WO2020152766A1 - Dispositif de transport - Google Patents

Dispositif de transport Download PDF

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Publication number
WO2020152766A1
WO2020152766A1 PCT/JP2019/001769 JP2019001769W WO2020152766A1 WO 2020152766 A1 WO2020152766 A1 WO 2020152766A1 JP 2019001769 W JP2019001769 W JP 2019001769W WO 2020152766 A1 WO2020152766 A1 WO 2020152766A1
Authority
WO
WIPO (PCT)
Prior art keywords
detection sensor
guide rail
circuit board
electronic component
substrate
Prior art date
Application number
PCT/JP2019/001769
Other languages
English (en)
Japanese (ja)
Inventor
貴規 ▲高▼木
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2019/001769 priority Critical patent/WO2020152766A1/fr
Priority to JP2020567692A priority patent/JP7116195B2/ja
Publication of WO2020152766A1 publication Critical patent/WO2020152766A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a transfer device that includes a conveyor device that transfers a substrate and a support pin that supports a substrate that has been transferred to a predetermined position by the conveyor device from below.
  • some transfer devices include a conveyor device that transfers a substrate and a support pin that supports a substrate that has been transferred to a predetermined position by the conveyor device from below. Further, it is desired that the carrier device detects the presence or absence of a foreign substance as described in Patent Document 2 below.
  • An object of the present invention is to suitably detect the presence or absence of a foreign matter in a transfer device that includes a conveyor device that transfers a substrate and a support pin that supports a substrate that is transferred to a predetermined position by the conveyor device from below.
  • the present specification discloses a conveyor device that conveys a substrate, a support pin that is placed on a mounting table and that supports a substrate that is conveyed to a predetermined position by the conveyor device from below, A detection sensor for detecting the presence or absence of the support pin placed on the mounting table, wherein the detection sensor detects the presence or absence of foreign matter in a predetermined region of the mounting table on which the support pin is not mounted.
  • a carrier device is disclosed.
  • the presence or absence of foreign matter in a predetermined area of the mounting table on which the support pins are not mounted is detected by the detection sensor for detecting the presence or absence of the supporting pins mounted on the mounting table.
  • the presence/absence of foreign matter can be suitably detected in the transport device including the conveyor device that transports the substrate and the support pin that supports the substrate transported from the conveyor device to the predetermined position from below.
  • FIG. 4 is a sectional view taken along the line BB in FIG. 3.
  • FIG. 1 shows an electronic component mounting device 10.
  • the electronic component mounting apparatus 10 has one system base 12 and two mounting machines 16 arranged side by side on the system base 12.
  • the direction in which the mounting machines 16 are arranged is referred to as the X direction
  • the horizontal direction perpendicular to the direction is referred to as the Y direction
  • the vertical direction perpendicular to the direction is referred to as the Z direction.
  • Each mounting machine 16 mainly includes a mounting machine main body 20, a pair of substrate transfer/holding devices 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 24, a mounting head 26, a supply device 28, A control device (see FIG. 7) 30 is provided.
  • the mounting machine body 20 includes a frame 31 and a beam 32 mounted on the frame 31.
  • Each of the pair of substrate transport holding devices 22 has a conveyor device 50 and a substrate holding device 52, as shown in FIGS. 2 to 5.
  • FIG. 2 is a diagram showing the substrate transport holding device 22 from an obliquely upper perspective
  • FIG. 3 is a diagram showing the substrate transport holding device 22 from an upper perspective.
  • FIG. 4 is a diagram showing a perspective from the AA line of FIG. 3
  • FIG. 5 is a diagram showing a perspective from the BB line of FIG.
  • the conveyor device 50 has a pair of guide rails 60, 62 and a conveyor belt 66 provided on each guide rail 60, 62.
  • the pair of guide rails 60, 62 are arranged in parallel to each other, and each guide rail 60, 62 is supported on the upper surface of a support plate 72 via a pair of support legs 70.
  • the direction in which the guide rails 60 and 62 extend is called the X direction
  • the direction that is orthogonal to the X direction horizontally is called the Y direction
  • the direction orthogonal to both the X direction and the Y direction is called the Z direction.
  • two pulleys 74 and 76 are arranged on the side surfaces of the guide rails 60 and 62 with the Y direction as the axis center.
  • the two pulleys 74, 76 are arranged at both ends of each guide rail 60, 62.
