JPH0157518B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method and apparatus for automatically mounting flat package type electronic components onto a component support such as a printed circuit board.
This relates to improving mounting position accuracy.

Conventional technology As a method for mounting flat package type electronic components on a component support such as a printed circuit board, there are conventional methods.
A method such as that described in Japanese Patent Application Laid-Open No. 59-92163 is known. In this method, the electronic component is transported by a transport/mounting device and placed at a predetermined position on the printed circuit board, and a pressing device is used to push the main body of the electronic component or the lead terminal protruding from its side toward the printed circuit board. Soldering is performed using a heating device such as a laser while the lead terminals are brought into close contact with the printed circuit board, and the electrical performance of the electronic components is not impaired, and the electronic components can be mounted efficiently.

Problems to be Solved by the Invention However, the present applicant has discovered that when electronic components are mounted on a printed circuit board as described above, the conveyance/mounting device that places the electronic components on the printed circuit board separates from the electronic components. It has been discovered that when the electronic component is pressed or when the pressing device comes into contact with the electronic component, the electronic component may move slightly and misalign, causing a problem in which the accuracy of the mounting position is reduced.

If soldering is performed while the electronic components are held in the transport/mounting device, it is possible to avoid a drop in mounting position accuracy. This is not desirable because the device cannot be made to perform the operation to receive the next electronic component, reducing the efficiency of the mounting work, and the transporting and mounting equipment is contaminated by flux splashes and gas generated during soldering. do not have.

Means for Solving the Problems The present invention has been made based on the discovery of such problems and in order to solve them. A protruding flat package type electronic component is transported by a transport/mounting device, placed on a fixed position on a component support such as a printed circuit board, and the main body or lead terminal of the electronic component is pressed onto the component support by a pressing device. In an automatic mounting method in which lead terminals are brought into close contact with the component support by pushing them to the component support body and then heated and soldered by a heating device, after the electronic component is placed by the transport/mounting device, the electronic component is moved from the electronic component to the transport/mounting device. Soldering of electronic components in which the pressing device is used to push the electronic component body or lead terminal toward the component supporter before the electronic components are separated, and the electronic component is pressed against the component supporter by the pressing device after the transport/mounting device is separated. It was designed to do this.

Further, the second invention provides an automatic mounting device for flat package type electronic components that can suitably implement the method according to the first invention, and which positions a component support such as a printed circuit board at a predetermined position. A component support support device for supporting a component support body, and a transportation system for transporting a flat package type electronic component with a plurality of lead terminals protruding from the sides of the electronic component body and placing it at a predetermined position on the component support body. A mounting device, a pressing device that pushes the main body or lead terminal of the mounted electronic component toward the component support to bring the lead terminal into close contact with the component support, and a laser head that solders the lead terminal to the component support. In an automatic mounting device including a press device, the pressing device is used to press the main body or lead terminal of the electronic component while the electronic component is placed on the component support and not yet separated from the electronic component. The laser head remains in the retracted position until the electronic component is placed on the component support and separated by a conveying/mounting device, and then moved to the normal position to perform soldering.

Effects of the First Invention According to the method described above, when the pressing device is brought into contact with the electronic component main body or the lead terminal, the transportation/mounting device holds the electronic component, - When the mounting device separates from the electronic component, the pressing device holds the electronic component, so the electronic component does not move as the two devices come into contact and separate, and the electronic component remains at a fixed position on the component support. The soldering device can be placed with high accuracy and soldered using the heating device.

In addition, while soldering is being carried out, the transport/mounting device is operated to transport the electronic components to be mounted next.
Since positioning etc. can be performed, cycle time is shortened and work efficiency is improved.

Effects of the second invention Furthermore, according to the apparatus of the second invention, the method of the first invention can be carried out satisfactorily, and the laser head is configured such that the conveying/mounting device places the electronic component on the component support. The laser head remains in the retracted position until it is separated, and after separation it moves to the normal position to perform soldering, so there is no interference between the laser head and the transport/mounting device. In addition to facilitating the installation of both, the laser head can be moved to an optimal position and operated, resulting in the effect of improving soldering reliability.

