before the mounting of the first printed circuit board 4a is completed. The second printed circuit board 4b is transferred from the conveyor belt 30 and held by the lifting support piece 48 of the lifter device 36.

  After mounting the first printed circuit board 4a, the component transfer device 16 is retracted in the same manner as described above, and the mounted first printed circuit board 4a is imaged by the CCD camera 8 in the same manner (second imaging process).

  Next, the imaged first printed circuit board 4a is transported to the downstream standby position BP to be on standby. The first printed circuit board 4a conveyed to the downstream standby position BP by the conveyor belt 30 is transferred from the conveyor belt 30 to the lifting support piece 48 and held by the lift of the lifting support piece 48 of the lifter device 38. At the same time, the second printed circuit board 4b at the upstream standby position AP is carried into the mounting position JP. At this time, the lifting support piece 48 of the lifter device 36 is lowered to place the second printed circuit board 4b on the conveyor belt 30 and conveyed to the mounting position JP by the conveyor belt 30.

  The second printed circuit board 4b is imaged before mounting, mounted, and imaged after mounting in the same manner as the first printed circuit board 4a. At the same time, image processing is performed on the first printed circuit board 4a by comparing image data captured after mounting (second imaging step) with image data captured before mounting (first imaging step). Thus, since the image processing of the first printed circuit board 4a is performed in parallel with the mounting process of the second printed circuit board 4b, the mounting and image processing can be completed in a short time as a whole. In addition, since image processing is performed by comparing image data captured after mounting (second imaging step) with image data captured before mounting (first imaging step), simplified image data is obtained quickly. Image processing can be performed.

  Next, the quality of the mounting is determined based on the image processed image data. The determination is performed, for example, by comparing the image data with the component type data of the electronic component to be mounted and the mounting coordinate data that determines the position where the electronic component is mounted on the printed board. Since the image data is simplified as described above, it can be easily determined based on the component type data and the mounting coordinate data.

  When it is determined that the first printed circuit board 4a is defective in mounting, the first printed circuit board 4a waits until the second printed circuit board 4b is completely mounted. Thereafter, the second printed circuit board 4b is returned from the mounting position JP to the upstream standby position AP, and at the same time, the first printed circuit board 4a is returned from the downstream standby position BP to the mounting position JP. Also in this case, the second printed board 4b is transferred from the lifter device 34 to the conveyor belt 30 and transferred by the conveyor belt 30 in the same manner as described above.

  The first printed circuit board 4a returned to the mounting position JP as described above is subjected to repair work such as notification to the operator, correction, or re-mounting. Then, the first printed circuit board 4a that has been repaired is transported to the downstream standby position BP, and at the same time, the second printed circuit board 4b is transported from the upstream standby position AP to the mounting position JP.

  Then, the first printed circuit board 4a is transported to the next process, and the second printed circuit board 4b performs imaging after mounting by the CCD camera 8 at the mounting position JP. At that time, a third printed circuit board (not shown) is carried into the upstream standby position AP. The imaged second printed circuit board 4b is transported to the downstream standby position BP, and at the same time, the third printed circuit board is transported from the upstream standby position AP to the mounting position and positioned. Thereafter, the same process is repeated.

  If it is determined by the above determination that the first printed circuit board 4a placed at the downstream standby position BP is well mounted, the first printed circuit board 4a is moved to the downstream side if there is a transfer request from the next process. The next process is sent out.

  Next, a second embodiment in which a predetermined working method on a printed circuit board according to the present invention is implemented in a mounting apparatus will be described with reference to the drawings. In the present embodiment, a buffer device for storing the printed circuit board 4 is provided at the downstream standby position BP of the substrate transport apparatus. A pair of unillustrated vertical guides opposed to each other in the conveyance direction are provided on both sides of the conveyance path of the printed circuit board 4 at the downstream standby position BP, and a frame member not illustrated is raised and lowered on each of the opposed vertical guides. It is mounted as possible.