  • the guide rail 60 and the guide rail 62 are arranged such that the surfaces on which the pulleys 74 and 76 are arranged face each other.
  • the conveyor belt 66 is wound around the pulleys 74 and 76 of the guide rails 60 and 62, and the conveyor belt 66 is rotated by driving an electromagnetic motor (see FIG. 7) 78.
  • the orbiting direction of the conveyor belt 66 is the clockwise direction in FIG.
  • the circuit board 80 faces from the side where the pulley 74 is arranged to the side where the pulley 76 is arranged. And is conveyed by the conveyor belt 66.
  • the conveyor device 50 has a width changing device (see FIG. 7) 81, and can change the distance between the guide rails 60 and 62.
  • the pair of support legs 70 that support the guide rails 62 are slidable in the Y direction. Then, the pair of support legs 70 is moved to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 7) 82.
  • the guide rails 62 supported by the pair of support legs 70 approach and separate from the guide rails 60 while being parallel to the guide rails 60.
  • the distance between the guide rail 60 and the guide rail 62 is changed. In this way, by changing the distance between the guide rails 60 and 62, it becomes possible to carry circuit boards 80 of various sizes.
  • a detection sensor 83 is arranged on the pair of support legs 70 of the guide rail 62.
  • the detection sensor 83 includes a light projecting portion 84 and a light receiving portion 85.
  • the light projecting portion 84 is arranged on one of the pair of support legs 70, and the light receiving portion 85 is connected to the pair of support legs 70. Is arranged on the other side of.
  • the light projecting portion 84 and the light receiving portion 85 are arranged so as to face each other. As a result, the light emitted from the light projecting unit 84 is received by the light receiving unit 85.
  • the substrate holding device 52 also includes a lifting table 86, a plurality of backup pins 88, a table lifting mechanism 90, and a clamp device 92.
  • the lifting table 86 has a generally rectangular shape, and is arranged below the guide rails 60 and 62 so as to extend between the pair of support legs 70 of each guide rail 60 and 62. Further, on the upper surface of the elevating table 86, for example, a plurality of backup pins 88 are arranged in 3 ⁇ 3 rows, that is, 3 rows in the X direction and 3 rows in the Y direction. It stands on the table 86.
  • the lifting table 86 is disposed on the upper surface of the support plate 72 via the table lifting mechanism 90, and the table lifting mechanism 90 drives the electromagnetic motor (see FIG. 7) 96 to lift the lifting table 86.
  • the clamp device 92 also has a pair of clamp bars 100 and a pair of clamp plates 102.
  • the clamp bar 100 has a generally plate shape, and the length dimension of the clamp bar 100 is longer than the length dimension of the elevating table 86 in the X direction.
  • Each of the pair of clamp bars 100 is fixed to the upper surfaces of the guide rails 60 and 62 so that the lifting table 86 is located between both ends of each clamp bar 100. That is, the clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so that the elevating table 86 extends below the clamp bar 100.
  • the clamp bar 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to extend above the conveyor belt 66 arranged on the guide rails 60 and 62.
  • the clamp plate 102 has a generally rectangular plate shape, and the length dimension of the clamp plate 102 in the longitudinal direction is substantially the same as the length dimension of the clamp bar 100.
  • the clamp plate 102 extends in the same direction as the clamp bar 100 below the clamp bar 100 that extends above the conveyor belt 66, and is vertically slidable by the guide rails 60 and 62 in an upright state. Is held. That is, the holder 108 is provided on the side surface of the guide rails 60 and 62 on the side where the conveyor belt 66 is provided. Then, with the side surfaces of the guide rails 60 and 62 and the side surface of the clamp plate 102 facing each other, the clamp plate 102 is held by the holder 108 so as to be slidable in the vertical direction below the clamp bar 100.
  • the upper end of the clamp plate 102 is located above the upper surface of the conveyor belt 66, as shown in FIG. It is located below, and the lower end of the clamp plate 102 is located above the upper surface of the lifting table 86 in a state where it is not lifted.
  • the circuit board 80 transferred by the conveyor device 50 is clamped by the board holding device 52.
  • the circuit board 80 is carried into the electronic component mounting apparatus 10 and conveyed by the conveyor device 50 to a predetermined work position.
  • both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50 are vertically aligned with the clamp bar 100 as shown in FIG. It is located between the clamp plate 102.