Embodiments Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

1 and 2 are diagrams showing a flat package type automatic mounting device for electronic components which is an embodiment of the second invention, and in the figures, 10 is a base.
An index table 12 is located in the center of the base 10.
is rotatably mounted, and a plurality of pallets 14 are placed on this index table 12 at equal intervals. The inside of each pallet 14 is partitioned into a large number of parts, and each partition accommodates one flat package type electronic component. A pallet 14 containing electronic components is stopped at an electronic component supply position defined approximately in the center of the base 10. This electronic component is connected to the main body A as shown in Figure 3.
Lead terminals B protrude in all directions from the side surface of the board, and solder is applied in advance to the portion of each lead terminal B that is fixed to the printed circuit board.

Above the index table 12 is a base 1.
A printed circuit board transfer device 16 is installed across 0, and a support device 18 for positioning and supporting the printed circuit board is provided in the middle. Note that these conveyance device 16 and support device 18 are similar to the printed circuit board conveyance and positioning device disclosed in Japanese Patent Application No. 113553/1989 filed by the present applicant, and are not described in detail in the specification of the same application. As such, this embodiment will only be briefly illustrated and described.

The printed circuit board transfer device 16 includes a pair of side frames 20 extending across the base 10 and one side frame 20.
A shaft 24 is rotatably supported by one longitudinal end of the other side frame 20 and the auxiliary side frame 22. A chain 32 is wound around a sprocket 26 attached to the protruding end of the shaft 24 from the auxiliary side frame 22 and a sprocket 30 fixed to the output shaft of the motor 28.
By rotating the shaft 24 by 8,
Two pulleys 34 attached to the shaft 24 and two pulleys 36 attached to the other end of the side frame 20
Two endless belts (not shown) wound around the belt are driven, and the printed circuit board supported by these endless belts is conveyed.

The support device 18 is provided at a position adjacent to the pallet 14 stopped at the electronic component supply position, and supports a lifter that is guided by a pair of guide rods 38 on the lower side of the side frame 20 and raised and lowered by a lift cylinder 40. It is equipped with 42. A support jig is attached to the lifter 42, and the printed circuit board transported by the transport device 16 is stopped directly above the lifter 42 and raised together with the lifter 42. The support jig engages with and lifts the printed circuit board, and positioning pins (not shown) fixed downward to the side frame 20 fit into holes provided in the printed circuit board to position the printed circuit board.

The side frame 20 and the auxiliary side frames 22 and 23 are also
Three screw shafts 44 are supported rotatably but immovably in the axial direction. A sprocket 46 is fixed to each of the protruding ends of the screw shafts 44 from the auxiliary side frame 22 and the side frame 20.
A chain (not shown) is wound around each of the two sprockets 46, and by turning a handle 48 attached to one screw shaft 44, the three screw shafts 44 are rotated simultaneously. One side frame 20 moves to form a pair of side frames 20.
The width between them varies, so that printed circuit boards of different sizes can be transported.

As shown in FIG. 2, five pillars 50 are erected around the base 10, and these pillars 5
A pair of frames 52 extending in the Y-axis direction perpendicular to the conveyance direction of the printed circuit board are fixed to the upper end of 0, and another pair of frames 54 are connected to the frames 52.
are provided, forming a rectangular frame as a whole. The pair of frames 52 have a rail-shaped guide part 56 and a groove-shaped guide part 58 extending in the longitudinal direction, respectively.
The guide parts 56 and 58 are located on one side of the printed circuit board conveying device 16, that is, the pallet 14 is stopped at the electronic component supply position when electronic components are mounted on the printed circuit board. On the side where electronic components are located, there is a transport/mounting device 60 that picks up electronic components from the pallet 14, transports them to the printed circuit board, and places them thereon, and on the other side, there is a transport/mounting device 60 that takes out electronic components from the pallet 14, transports them to the printed circuit board, and places them on the printed circuit board. A pressing/heating device 62 is installed, which includes a pressing device for pressing the electronic component onto the printed circuit board and a heating device for soldering the lead terminals of the electronic component to the printed circuit board.