  As shown in FIG. 10, two pulleys 80 are rotatably supported in two upper and lower stages at both inner ends of the frame member. Among these pulleys 80, a conveyor belt 82 is stretched horizontally in two upper and lower stages between the pulleys 80 facing in parallel with the conveying direction, and straddles two conveyor belts 82 facing in the direction perpendicular to the conveying direction. Thus, the printed circuit board 4 can be placed. Since these conveyor belts 82 are provided in two upper and lower stages, the printed circuit board 4 is placed in two upper and lower positions so that it can stand by. The pulley 80 is connected to a drive motor (not shown), and the drive of the drive motor is controlled by the control device 20 similar to that of the first embodiment. The frame member is configured to be moved up and down along the vertical guide by a cylinder device (not shown), and the cylinder device is communicated with a hydraulic pump (not shown) provided with an electromagnetic valve. This electromagnetic valve is controlled by the control device 20. The frame member, pulley 80 and conveyor belt 82 constitute a substrate standby shelf 84, and the pulley 80, conveyor belt 82 and drive motor constitute a loading / unloading device, and a vertical guide, cylinder device, hydraulic pump and solenoid valve. The lifting device is configured.

  The board standby shelf 84 is aligned with the end of the conveyor belt 30 that is continuous with the mounting position JP as the working position at the moving end where the upper and lower conveyor belts 82 are moved up and down, and the mounting position on the upstream side. The printed circuit board 4 can be delivered between the JP and the downstream standby position (substrate standby shelf) BP.

  The operation of the second embodiment configured as described above will be described below.

  First, the first printed circuit board 4a is transported to the mounting position JP, positioned in the same manner as in the first embodiment, and the mounting position lifter device 34 is operated as shown in FIG. The printed board 4a is placed on the lifting support piece 48 and clamped by a clamping device (not shown). In this state, the first printed circuit board 4a before mounting is imaged by the CCD camera 8 so that the whole is within the field of view (first imaging step).

  Next, electronic components are mounted on the first printed circuit board 4a by the component transfer device 16, and the second printed circuit board 4b is carried into the upstream standby position AP by the substrate transport device 6 as shown in FIG. The upstream lifter device 36 is raised to receive and hold the second printed circuit board 4b from the conveyor belt 30. The mounted first printed circuit board 4a is imaged by the CCD camera 8 in the same manner as described above (second imaging step).

  Next, as shown in FIG. 13, the clamp device (not shown) that clamps the first printed circuit board 4 a is unclamped, and the lifter device 34 is moved down to the conveyor belt 30 so that the first printed circuit board 4 a is moved. Is placed. At the same time, the lifter device 36 at the upstream standby position AP is lowered, and the second printed circuit board 4 b is placed on the conveyor belt 30.

  Next, the conveyor belt 30 is driven to convey the first printed circuit board 4a and the second printed circuit board 4b to the downstream side, respectively. As shown in FIG. 14, the first printed circuit board 4a is transported to the upper stage of the substrate standby shelf 84 at the downstream standby position BP, and the second printed circuit board 4b is transported to the mounting position JP.

  Next, as shown in FIG. 15, at the mounting position JP, the second printed circuit board 4b is raised by the mounting position lifter device 34 and clamped by the clamp device. At the same time, image processing of the first printed circuit board 4a is started. And about the 2nd printed circuit board 4b, the imaging and mounting before mounting are performed similarly to the 1st printed circuit board 4a.

  After image processing for the first printed circuit board 4a, whether the mounting is good or not is determined in the same manner as in the first embodiment. If it is determined that the mounting is good, as shown in FIG. 80 is driven, and the first printed circuit board 4 a is carried out downstream by the conveyor belt 82. The second printed circuit board 4b is imaged after mounting, and is transported to the board standby shelf 84 which is the downstream side standby position BP after unclamping.

  Even when it is determined that the first printed circuit board 4a is defective, as shown in FIG. 17, first, the second printed circuit board 4b performs mounting and imaging after mounting at the mounting position JP. In addition, the third printed circuit board 4c is carried into the upstream standby position AP before the completion of the mounting of the second printed circuit board 4b. Then, as shown in FIG. 18, the upper and lower substrate standby shelves 84 are raised together with the first printed circuit board 4a by the elevating device, and the lower substrate standby shelf 84 is aligned with the end of the mounting position JP. Then, as shown in FIG. 19, the second printed circuit board 4 </ b> B is unclamped and lowered by the mounting position lifter device 34 and placed on the conveyor belt 30.