  • the lifting/lowering table 86 is lifted by the operation of the table lifting/lowering mechanism 90.
  • the lower end of the clamp plate 102 contacts the upper surface of the elevating table 86, and the clamp plate 102 also rises as the elevating table 86 rises.
  • the upper end of the clamp plate 102 contacts the lower surface of the circuit board 80 supported by the conveyor belt 66.
  • the height dimension of the backup pin 88 mounted on the upper surface of the lifting table 86 is the same as the length dimension of the clamp plate 102 in the vertical direction.
  • the upper end of the backup pin 88 also contacts the lower surface of the circuit board 80. Then, as the lifting table 86 rises, the circuit board 80 supported by the conveyor belt 66 is lifted from the conveyor belt 66 by the clamp plate 102 and the backup pin 88 and rises. At this time, as shown in FIG. 6, the table lifting mechanism 90 operates until the upper surface of the circuit board 80 contacts the lower surface of the clamp bar 100, and the circuit board 80 is lifted by the clamp plate 102 and the backup pin 88. To be As a result, the circuit board 80 is sandwiched by the clamp bar 100 and the clamp plate 102 at both edges while being supported by the backup pin 88 from below in the central portion.
  • the moving device 24 is an XY robot type moving device.
  • the moving device 24 includes an electromagnetic motor (see FIG. 7) 112 that slides the slider 110 in the X direction and an electromagnetic motor (see FIG. 7) 114 that slides the slider 110 in the Y direction.
  • the mounting head 26 is attached to the slider 110, and the mounting head 26 is moved to an arbitrary position on the frame 31 by the operation of the two electromagnetic motors 112 and 114.
  • the mounting head 26 mounts electronic components on the circuit board 80.
  • the mounting head 26 has a suction nozzle 120 provided on the lower end surface.
  • the suction nozzle 120 communicates with a positive/negative pressure supply device (see FIG. 7) 122 via negative pressure air and positive pressure air passages.
  • the suction nozzle 120 sucks and holds an electronic component by negative pressure, and separates the held electronic component by positive pressure.
  • the mounting head 26 has a nozzle lifting device (see FIG. 7) 124 for lifting the suction nozzle 120.
  • the mounting head 26 changes the vertical position of the held electronic component by the nozzle lifting device 124.
  • the supply device 28 is a feeder-type supply device, and is arranged at the front end of the frame 31.
  • the supply device 28 has a tape feeder 130.
  • the tape feeder 130 accommodates the taped parts in a wound state.
  • the tape component is a taped electronic component.
  • the tape feeder 130 feeds the tape-formed component by the feeding device (see FIG. 7) 132.
  • the feeder-type supply device 28 supplies the electronic component at the supply position by feeding the tape-formed component.
  • the control device 30 has a controller 140 and a plurality of drive circuits 142, as shown in FIG. 7.
  • the plurality of drive circuits 142 are connected to the electromagnetic motors 78, 82, 96, 112, 114, the positive/negative pressure supply device 122, the nozzle lifting device 124, and the delivery device 132.
  • the controller 140 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 142. As a result, the operation of the substrate transport holding device 22, the moving device 24, etc. is controlled by the controller. Further, the controller 140 is connected to the detection sensor 83 of the substrate transport holding device 22. Therefore, the detection result of the detection sensor 83 is input to the controller 140.
  • the electronic component mounting apparatus 10 is capable of mounting the circuit board 80 held by the board transfer and holding apparatus 22 by the mounting head 26.
  • the conveyor device 50 conveys the circuit board 80 to the working position, and the board holding device 52 clamps the circuit board 80 at the position.
  • the tape feeder 130 sends out the tape-formed component and supplies the electronic component at the supply position according to a command from the controller 140.
  • the mounting head 26 moves to a position above the electronic component supply position in response to a command from the controller 140, and the suction nozzle 120 sucks and holds the electronic component. Subsequently, the mounting head 26 moves to the upper side of the circuit board 80 according to a command from the controller 140, and mounts the held electronic component on the circuit board 80.
  • the circuit board 80 conveyed to the work position is clamped by the board holding device 52, and the mounting work of the electronic component is performed on the circuit board 80 in the clamped state. It In the circuit board 80 clamped by the board holding device 52, the circuit board 80 is sandwiched and fixed by the clamp bar 100 and the clamp plate 102, so that proper electronic component mounting work is ensured. Further, in the state where the circuit board 80 is clamped by the board holding device 52, the central portion of the circuit board 80 is supported by the backup pin 88. As a result, the mounting work of the electronic component is ensured while the circuit board 80 is prevented from bending.