The conveyance/mounting device 60 includes guide portions 56 and 5 of the frame 52.
8 and moves in the Y-axis direction. As shown in FIG. 1, in the center of the slide 64 in the vertical direction, there is a screw shaft 66 disposed in the Y-axis direction and supported rotatably and immovably in the axial direction by the frames 52 and 54. A nut 67 to be screwed is fixed, and a belt is attached to a pulley 68 fixed to the protruding end of the screw shaft 66 from the frame 54 and a pulley 72 fixed to the output shaft of a servo motor 70 disposed below the pulley 68. 74 is wound around, and the screw shaft 66 is rotated by the servo motor 70, so that the slide 64 is moved.

A slide 77 of an electronic component mounting unit 76 is attached to a portion of the slide 64 on the side facing the pressing/heating device 62 so as to be movable in the X-axis direction perpendicular to the Y-axis direction. Slide 77 is
As shown in FIG. 2, a threaded shaft 78 is axially immovably and rotatably attached to the slide 64.
The screw shaft 78 is rotated by a servo motor 86 via a pulley 80, a belt 82, and a pulley 84, thereby moving in the X-axis direction. Therefore, the unit 76 can be moved in any direction within the horizontal plane by the combination of the movement of the slide 77 in the X-axis direction and the movement of the slide 64 in the Y-axis direction. A case 87 is fixed to the slide 77 and covers the main part of the unit 76.

Further, the pressing/heating device 62 includes a slide 92 that is guided by the guide portions 56 and 58 and moved in the Y-axis direction by a screw shaft 88, a servo motor 90, etc., similarly to the conveyance/mounting device 60. Inside the slide 92, as shown in FIG.
Another slide 93 is mounted so as to be movable in the X-axis direction. A screw shaft (not shown) is screwed into the slide 93, and when this screw shaft is rotated by a servo motor 96, the slide 93 is moved in the X-axis direction. By the combination of the movement of the slide 93 in the X-axis direction and the movement of the slide 92 in the Y-axis direction, the pressing device and heating device attached to the lower side of the slide 93 can be moved to any position in the horizontal plane. is being used.

Below, the electronic component placement unit 76 and the pressing/
The heating device 62 will be explained in detail.

FIG. 4 is a diagram showing the electronic component mounting unit 76 taken out, and the slide 77 is provided with a slide 104 that is moved in the vertical direction by the air cylinder 102 shown in FIG.
A suction head holder 106 is fixed to this slide 104. The suction head holder 106 has a holder portion 108 extending horizontally from its lower end.
A suction head 110 is rotatably supported by the holder portion 108 around a vertical axis.

A housing 112 of the suction head 110 has a substantially cylindrical shape, and a flange portion 114 is formed on the outer peripheral surface of one end in the axial direction. A cylindrical sleeve 116 is fixed to the holder part 108, and the suction head 110 is attached to the sleeve 116.
16, and supports the flange portion 114 from below.

Further, the outer peripheral portion of the flange portion 114 is connected to the gear 1.
18, and is engaged with a pinion 122 attached to the motor shaft of a servo motor 120 fixed to the holder part 108, and the suction head 110 is moved to the housing 1 by the servo motor 120.
It is designed to be rotated around 12 axes.

Inside the housing 112, two transparent glass plates 124 and 126 with a temporary reflective coating are fixed in parallel and horizontally with a certain distance apart. An airtight space 128 is formed. An adsorption tube 130 is fixed to the lower glass plate 124. The suction tube 130 includes an outer tube 132 and an inner tube 134 slidably fitted inside the outer tube 132. While the outer tube 132 is fixed to the glass plate 124, the inner tube 134 is fitted inside the outer tube 132. It is maintained in a state where it protrudes a certain length from the outer cylinder 132 by an attached compression coil spring. The periphery of this suction tube 130 can be seen through the glass plates 124 and 126 from above.

Furthermore, a connection passage 144 is formed in the side wall of the housing 112, passing through it in the radial direction and opening to the outer peripheral surface of the housing 112. On the other hand, an annular groove 14 is formed in a portion of the inner peripheral surface of the sleeve 116 corresponding to the opening of the connection passage 144.
6 is formed, and a connection port 148 is formed in a state that communicates this annular groove 146 with the external space. A hose 150 from a vacuum source such as a vacuum pump (not shown) is connected to this connection port 148. That is, the vacuum source is connected to the space 128 via the hose 150, the connection port 148, the annular groove 146, and the connection passage 144, regardless of the rotational position of the suction head 110 with respect to the holder part 108. When the space 128 is connected to the vacuum source, air is sucked from the suction tube 130 through the space 128, and the electronic components are suctioned to the tip of the suction tube 130. be.