  Next, as shown in FIG. 20, the second printed circuit board 4 b is conveyed to the lower substrate standby shelf 84 by the conveyor belt 30. Then, the substrate standby shelf 84 is lowered and the upper substrate standby shelf 84 is aligned with the downstream end of the mounting position JP as shown in FIG.

  Next, the pulley 80 of the upper substrate standby shelf 84 is driven, and the first printed circuit board 4a determined to be defective is returned to the mounting position JP as shown in FIG. The returned first printed circuit board 4a is similarly positioned and clamped, and work for repair (for example, notification to an operator, re-mounting, etc.) is performed. Further, as shown in FIG. 23, image processing and mounting quality determination of the second printed circuit board 4b are simultaneously performed. If it is determined that the second printed circuit board 4b is mounted properly, the substrate standby shelf 84 is raised as shown in FIGS. 24 and 25, and the lower substrate standby shelf 84 is continuously connected from the mounting position JP. To the next process on the downstream side.

  Next, the repaired first printed circuit board 4a is imaged in the same manner after the repair, and is transported to the board standby shelf 84 at the downstream standby position BP. Thereafter, the same process is repeated.

  As described above, when it is determined that the first printed board 4a placed on one of the upper and lower board standby shelves 84 is defective in mounting (working failure), the second printed circuit board 4b in the mounting position JP is removed. Since the first printed circuit board 4a loaded on the other board standby shelf 84 and returned to the mounting position JP can be returned to the mounting position JP, the second print that was at the mounting position JP can be transferred. Without returning the substrate 4b to the upstream standby position AP, it is possible to repair the first printed circuit board 4a that is determined to be defective in mounting, so that a continuous mounting operation can be quickly performed.

  Next, a third embodiment in which a predetermined working method on a printed circuit board according to the present invention is performed on a mounting line will be described below with reference to the drawings. As shown in FIG. 26, the mounting line of the present embodiment is provided with a mounting machine 102, an upstream substrate transfer device 104 provided on the upstream side of the mounting machine 102, and a downstream side of the mounting machine 102. And a downstream substrate transfer device 106. In the upstream substrate transfer apparatus 104, a conveyor 110 including a pair of guide rails and a pair of transfer belts is extended on a base 108 in the transfer direction (X direction). The upstream-side substrate transport device 104 transports and returns the printed circuit board 4 and waits the printed circuit board 4 on the upstream side of the mounting machine 102, and constitutes an upstream standby position AP. The mounting machine 102 conveys / returns the printed circuit board 4, mounts it, and images the printed circuit board 4 in the mounting machine, and constitutes a mounting position JP. The downstream board transport device 106 transports and returns the printed circuit board 4 and waits the printed circuit board 4 on the downstream side of the mounting machine 102, and constitutes a downstream standby position BP.

  As described above, the mounting machine 102 in the present embodiment does not have the upstream standby position AP and the downstream standby position BP in the mounting machine, and there is no configuration such as a mechanism associated therewith. It is different from the mounting machine in the embodiment. Since other configurations are the same, description thereof is omitted.

  The operation of the third embodiment configured as described above will be described below. In this embodiment, in the first embodiment, the work process performed at the upstream standby position AP in the mounting machine is performed in the upstream substrate transport apparatus 104, and in the first embodiment, the downstream standby position in the mounting machine. The work performed in the BP is different in that it is performed in the downstream side substrate transport apparatus 106, and the others are substantially the same, and thus detailed description thereof is omitted.

  In the mounting line as described above, the image processing operation of the first printed circuit board 4a previously mounted is performed in parallel with the new mounting operation to be mounted on the second printed circuit board 4b. When mounting is continuously performed, the mounting time and the image processing proceed in parallel, and the mounting and the image processing can be completed in a short time as a whole.

  In addition, the first printed circuit board 4a determined to be defective due to the determination is returned to the mounting position of the predetermined mounting machine 102 and, for example, the CCD camera 8 is examined again, the defective printed circuit board 4 is removed, or the like. The removed printed circuit board 4 can be repaired and returned at another location.