  • an electronic component may fall onto the substrate transfer/holding device 22.
  • the dropped electronic component may cause the backup pin 88 to be properly disposed on the upper surface of the lifting table 86.
  • the circuit board 80 cannot be clamped properly.
  • the electronic component 150 that has dropped onto the substrate transport holding device 22 may be located below the guide rail 62 on the upper surface of the elevating table 86. In such a case, when the lifting table 86 is raised, as shown in FIG. 8, the electronic component 150 is sandwiched between the upper surface of the lifting table 86 and the lower end of the guide rail 62, so that the lifting table 86 is raised. Be hindered.
  • the electronic component 150 that has dropped onto the substrate transport holding device 22 may be located below the clamp plate 102 on the upper surface of the lifting table 86.
  • the elevating table 86 rises, the electronic component 150 is sandwiched between the upper surface of the elevating table 86 and the lower end of the clamp plate 102 as shown in FIG. Is higher than the upper end position of the backup pin 88 by a distance corresponding to the height dimension of the electronic component 150. Therefore, the circuit board 80 is fixed by being clamped by the clamp bar 100 and the clamp plate 102 as the lift table 86 is raised, but is not supported from below by the backup pin 88.
  • the detection sensor 83 detects the presence or absence of the electronic component 150 that has dropped onto the lift table 86.
  • the detection sensor 83 is provided to detect the presence/absence of the backup pin 88 placed at a predetermined position on the elevating table 86.
  • the light projecting portion 84 and the light receiving portion 85 that form the detection sensor 83 are arranged on a pair of support legs 70 that support the guide rail 62. Further, the pair of support legs 70 that support the guide rails 62 are slidable in the Y direction in order to change the distance between the guide rails 60 and 62. In this way, the pair of support legs 70 supporting the guide rails 62 are slidable in the Y direction, and the distance between the guide rails 60 and 62 is changed, so that circuit boards of various sizes can be obtained. Can be mounted.
  • the guide rail 62 is slid toward the guide rail 60.
  • the distance between the guide rail 60 and the guide rail 62 is shortened.
  • the backup pins 88 placed on the elevating table 86 during the work of mounting a large-sized circuit board are removed from the elevating table 86 before the guide rail 62 is slid.
  • the operation of removing the backup pin 88 may be forgotten.
  • the clamp plate 102, the guide rail 62, etc. come into contact with the backup pin 88 remaining on the lifting table 86, and the clamp plate 102,
  • the guide rail 62, the backup pin 88, etc. may be damaged.
  • the detection sensor 83 is provided on the support leg 70 that supports the guide rail 62, and the detection sensor 83 detects when the guide rail 62 slides. That is, the light is emitted from the light projecting unit 84, and it is detected whether or not the light receiving unit 85 receives the light. Then, when light is detected by the light receiving unit 85 when the guide rail 62 slides, the guide rail 62 continuously slides. On the other hand, when the detection of light by the light receiving unit 85 is stopped during the sliding of the guide rail 62, the sliding of the guide rail 62 stops at that timing. As a result, when the guide rail 62 slides, contact of the clamp plate 102, the guide rail 62 and the like with the backup pin 88 remaining on the lifting table 86 is prevented. Further, when the guide rail 62 is slid, an error notification is given at the timing when the detection of light by the light receiving unit 85 is interrupted. As a result, the operator can be encouraged to remove the backup pin 88 from the lift table 86.
  • the pair of support legs 70 that support the guide rails 62 are provided with the detection sensor 83 for detecting the presence or absence of the backup pin 88 remaining on the lift table 86. Therefore, the detection sensor 83 is used to detect the presence/absence of the electronic component 150 that has dropped onto the lifting table 86. Specifically, for example, at the timing after the circuit board is unloaded from the electronic component mounting apparatus 10 at the time of setup change, or before the circuit board is loaded into the electronic component mounting apparatus 10, the lifting table 86 is moved. From the top all backup pins 88 are removed. That is, in the electronic component mounting apparatus 10, all the backup pins 88 are removed from the upper and lower table 86 at the timing when the circuit board 80 is not transported.
  • the detection sensor 83 detects whether the electronic component 150 is dropped on the lift table 86. Absent.