An arm 154 fixed to the slide 77 is placed above the suction head 110 as described above.
A television camera 156 is provided coaxially with the suction head 110, and the television camera 156 obtains various information for accurately positioning the electronic component at a predetermined mounting position on the printed circuit board. It looks like it's going to be blown away. In other words, the suction state of the electronic components suctioned by the suction tube 130,
Image information necessary for positioning the electronic component, such as the position of the printed pattern on the printed circuit board on which the electronic component is to be mounted, can be obtained.

On the other hand, the slide 93 of the pressing/heating device 62
As shown in FIGS. 5, 6, and 8, a container-shaped housing 162 with an opening 160 at one end is located below the servo motor 163 shown in FIG.
The housing 162 is fixed to the lower end of a shaft 164 which is rotated about a vertical axis by the housing 162, and a pressing device 166 and a heating device 168 are attached to the housing 162.

The pressing device 166 is attached to the lower portion of the opening 160 of the housing 162, as shown in FIGS. 6 and 8. The front end side of the housing 162, that is, the center portion of the side wall on the side where the opening 160 is formed, is extended forward to form the support portion 1.
As shown in FIG. 6, two guide rods 172 are fitted in the supporting portion 170 so as to be slidable in the vertical direction. A support 176 to which a pressing tool 174 is attached is fixed to the lower ends of both guide rods 172 by bolts 178. Further, a tension coil spring 180 is disposed between both guide rods 172, and the support body 176 is connected to this spring 180 by a bolt 182 and urged upward, and is brought into contact with the support portion 170. .

The end of the support body 176 opposite to the side to which the pressing tool 174 is attached extends horizontally to form an engaging portion 184.
The support portion 170 is attached by the mounting plate 186.
A piston rod 190 of an air cylinder 188 attached to the piston rod 190 is connected. The support body 176 is guided by the guide rod 172 and raised and lowered by the expansion and contraction of the piston rod 190, and at its rising end, a dog 192 provided on the engaging portion 184 operates a photo switch 194 attached to the mounting plate 186. The falling end is also detected in the same manner, although not shown.

On the other hand, the heating device 168 is provided with many parts housed within the housing 162. As shown in FIGS. 5 and 7, a guide rail 196 and a guide rod 198 are attached to the inner surface of the housing 162 in the front-rear direction, and a slide 200 is movably attached to the guide rail 196 and guide rod 198. installed. The slide 200 is slidably fitted into the guide rod 198, while a roller 201 attached to the side surface of the slide 200 is engaged with the guide rail 196 with a slight gap in a groove 203. An air cylinder 202 is further installed inside the housing 162 in parallel to the axis of the guide rod 198, and an engaging portion 206 provided at the head of the piston rod 204 is installed inside the housing 162.
A flat protrusion 208 provided at the rear end of the slide 200 is engaged with the slide 200, so that the slide 200 can be moved by the expansion and contraction of the piston rod 204.

A mounting member 210 is fixed on the slide 200 along the direction of movement of the slide 200.
A slide 212 that moves independently of the slide 200 is attached to the front end side portion of the slide 200. The slide 212 has a rod 214 fixed to itself and a rod 21 fixed to the slide 200.
6, and a screw shaft 222 is screwed into a nut 220 provided at the rear end thereof. The screw shaft 222 is rotated by a servo motor 224 attached to the rear end of the mounting member 210, and the slide 212 is moved by this rotation. Further, at the front end of the slide 212, as shown in FIGS.
A pair of laser heads 22 are provided on this support frame 226 at right angles to the moving direction of the laser heads 22 and 212.
8 is installed.