  Further, for example, when waiting at the downstream side substrate transport apparatus 106, the second printed circuit board 4a that is determined to be defective in mounting is returned to the mounting position of the predetermined mounting machine 102, and is in the second mounting position. Since the printed circuit board 4b is returned to, for example, the upstream-side substrate transport apparatus 104, the operation of returning the first printed circuit board 4a determined to be defective to the mounting position can be performed smoothly.

  In the mounting line of the present embodiment, the upstream substrate transfer device is disposed on the upstream side of the predetermined mounting machine, and the downstream transfer device is disposed on the downstream side. However, the present invention is not limited to this. For example, as shown in FIG. 27, the downstream side mounting machine 112 may be arranged on the downstream side of the predetermined mounting machine 102, and as shown in FIG. 28, the upstream side mounting machine 114 is arranged on the upstream side, and the downstream side. The downstream mounting machine 112 may be disposed on the side.

  In addition, two conveyor belts of the substrate transfer device are arranged side by side, and mounting positions are provided on the respective conveyor belts, so that mounting, imaging for determining mounting defects, and standby can be performed at each mounting position. Anyway. According to this, the mounting of the other can be performed in parallel with the image processing of the print after finishing the mounting of one and the imaging. Further, there is no need to move the printed circuit board to another place for standby.

1 is a schematic plan view of a mounting apparatus in which a predetermined operation method according to the present invention is implemented in a first embodiment. FIG. FIG. The figure which shows the predetermined position in the same mounting apparatus. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows a part of structure implemented in 2nd Embodiment. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the action | operation. The figure which shows the outline | summary implemented in 3rd Embodiment. The figure which shows the outline | summary implemented in other embodiment. The figure which shows the outline | summary implemented in other embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Predetermined work apparatus (mounting machine), 4 ... Printed circuit board, 4a ... 1st printed circuit board, 4b ... 2nd printed circuit board, 6 ... Board | substrate conveyance apparatus, 8 ... Camera means (CCD camera), 16 ... Predetermined work Means / repair means (part transfer device), 20... Predetermined work means / repair means / work positioning means / upstream standby position carry-in means / downstream standby position carry-in means / work position return means / upstream standby position return means ( Control device), 22 ... image processing means (image processing device), 24 ... determination means (determination device), 30 ... work positioning means, upstream standby position carry-in means, downstream standby position carry-in means (conveyor belt), 34 ... Work positioning means (mounting position lifter device), 36 ... upstream side standby position carry-in means (upstream side lifter device), 38 ... downstream side standby position carry-in means (downstream side lifter device), 40 ... work positioning means Clamping device), 59 ... work positioning means (stopper), 80 ... loading / unloading device (pulley), 82 ... loading / unloading device (conveyor belt), 84 ... substrate standby shelf, 102 ... mounting machine, 104 ... upstream substrate transfer device 106, downstream substrate transfer device, 112, downstream mounting machine, 114, upstream mounting machine, AP, upstream standby position, BP, downstream standby position, JP, working position (mounting position), S1, upstream Standby position carry-in means (upstream-side standby position confirmation sensor), S2 ... Work positioning means (mounting position confirmation sensor), S3 ... Work position return means (mounting position return confirmation sensor), S4 ... Downstream-side standby position carry-in means (downstream side) Standby position confirmation sensor), SB... Upstream side standby position carry-in means (carry-in detection sensor).

Claims (5)