  • the conveyor device 50 conveys the circuit board 80 and arranges the backup pins 88, and The circuit board 80 is clamped by the substrate holding device 52.
  • the detection of light by the light receiving unit 85 is stopped when the guide rail 62 is slid, the electronic component 150 that has fallen on the elevating table 86 is detected and an error is notified.
  • the operator can recognize the electronic component 150 that has dropped onto the lifting table 86 and remove the electronic component 150.
  • the guide rail 62 slides toward the guide rail 60 by operating the button for restarting the detection of the electronic component 150 when the guide rail 62 slides.
  • the detection of the electronic component 150 by the detection sensor 83 is restarted.
  • the conveyor device 50 conveys the circuit board 80 and the circuit by the board holding device 52.
  • the substrate 80 is clamped.
  • the electronic component 150 that has dropped onto the lifting table 86 is a factor, and it is possible to eliminate the arrangement failure of the backup pin 88 and the situation where the circuit board 80 cannot be clamped properly.
  • the elevating table 86 from which the backup pin 88 has been removed when the light detection by the light receiving unit 85 is stopped, not only the electronic components 150 dropped on the elevating table 86, but also misplaced jigs, large dust, etc.
  • the detection sensor 83 detects the electronic components 150 dropped on the lifting table 86, the misplaced jig, and large foreign substances such as dust.
  • the detection sensor 83 detects foreign matter in the entire area of the upper surface of the elevating table 86 where the guide rail 62 can slide. It takes a long time. Therefore, when it is desired to shorten the detection time of the foreign matter by the detection sensor 83, for example, when the setup change time is short, only the area in which the foreign matter such as the electronic component 150 may be caught when the substrate holding device 52 clamps is determined. Is detected by the detection sensor 83.
  • the electronic component 150 that has fallen onto the lifting table 86 when the lifting table 86 is raised is the electronic component 150 that has fallen onto the guide rail 62 or the clamp plate 102. It is sandwiched by the lifting table 86. Therefore, unless foreign matter such as the electronic component 150 has fallen below the guide rail 62 and the clamp plate 102, the clamp by the substrate holding device 52 is secured. Therefore, of the entire area of the lifting table 86 on which the guide rail 62 can slide, only the area below the guide rail 62 and the clamp plate 102 is detected by the detection sensor 83. As a result, the detection time can be shortened and the clamping by the substrate holding device 52 can be secured.
  • the backup pins 88 are naturally not placed in the areas below the guide rails 62 and the clamp plate 102. It is not necessary to remove the backup pin 88 from above. Therefore, not only the detection time by the detection sensor 83 can be shortened, but also the time required for the preparation for detecting the foreign matter by the detection sensor 83 can be shortened. That is, the detection sensor 83 detects only a region where the backup pins 88 of the lift table 86 are not placed and which interferes with the clamping of the circuit board 80 by the substrate holding device 52 as the predetermined region. By the work for a short time, the clamp by the substrate holding device 52 can be secured.
  • the substrate transfer/holding device 22 is an example of the transfer device.
  • the conveyor device 50 is an example of a conveyor device.
  • the circuit board 80 is an example of a board.
  • the detection sensor 83 is an example of a detection sensor.
  • the lifting table 86 is an example of a mounting table.
  • the backup pin 88 is an example of a support pin.
  • the present invention is not limited to the above-described embodiments, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art.
  • the area where the backup pin 88 is removed is set as a predetermined area and the detection sensor 83 is used.
  • the detection sensor 83 is used.
  • the area including the position where the backup pin 88 is placed is set as a predetermined area. Detection of foreign matter may be performed by.
  • the detection sensor 83 may detect the foreign matter not only in the area where the backup pin 88 is not placed, but also in the position where the backup pin 88 is placed.
  • a pair of support legs 70 supporting the guide rail 62 are provided with a pair of support legs extending toward the guide rail 60.
  • the arm 160 of FIG. Then, the light projecting portion 84 is disposed at one tip portion of the pair of arms 160, and the light receiving portion 85 is disposed at the other tip portion of the pair of arms 160.
  • the detection sensor 83 detects a foreign substance while the backup pin 88 is placed on the lift table 86, information about the placement position of the backup pin 88 is stored in the control device 30 in advance. Has been done. Then, even if the detection sensor 83 detects a foreign substance at the mounting position of the backup pin 88, that is, even if the backup pin 88 is detected as a foreign substance, the detection result is canceled.