Each laser head 228 has a respective slide 2
29, the slide 229 is fitted with a guide rod 230 supported by the left and right side walls of the support frame 226, as shown in FIG. The guide rod 230 is provided with a threaded shaft 232 arranged parallel to the guide rod 230.
This threaded shaft 232 has a left-hand thread on the left side and a right-hand thread on the right side in FIG. 8, and the two slides 229 have one screw on each of the left-hand and right-hand threads. When the screw shaft 232 is rotated by the servo motor 234, the two laser heads 228 are moved symmetrically with respect to a vertical plane including the center line of the pressing tool 174, so that the distance between the two laser heads 228 can be changed. It's summery.

The motors, air cylinders, etc. of the mechanical parts detailed above are controlled by a control device mainly composed of a computer, as shown in FIG. The computer includes a central processing unit (CPU) 242, a read-on memory (ROM) 244, and a random access memory (RAM) 246, and a control program stored in the ROM 244, an input device 248 having input keys, and the photo switch 194. The servo motor 64, air cylinder 104, etc. are controlled based on input data from various detectors including the above, the television camera 156, etc. Note that the computer controls each servo motor and air cylinder through respective drive control circuits, but these drive control circuits are omitted in FIG. 9.

Mounting of electronic components onto a printed circuit board using the mounting apparatus configured as described above is performed as shown in the flowchart of FIG.

First, a printed circuit board is supplied from a supply device (not shown) to the conveying device 16, and when the printed circuit board is conveyed to an electronic component mounting position and set in a predetermined cassette position by the supporting device 18, it is transferred from the RAM 246. Data on the position on the printed circuit board at which the electronic component is to be mounted (this position data is stored in the RAM 246 through teaching performed prior to the start of a series of mounting operations) is read out. Then, according to the position data, the slides 64 and 77 of the transport/mounting device 60 are moved in the Y-axis and X-axis directions, respectively, so that the rotation center of the suction head 110,
That is, the center of the television camera 156 is positioned almost directly above the portion of the printed pattern where the electronic component is to be mounted. In this state, an image from the television camera 156 is input to the CPU 242, and image information of the print pattern is acquired. When there are multiple electronic components to be mounted on the printed circuit board, the transport/mounting device 60 is sequentially moved to the plurality of positions according to the position data read from the RAM 246, and all electronic components to be mounted are moved to the plurality of positions in sequence. The image information of the print pattern is stored in the CPU 242. Note that at this time, the suction head 110
has been moved upward to the retracted position by the movement of the slide 104, and no electronic component is suctioned into the suction tube 130.

When the image information of the printed pattern on the printed circuit board is obtained, the type of electronic component to be installed first is read from the RAM 246, the pallet 14 containing the electronic component is moved to the electronic component supply position, and the CPU 242 Slides 64 and 7 according to the electronic component suction command from
7 is moved and the suction tube 130 is positioned over the electronic component to be taken out from the pallet 14 which is stopped at the electronic component supply position. Thereafter, the suction head 110, that is, the suction tube 130, is lowered to a predetermined position and brought into close contact with the main body A of the electronic component. At this time, the inner cylinder 134 is pushed into the outer cylinder 132 against the urging force of the compression coil spring, and the extra downward distance is absorbed. In this state, the space 128 formed in the housing 112 of the suction head 110 is connected to a vacuum source, and the electronic component is suctioned to the tip of the suction tube 130.

When the electronic component is suctioned into the suction tube 130, the suction head 110 is raised again, and when the lead terminal B of the electronic component is at the same height as the surface of the printed circuit board, the image of the television camera 156 is sent to the control device. is input, and image information of the electronic component is acquired.

Thereafter, the suction head 110 is further raised to the same height as the retracted position, and the slides 64 and 77 are moved again to mount the electronic component currently being suctioned on the printed pattern of the printed circuit board. It is placed directly above the desired part. While moving to this position, the horizontal position data of the suction head 110 and Rotational position data is calculated, and suction head 110 is positioned based on the horizontal position data and rotational position data. In other words, the suction head 110
The movement position of is determined based on the horizontal position data calculated by the calculation, and during the movement, the servo motor 120 is rotationally driven based on the rotational position data calculated by the calculation,
The suction head 110 is rotated.

In synchronization with the suction head 110 holding the electronic components being moved onto the printed circuit board, the slides 92 and 93 are moved on the Y-axis and the X-axis.
When the housing 162 is moved in the axial direction and the housing 162 is moved on a horizontal plane, the pressing tool 174 presses the suction tube 1.
30 on the main body A of the electronic component. Thereafter, the suction head 110 is lowered, and the electronic component is placed on the printed pattern of the printed circuit board, completing the execution of step S1.