  1. Predetermined work on a printed circuit board comprising: a substrate transporting device that transports the printed circuit board and positioning the printed circuit board at a predetermined position; and a predetermined working means that performs a predetermined work on the printed circuit board at a work position positioned by the substrate transporting device In the device
    Work positioning means for transporting and positioning the first printed circuit board before work from the upstream standby position provided on the upstream side of the work position to the work position;
    Predetermined working means for performing a predetermined work on the first printed circuit board positioned at the working position;
    Upstream standby position carry-in means for carrying in the second printed circuit board to the upstream standby position at the latest before the end of the predetermined operation of the first printed board;
    Camera means capable of accommodating at least a part of the first printed circuit board in a field of view;
    Imaging control means for causing the camera means to image the first printed circuit board before and after predetermined work;
    Downstream standby position transport means for transporting the first printed circuit board after a predetermined work to a downstream standby position downstream of the work position;
    New work positioning means for transporting and positioning the first printed circuit board after a predetermined operation to the downstream standby position and transporting the second printed circuit board from the upstream standby position to the work position;
    New predetermined working means for performing a predetermined work on the second printed circuit board;
    An image for image processing by comparing the image data of the first printed circuit board after the predetermined work taken by the camera means with the image data of the first printed board before the predetermined work taken by the camera means Image processing means, which is a processing means, which is performed in parallel with a predetermined work being performed on the second printed circuit board ,
    At the downstream standby position, a substrate standby shelf configured in two upper and lower stages,
    An elevating device that raises and lowers the substrate standby shelf to align the upper and lower substrate standby shelves at the end of the working position at the moving end;
    A loading / unloading apparatus that allows a printed board to be carried into the board standby shelf from the work position, allows a printed board to be returned from the board standby shelf to the working position, and allows the printed board to be carried out downstream from the board standby shelf. When,
    A control device that drives and controls the lifting device and the carry-in / out device;
    Predetermined working device to a printed board, characterized in that is provided.
  2. The control device according to claim 1 , wherein:
    When it is determined that the first printed circuit board placed on one of the upper and lower substrate standby shelves is defective, the lifting device is driven to align the other substrate standby shelf to the end of the working position. The second printed circuit board on which the predetermined operation has been performed by driving the carry-in / out device is carried into the other board standby shelf,
    After loading the second printed circuit board, the lifting device is driven to align one of the board standby shelves at the end of the working position, and the loading / unloading device is driven to determine the first work that is determined to be defective. A predetermined working device on a printed circuit board, wherein the printed circuit board is returned to a work position.
  3. 3. The determination unit according to claim 1 , wherein the determination unit is configured to determine whether the predetermined operation on the printed circuit board is acceptable based on the data processed by the image processing unit, and the predetermined operation is performed on the second printed circuit board. Determination means performed in parallel;
    A first printed circuit board that is a work defective by said determining means, said loading and unloading apparatus by driving, further and a working position returning means for positioning back into the working position from the downstream side standby position A predetermined working device on a printed circuit board.
  4. Te claim 3 odor, is determined by the pre-Symbol judging means and the work defective printed board further comprises a repair means to repair the first printed circuit board is returned to the working position by the carry-out device A predetermined working device on a printed circuit board.
  5. The work position according to any one of claims 1 to 4 , wherein the work position is a mounting position.
    The predetermined working means is a component transfer device having a component mounting head that sucks and mounts an electronic component on a printed circuit board,
    The predetermined work apparatus on a printed circuit board, wherein the predetermined work apparatus is a mounting apparatus having the component transfer apparatus.
JP2006278221A 2006-10-12 2006-10-12 Predetermined working method and predetermined working apparatus on printed circuit board Active JP4832244B2 (en)

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JP5370229B2 (en) * 2010-03-24 2013-12-18 パナソニック株式会社 Electronic component mounting apparatus and work method by electronic component mounting apparatus
JP6045376B2 (en) * 2013-02-06 2016-12-14 Juki株式会社 Substrate transfer device and substrate transfer method
JP2017028151A (en) * 2015-07-24 2017-02-02 ヤマハ発動機株式会社 Substrate work device

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JPH04324999A (en) * 1991-04-25 1992-11-13 Matsushita Electric Ind Co Ltd Mounting method of electronic component
JPH06265324A (en) * 1993-03-16 1994-09-20 Citizen Watch Co Ltd Electronic component mounting apparatus and inspecting method for electronic component mounting state
JP4386396B2 (en) * 2000-08-01 2009-12-16 ヤマハ発動機株式会社 Board transfer method and board transfer apparatus in component mounting system
JP4536280B2 (en) * 2001-03-12 2010-09-01 ヤマハ発動機株式会社 Component mounter, mounting inspection method
JP2004039819A (en) * 2002-07-02 2004-02-05 Fuji Mach Mfg Co Ltd Method, device, program, and production system for repairing part packaging substrate
JP2004200587A (en) * 2002-12-20 2004-07-15 Juki Corp Board conveyor apparatus
JP2007157817A (en) * 2005-12-01 2007-06-21 I-Pulse Co Ltd Mounting line, mounting method, and mounting apparatus

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