  • the error is notified only when the foreign matter is detected at a position other than the mounting position of the backup pin 88 according to the information stored in the control device 30.
  • the detection result is canceled, so no error notification is given.
  • the electronic component 150 by the detection sensor 83 is eventually set as a predetermined region in which the backup pin 88 is not placed. It is possible to detect foreign matter such as.
  • the presence or absence of foreign matter is detected by the detection sensor 83 including the light projecting unit 84 and the light receiving unit 85, but the presence or absence of foreign matter may be detected by other types of detection sensors. .. Specifically, for example, a height sensor or the like may be used to detect a foreign matter by detecting a portion protruding from the upper surface of the lifting table 86.
  • the detection sensor 83 is provided on the pair of support legs 70, but it is provided on the guide rail on the moving side or another structure that moves together with the guide rail on the moving side. May be.
  • the accurate position confirmation and removal of the electronic components falling on the lifting table 86 detected by the detection sensor 83 may be performed automatically instead of operator management.
  • an accurate position may be confirmed by an image pickup device (for example, a mark camera) that moves together with the mounting head 26, and an electronic component may be removed by a component holder (for example, a suction nozzle) included in the mounting head 26.
  • the light used by the detection sensor 83 is preferably parallel light, and for example, laser or laser light may be used.
  • Substrate transfer holding device (transfer device) 50: Conveyor device 80: Circuit board (board) 83: Detection sensor 86: Lifting table (mounting table) 88: Backup pin (support pin)

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Ce dispositif de transport comporte un dispositif de transport pour transporter un substrat ; des broches de support qui sont placées sur une table de placement et supportent, par le dessous, le substrat transporté jusqu'à une position prédéterminée par le dispositif de transport ; et un capteur de détection qui détecte la présence/absence des broches de support placées sur la table de placement, le capteur de détection détectant si des matières étrangères sont présentes dans une région prédéterminée de la table de placement sur laquelle les broches de support ne sont pas placées.
PCT/JP2019/001769 2019-01-22 2019-01-22 Dispositif de transport WO2020152766A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/001769 WO2020152766A1 (fr) 2019-01-22 2019-01-22 Dispositif de transport
JP2020567692A JP7116195B2 (ja) 2019-01-22 2019-01-22 搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/001769 WO2020152766A1 (fr) 2019-01-22 2019-01-22 Dispositif de transport

Publications (1)

Publication Number Publication Date
WO2020152766A1 true WO2020152766A1 (fr) 2020-07-30

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Application Number Title Priority Date Filing Date
PCT/JP2019/001769 WO2020152766A1 (fr) 2019-01-22 2019-01-22 Dispositif de transport

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JP (1) JP7116195B2 (fr)
WO (1) WO2020152766A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7418142B2 (ja) 2019-09-03 2024-01-19 株式会社Fuji 対基板作業機、および異物検出方法
WO2024134748A1 (fr) * 2022-12-20 2024-06-27 ヤマハ発動機株式会社 Dispositif de transport de substrat, dispositif de montage de composant et procédé de transport de substrat

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235312A (ja) * 2007-03-16 2008-10-02 Hitachi High-Tech Instruments Co Ltd プリント基板支持装置
JP2015228452A (ja) * 2014-06-02 2015-12-17 ヤマハ発動機株式会社 検出装置、検出方法、基板搬送装置、基板処理装置
JP2016146454A (ja) * 2015-02-02 2016-08-12 Juki株式会社 電子部品実装装置、及び基板支持部材の並べ替え方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235312A (ja) * 2007-03-16 2008-10-02 Hitachi High-Tech Instruments Co Ltd プリント基板支持装置
JP2015228452A (ja) * 2014-06-02 2015-12-17 ヤマハ発動機株式会社 検出装置、検出方法、基板搬送装置、基板処理装置
JP2016146454A (ja) * 2015-02-02 2016-08-12 Juki株式会社 電子部品実装装置、及び基板支持部材の並べ替え方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7418142B2 (ja) 2019-09-03 2024-01-19 株式会社Fuji 対基板作業機、および異物検出方法
WO2024134748A1 (fr) * 2022-12-20 2024-06-27 ヤマハ発動機株式会社 Dispositif de transport de substrat, dispositif de montage de composant et procédé de transport de substrat

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JPWO2020152766A1 (ja) 2021-09-09

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