Even after the electronic component is placed on the printed circuit board, the suction tube 130 remains in close contact with the main body A of the electronic component for a while to keep the electronic component pressed against the printed circuit board, and during this time step S2 is executed.
Air cylinder 188 provided in pressing device 166
Air is supplied to extend the piston rod 190, and the pressing tool 174 descends and comes into contact with the main body A of the electronic component, bringing all the lead terminals B into close contact with the printed circuit board. In this way, press tool 1
After the suction head 74 is placed in a state where it presses the electronic component, step S3 is executed and the suction head 110 is raised to the retracted position. Then, the transport and mounting device 6
0, when mounting more electronic components on the same printed circuit board, the next electronic component to be mounted will be taken out from the pallet 14, but if only one electronic component is mounted on the printed circuit board. If so, it is returned to its pre-operation position as shown in FIG.

Once the suction head 110 has been evacuated, the air cylinder 202 of the heating device 168 is activated, and the slide 200 is advanced by contraction of the piston rod 204 (step S4). When the laser head 228 is moved to the normal position, the slide 200 is stopped, and the servo motor 224 is activated to advance the slide 212 and direct the laser beam toward the lead terminal B. It is irradiated and soldered. At this time, housing 1
62 is in a position where the opening 160 faces the conveyance/mounting device 60, and the slides 200 and 21
2 is moved in the Y-axis direction, the lead terminal B protruding from the side surface of the electronic component body A parallel to the Y-axis direction is soldered.

Once soldering in the Y-axis direction has been performed as described above, the slide 212 is retracted and the laser head 228 is retracted to its normal position (step S5), the piston rod 190 is retracted, and the pressing tool 174 is retracted. is separated from the electronic component (step S6). Next step S7
In step S8, it is determined whether the electronic component requires soldering in two directions, the Y-axis and the . However, if soldering is required in two directions, the housing 162 is attached to the shaft 164.
The slides 200 and 212 are rotated 90 degrees around the main body A, and the moving direction of the slides 200 and 212 is changed to the X-axis direction, and the slides 92 and 93 are moved so that the pressing tool 174 is positioned on the main body A of the electronic component. It is corrected (step S9 ends). Thereafter, the pressing tool 174 is lowered in the same manner as described above, and the main body A of the electronic component is pushed toward the printed circuit board (step S10), and the slide 2
12 is moved forward and soldering is performed in the X-axis direction by the laser head 228 (step S1).
1). After this soldering is completed, the pressing tool 174 is raised (step S12), and the housing 162 is further rotated so that the slides 200 and 2
12 is returned to the position of moving in the Y-axis direction (step S13), and the laser head 228 is moved to the retracted position (step S8).

When a plurality of electronic components are mounted on a printed circuit board, after the above operations are repeated, the conveying and placing device 60 and the pressing and heating device 62 are returned to their pre-operation positions as shown in FIG. After the electronic components have been mounted, the printed circuit board is released from the positioning support by the support device 18, and is transported to the unloading position by the transport device 16.

As described in detail above, in the mounting apparatus of this embodiment, after the suction head 110 places the electronic component on the printed circuit board, the pressing tool 174 hits the main body A of the electronic component before separating from the electronic component. In order to bring the lead terminal B into close contact with the printed circuit board, the electronic component is constantly pressed onto the printed circuit board by the suction head 110 or the pressing device 166, and when the pressing tool 174 contacts the electronic component, Or, when the suction tube 130 separates from the electronic component, the electronic component will not be displaced by the impact that occurs when they come into contact and separate, and the electronic component will be accurately placed on the printed circuit board and the soldering will be performed reliably. becomes.

Further, the conveying/placing device 60 is provided so as to be movable independently of the pressing/heating device 62, so that the heating device 168 can be moved to the normal position after the suction head 110 is evacuated. Therefore, there is no fear that the suction head 110 and the laser head 128 will interfere with each other, and the electronic component mounting unit 76 to which the glass plates 124, 126 of the suction head 110, the television camera 156, etc. are attached is not soldered. It is possible to avoid staining due to splashes and gas generated during application.

Furthermore, since the soldering by the heating device 168 and the unloading of electronic components by the electronic component placement unit 76 are performed in parallel, the cycle time is shortened and the efficiency of the mounting work is improved.

Furthermore, in this mounting device, the index table 12 for supplying electronic components, and the conveyance device 16 and support device 18 for conveying and positioning the printed circuit board are vertically intersected, resulting in a compact configuration. This has the advantage of saving space for installing the device.

Although one embodiment of the present invention has been described above in detail, the present invention can be implemented in other embodiments.

For example, in the above embodiment, the pressing tool 174 was configured to press the main body A of the electronic component, but it may also be configured to press the lead terminal B.

Further, the pressing device 166 and the heating device 168 are provided in the same housing 162 and share a common slide 9.
It is not necessary to move them by 2 and 93, and it is also possible to provide them separately.

Furthermore, in the conveyance/placement device 60, the electronic components may be held and conveyed/placed by a chuck instead of or in addition to vacuum suction, and the solder is not applied to the lead terminals. , or may be applied on a printed circuit board.

Although not illustrated in detail, the present invention can be implemented with various modifications and improvements based on the knowledge of those skilled in the art.

[Brief explanation of drawings]

FIG. 1 is a front view showing an electronic component mounting device which is an embodiment of the device invention, and FIG. 2 is a plan view. FIG. 3 is a plan view showing an example of electronic components mounted by the device. FIG. 4 is a front view (partially in section) showing the electronic component mounting unit in the same device. FIG. 5 is a plan view showing the pressing device and heating device in the same device with the top wall of the housing removed. Figure 6 is the same as in Figure 5.
FIG. 7 is a cross-sectional view taken along the line in FIG. 5. FIG. 8 is a front view of the pressing device and heating device. FIG. 9 is a block diagram of the control device of the electronic component mounting apparatus, and FIG. 10 is a flowchart showing the control program. 18: Support device, 60: Conveyance/placing device, 6
2: Pressing/heating device, 64: Slide, 70: Servo motor, 76: Electronic component mounting unit, 7
7: Slide, 86, 90: Servo motor, 9
2, 93: Slide, 96: Servo motor, 16
2: Housing, 163: Servo motor, 17
4: Pressing tool, 180: Tension coil spring, 1
88: Air cylinder, 200: Slide, 20
2: Air cylinder, 212: Slide, 224:
Servo motor, 228: Laser head, 229:
Slide, 234: Servo motor.

Claims (1)

[Claims] 1. A flat package electronic component with a plurality of lead terminals protruding to the side of the electronic component body is transported by a transport/mounting device to a predetermined position on a component support such as a printed circuit board. In the automatic mounting method, the main body or the lead terminal of the electronic component is placed, and the main body or lead terminal of the electronic component is pushed toward the component support by a pressing device, so that the lead terminal is brought into close contact with the component support, and the lead terminal is heated and soldered by a heating device. After placing the electronic components using the placing device,
Before the transport/mounting device separates from the electronic component, the pressing device is set to push the electronic component body or the lead terminal toward the component support, and after the transport/mounting device separates, the pressing device pushes the electronic component toward the component support. 1. A method for mounting a flat package type electronic component, characterized by performing the soldering of the electronic component that is pressed against the flat package. 2. A component support support device that positions and supports a component support such as a printed circuit board at a predetermined position, and a component support device that transports a flat package type electronic component with a plurality of lead terminals protruding to the side of the electronic component body. A conveyance/mounting device that places the electronic component at a predetermined position on the component support, and a press that pushes the main body or lead terminal of the mounted electronic component toward the component support to bring the lead terminal into close contact with the component support. In an automatic mounting device including a device and a laser head for soldering its lead terminals to a component support, the pressing device is moved by the conveying/mounting device to place the electronic component on the component support and place the electronic component on the component support. The main body or lead terminal of the electronic component is pressed while the electronic component is not separated from the component, and the laser head is pressed until the electronic component is placed on the component support by the conveying/mounting device and separated. A flat package type electronic component mounting device characterized in that the device is in a retracted position and moves to a normal position after being separated to perform soldering.